JP4446763B2 - LIGHT EMITTING DIODE CAP AND LIGHT EMITTING DIODE DEVICE - Google Patents
LIGHT EMITTING DIODE CAP AND LIGHT EMITTING DIODE DEVICE Download PDFInfo
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- JP4446763B2 JP4446763B2 JP2004056980A JP2004056980A JP4446763B2 JP 4446763 B2 JP4446763 B2 JP 4446763B2 JP 2004056980 A JP2004056980 A JP 2004056980A JP 2004056980 A JP2004056980 A JP 2004056980A JP 4446763 B2 JP4446763 B2 JP 4446763B2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Description
本発明は、発光ダイオードへ被着して発光ダイオードからの光を拡散光にさせるとともに、輝度および発光波長を調整するための、蛍光体や着色剤を含有する発光ダイオード用キャップの形状に関するものである。 The present invention relates to a shape of a cap for a light-emitting diode that contains a phosphor and a colorant, which is applied to a light-emitting diode to change light from the light-emitting diode into diffused light and adjusts luminance and light emission wavelength. is there.
発光ダイオード（ＬＥＤ：Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）は、光を放射する半導体発光素子であり、電気エネルギーを紫外線、可視光、赤外光などに変換するものである。例えば、可視光を利用するものとしては，ＧａＰ、ＧａＡｓＰ、ＧａＡｌＡｓ等の発光材料で形成した半導体発光素子があり、これらを透明樹脂等で封止したＬＥＤランプが広く使用されている。また、発光材料をプリント基板や金属リードの上面に固定し、数字や文字をかたどった透明樹脂ケースで封止したディスプレイ型のＬＥＤランプなども多用されている。 A light emitting diode (LED: Light Emitting Diode) is a semiconductor light emitting element that emits light, and converts electrical energy into ultraviolet light, visible light, infrared light, and the like. For example, a device using visible light includes a semiconductor light emitting element formed of a light emitting material such as GaP, GaAsP, or GaAlAs, and an LED lamp in which these are sealed with a transparent resin or the like is widely used. In addition, a display-type LED lamp in which a light emitting material is fixed on the upper surface of a printed circuit board or a metal lead and sealed with a transparent resin case shaped like a number or letter is also frequently used.
また、発光ダイオードは半導体素子であるため、寿命が長く、信頼性も高く、光源として用いた場合には、その交換作業も軽減できることから、携帯通信機器、パーソナルコンピュータ周辺機器、ＯＡ機器、家庭用電気機器、オーディオ機器、各種スイッチ、バックライト用光源、掲示板等の各種表示装置などの構成部品として広く使用されている。更に、車載機器の表示部のバックライト照明用光源としてＬＥＤランプが注目され、メーター、ヒーターコントロールパネル、オーディオなどの表示部のバックライト照明に利用されており、特に白色又は青緑領域において高輝度で発光するＬＥＤランプが求められている。 In addition, since the light emitting diode is a semiconductor element, it has a long life, high reliability, and when used as a light source, the replacement work can be reduced. It is widely used as a component of various display devices such as electric devices, audio devices, various switches, backlight light sources, and bulletin boards. In addition, LED lamps are attracting attention as a backlight illumination light source for in-vehicle device displays, and are used for backlight illumination in displays such as meters, heater control panels, and audio, especially in the white or blue-green region. There is a need for LED lamps that emit light.
このようなＬＥＤランプは、各種の蛍光体粉末を、半導体素子を封止する透明樹脂中に含有させることにより、ＬＥＤから放射される光の色を変化させることにより得ることが可能である。例えば、青色ＬＥＤからの光を透明樹脂中の蛍光体に当て、この蛍光体の働きによって青色ＬＥＤの発光波長を白色や緑色の波長に変換して放射している。 Such an LED lamp can be obtained by changing the color of light emitted from the LED by including various phosphor powders in a transparent resin that seals the semiconductor element. For example, light from a blue LED is applied to a phosphor in a transparent resin, and the emission wavelength of the blue LED is converted into a white or green wavelength by the action of the phosphor and emitted.
この際、透明封止体中に蛍光体を分散させると、蛍光体による光散乱によって発光輝度が低下してしまうため、透明封止体の外表面にのみキャップを設けることが行われている。そこで、キャップは封止体とは別に成形し、接着剤を介して封止樹脂に被着されている。これにより、ＬＥＤからの光は封止樹脂中を透過し、キャップ内の蛍光体に当って波長が変換され、放射される。 At this time, if the phosphor is dispersed in the transparent encapsulant, the light emission luminance is reduced due to light scattering by the phosphor, so that a cap is provided only on the outer surface of the transparent encapsulant. Therefore, the cap is formed separately from the sealing body and is attached to the sealing resin via an adhesive. Thereby, the light from the LED is transmitted through the sealing resin, and the wavelength of the light hits the phosphor in the cap to be converted and emitted.
図１は、従来のＬＥＤ発光装置の構造を示す一実施例である。一対の配線導体１及び２と、上記配線導体の一方の配線導体に電気的に接続された半導体発光素子３と、この半導体発光素子３と上記配線導体の他方の配線導体とを電気的に接続するボンディングワイヤとを、上記配線導体の上記半導体発光素子及びボンディングワイヤが接続された一端側で砲弾型の封止樹脂５により封止される。このような砲弾型の発光ダイオードの封止樹脂５の外面周囲には、封止樹脂５と同一形状の内面を有する蛍光体が配合されたキャップ７が接着剤層６を介して被着されている。
FIG. 1 is an example showing the structure of a conventional LED light emitting device. A pair of
また、他の例では、封止樹脂５は、図２のように上面が開口した箱型の発光体収容部材８の内底から一対のリード１、２を発光体収容部材６の外部へ延出し、この発光体収容部材８の内部に半導体発光素子３やリード細線４，４を収容し、これらを接続して発光体収容部材８内部を封止樹脂５で封止した構造を有する。このようないわゆるチップ型の発光ダイオード封止樹脂５の外面周囲には、やはり、封止樹脂５と同一形状の内面を有する蛍光体が配合されたキャップ７が接着剤層６を介して被着されている。
In another example, the sealing resin 5 extends a pair of
さらに、最近では、フリップチップ型と呼ばれるワイヤレスタイプのリード線を用いずに半導体発光素子の端子部を底面にして、全体を封止樹脂で封止した構造を有するものも使用されている。 Further, recently, a semiconductor light emitting device having a structure in which a terminal portion of a semiconductor light emitting element is used as a bottom surface and is sealed with a sealing resin without using a wireless lead wire called a flip chip type has been used.
このように、いずれのタイプにおいても、キャップは封止樹脂５の周囲に接着剤を介して被着される。通常、キャップの封止体の表面に接触する内側側面に接着剤を塗布した後、該キャップを樹脂封止体にキャップして押し付けるようにして被着している。
しかしながら、このようなキャップの封止体への押し付けによる被着に際し、キャップの内側表面に塗布されていた接着剤がキャップの内側から外にはみ出し、発光ダイオードの端子に付着してしまうという問題があった。そして、半導体発光素子の端子に付着した接着剤は、端子のはんだ付け不良の原因となっていた。 However, there is a problem in that the adhesive applied to the inner surface of the cap protrudes from the inner side of the cap and adheres to the terminals of the light emitting diode when the cap is attached to the sealing body by pressing. there were. And the adhesive agent adhering to the terminal of the semiconductor light emitting element has caused the soldering failure of the terminal.
このように、はみ出した接着剤は除去しなければならず、また、製造工程が煩雑となり、また、これを完全に取り除くことは困難であった。はみ出した接着剤に起因するはんだ付け不良の原因となり、これによってリードが端子からはずれてしまうという事故が避けられなかった。 Thus, the protruding adhesive has to be removed, the manufacturing process becomes complicated, and it has been difficult to completely remove the adhesive. An accident in which the lead was detached from the terminal due to the soldering failure caused by the protruding adhesive was unavoidable.
したがって、本発明の目的は、キャップの封止体への押し付けによる被着に際し、キャップの内側表面に塗布されていた接着剤がキャップの内側から外に流れ出ることを防止することにある。 Accordingly, an object of the present invention is to prevent the adhesive applied to the inner surface of the cap from flowing out from the inside of the cap when the cap is attached to the sealing body by pressing.
上記目的を達成するために、本発明は、発光ダイオードを封止する封止体外周面に被着されるキャップにおいて、前記キャップ内側側壁の一部と前記封止体外周面との間に間隙が形成されるように、前記側壁の一部の肉厚を薄く形成することによって、キャップを封止体外周部に装着する際、キャップの内側表面に塗布されていた接着剤が前記間隙に溜まり、及び／又は前記キャップの深さが発光ダイオードの底面から前記封止体の頂点までの高さより浅くすることにより、接着剤がキャップの外にはみ出るのを防止するか、又ははみ出る量を十分に少なくすることができる。
本発明の具体的な構成は、次のとおりである。
（１）発光ダイオードを封止する封止体外周面に被着されるキャップにおいて、前記キャップの内側側壁の一部の肉厚が薄く、及び／又は前記キャップの深さが発光ダイオードの底面から前記封止体の頂点までの高さより浅いことを特徴とする発光ダイオード用キャップ。
（２）前記側壁の肉厚の薄い部分が前記側壁に凹部を形成していることを特徴とする上記（１）に記載の発光ダイオード用キャップ。
（３）前記側壁の肉厚の薄い部分が前記キャップの端部に形成されていることを特徴とする上記（１）に記載の発光ダイオード用キャップ。
（４）前側壁の肉厚の薄い部分と他の部分との肉厚の差が０．０１〜０．１５ｍｍであることを特徴とする上記（１）ないし（３）のいずれかに記載の発光ダイオード用キャップ。
（５）前記キャップの深さが前記頂点までの高さより０．０５〜０．２ｍｍ浅いことを特徴とする上記（１）ないし（４）のいずれかに記載の発光ダイオード用キャップ。
（６）キャップの内側側壁の一部の肉厚を薄くされた、及び／又は前記キャップの深さが発光ダイオードの底面から前記封止体の頂点までの高さより浅くされた発光ダイオード用キャップが接着剤により発光ダイオードを封止する封止体外周面に被着された発光ダイオード装置。
In order to achieve the above object, the present invention provides a cap that is attached to an outer peripheral surface of a sealing body that seals a light emitting diode, and a gap between a part of the inner wall of the cap and the outer peripheral surface of the sealing body. When the cap is attached to the outer peripheral portion of the sealing body, the adhesive applied to the inner surface of the cap accumulates in the gap. And / or by making the depth of the cap shallower than the height from the bottom surface of the light emitting diode to the top of the encapsulant, it is possible to prevent the adhesive from protruding out of the cap or to make the amount of protrusion sufficient. Can be reduced.
The specific configuration of the present invention is as follows.
(1) In the cap attached to the outer peripheral surface of the sealing body that seals the light emitting diode, the thickness of a part of the inner side wall of the cap is thin and / or the depth of the cap is from the bottom surface of the light emitting diode. A cap for a light emitting diode, wherein the cap is shallower than a height to the top of the sealing body.
(2) The light-emitting diode cap according to (1), wherein the thin portion of the side wall forms a recess in the side wall.
(3) The light-emitting diode cap according to (1), wherein a thin portion of the side wall is formed at an end of the cap.
(4) The thickness difference between the thin portion of the front side wall and the other portion is 0.01 to 0.15 mm, as described in any one of (1) to (3) above Cap for light emitting diode.
(5) The cap for a light emitting diode according to any one of (1) to (4), wherein the depth of the cap is 0.05 to 0.2 mm shallower than the height to the apex.
(6) A light-emitting diode cap in which a part of the inner side wall of the cap is thinned and / or the depth of the cap is shallower than the height from the bottom surface of the light-emitting diode to the top of the sealing body. A light emitting diode device attached to an outer peripheral surface of a sealing body for sealing a light emitting diode with an adhesive.
本発明の発光装置において、封止体には、透光性を有するエポキシ樹脂、シリコーン樹脂、ポリカーボネートなどの樹脂又はガラスなどが用いられる。 In the light-emitting device of the present invention, a resin such as a light-transmitting epoxy resin, silicone resin, polycarbonate, or glass is used for the sealing body.
本発明の発光装置において、キャップの樹脂基材としては、透光性のポリエステル樹脂、アクリル樹脂、ウレタン、ナイロン、シリコーン樹脂、塩化ビニル、ポリスチロール、ベークライト等樹脂やシリコーンゴム等の透明性ゴムを用いることができる。特に、シリコーン樹脂やシリコーンゴムなどの弾性体を用いると、その弾性変形を利用して、キャップを押圧して封止樹脂に容易に被着することができる。 In the light emitting device of the present invention, as a resin base material of the cap, transparent resin such as translucent polyester resin, acrylic resin, urethane, nylon, silicone resin, vinyl chloride, polystyrene, bakelite and silicone rubber is used. Can be used. In particular, when an elastic body such as silicone resin or silicone rubber is used, the cap can be pressed and easily applied to the sealing resin by utilizing its elastic deformation.
本発明の発光装置において、キャップに配合される蛍光体としては、無機蛍光体、顔料、有機蛍光染料、擬似顔料などが挙げられ、無機蛍光体としては、Ｙ3−ＸＧａＸＡｌ5Ｏ１2：Ｃｅ（０≦ｘ≦３）、ＢａＭｇＡｌ16Ｏ27：Ｅｕ、（Ｓｒ，Ｃａ，Ｂａ）5（ＰＯ4）3Ｃｌ：Ｅｕ、ＢａＭｇＡｌ16Ｏ27：Ｅｕ、Ｍｎ、Ｚｎ2ＧｅＯ4：Ｍｎ、Ｙ2Ｏ2Ｓ：Ｅｕ、３．５ＭｇＯ・０．５ＭｇＦ2・ＧｅＯ2：Ｍｎ、Ｌａ2Ｏ2Ｓ：Ｅｕ、ＣａＳ：Ｅｕ、ＬｉＥｕＷ2Ｏ8など、顔料としてはフタロシアニン系、アゾ系、イソインドリノン系、キナクリドン系、レーキ顔料などの有機顔料やコバルトブルー、群青、酸化鉄などの無機顔料、有機蛍光染料としてはぺリレン系、ナフタルイミド系、クマリン系、シアニン系、フラビン系、ローダミン系など、擬似顔料としてはプラスチックの粉末を蛍光性のある染料で着色した蛍光顔料などを好適に用いることができる。 In the light emitting device of the present invention, examples of the phosphor blended in the cap include an inorganic phosphor, a pigment, an organic fluorescent dye, and a pseudo pigment. Examples of the inorganic phosphor include Y 3 —XGaXAl 5 O1 2 : Ce ( 0 ≦ x ≦ 3), BaMgAl 16 O 27 : Eu, (Sr, Ca, Ba) 5 (PO 4 ) 3 Cl: Eu, BaMgAl 16 O 27 : Eu, Mn, Zn 2 GeO 4 : Mn, Y 2 O 2 S: Eu, 3.5MgO.0.5MgF 2 .GeO 2 : Mn, La 2 O 2 S: Eu, CaS: Eu, LiEuW 2 O 8 and the like, phthalocyanine, azo, and isoindolinone as pigments Organic pigments such as quinacridone and lake pigments, inorganic pigments such as cobalt blue, ultramarine and iron oxide, and organic fluorescent dyes such as perylene, naphthalimide, coumarin, cyanine, flavin, Rhodamine-based, etc., as the pseudo pigment can be preferably used fluorescent pigments colored powder plastic dye with a fluorescence.
本発明の発光装置において、キャップとしては、上述したような蛍光体を樹脂基材に混合分散させて成形することにより得られた樹脂成形体を用いるが、このような樹脂成形体は、未硬化の樹脂に色調変換材料を添加混合し、圧縮成形等の従来公知の方法で成形硬化させることにより得ることができる。 In the light emitting device of the present invention, as the cap, a resin molded body obtained by mixing and dispersing the phosphor as described above on a resin base material is used, and such a resin molded body is uncured. The color tone conversion material can be added to and mixed with the resin and molded and cured by a conventionally known method such as compression molding.
本発明に使用される接着剤は、シリコーン系接着剤、エポキシ系接着剤など、既成の接着剤を使うことができる。 As the adhesive used in the present invention, a ready-made adhesive such as a silicone adhesive and an epoxy adhesive can be used.
本発明によれば、前記キャップを前記封止樹脂に被着する際に、接着剤のはみ出しを防止することができ、流出した接着剤の除去をする必要がなくなる。これによって、発光ダイオード端子にはみ出した接着剤が付着することがないため、端子とリード線とのはんだ付け不良が防止できる。これにより、信頼性及び寿命が著しく向上したＬＥＤ装置が提供できるという効果を奏する。 According to the present invention, it is possible to prevent the adhesive from protruding when the cap is attached to the sealing resin, and it is not necessary to remove the adhesive that has flowed out. As a result, the adhesive that protrudes from the light emitting diode terminal does not adhere, so that it is possible to prevent poor soldering between the terminal and the lead wire. Thereby, there is an effect that an LED device with significantly improved reliability and lifetime can be provided.
以下、図面に基づいた実施例を挙げて本発明の発光ダイオード用キャップの具体的形状について説明する。 Hereinafter, the specific shape of the cap for light emitting diodes of the present invention will be described with reference to examples based on the drawings.
シリコーン材料（信越化学工業社製ＫＥ−９６１Ｔ−Ｕ）に加硫剤を０．５％添加し、それぞれ異なる４種類の金型に適量し、１７０℃で１０分間保持、プレスすることにより、シリコーンゴムからなる肉厚０．３ｍｍのキャップ（１）〜（４）を成形した。キャップ（１）〜（４）の断面形状をそれぞれ図３〜６に示す。（１）は、キャップ内側面の端部から０．５ｍｍを他の部分より０．１ｍｍ薄く（肉厚０．２ｍｍ）したものであり、（２）は、キャップ内側面の端部より０．２ｍｍ〜０．５ｍｍの間に幅０．３ｍｍ深さ０．１ｍｍの凹部（肉厚０．２ｍｍ）を形成したものあり、（３）は、キャップ内側面の端部から０．４ｍｍを他の部分より０．１ｍｍ薄く（肉厚０．２ｍｍ）し、かつ、キャップの深さを（１）より０．１ｍｍ浅くしたもの、（４）は従来のキャップである。このように成形した各キャップ内側表面に接着剤としてシリコーン系接着剤（信越化学工業製ＫＥ４８９６）をディスペンサーにより適量塗布し箱型タイプＬＥＤに被せた。この際、キャップからはみ出した接着剤の最下位のＬＥＤ底面からの高さの平均値を測定したところ、それぞれ、（１）１．２７ｍｍ、（２）１．３５ｍｍ、（３）１．２７ｍｍ、（４）１．１７ｍｍであった。この値は、ＬＥＤ底面からの高さで示されているため、高いほど接着剤のはみ出し量が少ないことになる。このように、（４）の従来例に比較して、本発明のキャップ（１）〜（３）はキャップ最端部からの接着剤のはみ出し距離が短く、ＬＥＤ端子まで到着することはなかった。 A silicone material (KE-961T-U manufactured by Shin-Etsu Chemical Co., Ltd.) is added with 0.5% of a vulcanizing agent, each of which is appropriately placed in four different molds, held at 170 ° C. for 10 minutes, and pressed. Caps (1) to (4) made of rubber and having a thickness of 0.3 mm were molded. The cross-sectional shapes of the caps (1) to (4) are shown in FIGS. (1) is 0.5 mm thinner than the other part by 0.1 mm (wall thickness 0.2 mm) from the end of the inner surface of the cap, and (2) is 0. 0 mm from the end of the inner surface of the cap. A recess having a width of 0.3 mm and a depth of 0.1 mm (wall thickness: 0.2 mm) is formed between 2 mm and 0.5 mm, and (3) is 0.4 mm from the end of the inner surface of the cap. The conventional cap is 0.1 mm thinner than the part (wall thickness 0.2 mm) and the depth of the cap is 0.1 mm shallower than (1). An appropriate amount of a silicone-based adhesive (KE4896 manufactured by Shin-Etsu Chemical Co., Ltd.) was applied as an adhesive to the inner surface of each cap thus formed, and covered with a box-type LED. At this time, when the average value of the height of the adhesive protruding from the cap from the bottom surface of the lowest LED was measured, (1) 1.27 mm, (2) 1.35 mm, (3) 1.27 mm, (4) It was 1.17 mm. Since this value is indicated by the height from the bottom surface of the LED, the higher the value, the smaller the amount of adhesive protruding. Thus, compared with the prior art example of (4), the caps (1) to (3) of the present invention have a shorter protruding distance of the adhesive from the cap end and did not reach the LED terminal. .
以上の実施例は箱型タイプのキャップについてのものであるが、本発明はこれに限らず、砲弾型のもの及びフリップチップ型のものであっても同様の構成とすることにより、同様の効果を奏することができる。 The above embodiment is for a box-type cap. However, the present invention is not limited to this, and the same effects can be obtained by adopting the same configuration for a shell type and a flip chip type. Can be played.
１ 配線導体（アノードリード）
２ 配線導体（カソードリード）
３ 半導体発光素子
４ ボンディングワイヤ
５ 封止樹脂
６ 接着剤層
７ キャップ
８ 発光体収容部材
1 Wiring conductor (Anode lead)
2 Wiring conductor (cathode lead)
DESCRIPTION OF
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