JP4444993B2 - Liquid crystal panel substrate and liquid crystal panel manufacturing method - Google Patents

Description

  The present invention relates to a liquid crystal panel substrate on which a sealing material for forming a liquid crystal cell is applied and a method for manufacturing the liquid crystal panel.

  Conventionally, an array in which a color filter (color filter) substrate (hereinafter referred to as a CF substrate) or a TFT (Thin Film Transistor) is formed for the purpose of improving contrast, improving the display quality of a black screen, and improving the product yield. Products in which spacers are formed on a substrate with an organic film have been put into practical use. An example in which columnar column spacers (hereinafter referred to as CS) are formed on a CF substrate will be described below.

  FIG. 12 shows a conventional example in which a sealing material for forming a liquid crystal cell is applied to a CF substrate. As shown in FIG. 12, a main seal 10 for forming six liquid crystal cells is applied on the CF substrate 100. 13 and 14 show cross-sectional configuration diagrams of the liquid crystal cell. In this liquid crystal cell, a TFT substrate 200 is attached to the main seal 10 applied on the CF substrate 100, and further cut out for each liquid crystal cell. The main seal 10 includes glass fibers 11 when applied on the CF substrate 100, and the strength is increased. Liquid crystal molecules 30 are enclosed in the liquid crystal cell. In addition, a spherical plastic spacer 20 is disposed in the liquid crystal cell to keep the cell gap uniform. FIG. 14 is a cross-sectional configuration diagram of a liquid crystal cell in which the CS 40 is disposed. The CS 40 is formed in a columnar shape to keep the cell gap uniform.

  In general, the CS 40 is formed by applying an organic material having photosensitivity on a CF substrate by a spin coating method or a slit & spin coating method, and performing exposure and development by a photolithography process, that is, photolithography. The advantage of this method is that the CS can be arranged at a desired position for forming CS by photolithography and the film thickness is uniform because the material of CS40 is applied by spin coating or slit & spin coating. The height is uniform.

  Since the CS 40 can be disposed at a desired position, the CS 40 can be disposed in a portion that transmits light of an LCD (Liquid Crystal Display), that is, in a light shielding portion other than the pixel opening. As a result, the alignment disorder of the liquid crystal around the CS 40 can be hidden by the light-shielding portion, and display defects caused thereby can be eliminated. In particular, since the disordered portion of the liquid crystal during black display looks white, the effect is great in terms of improving the quality of black display. Further, in the normally black (NB) liquid crystal mode in which no voltage is applied to the liquid crystal during black display, the alignment state of the liquid crystal largely dominates the characteristics of the black display, so that the effect is great, and the IPS (In Plane Switching) mode ( (Horizontal electric field system) and VA (vertical alignment) mode. Further, since the height of each CS 40 is uniform, the thickness of the liquid crystal layer of the LCD can be formed constant, that is, the electrical and optical responses of the liquid crystal can be made uniform.

On the other hand, in the prior art in which the spherical plastic spacer 20 is dispersed to form the thickness of the liquid crystal layer, as shown in FIG. The liquid crystal molecules 31 in the periphery of the spacer 20 are aligned on the surface of the plastic spacer 20 to cause alignment disorder, or the plastic spacer 20 is moved to cause defects that damage the alignment film that controls the alignment of the liquid crystal. It is a decline factor.
JP 2001-330819 A JP 2000-171807 A

  Although the conventional technique using such CS is effective as a method for forming the arrangement position and height uniformly, the following problems arise due to the uniformity.

  That is, when the TFT substrate and the CF substrate are bonded together, the CS formed in the liquid crystal cell on the CF substrate comes into contact with the designated location on the TFT substrate. At this time, CS is slightly bent and urged in a direction in which the TFT substrate and the CF substrate are peeled off. Since the CS is uniformly formed in a state where it is fixed to the substrate, there is a problem that the force transmission efficiency is high, that is, the reaction force becomes large and the two substrates are easily peeled off. Furthermore, since the main seal portion is high in the initial peeling state, the thickness of the liquid crystal layer in the vicinity of the same portion increases and is visually recognized as display unevenness. Further, in a method in which a liquid crystal is operated on a substrate surface between two electrodes formed on a substrate by a substantially parallel electric field and light is modulated (hereinafter referred to as a lateral electric field method), unevenness in the thickness of the liquid crystal layer. However, it is particularly problematic because it is severe.

  The present invention has been made to solve such problems, and an object thereof is to provide a liquid crystal panel substrate capable of increasing the yield.

  A liquid crystal panel substrate according to the present invention includes a first substrate and a second substrate, and is a liquid crystal panel substrate coated with a main seal that forms a liquid crystal cell, and holds a cell gap inside the main seal. A first columnar spacer (for example, CS40 in the present embodiment) and a second columnar spacer for dispersing the repulsive force of the first columnar spacer so as to surround the main seal. These are arranged on and integrated with one of the first substrate and the second substrate. With such a configuration, the repulsive force due to the first columnar spacers when the two liquid crystal panel substrates are bonded together is dispersed and weakened, so that the two liquid crystal panel substrates can be prevented from separating.

The above-mentioned second columnar spacer is preferably formed of a continuous pattern (for example, CS42 in the present embodiment) continuously formed so as to cover the periphery of the main seal. With such a configuration, the repulsive force by the first columnar spacer is more effectively dispersed.
At this time, it is preferable that the continuous pattern is provided with a vent hole in which a part of the continuous pattern is cut out.

  The second columnar spacer described above may be an isolated pattern (for example, CS41 in the present embodiment), and may be disposed at a higher density than the first columnar spacer. With such a configuration, the repulsive force by the first columnar spacer is more effectively dispersed.

  A dummy seal applied to the periphery of the main seal for expanding the bonding area may be further arranged and integrated on one of the first substrate and the second substrate. good. With such a configuration, the adhesive force is increased by the dummy seal, the two liquid crystal panel substrates are securely held, and the repulsive force by the first columnar spacer is dispersed and weakened by the second columnar spacer. The separation of the liquid crystal panel substrates is further effectively prevented.

The liquid crystal panel substrate may be a color filter substrate. With such a configuration, it can be used for a display device including a color filter substrate.
Further, the liquid crystal panel substrate is preferably used in a liquid crystal display device using a horizontal electric field method. Since the IPS mode is particularly problematic with respect to the unevenness of the thickness of the liquid crystal layer, it is more effective.

  Furthermore, the method for manufacturing a liquid crystal panel according to the present invention is a method for manufacturing a liquid crystal panel in which a main seal forming a liquid crystal cell is applied on a liquid crystal panel substrate, and a cell gap is held inside the main seal. A first columnar spacer for disposing the first columnar spacer on the first substrate or the second substrate, and a second columnar spacer for dispersing the repulsive force so as to surround the periphery of the main seal. Alternatively, the method includes a step of disposing on the second substrate. Thereby, since the repulsive force by the 1st columnar spacer at the time of bonding two liquid crystal panel substrates is disperse | distributed and weakened, it can prevent that two liquid crystal panel substrates leave | separate.

In the step of disposing the second columnar spacer, the second columnar spacer having a continuous pattern continuously formed so as to surround the main seal may be disposed. Thereby, the repulsive force by the 1st columnar spacer is disperse | distributed more effectively.
At this time, it is preferable that the continuous pattern is provided with a vent hole in which a part of the continuous pattern is cut out.

  In the step of arranging the second columnar spacers described above, the second columnar spacers made of isolated patterns may be arranged at a higher density than the first columnar spacers. Thereby, the repulsive force by the 1st columnar spacer is disperse | distributed more effectively.

  A step of applying a dummy seal for increasing the adhesive strength around the main seal may be further provided. As a result, the adhesive force is increased by the dummy seal, and the two liquid crystal panel substrates are securely held, and the repulsive force by the first columnar spacer is dispersed and weakened by the second columnar spacer. The separation of the panel substrate is further effectively prevented.

  The liquid crystal panel substrate is preferably used in a liquid crystal display device using a horizontal electric field method. Since the IPS mode is particularly problematic with respect to the unevenness of the thickness of the liquid crystal layer, it is more effective.

  As described above, according to the present invention, a liquid crystal panel substrate capable of increasing the yield can be provided.

  Hereinafter, a liquid crystal panel substrate according to the present invention will be described using a plurality of embodiments.

Embodiment 1 FIG.
FIG. 1 shows a configuration diagram of an example in which the liquid crystal panel substrate according to the first embodiment is used as a CF substrate. The CF substrate in the present embodiment includes a CF substrate 100, a main seal 10, and dummy seals 80 and 81.

  As shown in FIG. 1, the CF substrate 100 is coated with a plurality of main seals 10 that form liquid crystal cells.

  The main seal 10 is a thermosetting resin such as an epoxy resin or a photocurable resin such as an acrylic resin. As shown in FIG. 1, when the main seal 10 is bonded to a TFT substrate 200 (not shown), a predetermined space is provided. The liquid crystal cell is applied so as to form a rectangular outline. A part of the liquid crystal cell is provided with a liquid crystal inlet. In the main seal 10, the width of the broken line forming the liquid crystal cell is about 0.5 mm to 1 mm. In the case of the horizontal electric field method, the height is formed so that the thickness of the liquid crystal cell when bonded to the CF substrate is about 4 μm. In the case of the TN mode, the height is formed to be about 4.5 μm. The main seal 10 has, for example, a glass fiber contained in a sealing material to increase the strength. Moreover, since the container of a liquid crystal cell is comprised, it is preferable that it has affinity with respect to inorganic materials, such as a liquid crystal and glass.

  The dummy seals 80 and 81 are the same resin as the main seal 10 and are applied linearly in the vicinity of the main seal 10 as shown in FIG. In this example, it is applied substantially parallel along one side surface of the main seal 10. As described above, when the same material as that of the main seal 10 is used, the main seal 10 and the dummy seals 80 and 81 can be applied by the same process and the same material, so that the efficiency can be improved. Since these dummy seals 80 and 81 are applied, the adhesive force when the CF substrate and the TFT substrate are bonded together is enhanced, so that the main seal 10 and the dummy seals 80 and 81 are cured. It is possible to prevent troubles such as separation of the CF substrate 100 and the TFT substrate 200 due to low adhesive strength. Further, when the CF substrate 100 and the TFT substrate 200 are separated from each other, a gap is generated and the liquid crystal leaks, or when separated, the positional accuracy of the bonding is lowered, or the thickness of the liquid crystal cell near the main seal is increased. Occurrence can also be prevented.

  Here, since the dummy seals 80 and 81 do not need to have affinity with the liquid crystal, in order to reduce costs, the dummy seals 80 and 81 are not limited to materials used for the main seal 10 as long as they have a certain adhesive force, and are inexpensive. Etc. More desirably, the dummy seals 80 and 81 have a higher adhesive force than the main seal 10.

  FIG. 2 shows an enlarged view of the liquid crystal cell formed on the CF substrate 100 of FIG. Each liquid crystal cell is cut out along the line 90 as shown in FIG.

  Here, the bonding process of the CF substrate and the TFT substrate will be described. First, as shown in FIG. 3, the main seal 10 and the dummy seals 80 and 81 are applied to the upper surface of the CF substrate 100 in the seal coating (S100) process as described above, and the sealing material is temporarily dried in the precure (S101) process. Is performed, the TFT substrate 200 is placed on the CF substrate 100 by a transfer device (not shown), and the CF substrate 100 is lowered and pressed against the main seal 10 and the dummy seals 80 and 81 applied to the CF substrate 100. 100 (S102).

  At this time, since the dummy seal 80 is applied in the vicinity of the main seal 10 forming each liquid crystal cell to increase the adhesive force, the TFT substrate 200 is securely adhered to the CF substrate 100 without being peeled off. Until the main seal 10 and the dummy seals 80 and 81 are cured by heating means or ultraviolet irradiation means, the TFT substrate 200 becomes CF substrate due to the repulsive force of the spacers sandwiched between the CF substrate 100 and the TFT substrate 200. Since it is not separated from 100, it is possible to realize bonding with excellent positional accuracy and liquid crystal layer thickness uniformity.

  In this cure (S103), after the main seal 10 is cured and the CF substrate 100 and the TFT substrate 200 are securely fixed, each liquid crystal cell is cut out along the line 90 as shown in FIG. Thereby, the dummy seals 80 and 81 are separated from each liquid crystal cell.

  As described above, according to the liquid crystal panel substrate according to the first exemplary embodiment, the dummy seals 80 and 81 are applied around the main seal 10 to enhance the adhesive force. For this reason, it is sandwiched between the CF substrate 100 and the TFT substrate 200 after the TFT substrate 200 is bonded to the CF substrate 100 and before the main seal 10 and the dummy seals 80 and 81 are cured by the heating means or the ultraviolet irradiation means. Since the TFT substrate 200 is not separated from the CF substrate 100 due to the repulsive force of the spacers, it is possible to realize bonding with excellent positional accuracy.

Embodiment 2. FIG.
FIG. 4 shows the configuration of the CF substrate in the second embodiment. The color filter substrate in the present embodiment is substantially the same as the CF substrate in the first embodiment, and a dummy seal 82 is applied in the vicinity of the liquid crystal inlet of the main seal 10 as shown in FIG. In addition, dummy seals 83, 84 and 85 are applied in a straight line in the vicinity of the main seal 10 and substantially in parallel with the respective side surfaces, so that the adhesive force for bonding the TFT substrate 200 is further enhanced.

  FIG. 5 shows an enlarged view of the liquid crystal cell formed on the CF substrate 100 of FIG. Each liquid crystal cell is cut out along the line 90 as shown in FIG.

  The CF substrate according to the second embodiment has the same configuration as that of the first embodiment by having the above-described configuration. By applying the dummy seals 82, 83, 84, and 85, the adhesive force for bonding the CF substrate 100 and the TFT substrate 200 is further increased, so that the TFT substrate 200 is more securely adhered to the CF substrate 100. In addition, it is possible to realize bonding with excellent positional accuracy. In particular, in the vicinity of the liquid crystal injection port, since there is no main seal 10, the CF substrate 100 and the TFT substrate 200 are easily peeled off, so that the adhesive force between the two can be more effectively increased.

  Further, in the present cure (S103) in FIG. 3, after the main seal 10 is cured and the CF substrate 100 and the TFT substrate 200 are securely fixed, each liquid crystal cell is cut out along the line 90 in FIG. As a result, the dummy seals 82, 83, 84 and 85 are separated from the respective liquid crystal cells and discarded as they are.

  As described above, even with the liquid crystal panel substrate according to the second embodiment, since the TFT substrate 200 is not separated from the CF substrate 100, it is possible to realize bonding with excellent positional accuracy.

  It should be noted that the dummy seal 82 applied to the liquid crystal injection port may be applied so as to form a plurality of columns as shown in FIG. Further, as shown in FIG. 6B or 6C, it may be applied in a polygonal line shape, or may be applied in a strip shape outside the line 90 and applied in a plurality of columnar shapes inside. The dummy seal 82 has a configuration that does not block the liquid crystal injection port at the stage before being cut into each liquid crystal cell. Thereby, the pressure generated in the liquid crystal cell during the manufacturing process can be relaxed. Dummy seals 83, 84, 85 are also provided independently. For this reason, the space sealed by the dummy seal is not formed. Therefore, no pressure imbalance occurs due to the sealed space. Furthermore, even if the dummy seal 82 is formed in a polygonal line shape as shown in FIG. 6B, when the liquid crystal cell is cut out along the line 90, a part of the polygonal line is cut off, and the liquid crystal injection port Is formed.

Embodiment 3 FIG.
FIG. 7 shows a configuration diagram of the CF substrate according to the third embodiment. The CF substrate in the present third embodiment includes a CF substrate 100, a main seal 10, a column spacer (hereinafter referred to as CS) 40, and CS41. The main seal 10 is the same as that in the first embodiment.

  The CS 40 is a spacer that is disposed inside the main seal 10 that forms each liquid crystal cell on the CF substrate 100 to maintain a cell gap. The CS 40 is formed in a column shape by, for example, photolithography. The CS 40 is disposed at a location facing the light shielding portion other than the pixel opening portion of the TFT substrate 200 when the CF substrate 100 and the TFT substrate 200 (not shown) are bonded together. The CS 40 is similarly formed on the TFT substrate 200 (not shown).

  CS 41 is a spacer disposed around each liquid crystal cell formed on the CF substrate 100. Since the CS 41 is arranged in a wide range around each liquid crystal cell, the repulsive force of the CS 40 when the CF substrate 100 and the TFT substrate 200 are bonded together is dispersed on the entire surface of the CF substrate 100. It is possible to prevent the TFT substrate 200 from being peeled off locally. The CS 41 may be provided at the same density as the CS 40, or may have a different density. When the density of CS41 is higher than the density of CS40, the effect of dispersion can be enhanced. In order to disperse the repulsive force of CS40, it is conceivable to provide CS41 inside the liquid crystal cell, that is, to increase the number of CS40. However, increasing the number of spacers may decrease the aperture ratio or reduce the liquid crystal in a low temperature environment. This is not preferable because a problem of low-temperature foaming in which bubbles are generated due to shrinkage of the material is caused. For this reason, in this embodiment, it is provided outside the liquid crystal cell.

  FIG. 8 shows an enlarged view of pixels formed on the TFT substrate 200 (not shown). This pixel applies a voltage to a source wiring 50 that is a wiring for transmitting a signal voltage for screen display, a gate wiring 60 for ON / OFF control of the pixel opening 70 depending on the voltage level, and a liquid crystal on the substrate. The pixel electrode 70 is provided.

  As shown in FIG. 8, the CS 40 formed on the TFT substrate 200 is on a gate wiring 60 disposed between the pixels, that is, a portion that transmits light of an LCD (Liquid Crystal Display), that is, a light shielding portion other than the pixel opening. Is arranged. For this reason, the alignment disorder of the liquid crystal around the CS 40 can be hidden by the light-shielding part, and the deterioration of the image quality due to the alignment disorder can be eliminated. Further, since the CS 40 disposed on the CF substrate 100 is disposed at a position facing the light shielding portion other than the pixel opening, the liquid crystal around the CS 40 when the CF substrate 100 and the TFT substrate 200 are bonded together. The orientation disorder is hidden by the light shielding portion, and the image quality is not deteriorated by the orientation disorder.

  Here, the bonding process of the CF substrate and the TFT substrate will be described. First, as shown in FIG. 3, the main seal 10 and the dummy seals 80 and 81 are applied to the upper surface of the CF substrate 100 in the seal coating (S100) process as described above, and the sealing material is temporarily dried in the precure (S101) process. Is done. Then, the TFT substrate 200 is placed at the upper position of the CF substrate 100 by a transfer device (not shown), and is lowered to be pressed against the main seal 10 on the CF substrate 100 (S102).

  At this time, the repulsive force of the CS 40 when the TFT substrate 200 is attached to the CF substrate 100 is dispersed by the CS 41 disposed outside each liquid crystal cell. For this reason, it is possible to prevent the TFT substrate 200 from locally peeling from the CF substrate 100. The TFT substrate 200 is not separated from the CF substrate 100 by the repulsive force of the CS 40 sandwiched between the CF substrate 100 and the TFT substrate 200 until the main seal 10 is cured by the heating means or the ultraviolet irradiation means. Therefore, it is possible to realize bonding with excellent positional accuracy.

  In the present cure (S103), after the main seal 10 is cured and the CF substrate 100 and the TFT substrate 200 are securely fixed, the CS 41 is separated from each liquid crystal cell by being cut out for each liquid crystal cell.

  As described above, according to the liquid crystal panel substrate according to the third embodiment, since the CS 41 is disposed outside the main seal 10 that forms each liquid crystal cell, the CF substrate 100 and the TFT substrate 200 are bonded together. It is possible to disperse the repulsive force of CS40. For this reason, the repulsive force of CS 40 in the vicinity of the main seal 10 can be weakened, and the TFT substrate 200 can be prevented from being peeled off from the CF substrate 100. Accordingly, due to the repulsive force of the CS 40 sandwiched between the CF substrate 100 and the TFT substrate 200 after the TFT substrate 200 is bonded to the CF substrate 100 and before the main seal 10 is cured by heating means or ultraviolet irradiation means. Since the TFT substrate 200 is not separated from the CF substrate 100, it is possible to realize bonding with excellent positional accuracy.

Embodiment 4 FIG.
FIG. 9 shows a configuration diagram of the CF substrate according to the fourth embodiment. The CF substrate in the fourth embodiment is substantially the same as that in the third embodiment, and CS 41 is replaced with CS 42 that covers the periphery of the main seal 10. Main seal 10 and CS 40 are the same as those in the third embodiment.

  CS42 is the same material as CS40, for example, and is formed at the same height as CS40 by photolithography.

  Since the CF substrate in the fourth embodiment has the above-described configuration, the same effects as the CF substrate in the third embodiment are obtained. Further, since the CS 42 is formed on the entire surface of the CF substrate 10 so as to cover the periphery of the main seal 10, the repulsive force of the CS 40 when the TFT substrate 200 is bonded to the CF substrate 100 is more effectively dispersed. As a result, the TFT substrate 200 can be more effectively prevented from being peeled off from the CF substrate 100.

  In this cure (S103), after the main seal 10 is cured and the CF substrate 100 and the TFT substrate 200 are securely fixed, each liquid crystal cell is cut out along the line 90, whereby the CS 42 Detached from the cell.

As described above, according to the liquid crystal panel substrate according to the fourth embodiment, since each liquid crystal cell has the CS 42 disposed outside the main seal 10, the CS 40 when the CF substrate 100 and the TFT substrate 200 are bonded together. It is possible to more effectively disperse the repulsive force. For this reason, it can prevent more effectively that the TFT substrate 200 peels locally from the CF substrate 100. Accordingly, due to the repulsive force of the CS 40 sandwiched between the CF substrate 100 and the TFT substrate 200 after the TFT substrate 200 is bonded to the CF substrate 100 and before the main seal 10 is cured by heating means or ultraviolet irradiation means. Since the TFT substrate 200 is not separated from the CF substrate 100, it is possible to realize bonding with excellent positional accuracy.
Further, if a part of CS 42 is cut out and a vent hole 421 is provided as shown in FIG. 10, there is no problem due to air accumulation, which is better.

Embodiment 5 FIG.
FIG. 11 shows a configuration diagram of an example in which the liquid crystal panel substrate according to the fifth embodiment is used as a CF substrate. The CF substrate in the present embodiment is a combination of the first embodiment and the third embodiment, and includes a CF substrate 100, a main seal 10, CS40, CS41, and dummy seals 80 and 81. .

  The main seal 10, the CS 40, and the dummy seals 80 and 81 are applied or arranged in the same manner as in the first embodiment, and a description thereof is omitted. The CS 41 is formed in a column shape around the main seal 10 and the dummy seals 80 and 81 by, for example, photolithography.

  Next, functions and effects caused by the CF substrate according to the fifth embodiment having the above-described configuration will be described. First, in the seal application (S100) step shown in FIG. 3, the main seal 10 and the dummy seals 80 and 81 are applied to the upper surface of the CF substrate 100 as described above, and the seal material is temporarily dried in the precure (S101) step. . Thereafter, the TFT substrate 200 is placed on the CF substrate 100 by a transfer device (not shown), and is lowered and stacked on the CF substrate 100 so as to be pressed against the main seal 10 and the dummy seals 80 and 81 applied to the CF substrate 100. (S102).

  At this time, since the dummy seal 80 is applied in the vicinity of the main seal 10 forming each liquid crystal cell to increase the adhesive force, the TFT substrate 200 is securely adhered to the CF substrate 100 without being peeled off. Furthermore, since the CS 41 is disposed around the main seal 10 and the dummy seal 80 or the main seal 10 and the dummy seal 81, the repulsive force of the CS 40 generated when the TFT substrate 200 is pressed against the CF substrate 100 is dispersed. The For this reason, it is more effectively prevented that the TFT substrate 200 is locally peeled from the CF substrate 100 as compared with the first to third embodiments. The CF substrate is removed from the CF substrate 100 by the repulsive force of the CF substrate 100 and the spacer sandwiched between the CF substrates until the main seal 10 and the dummy seals 80 and 81 are cured by heating means or ultraviolet irradiation means. Since they do not leave, it is possible to realize bonding with excellent positional accuracy.

  Further, in this cure (S103), after the main seal 10 is cured and the CF substrate 100 and the TFT substrate 200 are securely fixed, each liquid crystal cell is cut out along the line 90, whereby the CS 41 and the dummy seal 80. And 81 are separated from each liquid crystal cell.

  As described above, according to the liquid crystal panel substrate according to the fifth embodiment, the dummy seals 80 and 81 are applied around the main seal 10 to increase the adhesive force, and the main seal 10, the dummy seal 80, and the CS 41 is arranged around 81 and the repulsive force of CS 40 in the vicinity of the main seal 10 is weakened. For this reason, it is sandwiched between the CF substrate 100 and the TFT substrate 200 after the TFT substrate 200 is bonded to the CF substrate 100 and before the main seal 10 and the dummy seals 80 and 81 are cured by heating means or ultraviolet irradiation means. Since the TFT substrate 200 is not separated from the CF substrate 100 due to the repulsive force of the spacers, it is possible to realize bonding with excellent positional accuracy.

Other embodiments.
If the adhesive strength at the time of bonding can be increased, the dummy seals 80, 81, 82, 83, 84 or 85 are not limited to a linear shape, and are applied over a wide area around the main seal 10 to provide a more effective adhesive strength. May be improved.

Further, it is possible to use a combination of the configurations of the CF substrates 100 in the above-described plurality of embodiments.
Further, it is more effective to use the IPS method in which the thickness of the liquid crystal layer has a great influence on the optical characteristics. This point will be described in more detail.
As a lateral electric field method capable of obtaining a wide viewing angle, an IPS method and an FFS method have been put into practical use. These systems perform optical switching using a birefringence effect. For this reason, the thickness of the liquid crystal layer has a great influence on the optical characteristics. FIG. 15 shows changes in the optical characteristics with respect to the liquid crystal layer thickness of the TN mode and IPS mode, which are the most versatile liquid crystal display devices. Here, the horizontal axis is represented by the product of Δn indicating the refractive index anisotropy of liquid crystal molecules and the thickness d of the liquid crystal layer, and the vertical axis is represented by ΔE * indicating an optical change. ΔE ^* relates to the L ^* u ^* v ^* color system and can be expressed by the following equation.
ΔE ^* = [(ΔL ^* ) ² + (Δu ^* ) ² + (Δv ^* ) ² ] ^1/2
Further, the graph shown in FIG. 15 is a result obtained from the calculation. From FIG. 15, it can be seen that in both the IPS system and the TN system, the change in ΔE ^* when Δn · d is changed by 20 nm is greater than twice in the IPS system. Since Δn is a value specific to liquid crystal molecules, only the thickness d of the liquid crystal layer contributes to the change in ΔE ^* within the same panel. Therefore, it can be explained that the IPS method is more strict with respect to variations in the thickness of the liquid crystal layer than the TN method.
From these, it is explained that it is effective to use the technique for improving the thickness unevenness around the main seal part for the lateral electric field method using the birefringence effect.

It is a schematic block diagram which shows the liquid crystal panel substrate in Embodiment 1 of invention. It is an enlarged block diagram which shows the liquid crystal cell on the liquid crystal panel substrate in Embodiment 1 of invention. It is a figure which shows the process of bonding the liquid crystal panel board | substrate in Embodiment 1 of invention. It is a schematic block diagram which shows the liquid crystal panel substrate in Embodiment 2 of invention. It is an enlarged block diagram which shows the liquid crystal cell on the liquid crystal panel substrate in Embodiment 2 of invention. It is a figure which shows the dummy seal | sticker 82 formed on the liquid crystal panel board | substrate in Embodiment 2 of invention. It is a schematic block diagram which shows the liquid crystal panel substrate in Embodiment 3 of invention. It is an enlarged block diagram which shows the pixel comprised by the TFT substrate 200 in the liquid crystal panel substrate in Embodiment 3 of invention. It is a schematic block diagram which shows the liquid crystal panel substrate in Embodiment 4 of invention. It is a schematic block diagram which shows the liquid crystal panel substrate in Embodiment 4 of invention. It is a schematic block diagram which shows the liquid crystal panel substrate in Embodiment 5 of invention. It is a schematic block diagram which shows the liquid crystal panel substrate in a prior art. It is sectional drawing which shows the liquid crystal cell by which the plastic spacer 20 is arrange | positioned inside the liquid crystal panel in a prior art. It is sectional drawing which shows the liquid crystal cell by which CS40 is arrange | positioned inside the liquid crystal panel in a prior art. It is a graph which shows the change of the optical characteristic with respect to the liquid crystal layer thickness of a TN system and an IPS system.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Main seal | sticker 11 Glass fiber 20 Plastic spacer 30 Liquid crystal 31 Liquid crystal 40, 41, 42 CS 50 Source wiring 60 Gate wiring 70 Pixel electrode 80, 81, 82, 83, 84, 85 Dummy seal 90 Line 100 CF substrate 200 TFT substrate 421 Vent

Claims (7)

A liquid crystal panel substrate comprising a first substrate and a second substrate and coated with a main seal forming a liquid crystal cell,
A first columnar spacer for holding a cell gap inside the main seal;
A second columnar spacer for dispersing the repulsive force of the first columnar spacer on one of the first substrate and the second substrate so as to surround the main seal. Arranged, integrated ,
The liquid crystal panel substrate, wherein the second columnar spacer has an isolated pattern and is arranged at a higher density than the first columnar spacer . A dummy seal applied around the main seal for enhancing the adhesive force is further arranged and integrated on one of the first substrate and the second substrate. The liquid crystal panel substrate according to claim 1 . 3. The liquid crystal panel substrate according to claim 1, wherein one of the liquid crystal panel substrates is a color filter substrate. The liquid crystal panel substrate according to any one of claims 1 to 3 , wherein the liquid crystal panel substrate is used in a liquid crystal display device using a horizontal electric field method. A method of manufacturing a liquid crystal panel substrate in which a main seal forming a liquid crystal cell is applied on the liquid crystal panel substrate,
Disposing a first columnar spacer for holding a cell gap on the first substrate or the second substrate inside the main seal;
Disposing a second columnar spacer for dispersing the repulsive force on the first substrate or the second substrate so as to surround the main seal ;
In the step of arranging the second columnar spacers, the second columnar spacers made of isolated patterns are arranged at a higher density than the first columnar spacers . 6. The method of manufacturing a liquid crystal panel according to claim 5, further comprising a step of applying a dummy seal for increasing the adhesive strength around the main seal. The method for manufacturing a liquid crystal panel according to claim 5, wherein the liquid crystal panel is used in a liquid crystal display device using a horizontal electric field method.

Images