JP4441451B2 - シート貼付装置 - Google Patents
シート貼付装置 Download PDFInfo
- Publication number
- JP4441451B2 JP4441451B2 JP2005198807A JP2005198807A JP4441451B2 JP 4441451 B2 JP4441451 B2 JP 4441451B2 JP 2005198807 A JP2005198807 A JP 2005198807A JP 2005198807 A JP2005198807 A JP 2005198807A JP 4441451 B2 JP4441451 B2 JP 4441451B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- plate
- wafer
- roller
- sticking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 description 39
- 230000001070 adhesive effect Effects 0.000 description 39
- 238000004804 winding Methods 0.000 description 9
- 238000012840 feeding operation Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1317—Means feeding plural workpieces to be joined
- Y10T156/1343—Cutting indefinite length web after assembly with discrete article
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本発明は、前述した不都合に着目して案出されたものであり、その目的は、間欠的な繰出動作によって形成されるシートの凹部跡を貼付領域に含まれないように除外しても、シートの無駄を極力無くして板状部材に貼付することができるシート貼付装置を提供することにある。
前記ピールプレートは、前記板状部材の大きさ若しくはテーブルの大きさに応じて進退可能に設けられるとともに、前記シートの貼付が完了したときのピールプレートの先端が前記板状部材の端近傍若しくはテーブルの外縁に略接する位置となるように設けられる、という構成を採っている。
従って、結果的に、繰出ヘッド49が、ガイド45及び単軸ロボット46(図1参照)の傾斜角度に沿って次第に下降し、これにより、ピールプレート22の先端と押圧ローラ14との間の接着シートSの長さが短くなっても貼付角度θが常に一定となるように維持されることとなる。
すなわち、本発明は、主に特定の実施形態に関して特に図示、説明されているが、本発明の技術的思想及び目的の範囲から逸脱することなく、以上説明した実施形態に対し、形状、位置若しくは配置等に関し、必要に応じて当業者が様々な変更を加えることができるものである。
12 シート繰出ユニット
14 押圧ローラ
22 ピールプレート
50 シリンダ
PS 剥離シート
S 接着シート
W ウエハ(板状部材)
θ 貼付角度
Claims (2)
- 剥離シートからシートを剥離するピールプレートを含むシート繰出ユニットと、テーブルに支持された板状部材に前記シートを押圧して貼付する押圧ローラとを備えたシート貼付装置において、
前記ピールプレートは、前記板状部材の大きさ若しくはテーブルの大きさに応じて進退可能に設けられるとともに、前記シートの貼付が完了したときのピールプレートの先端が前記板状部材の端近傍若しくはテーブルの外縁に略接する位置となるように設けられていることを特徴とするシート貼付装置。 - 前記ピールプレートは、前記押圧ローラが板状部材の一端から他端に向って移動するときに前記テーブルの上方所定位置から当該テーブルに近づく方向に移動することを特徴とする請求項1記載のシート貼付装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005198807A JP4441451B2 (ja) | 2005-07-07 | 2005-07-07 | シート貼付装置 |
CNB2006800243223A CN100550337C (zh) | 2005-07-07 | 2006-06-26 | 薄片粘贴装置 |
DE112006001812T DE112006001812T5 (de) | 2005-07-07 | 2006-06-26 | Folien-Anklebeeinrichtung |
US11/916,788 US7900677B2 (en) | 2005-07-07 | 2006-06-26 | Sheet sticking apparatus |
KR1020077030786A KR101229857B1 (ko) | 2005-07-07 | 2006-06-26 | 시트 첩부장치 |
PCT/JP2006/312686 WO2007007532A1 (ja) | 2005-07-07 | 2006-06-26 | シート貼付装置 |
TW095123388A TWI391981B (zh) | 2005-07-07 | 2006-06-28 | Sheet attachment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005198807A JP4441451B2 (ja) | 2005-07-07 | 2005-07-07 | シート貼付装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007019240A JP2007019240A (ja) | 2007-01-25 |
JP2007019240A5 JP2007019240A5 (ja) | 2009-11-05 |
JP4441451B2 true JP4441451B2 (ja) | 2010-03-31 |
Family
ID=37636929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005198807A Expired - Fee Related JP4441451B2 (ja) | 2005-07-07 | 2005-07-07 | シート貼付装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7900677B2 (ja) |
JP (1) | JP4441451B2 (ja) |
KR (1) | KR101229857B1 (ja) |
CN (1) | CN100550337C (ja) |
DE (1) | DE112006001812T5 (ja) |
TW (1) | TWI391981B (ja) |
WO (1) | WO2007007532A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5430087B2 (ja) * | 2008-06-26 | 2014-02-26 | リンテック株式会社 | シート貼付装置及び貼付方法 |
JP2011116486A (ja) * | 2009-12-02 | 2011-06-16 | Sharp Corp | フィルム剥離装置 |
CN102723520B (zh) * | 2011-03-29 | 2014-12-10 | 深圳市鑫力创自动化设备有限公司 | 一种电池贴面垫设备 |
JP6527817B2 (ja) * | 2015-12-11 | 2019-06-05 | リンテック株式会社 | シート貼付装置および貼付方法 |
JP6796952B2 (ja) * | 2016-05-31 | 2020-12-09 | リンテック株式会社 | シート貼付装置および貼付方法 |
US11014203B2 (en) * | 2016-07-11 | 2021-05-25 | Laird Technologies, Inc. | System for applying interface materials |
US10741519B2 (en) | 2016-07-11 | 2020-08-11 | Laird Technologies, Inc. | Systems of applying materials to components |
USD881822S1 (en) | 2017-10-06 | 2020-04-21 | Laird Technologies, Inc. | Material having an edge shape |
USD999405S1 (en) | 2017-10-06 | 2023-09-19 | Laird Technologies, Inc. | Material having edging |
US11141823B2 (en) * | 2018-04-28 | 2021-10-12 | Laird Technologies, Inc. | Systems and methods of applying materials to components |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04293253A (ja) * | 1991-03-20 | 1992-10-16 | Nitto Denko Corp | 半導体ウエハの粘着テープ貼付け装置 |
JPH0632522A (ja) * | 1992-07-16 | 1994-02-08 | Nitto Denko Corp | テープ自動貼付け装置 |
JPH06268047A (ja) * | 1993-03-16 | 1994-09-22 | Sharp Corp | 半導体レーザチップの供給方法及び供給装置 |
JP3447518B2 (ja) * | 1996-08-09 | 2003-09-16 | リンテック株式会社 | 接着シート貼付装置および方法 |
JP4502547B2 (ja) * | 2000-08-07 | 2010-07-14 | 日東電工株式会社 | 半導体ウエハの保護テープ除去方法およびその装置 |
JP2003152058A (ja) * | 2001-11-13 | 2003-05-23 | Lintec Corp | ウェハ転写装置 |
JP2004047976A (ja) | 2002-05-21 | 2004-02-12 | Nitto Denko Corp | 保護テープ貼付方法およびその装置 |
JP4444619B2 (ja) * | 2003-10-10 | 2010-03-31 | リンテック株式会社 | マウント装置及びマウント方法 |
JP4276049B2 (ja) * | 2003-10-31 | 2009-06-10 | リンテック株式会社 | 貼合装置及び貼合方法 |
JP4326519B2 (ja) * | 2005-03-31 | 2009-09-09 | 日東電工株式会社 | 保護テープ剥離方法およびこれを用いた装置 |
-
2005
- 2005-07-07 JP JP2005198807A patent/JP4441451B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-26 CN CNB2006800243223A patent/CN100550337C/zh not_active Expired - Fee Related
- 2006-06-26 DE DE112006001812T patent/DE112006001812T5/de not_active Withdrawn
- 2006-06-26 KR KR1020077030786A patent/KR101229857B1/ko active IP Right Grant
- 2006-06-26 WO PCT/JP2006/312686 patent/WO2007007532A1/ja active Application Filing
- 2006-06-26 US US11/916,788 patent/US7900677B2/en active Active
- 2006-06-28 TW TW095123388A patent/TWI391981B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2007007532A1 (ja) | 2007-01-18 |
JP2007019240A (ja) | 2007-01-25 |
KR101229857B1 (ko) | 2013-02-05 |
DE112006001812T5 (de) | 2008-05-15 |
TWI391981B (zh) | 2013-04-01 |
CN100550337C (zh) | 2009-10-14 |
US7900677B2 (en) | 2011-03-08 |
KR20080023319A (ko) | 2008-03-13 |
US20090223638A1 (en) | 2009-09-10 |
TW200721241A (en) | 2007-06-01 |
CN101213646A (zh) | 2008-07-02 |
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