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JP4424070B2 - Insert product molding device, electromagnetic device, discharge lamp lighting device, lighting fixture, and vehicle - Google Patents

Insert product molding device, electromagnetic device, discharge lamp lighting device, lighting fixture, and vehicle Download PDF

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JP4424070B2
JP4424070B2 JP2004156866A JP2004156866A JP4424070B2 JP 4424070 B2 JP4424070 B2 JP 4424070B2 JP 2004156866 A JP2004156866 A JP 2004156866A JP 2004156866 A JP2004156866 A JP 2004156866A JP 4424070 B2 JP4424070 B2 JP 4424070B2
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holding member
molten resin
cavity
insert
resin
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JP2005335201A (en
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久尚 梶浦
豊 北川
公明 中田
慎一郎 越智
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Panasonic Corp
Panasonic Electric Works Co Ltd
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Panasonic Corp
Matsushita Electric Works Ltd
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

本発明は、インサート品成形装置、電磁装置、放電灯点灯装置、照明器具、及び車両に関するものである。 The present invention Inserts article molding apparatus, an electromagnetic device, a discharge lamp lighting device, lighting fixture, and to a vehicle.

従来、トランスやICなどの回路部品は絶縁性や防水性を必要とすることから、その表面をポッティング材で覆って、絶縁性及び防水性を確保していたが、近年製品のコストダウンやリサイクル性の向上が強く要求されるようになって、その表面を成形樹脂で封止することが行われるようになった。この樹脂封止には、量産性に優れた射出成形やトランスファー成形で用いるインサート品成形方法が採用されており、例えば特許文献1に示されるようなインサート品成形方法が行われている。   Traditionally, circuit components such as transformers and ICs require insulation and waterproofing, so the surface was covered with a potting material to ensure insulation and waterproofing. The improvement in properties has been strongly demanded, and the surface has been sealed with a molding resin. For this resin sealing, an insert product molding method used in injection molding or transfer molding excellent in mass productivity is employed. For example, an insert product molding method as shown in Patent Document 1 is performed.

上記文献に開示されたインサート品成形方法では、金型のキャビティに対して進退自在に設けられた保持部材によってインサート品をキャビティ内に保持した状態で、このキャビティ内に溶融樹脂を注入するとともに、溶融樹脂の充填が完了する前或いは充填完了後に保持部材をキャビティから後退させて、インサート品を樹脂封止するのであるが、保持部材を後退させることが可能なように、溶融樹脂に接触する保持部材の表面を加熱手段により加熱して、保持部材の近傍の溶融樹脂が硬化するのを防止している。すなわち、加熱手段を用いて保持部材を加熱することで、キャビティに充填された溶融樹脂が保持部材に接触しても冷却固化層が形成されないか、冷却固化層が形成されたとしても冷却の程度を加熱しない場合に比べて遅らせている。そのため溶融樹脂の充填が完了した後に保持部材をキャビティから後退させても、保持部材が後退した後にできた空間に溶融樹脂が流入して確実に融合し、上記の空間を充分に埋め込むことができるので、未融合部の残留を充分抑制することができる。また溶融樹脂の充填完了まで保持部材によってインサート品を保持しておくことで、インサート品の位置ずれを防止することができ、従ってインサート品の位置ずれや保持部材が後退した後にできる未融合部の残留を抑制して、インサート品を充分に封止した良好な樹脂成形品を形成することが可能になっていた。
特許第3389775号公報
In the insert product molding method disclosed in the above document, while the insert product is held in the cavity by a holding member provided so as to be movable forward and backward with respect to the mold cavity, molten resin is injected into the cavity, The holding member is retracted from the cavity before or after the filling of the molten resin is completed, and the insert product is sealed with resin, but the holding member is in contact with the molten resin so that the holding member can be retracted. The surface of the member is heated by a heating means to prevent the molten resin near the holding member from being cured. That is, by heating the holding member using a heating means, a cooling solidified layer is not formed even when the molten resin filled in the cavity contacts the holding member, or even if a cooling solidified layer is formed, the degree of cooling Compared to when not heating. Therefore, even if the holding member is retracted from the cavity after the filling of the molten resin is completed, the molten resin flows into the space formed after the holding member is retracted and is surely fused, so that the above space can be sufficiently embedded. Therefore, it is possible to sufficiently suppress the remaining unfused portion. In addition, by holding the insert product with the holding member until the filling of the molten resin is completed, it is possible to prevent the displacement of the insert product, and therefore the position of the insert product and the unfused portion that is formed after the holding member is retracted. It was possible to form a good resin molded product in which the insert was sufficiently sealed while suppressing the residue.
Japanese Patent No. 3389775

上述のインサート品成形方法では、保持部材に接触する溶融樹脂が硬化しないように保持部材を加熱手段によって加熱しており、この加熱手段は保持部材の内部に設ける場合と、保持部材の外部に設け熱伝導によって保持部材を加熱する場合とがあるが、何れの場合にも成形金型に加熱手段を組み込む必要があるので、成形金型の他の構造部品と加熱手段との干渉を避けるために成形金型の構造が複雑化したり、大型化して、金型の製造コストが上昇するという問題があった。さらに保持部材の内部に加熱手段を備える場合は保持部材が大型化するという問題があり、通電によって発熱する発熱体を内蔵させる場合は金型の内部を通して加熱手段まで配線を引き回すのが難しく、また保持部材の進退に応じて配線も移動するため、長期間使用すると配線が断線しやすく、また加熱手段の電力消費が増大するという問題があった。   In the insert product molding method described above, the holding member is heated by heating means so that the molten resin that contacts the holding member is not cured, and this heating means is provided inside the holding member and outside the holding member. There are cases where the holding member is heated by heat conduction, but in any case, it is necessary to incorporate a heating means in the molding die, so in order to avoid interference between other structural parts of the molding die and the heating means There has been a problem that the manufacturing cost of the mold rises because the structure of the molding mold becomes complicated or large. Furthermore, when the heating member is provided inside the holding member, there is a problem that the holding member becomes large, and when a heating element that generates heat by energization is incorporated, it is difficult to route the wiring to the heating means through the inside of the mold, Since the wiring also moves in accordance with the advancement and retraction of the holding member, there is a problem that the wiring easily breaks when used for a long period of time, and the power consumption of the heating means increases.

また保持部材を加熱するための加熱手段の熱が、保持部材以外の成形金型の構造部品やキャビティ内に充填された溶融樹脂に伝導するため、これらの温度が上昇して、溶融樹脂の冷却に長時間を要し、生産性が低下するという問題もあった。特許文献1の表1に示されるように保持部材の熱容量を小さくして急速加熱手段を用いることで、保持部材の加熱、冷却にかかる時間を短くすることも考えられるが、加熱時間および冷却時間の短縮には限界があり、成形サイクルが長くなって生産性を阻害していた。また溶融樹脂にスーパーエンプラ等の溶融温度が高い樹脂(例えばポリエーテルイミドの場合は溶融温度が400℃)を用いる場合は保持部材が融点、ガラス転移点に到達するのに長時間を要し、生産性が低下するという問題があった。   In addition, since the heat of the heating means for heating the holding member is conducted to the structural parts of the molding die other than the holding member and the molten resin filled in the cavity, these temperatures rise and the molten resin is cooled. It took a long time to reduce productivity. As shown in Table 1 of Patent Document 1, it is conceivable to shorten the time required for heating and cooling the holding member by reducing the heat capacity of the holding member and using rapid heating means. There is a limit to shortening the length, and the molding cycle is lengthened, which hinders productivity. In addition, when a resin having a high melting temperature such as super engineering plastic is used as the molten resin (for example, in the case of polyetherimide, the melting temperature is 400 ° C.), it takes a long time for the holding member to reach the melting point and the glass transition point. There was a problem that productivity was lowered.

また更に保持部材によって保持されるインサート品が、汎用樹脂などの耐熱性の低い材料でできている場合、加熱手段によって加熱された保持部材が短時間インサート品に接触しただけでも、インサート品が保持部材の熱で変形し、インサート品の位置決め精度が低下するという問題があった。   Furthermore, when the insert product held by the holding member is made of a material having low heat resistance such as a general-purpose resin, the insert product is held even if the holding member heated by the heating means contacts the insert product for a short time. There is a problem that the positioning accuracy of the insert product is lowered due to deformation of the member due to heat.

またキャビティに溶融樹脂を充填した際に、保持部材に接触した溶融樹脂が保持部材の熱で暖められて粘度が低下し、成形圧力によって保持部材が進退するための摺動部内に流れ込んで、冷却固化してしまい、保持部材が摺動できなくなる可能性もあった。以上のように保持部材を加熱することによって、保持部材近傍の溶融樹脂の固化を遅らせようとうすると、加熱手段を用いることによって様々な問題点が発生するため、保持部材を加熱することなく保持部材近傍の溶融樹脂の固化を遅らせることが望まれている。   Also, when the cavity is filled with molten resin, the molten resin that contacts the holding member is warmed by the heat of the holding member, the viscosity decreases, and flows into the sliding part for the holding member to advance and retreat by the molding pressure, cooling There was a possibility that the holding member could not be slid due to solidification. As described above, when the holding member is heated to delay the solidification of the molten resin in the vicinity of the holding member, various problems occur due to the use of the heating means. Therefore, the holding member is not heated. It is desired to delay the solidification of the nearby molten resin.

本発明は上記問題点に鑑みて為されたものであり、その目的とするところは、保持部材を加熱することなくインサート品の位置ずれや、保持部材がキャビティから後退した後にできる未融合部の残留を抑制することが可能なインサート品成形装置、電磁装置、放電灯点灯装置、照明器具、及び車両を提供することにある。 The present invention has been made in view of the above-mentioned problems, and the object of the present invention is to provide a position shift of the insert product without heating the holding member, or an unfused portion formed after the holding member is retracted from the cavity. residual Inserts article molding apparatus capable of suppressing the electromagnetic device, a discharge lamp lighting device is to provide lighting equipment, and vehicles.

請求項の発明は、複数の金型と、複数の金型を合わせて形成されるキャビティと、金型にキャビティに連通して設けられた丸孔内に進退自在に配置され、キャビティ内に突出してインサート品を保持する丸棒状の保持部材とを備えるとともに、保持部材によりインサート品をキャビティ内に保持した状態でキャビティ内に溶融樹脂を充填する手段と、インサート品の少なくとも一部を溶融樹脂が外包したタイミングで保持部材をキャビティから後退させる手段と、保持部材がキャビティから後退したことによってできる空間に溶融樹脂を充填する手段とを備え、保持部材におけるキャビティ側の先端部に、片側の半円部をカットして断面半円形に形成されたDカット部が設けられ、当該Dカット部と丸孔とでできる空間に、溶融樹脂を充填するゲートが設けられたことを特徴とする。 The invention of claim 1 includes a mold multiple, a cavity is formed to match a plurality of molds, is movably disposed within a round hole provided in communication with the cavity in the mold, the cavity And a rod-shaped holding member for holding the insert product, and means for filling the cavity with molten resin while holding the insert product in the cavity by the holding member, and melting at least a part of the insert product Means for retracting the holding member from the cavity at the timing when the resin is encased, and means for filling the space formed by the holding member retracting from the cavity with molten resin . D-cut portion formed in semicircular cross-section by cutting the semi-circular portion is provided, the space available in the relevant D-cut portion and the round hole, the molten resin Characterized in that that the gate is provided.

請求項の発明は、請求項の発明において、金型の表面に接触する溶融樹脂の表面部において、保持部材周辺の表面部よりも溶融樹脂の硬化が促進される硬化促進領域を設けたことを特徴とする。 According to a second aspect of the present invention, in the first aspect of the invention, in the surface portion of the molten resin that comes into contact with the surface of the mold, a hardening acceleration region is provided in which the hardening of the molten resin is promoted more than the surface portion around the holding member. It is characterized by that.

請求項の発明は、請求項の発明において、硬化促進領域とインサート品との間の樹脂部の肉厚を、保持部材周辺の表面部とインサート品との間の樹脂部の肉厚よりも薄くしたことを特徴とする。
請求項4の発明は、請求項1乃至3の何れか1つの発明において、保持部材は、複数の金型の合わせ面において進退自在に配置されたことを特徴とする。
The invention of claim 3 is the invention of claim 2 , wherein the thickness of the resin portion between the curing acceleration region and the insert product is greater than the thickness of the resin portion between the surface portion around the holding member and the insert product. It is also characterized by being made thinner.
A fourth aspect of the invention is characterized in that, in any one of the first to third aspects of the invention, the holding member is disposed so as to freely advance and retract on the mating surfaces of the plurality of molds.

請求項の発明は、フェライトコア、当該フェライトコアに巻回される巻線、及び巻線の両端に電気的に接続されるコイル端子とを含む巻線構造体と、当該巻線構造体をインサート品とし、請求項1乃至4の何れか1つに記載のインサート品成形装置を用いて成形され、コイル端子の少なくとも一部を露出させた状態で樹脂封止する封止樹脂部とを備えたことを特徴とする。 The invention of claim 5, ferrite core, a winding structure and a coil terminal electrically connected to both ends of those the ferrite core to the windings to be wound, and winding, the winding structure the body and insert article is molded using an insert article molding apparatus according to any one of claims 1 to 4, coils sealing resin portion for resin sealing while exposing at least a portion of the terminal characterized by comprising and.

請求項の発明は、請求項記載の電磁装置を用いたことを特徴とする。 The invention of claim 6 uses the electromagnetic device according to claim 5 .

請求項の発明は、請求項記載の放電灯点灯装置を用いたことを特徴とする。 The invention of claim 7, characterized by using the discharge lamp lighting device according to claim 6, wherein.

請求項の発明は、請求項記載の照明器具を用いたことを特徴とする。 The invention of claim 8 is characterized in that the lighting apparatus of claim 7 is used.

請求項の発明によれば、キャビティ内に溶融樹脂を充填する際に、金型において保持部材が摺動する部位の一部に設けたゲートから溶融樹脂を充填しているので、保持部材が摺動する部位の近傍には常に溶融樹脂が流れることになり、キャビティ内の他の部分に充填された溶融樹脂と比較すると、保持部材が摺動する部位の近傍では溶融樹脂の硬化を遅らせることができる。従ってインサート品の少なくとも一部を溶融樹脂が外包したタイミングで保持部材をキャビティから後退させると、インサート品を外包する溶融樹脂の硬化が進んでいることで、インサート品を確実に位置決めすることができ、しかも保持部材が後退した後にできた空間には、保持部材が摺動する部位の一部に設けたゲートから溶融樹脂が充填されるから、溶融樹脂の未融合部の発生を抑制することができ、保持部材を加熱する手段を備えることなく、インサート品を確実に位置決めでき、且つ、溶融樹脂の未融合部の発生を抑制することが可能なインサート品成形装置を提供できる。 According to the first aspect of the present invention, when the molten resin is filled in the cavity, the molten resin is filled from the gate provided at a part of the portion where the holding member slides in the mold. The molten resin always flows in the vicinity of the sliding part, and compared with the molten resin filled in the other part in the cavity, the hardening of the molten resin is delayed in the vicinity of the part where the holding member slides. Can do. Therefore, if the holding member is retracted from the cavity at the timing when the molten resin encloses at least part of the insert product, the molten resin enclosing the insert product is hardened, so that the insert product can be positioned reliably. In addition, the space formed after the holding member is retracted is filled with the molten resin from the gate provided at a part of the portion where the holding member slides, so that the occurrence of an unfused portion of the molten resin can be suppressed. It is possible to provide an insert product molding apparatus that can reliably position the insert product and suppress the occurrence of an unfused portion of the molten resin without providing means for heating the holding member.

請求項の発明によれば、金型の表面に接触する溶融樹脂の表面部において、保持部材周辺の表面部よりも硬化促進領域では溶融樹脂の硬化が促進されているので、保持部材を後退させるタイミングで、保持部材の周辺領域の溶融樹脂が硬化していなくても、硬化促進領域の溶融樹脂は硬化が進んでいるから、インサート品の位置ずれをさらに抑制できる。 According to the second aspect of the present invention, in the surface portion of the molten resin that contacts the surface of the mold, the curing of the molten resin is promoted more in the curing acceleration region than in the surface portion around the holding member. Even when the molten resin in the peripheral region of the holding member is not cured at the timing of the curing, since the molten resin in the curing acceleration region has been cured, the position shift of the insert product can be further suppressed.

請求項の発明によれば、硬化促進領域の樹脂部の肉厚を、周辺領域の樹脂部の肉厚よりも薄肉にすることで、硬化促進領域の樹脂の硬化速度を周辺領域の樹脂の硬化速度を早めることができ、請求項の発明と同様の効果を奏する。
請求項4の発明によれば、複数の金型の合わせ面に保持部材を進退自在に保持しているので、保持部材が移動する部位の一部に設けるゲート位置の設計の自由度を高くできる。
According to the invention of claim 3 , by setting the thickness of the resin portion in the curing acceleration region to be thinner than the thickness of the resin portion in the peripheral region, the curing speed of the resin in the curing acceleration region is increased. The curing speed can be increased, and the same effect as that of the invention of claim 2 can be obtained.
According to the invention of claim 4, since the holding member is held on the mating surfaces of the plurality of molds so as to be able to advance and retreat, the degree of freedom in designing the gate position provided in a part of the portion where the holding member moves can be increased. .

請求項の発明によれば、インサート品である巻線構造体の位置ずれを抑制することで、巻線構造体を封止する封止樹脂の肉厚が極端に薄くなる部分ができないため、所望の絶縁破壊強度を得ることができ、絶縁性を高めた電磁装置を提供することができる。 According to the invention of claim 5 , by suppressing the displacement of the winding structure that is an insert product, there is no portion where the thickness of the sealing resin that seals the winding structure becomes extremely thin, A desired dielectric breakdown strength can be obtained, and an electromagnetic device with improved insulation can be provided.

請求項の発明によれば、絶縁性を高めた電磁装置を用いることで、放電灯点灯時に発生した高電圧が電磁装置に加わっても、電磁装置で絶縁破壊が発生することがなく、安定した点灯状態を得ることが可能な放電灯点灯装置を提供できる。 According to the invention of claim 6 , by using an electromagnetic device with improved insulation, even if a high voltage generated when the discharge lamp is turned on is applied to the electromagnetic device, the electromagnetic device does not cause dielectric breakdown and is stable. It is possible to provide a discharge lamp lighting device capable of obtaining the lit state.

請求項の発明によれば、請求項の放電灯点灯装置を用いることで、信頼性の高い照明器具を提供できる。 According to the invention of claim 7 , by using the discharge lamp lighting device of claim 6 , a highly reliable lighting apparatus can be provided.

請求項の発明によれば、請求項の照明器具を用いることで、信頼性の高い照明器具を備えた車両を提供できる。 According to the invention of claim 8 , by using the lighting fixture of claim 7 , a vehicle equipped with a reliable lighting fixture can be provided.

以下では、本発明に係るインサート品成形方法を用いたインサート品成形装置の一実施形態を図面に基づいて説明する。   Hereinafter, an embodiment of an insert product forming apparatus using the insert product forming method according to the present invention will be described with reference to the drawings.

先ず本実施形態のインサート品成形装置により製造される巻線構造体(インサート品)を用いた電磁装置について図17及び図18について説明する。図17に示すインサート品1は、棒状のロッド形のフェライトコア2と、このフェライトコア2の周面に平角線を1層エッジワイズ巻きにして形成された二次巻線3と、二次巻線3が巻回されたフェライトコア2を保持するコアホルダ4とで構成され、コアホルダ4には二次巻線3の両端3a,3bに電気的且つ機械的に接続される端子5a,5bが圧入或いは同時成形によって固定されている。そして、このインサート品1を絶縁のために封止樹脂で樹脂封止することによって成形品(高圧回路ブロック7)が形成される。   First, an electromagnetic device using a winding structure (insert product) manufactured by the insert product molding apparatus of this embodiment will be described with reference to FIGS. 17 and 18. An insert product 1 shown in FIG. 17 includes a rod-shaped rod-shaped ferrite core 2, a secondary winding 3 formed by winding a rectangular wire around the ferrite core 2 with one layer edgewise, and a secondary winding. A core holder 4 that holds a ferrite core 2 around which a wire 3 is wound. Terminals 5a and 5b that are electrically and mechanically connected to both ends 3a and 3b of the secondary winding 3 are press-fitted into the core holder 4 Alternatively, they are fixed by simultaneous molding. The insert product 1 is resin-sealed with a sealing resin for insulation to form a molded product (high-voltage circuit block 7).

なお、本実施形態ではインサート品1として巻線構造体を例に説明を行ったが、インサート品1を巻線構造体に限定する趣旨のものではなく、成形後に封止樹脂6に埋め込まれる電気部品であればどのようなものでも良い。また封止樹脂6に電気部品を埋め込む場合でも、外部との電気的接続を行う端子5a,5bや機能上問題無い部分を部分的に露出させても良いことは言うまでもない。図17に示したインサート品1では絶縁性能を確保するためにフェライトコア2の高圧側の端部は封止樹脂で完全に封止する必要があるが、低圧側の端面は封止樹脂から露出させても機能上問題はない。   In the present embodiment, the winding structure is described as an example of the insert product 1. However, the insert product 1 is not intended to be limited to the winding structure, and the electricity embedded in the sealing resin 6 after molding. Any component can be used. In addition, even when an electrical component is embedded in the sealing resin 6, it goes without saying that the terminals 5a and 5b for electrical connection with the outside and portions having no functional problem may be partially exposed. In the insert 1 shown in FIG. 17, it is necessary to completely seal the high-pressure end of the ferrite core 2 with a sealing resin in order to ensure insulation performance, but the low-pressure end is exposed from the sealing resin. There is no functional problem even if it is allowed.

次にインサート品1を製造するためのインサート品成形装置について図1を参照して説明する。インサート品1は2つの金型20,30を用いて成形されるのであり、両金型20,30はそれぞれそれぞれ、従来周知の成形機60の型締部(詳述せず)が備える上型プラテン61及び下型プラテン62に取り付けられている。一方の金型20は上型金型21とランナ板22と上型取付板23とを主要な構成として備え、他方の金型30は下型金型31と下型受板32と下型取付板33とスライドコア34とを主要な構成として備えている。そして、両金型20,30は図示しない温度調整手段(流体循環やヒータなど)で温度調整されている。   Next, an insert product forming apparatus for manufacturing the insert product 1 will be described with reference to FIG. The insert product 1 is molded using two molds 20 and 30, and both molds 20 and 30 are respectively upper molds provided in a mold clamping part (not described in detail) of a conventionally known molding machine 60. The platen 61 and the lower mold platen 62 are attached. One mold 20 includes an upper mold 21, a runner plate 22, and an upper mold mounting plate 23 as main components, and the other mold 30 includes a lower mold 31, a lower mold receiving plate 32, and a lower mold mounting. A plate 33 and a slide core 34 are provided as main components. The molds 20 and 30 are temperature adjusted by temperature adjusting means (fluid circulation, heater, etc.) not shown.

上型金型21および下型金型31の合わせ面にはそれぞれキャビティ41a,41bが形成されており、この2つのキャビティ41a,41bから、インサート品1を内部に保持して、このインサート品1を溶融樹脂6で樹脂封止して成形品(高圧回路ブロック7)を形成するためのキャビティ部41が形成される。また上型金型21および下型金型31の合わせ面には、それぞれキャビティ41a,41bに連通するコア収納凹部21a,31aが形成されており、金型を合わせた時に収納凹部21a,31aからできる空間内にスライドコア34がスライド移動自在に配置される。図2は図17で説明したインサート品1を模式的に示した断面図であり、端子5a,5bを省略して図示してあり、以下の成形方法の説明では図2に示した概略構造を用いて説明を行う。なお、図2は図17と上下を逆にして図示してあり、この状態でキャビティ41内に保持される。また、図2中の9はコアホルダ4に保持された高圧ヨークを示している。   Cavities 41a and 41b are formed on the mating surfaces of the upper mold 21 and the lower mold 31, respectively, and the insert product 1 is held inside from the two cavities 41a and 41b. A cavity 41 for forming a molded product (high-voltage circuit block 7) by sealing the resin with molten resin 6 is formed. Further, core accommodating recesses 21a and 31a communicating with the cavities 41a and 41b are formed on the mating surfaces of the upper mold 21 and the lower mold 31, respectively. A slide core 34 is slidably disposed in the space that can be formed. FIG. 2 is a cross-sectional view schematically showing the insert 1 described in FIG. 17, in which the terminals 5a and 5b are omitted, and in the following description of the molding method, the schematic structure shown in FIG. The explanation will be given. 2 is shown upside down from FIG. 17, and is held in the cavity 41 in this state. Further, reference numeral 9 in FIG. 2 denotes a high pressure yoke held by the core holder 4.

また上型金型21及び下型金型31の合わせ面には、それぞれキャビティ41a,41bに連通する半円形に窪んだ摺動用溝21b,31bが形成されており、両金型21,31の合わせ時に摺動用溝21b,31bが合わさってできる丸孔内に保持部材50が摺動自在に配置されている。保持部材50は図3に示すように細長の丸棒からなり、軸方向の一端側に設けた鍔52がエアシリンダ53のロッド54の先端に連結されており、エアシリンダ53によって前後動するようになっている。そして、保持部材50の軸方向中間部から先端側(キャビティ部41側)は上側の半円部をカットして、断面半円形に形成してあり、カットされた半円部(この半円部をDカット部51と言う。)と摺動凹溝21b,31bとでできる空間にゲート26の出口が臨ませてあり、ゲート26を通ってきた溶融樹脂をキャビティ部41に導入するための流路となる。なお、保持部材50は角棒形状でも良いし、保持部材50を油圧シリンダやモータで駆動しても良い。   Further, on the mating surfaces of the upper mold 21 and the lower mold 31, semi-circular recessed grooves 21b and 31b communicating with the cavities 41a and 41b are formed. The holding member 50 is slidably disposed in a round hole formed by combining the sliding grooves 21b and 31b during alignment. As shown in FIG. 3, the holding member 50 is formed of an elongated round bar, and a flange 52 provided on one end side in the axial direction is connected to the tip of the rod 54 of the air cylinder 53 so as to move back and forth by the air cylinder 53. It has become. And the tip side (cavity part 41 side) from the axial direction intermediate part of the holding member 50 cuts an upper semicircle part, is formed in the cross-sectional semicircle, and the cut semicircle part (this semicircle part) Is referred to as a D-cut portion 51) and a space formed by the sliding grooves 21b and 31b, the outlet of the gate 26 faces, and a flow for introducing the molten resin that has passed through the gate 26 into the cavity portion 41 is provided. It becomes a road. Note that the holding member 50 may have a square bar shape, or the holding member 50 may be driven by a hydraulic cylinder or a motor.

ここで、成形機60の射出部(図示せず)で溶融された溶融樹脂は、成形機ノズル63から、上型取付板23及びランナ板22に貫設されたスプルー24と、上型金型21に形成されたランナ25およびゲート26を通り、さらに保持部材50のDカット部51と摺動凹溝21b,31bとでできる空間を通って、上型金型21および下型金型31の合わせ面に形成されたキャビティ部41に導入される。なお、本実施形態では射出成形の場合を示したが、トランスファー成形機などの成形方法にも適用できる。また、本実施形態は竪型の成形機の場合を示したが、横型の場合でも適用できるのは言うまでもない。   Here, the molten resin melted at the injection portion (not shown) of the molding machine 60 is fed from the molding machine nozzle 63 to the upper die mounting plate 23 and the runner plate 22 through the sprue 24 and the upper die. The upper mold 21 and the lower mold 31 are passed through a runner 25 and a gate 26 formed in 21 and through a space formed by the D cut portion 51 of the holding member 50 and the sliding grooves 21b and 31b. It is introduced into the cavity 41 formed on the mating surface. In this embodiment, the case of injection molding is shown, but the present invention can also be applied to a molding method such as a transfer molding machine. Moreover, although this embodiment showed the case of the vertical type | molding machine, it cannot be overemphasized that it is applicable also in the case of a horizontal type.

以下にこのインサート品成形装置を用いてインサート品1を溶融樹脂で樹脂封止するインサート品成形方法について図4〜図11を参照して説明する。尚、図4〜図11では説明を簡素化するため上型プラテン61、下型プラテン62、成形機ノズル63、及びエアシリンダ53を省略して図示してある。   Hereinafter, an insert product molding method in which the insert product 1 is sealed with a molten resin using the insert product molding apparatus will be described with reference to FIGS. 4 to 11. 4 to 11, the upper mold platen 61, the lower mold platen 62, the molding machine nozzle 63, and the air cylinder 53 are omitted in order to simplify the description.

先ず図4に示すように金型20が上側に持ち上がっている状態で、金型30のキャビティ41bにインサート品1を配置する。このとき、仮保持部材55,56は上昇しており、その先端がインサート品1の巻線3および高圧ヨーク9に接触するとともに、下型金型31に設けたコア保持部31cがフェライトコア2の低圧側端部に接触することで、インサート品1を仮保持する。なお仮保持部材55は軸部55aの下端に頭部55bが設けられたピンからなり、2枚のリターンプレート35a,35bの間に頭部55bを挟み込むことで、リターンプレート35a,35bに支持されている。リターンプレート35a,35bは下型受板32に設けた凹所32a内に上下動自在に配置され、ばね36,36によって上側に付勢されており、これによって仮保持部材55は上側に移動している。また仮保持部材56も軸部56aの下端に頭部56bが設けられたピンからなり、下型金型31に設けた凹所内に頭部56bを納めた状態で上下動自在に配置されており、ばね37のばね力によって上側に付勢されている。また、保持部材50はエアシリンダ53によってキャビティ部41から後退した位置に移動している。尚、図4では後述する下型リターンピン38と保持部材50とが重なって図示されているが、両者は干渉しているわけではなく、実際にはこの2つの部品は同一断面上には存在していない。   First, as shown in FIG. 4, the insert 1 is placed in the cavity 41 b of the mold 30 in a state where the mold 20 is lifted upward. At this time, the temporary holding members 55 and 56 are raised, and the tips thereof are in contact with the winding 3 and the high voltage yoke 9 of the insert 1, and the core holding portion 31 c provided in the lower mold 31 is the ferrite core 2. The insert product 1 is temporarily held in contact with the low-pressure side end portion. The temporary holding member 55 includes a pin having a head portion 55b provided at the lower end of the shaft portion 55a, and is supported by the return plates 35a and 35b by sandwiching the head portion 55b between the two return plates 35a and 35b. ing. The return plates 35a and 35b are disposed in a recess 32a provided in the lower mold receiving plate 32 so as to be movable up and down, and are biased upward by springs 36 and 36, whereby the temporary holding member 55 moves upward. ing. The temporary holding member 56 also includes a pin having a head portion 56b provided at the lower end of the shaft portion 56a. The temporary holding member 56 is disposed so as to be movable up and down with the head portion 56b placed in a recess provided in the lower mold 31. The spring 37 is biased upward by the spring force. The holding member 50 is moved to a position retracted from the cavity portion 41 by the air cylinder 53. In FIG. 4, a lower return pin 38 and a holding member 50, which will be described later, are shown in an overlapping manner. However, they do not interfere with each other, and actually these two parts exist on the same cross section. Not done.

次に図5に示すように成形機の型開閉装置(図示せず)によって上型金型21を下降させ、上型金型21と下型金型31とを閉じると、スライドコア34の傾斜面34aが上型金型21に設けた当接部21cに当たって、スライドコア34がキャビティ部41側へ前進し、フェライトコア2の低圧側の先端面と当接する。この時同時に、上型金型21および下型金型31にそれぞれ設けたコア保持部21d,31cが上下両側からフェライトコア2の周面を挟むように保持するので、フェライトコア2(すなわちインサート品1)の低圧側の端部が精度良く保持される。なおスライドコア34の前進、後退は保持部材50と同様にエアシリンダなどのアクチュエータを用いて行っても良い。   Next, as shown in FIG. 5, when the upper mold 21 is lowered by a mold opening / closing device (not shown) of the molding machine and the upper mold 21 and the lower mold 31 are closed, the slide core 34 is inclined. When the surface 34 a hits the contact portion 21 c provided on the upper mold 21, the slide core 34 advances to the cavity portion 41 side and contacts the tip surface of the ferrite core 2 on the low pressure side. At the same time, since the core holding portions 21d and 31c provided in the upper mold 21 and the lower mold 31 respectively hold the peripheral surface of the ferrite core 2 from both the upper and lower sides, the ferrite core 2 (that is, the insert product) The end on the low pressure side of 1) is held with high accuracy. The slide core 34 may be moved forward and backward using an actuator such as an air cylinder as in the holding member 50.

下型金型31に組み込まれた近接スイッチSWが上型金型21と下型金型31との型閉じを検知すると、近接スイッチSWの検出信号に応じて図示しない制御部がエアシリンダ53を駆動してロッド54を前進させるので、図6に示すようにロッド54の先端に連結された保持部材50がキャビティ部41内に前進して、フェライトコア2の高圧側端部に設けた係合凹部2aと係合し、インサート品1を完全に保持する。   When the proximity switch SW incorporated in the lower mold 31 detects that the upper mold 21 and the lower mold 31 are closed, a control unit (not shown) activates the air cylinder 53 according to the detection signal of the proximity switch SW. Since the rod 54 is driven to advance, the holding member 50 connected to the tip of the rod 54 advances into the cavity portion 41 as shown in FIG. 6 and is provided at the high-pressure side end portion of the ferrite core 2. Engage with the recess 2a to hold the insert 1 completely.

エアシリンダ53のロッド54が前進し、エアシリンダ53のリミットスイッチ(図示せず)が前進限を検知すると、成形機の型開閉装置によって再び型閉じが開始され、図7に示すように上型金型21にランナ板22が接触して、型閉じが完了する。この時、ランナ板22に取り付けられた上型リターンピン27が、仮保持部材55と同様にリターンプレート35a,35bに挟まれるように取り付けられた下型リターンピン38を押し下げるため、リターンプレート35a,35bがばね力に抗して下降し、これに応じて仮保持部材55も下降してキャビティ部41から後退するため、仮保持部材55による仮保持が終了する。なお、この時点では保持部材50がインサート品1の係合凹部2aと係合しているので、インサート品1の位置がずれることはない。   When the rod 54 of the air cylinder 53 moves forward and the limit switch (not shown) of the air cylinder 53 detects the forward limit, the mold closing is started again by the mold opening / closing device of the molding machine, and the upper mold as shown in FIG. The runner plate 22 comes into contact with the mold 21 to complete the mold closing. At this time, the upper die return pin 27 attached to the runner plate 22 pushes down the lower die return pin 38 attached so as to be sandwiched between the return plates 35a and 35b in the same manner as the temporary holding member 55. 35b descends against the spring force, and the temporary holding member 55 also descends and retracts from the cavity portion 41 accordingly, so that the temporary holding by the temporary holding member 55 ends. At this time, since the holding member 50 is engaged with the engagement recess 2a of the insert product 1, the position of the insert product 1 does not shift.

このように、保持部材50が前進してインサート品1を保持する前に、仮保持部材55によってインサート品1を仮保持し、保持部材50がインサート品1を保持してから溶融樹脂の重点が完了するまでの間に、仮保持部材55がキャビティ部41から後退しているので、保持部材40によって仮保持されたインサート品1を容易に保持させることができ、インサート品1の位置決め精度が更に向上する。また仮保持部材55は型締め動作によって駆動力が与えられてキャビティ部41から後退するので、別途駆動源を用意する必要もなく、また溶融樹脂の充填が完了するまでの間にキャビティ部41から後退させているので、仮保持部材55が抜けた空間に溶融樹脂が確実に入り込み、非融合部が残留することもない。   Thus, before the holding member 50 moves forward and holds the insert product 1, the insert product 1 is temporarily held by the temporary holding member 55, and the emphasis of the molten resin is applied after the holding member 50 holds the insert product 1. Until the completion, the temporary holding member 55 is retracted from the cavity portion 41, so that the insert product 1 temporarily held by the holding member 40 can be easily held, and the positioning accuracy of the insert product 1 is further increased. improves. Further, since the temporary holding member 55 is retracted from the cavity portion 41 by applying a driving force by the mold clamping operation, it is not necessary to prepare a separate driving source, and from the cavity portion 41 until the filling of the molten resin is completed. Since it is made to retreat, the molten resin surely enters the space from which the temporary holding member 55 is removed, and the non-fusion portion does not remain.

型締めが終わり、成形機の型締め力によって型締めが完了すると、図8に示すように成形機ノズル63から溶融した樹脂材料(溶融樹脂6)がスプルー24、ランナ25、ゲート26を通してキャビティ部41内に充填される。なお本実施形態で使用される溶融樹脂6は熱可塑性の溶融温度が低いポリプロピレン、ポリエチレン、溶融温度の高いポリフタルアミド、ポリエーテルイミド、液晶ポリエステル、シンジオタクチックポリスチレン、また熱硬化性のフェノール、エポキシ、不飽和ポリエステルなどの種々の樹脂材料を用いることができる。ここに、成形機の成形機ノズル63などから溶融樹脂を充填する手段が構成される。   When the clamping is completed and the clamping is completed by the clamping force of the molding machine, the resin material (molten resin 6) melted from the molding machine nozzle 63 passes through the sprue 24, the runner 25, and the gate 26 as shown in FIG. 41 is filled. Note that the molten resin 6 used in the present embodiment is polypropylene, polyethylene having a low thermoplastic melting temperature, polyphthalamide having a high melting temperature, polyetherimide, liquid crystal polyester, syndiotactic polystyrene, thermosetting phenol, Various resin materials such as epoxy and unsaturated polyester can be used. Here, a means for filling the molten resin is formed from the molding machine nozzle 63 of the molding machine.

この時、キャビティ部41内の樹脂圧力よりも、仮保持部材56を上側に付勢するばね37のばね力を小さく設定してあるので、樹脂圧力によって仮保持部材56が下降し、キャビティ部41から後退するため、仮保持部材56による仮保持が終了する。このように仮保持部材56は樹脂圧力によって後退するため、別途の駆動源を必要とすることなく、また保持部材50が保持する前に仮保持しておくことでインサート品1の位置決め精度を向上させることができる。   At this time, since the spring force of the spring 37 that biases the temporary holding member 56 upward is set smaller than the resin pressure in the cavity portion 41, the temporary holding member 56 is lowered by the resin pressure, and the cavity portion 41. Therefore, the temporary holding by the temporary holding member 56 ends. Since the temporary holding member 56 moves backward due to the resin pressure in this way, the positioning accuracy of the insert product 1 is improved without requiring a separate drive source and by temporarily holding it before the holding member 50 holds it. Can be made.

なお、ゲート26の出口は保持部材50のDカット部51に臨ませるように開口しているのであるが、保持部材50は上型金型21及び下型金型31の合わせ面上を進退自在に摺動可能に配置されているので、ゲート26の位置の設計自由度が高く、成形機ノズル63からゲート26に至る流路設計を最適化でき、保持部材50の周辺に流動性があまり低下していない溶融樹脂6を供給することが可能にある。またゲート26を摺動部以外に設け、多点ゲートとしても良いことは言うまでもない。   Although the outlet of the gate 26 is opened so as to face the D-cut portion 51 of the holding member 50, the holding member 50 can freely advance and retreat on the mating surface of the upper mold 21 and the lower mold 31. Therefore, the design of the flow path from the molding machine nozzle 63 to the gate 26 can be optimized, and the fluidity in the periphery of the holding member 50 is greatly reduced. It is possible to supply the molten resin 6 which has not been performed. Needless to say, the gate 26 may be provided in addition to the sliding portion to form a multipoint gate.

その後、キャビティ部41への溶融樹脂6の充填完了前あるいは充填完了後であって、溶融樹脂6がインサート品1の周囲の少なくとも一部を外包する所定のタイミングを検知して、制御部がエアシリンダ53を駆動し、ロッド54を後退させると、保持部材50がキャビティ部41から後退する。ここに、エアシリンダ53から保持部材を後退させる手段が構成されるが、エアシリンダ以外の油圧シリンダやモータなどのアクチュエータを用いても良いことは言うまでもない。   After that, before completion of filling the molten resin 6 into the cavity part 41 or after completion of filling, the control unit detects the predetermined timing when the molten resin 6 encloses at least a part of the periphery of the insert product 1 and the control unit When the cylinder 53 is driven and the rod 54 is retracted, the holding member 50 is retracted from the cavity portion 41. Here, means for retracting the holding member from the air cylinder 53 is configured, but it goes without saying that an actuator such as a hydraulic cylinder or a motor other than the air cylinder may be used.

このように溶融樹脂6の充填を行えば、ゲート26の近傍、すなわち保持部材50の近傍は成形機から常に溶融樹脂6が供給されるため、キャビティ部41内の他の部位と比べると固化あるいは硬化が遅れることになる。したがって、保持部材50を後退させる際に他の部位に充填された溶融樹脂6の固化が進んでいることによってインサート品1が確実に位置決めされ、また保持部材50が後退した後にできる空間には溶融樹脂6が流入して、この空間を確実に埋めることができるから、未融合部の残留を抑制して、インサート品1を十分に封止した良好な樹脂成型品を得ることができる。ここに、上述した所定のタイミングとしては、スクリュー式の成形機のスクリューの位置検出のタイミング、成形機の射出圧または型の内圧が所定の値になった時点、あるいは射出開始から所定時間が経過した時点、あるいはこれらを組み合わせたタイミングを用いることが可能である。なお保持部材50を溶融樹脂の充填完了後に後退させてもよく、インサート品1の位置決め精度が更に向上する。   If the molten resin 6 is filled in this way, the molten resin 6 is always supplied from the molding machine in the vicinity of the gate 26, that is, in the vicinity of the holding member 50. Curing will be delayed. Accordingly, when the holding member 50 is moved backward, the insert product 1 is reliably positioned by the solidification of the molten resin 6 filled in other parts, and the space formed after the holding member 50 moves backward is melted. Since the resin 6 flows in and this space can be reliably filled, it is possible to obtain a good resin molded product in which the insert product 1 is sufficiently sealed while suppressing the unfused portion from remaining. Here, as the predetermined timing described above, the timing of detecting the position of the screw of the screw type molding machine, the time when the injection pressure of the molding machine or the internal pressure of the mold reaches a predetermined value, or a predetermined time has elapsed since the start of injection. It is possible to use a point in time or a combination of these. Note that the holding member 50 may be retracted after the filling of the molten resin, and the positioning accuracy of the insert 1 is further improved.

また本実施形態ではキャビティ部41内の流動末端付近において金型21,31に隆起部21e,31dを形成してあり、この部分の樹脂部に保持部材50の周辺領域に比べて肉厚の薄い薄肉部7aを設けることで、溶融樹脂6の固化または硬化が薄肉部7a(この薄肉部7aが硬化促進領域となる)だけ促進される一方、保持部材50の周辺領域に充填される溶融樹脂6はまだ溶融状態なので、保持部材50を後退させるタイミングをより遅らせることができ、インサート品1の位置ずれを防止しつつ、未融合部の残留を防止できる。なお薄肉部7a(硬化促進領域)の厚みとしては約0.5mm〜1.0mm、薄肉部7a以外の樹脂部の肉厚は約2.0〜4.0mmであるが、必ずしもこの範囲に限定されるものではない。また本実施形態では金型21,31に隆起部21e,31dを形成してあるが、インサート品1側に隆起部を設けることで、薄肉部を形成した場合でも上述と同様の効果が得られる。   Further, in this embodiment, raised portions 21e and 31d are formed in the molds 21 and 31 near the flow end in the cavity portion 41, and the thickness of the resin portion in this portion is smaller than that in the peripheral region of the holding member 50. By providing the thin portion 7a, solidification or curing of the molten resin 6 is promoted only by the thin portion 7a (this thin portion 7a becomes a hardening promoting region), while the molten resin 6 filled in the peripheral region of the holding member 50 is provided. Since it is still in a molten state, the timing for retracting the holding member 50 can be further delayed, and the misalignment of the insert product 1 can be prevented while the unfused portion remains. The thickness of the thin portion 7a (curing acceleration region) is about 0.5 mm to 1.0 mm, and the thickness of the resin portion other than the thin portion 7a is about 2.0 to 4.0 mm, but is not necessarily limited to this range. Is not to be done. In the present embodiment, the raised portions 21e and 31d are formed on the molds 21 and 31, but by providing the raised portions on the insert product 1 side, the same effect as described above can be obtained even when a thin portion is formed. .

その後、成形機のタイマー設定によって、キャビティ部41内に充填された溶融樹脂6が充分に固化あるいは硬化する時間が経過すると、図10に示すように成形機の型開閉装置によって金型20が上昇させられ、2つの金型20,30が開く。この時、上型金型21の当接部21cによってスライドコア34が前方に押圧されなくなるので、図示しないスライドコア後退用のばねによってスライドコア34が後退し、フェライトコア2の端面から離れる。また、保持部材50はエアシリンダ53によって後退させられるのであるが、保持部材50の先端部には、フェライトコア2に設けたすり鉢状の係合凹部2aと密着するように円錐形状の突起が設けられており、成型品(高圧回路ブロック7)を上側に離型する際に保持部材50と干渉するアンダカット7bが形成されてしまうので、成型品のアンダカット7bに引っ掛からないよう保持部材50をさらに後退させている。   Thereafter, when the time required for the molten resin 6 filled in the cavity portion 41 to sufficiently solidify or harden has elapsed by setting the timer of the molding machine, the mold 20 is raised by the mold opening / closing device of the molding machine as shown in FIG. The two molds 20 and 30 are opened. At this time, the slide core 34 is not pressed forward by the contact portion 21 c of the upper mold 21, so that the slide core 34 is retracted by a spring for retracting the slide core (not shown) and separated from the end face of the ferrite core 2. Further, the holding member 50 is retracted by the air cylinder 53, but a conical protrusion is provided at the tip of the holding member 50 so as to be in close contact with the mortar-shaped engaging recess 2 a provided on the ferrite core 2. Since the undercut 7b that interferes with the holding member 50 is formed when the molded product (the high-voltage circuit block 7) is released upward, the holding member 50 is prevented from being caught by the undercut 7b of the molded product. It is further retracted.

そして、保持部材50の後退が完了すると、図11に示すように成形機の突き出し装置(図示せず)が駆動され、金型30内のエジェクタピン(図示せず)によって成型品(高圧回路ブロック7)を下型金型31から突き出し、取り出すことができる。   When the retracting of the holding member 50 is completed, the extrusion device (not shown) of the molding machine is driven as shown in FIG. 11, and the molded product (high voltage circuit block) is ejected by the ejector pins (not shown) in the mold 30. 7) can be protruded from the lower mold 31 and taken out.

なお、上述のインサート品成形方法では上型金型21と下型金型31とが合わさってから保持部材50を前進させて、インサート品1を保持しているが、インサート品1の形状や寸法精度によっては、図16(a)〜(c)に示すように金型を閉じる前に保持部材50を前進させて、保持部材50の先端をフェライトコア2の係合凹部2aと係合させた後に、型締めを行うようにしても良い。   In the above-described insert product molding method, the holding member 50 is moved forward after the upper mold 21 and the lower mold 31 are combined, and the insert product 1 is held. Depending on the accuracy, as shown in FIGS. 16A to 16C, the holding member 50 is advanced before the mold is closed, and the tip of the holding member 50 is engaged with the engaging recess 2 a of the ferrite core 2. Later, mold clamping may be performed.

以上説明したように本実施形態のインサート品成形方法では、複数(本実施形態では2つ)の金型20,30を合わせて形成されるキャビティ部41に対して進退自在に配置される保持部材50によりインサート品1をキャビティ部41内に保持する工程と、保持部材50でインサート品1を保持した状態で溶融樹脂6をキャビティ部41内に充填する工程と、インサート品1の少なくとも一部を溶融樹脂6が外包したタイミングで保持部材50をキャビティ部41から後退させる工程と、保持部材50がキャビティ部から後退した後にできた空間に溶融樹脂6を充填する工程とを有するインサート品成形方法において、
金型21,31において保持部材50が摺動する摺動部位(摺動用溝21b,31bからなる)の一部に設けたゲート26からキャビティ41内に溶融樹脂6を充填することで、保持部材50の近傍の溶融樹脂6の固化または硬化を遅らせて、保持部材50が後退した後にできる空間に溶融樹脂6を確実に流入させて未融合部の発生を抑制しているのであるが、保持部材50の摺動部位にゲート26を設けたことによる効果を検証するために、流動解析を用いて溶融樹脂6の充填完了時における保持部材50近傍の溶融樹脂6の固化率を計算により求めた。図12(a)〜(e)の矢印G1〜G4は溶融樹脂6の固化率を求める際のゲート位置の条件を示しており、同図(a)〜(c)に示すように保持部材50の摺動部位にゲートG1を設けた場合は、充填完了時における保持部材50近傍(図中のF部)の溶融樹脂6の固化率が約50%であるのに対して、同図(d)(e)に示すように保持部材50の摺動部位以外にゲートG2〜G4を設けた場合は、保持部材50に近い側にゲートG4を設けた場合であっても固化率が70%と高くなっており、保持部材50の摺動部位にゲートを設けることが保持部材50近傍の溶融樹脂の固化率を低下させる(すなわち固化を遅らせる)のに有効であることが判る。
As described above, in the insert product molding method of the present embodiment, the holding member is disposed so as to be movable forward and backward with respect to the cavity portion 41 formed by combining a plurality of (two in the present embodiment) molds 20 and 30. A step of holding the insert product 1 in the cavity portion 41 by 50, a step of filling the cavity portion 41 with the molten resin 6 in a state where the insert product 1 is held by the holding member 50, and at least a part of the insert product 1 In an insert product molding method including a step of retracting the holding member 50 from the cavity portion 41 at a timing when the molten resin 6 is enclosed, and a step of filling the space formed after the holding member 50 has retracted from the cavity portion with the molten resin 6. ,
The molten resin 6 is filled into the cavity 41 from the gate 26 provided at a part of the sliding portion (consisting of the sliding grooves 21b and 31b) in which the holding member 50 slides in the molds 21 and 31, thereby holding the holding member. Although the solidification or hardening of the molten resin 6 near 50 is delayed, the molten resin 6 is surely flowed into the space formed after the holding member 50 is retracted to suppress the occurrence of an unfused portion. In order to verify the effect of providing the gate 26 at the 50 sliding portions, the solidification rate of the molten resin 6 in the vicinity of the holding member 50 at the completion of the filling of the molten resin 6 was obtained by calculation using flow analysis. Arrows G1 to G4 in FIGS. 12 (a) to 12 (e) indicate gate position conditions for determining the solidification rate of the molten resin 6, and as shown in FIGS. 12 (a) to (c), the holding member 50 is provided. When the gate G1 is provided at the sliding portion, the solidification rate of the molten resin 6 in the vicinity of the holding member 50 (F portion in the drawing) at the completion of filling is about 50%, whereas FIG. ) When the gates G2 to G4 are provided in addition to the sliding portion of the holding member 50 as shown in (e), the solidification rate is 70% even when the gate G4 is provided on the side close to the holding member 50. It can be seen that providing a gate at the sliding portion of the holding member 50 is effective in reducing the solidification rate of the molten resin in the vicinity of the holding member 50 (that is, delaying solidification).

また、保持部材50の摺動部位にゲートを設けることの有意性をさらに別のデータで検証した。図13(a)に示すように保持部材50の摺動部位にゲートG1を設けた場合と、同図(b)に示すように保持部材50に近い成形品7の部位と対向する金型の部位にゲートG4を設けた場合とで、保持部材50の近傍における溶融樹脂6(例えばポリフタルアミド)の樹脂温度の充填開始時からの経時変化を求めた結果を図14に示す。図中のイはゲートG1を設けた場合の経時変化を、ロはゲートG4を設けた場合の経時変化を夫々示し、充填開始から樹脂温度が310℃(溶融樹脂6が流動しなくなる温度)に降下するまでの時間がゲートG4の場合は約3秒であるのに対して、ゲートG1の場合は約12秒となっており、保持部材50の摺動部位にゲートG1を設けることによって、保持部材50近傍の溶融樹脂6の樹脂温度が降下する時間を遅らせることができ、保持部材50を後退させるタイミングを遅らせることが可能になる。   Further, the significance of providing a gate at the sliding portion of the holding member 50 was verified with further data. When the gate G1 is provided at the sliding portion of the holding member 50 as shown in FIG. 13 (a) and when the mold faces the portion of the molded product 7 close to the holding member 50 as shown in FIG. 13 (b). FIG. 14 shows the results of determining the change with time from the start of filling of the resin temperature of the molten resin 6 (for example, polyphthalamide) in the vicinity of the holding member 50 when the gate G4 is provided at the site. In the figure, “A” indicates the change with time when the gate G1 is provided, and “B” indicates the change with time when the gate G4 is provided. The resin temperature is 310 ° C. (the temperature at which the molten resin 6 does not flow) from the start of filling. The time to descend is about 3 seconds in the case of the gate G4, whereas it is about 12 seconds in the case of the gate G1, and the holding is achieved by providing the gate G1 at the sliding portion of the holding member 50. The time during which the resin temperature of the molten resin 6 in the vicinity of the member 50 falls can be delayed, and the timing for retracting the holding member 50 can be delayed.

さらに詳細に検証すると、図13(a)に示すように保持部材50の摺動部位にゲートG1を設けた場合において、成形品の各部分(保持部材50の近傍(図8中のP1)、薄肉部(図8中のP3)、流動末端(図8中のP2))における溶融樹脂6(例えばポリフタルアミド)の樹脂温度の充填開始時からの経時変化を求めた結果を図15に示しており、図中のaは保持部材の近傍(P1)における温度変化、bは薄肉部(P3)における温度変化、cは流動末端(P2)における温度変化である。図15の計算結果より、厚み方向の平均樹脂温度が310℃(溶融樹脂6が流動しなくなる温度)に降下するまでの時間は流動末端では約1秒であるのに対して、保持部材50の近傍では約12秒と遅らせることができた。また薄肉部7aの樹脂温度が310℃に降下してから保持部材50の近傍の樹脂温度が310℃に降下するまでに約4秒あり、この間に保持部材50を後退させるタイミングを設定することが可能である。   In more detailed verification, when the gate G1 is provided at the sliding portion of the holding member 50 as shown in FIG. 13A, each part of the molded product (near the holding member 50 (P1 in FIG. 8)), FIG. 15 shows the results obtained by determining the change over time of the resin temperature of the molten resin 6 (for example, polyphthalamide) at the thin wall portion (P3 in FIG. 8) and the flow end (P2 in FIG. 8) from the start of filling. In the figure, a is a temperature change in the vicinity (P1) of the holding member, b is a temperature change in the thin portion (P3), and c is a temperature change in the flow end (P2). From the calculation result of FIG. 15, the time until the average resin temperature in the thickness direction falls to 310 ° C. (the temperature at which the molten resin 6 does not flow) is about 1 second at the flow end, whereas the holding member 50 In the vicinity, the delay was about 12 seconds. Further, it takes about 4 seconds from the time when the resin temperature of the thin portion 7a is lowered to 310 ° C. until the temperature of the resin in the vicinity of the holding member 50 is lowered to 310 ° C. The timing for retracting the holding member 50 can be set during this time. Is possible.

ところで、上述のインサート品1は巻線構造体であり、上述のインサート品成形方法を用いることで巻線構造体の位置ずれを抑制することができ、この巻線構造体を封止する封止樹脂の肉厚が極端に薄くなる部分ができないため、所望の絶縁破壊強度を得ることができ、絶縁性を高めた電磁装置を提供することができる。また上述のインサート品1は、メタルハライドランプのような放電灯を始動するために放電灯に高圧パルスを印加する放電灯始動装置Aに用いられるものであり、この放電灯始動装置Aを用いた放電灯点灯装置の回路図を図19に示す。放電灯始動装置Aは、上述の高圧回路ブロック7の低圧側端の外周に一次巻線8を巻回して構成され、二次巻線3の一端が放電灯Laの一方の電極に接続されるパルストランスPTと、パルストランスPTの一次巻線8に直列に接続された放電ギャップSGと、一次巻線8および放電ギャップSGからなる直列回路の両端間に接続されたパルス発生用のコンデンサC1と、二次巻線3の他端と放電灯Laの他方の電極との間に接続されてパルス発生時のバイパスループを形成するバイパスコンデンサC2とを備えている。そして、インバータ回路INVによりコンデンサC1が充電され、コンデンサC1の両端電圧が所定の電圧に達すると、放電ギャップSGが放電してパルストランスPTの一次巻線8に電流が流れる。このときパルストランスPTの二次巻線3に高圧パルスが発生し、この高圧パルスが放電灯Laに印加されて、放電灯Laを始動させるとともに、インバータ回路INVからの電力供給を受けて放電灯Laが点灯するのである。   By the way, the above-mentioned insert product 1 is a winding structure, and the position shift of the winding structure can be suppressed by using the above-described insert product molding method. Since there is no portion where the thickness of the resin becomes extremely thin, a desired dielectric breakdown strength can be obtained, and an electromagnetic device with improved insulation can be provided. The insert 1 described above is used in a discharge lamp starting device A that applies a high-pressure pulse to a discharge lamp in order to start a discharge lamp such as a metal halide lamp, and a discharge lamp using the discharge lamp starting device A is used. A circuit diagram of the lamp lighting device is shown in FIG. The discharge lamp starting device A is configured by winding a primary winding 8 around the outer periphery of the low-pressure side end of the high-voltage circuit block 7 described above, and one end of the secondary winding 3 is connected to one electrode of the discharge lamp La. A pulse transformer PT, a discharge gap SG connected in series to the primary winding 8 of the pulse transformer PT, and a capacitor C1 for generating a pulse connected between both ends of a series circuit composed of the primary winding 8 and the discharge gap SG And a bypass capacitor C2 connected between the other end of the secondary winding 3 and the other electrode of the discharge lamp La to form a bypass loop when a pulse is generated. When the capacitor C1 is charged by the inverter circuit INV and the voltage across the capacitor C1 reaches a predetermined voltage, the discharge gap SG is discharged and a current flows through the primary winding 8 of the pulse transformer PT. At this time, a high-pressure pulse is generated in the secondary winding 3 of the pulse transformer PT, and this high-pressure pulse is applied to the discharge lamp La to start the discharge lamp La and receive power supply from the inverter circuit INV to receive the discharge lamp. La lights up.

また図18は放電灯始動装置Aの各製造工程を示しており、同図(a)に示すようにプリント配線板或いはリードフレームからなる基板11にコンデンサC1,C2、放電ギャップSG、およびインバータ回路INVとの接続コネクタCNを実装して低圧回路ブロック12を構成するとともに、高圧回路ブロック7の低圧側端部の外周面(すなわちフェライトコア2の低圧側端部を覆う封止樹脂の表面)に一次巻線8を巻回してパルストランスPTを構成し、さらに高圧回路ブロック7に一体に設けたソケット口13に放電灯Laの中心電極および外周電極にそれぞれ電気的に接続させるための内側電極14および外側電極15を保持させる。そして、同図(b)に示すように低圧回路ブロック12の基板11に高圧回路ブロック7を実装した後、絶縁性を確保するために合成樹脂成型品よりなる上面カバー16および下面カバー17を装着して、両カバー16,17で囲まれる空間内にシリコンなどの絶縁樹脂を一部或いは全体に充填し、さらにノイズ抑制のために上下両側から上面シールドカバー18および下面シールドカバー19を被せて、放電灯始動装置Aの組立を完了する(同図(c)参照)。放電灯始動装置Aは上述のように構成されており、上述した絶縁性能の高いインサート品1を用いることで、放電灯Laの始動時に高電圧が印加されたとしても、絶縁破壊が発生せず、不点灯が発生することはないので、安定した点灯状態を得ることができる。なお上面カバー16および上面シールドカバー18にはソケット口13を露出させる丸孔状の開口窓16a,18aが形成されており、この開口窓16a,18aを通して放電灯Laの口金を装着できるようになっている。   FIG. 18 shows each manufacturing process of the discharge lamp starting device A. As shown in FIG. 18A, capacitors C1 and C2, a discharge gap SG, and an inverter circuit are formed on a substrate 11 made of a printed wiring board or a lead frame. The low-voltage circuit block 12 is configured by mounting the connector CN to the INV, and the outer peripheral surface of the low-voltage side end of the high-voltage circuit block 7 (that is, the surface of the sealing resin covering the low-voltage side end of the ferrite core 2). The primary winding 8 is wound to constitute the pulse transformer PT, and the inner electrode 14 is electrically connected to the socket electrode 13 provided integrally with the high voltage circuit block 7 to the center electrode and the outer peripheral electrode of the discharge lamp La, respectively. The outer electrode 15 is held. Then, after mounting the high-voltage circuit block 7 on the substrate 11 of the low-voltage circuit block 12 as shown in FIG. 4B, the upper surface cover 16 and the lower surface cover 17 made of a synthetic resin molded product are mounted to ensure insulation. Then, the space surrounded by the covers 16 and 17 is partially or entirely filled with an insulating resin such as silicon, and further covered with the upper shield cover 18 and the lower shield cover 19 from both the upper and lower sides to suppress noise, The assembly of the discharge lamp starting device A is completed (see (c) in the same figure). The discharge lamp starting device A is configured as described above. By using the above-described insert 1 having high insulation performance, even when a high voltage is applied at the time of starting the discharge lamp La, dielectric breakdown does not occur. Since no unlighting occurs, a stable lighting state can be obtained. The top cover 16 and the top shield cover 18 are formed with round hole-shaped opening windows 16a and 18a for exposing the socket opening 13, and the cap of the discharge lamp La can be mounted through the opening windows 16a and 18a. ing.

ところで、上述の放電灯始動装置Aは、メタルハライドランプのようなHIDランプからなる放電灯Laを始動するために放電灯Laに高圧パルスを印加するものであり、この放電灯始動装置Aを用いた放電灯点灯装置Bのブロック図を図19に示している。この放電灯点灯装置Bは、直流電源Eの直流電圧を矩形波電圧に変換して放電灯始動装置Aに装着された放電灯Laに供給するインバータINVと、放電灯始動装置Aが備える高圧パルス発生部(充電コンデンサC1、バイパスコンデンサC2、放電ギャップSG、パルストランスPTからなる)とで構成される。   By the way, the above-described discharge lamp starting device A applies a high-pressure pulse to the discharge lamp La in order to start a discharge lamp La composed of an HID lamp such as a metal halide lamp. This discharge lamp starting device A was used. A block diagram of the discharge lamp lighting device B is shown in FIG. The discharge lamp lighting device B includes an inverter INV that converts a DC voltage of a DC power source E into a rectangular wave voltage and supplies the rectangular wave voltage to a discharge lamp La mounted on the discharge lamp starting device A, and a high-pressure pulse included in the discharge lamp starting device A. The generator is composed of a charging capacitor C1, a bypass capacitor C2, a discharge gap SG, and a pulse transformer PT.

また図20は上記の放電灯点灯装置Bを用いた車両用前照灯器具Cの一実施形態を示し、この前照灯器具Cは、車体に固定される灯体ハウジング101の内部に上記の放電灯始動装置Aと反射板102を収納したものであり、灯体ハウジング101の前面に設けた開口部にはレンズ103が取り付けられている。また灯体ハウジング101の後部には放電灯Laを交換するための開口部104が設けられており、この開口部104にはキャップ105が開閉自在に被着されている。また灯体ハウジング101の下側部には直流電源Eから電源供給を受けて動作するインバータ回路INVが取着されており、このインバータ回路INVからの電線106が放電灯始動装置AのコネクタCNに接続されている。なお図中の107は直流電源Eからの給電線を接続する接続コネクタである。この前照灯器具Cは上述の放電灯点灯装置Bを用いて構成されており、この前照灯器具Cを車両のヘッドランプに用いれば、信頼性の高いヘッドランプを実現できる。なお照明器具を前照灯器具Cに限定する趣旨のものではなく、上述の放電灯点灯装置Bを用いて、例えばプロジェクタの光源に用いる照明器具を構成しても良い。   FIG. 20 shows an embodiment of a vehicle headlamp fixture C using the above-described discharge lamp lighting device B. The headlamp fixture C is placed inside the lamp housing 101 fixed to the vehicle body. The discharge lamp starting device A and the reflecting plate 102 are accommodated, and a lens 103 is attached to an opening provided on the front surface of the lamp housing 101. An opening 104 for replacing the discharge lamp La is provided at the rear of the lamp housing 101, and a cap 105 is attached to the opening 104 so as to be freely opened and closed. Also, an inverter circuit INV that operates by receiving power supply from the DC power source E is attached to the lower portion of the lamp housing 101, and the electric wire 106 from the inverter circuit INV is connected to the connector CN of the discharge lamp starting device A. It is connected. Reference numeral 107 in the figure denotes a connection connector for connecting a power supply line from the DC power source E. The headlamp fixture C is configured using the above-described discharge lamp lighting device B. If the headlamp fixture C is used for a vehicle headlamp, a highly reliable headlamp can be realized. Note that the lighting fixture is not limited to the headlamp C, and the above-described discharge lamp lighting device B may be used to configure a lighting fixture used for a light source of a projector, for example.

また図21は上述の車両用前照灯器具Cを用いた車両Dの一実施形態を示し、車体110の前面の左右両側には車両用前照灯器具Cが1台ずつ取り付けられている。この車両Dは上述の車両用前照灯器具Cを用いたものであり、高い信頼性の前照灯器具Cを用いることで、夜間走行などで安全性の高い車両を実現することができる。   FIG. 21 shows an embodiment of a vehicle D using the above-described vehicle headlamp fixture C. One vehicle headlamp fixture C is attached to each of the left and right sides of the front surface of the vehicle body 110. The vehicle D uses the vehicle headlamp fixture C described above, and by using the highly reliable headlamp fixture C, a vehicle with high safety can be realized during night driving.

本実施形態のインサート品成形方法を用いたインサート品成形装置の一部省略せる断面図である。It is sectional drawing which can abbreviate | omit a part of insert product shaping | molding apparatus using the insert product shaping | molding method of this embodiment. 同上を用いて形成されるインサート品を模式的に示した断面図である。It is sectional drawing which showed typically the insert goods formed using the same as the above. 同上に用いる保持部材の外観斜視図である。It is an external appearance perspective view of the holding member used for the same as the above. 同上のインサート品成形方法の一工程を説明する断面図である。It is sectional drawing explaining 1 process of the insert goods shaping | molding method same as the above. 同上のインサート品成形方法の一工程を説明する断面図である。It is sectional drawing explaining 1 process of the insert goods shaping | molding method same as the above. 同上のインサート品成形方法の一工程を説明する断面図である。It is sectional drawing explaining 1 process of the insert goods shaping | molding method same as the above. 同上のインサート品成形方法の一工程を説明する断面図である。It is sectional drawing explaining 1 process of the insert goods shaping | molding method same as the above. 同上のインサート品成形方法の一工程を説明する断面図である。It is sectional drawing explaining 1 process of the insert goods shaping | molding method same as the above. 同上のインサート品成形方法の一工程を説明する断面図である。It is sectional drawing explaining 1 process of the insert goods shaping | molding method same as the above. 同上のインサート品成形方法の一工程を説明する断面図である。It is sectional drawing explaining 1 process of the insert goods shaping | molding method same as the above. 同上のインサート品成形方法の一工程を説明する断面図である。It is sectional drawing explaining 1 process of the insert goods shaping | molding method same as the above. (a)〜(e)はゲートの位置を説明する説明図である。(A)-(e) is explanatory drawing explaining the position of a gate. (a)(b)はゲートの位置を説明する説明図である。(A) (b) is explanatory drawing explaining the position of a gate. 保持部材の近傍における溶融樹脂の樹脂温度の時間推移を示した図である。It is the figure which showed the time transition of the resin temperature of the molten resin in the vicinity of a holding member. 成形品の各部における溶融樹脂の樹脂温度の時間推移を示した図である。It is the figure which showed the time transition of the resin temperature of the molten resin in each part of a molded article. (a)〜(c)は同上の別のインサート品成形方法の説明図である。(A)-(c) is explanatory drawing of another insert goods shaping | molding method same as the above. 同上を用いて形成される高圧回路ブロックの各製造工程の説明図である。It is explanatory drawing of each manufacturing process of the high voltage circuit block formed using the same as the above. 同上の高圧回路ブロックを用いる放電灯始動装置の各製造工程の説明図である。It is explanatory drawing of each manufacturing process of the discharge lamp starter using a high voltage circuit block same as the above. 同上を用いた放電灯点灯装置のブロック回路図である。It is a block circuit diagram of the discharge lamp lighting device using the same. 同上を用いた車両用前照灯器具の断面図である。It is sectional drawing of the vehicle headlamp fixture using the same as the above. 同上を用いた車両の要部斜視図である。It is a principal part perspective view of the vehicle using the same as the above.

符号の説明Explanation of symbols

21 上型金型
21b,31b 摺動用溝
26 ゲート
31 下型金型
41 キャビティ部
50 保持部材
21 Upper mold 21b, 31b Sliding groove 26 Gate 31 Lower mold 41 Cavity 50 Holding member

Claims (8)

複数の金型と、前記複数の金型を合わせて形成されるキャビティと、前記金型に前記キャビティに連通して設けられた丸孔内に進退自在に配置され、前記キャビティ内に突出してインサート品を保持する丸棒状の保持部材とを備えるとともに、前記保持部材により前記インサート品を前記キャビティ内に保持した状態で前記キャビティ内に溶融樹脂を充填する手段と、前記インサート品の少なくとも一部を溶融樹脂が外包したタイミングで前記保持部材を前記キャビティから後退させる手段と、前記保持部材が前記キャビティから後退したことによってでき空間に溶融樹脂を充填する手段とを備え、
前記保持部材における前記キャビティ側の先端部に、片側の半円部をカットして断面半円形に形成されたDカット部が設けられ、当該Dカット部と前記丸孔とでできる空間に、溶融樹脂を充填するゲートが設けられたことを特徴とするインサート品成形装置。
A plurality of molds , a cavity formed by combining the plurality of molds , and a reciprocating arrangement in a round hole provided in the mold in communication with the cavity, and protruding into the cavity to be inserted together and a holding member of a round bar for holding goods, and means for filling the molten resin into the cavity while holding the insert article within said cavity by said holding member, at least a portion of said insert article and means for retracting the holding member from said cavity at the timing when the molten resin is outerwrap, and means for the retaining member is filled with the molten resin into the space that can by receding from the cavity,
At the tip of the holding member on the cavity side, a D-cut part formed by cutting a semicircular part on one side to have a semicircular cross section is provided, and melted in a space formed by the D-cut part and the round hole. An insert molding apparatus characterized in that a gate for filling resin is provided.
前記金型の表面に接触する溶融樹脂の表面部において、前記保持部材周辺の表面部よりも溶融樹脂の硬化が促進される硬化促進領域を設けたことを特徴とする請求項1記載のインサート品成形装置。The insert product according to claim 1, wherein a hardening acceleration region is provided in the surface portion of the molten resin that contacts the surface of the mold so as to accelerate the hardening of the molten resin more than the surface portion around the holding member. Molding equipment. 前記硬化促進領域における溶融樹脂の肉厚を、前記保持部材周辺の表面部における溶融樹脂の肉厚よりも薄くしたことを特徴とする請求項2記載のインサート品成形装置。The insert molding apparatus according to claim 2, wherein the thickness of the molten resin in the curing acceleration region is made thinner than the thickness of the molten resin in the surface portion around the holding member. 前記保持部材は、複数の金型の合わせ面において進退自在に配置されたことを特徴とする請求項1乃至3の何れか1つに記載のインサート品成形装置。The insert product forming apparatus according to any one of claims 1 to 3, wherein the holding member is disposed so as to freely advance and retract on a mating surface of a plurality of molds. フェライトコア、当該フェライトコアに巻回される巻線、及び前記巻線の両端に電気的に接続されるコイル端子を含む巻線構造体と、当該巻線構造体をインサート品とし、請求項1乃至4の何れか1つに記載のインサート品成形装置を用いて成形され、前記コイル端子の少なくとも一部を露出させた状態で前記巻線構造体を樹脂封止する封止樹脂部とを備えたことを特徴とする電磁装置。A winding structure including a ferrite core, a winding wound around the ferrite core, and a coil terminal electrically connected to both ends of the winding, and the winding structure as an insert product. And a sealing resin portion that is molded using the insert product molding device according to any one of claims 4 to 4 and that seals the winding structure with resin in a state where at least a part of the coil terminal is exposed. An electromagnetic device characterized by that. 請求項5記載の電磁装置を用いた放電灯点灯装置。A discharge lamp lighting device using the electromagnetic device according to claim 5. 請求項6記載の放電灯点灯装置を用いた照明器具。The lighting fixture using the discharge lamp lighting device of Claim 6. 請求項7記載の照明器具を用いた車両。A vehicle using the lighting apparatus according to claim 7.
JP2004156866A 2004-05-26 2004-05-26 Insert product molding device, electromagnetic device, discharge lamp lighting device, lighting fixture, and vehicle Expired - Fee Related JP4424070B2 (en)

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