JP4394464B2 - インクジェットプリントヘッド - Google Patents
インクジェットプリントヘッド Download PDFInfo
- Publication number
- JP4394464B2 JP4394464B2 JP2004008462A JP2004008462A JP4394464B2 JP 4394464 B2 JP4394464 B2 JP 4394464B2 JP 2004008462 A JP2004008462 A JP 2004008462A JP 2004008462 A JP2004008462 A JP 2004008462A JP 4394464 B2 JP4394464 B2 JP 4394464B2
- Authority
- JP
- Japan
- Prior art keywords
- ink
- heater
- bubble
- ink chamber
- print head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011241 protective layer Substances 0.000 claims description 44
- 239000010410 layer Substances 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 17
- 238000003825 pressing Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 13
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- RVSGESPTHDDNTH-UHFFFAOYSA-N alumane;tantalum Chemical compound [AlH3].[Ta] RVSGESPTHDDNTH-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241001272720 Medialuna californiensis Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- -1 for example Chemical compound 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/22—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
- B41J2/23—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material using print wires
- B41J2/235—Print head assemblies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14032—Structure of the pressure chamber
- B41J2/14056—Plural heating elements per ink chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14032—Structure of the pressure chamber
- B41J2/1404—Geometrical characteristics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/1412—Shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/1437—Back shooter
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
110 マニホールド
102 インクチャンバ
104 インクチャンネル
106 ノズル
108a 第1ヒーター
108b 第2ヒーター
112 第1保護層
114 第2保護層
116 第3保護層
120 熱発散層
150 ノズルプレート
B1 第1バブル
B2 第2バブル
Claims (8)
- 吐出されるインクが満たされるインクチャンバと、
前記インクチャンバにインクを供給するためのマニホールドと、
前記インクチャンバと前記マニホールドとを連結するインクチャンネルと、
前記インクチャンバからインクが吐出されるノズルと、
前記インクチャンバ内のインクを加熱してバブルを発生させる第1及び第2ヒーターと、
前記第1及び第2ヒーターと電気的に連結されて前記第1及び第2ヒーターに電流を印加する導線と、を具備し、
前記第1ヒーターと前記第2ヒーターとは前記ノズルを中心として互いに対称に配置されており、そのうちの一方は前記インクチャンネル側に配置され、
前記第1ヒーター及び前記第2ヒーターの加熱により、前記インクチャンバ内に供給されるインクに2つのバブルを生成し、
前記インクチャンネル側に配置された前記第1ヒーターの加熱により生成される第1バブルは、前記インクチャンネルのインクに圧力を加えて成長する一方、第2ヒーターの加熱により生成される第2バブルは、前記インクチャンバの側壁によって成長が制限されることにより、前記第1バブルは前記第2バブルよりもさらに膨らみ、
前記第1バブルは、前記インクチャンネルにあるインクによって引っ張られるために前記第2バブルより速く消滅することを特徴とするインクジェットプリントヘッド。 - 前記第1ヒーターと前記第2ヒーターとは同じ抵抗値を有するようにその材質及びサイズが互いに同じであることを特徴とする請求項1に記載のインクジェットプリントヘッド。
- 吐出されるインクが満たされるインクチャンバが表面側に形成され、前記インクチャンバにインクを供給するためのマニホールドが背面側に形成され、前記インクチャンバと前記マニホールドとを連結するインクチャンネルが表面に平行に形成された基板と、
前記基板上に積層されて前記インクチャンバの上部壁をなすものであって、前記インクチャンバの中央部と対応する位置にノズルが形成され、前記インクチャンバ内のインクを加熱してバブルを発生させる第1及び第2ヒーターと、前記第1及び第2ヒーターと電気的に連結されて前記第1及び第2ヒーターに電流を印加する導線が配置されたノズルプレートと、を具備し、
前記第1ヒーターと前記第2ヒーターとは前記ノズルを中心として互いに対称に配置されており、そのうち何れか1つは前記インクチャンネル側に配置され、
前記第1ヒーター及び前記第2ヒーターの加熱により、前記インクチャンバ内に供給されるインクに2つのバブルを生成し、
前記インクチャンネル側に配置された前記第1ヒーターの加熱により生成される第1バブルは、前記インクチャンネルのインクに圧力を加えて成長する一方、第2ヒーターの加熱により生成される第2バブルは、前記インクチャンバの側壁によって成長が制限されることにより、前記第1バブルは前記第2バブルよりもさらに膨らみ、
前記第1バブルは、前記インクチャンネルにあるインクによって引っ張られるために前記第2バブルより速く消滅することを特徴とするインクジェットプリントヘッド。 - 前記第1ヒーターと前記第2ヒーターとは同じ抵抗値を有するようにその材質及びサイズが互いに同じであることを特徴とする請求項3に記載のインクジェットプリントヘッド。
- 前記第1ヒーターと前記第2ヒーターとは電気的に並列に連結されることを特徴とする請求項3に記載のインクジェットプリントヘッド。
- 前記第1ヒーターと前記第2ヒーターとは電気的に直列に連結することを特徴とする請求項3に記載のインクジェットプリントヘッド。
- 前記ノズルプレートは前記基板上に順次積層された第1保護層、第2保護層及び第3保護層を含み、前記第1及び第2ヒーターは前記第1保護層と前記第2保護層間に備えられ、前記導線は前記第2保護層と前記第3保護層間に備えられることを特徴とする請求項3に記載のインクジェットプリントヘッド。
- 前記ノズルプレートは前記第3保護層上に積層されて前記第1及び第2ヒーターとその周辺の熱を外部に発散させる熱発散層をさらに含むことを特徴とする請求項7に記載のインクジェットプリントヘッド。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0002726A KR100519755B1 (ko) | 2003-01-15 | 2003-01-15 | 잉크젯 프린트헤드 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004216902A JP2004216902A (ja) | 2004-08-05 |
JP4394464B2 true JP4394464B2 (ja) | 2010-01-06 |
Family
ID=32677858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004008462A Expired - Fee Related JP4394464B2 (ja) | 2003-01-15 | 2004-01-15 | インクジェットプリントヘッド |
Country Status (4)
Country | Link |
---|---|
US (1) | US7101024B2 (ja) |
EP (1) | EP1447222B1 (ja) |
JP (1) | JP4394464B2 (ja) |
KR (1) | KR100519755B1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100560721B1 (ko) * | 2004-08-23 | 2006-03-13 | 삼성전자주식회사 | 금속 챔버층을 구비하는 잉크젯 헤드의 제조방법 및 그에의하여 제조된 잉크젯 헤드 |
US7832843B2 (en) * | 2006-08-28 | 2010-11-16 | Canon Kabushiki Kaisha | Liquid jet head |
JP5159069B2 (ja) * | 2006-08-29 | 2013-03-06 | キヤノン株式会社 | 液体吐出方法 |
TWI322085B (en) * | 2007-03-07 | 2010-03-21 | Nat Univ Tsing Hua | Micro-droplet injector apparatus having nozzle arrays without individual chambers and ejection method of droplets thereof |
US8328330B2 (en) * | 2008-06-03 | 2012-12-11 | Lexmark International, Inc. | Nozzle plate for improved post-bonding symmetry |
WO2019078868A1 (en) | 2017-10-19 | 2019-04-25 | Hewlett-Packard Development Company, L.P. | FLUIDIC MATRICES |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0124312A3 (en) | 1983-04-29 | 1985-08-28 | Hewlett-Packard Company | Resistor structures for thermal ink jet printers |
JPS60204374A (ja) * | 1984-03-30 | 1985-10-15 | Canon Inc | インクジエツト記録ヘツド |
EP0317171A3 (en) | 1987-11-13 | 1990-07-18 | Hewlett-Packard Company | Integral thin film injection system for thermal ink jet heads and methods of operation |
US6019457A (en) | 1991-01-30 | 2000-02-01 | Canon Information Systems Research Australia Pty Ltd. | Ink jet print device and print head or print apparatus using the same |
JPH05338178A (ja) | 1991-12-23 | 1993-12-21 | Canon Inf Syst Res Australia Pty Ltd | インクジェットプリントデバイス |
JP3592096B2 (ja) * | 1997-09-11 | 2004-11-24 | キヤノン株式会社 | インクジェット記録ヘッド及びインクジェット記録装置 |
US6280019B1 (en) | 1999-08-30 | 2001-08-28 | Hewlett-Packard Company | Segmented resistor inkjet drop generator with current crowding reduction |
KR100413677B1 (ko) | 2000-07-24 | 2003-12-31 | 삼성전자주식회사 | 버블 젯 방식의 잉크 젯 프린트 헤드 |
US6443564B1 (en) | 2000-11-13 | 2002-09-03 | Hewlett-Packard Company | Asymmetric fluidic techniques for ink-jet printheads |
KR100668295B1 (ko) | 2001-01-19 | 2007-01-12 | 삼성전자주식회사 | 반구형 잉크 챔버를 가진 잉크 젯 프린트 헤드 및 soi웨이퍼를 이용한 그 제조 방법 |
US6676246B1 (en) * | 2002-11-20 | 2004-01-13 | Lexmark International, Inc. | Heater construction for minimum pulse time |
-
2003
- 2003-01-15 KR KR10-2003-0002726A patent/KR100519755B1/ko active IP Right Grant
-
2004
- 2004-01-15 US US10/757,393 patent/US7101024B2/en not_active Expired - Lifetime
- 2004-01-15 EP EP04250172A patent/EP1447222B1/en not_active Expired - Lifetime
- 2004-01-15 JP JP2004008462A patent/JP4394464B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100519755B1 (ko) | 2005-10-07 |
EP1447222A1 (en) | 2004-08-18 |
US7101024B2 (en) | 2006-09-05 |
US20040145633A1 (en) | 2004-07-29 |
EP1447222B1 (en) | 2011-06-22 |
JP2004216902A (ja) | 2004-08-05 |
KR20040065104A (ko) | 2004-07-21 |
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