JP4384024B2 - heatsink - Google Patents

Description

  The present invention relates to a heat sink having a high heat dissipation effect in which protrusion from an attachment surface of an electronic component on a substrate is suppressed.

Many conventional electrical products have a horizontal substrate in use. In this case, the space in the height direction of the substrate (the mounting direction of the electronic component) is large. On the other hand, many recent electronic components generate a large amount of heat. A heat sink having a high heat dissipation capability is required for these electronic components that generate a large amount of heat. As described above, when there is a margin in the height direction of the substrate, a heat sink having a high height in the height direction of the substrate and having a high heat dissipation capability can be used.
JP 2000-12750 A

  In thin electrical products that have been increasing in recent years, for example, thin televisions using liquid crystal or plasma displays, the depth size is small, and it is difficult to arrange the substrate so that it is horizontal when the electrical product is in use. For this reason, the board | substrate is arrange | positioned along the back surface of the said electric product. In this case, the substrate is in an upright state when the electric product is used.

  The depth direction of the electrical product is the mounting direction of the electronic component on the board. However, as described above, the electric product has no allowance in the depth direction, and the amount by which the component can be protruded from the component mounting surface of the board (component mounting space) is limited and small. For this reason, especially in the case of an electronic component having a large calorific value as described above, there has been a problem that the heat sink cannot be easily attached.

The heat sink of the present invention for solving the above problems is a heat sink that is attached together with the electrical component 4 to the substrate 7 that is mounted so as to stand up when the electrical product is used, and the heat sink attaches the electronic component 4 . The mounting part 1 and a leg 3 for attaching the heat sink to the substrate 7 in a state where a space is formed between the front surface 7a of the substrate 7 and the back surface 1b of the mounting part 1 are provided, and the electronic component 4 is mounted on the back surface 1b of the mounting part 1. A first feature is that the mounting surface is formed, and the space is a heat radiation space 8 having a size capable of allowing air to flow in the upward direction and positioning the electronic component 4 attached to the back surface 1b . .

Secondly , a fin 2 is provided on the back surface 1b side of the mounting portion 1 to perform heat radiation and guide the upward discharge of air, the leg 3 is provided at the tip of the fin 2, and a number of notches 11 are provided in the fin 2. It is characterized by.

  According to the structure of the present invention configured as described above, the heat of the electronic component attached to the heat sink flows smoothly in the upward direction by the heat dissipation space formed between the front surface of the substrate and the back surface of the mounting portion. In addition, the electronic components are efficiently cooled. As a result, the mounting part can be arranged close to the surface of the board, and there is no need to project fins or the like from the surface of the mounting part to the front side (on the opposite side of the board). There is an effect that can be attached small.

  In particular, by providing fins on the back side of the mounting part to conduct heat dissipation and guide the upward release of air, in addition to the heat dissipation area increased by the fins, the heat dissipation space becomes a space surrounded by the fins, the board and the mounting part. Heat (air) rises and discharges smoothly and efficiently, improving the heat dissipation efficiency of the heat sink.

  By providing a leg at the tip of the fin, the leg can be easily provided and the heat sink can be easily attached. Further, by providing a large number of notches in the fin, the heat dissipation efficiency of the heat sink can be further improved by the heat dissipation area increased by the notches and the air flow through the notches or holes.

  1A and 1B are a plan perspective view and a bottom perspective view of a heat sink of the present invention. The heat sink H is made of a material having high thermal conductivity such as aluminum. In the present embodiment, a plating layer formed by sequentially plating zinc, nickel, and tin is provided on the surface of a member made of aluminum, and is formed by an aluminum alloy plate (aluminum plate) having conductivity. The surface of the plating layer may be coated with a urethane resin to prevent corrosion.

  The heat sink H has a shape having a gate-like cross section including a mounting portion 1 for a flat plate-like electronic component and plate-like fin portions 2 protruding in the same direction from the left and right sides of the mounting portion. Yes. A leg 3 for mounting the heat sink H projects from the end of the fin portion 2 in the same direction as the fin portion 2. A surface (surface) 1a opposite to the protruding side of the fin portion 2 in the mounting portion 1 is a mounting surface for the electronic component.

  The mounting portion 1 is provided with a threaded portion with a tapped stand on a burring portion 1c that protrudes from a protruding side surface (back surface) 1b of the fin portion 2. As shown in FIG. 2, the electronic component 4 is in close contact with the surface 1 a and is attached to the screw portion via a bolt 6. The heat sink H is attached to the substrate 7 by inserting the legs 3 into the substrate 7 and performing soldering or the like. Since the aluminum plate has high solder wettability, the heat sink H can be easily soldered.

  When the heat sink H is attached to the substrate 7 as described above, the heat radiation path 8 formed of a cylindrical space is formed by the back surface 1b of the heat sink H, the fin portion 2, and the component mounting surface (front surface) 7a of the substrate 7. The electronic component 4 is located outside the heat dissipation path 8. The heat radiation path 8 is substantially parallel to the substrate 7. Heat generated by energizing the electronic component is released to the heat dissipation path 8.

  The substrate 7 is a vertical type that stands in an upright state in use of an electrical product on which the substrate 7 is mounted. For example, it is a substrate for a flat-screen television. As shown in FIG. 3, the heat radiation path 8 is in the vertical direction along the substrate 7 when the electric product is used (the substrate 7 is standing). For this reason, the heat of the electronic component flows up smoothly from the lower side to the upper side of the heat radiation path 8.

  As described above, in the heat sink H, the cooling efficiency is improved by allowing air to smoothly flow through the heat radiation path 8, and the mounted electronic component 4 is efficiently cooled. Thereby, the protrusion length of the fin part 2 from the mounting part 1 can be shortened, and the mounting part 1 can be arranged at a position relatively close to the component mounting surface 7 a of the substrate 7.

  As described above, the electronic component 4 that requires the heat sink H can be compactly mounted together with the heat sink H while suppressing the protrusion of the substrate 7 from the component mounting surface 7a. For example, even when the display unit is arranged along the component mounting surface 7a of the substrate 7 and the mounting space for the component is a small space, the electrical component 4 can be easily mounted. In addition, since the above-mentioned aluminum plate used as the material of this heat sink H has a high heat dissipation characteristic, the heat sink H can be made more compact.

  As shown in FIG. 4A, another electronic component 9 or the like can be arranged in the heat dissipation path 8. Thereby, the space on the component mounting surface 7a of the board 7 can be effectively used. As shown in FIG. 4B, burring is performed from the back surface 1b of the mounting portion 1 toward the front surface 1a, the burring portion 1c is formed on the front surface 1a side, and the back surface 1b of the mounting portion 1 is mounted on the electronic component 4. It can also be a surface.

  In this case, the electronic component is located in the heat dissipation path 8. Thereby, the electronic component 4 provided with the heat sink H can be attached while further suppressing the protruding amount of the substrate 7 from the component mounting surface 7a. In the case where the electronic components 4 and 9 are provided in the heat radiation path 8, it is necessary that the parts have a size that does not hinder the flow of hot air in the heat radiation path 8.

  As shown in FIGS. 5A and 5B, holes 11 and grooves 12 for improving the heat radiation efficiency may be provided in the fin portion 2. In this case, in addition to the heat passing up and down the heat dissipation path 8, the surface area of the heat sink H is increased by the cooling holes 11 and grooves 12, and the air is circulated by the holes 11 and grooves 12, The cooling efficiency of the heat sink H is improved. As a result, the heat sink H can be made more compact.

  The legs of the heat sink H may be provided in any way as long as the legs protrude in the direction toward the substrate 7 and do not hinder ventilation of the heat radiation path 8. For example, as shown in FIG. 6, the leg 13 having a width that does not hinder ventilation of the heat radiation path 8 can be protruded from the edge portion of the mounting portion 1 where the fin portion 2 is not provided.

  In addition, since this heat sink H is formed with the metal material which has electroconductivity, it can be used as a terminal, an antenna, etc. For example, the surface of the heat sink H can be used as a ground terminal by soldering the legs 3 and 13 to the ground line and disposing the electronic component 4 in the heat radiation path 8. As a result, the number of parts can be reduced and wiring can be easily performed.

  On the other hand, as shown in FIGS. 7A, 7 </ b> B, and 7 </ b> C, an electronic component 14 is attached to the substrate 7, a heat radiation sheet 16 is attached to the electronic component 14, and block-shaped heat radiation is applied to the heat radiation sheet 16. It is also possible to attach the block 17, bring the back surface 1 b of the mounting portion 1 into close contact with the heat radiating block 17, and attach the heat sink H to the substrate 7 with the legs 3, so .

  In this case, it is necessary to provide a space S between at least one fin portion 2 of the heat sink H and the electronic component 14, the heat radiating sheet 16, and the heat radiating block 17, and to form a heat radiating path by the space S. Note that the end of the fin portion 2 is not necessarily in contact with the component mounting surface 7 a of the substrate 7.

  In the above case, the heat generated from the electronic component 14 is conducted to the heat sink H via the heat dissipation block 17 and is radiated by the heat sink H. For this reason, even when a large load is suddenly applied to the electronic component 14 and the amount of heat generated suddenly increases, the heat generated from the electronic component 14 temporarily accumulates (stores heat) in the heat dissipation block 17 and is transmitted from the heat dissipation block 17 to the heat sink H. Since the heat is dissipated, it is possible to prevent an inconvenience such as destruction of the electronic component 14 due to the rapid heat generation and the heat.

  Since the heat of the heat sink H is conducted to the shield case 18 at this time, the electronic component 14 is efficiently cooled and has a high cooling effect. In addition, the cooling is performed in the same manner as described above by the heat radiation path (space S). The cooling effect of the electronic component 14 is further improved. Thereby, the heat dissipation block 17 can be made compact and the protrusion from the substrate 7 can be made small, and the electronic component 14 can be compactly disposed between the substrate 7 and the shield case 18 together with the heat sink H as described above.

  As shown in FIG. 8, the protrusion 19 is provided above the heat dissipation block 17, the hole 20 corresponding to the protrusion 19 is provided in the mounting portion 1, the protrusion 19 is inserted into the hole 20, and the protrusion 19 is caulked. Thus, the heat sink H and the heat radiating block 17 can be integrally adhered and fixed. Thereby, the heat conduction efficiency from the heat dissipation block 17 to the heat sink H is improved. Further, the heat dissipation block 17 and the shield case 18 can be fixed by fastening the heat sink H together with screws or the like.

  In addition, the heat dissipation block 17 can be provided on the surface 1 a of the mounting portion 1. The electronic component 14 can also be attached to the opposite side of the heat sink H with the heat radiating portion 1 interposed therebetween. In this case, when a large amount of heat is suddenly generated from the electronic component 14, the heat is dissipated by the heat sink H or the like while accumulating in the heat radiating block 17. Inconveniences such as destruction can be prevented.

  For this reason, it is desirable to form the heat dissipation block 17 with a material having high thermal conductivity such as copper. Further, the heat radiation block 17 may be attached to a normal heat sink H that does not contact the shield case 18 (for example, in FIGS. 1, 4, 5, and 6) as described above. In this case as well, it is possible to cope with rapid heat generation as described above.

  On the other hand, as shown in FIG. 9, it is possible to prevent the legs 3 and 13 from being detached from the substrate 7 by bending or curving the portions where the legs 3 and 13 are inserted into the substrate 7. it can. In this case, the legs 3 and 13 are not necessarily fixed to the substrate 7 by soldering. A leg-shaped bend or curve of the leg can be employed in any of the heat sinks described above.

(A) is a top perspective view of a heat sink, (b) is a bottom perspective view. It is a top perspective view which shows the attachment state to the board | substrate of a heat sink and an electronic component. It is a perspective view which shows the board | substrate of the standing state at the time of use of an electric product. (A) is a perspective view which shows the state which attached the electrical component to the back surface of a mounting part, (b) is sectional drawing which shows the state which has arrange | positioned components inside a flow path. (A) is a perspective view of the heat sink in which the hole was provided in the fin part, (b) is a perspective view of the heat sink in which the groove | channel was provided in the fin part. It is a bottom perspective view of a heat sink in which legs are directly provided on the mounting portion. (A) is a top perspective view which shows the state which attached the heat sink to the electronic component provided with the thermal radiation block, (b) is A arrow directional view, (c) is BB sectional drawing. It is a disassembled perspective view which shows attachment of the heat sink and heat dissipation block at the time of providing a protrusion in a heat dissipation block. It is side sectional drawing of the leg bent in the shape of a "<".

DESCRIPTION OF SYMBOLS 1 Mounting part 1b Back surface 2 Fin part (fin)
3 legs 7 Board 7a Component mounting surface (Board surface)
8 Heat dissipation path (heat dissipation space)
11 holes 12 grooves (notches)
17 Heat dissipation block 19 Protrusion 20 Hole

Claims (2)

In the heat sink attached together with the electrical component (4) to the substrate (7) that is mounted so as to stand up when the electrical product is used, the heat sink includes a mounting portion (1) for mounting the electronic component (4) ; A leg (3) for attaching the heat sink to the substrate (7) in a state where a space is formed between the front surface (7a) of the substrate (7) and the back surface (1b) of the mounting portion (1 ) is provided, and the mounting portion (1 The mounting surface of the electronic component (4) is formed on the back surface (1b) of the electronic component (4) so that the space allows air to flow in the upward direction and the electronic component (4) attached to the back surface (1b) to be positioned. A heat sink which is a heat radiation space (8) of a large size. A fin (2) is provided on the back surface (1b) side of the mounting portion (1) to perform heat radiation and guide the upward discharge of air, the leg (3) is provided at the tip of the fin (2), and the fin (2) The heat sink according to claim 1 , wherein a plurality of notches (11) are provided on the heat sink.

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