JP4338565B2 - Ultrasonic probe and method for manufacturing ultrasonic probe - Google Patents

Description

  The present invention relates to an ultrasonic probe and a method of manufacturing an ultrasonic probe, and in particular, an ultrasonic probe that is easy to manufacture with less attenuation of a transmitted / received signal, improved pressability and adhesion to a subject. And improvement of the manufacturing method thereof.

  Conventionally, many ultrasonic probes have been devised that generate a periodic distortion by applying a voltage of a predetermined frequency to a piezoelectric material and obtain an ultrasonic wave having a frequency corresponding to the distortion. A general ultrasonic probe forms a surface that absorbs ultrasonic waves and does not transmit / receive ultrasonic waves on one side of a piezoelectric material that actually generates distortion and generates ultrasonic waves. A backing layer that expands the frequency band so that short pulse signals can be transmitted and received is arranged, and on the other side, it plays a role of filling the gap of acoustic impedance to the subject etc. when using an ultrasonic probe An acoustic matching layer is disposed. That is, as a whole, a plurality of members are stacked.

  The ultrasonic probe configured as described above employs various shapes and ultrasonic scanning methods depending on applications. As an arrangement form of each piezoelectric material (vibrator), there are a linear array type in which a plurality of piezoelectric materials are linearly arranged, a convex array type in which this linear array is curved, and the like. As scanning methods, linear scanning that emits ultrasonic waves perpendicular to the surface of the piezoelectric material, sector scanning that deflects the combined wavefront of the ultrasonic waves generated from each piezoelectric material to obtain a fan-shaped image, and beam scanning in an arcuate shape Arc scanning to be performed, radial scanning to scan the beam to the surrounding 360 °, and the like.

  For example, when performing ultrasonic diagnosis of the heart using such an ultrasonic probe, it is necessary to transmit and receive ultrasonic waves between the ribs. Normally, when transmitting and receiving ultrasonic waves between the intercostals as described above, a sector of the small linear array type ultrasonic probe 100 having a flat surface as shown in FIG. Sound image acquisition is performed.

  By the way, as shown in FIG. 13, when an image is to be obtained using the ultrasonic probe 100 whose surface is flat (actually, a protective film or a cover is provided on the upper surface of the acoustic matching layer). In order to find a good image acquisition position, the ultrasonic probe 100 is moved left and right on the rib 104 in a state of being in close contact with the subject. As a result, the linear ultrasonic probe 100 is rubbed between the ribs 104 and the ribs 104 to cause discomfort to the subject, and the surface of the ultrasonic probe 100 is flat. There were inconveniences such as unstable positioning.

  Therefore, for example, by using the curved surface shape of the convex convex acoustic lens arranged on the surface side of the linear array type piezoelectric material, the contact condition with the subject can be improved, or the convex type ultrasonic probe can be used. It is conceivable to improve the contact condition by using it (see Patent Document 1 and Patent Document 2).

JP-A-8-289386 JP-A-6-292665

  However, when a convex acoustic lens is used, there is a problem that the central portion where the highest sensitivity is originally desired is thickened and the attenuation of the ultrasonic wave is increased. In addition, the ultrasonic wave emitted from each piezoelectric material (vibrator) is strongest at the front surface of the piezoelectric material. However, in the case of a convex ultrasonic probe that performs sector scanning, each piezoelectric material follows a sector shape. , Arranged in a direction extending from the center to the left and right. As a result, when sector scanning is performed, for example, when an ultrasonic beam is transmitted in the right direction using a piezoelectric material arranged facing the left direction with respect to the center position, it is largely deflected from the left direction to the right direction. Need to be made. In addition, when an ultrasonic wave is to be transmitted in the left direction using a piezoelectric material arranged facing the right direction with respect to the center position, it is necessary to largely deflect the right direction to the left direction. As a result, there is a problem that the ultrasonic beam becomes weak as a whole. In addition, when a piezoelectric material is arranged in a two-dimensional manner using a convex type, it is difficult to secure a lead-out space since the lead-out direction of the signal lines and ground lines of each piezoelectric material faces the center of the curve, and the wiring work itself is also difficult. There was a problem that became difficult.

  The present invention has been made in view of the above problems, and can improve contactability (contact condition) to a subject, reduce attenuation of an ultrasonic beam, and draw out a signal line and a ground line. It is an object of the present invention to provide an ultrasonic probe with improved wiring workability and assembling work and a method for manufacturing the same.

  In order to achieve the above-described object, the present invention includes a vibrator formed by arranging a plurality of piezoelectric materials that generate ultrasonic waves, an acoustic matching layer laminated on one surface side of the vibrator, and a vibrator. An ultrasonic probe comprising a backing layer sandwiched between and opposite to the acoustic matching layer, wherein the piezoelectric material constituting the vibrator has an ultrasonic wave transmitting / receiving surface of a piezoelectric material having a substantially central arrangement. It is characterized by being arranged in steps in the same direction as the ultrasonic transmission / reception surface and in a convex shape with respect to the arrangement direction.

  In order to achieve the above object, in the present invention, in the above configuration, each piezoelectric material forming the vibrator individually forms a composite including an acoustic matching layer and a backing layer, The composites are arranged in steps so as to protrude in the arrangement direction.

  In order to achieve the above object, according to the present invention, in the above configuration, the composite is a plate-like composite including a strip-shaped piezoelectric material, and the plate-like composite is arranged in the thickness direction. A one-dimensional array is formed by arranging steps in a convex shape.

  In order to achieve the above object, according to the present invention, in the above configuration, the composite is a plate-like composite including a strip-shaped piezoelectric material, and the plate-like composite is arranged in the thickness direction. A two-dimensional array is formed by arranging steps in a convex shape and separating the plate-shaped composite body into a plurality in a direction perpendicular to the thickness direction.

  In order to achieve the above object, in the present invention, in the above configuration, each piezoelectric material forming the vibrator individually forms a composite including an acoustic matching layer and a backing layer, The composite is characterized in that a step is arranged in a convex shape in each of two orthogonal directions of the ultrasonic transmission / reception surface to form a cone-shaped two-dimensional array having a substantially central portion at the top.

  Furthermore, in order to achieve the above-described object, the ultrasonic probe manufacturing method of the present invention includes a step of forming a piezoelectric material having an electrode on an opposing surface, and a fluidity on one side across the piezoelectric material. A step of pouring an acoustic matching layer forming material and a flowable backing layer forming material on the other side and curing the respective materials to form a composite, and lead wires for the electrodes exposed on the front and back surfaces of the composite, respectively. And forming a wiring composite by extending the open end side of the leader line along the backing layer in a direction away from the piezoelectric material, and the wiring composite and a spacer having a predetermined thickness, Wherein the ultrasonic transmission / reception surface of the piezoelectric material constituting the wiring complex is oriented in the same direction as the ultrasonic transmission / reception surface of the piezoelectric material at the substantially center of the arrangement, and with respect to the arrangement direction. Convex step Characterized in that it comprises the steps of: arranging.

  In order to achieve the above-described object, the ultrasonic probe manufacturing method of the present invention includes a step of forming a strip-shaped piezoelectric material having electrodes on opposite surfaces, and one side across the piezoelectric material. A flowable acoustic matching layer forming material and a fluidized backing layer forming material on the other side, and curing each to form a plate-shaped composite, and a plate-shaped composite on the front and back surfaces. A lead wire that can be separated into a plurality of separations at a predetermined pitch is connected to the exposed electrode, and is extended in a direction away from the piezoelectric material along the backing layer on which the open end side of the lead wire is formed. Forming the wiring composite and spacers of a predetermined thickness alternately in the thickness direction, wherein an ultrasonic wave transmitting / receiving surface of a piezoelectric material constituting the composite Ultrasonic wave transmitting / receiving surface A step of forming a block body by arranging steps in the same direction and projecting with respect to the arrangement direction, a direction of removing the upper portion of the spacer from the acoustic matching layer side of the block body, and a strip-shaped piezoelectric material Forming a matrix-like groove in a plurality of separating directions, and separating the strip-shaped piezoelectric material into individual elements corresponding to the lead lines.

  In order to achieve the above-described object, the ultrasonic probe manufacturing method of the present invention includes a step of forming a strip-shaped piezoelectric material having electrodes on opposite surfaces, and one side across the piezoelectric material. A flowable acoustic matching layer forming material and a fluidized backing layer forming material on the other side, and curing each to form a plate-shaped composite, and a plate-shaped composite on the front and back surfaces. A lead wire that can be separated into a plurality of separations at a predetermined pitch is connected to the exposed electrode, and is extended in a direction away from the piezoelectric material along the backing layer on which the open end side of the lead wire is formed. Forming a wiring composite and a spacer having a predetermined thickness in the thickness direction, separating the plurality of wiring composites along the lead-out direction of the leader line, and forming the individual composite; and The individual complex The step of alternately arranging the wire composite portion and the spacer portion, wherein the ultrasonic transmission / reception surface of the piezoelectric material constituting the wiring composite is oriented in the same direction as the ultrasonic transmission / reception surface of the piezoelectric material at the substantially center of the arrangement And forming a plate-like wiring complex by arranging steps in a convex shape with respect to the arrangement direction, and arranging the plate-like wiring complex and a spacer having a predetermined thickness alternately in the thickness direction. The ultrasonic wave transmitting / receiving surface of the piezoelectric material constituting the plate-like wiring composite is aligned in the same direction as the ultrasonic wave transmitting / receiving surface of the piezoelectric material at the center of the arrangement, and is arranged in a stepped manner in a convex shape with respect to the arrangement direction A step of forming a block body, a matrix-like groove is formed by excluding an upper portion of a spacer existing around the individual composite from the acoustic matching layer side of the block body, and a strip-shaped piezoelectric material is provided for each lead wire Separated into individual elements corresponding to A step that, characterized in that it comprises a.

  According to the above configuration, the piezoelectric material is arranged in a stepped shape, and the surface shape of the ultrasonic probe can be made convex without using the shape of another member. It can improve the sex. In addition, since the convex shape is formed by the stepped arrangement of the piezoelectric material without using other members, it is possible to suppress attenuation of ultrasonic waves to be transmitted and received. In addition, since the ultrasonic wave transmission / reception surfaces of all piezoelectric materials are substantially in the same direction as the central piezoelectric material, that is, facing the front, when performing sector scanning, the deflection angle of ultrasonic waves from each piezoelectric material is minimized. The attenuation of the ultrasonic beam can be minimized. In addition, since the ultrasonic wave transmission / reception surfaces of the piezoelectric material are all in the same direction, the signal and ground wires can be drawn straight in the direction of the back surface of the piezoelectric material, wiring and assembly of the ultrasonic probe. Work becomes easy.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention (hereinafter referred to as embodiments) will be described with reference to the drawings.

  FIG. 1 shows a schematic external view of an ultrasonic probe 10 of the present embodiment. The ultrasonic probe 10 of this embodiment includes a piezoelectric material 12 (vibrator) that generates ultrasonic waves, a backing layer 14, and an acoustic matching layer 16. The backing layer 14 absorbs ultrasonic waves and serves to widen the frequency band by allowing the ultrasonic probe 10 to transmit and receive short pulse signals. The acoustic matching layer 16 plays a role of filling a gap of acoustic impedance with respect to the subject or the like. FIG. 1 shows an example in which a two-dimensional type ultrasonic probe 10 in which a plurality of independently controllable piezoelectric materials 12 are arranged in a matrix is configured.

  In this embodiment, as shown in FIG. 2, a signal electrode 18 a is formed on the lower surface of the piezoelectric material 12, and its end surface is in contact with the signal line 18 disposed on the side surface of the piezoelectric material 12. Further, the end surface of the ground electrode 20 a formed on the upper surface of the piezoelectric material 12 is in contact with the ground wire 20 disposed on the opposite side surface of the piezoelectric material 12 with respect to the signal line 18. Then, by applying a voltage between the signal line 18 and the ground line 20, ultrasonic waves are radiated in the stacking direction of the acoustic matching layer 16. At this time, the end surface of the signal electrode 18 a formed on the lower surface of the piezoelectric material 12 on the ground line 20 side is offset inward from the end surface of the piezoelectric material 12. That is, the signal line 18 and the ground line 20 can be fixed to both side surfaces of the piezoelectric material 12 so as not to contact the ground electrode 20a connected to the ground line 20 on the acoustic matching layer side. In FIG. 2, the backing layer 14 is not shown.

  As described above, when a predetermined voltage is applied between the signal line 18 and the ground line 20, the piezoelectric material 12 vibrates in the Z direction in the figure. In the configuration of FIG. 2, desired ultrasonic waves are radiated from the ultrasonic probe 10 using the vibration in the Z direction, that is, ultrasonic waves generated by a so-called longitudinal effect method.

  The characteristic feature of the ultrasonic probe 10 of the present embodiment is that, in the piezoelectric material 12 constituting the vibrator, the ultrasonic wave transmitting / receiving surface is oriented in the same direction as the ultrasonic wave transmitting / receiving surface of the piezoelectric material 12 at substantially the center of the array. In addition, the steps are arranged in a convex shape with respect to the arrangement direction.

  As is apparent from FIGS. 1 and 2, in the present embodiment, the signal line 18 and the ground line 20 penetrate the backing layer 14 from the side surface of each piezoelectric material 12, and the back surface of the ultrasonic probe 10. It extends to the side. That is, the signal line 18 and the ground line 20 can be connected to each transducer (vibration element) constituting the ultrasonic probe, and accurate control for each transducer, that is, accurate transmission and reception of ultrasonic waves. Wave control can be performed. In addition, since it becomes possible to make each vibrator substantially independent, it is possible to suppress deterioration of directivity of ultrasonic waves. Furthermore, since each vibrator is substantially in an independent state, it is possible to contribute to suppression of mutual crosstalk. In particular, as can be easily understood from FIGS. 1 and 2, the ground line 20 passes straight through the backing layer 14 and the ground line 20 is interposed between the signal lines 18. It is possible to suppress crosstalk in the signal line and to reduce signal degradation.

  Hereinafter, with reference to FIGS. 3 to 5, the two-dimensional type ultrasonic probe 10 of this embodiment, that is, the ultrasonic wave transmitting / receiving surfaces of all the piezoelectric materials 12 are directed in the same direction and are convex with respect to the arrangement direction. A method for manufacturing the ultrasonic probe 10 having the shape of the stepped arrangement will be described.

  As a first step, as shown in FIG. 3 (a), for example, on the front and back surfaces of the plate-like piezoelectric material 22 made of piezoelectric ceramics such as barium titanate, PZT, lead titanate, etc. The signal electrode 18a and the ground electrode 20a are formed by a suitable material by any means such as vapor deposition, sputtering, and printing.

  Subsequently, as shown in FIG. 3B, grooves 24 having a predetermined pitch are formed on one electrode formation surface (for example, the formation surface of the signal electrode 18a) by means such as etching. The groove 24 is for preventing the ground line 20 from coming into contact with the signal electrode 18a when the ground line 20 (when the groove 24 is provided on the formation surface of the signal electrode 18a) is connected as described above. is there. Next, as shown in FIG. 3C, the piezoelectric material 22 is cut into strips along the grooves 24 to form the piezoelectric material 22a. The width of this strip is the width of the vibrator. As described above, the groove 24 has a signal electrode on the inner side of the end face of the piezoelectric material 22a after being cut into a strip shape so that the signal electrode 18a does not come into contact when the ground wire 20 is connected to the piezoelectric material 22a. This is for offsetting 18a. Therefore, the etching width in FIG. 3B is a width obtained by adding a cutting margin to the width of the offset groove 24a in FIG. It is desirable that the etching depth be appropriately selected to a depth that does not cause electrical connection or influence between the ground line 20 and the signal line 18 (piezoelectric material forming step).

  Next, as shown in FIG. 3D, the cut piezoelectric material 22a is disposed at a predetermined position of the mold 23. In this case, as shown in FIG. 3E, the piezoelectric material 22a is disposed in the mold 23 so that the offset groove 24a is on the upper surface. At this time, since the holding portion 26 for holding the piezoelectric material 22a is formed in the mold 23, the positioning of the piezoelectric material 22a can be performed easily and accurately. The mold 23 is formed with a recess 28 that is divided into regions 28a and 28b by the piezoelectric material 22a. The piezoelectric material 22a is arranged so that the offset groove 24a faces the region 28a side.

  Then, the regions 28a and 28b of the recess 28 are completely covered with a mold lid (not shown). At this time, as shown in FIG. 4A, the mold lid covering the region 28a is molded so that the thickness of the backing layer forming material 30 is smaller than the thickness of the piezoelectric material 22a (for example, half the thickness). The lid has a convex shape that can be fitted into the region 28 a of the concave portion 28. Next, a fluid backing layer forming material 30 is injected from the injection gate 28c to fill the region 28a. Excess backing layer forming material 30 is discharged from the discharge gate 28d. It should be noted that the backing layer forming material 30 can be shaped so as to gradually become thin with an inclination so that the ground line 20 can be fixed without being bent in accordance with the shape of the mold lid. preferable. In this state, the backing layer forming material 30 is cured.

  Simultaneously with or before or after the formation of the backing layer 14, the fluid acoustic matching layer forming material 32 is injected from the injection gate 28 c into the region 28 b covered with the mold lid to fill the region 28 b. Similar to the backing layer forming material 30, the excess acoustic matching layer forming material 32 is discharged from the discharge gate 28d. Note that the acoustic matching layer forming material 32 and the backing layer forming material 30 are selected from those having a property of adhering to the piezoelectric material 22a on which electrodes are formed by curing.

  In FIG. 4B, the backing layer forming material 30 and the acoustic matching layer forming material 32 after being subjected to a predetermined curing process are taken out together with the piezoelectric material 22a from the mold 23, and the injection gate and the discharge gate portions are cut off. The state of the plate-like composite 34 is shown (composite forming step). In this state, the height h0 and the thickness t0 of the acoustic matching layer 16 are accurately obtained. FIG. 4C shows a cross-sectional view of the composite 34. As apparent from FIG. 4C, the acoustic matching layer forming material 32 (acoustic matching layer 16), the ground electrode 20a, the piezoelectric material 22a, the signal electrode 18a, and the backing layer forming material 30 (backing layer 14) are laminated. It is in a state. At this time, since the fluid acoustic matching layer forming material 32 and the backing layer forming material 30 are brought into contact with the piezoelectric material 22a on which each electrode is formed and cured, the acoustic matching can be performed without using any adhesive. Since the layer 16 and the backing layer 14 can be connected (adhered) to the piezoelectric material 22a, the layer 16 and the backing layer 14 are ideally free from noise generation such as attenuation of ultrasonic waves and unnecessary reflection at the boundary with the piezoelectric material 22a. A boundary state can be realized.

  Subsequently, as illustrated in FIG. 4D, the ground line 20 that contacts the end portion of the ground electrode 20 a is formed on one side of the composite 34 (for example, the side where the backing layer 14 is thinned). As shown in FIG. 4E, the signal line 18 that contacts the end of the signal electrode 18a is formed on the other surface side of the composite 34. The ground line 20 and the signal line 18 can be easily formed by, for example, vapor deposition or sputtering (wiring complex forming step). Note that, when the ground line 20 and the signal line 18 are formed by vapor deposition, sputtering, or the like, the shape can be arbitrarily and easily selected. Therefore, in the present embodiment, FIG. 4 (d) and FIG. 4 (e). As shown in FIG. 4, a shape that is continuous at the contact portion of the ground electrode 20a and the signal electrode 18a and is separated into a comb shape at the lower portion is employed. In this case, when the piezoelectric material 22a is separated later, it is not necessary to separately separate the ground line 20 and the signal line 18, and efficient production can be performed. Needless to say, planar ground lines and signal lines may be formed, and the ground lines 20 and the signal lines 18 may be separately separated by etching or the like.

  A cross-sectional view of a wiring complex 36 in which the ground wire 20 and the signal line 18 are formed on the complex 34 is shown in FIG. As is apparent from FIG. 4F, the signal electrode 18a and the ground line 20 are not in electrical contact due to the presence of the offset groove 24a described above.

  As shown in FIG. 1, the wiring composite 36 formed in this way has the ultrasonic transmission / reception surface of the piezoelectric material 12 at the substantially center of the array and the ultrasonic transmission / reception surfaces of the other piezoelectric materials 12 oriented in the same direction, and The length of the backing layer 14 is adjusted so as to sequentially change along the arrangement direction so that the steps can be arranged in a convex shape with respect to the arrangement direction. That is, as shown in FIG. 4G, the backing layers 14 of the respective wiring composites 36 are appropriately adjusted and cut to form wiring composites 36a, 36b, 36c,... Having different backing layer 14 lengths. (The wiring complex 36a has a basic length). Although FIG. 4G exaggerates the length of the cut portion 14a for the sake of explanation, the difference in length of each cut portion 14a is actually about several tens of μm to several hundreds of μm. By setting the length of the backing layer 14 to be sufficiently long, even if the length of the backing layer 14 changes in each wiring complex 36 for adjusting the length, the acoustic characteristics are not affected.

  In the above description, the wiring composite 36 having the same length of the backing layer 14 is appropriately cut to form the wiring composites 36a, 36b, 36c... Having different lengths. ) Or the length of the backing layer 14 may be adjusted in the burr processing step in FIG. 4B.

  FIG. 5A shows a state in which the wiring composites 36 (36a to 36d) having the backing layers 14 having different lengths are arranged so that a step is formed in a convex shape with respect to the arrangement direction. ing. When arranging the wiring complexes 36, a predetermined number of them are alternately arranged via the spacers 38 to form the block bodies 40 in order to electrically insulate the adjacent wiring complexes 36 (block body forming step). ). The spacer 38 used here is preferably formed of the same material as the backing layer 14 or an equivalent material. For example, the spacer 38 is equivalent to the wiring complex 36 in which the length of the backing layer 14 is adjusted in advance using a mold or the like. It is desirable to form in length. 5A, the spacer 38 has a thick portion corresponding to the thin portion of the backing layer 14 of the wiring composite 36. The wiring composite 36 and the spacer 38 It has a rectangular shape. In this way, by forming a thin portion in the backing layer 14 and forming a thick portion in the spacer 38, it is possible to increase the distance between the wiring complexes 36 that are alternately arranged via the spacer 38. Thus, electrical crosstalk between the signal lines 18 can be suppressed. Of course, even if the thickness of the backing layer 14 and the spacer 38 is made uniform, the signal lines 18 are separated, so that sufficient electrical crosstalk is suppressed.

  Further, the wiring composite 36 and the spacer 38 can be joined with, for example, an epoxy adhesive. Note that the size of the ultrasonic probe 10 to be finally obtained can be determined by the width of the wiring complex 36 in the vertical direction, and the size in the horizontal direction can be determined by wiring when the block body 40 is formed. The number can be arbitrarily determined depending on the number of the composites 36 and the spacers 38 arranged. Further, in the step arrangement shown in FIG. 5A and the like, the central two wiring composites 36 are the same size, and the others are arranged so as to have a step with respect to the arrangement direction. For example, several adjacent wiring composites 36 having the same length may include a flat array portion having no step. Thus, by appropriately mixing the flat arrangement, the convex state of the surface of the ultrasonic probe 10 can be arbitrarily adjusted. Of course, all the wiring complexes 36 may be arranged with steps, or the difference between the steps may be changed according to the desired convexity of the surface of the ultrasonic probe 10. However, when the step is formed in the arrangement direction as in the present embodiment, the actual distance from each transducer (piezoelectric material 12) to the target of the subject changes according to the step, so that each step is taken into consideration. It is necessary to perform ultrasonic transmission / reception control of the vibrator.

  As shown in FIG. 4G, by adjusting the length of the backing layer 14 of the wiring complex 36 in advance, the step arrangement can be easily performed in a convex shape. Of course, the convex step arrangement may be performed using an arrangement mold or the like in which a step is formed in a concave shape without adjusting the length of the backing layer 14 of the wiring complex 36. In this case, if the backing layer 14 side end surface is cut and flattened in a later step, the same shape as in FIG. 5A can be obtained. Further, when the step on the backing layer 14 side is left without being cut, the signal line 18 and the ground line 20 drawn along the backing layer 14 are stepped for each wiring complex 36. Wiring work with wiring becomes easy.

  In this state, a one-dimensional array is completed in which the ultrasonic wave transmitting / receiving surfaces of all the piezoelectric materials 12 face the same direction and are provided with a convex step arrangement in the arrangement direction. In the case of an actual one-dimensional array, the length in the depth direction orthogonal to the thickness in the wiring direction of the wiring complex 36 is appropriately selected.

  On the other hand, when creating a two-dimensional array like this embodiment, the piezoelectric material 22a in the block body 40 is isolate | separated for every predetermined vibrator | oscillator (vibration element) continuously. First, as shown in FIG. 5B, the acoustic matching layer 16 side surface of the block body 40 is arranged at a predetermined pitch (in a desired transducer width) in the arrangement direction of the wiring complex 36 and the spacer 38 (direction of cut 1). Dicing is performed at a position where the signal line 18 (the ground line 20) comes to substantially the center of each vibrator), and a groove 42 as shown in FIG. 5C is formed to form a wiring composite 36. 22a is separated into individual piezoelectric materials 12 (vibrators). The dicing depth at this time is such that the separation groove is formed on the backing layer 14 beyond the piezoelectric material 22a (12) from the acoustic matching layer 16 side in the wiring composite 36 at the extreme end, that is, at least acoustic. The depth is such that the matching layer 16 and the piezoelectric material 12 are completely separated for each signal line 18.

  Further, as shown in FIG. 5 (c), dicing with a predetermined depth is performed in the direction of cut 2 perpendicular to the direction of cut 1 to form a groove 44 as shown in FIG. Also, the acoustic matching layer 16 is separated into a matrix, and the acoustic matching layer 16 is completely separated for each piezoelectric material 12. In this case, the groove 44 is formed so as to exclude the upper portion of the spacer 38, and the depth thereof is a depth that slightly reaches the backing layer 14, and from the upper surface (acoustic matching layer 16) of each wiring complex 36. The depth is preferably the same (element isolation step).

  Finally, the grooves 42 and 44 formed for separating the acoustic matching layer 16 and the piezoelectric material 12 include, for example, a bubble body made of urethane curable resin or resin in order to suppress acoustic crosstalk. A silicon adhesive or the like is injected for sealing. This stop can reduce crosstalk. In addition, the acoustic matching layer 16 and the piezoelectric material 12 that are acoustically and physically divided can be stably held.

  When the groove 42 is formed by the cut 1, the cutting load acts on the piezoelectric material 22a in order to cut the piezoelectric material 22a. The spacer 38 has a function of supporting the piezoelectric material 22a at this time, and can prevent the piezoelectric material 22a from being damaged. Of course, the cutting load on the piezoelectric material 22a can be reduced by considering the dicing speed and the like. In this case, the height of the spacer 38 used in FIG. 5A can be lowered in advance by the depth of the groove 44, and the dicing of the cut 2 can be omitted.

  By manufacturing the ultrasonic probe according to the above procedure, as shown in FIGS. 1 and 5D, the piezoelectric materials 12 are arranged substantially in a matrix, and the ultrasonic waves of each piezoelectric material 12 are arranged. It is possible to obtain the ultrasonic probe 10 in which the transmission / reception surface is oriented in the same direction as the ultrasonic transmission / reception surface of the piezoelectric material 12 at the center of the arrangement, that is, the front surface, and is arranged in a stepped shape in a convex shape with respect to the arrangement direction. Therefore, the surface of the ultrasonic probe 10 can form a convex shape without using another convex shape forming member or the like. In practice, a thinner protective film, a protective cover, and the like are disposed on the acoustic matching layer 16, but there is no difference in the thickness of the additional material on the ultrasonic wave transmitting / receiving surface between the piezoelectric materials 12. In the case of this embodiment, a pair of the signal line 18 and the ground line 20 is connected for each piezoelectric material 12 and has a good directional characteristic and is a two-dimensional type superacoustic that suppresses crosstalk acoustically and electrically. The acoustic probe 10 can be easily formed.

  Furthermore, since the signal line 18 and the ground line 20 separated for each piezoelectric material 12 can be easily extended to the back surface side of the backing layer 14, a separate electric circuit is provided for each piezoelectric material 12. Since they can be connected and controlled differently for each piezoelectric material 12, it is possible to easily manufacture the ultrasonic probe 10 that contributes to improving the degree of freedom in circuit design.

  Further, in the mold 23 shown in FIG. 4A and the like, a flow path to which the injection gate 28c and the discharge gate 28d for the acoustic matching layer forming material 32 are connected is provided obliquely with respect to the acoustic matching layer 16 formation region. However, this is for forming the holding portion 26 and forming the burr due to the presence of the injection gate 28c and the discharge gate 28d in a portion where the height h0 and the thickness t0 of the acoustic matching layer 16 are not affected. . Therefore, the shape of the mold 23 can be appropriately selected as long as the shape can be obtained accurately without holding the piezoelectric material 22a and the height h0 and the thickness t0 of the acoustic matching layer 16 without additional processing such as dicing. .

  In the above description, burrs generated due to the presence of the injection gate 28c and the like shown in FIG. 4A are cut out at the stage of FIG. 4B to adjust the thickness T of the backing layer 14, but FIG. The backing layer 14 may be excised together with the length adjustment. Similarly to the acoustic matching layer region 28b, the backing layer injection gate 28c may be disposed on the same side surface as the discharge gate 28d, and the thickness T of the backing layer 14 may be defined by the mold 23.

  As shown in FIG. 6, the ultrasonic probe 10 manufactured in this way forms a convex shape due to the arrangement of the piezoelectric material 12 itself, so that it can be stably disposed between the ribs 104. . Further, since the surface is formed with a smooth curved surface (in fact, a thin protective film or cover is formed on the acoustic matching layer 16 as described above), the ultrasonic probe is formed on the rib 104. Even if the 10 is moved, there is no sense of inconvenience, and the measurement position can be satisfactorily searched. In addition, since an additional member having a convexly centered surface for making the surface convex is not required, attenuation of ultrasonic waves at the central portion can be suppressed. Further, the ultrasonic wave transmitting / receiving surface of each piezoelectric material 12 has the same orientation as that of the piezoelectric material 12 at the center, that is, all the piezoelectric materials 12 are similarly facing the front at an angle of 0 °. Is the minimum necessary (only right or left from the front position). In the case of a normal convex type, directivity beyond the scanning range of the beam is required, which leads to attenuation of ultrasonic waves.

  Further, since the ultrasonic wave transmission / reception surfaces of the piezoelectric material 12 all face the same direction, the signal lines and the ground lines can be drawn straight to the back surface direction of the piezoelectric material 12, that is, the backing layer 14. As a result, a wiring drawing space can be easily secured, and wiring work and assembly work are facilitated.

  FIG. 7 and FIG. 8 show a procedure for manufacturing another type of ultrasonic probe. In the ultrasonic probe 10 described above, a step is arranged in a convex shape with respect to one of the arrangement directions of the piezoelectric materials 12, but no step is arranged in the other orthogonal direction. Therefore, in the ultrasonic probe shown in FIG. 7 and FIG. 8, an example is shown in which convex steps are arranged in two orthogonal directions.

  First, a wiring complex 36 prepared by the procedure described in FIGS. 3A to 3F and FIGS. 4A to 4F is prepared, and a spacer 38 having a corresponding shape is shown in FIG. 7A. Paste together. In this case, the adhesive used for bonding is preferably a curable liquid material made of the same material as the spacer 38 (ie, the same material as the backing layer 14).

  Subsequently, as shown in FIG. 7B, dicing is performed at a predetermined pitch from the cut 3 direction (a position where the signal line 18 (the ground line 20) comes to the center of each vibrator with a desired vibrator width). Then, as shown in FIG. 7C, the vibrating body 46 having individual spacers is formed. Further, the vibrating body 46 is laminated as shown in FIG. 7D to reconfigure the wiring complex 48. In this case, the steps are arranged so as to be convex with the vibrating body 46 at the substantially center. As apparent from FIG. 7D, the laminated wiring composite 48 has different lengths of the backing layer 14. Therefore, in any of the steps leading to FIG. 7C, a cut process for adjusting the length of the backing layer 14 in a direction orthogonal to the cut 3 direction is performed. Of course, it is also possible to prepare the wiring complex 48 in which the length of the backing layer 14 is not adjusted, and perform the convex step arrangement by using an array mold or the like in which the concave step is formed. In this case, if the end surface on the backing layer 14 side is cut and flattened in a later step, the same shape as that shown in FIG. In the example shown in FIG. 7 (d), a step is not formed with respect to the total number of layers, but a part of the flat portion is formed. As described above, by appropriately mixing the flat arrangement, the convex state of the surface of the ultrasonic probe completed as described above can be arbitrarily adjusted.

  In FIG. 7D, the wiring complex 48 on the left in the figure is a wiring complex 48 that forms a substantially central portion when the ultrasonic probe is assembled, and the wiring that forms the outer peripheral side in order toward the right. A composite 48 is obtained. Further, the rightmost wiring complex 48 in FIG. 7D is not formed with a step in the stacking direction, but when this wiring complex 48 assembles an ultrasonic probe, the lowest step of the overall level difference. Part. In FIG. 7D, the relationship between the total thicknesses t1 to t4 of the wiring complex 48 is t1> t2> t3> t4 (when all steps are provided in the arrangement direction of the wiring complex 48 described later).

  Subsequently, as shown in FIG. 8A, the reconfigured wiring complex 48 is arranged so that a step is formed in a convex shape with respect to the arrangement direction, as in FIG. 5A. Also at this time, in order to electrically insulate the adjacent wiring complex 48, a predetermined number of them are alternately arranged via the spacers 50 to form the block bodies 52 (block body forming step). The spacer 50 used here is preferably formed of the same material as the backing layer 14 or an equivalent material. For example, the wiring complex 48 in which the length of the backing layer 14 is adjusted to the shortest in advance using a mold or the like. It is desirable that the length is equal to or the same length as that of the backing layer 14 of the wiring complex 48 (most front side in FIG. 8A). As is clear from FIG. 8A, the spacer 50 has a plate shape, and both surfaces thereof have a planar shape. The vibrating bodies 46 constituting the wiring complex 48 are completely separated from each other by the spacers 38 and 50, and electrical crosstalk between the signal lines 18 can be suppressed. In addition, the arrangement of the vibrating bodies 46 is a so-called pyramid shape in which convex step arrangements are formed in two orthogonal directions.

  As shown in FIG. 8B, the block body 52 formed in this way is diced so as to exclude the upper part of the spacer 50 in the arrangement direction of the wiring complex 48 and the spacer 50 (direction of cut 1). The groove 54 is formed by such means. The depth of the groove 54 is preferably a depth that slightly reaches the backing layer 14. As described above, when the spacer 50 having a length adjusted so as to reach the backing layer 14 is used, this dicing in the cut 1 direction can be omitted. Subsequently, dicing with a predetermined depth is performed in the direction of cut 2 orthogonal to the direction of cut 1 to form a groove 56 as shown in FIG. 8B by dicing or the like, and the upper portion of the spacer 38 is eliminated. The depth of the groove 56 at this time is preferably a depth that slightly reaches the backing layer 14. As a result, the block body 52 is separated into a matrix shape and is completely separated for each piezoelectric material 12.

  Finally, the grooves 54 and 56 formed for separating the acoustic matching layer 16 and the piezoelectric material 12 include, for example, a bubble body made of urethane-based curable resin or resin in order to suppress acoustic crosstalk. A silicon adhesive or the like is injected for sealing. This stop can reduce crosstalk. In addition, the acoustic matching layer 16 and the piezoelectric material 12 that are acoustically and physically divided can be stably held. In the case of the actual ultrasonic probe 58, a protective film or cover having a substantially uniform thickness is disposed on the upper surface of the acoustic matching layer 16.

  The pyramid-type ultrasonic probe 58 formed in this way has a cone shape, and has improved adhesion to the subject as compared to those arranged in steps in one direction as shown in FIG. Sound waves can be transmitted and received. Further, when the ultrasonic probe 58 is moved while being pressed against the subject, it can be moved freely and smoothly in an arbitrary direction, which can contribute to an improvement in contact feeling. Further, since the ultrasonic wave transmitting / receiving surfaces of all the piezoelectric materials 12 face the same direction and are provided with a convex step arrangement with respect to the arrangement direction, the signal lines 18 and the ground lines 20 can be easily wired. Can do.

  FIG. 9 shows a structural example of a vibrator using vibration characteristics different from the structure described in FIG. That is, the signal electrode and the ground electrode are formed on the opposing surface of the piezoelectric material 12 orthogonal to the laminated surface of the acoustic matching layer 16, and the signal line 18 and the ground line 20 are connected to each signal electrode and the ground electrode. Yes. At this time, when a predetermined voltage is applied between the signal line 18 and the ground line 20, the piezoelectric material 12 vibrates in the X direction of FIG. 9, but simultaneously vibrates in the Z direction. The vibration in the Z direction is generated by a so-called X-direction lateral effect method, and an ultrasonic wave is generated by the vibration in the Z direction to emit a desired ultrasonic wave from the radiation surface of the ultrasonic probe.

  Also in the ultrasonic probe described with reference to FIG. 9, the backing layer 14 connected to the lower surface side of the piezoelectric material 12 is omitted, but the signal line 18 and the ground line 20 are backed from the side surface of the piezoelectric material 12. It penetrates through the layer 14 and extends to the back side of the ultrasonic probe 10. Therefore, the signal line 18 and the ground line 20 are not interposed between the bonding between the acoustic matching layer 16 and the piezoelectric material 12 and between the bonding between the piezoelectric material 12 and the backing layer 14. That is, the acoustic matching layer 16, the piezoelectric material 12, and the backing layer 14 can be directly joined. As a result, the acoustic matching layer 16 and the backing layer 14 can be firmly bonded to the piezoelectric material 12. In addition, since the signal line 18 and the ground line 20 do not exist in the ultrasonic radiation direction, the piezoelectric material 12 and the acoustic matching layer 16 can be coupled well, and the ultrasonic radiation performance is improved. Can be maintained.

  Further, as apparent from FIG. 9, the acoustic matching layer 16 laminated on the piezoelectric material 12 can be completely separated for each piezoelectric material 12 without being affected by the signal line 18 and the ground line 20. Even when arranged in a matrix as shown in FIG. 1, ultrasonic waves radiated from adjacent piezoelectric materials 12 can radiate ultrasonic waves from each piezoelectric material 12 in a desired direction without interfering with each other. it can. As a result, the directional characteristics as the ultrasonic probe 10 can be improved. Further, since the signal line 18 and the ground line 20 separated for each piezoelectric material 12 can be easily extended to the back surface side of the backing layer 14, the processing for each piezoelectric material 12 is facilitated. Since the control for each piezoelectric material 12 becomes easy, the degree of freedom in circuit design of the electric circuit connected to the piezoelectric material 12 is improved.

  In the configuration of FIG. 9, the ground line 20 can extend straight through the backing layer 14 and extend to the back surface side. That is, since the ground line 20 can be easily interposed between the signal lines 18, crosstalk between the signal lines 18 can be suppressed, and signal deterioration can be reduced. .

  FIG. 10 shows a schematic procedure of a manufacturing method of the lateral effect utilization type ultrasonic probe shown in FIG.

  As a first step, as shown in FIG. 10 (a), for example, electrodes such as barium titanate, PZT, lead titanate and other plate-like piezoelectric materials 22 made of piezoelectric ceramics, etc. The signal electrode 18a and the ground electrode 20a are formed by a suitable material by any means such as vapor deposition, sputtering, and printing (electrode formation step).

  Next, as shown in FIG. 10B, the plate-shaped piezoelectric material 22 is cut into strip-shaped piezoelectric material 22a having a desired size. The width of this strip is the width of the vibrator (vibration element). When the lateral effect is used, each electrode is disposed on both side surfaces of the piezoelectric material 22a, so that the contact between the signal electrode and the ground line does not occur. Therefore, it is not necessary to form the groove 24 as shown in FIG. In this state, as shown in FIG. 10C, a strip-shaped piezoelectric material 22a having a signal electrode 18a and a ground electrode 20a on the opposing surface is formed.

  Subsequently, the acoustic matching layer forming material 32 is poured into one side of the piezoelectric material 22a by the same procedure as that described with reference to FIGS. 3 (f), 4 (a), and 4 (b). The backing layer forming material 30 is poured onto the other side to form the backing layer 14. At this time, as described above, the thickness of the backing layer 14 is made thinner (for example, half the thickness) than the thickness of the piezoelectric material 22a. Further, it is preferable that the backing layer 14 is inclined so that the ground wire 20 can be fixed without bending. FIG. 10D shows a side view of the piezoelectric material 22 a having the acoustic matching layer 16 and the backing layer 14, that is, the composite 60. Subsequently, as shown in FIG. 10E, the ground line 20 is formed on one surface side of the composite 60 (for example, the side where the backing layer 14 is thinned) so as to contact the ground electrode 20a. Further, the signal line 18 in contact with the signal electrode 18 a is formed on the other surface side of the composite body 60. The ground line 20 and the signal line 18 can be easily formed by, for example, vapor deposition or sputtering. A cross-sectional view of a wiring complex 62 in which the ground wire 20 and the signal line 18 are formed on the complex 60 is shown in FIG. As apparent from FIG. 10 (e), the signal electrode 18a and the ground line 20 are not in contact at all, so the offset groove 24a as shown in FIG. 3 (c) is not necessary. Even in a structure using the lateral effect, it is possible to further suppress electrical crosstalk by forming a thin portion in the backing layer 14 and forming a thick portion in the spacer 38. Needless to say, the backing layer 14 and the spacer 38 may each have a uniform thickness.

  As described above, in the case of the lateral effect type ultrasonic transducer, the signal electrode and the ground electrode are not interposed between the bonding of the acoustic matching layer 16 and the piezoelectric material 12 and between the bonding of the piezoelectric material 12 and the backing layer 14. That is, the acoustic matching layer 16, the piezoelectric material 12, and the backing layer 14 can be directly joined, and can be firmly joined to the piezoelectric material 22 a when the acoustic matching layer 16 and the backing layer 14 are cured.

  The wiring complex 62 formed as described above is arranged via the spacers 38 as shown in FIG. 5A to form a block body. 5B to 5D, the ultrasonic wave transmitting / receiving surfaces of all the piezoelectric materials 12 formed of vibrators that can be individually controlled by the signal line 18 and the ground line 20 by performing dicing in a matrix form. Are arranged in the same direction, and a matrix-like ultrasonic probe having a convex step arrangement in the arrangement direction is created.

  In addition, by using the wiring complex 62 formed in the same manner and manufacturing in the procedure of FIGS. 7A to 7D, FIGS. It is possible to obtain a pyramid type ultrasonic probe 58 in which the ultrasonic wave transmitting / receiving surface of the piezoelectric material 12 is directed in the same direction and is provided with a convex step arrangement with respect to the arrangement direction.

  By the way, in the above-described ultrasonic probe manufacturing method (the one using the vertical effect and the one using the horizontal effect), various additional effects can be obtained by changing only part of the manufacturing process. For example, the acoustic matching layer 16 connected to the upper surface side of the piezoelectric material 22a changes the acoustic characteristics of the ultrasonic wave depending on the thickness in the stacking direction. Therefore, the thickness of the acoustic matching layer 16 needs to be set accurately, and it is desirable that the thickness of the acoustic matching layer 16 can be selected and adjusted arbitrarily and easily according to the characteristics of the ultrasonic probe to be manufactured. Therefore, as shown in FIG. 11 (a), the acoustic matching layer 16 is formed in advance thickly (for example, thickness t), and is cut into a thickness t0 as necessary as shown in FIG. 11 (b). By doing so, a composite having desired acoustic characteristics can be easily formed.

  FIG. 12 shows an application example of the above-described embodiment to the lateral effect, that is, an application example of a structure in which the signal line 18 and the ground line 20 are formed on the side surface facing the direction orthogonal to the ultrasonic radiation direction of the piezoelectric material 12. Is shown. In FIG. 12, the backing layer 14 is not shown. FIG. 12 illustrates only one transducer (vibration element) 64 after being divided in the actual ultrasonic probe 10.

  The structure shown in FIG. 12 has a half thickness T0 of the piezoelectric material 66 (for example, the same thickness as the piezoelectric material 12 (22a) described in FIG. 9, FIG. 10, etc.). Two piezoelectric materials 66 having a thickness (T1) are bonded together.

  The piezoelectric material 66 forms the signal line 18 and the ground line 20 on the side surface facing the direction orthogonal to the ultrasonic radiation direction according to the procedure described in FIG. In FIG. 12, the shape after separation into the individual piezoelectric members 66 is illustrated. However, in the actual manufacturing process, a plate having a thickness T1 is formed by the procedure shown in FIG. The state separated by dicing in the process is shown in FIG.

  The signal line 18 and the ground line 20 connected to the piezoelectric material 66 are, for example, a sheet-like wiring material pasted or a pattern printed on a composite in which a gold material is formed with a thickness T1 that is ½ of a desired thickness T0. It is formed by vapor deposition or sputtering. Subsequently, as shown in FIG. 12, the two wiring composites on which the signal line 18 and the ground line 20 are formed are face-to-face joined so that the signal lines 18 are in contact with each other. The joining method at this time is arbitrary. For example, the bonding surface of the two wiring composites to be bonded is not completely flat. For example, an epoxy conductive adhesive or the like is used to bond the two to make electrical contact. obtain.

  With such a structure, the impedance related to each piezoelectric material 66 sandwiched between the signal line 18 and the ground line 20 is ½ that of the thickness T0. When two piezoelectric materials sandwiched between the signal line 18 and the ground line 20 are stacked to have a thickness T0, the total impedance is obtained by sandwiching the piezoelectric material having the thickness T0 between the signal line 18 and the ground line 20. 1/4 of the thing. That is, when a wiring complex having a piezoelectric material with a thickness T0 is formed, it is possible to improve electrical characteristics and to form a high-performance ultrasonic probe.

  In the multilayer type wiring composite formed as described above, the block body is formed according to the procedure similar to the procedure shown in FIGS. 3 to 5 and then dicing is performed, so that the ultrasonic wave transmitting / receiving surfaces of all the piezoelectric materials 66 are formed. The ultrasonic probe 10 is completed, which faces the same direction and is provided with a convex step arrangement in the arrangement direction. The lead-out of the ground line 20 may be individually extended to the back side of the backing layer 14 or may be extended as a common ground line.

  In FIG. 12, the acoustic matching layer 16 may be formed at the same time when the backing layer is formed on the piezoelectric material 66, or may be laminated on the piezoelectric material 66 after the two piezoelectric materials 66 are laminated. Good. In the case of retrofitting, since the shape accuracy of the acoustic matching layer 16 is easily obtained, it is suitable for improving the overall accuracy of the ultrasonic probe 10. On the other hand, in the case of tipping, the manufacturing process is simplified, which is suitable for improving manufacturing efficiency. Therefore, it is preferable to appropriately select the order in which the acoustic matching layer 16 is formed.

  In the embodiment described above, the example in which the acoustic matching layer 16 and the backing layer 14 are bonded to the upper and lower surfaces of the piezoelectric material 22a using the mold 23 has been described. For example, the piezoelectric layer disposed on the surface plate is used. The acoustic matching layer forming material 32 and the backing layer forming material 30 may be arbitrarily poured on the upper and lower surfaces of the material 22a, and after curing, the acoustic matching layer 16 and the backing layer 14 may be formed by cutting or the like. Of course, this structure can be applied to an ultrasonic probe using a lateral effect, and the same effect can be obtained.

  Further, in the present embodiment, the radiation of ultrasonic waves is described. However, the ultrasonic probe 10 of the present embodiment can be used for reception of ultrasonic waves and for both transmission and reception, and the same effect. Can be obtained.

  In this embodiment, a 1D array in which piezoelectric materials (vibrators) are arranged one-dimensionally has been described. A two-dimensional array of 2D arrays has been described, but a so-called 1.5D array in which a direction orthogonal to the arrangement direction of the 1D array is divided into several parts. A type of ultrasonic transducer can be manufactured in the same manner, and the same effect can be obtained.

It is a structure conceptual diagram of the ultrasonic probe concerning the embodiment of the present invention. FIG. 2 is an explanatory diagram illustrating details of a signal line and a ground line connected to a side surface of a piezoelectric material in the ultrasonic probe of FIG. 1. It is explanatory drawing explaining the first stage of the manufacturing procedure of the ultrasonic probe which concerns on embodiment of this invention. It is explanatory drawing explaining the middle stage of the manufacture procedure of the ultrasonic probe which concerns on embodiment of this invention. It is explanatory drawing explaining the last stage of the manufacturing procedure of the ultrasonic probe which concerns on embodiment of this invention. It is explanatory drawing explaining the state which is diagnosing the heart from the intercostal space using the ultrasonic probe which concerns on embodiment of this invention. It is explanatory drawing explaining the first half of the manufacturing procedure of the ultrasonic probe of another shape which concerns on embodiment of this invention. It is explanatory drawing explaining the second half of the manufacturing procedure of the ultrasonic probe of another shape which concerns on embodiment of this invention. In the ultrasonic probe which concerns on embodiment of this invention, it is explanatory drawing explaining the detail of the signal wire | line connected to the side surface of the piezoelectric material using a lateral effect, and a ground line. It is explanatory drawing explaining the outline of the manufacturing procedure of the ultrasonic probe using the piezoelectric material shown in FIG. It is explanatory drawing explaining the method to adjust the thickness of the acoustic matching layer in the manufacture process of the ultrasonic probe which concerns on embodiment of this invention. It is explanatory drawing explaining the example of an applied structure of the ultrasonic probe which concerns on embodiment of this invention. It is explanatory drawing explaining the state which is diagnosing the heart from the intercostal space using the conventional ultrasonic probe.

Explanation of symbols

  10, 58 ultrasonic probe, 12, 22a, 66 piezoelectric material, 14 backing layer, 16 acoustic matching layer, 18 signal line, 18a signal electrode, 20 ground line, 20a ground electrode, 22 piezoelectric material, 23 mold, 24 groove, 24a offset groove, 26 holding portion, 28 recess, 30 backing layer forming material, 32 acoustic matching layer forming material, 34, 60 composite, 36, 48, 62 wiring composite, 38, 50 spacer, 40, 52 Block body, 42, 44 groove, 46 vibrator, 64 vibrator, 102 heart, 104 rib.

Claims (6)

A vibrator formed by arranging a plurality of piezoelectric materials that generate ultrasonic waves, an acoustic matching layer laminated on one side of the vibrator, and a backing layer laminated on the opposite side of the acoustic matching layer with the vibrator interposed therebetween. An ultrasonic probe comprising:
The piezoelectric material that constitutes the vibrator has its ultrasonic transmission / reception surface oriented in the same direction as the ultrasonic transmission / reception surface of the piezoelectric material at the center of the arrangement, and is arranged stepwise in a convex shape with respect to the arrangement direction ,
Each piezoelectric material constituting the vibrator individually forms a composite including an acoustic matching layer and a backing layer, and the composite is arranged in steps in a convex shape in the arrangement direction,
The composite is a plate-like composite including a strip-shaped piezoelectric material, and a plurality of the plate-like composites and spacers having a predetermined thickness are alternately arranged in the thickness direction, and the plate-like composite has a thickness thereof. Steps are arranged in a convex shape in the direction,
An ultrasonic probe characterized by that. The ultrasonic probe according to claim 1,
An ultrasonic probe, wherein the plate-like composite is separated into a plurality of parts in a direction perpendicular to the thickness direction to form a two-dimensional array. The ultrasonic probe according to claim 1,
An ultrasonic probe characterized in that the complex is arranged in a convex shape in two directions orthogonal to an ultrasonic wave transmitting / receiving surface to form a cone-shaped two-dimensional array having a substantially central portion at the top. Forming a piezoelectric material having electrodes on opposing surfaces;
Pouring a fluid acoustic matching layer forming material on one side with a piezoelectric material in between, pouring a fluid backing layer forming material on the other side, and curing each to form a composite;
A lead wire is connected to the electrodes exposed on the front and back surfaces of the composite, and the open end side of the lead is extended in the direction away from the piezoelectric material along the backing layer to form a wiring composite. And steps to
A step of alternately arranging a plurality of the wiring composites and spacers having a predetermined thickness, wherein the ultrasonic transmission / reception surface of the piezoelectric material constituting the wiring composite is an ultrasonic transmission / reception surface of the piezoelectric material at a substantially center of the arrangement And arranging the steps in a convex manner with respect to the arrangement direction,
A method for manufacturing an ultrasonic probe, comprising: Forming a strip-shaped piezoelectric material having electrodes on the opposing surface;
Pouring a fluid acoustic matching layer forming material on one side with a piezoelectric material in between, pouring a fluid backing layer forming material on the other side, and curing each to form a plate-like composite;
Lead wires that can be separated into a plurality of predetermined pitches are connected to the electrodes exposed on the front and back surfaces of the plate-like composite, and separated from the piezoelectric material along the backing layer on which the open ends of the lead wires are formed. Extending in a direction to form a wiring complex;
The step of alternately arranging the wiring composite and the spacer having a predetermined thickness in the thickness direction, wherein the ultrasonic transmission / reception surface of the piezoelectric material constituting the composite is the ultrasonic transmission / reception of the piezoelectric material at the substantially center of the arrangement. Directing the same direction as the wavefront and forming a block body with a stepped arrangement in a convex shape with respect to the arrangement direction; and
A matrix-like groove is formed in a direction in which the upper portion of the spacer is removed from the acoustic matching layer side of the block body and a direction in which the strip-shaped piezoelectric material is separated into a plurality of strips, and the strip-shaped piezoelectric material corresponds to each lead line. Separating into individual elements;
A method for manufacturing an ultrasonic probe, comprising: Forming a strip-shaped piezoelectric material having electrodes on the opposing surface;
Pouring a fluid acoustic matching layer forming material on one side with a piezoelectric material in between, pouring a fluid backing layer forming material on the other side, and curing each to form a plate-like composite;
Lead wires that can be separated into a plurality of pitches at predetermined pitches are connected to the electrodes exposed on the front and back surfaces of the plate-like composite, and separated from the piezoelectric material along the backing layer on which the open ends of the lead wires are formed. Extending in a direction to form a wiring complex;
Laminating the wiring composite and a spacer having a predetermined thickness in the thickness direction, separating the plurality of wiring composites along the lead-out direction of the lead lines, and forming individual composites;
The individual composite is a step of alternately arranging a wiring composite portion and a spacer portion of the individual composite, wherein an ultrasonic wave transmitting / receiving surface of a piezoelectric material constituting the wiring composite is a piezoelectric at a substantially center of the arrangement. Directing the same direction as the ultrasonic transmission / reception surface of the material, and forming a plate-like wiring composite by arranging the steps in a convex shape with respect to the arrangement direction;
A step of alternately arranging the plate-like wiring composite and a spacer having a predetermined thickness in the thickness direction, wherein an ultrasonic wave transmitting / receiving surface of a piezoelectric material constituting the plate-like wiring composite is a piezoelectric at a substantially center of the arrangement; Directing the same direction as the ultrasonic transmission / reception surface of the material, and forming a block body by arranging a step in a convex shape with respect to the arrangement direction;
The upper part of the spacer existing around the individual composite is removed from the acoustic matching layer side of the block body to form a matrix-like groove, and the strip-shaped piezoelectric material is separated into individual elements corresponding to the lead lines. Steps,
A method for producing an ultrasonic probe, comprising:

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