JP4335781B2 - Exposure apparatus and exposure method - Google Patents

Description

  The present invention relates to an exposure apparatus and an exposure method that are suitably used when exposing an exposure layer formed on a substrate when manufacturing a liquid crystal display device or the like.

  Conventional exposure apparatuses are used, for example, in manufacturing processes of liquid crystal display devices, integrated circuits (abbreviation: IC), and large scale integration (abbreviation: LSI). The exposure apparatus is also used when forming a microlens array in order to improve the light utilization efficiency of the liquid crystal display element. A first conventional exposure apparatus 1 used for forming a microlens array is described in Patent Document 1. FIG. 28 is a diagram showing a simplified configuration of the exposure apparatus 1 of the first conventional technique. X, Y, and Z shown in the figure represent an X coordinate axis, a Y coordinate axis, and a Z coordinate axis, respectively, and are three-dimensional orthogonal coordinate axes. In the exposure apparatus 1, a liquid crystal display element in which a quartz thin plate glass 4 is bonded on a glass substrate 3 on which a first microlens array 2 is formed, and a resist is applied on the quartz thin plate glass 4 to form a resist layer 5. 6 is a predetermined two axes, for example, an axis extending along the X coordinate axis (hereinafter may be referred to as “X axis”) and an axis extending along the Y coordinate axis (hereinafter referred to as “Y axis”) Is mounted on a rotary stage (not shown) that can rotate around each axis. In the exposure apparatus 1, the tilt between the normal line of the glass substrate 3 constituting the liquid crystal display element 6 and the optical axis of the irradiation light 8 from the light source 7 can be freely changed by controlling the rotation angle of the rotation stage. Composed.

  In the exposure apparatus 1, the angle of incidence of the irradiation light 8 on the first microlens array 2 previously formed on the liquid crystal display element 6 is adjusted by rotating the liquid crystal display element 6 around two axes, for example, the X axis and the Y axis. The second microlens array having a desired shape can be formed by changing and exposing the resist layer 5 while controlling the incident angle and the exposure time at each incident angle.

  Further, in a conventional exposure apparatus used in a manufacturing process of a liquid crystal display device, a substrate to be exposed, for example, a glass substrate coated with a resist and an exposure mask substrate are arranged horizontally, and further described, the resist surface is horizontal. As described above, a so-called flat exposure method in which a glass substrate and an exposure mask substrate are arranged is used. In recent years, exposure mask substrates having relatively large dimensions have been used with the increase in size of glass substrates. However, when the exposure mask substrate is placed flat, the exposure mask substrate is bent by its own weight, and the exposure mask substrate There is a problem in that it is difficult to perform uniform exposure because the light intensity of the light irradiated to the central portion and the peripheral portion is different.

  A second prior art exposure apparatus 10 that solves the above-described problems is described in Patent Document 2. FIG. 29 is a diagram showing a simplified configuration of the exposure apparatus 10 of the second conventional technique. A vertical direction 17, a vertical direction 18, and a horizontal direction 19 shown in the figure constitute a three-dimensional orthogonal coordinate system. In the exposure apparatus 10 according to the second conventional technique, the substrate 12 is held upright by the substrate holder 11 so as to be parallel to the vertical direction 17, and the exposure mask substrate 14 is brought close to the substrate 12 and the mask holder. 13, the exposure mask substrate 14 is erected and held so as to be parallel to the substrate 12, thereby suppressing the deflection due to the weight of the exposure mask substrate 14 and the irradiation light 16 from the light source 15 on the surface of the substrate 12. On the other hand, exposure is performed by irradiating vertically.

JP 2003-294912 A JP-A-1-181420

  In a conventional exposure apparatus, in order to improve productivity, a substrate on which a large number of liquid crystal display elements are arranged is used, and the size of the substrate is increased. Therefore, in such an exposure apparatus that exposes a large substrate in a flat position, the substrate is bent due to its own weight, and there is a difference in the light intensity of light irradiated to the central portion and the peripheral portion of the substrate, respectively. Therefore, there is a problem that it is difficult to perform uniform exposure.

  Further, in the exposure apparatus 10 of the second conventional technique described above, the exposure mask substrate 14 is vertically moved by the mask holder 13 in order to suppress the bending generated in the exposure mask substrate by its own weight as in the first conventional technique. Although the exposure is performed while being held upright so as to be parallel to the direction 17, the direction 18 and the direction perpendicular to the vertical paper plane orthogonal to each other on a virtual plane parallel to the vertical direction 17. When the substrate 12 and the exposure mask substrate 14 are rotated about axes extending in the direction 19, the surface of the substrate 12 and the surface of the exposure mask substrate 14 are not parallel to the vertical direction 17. The exposure mask substrate 14 is bent. Accordingly, since the incident angles of the irradiation light incident on the central portion and the peripheral portion of the substrate 12 and the exposure mask substrate 14 are different depending on the bending of the substrate 12 and the exposure mask substrate 14, the central portion of the substrate 12 and the exposure mask substrate 14, respectively. There is a problem in that it is difficult to perform uniform exposure due to a difference in the light intensity of the irradiation light irradiated to the peripheral portion and the peripheral portion.

  In the exposure apparatus 1 according to the first conventional technique, a quartz thin plate glass 4 is bonded on the glass substrate 3 on which the first microlens array 2 is formed, and a resist is applied on the quartz thin plate glass 4. The formed resist layer 5 is exposed. As described above, the resist layer 5 to be exposed is formed on the side from which the light emitted from the light source 7 is emitted. When exposure is performed with the surface of the resist layer 5 in contact with the rotary stage, the resist layer 5 is exposed. Depending on the pressure applied to the surface, the thickness dimension of the resist layer 5 may vary, or dust may be buried in the resist layer 5. When dust is buried in the resist layer 5, the irradiation light 8 from the light source 7 is blocked by the buried dust, resulting in poor exposure. Further, after the irradiation light 8 from the light source 7 is transmitted through the resist layer 5 and emitted from the resist layer 5, the emitted light is reflected by another member and exposed to the resist layer 5 again, and has a desired shape. There is a problem that a microlens array cannot be formed.

  An object of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of bending of a substrate and can reduce non-uniform exposure as much as possible.

The present invention holds a peripheral portion of a substrate on which an exposure layer is formed by applying a material to be exposed, and holds the substrate substantially vertically; and
A substrate-side drive unit that rotates the holding unit around a predetermined substrate-side axis while maintaining the substrate substantially vertical;
A light irradiation unit for irradiating light to the exposure layer of the substrate held by the holding unit;
A light source drive unit that rotates the light irradiation unit around a predetermined light source side axis ,
In relation to the rotation operation of the holding unit by the substrate side driving unit, the light irradiation unit is rotated by the light source side driving unit, and the optical axis of the light irradiated by the light irradiation unit and the exposure layer An exposure apparatus that exposes the exposure layer while relatively changing an angle with an exposure surface.

  Further, according to the present invention, the predetermined substrate side axis of the substrate side drive unit includes an incident side surface on which light from the light irradiation unit of the substrate held by the holding unit is incident, and exposure formed on the substrate. It is characterized by being disposed between the incident side surface of the layer from which the incident light exits.

Further, according to the present invention, the predetermined light source side axis of the light source side driving unit includes an incident side surface on which light from the light irradiation unit of the substrate held by the holding unit is incident, and exposure formed on the substrate. It is characterized by being disposed between the incident side surface of the layer from which the incident light exits.
In the invention, it is preferable that the holding unit further includes a mask holding unit that holds a mask substrate on which a light transmission pattern to transmit light is formed substantially vertically.
In the present invention, the substrate-side axis of the substrate-side drive unit is disposed closer to the light irradiation unit than the substrate, and light from the light irradiation unit of the mask substrate held by the mask holding unit is incident thereon. It is arranged between the incident side surface and the exit side surface from which the incident light of the mask substrate exits.
In the present invention, the light source side axis of the light source side drive unit is disposed closer to the light irradiation unit than the substrate, and light from the light irradiation unit of the mask substrate held by the mask holding unit is incident thereon. It is arranged between the incident side surface and the exit side surface from which the incident light of the mask substrate exits.

The present invention also includes a holding unit that holds the substrate substantially vertically by gripping a peripheral portion of the substrate on which an exposure layer is formed by applying a material to be exposed.
A substrate-side drive unit that rotates the holding unit around a predetermined substrate-side axis while maintaining the substrate substantially vertical;
A light irradiation unit for irradiating light to the exposure layer of the substrate held by the holding unit;
A light reflecting portion interposed between the light irradiating portion and the substrate;
And a light reflecting side driving portion for rotating the light reflecting portion seen including,
In relation to the rotation operation of the holding unit by the substrate side drive unit, the light reflection unit is rotated by the light reflection side drive unit, and the optical axis of the light irradiated by the light irradiation unit and the exposure layer An exposure apparatus that exposes the exposure layer while relatively changing an angle with respect to the exposure surface.

  In the invention, it is preferable that the holding unit further includes a mask holding unit that holds a mask substrate on which a light transmission pattern to transmit light is formed substantially vertically.

  In the present invention, the substrate-side axis of the substrate-side drive unit is disposed closer to the light irradiation unit than the substrate, and light from the light irradiation unit of the mask substrate held by the mask holding unit is incident thereon. It is arranged between the incident side surface and the exit side surface from which the incident light of the mask substrate exits.

The present invention also includes a holding unit that holds the substrate substantially vertically by gripping a peripheral portion of the substrate on which an exposure layer is formed by applying a material to be exposed.
The holding portion, while maintaining the substrate substantially vertically, within the rotatable virtual plane around the rotation axis predetermined perpendicular to the thickness direction of the substrate, and the substrate-side drive section which moves in parallel,
A light irradiation unit for irradiating light to the exposure layer of the substrate held by the holding unit;
A light source drive unit that rotates the light irradiation unit around a predetermined light source side axis ,
In relation to the parallel movement operation of the holding unit by the substrate side driving unit, the light irradiation unit rotates by the light source side driving unit, and the optical axis of the light irradiated by the light irradiation unit and the exposure layer An exposure apparatus that exposes the exposure layer while relatively changing an angle with an exposure surface.

  Further, according to the present invention, the predetermined light source side axis of the light source side driving unit includes an incident side surface on which light from the light irradiation unit of the substrate held by the holding unit is incident, and exposure formed on the substrate. It is characterized by being disposed between the incident side surface of the layer from which the incident light exits.

The present invention also includes a holding unit that holds the substrate substantially vertically by gripping a peripheral portion of the substrate on which an exposure layer is formed by applying a material to be exposed.
A substrate-side drive unit that moves the holding unit in parallel in a virtual plane that is perpendicular to the thickness direction of the substrate and is rotatable about a predetermined rotation axis while maintaining the substrate substantially vertical;
A light irradiation unit for irradiating light to the exposure layer of the substrate held by the holding unit;
A light reflecting portion interposed between the light irradiating portion and the substrate;
And a light reflecting side driving portion for rotating the light reflecting portion seen including,
In relation to the parallel movement operation of the holding unit by the substrate side driving unit, the light reflecting unit is rotated by the light reflecting side driving unit, and the optical axis of the light irradiated by the light irradiation unit and the exposure layer An exposure apparatus that exposes the exposure layer while relatively changing an angle with respect to the exposure surface.

  In the invention, it is preferable that the holding unit further includes a mask holding unit that holds a mask substrate on which a light transmission pattern to transmit light is formed substantially vertically.

  Further, the invention is characterized in that the moving speed of the holding part by the substrate side driving part is constant.

  Further, the invention is characterized in that the region facing the surface on the side from which the irradiation light from the light irradiation unit is emitted is a space.

  According to the present invention, the substrate side drive unit applies the transported material to be exposed to hold the substrate on which the exposure layer is formed, and carries out the substrate on which the exposure layer is exposed. Features.

In the present invention, the substrate on which the exposure layer is formed by applying the material to be exposed is held substantially vertically with the peripheral edge held by the holding portion,
The holding portion is rotated around a predetermined substrate-side axis while maintaining the substrate substantially vertical,
In relation to the rotation operation of the holding unit around the predetermined substrate side axis, the light irradiation unit for irradiating the exposure layer with light is rotated around the predetermined light source side axis by the light source side driving unit, and the holding is performed. In the exposure method, the exposure layer is exposed while relatively changing an angle between an optical axis of light applied to the exposure layer of the substrate held by the unit and an exposure surface of the exposure layer.

In the present invention, the substrate on which the exposure layer is formed by applying the material to be exposed is held substantially vertically with the peripheral edge held by the holding portion,
The holding portion is rotated around a predetermined substrate-side axis while maintaining the substrate substantially vertical,
In relation to the rotation operation of the holding unit around the predetermined substrate-side axis, the light reflecting unit interposed between the light irradiation unit and the substrate is rotated, and the substrate held by the holding unit is rotated. In the exposure method, the exposure layer is exposed while relatively changing an angle between an optical axis of light applied to the exposure layer and an exposure surface of the exposure layer.

In the present invention, the substrate on which the exposure layer is formed by applying the material to be exposed is held substantially vertically with the peripheral edge held by the holding portion,
Wherein the holding portion, while maintaining the substrate substantially vertically, in a rotatable imaginary plane around the rotation axis predetermined perpendicular to the thickness direction of the substrate, moving in parallel,
In relation to the parallel movement operation of the holding unit, a light irradiation unit for irradiating the exposure layer with light is rotated around a predetermined light source side axis by a light source side driving unit, and the substrate held by the holding unit is rotated . In the exposure method, the exposure layer is exposed while relatively changing an angle between an optical axis of light applied to the exposure layer and an exposure surface of the exposure layer.

In the present invention, the substrate on which the exposure layer is formed by applying the material to be exposed is held substantially vertically with the peripheral edge held by the holding portion,
The holding unit is moved in parallel in a virtual plane that is perpendicular to the thickness direction of the substrate and is rotatable about a predetermined rotation axis while maintaining the substrate substantially vertical.
In relation to the parallel movement operation of the holding unit, the light reflecting unit interposed between the light irradiation unit and the substrate is rotated to irradiate the exposure layer of the substrate held by the holding unit. In the exposure method, the exposure layer is exposed while relatively changing an angle between an optical axis of light and an exposure surface of the exposure layer.

  According to the present invention, the holding unit holds a mask substrate on which a light transmission pattern to transmit light is formed, and enters the mask substrate and irradiates the exposure layer with the optical axis of the light and the exposure layer. The exposure layer is exposed while relatively changing an angle with the exposure surface.

  In the invention, it is preferable that the moving speed of the holding unit by the substrate side driving unit is constant.

  In the exposure apparatus and exposure method of the present invention, the substrate on which the exposure layer is formed by applying the material to be exposed is held substantially vertically with the peripheral edge held by the holding part, and the holding part is The substrate is rotated around a predetermined substrate side axis while maintaining the substrate substantially vertical. Here, holding the substrate substantially vertical means a state in which a surface perpendicular to the thickness direction of the substrate is arranged substantially vertically, and substantially vertical means a gravity direction including vertical. In relation to the rotation operation of the holding unit around a predetermined substrate-side axis by the substrate-side driving unit, the optical axis of the light applied to the exposure layer of the substrate held by the holding unit and the exposure of the exposure layer The exposure layer is exposed while the angle with the surface is changed relatively.

  As described above, the substrate on which the exposure layer is formed by applying the exposure material is held substantially vertically with the periphery held by the holding unit, and the holding unit holds the substrate by the substrate side driving unit. Since it is rotated around a predetermined substrate-side axis while being maintained substantially vertical, it is possible to prevent the substrate from being bent due to gravity acting on the substrate. Compared with the case where the substrate is horizontally arranged as in the prior art, the larger the area of the substrate, the more effectively the occurrence of bending of the substrate can be suppressed. Thereby, non-uniform exposure to the exposure layer formed on the substrate can be reduced as much as possible.

  The holding unit holds the substrate while holding the peripheral edge of the substrate. Further, when holding the exposure layer formed on the substrate, the holding unit holds the substrate while holding the exposure layer outside the region to be exposed. Therefore, the contact area between the holding portion and the substrate is small. As a result, it is possible to minimize the occurrence of fluctuations in the thickness dimension of the exposure layer as in the prior art and the dust being buried in the exposure layer.

  Further, since the substrate is configured to be held in a state where the peripheral portion of the substrate is gripped, the configuration in which the holding unit and the substrate side driving unit are separated from the peripheral portion of the substrate to the outer edge, and the light irradiation unit It can be set as the structure spaced apart in the emission direction from the board | substrate of the irradiated light. Therefore, the reflection of light from the light irradiation unit by the holding unit and the substrate side driving unit is reduced, and the exposure layer formed on the substrate is irradiated with the reflected light and exposed again, for example, non-occurrence. A microlens having a desired shape can be prevented from being formed. In other words, a microlens having a desired shape can be formed.

  Further, in the exposure apparatus and exposure method of the present invention, a light irradiating unit for irradiating light to the exposure layer formed on the substrate in relation to the rotation operation around the predetermined substrate side axis of the holding unit by the substrate side driving unit. The light source side drive unit is rotated around a predetermined light source side axis, and the angle between the optical axis of the light applied to the exposure layer of the substrate held by the holding unit and the exposure surface of the exposure layer is relatively changed. Then, the exposure layer is exposed.

  As described above, the rotation operation around the predetermined light source side axis of the light irradiation unit by the light source side driving unit is performed in relation to the rotation operation around the predetermined substrate side axis of the holding unit by the substrate side driving unit. The amount of rotation of each of the holding unit and the light irradiation unit can be reduced, and a required amount of movement of the substrate with respect to the optical axis of the light irradiated from the light irradiation unit can be ensured. Therefore, it is possible to reduce the bending of the substrate by reducing loads such as gravity and inertial force acting on the substrate.

  Further, since the light source side driving unit rotates the light irradiation unit around a predetermined light source side axis in relation to the rotation operation of the holding unit by the substrate side driving unit, the moving speed and the moving amount of the holding unit are reduced. be able to. As a result, the occupied space in which the exposure apparatus is installed can be reduced, so that the equipment cost can be reduced and the exposure apparatus can be miniaturized.

  According to the invention, the predetermined substrate-side axis of the substrate-side drive unit includes the incident-side surface on which light from the light irradiation unit of the substrate held by the holding unit is incident, and the exposure layer formed on the substrate The incident light is disposed between the light-exiting side surface from which the incident light is emitted. When the substrate-side axis is disposed at the aforementioned position, the substrate-side axis is perpendicular to the thickness direction of the substrate and the direction in which the predetermined axis of the substrate driving unit extends, as compared with the case where the substrate-side axis is disposed at other than the aforementioned position. The amount of movement of the substrate in a certain direction (hereinafter sometimes simply referred to as “the width direction of the substrate”) can be reduced.

  Thereby, a configuration for reliably irradiating light on an area to be exposed of the substrate, for example, a configuration for moving the light irradiation unit in accordance with a rotation operation around a predetermined substrate-side axis of the substrate held by the holding unit. It is not necessary, and it is not necessary to configure the light irradiation unit to be relatively large in order to increase the exposure range in accordance with the movement range in the width direction of the substrate. Therefore, the configuration of the light irradiation unit can be reduced as compared with the case where the substrate-side axis is disposed at a position other than the above-described position. In addition, since the light irradiation unit can be reduced in size, power consumption in the light irradiation unit can be reduced, and power saving can be achieved. Therefore, it is possible to reduce the manufacturing cost required when manufacturing the microlens by exposing the exposure layer formed on the substrate.

  Further, according to the present invention, the predetermined light source side axis of the light source side driving unit includes the incident side surface on which light from the light irradiation unit of the substrate held by the holding unit is incident, and the exposure layer formed on the substrate The incident light is disposed between the light-exiting side surface from which the incident light is emitted. When the substrate is fixed at a predetermined position and the light irradiating unit is rotated around the light source side axis, if the light source side axis is disposed at a position other than the aforementioned position, for example, the substrate in the region to be exposed of the substrate In some cases, it is impossible to irradiate light to one end in the width direction or the other end in the width direction.

  Therefore, in the case where the light source side axis is disposed at a position other than the above-described position, the light irradiation unit must be configured to be relatively large in order to reliably irradiate the region to be exposed on the substrate. On the other hand, when the light source side axis is disposed at the above-described position, light can be reliably irradiated to the region to be exposed on the substrate, and therefore, the light source side axis is disposed at a position other than the above position. Compared with the case, the structure of a light irradiation part can be reduced in size. In addition, by reducing the size of the light irradiation unit, power consumption in the light irradiation unit can be reduced, and power saving can be achieved. Therefore, it is possible to reduce the manufacturing cost required when manufacturing the microlens by exposing the exposure layer formed on the substrate.

  Further, in the exposure apparatus and exposure method of the present invention, the light reflecting portion is rotated by the light reflecting side driving portion in association with the rotation operation around the predetermined substrate side axis of the holding portion by the substrate side driving portion. Thus, the exposure layer is exposed while relatively changing the angle between the optical axis of the light applied to the exposure layer by the light irradiation unit and the exposure surface of the exposure layer. By rotating the light reflecting part that is relatively lighter than the light irradiating part by the light reflecting side driving part, the light reflecting part can be rotated with a relatively smaller driving force than when the light irradiating part is rotated. it can. Therefore, the rated output of the light reflection side drive unit that rotates the light reflection unit can be made smaller than the rated output of the drive unit that rotates the light irradiation unit. As a result, the manufacturing cost of the exposure apparatus can be reduced and the exposure apparatus can be made smaller than when the light irradiation unit is rotated.

  In the exposure apparatus and exposure method of the present invention, the mask substrate on which the light transmission pattern to transmit light is formed is held substantially vertically by the mask holding unit. Here, holding the mask substrate substantially vertically means a state in which a surface perpendicular to the thickness direction of the mask substrate is arranged substantially vertically, and the substantially vertical means a gravity direction including the vertical. Therefore, it is possible to suppress the bending of the mask substrate due to the gravity acting on the mask substrate. As the area of the mask substrate becomes larger as compared with the case where the mask substrate is horizontally arranged as in the prior art, the occurrence of bending of the mask substrate can be effectively suppressed. Thereby, non-uniform exposure to the exposure layer formed on the substrate can be reduced as much as possible.

  According to the invention, the predetermined substrate-side axis of the substrate-side drive unit is disposed closer to the light irradiation unit than the substrate, and light from the light irradiation unit of the mask substrate held by the mask holding unit is It is arranged between the incident side surface that is incident and the emission side surface from which the incident light of the mask substrate is emitted. When the substrate-side axis of the substrate-side drive unit is disposed at the aforementioned position, the substrate thickness direction and the substrate drive are compared to when the substrate-side axis of the substrate-side drive unit is disposed at a position other than the aforementioned position. It is possible to reduce the amount of movement of the substrate in a direction perpendicular to the direction in which the predetermined substrate-side axis of the portion extends (hereinafter, simply referred to as “substrate width direction”).

  Accordingly, the light irradiating unit is moved in accordance with the rotation operation around the predetermined substrate side axis of the substrate held by the holding unit, for example, a structure for irradiating light to the area of the mask substrate where light should be irradiated. There is no need for such a configuration, and it is not necessary to configure the light irradiation unit to be relatively large in order to increase the exposure range in accordance with the movement range of the mask substrate in the width direction. Therefore, the configuration of the light irradiation unit can be reduced as compared with the case where the substrate-side axis is disposed at a position other than the above-described position. In addition, since the light irradiation unit can be reduced in size, power consumption in the light irradiation unit can be reduced, and power saving can be achieved. Therefore, it is possible to reduce the manufacturing cost required when manufacturing the microlens by exposing the exposure layer formed on the substrate.

  According to the invention, the predetermined light source side axis of the light source side drive unit is disposed closer to the light irradiation unit than the substrate, and light from the light irradiation unit of the mask substrate held by the mask holding unit is received. It is arranged between the incident side surface that is incident and the emission side surface from which the incident light of the mask substrate is emitted. When the substrate and the mask substrate are fixed at predetermined positions and the light irradiation unit is rotated around the light source side axis, if the light source side axis of the light source side drive unit is disposed at a position other than the above-described position, Of the region to be irradiated with light, for example, there may be a case where light cannot be irradiated to one end in the width direction or the other end in the width direction of the mask substrate.

  Therefore, when the light source side axis of the light source side drive unit is disposed at a position other than the above-described position, the light irradiation unit is relatively large in order to reliably irradiate the region of the mask substrate where the light is to be irradiated. Must be configured. On the other hand, when the light source side axis of the light source side driving unit is disposed at the above-described position, the light source side axis can be reliably irradiated to the region to be irradiated with light on the mask substrate. Compared with the case where it is arrange | positioned except the position of this, the structure of a light irradiation part can be reduced in size. In addition, by reducing the size of the light irradiation unit, power consumption in the light irradiation unit can be reduced, and power saving can be achieved. Therefore, it is possible to reduce the manufacturing cost required when manufacturing the microlens by exposing the exposure layer formed on the substrate.

Further, in the exposure apparatus and exposure method of the present invention, a substrate on which an exposure layer is formed by applying a material to be exposed is held substantially vertically with its peripheral edge held by a holding part, and the holding part is In a state where the substrate is maintained substantially vertical, the substrate moves in parallel in a virtual plane that is perpendicular to the thickness direction of the substrate and is rotatable about a predetermined rotation axis , and specifically, the holding portion is moved to the virtual plane. Move parallel to Here, holding the substrate substantially vertical means a state in which a surface perpendicular to the thickness direction of the substrate is arranged substantially vertically, and substantially vertical means a gravity direction including vertical. In relation to the parallel movement operation of the holding unit by the substrate side driving unit, the angle of the optical axis of the light irradiated to the exposure layer of the substrate by the light irradiation unit and the exposure surface of the exposure layer is relatively changed. Then, the exposed layer is exposed.

Thus, when the angle between the optical axis of the light irradiated to the exposure layer of the substrate by the light irradiation unit and the exposure surface of the exposure layer is relatively changed, the holding unit is while maintaining the substrate substantially vertically, can be moved in parallel with rotatable imaginary plane around the rotation axis predetermined perpendicular to the thickness direction of the substrate, it is irradiated on the exposure layer The degree of freedom in designing an exposure apparatus that changes the angle between the optical axis of light and the exposure surface of the exposure layer can be increased. Further, as described above, since the holding portion can be moved in parallel in a virtual plane that is perpendicular to the thickness direction of the substrate and is rotatable around a predetermined rotation axis , the substrate is bent by the gravity acting on the substrate. Can be suppressed.

Further, the substrate on which the exposure layer is formed by applying the exposure material is held substantially vertically with the peripheral edge held by the holding unit, and the holding unit holds the substrate substantially vertically by the substrate side driving unit. In this state, the substrate is moved in parallel in a virtual plane that is perpendicular to the thickness direction of the substrate and can be rotated around a predetermined rotation axis, thereby suppressing the occurrence of bending of the substrate due to gravity acting on the substrate. be able to. Compared with the case where the substrate is horizontally arranged as in the prior art, the larger the area of the substrate, the more effectively the occurrence of bending of the substrate can be suppressed. Thereby, non-uniform exposure to the exposure layer formed on the substrate can be reduced as much as possible.

  The holding unit holds the substrate while holding the peripheral edge of the substrate. Further, when holding the exposure layer formed on the substrate, the holding unit holds the substrate while holding the exposure layer outside the region to be exposed. Therefore, the contact area between the holding portion and the substrate is small. As a result, it is possible to minimize the occurrence of fluctuations in the thickness dimension of the exposure layer as in the prior art and the dust being buried in the exposure layer.

  Moreover, since it is comprised so that the board | substrate may be hold | maintained in the state which hold | gripped the peripheral part of the board | substrate, the holding | maintenance part and the board | substrate side drive part are from the board | substrate of the light irradiated by the said light irradiation part rather than the peripheral part of a board | substrate. It can be set as the structure spaced apart in the output direction. Therefore, the reflection of light from the light irradiation unit by the holding unit and the substrate side driving unit is reduced, and the exposure layer formed on the substrate is irradiated with the reflected light and exposed again, for example, non-occurrence. A microlens having a desired shape can be prevented from being formed. In other words, a microlens having a desired shape can be formed.

  Further, in the exposure apparatus and exposure method of the present invention, the light irradiation unit for irradiating light to the exposure layer formed on the substrate is previously set by the light source side driving unit in relation to the parallel movement operation of the holding unit by the substrate side driving unit. The exposure layer is exposed to light while rotating around a predetermined light source side axis and relatively changing the angle between the optical axis of the light applied to the exposure layer of the substrate held by the holding unit and the exposure surface of the exposure layer. To do. Therefore, the moving speed and moving amount of the holding unit can be reduced. As a result, the occupied space in which the exposure apparatus is installed can be reduced, so that the equipment cost can be reduced. At the same time, the size of the exposure apparatus can be reduced.

  Further, according to the present invention, the predetermined light source side axis of the light source side driving unit includes the incident side surface on which light from the light irradiation unit of the substrate held by the holding unit is incident, and the exposure layer formed on the substrate The incident light is disposed between the light-exiting side surface from which the incident light is emitted. In relation to the parallel operation of the holding unit by the substrate driving unit, when the light irradiation unit is rotated around the light source side axis, if the light source side axis is disposed at a position other than the above-described position, Of these, for example, there may be a case where light cannot be irradiated to one end in the width direction or the other end in the width direction of the substrate.

  Therefore, in the case where the light source side axis is disposed at a position other than the above-described position, the light irradiation unit must be configured to be relatively large in order to reliably irradiate the region to be exposed on the substrate. On the other hand, when the light source side axis is disposed at the above-described position, light can be reliably irradiated to the region to be exposed on the substrate, and therefore, the light source side axis is disposed at a position other than the above position. Compared with the case, the structure of a light irradiation part can be reduced in size. In addition, by reducing the size of the light irradiation unit, power consumption in the light irradiation unit can be reduced, and power saving can be achieved. Therefore, it is possible to reduce the manufacturing cost required when manufacturing the microlens by exposing the exposure layer formed on the substrate.

  Further, in the exposure apparatus and the exposure method of the present invention, the light irradiating unit performs the rotating operation of the light reflecting unit by the light reflecting side driving unit in association with the parallel movement operation of the holding unit by the substrate side driving unit. The exposure layer is exposed while relatively changing the angle between the optical axis of the light applied to the exposure layer and the exposure surface of the exposure layer. By rotating the light reflecting part that is relatively lighter than the light irradiating part by the light reflecting side driving part, the light reflecting part can be rotated with a relatively smaller driving force than when the light irradiating part is rotated. it can. Therefore, the rated output of the light reflection side drive unit that rotates the light reflection unit can be made smaller than when the light irradiation unit is rotated. As a result, the light reflection side drive unit can be configured to be relatively smaller than the drive unit in the case of rotating the light irradiation unit, and the manufacturing cost of the exposure apparatus can be reduced.

  In the exposure apparatus and exposure method of the present invention, the mask substrate on which the light transmission pattern to transmit light is formed is held substantially vertically by the mask holding unit. Here, holding the mask substrate substantially vertically means a state in which a surface perpendicular to the thickness direction of the mask substrate is arranged substantially vertically, and the substantially vertical means a gravity direction including the vertical. Therefore, it is possible to suppress the bending of the mask substrate due to the gravity acting on the mask substrate. As the area of the mask substrate becomes larger as compared with the case where the mask substrate is horizontally arranged as in the prior art, the occurrence of bending of the mask substrate can be effectively suppressed. Thereby, non-uniform exposure to the exposure layer formed on the substrate can be reduced as much as possible.

Further, according to the present invention, the substrate-side drive unit substantially applies the holding unit to the substrate on which the material to be exposed is applied and the exposure layer is formed, and the mask substrate on which the light transmission pattern to transmit light is formed. In a state where the substrate is kept vertical, the moving speed when moving in parallel in a virtual plane that is perpendicular to the thickness direction of the substrate and the mask substrate and is rotatable around a predetermined rotation axis is constant. If the moving speed of the holding unit is not constant, for example, if the holding unit is accelerated or decelerated, the holding unit that holds the substrate and the mask substrate vibrates, and the substrate and the mask substrate are distorted. Therefore, as described above, by making the moving speed of the holding portion constant, it is possible to prevent the substrate and the mask substrate from being distorted.

In addition, by making the moving speed of the holding part constant, it is possible to expose the exposed layer while suppressing the vibration of the holding part, so that non-uniform exposure to the exposed layer formed on the substrate is possible. It can be reduced as much as possible.

  Further, according to the present invention, the region where the surface on the side from which the irradiation light from the light irradiation unit exits is a space. Therefore, even when the emission side surface from which the light irradiated by the light irradiation unit emits is an exposure layer formed on a substrate, for example, the thickness of the exposure layer varies due to pressurization of other members. It is possible to reduce as much as possible that dust is buried in the exposure layer. In addition, since the region where the surface on the side from which the irradiation light from the light irradiation unit exits is a space, the irradiation light from the light irradiation unit that has exited the surface of the exposure layer is different from that in the prior art. It is possible to prevent the exposure layer from being exposed again by being reflected by the member, and to prevent the occurrence of defects due to the exposure again, for example, the formation of an undesired microlens. In other words, a microlens having a desired shape can be formed.

According to the present invention, the holding portion, while maintaining the substrate substantially vertically, within the rotatable virtual plane around the rotation axis predetermined perpendicular to the thickness direction of the substrate is moved in parallel For this purpose, the substrate-side drive unit provided in the exposure apparatus in advance holds the substrate on which the material to be exposed that has been conveyed is applied and the exposure layer is formed, and unloads the substrate on which the exposure layer has been exposed. To do. Therefore, it is not necessary to separately provide a dedicated mechanism for holding the transported substrate and carrying out the exposed substrate on the exposure layer. This can prevent the exposure apparatus from becoming large.

  Further, by holding the substrate that has been transported by the substrate side driving unit and carrying out the substrate on which the exposure layer is exposed, a dedicated mechanism is provided to hold the substrate and carry out the substrate. In addition, it is possible to shorten the time required to carry out the substrate on which the exposure layer is exposed.

  FIG. 1 is a diagram showing a simplified configuration of an exposure apparatus 21 according to the first embodiment of the present invention. FIG. 1 shows the exposure apparatus 21 as viewed from one side in the left-right direction Y which is a direction parallel to the surface perpendicular to the thickness direction of the substrate 35. FIG. 2 is a view of the substrate driving unit 22 as viewed from one side in the vertical direction Z. FIG. 3 is a view of the light source driving unit 23 as viewed from one side in the vertical direction Z. FIG. 4 is a view of the substrate driving unit 22 as viewed from the other side in the front-rear direction X, which is the thickness direction of the substrate 35. For example, the exposure apparatus 21 uses a photosensitive resin, for example, a photoresist on the substrate surface in a manufacturing process of a liquid crystal display device, an integrated circuit (abbreviation: IC), and a large scale integration (abbreviation: LSI). It is used when exposing a resist layer formed by coating. The exposure apparatus 21 includes a substrate driving unit 22, a light source driving unit 23, a substrate ID (Identification) reading unit 24, a main controller 25, a substrate stage controller 26, and a light source stage controller 27.

  The substrate driving unit 22 includes a substrate stage 31 and a substrate driving unit 41. The light source drive unit 23 includes a light source 45 that is a light irradiation unit, a light source stage 46, and a connection member 47. In the present embodiment, the front-rear direction (in FIG. 1, the left-right direction of the paper surface) X which is the thickness direction of the substrate 35 and the left-right direction (in FIG. 1, the direction parallel to the surface perpendicular to the thickness direction of the substrate 35). The direction Y perpendicular to the paper surface Y is on a virtual plane perpendicular to the vertical direction Z (the vertical direction of the paper surface in FIG. 1) Z. The front-rear direction X, the left-right direction Y, and the vertical direction Z constitute a three-dimensional orthogonal coordinate system that is orthogonal to each other. In the present embodiment, the front-rear direction X refers to a direction in which the light source drive unit 23 approaches or separates from the substrate drive unit 22.

  The substrate stage 31 as a holding unit includes a substrate holding unit 32, a fixed side holding unit 33 fixed to the substrate holding unit 32, and a movable side holding unit 34 movable in the front-rear direction X with respect to the substrate holding unit 32. . The substrate 35 of the present embodiment is plate-shaped, and the thickness dimension of the substrate is selected to be not less than 0.4 mm and less than 2 mm, for example. A photosensitive resin, for example, a photoresist, which is a material to be exposed is applied to one surface of the substrate 35, and the applied photoresist is irradiated with light and cured to form a resist layer 36 which is an exposed layer. .

  The cross-sectional shape of the substrate 35 and the resist layer 36 viewed from one side in the thickness direction, in other words, the other side of the substrate 35 and the resist layer 36 in the front-rear direction X is substantially rectangular. Here, the substantially rectangular shape includes a rectangular shape. The substrate 35 includes a substrate upper edge 37, a substrate lower edge 38, a substrate left edge 39, and a substrate right edge 40. The substrate upper edge 37 and the substrate lower edge 38 are parallel to each other, and the substrate left edge 39 and the substrate right edge 40 are parallel to each other. The substrate holding part 32 is provided side by side in the circumferential direction along the peripheral edge of the substrate 35. The substrate holding part 32 suppresses the displacement of the substrate 35 in the left-right direction Y and the vertical direction Z by holding the substrate 35 on which the resist layer 36 is formed.

  A plurality of fixed-side clamping portions 33 are arranged on the back surface of the substrate 35 on which the resist layer 36 is formed, that is, on the rear side in the irradiation direction when viewed from the light source 45. A plurality of movable side holding portions 34 are arranged on the light source drive unit 23 side, and can be displaced in a direction approaching or leaving each fixed side holding portion 33. The fixed-side clamping unit 33 and the movable-side clamping unit 34 are provided at intervals in the circumferential direction of the substrate 35. More specifically, two fixed-side holding portions 33 and two movable-side holding portions 34 are provided in the middle portion between both longitudinal ends of the substrate upper edge portion 37 so as to be spaced apart from each other. Two fixed-side holding portions 33 and two movable-side holding portions 34 are provided in the intermediate portion between both ends in the longitudinal direction of the plate 38 at intervals. In addition, two fixed-side holding portions 33 and two movable-side holding portions 34 are provided in the intermediate portion between both ends in the width direction of the substrate left edge portion 39 so as to be spaced apart from each other. Two fixed-side clamping portions 33 and two movable-side clamping portions 34 are provided in the intermediate portion between both ends in the width direction so as to be spaced apart from each other.

  The substrate 35 on which the resist layer 36 is formed includes a fixed-side holding portion 33 and a movable-side holding portion 34 provided on the substrate upper edge portion 37, the substrate lower edge portion 38, the substrate left edge portion 39, and the substrate right edge portion 40, respectively. Thus, the substrate 35 on which the resist layer 36 is formed is sandwiched in the thickness direction. The fixed-side clamping unit 33 and the movable-side clamping unit 34 sandwich the substrate 35 and suppress the displacement of the substrate 35 in the thickness direction of the substrate 35, that is, the front-rear direction X.

  In a state where the substrate 35 is disposed on the back surface of each movable side holding portion 34, that is, behind the irradiation direction when viewed from the light source 45, the direction in which each movable side holding portion 34 approaches the fixed side holding portion 33, in other words, the front-back direction X By displacing to one side, the substrate 35 is clamped and fixed. The substrate holding unit 32 is positioned and sandwiched in a state where the substrate 35 is vertically raised by the substrate upper edge portion 37 and the substrate lower edge portion 38 and is vertically raised by the substrate left edge portion 39 and the substrate right edge portion 40. Can be made. In this way, exposure is performed with the substrate 35 standing upright. After the exposure, the holding state of the substrate 35 is released by displacing each movable side holding portion 34 in a direction away from the fixed side holding portion 33, in other words, the other side in the front-rear direction X, and the resist layer 36 is exposed. The substrate 35 can be removed from the substrate stage 31.

  The substrate drive unit 41 that is a substrate side drive unit includes a substrate rotation drive source that rotates the substrate stage 31 along a rotation direction of an arrow A around a predetermined substrate side axis L1. The substrate-side axis L1 is parallel to the vertical direction Z, and the incident-side surface on which light from the light source 45 of the substrate 35 held by the substrate stage 31 is incident, and the resist layer 36 formed on the substrate 35 It arrange | positions between the output side surfaces from which the said incident light radiate | emits. In the present embodiment, the substrate-side axis L1 is disposed on the exit-side surface of the resist layer 36 and in the width direction of the resist layer 36, in other words, in the left-right direction Y center of the resist layer 36. Preferably, the substrate-side axis L1 is disposed at the center between the entrance-side surface of the substrate 35 and the exit-side surface of the resist layer 36.

  As described above, since the substrate-side axis L1 is disposed at the center in the left-right direction Y of the substrate 35, the torque required to rotate the substrate stage 31 around the substrate-side axis L1 can be reduced. The substrate rotation drive source is realized by a motor, for example. The cross-sectional shape of the substrate driving unit 41 viewed from one side in the left-right direction Y is substantially concave. The substrate drive unit 41 faces the light source drive unit 23 and is formed with a recess 42 that opens to the other side in the front-rear direction X. The substrate stage 31 is provided in the recess 42. In the present embodiment, the substrate holding portion 32 of the substrate stage 31 is configured to be displaceable in the front-rear direction X so that the position of the substrate-side axis L1 can be adjusted. In the present embodiment, the substrate drive unit 41 rotates the substrate stage 31 around the substrate-side axis L1 along the rotation direction of the arrow A. Therefore, the substrate 35 held by the substrate stage 31 and the resist layer 36 formed on one surface portion of the substrate 35 can be rotated along the rotation direction of the arrow A around the substrate-side axis L1. .

  Moreover, the area | region which the output side surface which the light 48 irradiated from the light source 45 of the resist layer 36 radiate | emits faces is a space. In the present embodiment, the surface on the emission side of the resist layer 36 formed on the substrate 35 and one surface of the substrate drive unit 41 facing this surface are from the light source 45 emitted from the surface on the emission side of the resist layer 36. The light 48 is reflected on one surface of the substrate driving unit 41 facing the emission side surface of the resist layer 36 and is formed at an interval so as to prevent the resist layer 36 from being exposed again. Yes. Specifically, the left and right sides of the resist layer 36 formed on the substrate 35 when the substrate 35 held by the substrate stage 31 rotates along the rotation direction of the arrow A around the substrate side axis L1. The distance when the direction Y one end side surface portion or the left and right direction Y other end side surface portion is closest to one surface of the substrate driving portion 41 facing the emission side surface of the resist layer 36 is, for example, 50 cm. The substrate 35 on which the resist layer 36 is formed is placed on the substrate stage 31.

  The light source 45 that is a light irradiation unit is realized by, for example, an ultrahigh pressure mercury lamp and emits light having a wavelength of 365 nm, i.e., so-called ultraviolet rays. In the present embodiment, the light 48 emitted from the light source 45 is irradiated toward the substrate 35 held on the substrate stage 31. The light source stage 46, which is a light source side drive unit, has a light source rotation drive source that rotates the light source 45 along a rotation direction of an arrow B around a predetermined light source side axis L2. The light source side axis L2 is parallel to the left-right direction Y, and the incident side surface on which light from the light source 45 of the substrate 35 held by the substrate stage 31 is incident, and the resist layer 36 formed on the substrate 35 It arrange | positions between the output side surfaces from which the said incident light radiate | emits. In the present embodiment, the light source side axis L <b> 2 is arranged on the emission side surface of the resist layer 36 and in the vertical direction Z center of the resist layer 36. Preferably, the light source side axis L <b> 2 is disposed in the center between the incident side surface of the substrate 35 and the emission side surface of the resist layer 36. The light source rotation drive source is realized by a motor, for example.

  A connection member 47 connected to the light source 45 and the light source stage 46 is provided on the other side in the front-rear direction X of the light source 45 and one side of the light source stage 46 in the front-rear direction X. A substantially concave first curved surface is formed at one end of the front-rear direction X facing the connection member 47 of the light source stage 46. A second curved surface is formed at the other end portion of the connecting member 47 facing the light source stage 46 in the front-rear direction X so as to protrude in the other direction X. The second curved surface is included in a virtual cylindrical surface centered on the light source side axis L2. The curvature radius of the first curved surface is selected to be greater than or equal to the curvature radius of the second curved surface. The second curved surface of the connecting member 47 is rotated by the light source stage 46 along the first curved surface of the light source stage 46 in the rotational direction of the arrow B around the light source side axis L2. Therefore, the light source 45 can be rotated along the rotation direction of the arrow B around the light source side axis L <b> 2 by the light source stage 46.

  The substrate ID reading unit 24 reads substrate ID information for identifying each substrate 35 from the substrate 35 to be exposed, and gives the read substrate ID information to the main controller 25. The substrate ID information is information representing exposure conditions such as the thickness dimension of the substrate 35, the thickness dimension of the resist layer 36 formed on the substrate 35, the incident angle of light with respect to the substrate 35, and the exposure time at the incident angle. In this way, the substrate ID reading means 24 reads the substrate ID information of the substrate 35 to be exposed. The substrate 35 whose substrate ID information has been read by the substrate ID reading unit 24 is transported to the exposure apparatus 21 by a predetermined transport unit, and the resist layer 36 is behind the irradiation direction with respect to the substrate 35 as viewed from the light source 45. A substrate 35 on which the resist layer 36 is formed is disposed. Therefore, in the present embodiment, the light 48 emitted from the light source 45 is irradiated onto the substrate 35, and the light transmitted through the substrate 35 reaches the resist layer 36.

  Based on the substrate ID information given from the substrate ID reading means 24, the main controller 25 checks whether or not the substrate 35 is to be exposed. Based on the substrate ID information, the main controller 25 includes information indicating drive conditions for driving the substrate stage controller 26 (hereinafter, sometimes simply referred to as “substrate drive information”), and the light source stage controller 27. Information indicating a driving condition for driving (hereinafter, sometimes simply referred to as “light source driving information”) is generated. The main controller 25 provides the generated substrate drive information to the substrate stage controller 26 and also provides the generated light source drive information to the light source stage controller 27.

  The substrate stage controller 26 gives the substrate drive information given from the main controller 25 to the substrate drive unit 41. The substrate drive unit 41 drives the substrate stage 31 to rotate about the substrate-side axis L <b> 1 along the rotation direction of the arrow A based on the substrate drive information given from the substrate stage controller 26. The light source stage controller 27 gives the light source drive information given from the main controller 25 to the light source stage 46. Based on the light source drive information given from the light source stage controller 27, the light source stage 46 drives the light source 45 to rotate about the light source side axis L2 along the rotation direction of the arrow B.

  Further, the substrate drive unit 41 is information indicating the amount of rotation when the substrate stage 31 is driven to rotate about the substrate-side axis L1 (hereinafter sometimes referred to as “substrate rotation information”), for example, from a reference position. The displaced angle is given to the main controller 25 via the substrate stage controller 26. The main controller 25, based on the substrate rotation information given from the substrate drive unit 41 via the substrate stage controller 26, information indicating the amount of rotation when the light source 45 is rotationally driven around the light source side axis L2. Hereinafter, it may be expressed as “light source rotation information”) and is supplied to the light source stage 46 via the light source stage controller 27. The light source stage 46 rotates the light source 45 about the light source side axis L2 along the rotation direction of the arrow B based on the light source rotation information given from the main controller 25 via the light source stage controller 27. .

  Further, the light source stage 46 gives light source rotation information, for example, an angle displaced from the reference position, to the main controller 25 via the light source stage controller 27. The main controller 25 is information representing a rotation amount when the substrate stage 31 is rotationally driven around the substrate side axis L1 based on the light source rotation information given from the light source stage 46 via the light source stage controller 27. Substrate rotation information is generated and provided to the substrate drive unit 41 via the substrate stage controller 26. The substrate drive unit 41 rotates the substrate stage 31 around the substrate-side axis L1 along the rotation direction of the arrow A based on the substrate rotation information given from the main controller 25 via the substrate stage controller 26. Drive.

  Next, the substrate 35 before exposure will be described. FIG. 5 is an enlarged view of the liquid crystal display unit 51 of the substrate 35 viewed from the other side in the front-rear direction X. A liquid crystal display unit 51 is formed on the substrate 35 to be exposed. The liquid crystal display unit 51 includes a plurality of pixels 52, and the plurality of pixels 52 are arranged in a matrix. In the pixel 52, the light emitted from the light source 45 and applied to the substrate 35 is applied to the transmission portion 53 that transmits the substrate 35 in the thickness direction from the other side, in other words, the front-rear direction X from the other to the one side, and the substrate 35. The non-transmissive portion 54 that does not transmit light from the other side in the thickness direction of the substrate 35, in other words, the front-rear direction X from the other side.

  FIG. 6 is a cross-sectional view taken along the section line AA of FIG. FIG. 7 is a cross-sectional view taken along the section line BB in FIG. The liquid crystal display unit 51 further includes a first glass substrate 55 and a second glass substrate 56, and between the first glass substrate 55 and the second glass substrate 56, a transmissive part 53 and a non-transmissive part 54 are provided. It is formed. Although not shown, a liquid crystal layer is sealed between the first glass substrate 55 and the second glass substrate 56, and a signal electrode that provides a driving voltage for changing the phase of the liquid crystal molecules in the liquid crystal layer is formed. . On one surface portion of the second glass substrate 56, for example, a resist layer 36 is formed by applying a photoresist and heating and curing it. When the thickness dimension of the microlens array formed by performing exposure and development is, for example, 30 μm, the resist layer 36 is formed so that the thickness dimension is, for example, 30 μm or more and less than 60 μm.

  FIG. 8 is a view showing a state in which the light source 45 is rotated around the light source side axis L <b> 2 to expose the resist layer 36 formed on the substrate 35. In FIG. 8, for ease of understanding, the substrate stage 31 and the substrate driving unit 41 in the substrate driving unit 22 and the light source stage 46 and the connecting member 47 in the light source driving unit 23 are omitted. In the present embodiment, the light source stage 46 rotates the light source 45 in the rotation direction of the arrow B around the light source side axis L2 based on the light source drive information given from the light source stage controller 27. The light 48 emitted from the light source 45 is applied to the other surface in the thickness direction of the substrate 35, in other words, the other surface in the front-rear direction X of the substrate 35, and the light transmitted through the substrate 35 enters the resist layer 36.

  In the present embodiment, the optical axis of the light 48 emitted from the light source 45, the exposure surface of the resist layer 36, which is an exposure layer formed on the substrate 35, specifically, the other surface in the thickness direction of the resist layer 36, in other words, Then, the resist layer 36 is exposed by changing the angle of the resist layer 36 with respect to the front and rear direction X and other surfaces. The rotational speed of the light source 45 around the light source side axis L <b> 2 can be arbitrarily set by the light source stage 46. It is also possible to control the amount of light emitted from the light source 45 toward the substrate 35 by a shutter (not shown).

  FIG. 9 is a view showing a state where the substrate stage 31 is rotated about the substrate-side axis L1 and the resist layer 36 formed on the substrate 35 is exposed. In FIG. 9, for ease of understanding, the substrate stage 31 and the substrate driving unit 41 in the substrate driving unit 22 and the light source stage 46 in the light source driving unit 23 are omitted. In the present embodiment, the substrate drive unit 41 rotates the substrate stage 31 around the substrate-side axis L1 in the rotation direction of the arrow A based on the substrate drive information given from the substrate stage controller 26. The light 48 emitted from the light source 45 is applied to the other surface in the thickness direction of the substrate 35, in other words, the other surface in the front-rear direction X of the substrate 35, and the light transmitted through the substrate 35 enters the resist layer 36. In the present embodiment, the optical axis of the light 48 emitted from the light source 45, the exposure surface of the resist layer 36, which is an exposure layer formed on the substrate 35, specifically, the other surface in the thickness direction of the resist layer 36, in other words, Then, the resist layer 36 is exposed by changing the angle of the resist layer 36 with respect to the front and rear direction X and other surfaces. The rotation speed of the substrate stage 31 around the substrate-side axis L <b> 1 can be arbitrarily set by the substrate driving unit 41.

  In the present embodiment, as described above, the resist layer 36 formed on the substrate 35 is irradiated with light in association with the rotation operation of the substrate stage 31 around the predetermined substrate side axis L1 by the substrate driving unit 41. The light source 45 is rotated around a predetermined light source side axis L2 by the light source stage 46, and the optical axis of the light 48 applied to the resist layer 36 of the substrate 35 held by the substrate stage 31 and the exposure of the resist layer 36. The resist layer 36 is exposed while relatively changing the angle with the surface. In the present embodiment, the resist layer 36 is exposed while simultaneously rotating the substrate stage 31 around the predetermined substrate-side axis L1 and rotating the light source 45 around the predetermined light-source-side axis L2. Alternatively, the resist layer 36 may be exposed in a state where any one of the rotation operations of the substrate stage 31 and the light source 45 is performed and the other rotation operation is stopped. Good.

  FIG. 10 is a view for explaining exposure to the resist layer 36. The light 48 emitted from the light source 45 passes through the first glass substrate 55 and then passes through the transmission part 53. The light transmitted through the transmission part 53 passes through the second glass substrate 56 and is irradiated onto the resist layer 36. Therefore, the resist layer 36 is exposed based on the position of the transmission part 53. FIG. 11 is a diagram showing a microlens array 57 formed after exposure. FIG. 11 shows a cross-sectional view taken along the section line AA of FIG. FIG. 12 is a diagram showing a microlens array 57 formed after exposure. FIG. 12 shows a cross-sectional view as seen from the section line BB in FIG. When a negative resist material is used as the material of the resist layer 36, the resist layer 36 remains thick in the strongly exposed part, and the resist layer 36 becomes thin in the weakly exposed part. By controlling the angle between the optical axis of the light 48 emitted from the light source 45 and the exposure surface of the resist layer 36, the exposure time, the intensity of the light 48 applied to the resist layer 36 by the light source 45, etc., a desired exposure amount is obtained. Exposure can be performed.

  As described above, the light source 45 that irradiates the resist layer 36 formed on the substrate 35 with the light in relation to the rotation operation of the substrate stage 31 around the predetermined substrate side axis L1 by the substrate driving unit 41 is the light source stage. 46 is rotated around a light source side axis L2 determined in advance by 46, and the angle between the optical axis of the light 48 applied to the resist layer 36 of the substrate 35 held by the substrate stage 63 and the exposure surface of the resist layer 36 is relatively set. The resist layer 36 can be exposed to have a desired shape by repeatedly performing the process of exposing the resist layer 36 while changing.

  In this embodiment, the angle between the optical axis of the light 48 emitted from the light source 45 and the other surface in the thickness direction of the resist layer 36, in other words, the front and rear direction X other surface of the resist layer 36 is relatively changed to change the resist layer. 36, by performing development to dissolve and remove the remaining portion of the resist layer 36 while leaving the portion irradiated with light, the resist layer 36 has a lens pattern having a desired shape, for example, a thickness dimension W of 30 μm, A microlens array 57 having a radius of curvature of 170 μm, a focal length of 280 μm, and a pitch P of 200 μm can be formed.

  FIG. 13 is a flowchart showing a procedure for forming the microlens array 57 by the exposure apparatus 21. When the preparation for forming the resist layer 36 on the substrate 35 is completed, the procedure for forming the microlens array 57 by the exposure apparatus 21 is started at step a0 and proceeds to step a1.

  In step a1, a photosensitive resin, in this embodiment, a photoresist is applied to the substrate 35 to form a resist layer 36, and the process proceeds to step a2. In step a2, the substrate ID reading means 24 reads substrate ID information from the substrate 35 to be exposed. When the board ID information is read, the process proceeds to step a3.

  In step a3, the substrate 35 on which the resist layer 36 is formed is transported to the exposure apparatus 21, and the resist layer 36 is disposed behind the substrate 35 in the irradiation direction when viewed from the light source 45, and the process proceeds to step a4. . In step a4, the substrate stage 31 is rotated about the substrate-side axis L1 by the substrate driving unit 41, and the light source 45 is rotated about the light-source-side axis L2 by the light source stage 46, thereby forming a resist layer formed on the substrate 35. 36 is exposed. When the resist layer 36 is exposed, the process proceeds to step a5.

  In step a5, the rotation drive around the substrate-side axis L1 of the substrate stage 31 by the substrate drive unit 41 and the rotation drive around the second axis L2 of the light source 45 by the light source stage 46 are stopped to form the substrate 35. The exposure to the resist layer 36 is completed. When the exposure to the resist layer 36 is completed, the process proceeds to step a6. In step a6, the exposed substrate 35 is removed from the substrate stage 31 of the exposure apparatus 21, and the process proceeds to step a7.

  In step a7, the resist layer 36 exposed by the exposure device 21 is developed to form a microlens array 57 having a desired shape, and the process proceeds to step a8. In step a8, all processing procedures for forming the microlens array 57 by the exposure device 21 are completed.

  As described above, according to the present embodiment, the substrate stage 31 holds the substrate 35 on which the resist layer 36 is formed by applying a material to be exposed, for example, a photoresist, while holding the peripheral portion thereof. The substrate drive unit 41 holds the substrate stage 31 around a predetermined substrate-side axis L1 while maintaining the substrate 35 substantially vertical. The light source 45 irradiates the resist layer 36 of the substrate 35 held by the substrate stage 31 with light 48. The optical axis of the light applied to the resist layer 36 of the substrate 35 held by the substrate stage 31 in relation to the rotation operation of the substrate stage 31 around the predetermined substrate side axis L1 by the substrate driving unit 41; The resist layer 36 is exposed while relatively changing the angle of the resist layer 36 with the exposure surface.

  As described above, the substrate 35 on which the photoresist layer 36 is formed by applying the photoresist is held substantially vertically with the peripheral portion held by the substrate stage 31, and the substrate stage 31 is held by the substrate driving unit 41. Since the substrate 35 is rotated around the predetermined substrate-side axis L1 in a state where the substrate 35 is maintained substantially vertical, the occurrence of bending of the substrate 35 due to gravity acting on the substrate 35 can be suppressed. More specifically, as the area of the substrate 35 becomes larger as compared with the case where the substrate 35 is horizontally arranged as in the prior art, the occurrence of bending of the substrate 35 can be effectively suppressed. Thereby, non-uniform exposure to the resist layer 36 formed on the substrate 35 can be reduced as much as possible. In other words, the resist layer 36 formed on the substrate 35 can be uniformly exposed.

  The fixed-side holding portion 33 and the movable-side holding portion 34 provided at intervals in the circumferential direction of the substrate 35 hold the substrate 35 in a state where the peripheral portion of the substrate 35 is gripped. Further, when holding the resist layer 36 formed on the substrate 35, the fixed side holding portion 33 and the movable side holding portion 34 hold the substrate 35 in a state where the resist layer 36 outside the region to be exposed is held. Accordingly, the contact area between the substrate 35 and the substrate 35, specifically, the fixed-side clamping unit 33 and the movable-side clamping unit 34, and the substrate 35 is small. As a result, it is possible to minimize the occurrence of fluctuations in the thickness dimension of the resist layer 36 as in the above-described conventional technique, and the dust being buried in the resist layer 36 as much as possible.

  In addition, since the substrate 35 is configured to be held in a state where the peripheral edge portion of the substrate 35 is gripped, the light that is emitted from the light source 45 on the substrate stage 31 and the substrate driving unit 41 from the peripheral edge portion of the substrate 35. For example, it may be configured to be separated in the emission direction from the 48 substrates 35. Therefore, the reflection of light from the light source 45 by the substrate stage 31 and the substrate driving unit 41 is reduced, and the occurrence of problems due to the resist layer 36 formed on the substrate 35 being irradiated with reflected light and exposed again. For example, it is possible to prevent a microlens having an undesired shape from being formed. In other words, a microlens having a desired shape can be formed.

  Further, according to the present embodiment, the light source 45 that irradiates the resist layer 36 formed on the substrate 35 with light in association with the rotation of the substrate stage 31 around the predetermined substrate side axis L1 by the substrate driving unit 41. Is rotated around the light source side axis L2 by the light source stage 46, and the optical axis of the light 48 applied to the resist layer 36 of the substrate 35 held by the substrate stage 31 and the exposure surface of the resist layer 36. The resist layer 36 is exposed to light while the relative angle is relatively changed.

  As described above, the light source stage 46 rotates the light source 45 around the predetermined light source side axis L2 in association with the rotation operation around the predetermined substrate side axis L1 of the substrate stage 31 by the substrate driving unit 41. Therefore, the rotation amount of each of the substrate stage 31 and the light source 45 can be reduced, and the required movement amount of the substrate 35 with respect to the optical axis of the light 48 emitted from the light source 45 can be ensured. Therefore, it is possible to reduce the bending of the substrate 35 by reducing loads such as gravity and inertial force acting on the substrate 35.

  Furthermore, since the light source stage 46 rotates the light source 45 around the predetermined light source side axis L2 in relation to the rotation operation of the substrate stage 31 by the substrate driving unit 41, the moving speed and moving amount of the substrate stage 31 are reduced. can do. As a result, the occupation space in which the exposure apparatus 21 is installed can be reduced, so that the equipment cost can be reduced and the exposure apparatus 21 can be downsized.

  Further, according to the present embodiment, the predetermined substrate-side axis L1 of the substrate driving unit 41 includes the incident-side surface on which the light 48 from the light source 45 of the substrate 35 held by the substrate stage 31 is incident, and the substrate 35. The resist layer 36 is formed between the incident side surface 48 from which the incident light 48 is emitted. When the substrate-side axis L1 is disposed at the above-described position, the substrate-side axis L1 is perpendicular to the thickness direction of the substrate 35 and the direction in which the substrate-side axis L1 extends, as compared to the case where the substrate-side axis L1 is disposed at other positions. The amount of movement of the substrate 35 in a certain direction (hereinafter sometimes simply referred to as “substrate width direction”) can be reduced.

  As a result, a configuration for reliably irradiating light to an area to be exposed of the substrate 35, for example, a configuration in which the light source 45 is moved in accordance with a rotation operation around the substrate-side axis L1 of the substrate 35 held by the substrate stage 31. Is not necessary, and it is not necessary to make the light source 45 relatively large in order to increase the exposure range in accordance with the movement range of the substrate 35 in the width direction. Therefore, the arrangement of the light source 45 can be reduced by disposing the substrate side axis L1 at the above-mentioned position as compared with the case where the substrate side axis L1 is arranged at a position other than the above-mentioned position. Further, since the light source 45 can be reduced in size, power consumption at the light source 45 can be reduced, and power saving can be achieved. Therefore, it is possible to reduce the manufacturing cost required to manufacture the microlens by exposing the resist layer 36 formed on the substrate 35.

  A predetermined light source side axis L2 of the light source stage 46 has an incident side surface on which the light 48 from the light source 45 of the substrate 35 held by the substrate stage 31 is incident, and the resist layer 36 formed on the substrate 35. It arrange | positions between the output side surfaces from which the said incident light radiate | emits. When the substrate 35 is fixed at a predetermined position and the light source 45 is rotated about the light source side axis L2, if the light source side axis L2 is disposed at a position other than the above position, For example, there may be a case where one end of the substrate 35 in the width direction or the other end in the width direction cannot be irradiated with light. Therefore, when the light source side axis L2 is disposed at a position other than the above-described position, the light source 45 must be configured to be relatively large in order to reliably irradiate the region of the substrate 35 to be exposed.

  On the other hand, if the light source side axis L2 is disposed at the above-mentioned position, light can be reliably irradiated to the area to be exposed of the substrate 35. Therefore, the light source side axis L2 is disposed at a position other than the above position. Compared to the case, the configuration of the light source 45 can be reduced in size. Further, by reducing the size of the light source 45, less power is consumed by the light source 45, and power saving can be achieved. Therefore, it is possible to reduce the manufacturing cost required to manufacture the microlens by exposing the resist layer 36 formed on the substrate 35.

  In addition, according to the present embodiment, the region on the surface on the side where the irradiation light 48 from the light source 45 is emitted, that is, the region on the emission side where the light 48 emitted from the light source 45 of the resist layer 36 is exposed in this embodiment is , Space. As described above, since the region of the resist layer 36 facing the exit side surface from which the light 48 from the light source 45 is emitted is a space, the thickness of the resist layer 36 is changed by pressing of another member. It is possible to reduce the occurrence of dust or the dust buried in the resist layer 36 as much as possible.

  Further, since the region of the resist layer 36 facing the emission side surface from which the light 48 from the light source 45 is emitted is a space, the light 48 from the light source 45 emitted from the surface of the resist layer 36 is the same as that of the prior art. As described above, it is possible to prevent the resist layer 36 from being exposed again by being reflected by another member, and to prevent the occurrence of defects due to the exposure again, for example, the formation of an undesired microlens. it can.

  FIG. 14 is a diagram showing a simplified configuration of the exposure apparatus 61 according to the second embodiment of the present invention. FIG. 14 shows the exposure apparatus 61 as viewed from one side in the left-right direction Y which is a direction parallel to the surface perpendicular to the thickness direction of the substrate 35. The exposure apparatus 61 includes a substrate driving unit 22, a light source driving unit 23, a substrate ID (Identification) reading unit 24, a main controller 25, a substrate mask stage controller 62, and a light source stage controller 27. The substrate driving unit 22 includes a substrate stage 63 and a substrate driving unit 41. The light source drive unit 23 includes a light source 45, a light source stage 46 and a connection member 47. The substrate stage 63 as a holding unit includes a substrate holding unit 32, a fixed side holding unit 33, a movable side holding unit 34, a first mask holding unit 64, and a second mask holding unit 65.

  The exposure apparatus 61 is similar to the exposure apparatus 21 of the first embodiment described above, and only a different configuration will be described, and the same configuration will be denoted by the same reference numeral and description thereof will be omitted. In the present embodiment, the front-rear direction (in FIG. 14, the left-right direction of the paper surface) X which is the thickness direction of the substrate 35 and the left-right direction (in FIG. 14, the direction parallel to the surface perpendicular to the thickness direction of the substrate 35). , The direction perpendicular to the paper surface) Y exists on a virtual plane perpendicular to the vertical direction (the vertical direction of the paper surface in FIG. 14) Z. The front-rear direction X, the left-right direction Y, and the vertical direction Z constitute a three-dimensional orthogonal coordinate system that is orthogonal to each other. In the present embodiment, the front-rear direction X refers to a direction in which the light source drive unit 23 approaches or separates from the substrate drive unit 22.

  In the present embodiment, the first and second mask holding portions 64, which are mask holding portions, are closer to the light source 45 than the substrate 35 held by the substrate holding portion 32, the fixed side holding portion 33 and the movable side holding portion 34. An exposure mask substrate 66 held by 65 is provided. The cross-sectional shape of the exposure mask substrate 66, which is a mask substrate, viewed from one side in the thickness direction, in other words, from the front-rear direction X of the exposure mask substrate 66 is substantially rectangular. Here, the substantially rectangular shape includes a rectangular shape. On the exposure mask substrate 66, a predetermined light transmission pattern for forming a desired microlens array, specifically, a light transmission pattern to transmit light is formed.

  The exposure mask substrate 66 includes a mask upper edge, a mask lower edge, a mask left edge, and a mask right edge. The mask upper edge and the mask lower edge are parallel to each other, and the mask left edge and the mask right edge are parallel to each other. The first mask holding part 64 is provided side by side in the circumferential direction along the peripheral part of the exposure mask substrate 66. The first mask holding unit 64 holds the exposure mask substrate 66 to suppress the displacement of the exposure mask substrate 66 in the left-right direction Y and the vertical direction Z. In the present embodiment, the first mask holder 64 is detachably connected to the substrate holder 32.

  A plurality of second mask holding portions 65 are arranged on one surface portion in the thickness direction of the exposure mask substrate 66. For example, a plurality of second mask holding portions 65 are provided at intervals in the circumferential direction of the exposure mask substrate 66. The second mask holding unit 65 holds the exposure mask substrate 66 to suppress the displacement of the exposure mask substrate 66 in the front-rear direction X. In the state where the substrate 35 is disposed behind the movable side holding portion 34, that is, behind the irradiation direction when viewed from the light source 45, the direction in which each movable side holding portion 34 approaches the fixed side holding portion 33, in other words, the front-rear direction X By displacing to one side, the substrate 35 is positioned. The substrate 35 is vertically positioned by the substrate upper edge portion 37 and the substrate lower edge portion 38, and the substrate 35 is positioned and clamped in a state where the substrate 35 is vertically raised by the substrate left edge portion 39 and the substrate right edge portion 40.

  Further, the exposure mask substrate 66 held by the first mask and the second mask holding portions 64 and 65 is arranged on the other side in the front-rear direction X of the substrate 35. Specifically, position adjustment between the exposure mask substrate 66 held by the first and second mask holding portions 64 and 65 and the substrate 35 on which the resist layer 36 is formed (hereinafter referred to as “positioning”). The first mask holding part 64 and the substrate holding part 32 are connected.

  In this way, with the exposure mask substrate 66 and the substrate 35 standing vertically, the exposure mask substrate 66 is first exposed to light and transmitted to the resist layer 36 formed on the substrate 35 by the light transmitted through the exposure mask substrate 66. Perform exposure. After the exposure, the first mask holding portion 64 is displaced in the front-rear direction X to release the connection state between the first mask holding portion 64 and the substrate holding portion 32, and each movable side holding portion 34 is fixed. By displacing in the direction away from the side clamping portion 33, in other words, the other side in the front-rear direction X, the clamping state of the substrate 35 is released, and the substrate 35 on which the resist layer 36 is exposed can be removed from the substrate stage 63. .

  The main controller 25 of the present embodiment uses information representing driving conditions for driving the substrate mask stage controller 62 based on the substrate ID information (hereinafter sometimes simply referred to as “substrate mask driving information”), and a light source. Light source drive information for driving the stage controller 27 is generated. The main controller 25 gives the generated substrate mask drive information to the substrate mask stage controller 62 and also gives the generated light source drive information to the light source stage controller 27. The substrate mask stage controller 62 gives the substrate mask drive information given from the main controller 25 to the first mask holding unit 64 and the substrate drive unit 41.

  The first mask holding unit 64 positions the exposure mask substrate 66 and the substrate 35 on which the resist layer 36 is formed based on the substrate mask drive information given from the substrate mask stage controller 62. The substrate drive unit 41 drives the substrate stage 63 to rotate about the substrate-side axis L1 along the rotation direction of the arrow A based on the substrate drive information given from the substrate mask stage controller 62. Thus, since the first mask holding unit 64 that holds the exposure mask substrate 66 is connected to the substrate holding unit 32, the substrate driving unit 41 rotates the arrow A around the substrate side axis L1 together with the substrate stage 63. It is rotated along the moving direction.

  In the present embodiment, the substrate-side axis L1 is parallel to the vertical direction Z and the incident-side surface on which light from the light source 45 of the exposure mask substrate 66 is incident and the incident light of the exposure mask substrate 66 Is disposed between the light-emitting surface and the light-emitting surface. In the present embodiment, the substrate-side axis L1 is disposed in the width direction of the exposure mask substrate 66, in other words, in the left-right direction Y center of the exposure mask substrate 66. Preferably, the substrate side axis L1 is disposed at the center between the incident side surface and the emission side surface of the exposure mask substrate 66. In the present embodiment, the substrate-side axis L1 is configured to be disposed at the aforementioned position, but is not limited to such a configuration.

  Further, the substrate drive unit 41 is information indicating the amount of rotation when the substrate stage 63 and the first mask holding unit 64 are driven to rotate about the substrate side axis L1 (hereinafter referred to as “substrate mask rotation information”). For example, the angle displaced from the reference position is given to the main controller 25 via the substrate mask stage controller 62. The main controller 25 is information representing the amount of rotation when rotating around the light source side axis L <b> 2 of the light source 45 based on the substrate mask rotation information given from the substrate driving unit 41 via the substrate mask stage controller 62. (Hereinafter, sometimes referred to as “light source rotation information”) is generated and provided to the light source stage 46 via the light source stage controller 27. The light source stage 46 rotates the light source 45 about the light source side axis L2 along the rotation direction of the arrow B based on the light source rotation information given from the main controller 25 via the light source stage controller 27. .

  In the present embodiment, the light source side axis L2 is parallel to the left-right direction Y, and the incident side surface on which light from the light source 45 of the exposure mask substrate 66 is incident and the incident light of the exposure mask substrate 66 Is disposed between the light-emitting surface and the light-emitting surface. In the present embodiment, the light source side axis L <b> 2 is disposed at the center in the vertical direction Z of the exposure mask substrate 66. Preferably, the light source side axis L2 is disposed in the center between the incident side surface and the emission side surface of the exposure mask substrate 66. In the present embodiment, the light source side axis L2 is configured to be disposed at the aforementioned position, but is not limited to such a configuration.

  Further, the light source stage 46 gives light source rotation information, for example, an angle displaced from the reference position, to the main controller 25 via the light source stage controller 27. When the main controller 25 is driven to rotate around the substrate-side axis L1 of the substrate stage 63 and the first mask holding unit 64 based on the light source rotation information given from the light source stage 46 via the light source stage controller 27. Substrate mask rotation information, which is information representing the rotation amount, is generated and provided to the substrate drive unit 41 via the substrate mask stage controller 62. The substrate driving unit 41 moves the substrate stage 63 and the first mask holding unit 64 around the substrate-side axis L1 on the basis of the substrate mask rotation information given from the main controller 25 via the substrate mask stage controller 62. Is driven to rotate along the direction of rotation.

  As described above, according to the present embodiment, the predetermined substrate-side axis L1 of the substrate driving unit 41 is disposed closer to the light source 45 than the substrate 35 on which the resist layer 36 is formed. More specifically, the substrate-side axis L1 includes the incident-side surface of the exposure mask substrate 66 held by the first and second mask holding portions 64 and 65 on which the light 48 from the light source 45 is incident, and the exposure mask substrate. 66 between the exit side surface from which the incident light 48 exits. When the substrate-side axis L1 is disposed at the aforementioned position, the thickness direction of the substrate 35 and the substrate-side axis of the substrate driving unit 41 are compared with the case where the substrate-side axis L1 is disposed at a position other than the aforementioned position. The amount of movement of the substrate 35 in the direction perpendicular to the extending direction (hereinafter, sometimes simply referred to as “substrate width direction”) can be reduced.

  Thus, the light source 45 is adapted to a configuration for irradiating light to the region to be irradiated with light on the exposure mask substrate 66, for example, a rotation operation around the substrate side axis L1 of the substrate 35 held by the substrate stage 63. Is not necessary, and it is not necessary to configure the light source 45 to be relatively large in order to increase the exposure range in accordance with the movement range of the exposure mask substrate 66 and the substrate 35 in the width direction. Therefore, the arrangement of the light source 45 can be reduced by disposing the substrate side axis L1 at the above-mentioned position as compared with the case where the substrate side axis L1 is arranged at a position other than the above-mentioned position. Further, since the light source 45 can be reduced in size, power consumption at the light source 45 can be reduced, and power saving can be achieved. Therefore, it is possible to reduce the manufacturing cost required to manufacture the microlens by exposing the resist layer 36 formed on the substrate 35.

  Further, according to the present embodiment, the predetermined light source side axis L2 of the light source stage 46 is disposed closer to the light source 45 than the substrate 35 on which the resist layer 36 is formed. More specifically, the light source side axis L2 includes the incident side surface of the exposure mask substrate 66 held by the first and second mask holding portions 64 and 65 on which the light 48 from the light source 45 is incident, and the exposure mask substrate. 66 between the exit side surface from which the incident light 48 exits. When the substrate 35 and the exposure mask substrate 66 are fixed at predetermined positions and the light source 45 is rotated around the light source side axis L2, if the light source side axis L2 is disposed at a position other than the aforementioned position, the exposure mask substrate 66 is placed. Among the regions to be exposed, for example, light may not be irradiated to one end in the width direction or the other end in the width direction of the exposure mask substrate 66. Therefore, when the light source side axis L2 is disposed at a position other than the above-described position, the light source 45 must be configured to be relatively large in order to surely irradiate the region of the exposure mask substrate 66 where the light is to be irradiated. I must.

  On the other hand, if the light source side axis L2 is disposed at the above-described position, the light on the exposure mask substrate 66 can be reliably irradiated with light. The configuration of the light source 45 can be reduced in size as compared with the case where the light source 45 is disposed. Further, by reducing the size of the light source 45, less power is consumed by the light source 45, and power saving can be achieved. Therefore, it is possible to reduce the manufacturing cost required when the micro lens is manufactured by exposing the resist 36 layer formed on the substrate 35.

  FIG. 15 is a view showing a state in which the light source 45 is rotated about the light source side axis L2 and the resist layer 36 formed on the substrate 35 is exposed. In FIG. 15, for ease of understanding, the substrate stage 63 and the substrate driving unit 41 in the substrate driving unit 22, and the light source stage 46 and the connecting member 47 in the light source driving unit 23 are omitted. In the present embodiment, the light source stage 46 rotates the light source 45 in the rotation direction of the arrow B around the light source side axis L2 based on the light source drive information given from the light source stage controller 27. The light 48 emitted from the light source 45 is applied to the other surface in the thickness direction of the exposure mask substrate 66, in other words, the other surface in the front-rear direction X of the exposure mask substrate 66, and the light transmitted through the exposure mask substrate 66 is applied to the resist layer 36. Incident.

  In the present embodiment, the optical axis of the light 48 emitted from the light source 45 and the other surface in the thickness direction of the resist layer 36 that is the exposure layer formed on the substrate 35, in other words, the front and rear direction X other surface of the resist layer 36. The resist layer 36 is exposed with a relative change in angle. The rotational speed of the light source 45 around the light source side axis L <b> 2 can be arbitrarily set by the light source stage 46. It is also possible to control the amount of light emitted from the light source 45 toward the substrate 35 by a shutter (not shown).

  FIG. 16 is a view showing a state in which the substrate stage 63 is rotated around the substrate-side axis L1 and the resist layer 36 formed on the substrate 35 is exposed. In FIG. 16, the substrate stage 63 and the substrate driving unit 41 in the substrate driving unit 22 and the light source stage 46 and the connecting member 47 in the light source driving unit 23 are omitted for easy understanding. In the present embodiment, the rotation direction of the arrow A about the substrate side axis L1 is moved between the exposure mask substrate 66 and the substrate stage 63 based on the substrate driving information given from the substrate mask stage controller 62 by the substrate driving unit 41. Turn to. The light 48 emitted from the light source 45 is applied to the other surface in the thickness direction of the exposure mask substrate 66, in other words, the other surface in the front-rear direction X of the exposure mask substrate 66, and the light transmitted through the exposure mask substrate 66 is applied to the resist layer 36. Incident. In the present embodiment, the optical axis of the light 48 emitted from the light source 45 and the other surface in the thickness direction of the resist layer 36 that is the exposure layer formed on the substrate 35, in other words, the front and rear direction X other surface of the resist layer 36. The resist layer 36 is exposed with a relative change in angle. The rotation speed of the exposure mask substrate 66 and the substrate stage 62 around the substrate-side axis L1 can be arbitrarily set by the substrate driving unit 41.

  In the present embodiment, as in the above-described embodiment, the substrate stage 31 is rotated around the predetermined substrate side axis L1 and the light source 45 is rotated around the predetermined light source side axis L2 simultaneously. The resist layer 36 may be exposed, or the resist layer 36 may be rotated while one of the rotating operations of the substrate stage 31 and the light source 45 is performed and the other rotating operation is stopped. The layer 36 may be exposed.

  FIG. 17 is a flowchart showing a procedure for forming the microlens array 57 by the exposure device 61. The procedure for forming the microlens array 57 by the exposure device 61 is started in step b0 when the preparation for forming the resist layer 36 on the substrate 35 is completed, and proceeds to step b1.

  In step b1, a photosensitive resin, in this embodiment, a photoresist is applied to the substrate 35 to form a resist layer 36, and the process proceeds to step b2. In step b2, the substrate ID reading means 24 reads the substrate ID information from the substrate 35 to be exposed. When the board ID information is read, the process proceeds to step b3.

  In step b3, the substrate 35 on which the resist layer 36 is formed is transported to the exposure device 61, arranged so that the resist layer 36 is in front of the irradiation direction with respect to the substrate 35 when viewed from the light source 45, and the process proceeds to step b4. .

  In step b4, the first mask holding unit 64, based on the substrate mask drive information given from the substrate mask stage controller 62, the exposure mask substrate 66 held by the first and second mask holding units 64 and 65, The positioning with respect to the substrate 35 on which the resist layer 36 is formed is performed, the first mask holding unit 64 and the substrate holding unit 32 are connected, and the process proceeds to Step b5.

  In step b5, the exposure mask substrate 66 and the substrate stage 63 are rotated about the substrate side axis L1 by the substrate driving unit 41, and the light source 45 is rotated about the light source side axis L2 by the light source stage 46. The formed resist layer 36 is exposed. When the resist layer 36 is exposed, the process proceeds to step b6.

  In step b6, the rotation drive around the substrate side axis L1 of the exposure mask substrate 66 and the substrate stage 63 by the substrate drive unit 41 and the rotation drive around the light source side axis L2 of the light source 45 by the light source stage 46 are stopped. The exposure to the resist layer 36 formed on the substrate 35 is finished. When the exposure to the resist layer 36 is completed, the process proceeds to step b7.

  In step b7, the exposure mask substrate 66 and the exposed substrate 35 are removed from the exposure apparatus 61, and the process proceeds to step b8. In step b8, the resist layer 36 exposed by the exposure device 61 is developed to form a microlens array 57 having a desired shape, and the process proceeds to step b9. In step b9, all processing procedures for forming the microlens array 57 by the exposure device 61 are completed.

  As described above, according to the present embodiment, each movable-side holding portion 34 is fixedly held in the state where the substrate 35 is disposed on the back surface of each movable-side holding portion 34, that is, behind the light source 45 in the irradiation direction. The substrate 35 is clamped and fixed by being displaced in the direction approaching the portion 33, in other words, in the front-rear direction X. The substrate holding unit 32 is positioned and sandwiched in a state where the substrate 35 is vertically raised by the substrate upper edge portion 37 and the substrate lower edge portion 38 and is vertically raised by the substrate left edge portion 39 and the substrate right edge portion 40. Can be made.

  Further, the exposure mask substrate 66 held by the first mask and the second mask holding portions 64 and 65 is arranged on the other side in the front-rear direction X of the substrate 35. Specifically, the exposure mask substrate 66 held by the first and second mask holding portions 64 and 65 and the substrate 35 on which the resist layer 36 is formed are positioned, and the first mask holding portion 64 and the substrate are positioned. The holding part 32 is connected. In this way, with the exposure mask substrate 66 and the substrate 35 standing upright, the substrate holder 32 and the first mask holder 64 are rotated around the substrate-side axis L1, in other words, the exposure mask substrate 66 and The substrate 35 on which the resist layer 36 is formed is rotated about the substrate-side axis L1, and the optical axis of light applied to the resist layer 36 of the substrate 35 held by the substrate stage 63, and the exposure of the resist layer 36. The resist layer 36 is exposed while relatively changing the angle with the surface.

  Therefore, it is possible to suppress the bending of the exposure mask substrate 66 due to the gravity acting on the exposure mask substrate 66 and the bending of the substrate 35 due to the gravity acting on the substrate 35. Thereby, non-uniform exposure to the resist layer 36 formed on the substrate 35 can be reduced as much as possible. In other words, the resist layer 36 formed on the substrate 35 can be uniformly exposed.

  Further, according to the present embodiment, the light source 45 is connected to the light source stage 46 by the light source stage 46 in relation to the rotation operation of the substrate stage 63 and the first mask holding unit 64 around the substrate side axis L1 by the substrate driving unit 41. While rotating around the light source side axis L2 and relatively changing the angle between the optical axis of the light 48 applied to the resist layer 36 of the substrate 35 held by the substrate stage 63 and the exposure surface of the resist layer 36, The resist layer 36 is exposed.

  As described above, in relation to the rotation operation of the substrate stage 63 and the first mask holding unit 64 around the substrate side axis L1 by the substrate drive unit 41, the light source stage 46 around the light source side axis L2 is moved. Since the rotation operation is performed, the rotation amount of each of the substrate 35 on which the resist layer 36 is formed, the exposure mask substrate 66, and the light source 45 is reduced, and the required amount of the substrate 35 with respect to the optical axis of the light 48 emitted from the light source 45 is reduced. The amount of movement can be secured. Therefore, the load such as gravity and inertia force acting on the substrate 35 and the exposure mask substrate 66 on which the resist layer 36 is formed is reduced, and the deflection of the substrate 35 and the exposure mask substrate 66 on which the resist layer 36 is formed is reduced. be able to.

  Further, the light source stage 46 rotates the light source 45 about the predetermined light source side axis L2 in relation to the rotation operation of the substrate stage 63 and the first mask holding unit 64 by the substrate driving unit 41. It is possible to reduce the moving speed and moving amount. As a result, the occupied space in which the exposure apparatus 61 is installed can be reduced, so that the equipment cost can be reduced. At the same time, the size of the exposure device 61 can be reduced.

  Further, according to the present embodiment, the region on the surface on the side from which the irradiation light 48 from the light source 45 is emitted, in this embodiment, the region on the emission side from which the light 48 emitted from the light source 45 of the substrate 35 is emitted, It is space. As described above, since the region where the emission-side surface from which the light 48 from the light source 45 emits faces the space is a space, the light 48 from the light source 45 emitted from the surface of the substrate 35 is the conventional technology. In this way, the light is reflected on another member and is incident on the substrate 35 again, and the incident light is prevented from being transmitted through the substrate 35 and being exposed to the resist layer 36. A microlens having a desired shape can be prevented from being formed.

  FIG. 18 is a diagram showing a simplified configuration of the exposure apparatus 71 according to the third embodiment of the present invention. FIG. 18 shows the exposure apparatus 71 as viewed from one side in the left-right direction Y, which is a direction parallel to the surface perpendicular to the thickness direction of the substrate 35. Since the exposure apparatus 71 is similar to the exposure apparatus 21 of the first embodiment described above, only different configurations will be described, and similar configurations will be denoted by the same reference numerals and description thereof will be omitted. In the present embodiment, the front-rear direction (in FIG. 18, the left-right direction of the paper surface) X which is the thickness direction of the substrate 35 and the left-right direction (in FIG. 18, the direction parallel to the surface perpendicular to the thickness direction of the substrate 35). , The direction perpendicular to the paper surface) Y exists on a virtual plane perpendicular to the vertical direction (the vertical direction of the paper surface in FIG. 18) Z. The front-rear direction X, the left-right direction Y, and the vertical direction Z constitute a three-dimensional orthogonal coordinate system that is orthogonal to each other. In the present embodiment, the front-rear direction X refers to a direction in which the reflecting mirror driving unit 80 approaches or separates from the substrate driving unit 22.

  The exposure apparatus 71 includes a substrate driving unit 22, a light source 45, a reflecting mirror driving unit 80, a substrate ID (Identification) reading unit 24, a main controller 25, a substrate stage controller 26, and a reflecting mirror stage controller 83. More specifically, the exposure apparatus 71 includes a light source 45 and a reflecting mirror drive unit 80 instead of the light source drive unit 23 of the exposure apparatus 21 described above. The reflecting mirror drive unit 80 includes a reflecting mirror 81 and a reflecting mirror stage 82.

  The reflecting mirror 81 serving as a light reflecting unit reflects light emitted from the light source 45 serving as a light irradiating unit and irradiates the substrate 35 held on the substrate stage 31 of the substrate driving unit 22. The reflecting mirror stage 82 which is a light reflecting side driving unit is integrally fixed to the reflecting mirror 81, and the reflecting mirror 81 is rotated along the rotation direction of the arrow C around the predetermined light reflecting side axis L3. It has a reflecting mirror rotation drive source to be driven. The reflecting mirror rotation drive source is realized by a motor, for example. The light reflection side axis L3 is disposed in a direction parallel to the left-right direction Y and perpendicular to the thickness direction of the reflecting mirror 81. Further, the light reflection side axis L3 is disposed in the vicinity of the middle of the extending direction of the reflecting mirror 81 as viewed by cutting the reflecting mirror 81 along a virtual plane perpendicular to the direction. The “near the middle” includes the middle.

  The substrate ID reading unit 24 reads substrate ID information for identifying each substrate 35 from the substrate 35 to be exposed, and gives the read substrate ID information to the main controller 25. The substrate ID information is information representing exposure conditions such as the thickness dimension of the substrate 35, the thickness dimension of the resist layer 36 formed on the substrate 35, the incident angle of light with respect to the substrate 35, and the exposure time at the incident angle. In this way, the substrate ID reading means 24 reads the substrate ID information of the substrate 35 to be exposed. The substrate 35 whose substrate ID information has been read by the substrate ID reading unit 24 is transported to the exposure apparatus 21 by a predetermined transport unit, and the resist layer 36 is behind the irradiation direction with respect to the substrate 35 as viewed from the light source 45. A substrate 35 on which the resist layer 36 is formed is disposed. Therefore, in the present embodiment, the light 48 emitted from the light source 45 is irradiated onto the substrate 35, and the light transmitted through the substrate 35 reaches the resist layer 36.

  Based on the substrate ID information given from the substrate ID reading means 24, the main controller 25 checks whether or not the substrate 35 is to be exposed. The main controller 25 is based on the substrate ID information, information indicating driving conditions for driving the substrate stage controller 26 (hereinafter, sometimes simply referred to as “substrate driving information”), and the reflector stage controller 83. Information indicating the driving conditions for driving the lens (hereinafter, sometimes simply referred to as “reflecting mirror driving information”) is generated. The main controller 25 gives the generated substrate driving information to the substrate stage controller 26 and also gives the generated reflecting mirror driving information to the reflecting mirror stage controller 83.

  The substrate stage controller 26 gives the substrate drive information given from the main controller 25 to the substrate drive unit 41 of the substrate drive unit 22. The substrate drive unit 41 as the substrate side drive unit rotates the substrate stage 31 around the substrate side axis L1 along the rotation direction of the arrow A based on the substrate drive information given from the substrate stage controller 26. . The reflecting mirror stage controller 83 gives the reflecting mirror drive information given from the main controller 25 to the reflecting mirror stage 82. Based on the reflecting mirror drive information given from the reflecting mirror stage controller 83, the reflecting mirror stage 82 drives the reflecting mirror 81 to rotate about the light reflecting side axis L3 along the rotating direction of the arrow C.

  Further, the substrate drive unit 41 is information indicating the amount of rotation when the substrate stage 31 is driven to rotate about the substrate-side axis L1 (hereinafter sometimes referred to as “substrate rotation information”), for example, from a reference position. The displaced angle is given to the main controller 25 via the substrate stage controller 26. The main controller 25 represents a rotation amount when the reflecting mirror 81 is driven to rotate around the light reflection side axis L3 based on the substrate rotation information given from the substrate driving unit 41 via the substrate stage controller 26. Information (hereinafter sometimes referred to as “reflecting mirror rotation information”) is generated and provided to the reflecting mirror stage 82 via the reflecting mirror stage controller 83. Based on the reflecting mirror rotation information given from the main controller 25 via the reflecting mirror stage controller 83, the reflecting mirror stage 82 moves the reflecting mirror 81 around the light reflecting side axis L3 along the rotating direction of the arrow C. To rotate.

  Further, the reflecting mirror stage 82 provides reflecting mirror rotation information, for example, an angle displaced from the reference position, to the main controller 25 via the reflecting mirror stage controller 83. The main controller 25 represents a rotation amount when the substrate stage 31 is driven to rotate about the substrate side axis L1 based on the reflecting mirror rotating information given from the reflecting mirror stage 82 via the reflecting mirror stage controller 83. Substrate rotation information, which is information, is generated and provided to the substrate drive unit 41 via the substrate stage controller 26. The substrate drive unit 41 rotates the substrate stage 31 around the substrate-side axis L1 along the rotation direction of the arrow A based on the substrate rotation information given from the main controller 25 via the substrate stage controller 26. Drive.

  In the present embodiment, the reflecting mirror 81 is rotated around the light reflecting side axis L3 in the rotating direction of the arrow C by the reflecting mirror stage 82 based on the reflecting mirror drive information given from the reflecting mirror stage controller 83. Let Further, the substrate drive unit 41 rotates the substrate stage 31 in the rotation direction of the arrow A around the substrate-side axis L <b> 1 based on the substrate drive information given from the substrate stage controller 26. The light emitted from the light source 45 is reflected by the reflecting mirror 81 and irradiated to the other surface in the thickness direction of the substrate 35, in other words, the other surface in the front-rear direction X of the substrate 35, and the light transmitted through the substrate 35 is transmitted through the resist layer 36. Is incident on.

  In the present embodiment, the optical axis of the light 48 emitted from the light source 45 and reflected by the reflecting mirror 81, the exposure surface of the resist layer 36 that is an exposure layer formed on the substrate 35, specifically, the resist layer 36. In other words, the resist layer 36 is exposed by changing the angle of the other surface in the thickness direction, in other words, the angle of the resist layer 36 with respect to the front and rear direction X other surface.

  The rotation speed of the substrate stage 31 around the first axis L1 can be arbitrarily set by the substrate driving unit 41. The rotational speed of the reflecting mirror 81 around the light reflection side axis L3 can be arbitrarily set by the reflecting mirror stage 83. It is also possible to control the amount of light emitted from the light source 45 toward the substrate 35 from the light source 45 via the reflecting mirror 81.

  In the present embodiment, the reflecting mirror 81 is moved around the light reflecting side axis L3 that is predetermined by the reflecting mirror stage 82 in relation to the rotation operation of the substrate stage 31 around the predetermined substrate side axis L1 by the substrate driving unit 41. Rotate. Thus, the angle between the optical axis of the light emitted from the light source 45 and reflected by the reflecting mirror 81 to the resist layer 36 of the substrate 35 held by the substrate stage 31 and the exposure surface of the resist layer 36. The resist layer 36 is exposed to light while relatively changing.

  In the present embodiment, the resist layer 36 is exposed while simultaneously rotating the substrate stage 31 about the predetermined substrate side axis L1 and rotating the reflecting mirror 81 about the predetermined light reflection side axis L3. Alternatively, the resist layer 36 may be exposed in a state where any one of the rotation operations of the substrate stage 31 and the reflecting mirror 81 is performed and the other rotation operation is stopped. It may be.

  As described above, according to the present embodiment, since the reflecting mirror 81 that is relatively lighter than the light source 45 is rotated by the reflecting mirror stage 82, the reflecting is performed with a relatively smaller driving force than when the light source 45 is rotated. The mirror 81 can be rotated. Therefore, the rated output of the reflecting mirror stage 82 that rotates the reflecting mirror 81 can be made smaller than the rated output of the drive unit that rotates the light source 45. As a result, the manufacturing cost of the exposure apparatus 71 can be reduced and the exposure apparatus 71 can be made smaller than when the light source 45 is rotated.

  Further, the present embodiment has a configuration similar to that of the first embodiment described above, and specifically, only the configuration using the light source 45 and the reflector driving unit 80 in place of the light source driving unit 23 is used. Therefore, the same effect as in the first embodiment can be obtained.

  FIG. 19 is a diagram showing a simplified configuration of an exposure apparatus 200 according to the fourth embodiment of the present invention. FIG. 19 shows the exposure apparatus 200 viewed from one side in the left-right direction Y. FIG. 20 is a view of the substrate 35, the substrate driving unit 100, and the reflecting mirror 81 transported by the transport unit 120 as viewed from one side in the vertical direction Z. In FIG. 20, the light source 45 is omitted for easy understanding. FIG. 21 is a view of the substrate driving unit 100 as seen from the other side in the front-rear direction X. FIG. 22 is a diagram illustrating a state in which the substrate 35 transported from the substrate transport unit 120 is installed on the substrate stage 31. Since exposure apparatus 200 is similar to the first and third embodiments described above, only different configurations will be described, and the same configurations will be denoted by the same reference numerals and description thereof will be omitted. In FIG. 19, the substrate holding part 32, the fixed side holding part 33, and the movable side holding part 34 included in the substrate stage 31 are omitted for easy understanding.

  In the present embodiment, the front-rear direction (in FIG. 19, the left-right direction of the paper surface) X, which is the thickness direction of the substrate stage 31, and the left-right direction, which is a direction parallel to the surface perpendicular to the thickness direction of the substrate stage 31 ( In 19, the direction Y perpendicular to the paper surface Y exists on a virtual plane perpendicular to the vertical direction Z (the vertical direction of the paper surface in FIG. 19) Z. The front-rear direction X, the left-right direction Y, and the vertical direction Z constitute a three-dimensional orthogonal coordinate system that is orthogonal to each other. In the present embodiment, the front-rear direction X refers to a direction in which the reflecting mirror driving unit 80 approaches or separates from the substrate driving unit 100.

The exposure apparatus 200 includes a substrate driving unit 100, a reflecting mirror driving unit 80, a substrate ID (
Identification) comprises a reading means 24, a main controller 25, a reflector stage controller 83, and a substrate drive controller 84. The substrate driving unit 100 includes a substrate stage 31 and a substrate driving unit 101. The reflecting mirror drive unit 80 has the same configuration as that of the third embodiment. The configuration and function of the reflecting mirror 81, which is a light reflecting portion, are the same as those in the third embodiment. In the present embodiment, the holding unit 130 that holds the substrate holding units 32 at both ends in the vertical direction Z is provided. The cross-sectional shape of the grip portion 130 viewed from one side in the left-right direction Y is substantially concave. The holding part 130 faces the reflecting mirror drive unit 80 and is formed with a recess that opens to the other side in the front-rear direction X, and the substrate stage 31 that is a holding part is provided in the recess.

  The substrate drive unit 101 which is a substrate side drive unit is realized by, for example, an industrial articulated robot. The substrate drive unit 101 includes a base 111, an arm drive mechanism 112, a first arm 113 and a second arm 114. The base 111 is formed in a rectangular parallelepiped shape. The arm drive mechanism 112 is provided on one side of the base 111 in the vertical direction Z. The arm driving mechanism 112 is connected to one end of the first arm 113 in the longitudinal direction. The arm drive mechanism 112 is configured to be able to rotate the first arm 113 along the rotation direction of the arrow D around the arm rotation axis L10 parallel to the vertical direction Z. The arm drive mechanism 112 includes an arm rotation drive source realized by, for example, a motor, and the arm rotation drive source rotates the first arm 113 around the arm rotation axis L10.

  One end of the first arm 113 connected to the arm drive mechanism 112 in the longitudinal direction is configured to be rotatable around a first link axis L11 parallel to the left-right direction Y by a rotation drive source such as a motor. The The other end in the longitudinal direction of the first arm 113 is connected to one end in the longitudinal direction of the second arm 114. The other end in the longitudinal direction of the first arm 113 and the one end in the longitudinal direction of the second arm 114 can be rotated around the second link axis L12 parallel to the left-right direction Y by a rotational drive source such as a motor. Composed.

  The other end of the second arm 114 in the longitudinal direction is connected to the substrate stage 31. The substrate stage 31 is configured to be rotatable around a third link axis L13 parallel to the left-right direction Y by a rotation drive source such as a motor. The grip portion 130 at one end portion in the vertical direction is provided with a connection portion 140 that protrudes from one surface portion in the vertical direction Z to one side in the vertical direction Z. More specifically, a plurality of, in the present embodiment, two connection portions 140 are provided at an intermediate portion between both ends in the left-right direction Y of the grip portion 130 at one end portion in the vertical direction. By connecting the second arm 114 to the connecting portion 140, the substrate stage 31 can be rotated around the third link axis L13.

  Therefore, in the present embodiment, the substrate stage 31 can move in the front-rear direction X and the vertical direction Z, and can rotate about the arm rotation axis L10 of the arm rotation mechanism 112.

  The main controller 25 checks whether or not the substrate 35 is to be exposed based on the substrate ID information given from the substrate ID reading means 24, and drives the substrate drive controller 84 based on the substrate ID information. Information (hereinafter, simply referred to as “substrate drive information”) and information indicating drive conditions for driving the reflector stage controller 83 (hereinafter simply “reflector drive information”). May be written). The main controller 25 provides the generated substrate drive information to the substrate drive controller 84 and also provides the generated reflector drive information to the reflector stage controller 83. The board drive controller 84 gives the board drive information given from the main controller 25 to the board drive unit 101.

  The substrate drive unit 101 drives the substrate stage 31 to rotate about the arm rotation axis L10 along the rotation direction of the arrow D on the basis of the substrate drive information given from the substrate drive controller 84, as well as the substrate stage. 31 is translated in the vertical direction Z. The reflecting mirror stage controller 83 gives the reflecting mirror drive information given from the main controller 25 to the reflecting mirror stage 82. Based on the reflecting mirror drive information given from the reflecting mirror stage controller 83, the reflecting mirror stage 82 drives the reflecting mirror 81 to rotate about the light reflecting side axis L3 along the rotating direction of the arrow C.

  The substrate drive unit 101 also represents information representing the amount of rotation when the substrate stage 31 is driven to rotate about the arm rotation axis L10 and the amount of movement when the substrate stage 31 is translated in the vertical direction Z (hereinafter referred to as the amount of rotation). For example, an angle and a displacement amount displaced from the reference position are given to the main controller 25 via the substrate drive controller 84. The main controller 25 is information representing the amount of rotation when the reflecting mirror 81 is driven to rotate about the light reflection side axis L3 based on the substrate driving information provided from the substrate driving unit 101 via the substrate driving controller 84. (Hereinafter sometimes referred to as “reflecting mirror rotation information”) is generated and provided to the reflecting mirror stage 82 via the reflecting mirror stage controller 83. Based on the reflecting mirror rotation information given from the main controller 25 via the reflecting mirror stage controller 83, the reflecting mirror stage 82 moves the reflecting mirror 81 around the light reflecting side axis L3 along the rotating direction of the arrow C. To rotate.

  Further, the reflecting mirror stage 82 provides reflecting mirror rotation information, for example, an angle displaced from the reference position, to the main controller 25 via the reflecting mirror stage controller 83. Based on the reflecting mirror rotation information given from the reflecting mirror stage 82 via the reflecting mirror stage controller 83, the main controller 25 rotates the amount of rotation when the substrate stage 31 is rotated around the arm rotation axis L10. Substrate drive information representing the amount of movement when the substrate stage 31 is translated in the vertical direction Z is generated and provided to the substrate drive unit 101 via the substrate drive controller 84. The substrate drive unit 101 rotates the substrate stage 31 around the arm rotation axis L10 along the rotation direction of the arrow D based on the substrate drive information given from the main controller 25 via the substrate drive controller 84. While being driven, the substrate stage 31 is translated in the vertical direction Z.

  The substrate 35 whose substrate ID information has been read by the substrate ID reading unit 24 is placed on the transfer table of the substrate transfer unit 120 so that the surface of the resist layer 36 formed on the substrate 35 is exposed. In the direction of T, the wafer is transported toward a predetermined position in the vicinity of the substrate driving unit 101 of the exposure apparatus 200. The substrate transfer means 120 is provided with a substrate push-up pin 121 that can protrude in one vertical direction Z with respect to the transfer table and can be immersed in the other vertical direction Z with respect to the transfer table. When the board | substrate 35 is conveyed, the board | substrate pushing-up pin 121 is immersed in the other vertical direction Z with respect to the conveyance stand. When the substrate push-up pin 121 protrudes in the vertical direction Z from the surface of the transport table, the substrate 35 is transported by the substrate transport means 120 so as to come into contact with a portion other than the region to be exposed of the rectangular substrate 35. Placed on the table.

  More specifically, in the present embodiment, one end of the substrate 35 in the longitudinal direction and one end in the width direction, the other end in the longitudinal direction of the substrate 35 and one end in the width direction, and one end in the longitudinal direction of the substrate 35 and the width direction. The substrate 35 is placed on the transfer table of the substrate transfer means 120 so as to come into contact with the substrate push-up pins 121 at the other end portion and the other end portion in the longitudinal direction of the substrate 35 and the other end portion in the width direction.

  As shown in FIG. 20, the substrate 35 on which the resist layer 36 is formed is conveyed to a predetermined position near the substrate driving unit 101 of the exposure apparatus 200 by the conveying means 120. When the substrate 35 is transported to a predetermined position, as shown in FIG. 22, the substrate push-up pin 121 of the substrate transport means 120 protrudes in the vertical direction Z and pushes up the substrate 35 in the vertical direction Z. Next, the substrate drive unit 101 moves the substrate stage 31 to above the substrate 35 placed on the transfer table of the substrate transfer means 120. Next, the fixed side holding portion 33 of the substrate stage 31 is brought into contact with the resist layer 36 from one side of the vertical direction Z of the substrate 35, and the movable side holding portion 34 of the substrate stage 31 is set from the other side of the vertical direction Z of the substrate 35 to the substrate. 35. As described above, the substrate 35 on which the resist layer 36 is formed is sandwiched between the fixed-side sandwiching portion 33 and the movable-side sandwiching portion 34. As a result, the substrate 35 is placed on the substrate stage 31. Next, the substrate drive unit 101 moves the substrate stage 31 on which the substrate 35 is installed to a predetermined exposure position.

  After the resist layer 36 formed on the substrate 35 is exposed, the substrate driving unit 101 moves the substrate stage 31 holding the exposed substrate 35 above the transport table of the substrate transport unit 120. Next, the exposed substrate 35 is placed on the substrate transfer means 120 from which the substrate push-up pin 121 protrudes, and the substrate 35 is released by releasing the fixed state of the fixed side holding portion 33 and the movable side holding portion 34. The removed substrate 35 is removed from the substrate stage 31. When the exposed substrate 35 is removed from the substrate stage 31, the substrate push-up pins 121 are in a state before protruding from the surface of the transfer table of the substrate transfer unit 120, in other words, in the vertical direction Z with respect to the transfer table of the substrate transfer unit 120. Returning to the state immersed in the other, the exposed substrate 35 is transported to a predetermined position by the transport means 120.

  FIG. 23 is a diagram showing a state in which the resist layer 36 formed on the substrate 35 is exposed. In FIG. 23, the figure which looked at the board | substrate drive part 101, the board | substrate stage 31, and the reflective mirror 81 from the vertical direction Z one side is shown. In FIG. 23, the light source 45 is omitted for easy understanding. 24, 25, and 26 are views showing a state in which the resist layer 36 formed on the substrate 35 is exposed. 24, 25, and 26 show the substrate drive unit 100, the light source 45, and the reflecting mirror 81 as viewed from the left-right direction Y. In FIG. 24, FIG. 25 and FIG. 26, the reflector stage 82 is omitted for easy understanding.

  In the present embodiment, the substrate stage 31 is rotated around the arm rotation axis L10 along the rotation direction of the arrow D based on the substrate drive information provided from the substrate drive controller 84. The light 48 emitted from the light source 45 and reflected by the reflecting mirror 81 is applied to the other surface in the thickness direction of the substrate 35, in other words, the other surface in the front-rear direction X of the substrate 35, and the light transmitted through the substrate 35 is transmitted through the resist layer 36. Is incident on. In the present embodiment, the optical axis of the light 48 emitted from the light source 45 and reflected by the reflecting mirror 81, the exposure surface of the resist layer 36 that is an exposure layer formed on the substrate 35, specifically, the resist layer 36. In other words, the resist layer 36 is exposed by changing the angle of the other surface in the thickness direction, in other words, the angle of the resist layer 36 with respect to the front and rear direction X other surface.

  A rotation speed of the substrate stage 31 around the arm rotation axis L10 by the substrate driving unit 101 can be arbitrarily set by the substrate driving unit 101. The rotational speed of the reflecting mirror 81 around the light reflection side axis L3 can be arbitrarily set by the reflecting mirror stage 83. It is also possible to control the amount of light emitted from the light source 45 toward the substrate 35 from the light source 45 via the reflecting mirror 81.

  In the present embodiment, the substrate drive unit 101 moves the substrate stage 31 in parallel to the vertical direction Z based on the substrate drive information given from the substrate drive controller 84. At this time, the first arm 113 and the second arm 114 of the substrate driving unit 101 are driven to rotate by a predetermined angle around the first link axis L11 and the second link axis L12, respectively, and the substrate stage 31 is driven. Is driven to rotate by a predetermined angle around the third link axis L13.

  Further, the substrate driving unit 101 moves the substrate stage 31 in parallel in a virtual plane perpendicular to the thickness direction of the substrate 35 while maintaining the substrate 35 substantially vertical. Specifically, the substrate stage 31 is moved in parallel to the virtual plane. More specifically, in the present embodiment, the substrate 35 may be in a state of being maintained substantially vertical, and the substrate stage 31 holding the substrate 35 may be displaced in the front-rear direction X. When the resist layer 36 formed on the substrate 35 is exposed, the moving speed when the substrate stage 31 is moved in parallel in a virtual plane perpendicular to the thickness direction of the substrate 35 is constant. That is, the substrate stage 31 is moved at a constant speed.

  The reflecting mirror stage 82 rotates the reflecting mirror 81 around the light reflecting side axis L3 along the rotating direction of the arrow C based on reflecting mirror drive information given from the reflecting mirror stage controller 83. In the present embodiment, in relation to the movement operation of the substrate stage 31 parallel to the vertical direction Z by the substrate driving unit 101, the light is emitted from the light source 45 and reflected by the reflecting mirror 81 and is applied to the resist layer 36 of the substrate 35. The resist layer 36 is exposed while relatively changing the angle between the optical axis of the irradiated light 48 and the exposure surface of the resist layer 36.

  In the present embodiment, the substrate driving unit 101 rotates the substrate stage 31 around the arm rotation axis L10 and translates it in the vertical direction Z, and the light reflecting side axis L3 of the reflecting mirror 81 by the reflecting mirror stage 82. The resist layer 36 may be exposed while simultaneously rotating around. In addition, one of the rotating operation and the parallel moving operation of the substrate stage 31 by the substrate driving unit 101 and the rotating operation of the reflecting mirror 81 by the reflecting mirror stage 82 is performed, and the other operation is stopped. In this state, the resist layer 36 may be exposed.

  As described above, according to the present embodiment, the substrate stage 31 holds the substrate 35 on which the resist layer 36 is formed by applying a material to be exposed, for example, a photoresist, while holding the peripheral portion thereof. The substrate drive unit 101 holds the substrate stage 31 in parallel in a virtual plane perpendicular to the thickness direction of the substrate while maintaining the substrate 35 substantially vertical, specifically, the substrate stage 31. The stage 31 is moved in parallel with the virtual plane. In relation to the parallel movement operation of the substrate stage 31 by the substrate driving unit 101, the optical axis of the light 48 from the light source 45 irradiated to the resist layer 36 of the substrate 35 held by the substrate stage 31, and the resist layer The resist layer 36 is exposed while relatively changing the angle with the exposure surface 36.

  As described above, when the angle between the optical axis of the light 48 irradiated to the resist layer 36 of the substrate 35 by the light source 45 and the exposure surface of the resist layer 36 is relatively changed, the substrate driving unit 101 causes the substrate stage to be changed. 31 can be moved in parallel in an imaginary plane perpendicular to the thickness direction of the substrate 35 in a state where the substrate 35 is maintained substantially vertical, so that the optical axis of the light applied to the resist layer 36 is The degree of freedom in designing the exposure apparatus 200 that changes the angle of the resist layer 36 with the exposure surface can be increased.

  Further, for example, the substrate 35 on which the photoresist layer 36 is formed by applying a photoresist is held substantially vertically with its peripheral edge held by the substrate stage 31, and the substrate stage 31 is held by the substrate driving unit 101. Since the substrate 35 is moved in parallel in a virtual plane perpendicular to the thickness direction of the substrate 35 in a state where the substrate 35 is maintained substantially vertical, it is possible to suppress the occurrence of bending of the substrate 35 due to gravity acting on the substrate 35. . More specifically, as the area of the substrate 35 becomes larger as compared with the case where the substrate 35 is horizontally arranged as in the prior art, the occurrence of bending of the substrate 35 can be effectively suppressed. Thereby, non-uniform exposure to the resist layer 36 formed on the substrate 35 can be reduced as much as possible.

  The substrate stage 31 holds the substrate 35 in a state where the peripheral edge of the substrate 35 is gripped. Further, when holding the resist layer 36 formed on the substrate 35, the substrate stage 31 holds the substrate 35 in a state where the resist layer 36 outside the region to be exposed is held. Accordingly, the contact area between the substrate 35 and the substrate 35, specifically, the fixed-side clamping unit 33 and the movable-side clamping unit 34, and the substrate 35 is small. As a result, it is possible to minimize the occurrence of fluctuations in the thickness dimension of the resist layer 36 as in the above-described conventional technique, and the dust being buried in the resist layer 36 as much as possible.

  Since the substrate 35 is configured to be held in a state where the peripheral portion of the substrate 35 is gripped, the light that is emitted from the light source 45 to the substrate stage 31 and the substrate driving unit 101 from the peripheral portion of the substrate 35. It can be set as the structure spaced apart in the emission direction from the board | substrate 35 of this. Therefore, the reflection of light from the light source 45 by the substrate stage 31 and the substrate driving unit 101 is reduced, and the occurrence of problems due to the resist layer 36 formed on the substrate 35 being irradiated with reflected light and exposed again. For example, it is possible to prevent a microlens having an undesired shape from being formed. In other words, a microlens having a desired shape can be formed.

  Further, according to the present embodiment, in relation to the parallel movement operation of the substrate stage 31 in the vertical direction Z by the substrate driving unit 101, the reflecting mirror stage 82 rotates the reflecting mirror 81 around the light reflection side axis L3. As a result, the angle between the optical axis of the light 48 emitted from the light source 45, reflected by the reflecting mirror 81 and applied to the resist layer 36 formed on the substrate 35, and the exposure surface of the resist layer 36 is relatively set. While changing, the resist layer 36 is exposed. Thus, by rotating the reflecting mirror 81 that is relatively lighter than the light source 45 by the reflecting mirror stage 82, the reflecting mirror 81 is rotated with a relatively smaller driving force than when the light source 45 is rotated. Can do. Therefore, the rated output of the reflecting mirror stage 82 that rotates the reflecting mirror 81 can be made smaller than the rated output of the drive unit that rotates the light source 45. As a result, the manufacturing cost of the exposure apparatus 200 can be reduced and the exposure apparatus 200 can be made smaller than when the light source 45 is rotated.

  Further, according to the present embodiment, the movement speed when the substrate driving unit 101 moves the substrate stage 31 in parallel in a virtual plane perpendicular to the thickness direction of the substrate 35 on which the resist layer 36 is formed is constant. It is. If the moving speed of the substrate stage 31 is not constant, for example, if the substrate stage 31 is accelerated or decelerated, the substrate stage 31 holding the substrate 35 vibrates and the substrate 35 is distorted. Therefore, as described above, by making the moving speed of the substrate stage 31 constant, it is possible to prevent the substrate 35 from being distorted. Further, by making the moving speed of the substrate stage 31 constant, it is possible to expose the resist layer 36 while suppressing the vibration of the substrate stage 31, so that the resist layer 36 formed on the substrate 35 can be exposed. Uniform exposure can be reduced as much as possible.

  Further, according to the present embodiment, the exposure apparatus 200 is provided in advance to move the substrate stage 31 in parallel in a virtual plane perpendicular to the thickness direction of the substrate 35 while maintaining the substrate 35 substantially vertical. The substrate driving unit 101 holds the substrate 35 on which the resist layer 36 conveyed by the conveying means 120 is formed, and unloads the substrate 35 on which the resist layer 36 is exposed. Therefore, it is not necessary to provide the exposure apparatus 200 with a dedicated mechanism for holding the substrate 35 that has been transported and carrying out the substrate 35 on which the resist layer 36 has been exposed. This can prevent the exposure apparatus 200 from becoming large.

  Further, the substrate driving unit 101 holds the substrate 35 transported by the transport unit 120 and unloads the substrate 35 on which the resist layer 36 is exposed, thereby providing a dedicated mechanism to hold and hold the substrate 35. Compared with the case where the substrate 35 is unloaded, the time required to unload the substrate 35 can be shortened.

  FIG. 27 is a diagram showing a simplified configuration of an exposure apparatus 300 according to the fifth embodiment of the present invention. FIG. 27 shows the exposure apparatus 300 as viewed from one side in the left-right direction Y. In FIG. 27, in order to facilitate understanding, the substrate holding part 32, the fixed side holding part 33, and the movable side holding part 34 included in the substrate stage 31 are omitted. Since exposure apparatus 300 is similar to the first and fourth embodiments described above, only different components will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.

  In the present embodiment, the front-rear direction (in FIG. 27, the left-right direction of the paper surface) X, which is the thickness direction of the substrate stage 31, and the left-right direction, which is a direction parallel to the surface perpendicular to the thickness direction of the substrate stage 31 ( In FIG. 27, the direction Y perpendicular to the paper surface Y is on a virtual plane perpendicular to the vertical direction Z (the vertical direction of the paper surface in FIG. 27). The front-rear direction X, the left-right direction Y, and the vertical direction Z constitute a three-dimensional orthogonal coordinate system that is orthogonal to each other. In the present embodiment, the front-rear direction X refers to a direction in which the light source drive unit 23 approaches or separates from the substrate drive unit 100.

The exposure apparatus 300 includes a substrate driving unit 100, a light source driving unit 23, a substrate ID (
Identification) comprises reading means 24, main controller 25, light source stage controller 27, and substrate drive controller 84. The substrate driving unit 100 includes a substrate stage 31 and a substrate driving unit 101. The light source drive unit 23 includes a light source 45 that is a light irradiation unit, a light source stage 46, and a connection member 47.

  In the present embodiment, the substrate stage 31 that is the holding unit is moved by the arrow D around the arm rotation axis L10 by the substrate driving unit 101 that is the substrate side driving unit, as in the fourth embodiment described above. It is rotationally driven along the rotational direction. Further, the substrate stage 31 is moved in parallel in a virtual plane perpendicular to the thickness direction of the substrate 35 while the substrate 35 is maintained substantially vertical. Specifically, the substrate stage 31 is moved in parallel to the virtual plane. .

  A predetermined light source side axis L2 of the light source stage 46 that is a light source side driving unit is a substrate stage 31 that is disposed at a predetermined position when the substrate stage 31 starts exposure, specifically, a light source that is a light irradiation unit. An incident side surface to which light 48 from the light source 45 of the substrate 35 held by the substrate stage 31 disposed at the front position 45 is incident, and the incident light of the resist layer 36 formed on the substrate 35. Is disposed between the light-emitting surface and the light-emitting surface. The light source 45 is rotated about the light source side axis L2 along the rotation direction of the arrow B by the light source stage 46, as in the first embodiment.

  The main controller 25 checks whether or not the substrate 35 is to be exposed based on the substrate ID information given from the substrate ID reading means 24, and drives the substrate drive controller 84 based on the substrate ID information. Information representing drive conditions (hereinafter simply referred to as “substrate drive information”) and information representing drive conditions for driving the light source stage controller 27 (hereinafter simply referred to as “light source drive information”). To generate). The main controller 25 provides the generated substrate drive information to the substrate drive controller 84 and also provides the generated light source drive information to the light source stage controller 27.

  The board drive controller 84 gives the board drive information given from the main controller 25 to the board drive unit 101. The substrate drive unit 101 drives the substrate stage 31 to rotate about the arm rotation axis L10 along the rotation direction of the arrow D on the basis of the substrate drive information given from the substrate drive controller 84, as well as the substrate stage. 31 is translated in the vertical direction Z. The light source stage controller 27 gives the light source drive information given from the main controller 25 to the light source stage 46. Based on the light source drive information given from the light source stage controller 27, the light source stage 46 drives the light source 45 to rotate about the light source side axis L2 along the rotation direction of the arrow B.

  The substrate drive unit 101 also represents information representing the amount of rotation when the substrate stage 31 is driven to rotate about the arm rotation axis L10 and the amount of movement when the substrate stage 31 is translated in the vertical direction Z (hereinafter referred to as the amount of rotation). For example, an angle and a displacement amount displaced from the reference position are given to the main controller 25 via the substrate drive controller 84. The main controller 25 is information (hereinafter referred to as a rotation amount) when the light source 45 is driven to rotate around the light source side axis L <b> 2 based on the substrate drive information given from the substrate drive unit 101 via the substrate drive controller 84. , May be referred to as “light source rotation information”) and is provided to the light source stage 46 via the light source stage controller 27. The light source stage 46 rotates the light source 45 around the light source side axis L2 along the rotation direction of the arrow B based on the light source rotation information given from the main controller 25 via the light source stage controller 46. .

  Further, the light source stage 46 gives light source rotation information, for example, an angle displaced from the reference position, to the main controller 25 via the light source stage controller 27. Based on the light source rotation information provided from the light source stage 46 via the light source stage controller 27, the main controller 25 rotates the substrate stage 31 around the arm rotation axis L10 and the substrate stage 31. Is generated, and is given to the substrate drive unit 101 via the substrate drive controller 84. The substrate drive unit 101 rotates the substrate stage 31 around the arm rotation axis L10 along the rotation direction of the arrow D based on the substrate drive information given from the main controller 25 via the substrate drive controller 84. While being driven, the substrate stage 31 is translated in the vertical direction Z.

  In the present embodiment, the light source 45 is caused to move the light source 45 by the light source stage 46 in relation to the movement operation parallel to the vertical direction Z of the substrate stage 31 by the substrate driving unit 101 and the rotation operation about the arm rotation axis L10. By rotating the lens around the resist layer 36, the angle of the optical axis of the light 48 emitted from the light source 45 and applied to the resist layer 36 of the substrate 35 and the exposure surface of the resist layer 36 is changed relatively. Layer 36 is exposed.

  In the present embodiment, the substrate drive unit 101 rotates the substrate stage 31 around the arm rotation axis L10 and translates it in the vertical direction Z, and the light source stage 46 rotates the light source 45 around the light source side axis L2. The resist layer 36 may be exposed while simultaneously performing the moving operation. In addition, a state in which any one of the rotation operation and the parallel movement operation of the substrate stage 31 by the substrate driving unit 101 and the rotation operation of the light source 45 by the light source stage 46 is performed and the other operation is stopped. Thus, the resist layer 36 may be exposed.

  As described above, according to the present embodiment, as in the fourth embodiment, the substrate stage 31 is a substrate on which a resist layer 36 is formed by applying a material to be exposed, for example, a photoresist. 35 is held substantially vertically with its peripheral edge held, and the substrate drive unit 101 holds the substrate stage 31 in a virtual direction perpendicular to the thickness direction of the substrate while maintaining the substrate 35 substantially vertical. The substrate stage 31 is moved in parallel with the virtual plane. In relation to the parallel movement operation of the substrate stage 31 by the substrate driving unit 101, the optical axis of the light 48 from the light source 45 irradiated to the resist layer 36 of the substrate 35 held by the substrate stage 31, and the resist layer The resist layer 36 is exposed while relatively changing the angle with the exposure surface 36.

  As described above, when the angle between the optical axis of the light 48 irradiated to the resist layer 36 of the substrate 35 by the light source 45 and the exposure surface of the resist layer 36 is relatively changed, the substrate driving unit 101 causes the substrate stage to be changed. 31 can be moved in parallel in an imaginary plane perpendicular to the thickness direction of the substrate 35 in a state where the substrate 35 is maintained substantially vertical, so that the optical axis of the light applied to the resist layer 36 is The degree of freedom in designing the exposure apparatus 300 that changes the angle with the exposure surface of the resist layer 36 can be increased.

  Further, for example, the substrate 35 on which the photoresist layer 36 is formed by applying a photoresist is held substantially vertically with its peripheral edge held by the substrate stage 31, and the substrate stage 31 is held by the substrate driving unit 101. Since the substrate 35 is moved in parallel in a virtual plane perpendicular to the thickness direction of the substrate 35 in a state where the substrate 35 is maintained substantially vertical, it is possible to suppress the occurrence of bending of the substrate 35 due to gravity acting on the substrate 35. . More specifically, as the area of the substrate 35 becomes larger as compared with the case where the substrate 35 is horizontally arranged as in the prior art, the occurrence of bending of the substrate 35 can be effectively suppressed. Thereby, non-uniform exposure to the resist layer 36 formed on the substrate 35 can be reduced as much as possible.

  The substrate stage 31 holds the substrate 35 in a state where the peripheral edge of the substrate 35 is gripped. Further, when holding the resist layer 36 formed on the substrate 35, the substrate stage 31 holds the substrate 35 in a state where the resist layer 36 outside the region to be exposed is held. Accordingly, the contact area between the substrate 35 and the substrate 35, specifically, the fixed-side clamping unit 33 and the movable-side clamping unit 34, and the substrate 35 is small. As a result, it is possible to minimize the occurrence of fluctuations in the thickness dimension of the resist layer 36 as in the above-described conventional technique, and the dust being buried in the resist layer 36 as much as possible.

  Since the substrate 35 is configured to be held in a state where the peripheral portion of the substrate 35 is gripped, the light that is emitted from the light source 45 to the substrate stage 31 and the substrate driving unit 101 from the peripheral portion of the substrate 35. It can be set as the structure spaced apart in the emission direction from the board | substrate 35 of this. Therefore, the reflection of light from the light source 45 by the substrate stage 31 and the substrate driving unit 101 is reduced, and the occurrence of problems due to the resist layer 36 formed on the substrate 35 being irradiated with reflected light and exposed again. For example, it is possible to prevent a microlens having an undesired shape from being formed. In other words, a microlens having a desired shape can be formed.

  Further, according to the present embodiment, the resist layer 36 formed on the substrate 35 in relation to the parallel movement operation of the substrate stage 31 by the substrate driving unit 101 and the rotation operation of the substrate stage 31 around the arm rotation axis L10. The light source 45 for irradiating light is rotated around the light source side axis L2 by the light source stage 46, and the optical axis of the light applied to the resist layer 36 of the substrate 35 held by the substrate stage 31 and the resist The resist layer 36 is exposed while relatively changing the angle of the layer 36 with the exposure surface. Therefore, the moving speed and moving amount of the substrate stage 31 can be reduced. As a result, the occupied space in which the exposure apparatus 300 is installed can be reduced, so that the equipment cost can be reduced and the exposure apparatus 300 can be miniaturized.

  Each of the embodiments described above is merely an example of the present invention, and the configuration can be changed within the scope of the present invention. For example, in the first and second embodiments described above, an axis parallel to the vertical direction Z is selected as the substrate-side axis L1, and the substrate stages 31 and 63 are driven to rotate around the axis parallel to the vertical direction Z. However, in another embodiment of the present invention, an axis parallel to the front-rear direction X is selected as the substrate-side axis L1, and the substrate stages 31, 63 are arranged around the axis parallel to the front-rear direction X. May be configured to be rotationally driven. Even when configured in this manner, the same effects as those of the first and second embodiments described above can be obtained.

  Further, in the first embodiment described above, the substrate holding part 32 and the fixed side holding part 33 are formed separately, but in other embodiments of the present invention, the substrate holding part 32 and the fixed side are formed. The holding portion 33 may be integrally formed. In the second embodiment described above, the first mask holding part 64 and the second mask holding part 65 are formed separately. However, in other embodiments of the present invention, the first mask holding part is provided. The part 64 and the second mask holding part 65 may be integrally formed.

  In the third to fifth embodiments described above, the configuration in which exposure is performed while holding the substrate 35 by the substrate stage 31 has been described. However, similarly to the second embodiment described above, light is transmitted. The mask substrate on which the light transmission pattern should be formed may be held and exposed by the substrate stage. Even when configured in this manner, the same effects as those of the second embodiment described above can be obtained. That is, it is possible to suppress the occurrence of bending of the mask substrate due to gravity acting on the mask substrate. More specifically, as the area of the mask substrate increases as compared with the case where the mask substrate is horizontally arranged as in the prior art, the occurrence of bending of the mask substrate can be effectively suppressed. Thereby, non-uniform exposure to the resist layer 36 formed on the substrate 35 can be reduced as much as possible.

  In the third and fourth embodiments described above, the configuration is described in which the reflecting mirror stage 82 is rotated around the light reflecting side axis L3 for exposure by the reflecting mirror stage 82. However, other embodiments of the present invention are described. Then, an axis perpendicular to the surface of the reflecting mirror 81 is selected as the light reflecting side axis, and the reflecting mirror 81 is driven to rotate around an axis perpendicular to the surface of the reflecting mirror 81 for exposure. Good.

  Further, in the first to fifth embodiments described above, the surface on the side from which the irradiation light 48 from the light source 45 is emitted, in this embodiment, the light 48 emitted from the light source 45 of the substrate 35 or the resist layer 36 is emitted. A space is formed by the substrate driving unit 41, the gripping unit 130, the substrate stages 31 and 63, the substrate 35 on which the resist layer 36 is formed, and the like, and the resist layer 36 or the substrate 35 is emitted in the region where the emission-side surface facing Although the configuration is such that the irradiation light 48 from the light source 45 is reflected by another member and prevents the occurrence of defects due to the exposure to the resist layer 36 again, in another embodiment of the present invention, the resist Irradiation light from the light source 45 emitted from the resist layer 36 or the substrate 35 by providing an antireflection film on one surface portion of the substrate driving portion 41 or the gripping portion 130 facing the layer 36 or the substrate 35. 8 is reflected, again, it may be configured to prevent exposure to the resist layer 36.

It is a figure which simplifies and shows the structure of the exposure apparatus 21 which is the 1st Embodiment of this invention. It is the figure which looked at the board | substrate drive unit 22 from the perpendicular direction Z one side. It is the figure which looked at the light source drive unit 23 from the perpendicular direction Z one side. It is the figure which looked at the board | substrate drive unit 22 from the front-back direction X other side. It is a figure which expands and shows the liquid crystal display part 51 of the board | substrate 35 seen from the front-back direction X other side. It is sectional drawing seen from the cut surface line AA of FIG. It is sectional drawing seen from the cut surface line BB of FIG. It is a figure which shows the state which rotates the light source 45 around the 2nd axis line L2, and exposes to the resist layer 36 formed in the board | substrate 35. FIG. FIG. 3 is a diagram showing a state in which a substrate stage 31 is rotated around a first axis L1 and a resist layer 36 formed on a substrate 35 is exposed. FIG. 5 is a diagram for explaining exposure to a resist layer 36. It is a figure which shows the micro lens array 57 formed after exposure. It is a figure which shows the micro lens array 57 formed after exposure. 4 is a flowchart showing a procedure for forming a microlens array 57 by the exposure device 21. It is a figure which simplifies and shows the structure of the exposure apparatus 61 which is the 2nd Embodiment of this invention. It is a figure which shows the state which rotates the light source 45 around the 2nd axis line L2, and exposes to the resist layer 36 formed in the board | substrate 35. FIG. FIG. 5 is a diagram showing a state in which a substrate stage 63 is rotated around a first axis L1 and a resist layer 36 formed on a substrate 35 is exposed. It is a flowchart which shows the formation procedure of the micro lens array 57 by the exposure apparatus 61. FIG. It is a figure which simplifies and shows the structure of the exposure apparatus 71 which is the 3rd Embodiment of this invention. It is a figure which simplifies and shows the structure of the exposure apparatus 200 which is the 4th Embodiment of this invention. It is the figure which looked at the board | substrate 35 conveyed by the conveyance means 120, the board | substrate drive unit 100, and the reflective mirror 81 from the vertical direction Z one side.

It is the figure which looked at the board | substrate drive unit 100 from the front-back direction X other side. FIG. 3 is a diagram showing a state where a substrate 35 transported from a substrate transport unit 120 is placed on a substrate stage 31. It is a figure which shows the state exposed to the resist layer 36 formed in the board | substrate 35. FIG. It is a figure which shows the state exposed to the resist layer 36 formed in the board | substrate 35. FIG. It is a figure which shows the state exposed to the resist layer 36 formed in the board | substrate 35. FIG. It is a figure which shows the state exposed to the resist layer 36 formed in the board | substrate 35. FIG. It is a figure which simplifies and shows the structure of the exposure apparatus 300 which is the 5th Embodiment of this invention. It is a figure which simplifies and shows the structure of the exposure apparatus 1 of the 1st prior art. It is a figure which simplifies and shows the structure of the exposure apparatus 10 of the 2nd prior art.

Explanation of symbols

21, 61, 71, 200, 300 Exposure apparatus 22, 100 Substrate drive unit 23 Light source drive unit 24 Substrate ID reading means 25 Main controller 26 Substrate stage controller 27 Light source stage controller 31, 63 Substrate stage 32 Substrate holding part 33 Fixed side clamping Part 34 Movable side clamping part 35 Substrate 36 Resist layer 37 Substrate upper edge 38 Substrate lower edge 39 Substrate left edge 40 Substrate right edge 41, 101 Substrate drive part 42 Recess 45 Light source 46 Light source stage 47 Connection member 48 Light 51 Liquid Crystal Display Unit 52 Pixel 53 Transmitting Unit 54 Non-Transmitting Unit 55 First Glass Substrate 56 Second Glass Substrate 57 Micro Lens Array 62 Substrate Mask Stage Controller 64 First Mask Holding Unit 65 Second Mask Holding Unit 66 Exposure Mask Substrate 80 Reflection Mirror Unit 81 reflector 82 reflector stage 83 reflector stage controller 84 substrate driving controller 111 base plate 112 arm driving mechanism 113 first arm 114 and the second arm 120 substrate transport means L1 substrate side axis L2 source side axis L3 light reflecting side axis

Claims (22)

Holding a peripheral portion of a substrate on which an exposure layer is formed by applying a material to be exposed, and holding the substrate substantially vertically; and
A substrate-side drive unit that rotates the holding unit around a predetermined substrate-side axis while maintaining the substrate substantially vertical;
A light irradiation unit for irradiating light to the exposure layer of the substrate held by the holding unit;
A light source drive unit that rotates the light irradiation unit around a predetermined light source side axis ,
In relation to the rotation operation of the holding unit by the substrate side driving unit, the light irradiation unit is rotated by the light source side driving unit, and the optical axis of the light irradiated by the light irradiation unit and the exposure layer An exposure apparatus that exposes the exposure layer while relatively changing an angle with an exposure surface.   The predetermined substrate-side axis of the substrate-side drive unit is incident on the incident-side surface on which light from the light irradiation unit of the substrate held by the holding unit is incident and on the exposure layer formed on the substrate. The exposure apparatus according to claim 1, wherein the exposure apparatus is disposed between the light-exiting surface and the light exiting surface. The predetermined light source side axis of the light source side drive unit is incident on the incident side surface of the substrate held by the holding unit on which light from the light irradiation unit is incident and on the exposure layer formed on the substrate. The exposure apparatus according to claim 1 , wherein the exposure apparatus is disposed between the light-exiting surface and the light exiting surface. The holding portion is exposed according to any one of claims 1-3, characterized in that it further comprises a mask holder substantially vertically holding the mask substrate a light transmitting pattern to transmit light are formed apparatus. The substrate-side axis of the substrate-side drive unit is disposed closer to the light irradiation unit than the substrate, and an incident-side surface on which light from the light irradiation unit of the mask substrate held by the mask holding unit is incident, 5. The exposure apparatus according to claim 4 , wherein the exposure apparatus is disposed between the incident surface of the mask substrate and an exit side surface from which the incident light exits. The light source side axis of the light source side drive unit is disposed closer to the light irradiation unit than the substrate, and an incident side surface on which light from the light irradiation unit of the mask substrate held by the mask holding unit is incident, 5. The exposure apparatus according to claim 4 , wherein the exposure apparatus is disposed between the incident surface of the mask substrate and an exit side surface from which the incident light exits. Holding a peripheral portion of a substrate on which an exposure layer is formed by applying a material to be exposed, and holding the substrate substantially vertically; and
A substrate-side drive unit that rotates the holding unit around a predetermined substrate-side axis while maintaining the substrate substantially vertical;
A light irradiation unit for irradiating light to the exposure layer of the substrate held by the holding unit;
A light reflecting portion interposed between the light irradiating portion and the substrate;
And a light reflecting side driving portion for rotating the light reflecting portion seen including,
In relation to the rotation operation of the holding unit by the substrate side drive unit, the light reflection unit is rotated by the light reflection side drive unit, and the optical axis of the light irradiated by the light irradiation unit and the exposure layer while the angle was a relative change in the exposure surface, to that eXPOSURE aPPARATUS, wherein the exposure to the exposure layer. 8. The exposure apparatus according to claim 7, wherein the holding unit further includes a mask holding unit that holds a mask substrate on which a light transmission pattern to transmit light is formed substantially vertically. The substrate-side axis of the substrate-side drive unit is disposed closer to the light irradiation unit than the substrate, and an incident-side surface on which light from the light irradiation unit of the mask substrate held by the mask holding unit is incident, The exposure apparatus according to claim 8, wherein the exposure apparatus is disposed between the incident surface of the mask substrate and an exit side surface from which the incident light exits. Holding a peripheral portion of a substrate on which an exposure layer is formed by applying a material to be exposed, and holding the substrate substantially vertically; and
The holding portion, while maintaining the substrate substantially vertically, within the rotatable virtual plane around the rotation axis predetermined perpendicular to the thickness direction of the substrate, and the substrate-side drive section which moves in parallel,
A light irradiation unit for irradiating light to the exposure layer of the substrate held by the holding unit;
A light source drive unit that rotates the light irradiation unit around a predetermined light source side axis ,
In relation to the parallel movement operation of the holding unit by the substrate side driving unit, the light irradiation unit rotates by the light source side driving unit, and the optical axis of the light irradiated by the light irradiation unit and the exposure layer An exposure apparatus that exposes the exposure layer while relatively changing an angle with an exposure surface.   The predetermined light source side axis of the light source side drive unit is incident on the incident side surface of the substrate held by the holding unit on which light from the light irradiation unit is incident and on the exposure layer formed on the substrate. The exposure apparatus according to claim 10, wherein the exposure apparatus is disposed between the surface on the emission side from which the emitted light is emitted. Holding a peripheral portion of a substrate on which an exposure layer is formed by applying a material to be exposed, and holding the substrate substantially vertically; and
A substrate-side drive unit that moves the holding unit in parallel in a virtual plane that is perpendicular to the thickness direction of the substrate and is rotatable about a predetermined rotation axis while maintaining the substrate substantially vertical;
A light irradiation unit for irradiating light to the exposure layer of the substrate held by the holding unit;
A light reflecting portion interposed between the light irradiating portion and the substrate;
And a light reflecting side driving portion for rotating the light reflecting portion seen including,
In relation to the parallel movement operation of the holding unit by the substrate side driving unit, the light reflecting unit is rotated by the light reflecting side driving unit, and the optical axis of the light irradiated by the light irradiation unit and the exposure layer while the angle was a relative change in the exposure surface, to that eXPOSURE aPPARATUS, wherein the exposure to the exposure layer. The exposure according to claim 10, wherein the holding unit further includes a mask holding unit that holds a mask substrate on which a light transmission pattern to transmit light is formed substantially vertically. apparatus. The exposure apparatus according to claim 10, wherein a moving speed of the holding unit by the substrate side driving unit is constant.   The exposure apparatus according to any one of claims 1 to 14, wherein the region facing the surface on the side from which the irradiation light from the light irradiation unit exits is a space. The substrate-side drive unit holds the substrate on which an exposed layer is formed by applying the conveyed material to be exposed, and unloads the substrate on which the exposed layer is exposed. The exposure apparatus according to any one of 10 to 15. A substrate on which an exposure layer is formed by applying a material to be exposed is held substantially vertically with its peripheral edge held by a holding part,
The holding portion is rotated around a predetermined substrate-side axis while maintaining the substrate substantially vertical,
In relation to the rotation operation of the holding unit around the predetermined substrate side axis, the light irradiation unit for irradiating the exposure layer with light is rotated around the predetermined light source side axis by the light source side driving unit, and the holding is performed. An exposure method comprising exposing the exposure layer while relatively changing an angle between an optical axis of light applied to the exposure layer of the substrate held by the unit and an exposure surface of the exposure layer. A substrate on which an exposure layer is formed by applying a material to be exposed is held substantially vertically with its peripheral edge held by a holding part,
The holding portion is rotated around a predetermined substrate-side axis while maintaining the substrate substantially vertical,
In relation to the rotation operation of the holding unit around the predetermined substrate-side axis, the light reflecting unit interposed between the light irradiation unit and the substrate is rotated, and the substrate held by the holding unit is rotated. while relatively changing the angle between the exposure surface of the exposed layer with the optical axis of the light irradiated to the exposed layer, eXPOSURE how to said exposure to the exposure layer. A substrate on which an exposure layer is formed by applying a material to be exposed is held substantially vertically with its peripheral edge held by a holding part,
Wherein the holding portion, while maintaining the substrate substantially vertically, in a rotatable imaginary plane around the rotation axis predetermined perpendicular to the thickness direction of the substrate, moving in parallel,
In relation to the parallel movement operation of the holding unit, a light irradiation unit for irradiating the exposure layer with light is rotated around a predetermined light source side axis by a light source side driving unit, and the substrate held by the holding unit is rotated . An exposure method comprising exposing the exposure layer while relatively changing an angle between an optical axis of light applied to the exposure layer and an exposure surface of the exposure layer. A substrate on which an exposure layer is formed by applying a material to be exposed is held substantially vertically with its peripheral edge held by a holding part,
The holding unit is moved in parallel in a virtual plane that is perpendicular to the thickness direction of the substrate and is rotatable about a predetermined rotation axis while maintaining the substrate substantially vertical.
In relation to the parallel movement operation of the holding unit, the light reflecting unit interposed between the light irradiation unit and the substrate is rotated to irradiate the exposure layer of the substrate held by the holding unit. while the angle between the exposure surface of the exposed layer to the optical axis of the light is relatively changed, eXPOSURE how to said exposure to the exposure layer. The holding unit holds a mask substrate on which a light transmission pattern to transmit light is formed, and an angle between an optical axis of light incident on the mask substrate and irradiated on the exposure layer and an exposure surface of the exposure layer 21. The exposure method according to any one of claims 17 to 20 , wherein the exposure layer is exposed while relative changes are made. The exposure method according to any one of claims 19 to 21 , wherein a moving speed of the holding unit by the substrate side driving unit is made constant.

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