JP4333302B2 - Manufacturing method of lead frame for chip capacitor and chip capacitor - Google Patents

Description

  The present invention relates to a lead frame for a chip capacitor, a manufacturing method thereof, and a chip capacitor. In particular, the present invention can flexibly cope with a change in connection height between a capacitor element and an anode lead wire, and can perform connection reliably and easily. The present invention relates to a lead frame for a chip capacitor, a manufacturing method thereof, and a chip capacitor.

  Various electronic devices such as mobile phones, digital cameras, and notebook personal computers (notebook personal computers) responded to the demands for miniaturization and weight reduction and mass production of all types of electronic components used in electronic circuits for miniaturization and weight reduction. Commercialization is desired. Since an electrolytic capacitor occupies a large space among electronic components, a chip-type solid electrolytic capacitor is used in the electronic apparatus as described above. A typical example of a chip-type solid electrolytic capacitor is a chip-type solid tantalum capacitor that is small and has a large capacity, has excellent temperature characteristics and frequency characteristics, and has a semi-permanent lifetime. .

In general, a chip type solid tantalum capacitor includes a capacitor element, a resin sheath, and an external electrode. The capacitor element is composed of a porous sintered body of tantalum powder for the anode, a tantalum pentoxide (Ta ₂ O ₅ ) coating for the dielectric, and manganese dioxide (MnO ₂ ) for the cathode. With the surface mounting leads connected to the anode and the cathode, the capacitor element is sealed with mold resin (exterior resin).

  FIG. 9 shows a configuration of a conventional chip capacitor. The chip capacitor 100 includes a cylindrical or prismatic capacitor element 1, an insulating plate 2 provided on one end face of the capacitor element 1, an anode lead wire 3 protruding from the center of the insulating plate 2, and a capacitor element. 1, a cathode layer 4 as a cathode provided on the outer surface of 1, a cathode lead frame 5 connected to the cathode layer 4, an anode lead frame 6, and the anode lead frame 6 and the anode lead wire 3 are connected to each other. The auxiliary connecting member 7 to be connected, the insulating layer 8 provided in the vicinity of the capacitor element 1 on the upper surface of the anode lead frame 6, and the respective members are housed and sealed so that the bottom surfaces of the two lead frames are exposed. An exterior resin 9 is provided. The connection auxiliary member 7 has a ball shape or a cylindrical shape, and for example, 42 alloy material is used as the material thereof. The exposed surfaces (lower surfaces) of the cathode lead frame 5 and the anode lead frame 6 are connected to the pattern surface of the printed circuit board 10 by solder 11. The cathode layer 4 and the cathode lead frame 5 are connected by solder 12.

  In the chip-type capacitor 100 configured as shown in FIG. 9, the capacitor element 1, the insulating plate 2, the anode lead wire 3, and the cathode layer 4 are sealed by the exterior resin 9, so that other electronic components and housings There is no portion in contact with the conductive portion, and a contact accident can be prevented and the aesthetics can be improved. Since surface mounting can be performed by the cathode lead frame 5 and the anode lead frame 6, high-density mounting and mass production are possible.

  However, in the chip type capacitor 100 of FIG. 9, the connection auxiliary member 7 is used to match the height of the anode lead wire 3 and the anode lead frame 6, and welding is used for fixing and connecting the connection auxiliary member 7. Yes. For this reason, the welding which connects the anode lead wire 3 and the connection auxiliary member 7, and the welding which connects the connection auxiliary member 7 and the anode lead frame 6 are required, and a welding process is required twice, and productivity (or mass productivity) is required. ) Is bad.

In order to solve this problem, the anode lead frame immediately below the anode lead wire is pulled up in an X shape and the intersection is brought into contact with the lower surface of the anode lead wire to perform connection by welding (for example, see Patent Document 1). A configuration has been proposed in which the anode lead frame is bent into an L shape or a V shape, and its tip is connected to the anode lead wire by welding (for example, see Patent Documents 2 and 3).
JP 2002-299165 A (see FIGS. 1 and 2) JP 2002-43175 A (see FIGS. 1 and 2) Japanese Patent Laid-Open No. 2003-100555 (see FIGS. 7 and 8)

  However, according to the conventional chip-type capacitor, in the configuration of Patent Document 1, when the height of the crossing portion of the raised portion and the anode lead wire does not match, the anode side of the capacitor element is lifted or the crossing portion is too low. Since it becomes impossible to connect the anode lead frame and the anode lead wire, it takes time for welding work, and the yield and productivity are likely to be affected.

  Furthermore, in the configuration of Patent Document 2, it is necessary to bend the anode lead frame and the cathode lead frame in a complicated shape, and the connecting portion of the cathode lead frame becomes the upper surface of the capacitor element, which complicates the process. At the same time, the resin package becomes larger.

  Moreover, in the structure of patent document 3, since the tongue part connected to an anode lead wire is bend | folded so that it may incline, and the front-end | tip part may not be fixed in the air, in order to perform welding, an anode lead wire is used. There is no choice but to place it on the lower side. Further, since the anode lead wire is arranged on the lower surface of the tongue portion for connection, the capacitor element cannot be mounted vertically lowered from above. Thus, since there are many restrictions in connection work, mass productivity cannot be improved.

  Accordingly, an object of the present invention is to provide a chip-type capacitor lead frame capable of flexibly responding to changes in the connection height of the capacitor element with the anode lead wire, and enabling reliable and easy connection, a manufacturing method thereof, and It is to provide a chip type capacitor.

In order to achieve the above object, the present invention provides, as a first feature, a cathode lead frame on which a capacitor element in which an anode lead wire protrudes from one of side surfaces is mounted, a surface mounting portion serving as a mounting surface, and the surface A strip-shaped connection piece is disposed on one or both side surfaces of the surface mounting portion so as to be on the same plane as the mounting portion and parallel to the longitudinal direction on which the capacitor element is mounted. is processed to integrally include an anode lead frame includes a connection piece that is expanded in the orthogonal and belt formed by connecting in the surface mounting portion and the side surface at the one end portion, each of said connecting piece, said The surface mounting portion is bent at about 90 degrees with respect to the surface mounting portion surface in the vicinity of the portion where the cathode lead frame side of the connecting portion connected with the surface mounting portion is cut off, and further, the surface mounting portion at the connection portion. Disposed close contact surface mounting portion side surface of the distal end portion near the opposite side surface of the surface mounting portion and the one end portion after bending by bending at substantially 90 degrees with respect to the surface mount portion surface Alternatively, a chip capacitor lead frame manufacturing method is provided, wherein the tip end portion is disposed at a position in contact with the anode lead wire.

In order to achieve the above object, the present invention has a second feature in that when the connection piece is provided on both side surfaces of the surface mounting portion, the tip end portion is located on the surface mounting portion. 2. The method of manufacturing a lead frame for a chip-type capacitor according to claim 1, wherein the tip end face is abutted at a position where the tip end face is abutted or in contact with the anode lead wire. Provide .

In order to achieve the above object, according to the present invention, as a third feature, a capacitor element in which an anode lead wire protrudes from one of side surfaces, and a cathode lead frame connected to the cathode in a state where the capacitor element is mounted And an anode lead frame connected to the anode lead wire in a state where the capacitor element is mounted, and a mounting surface of the cathode lead frame and the anode lead frame is flush with the mounting surface exposed. And an exterior resin that seals the periphery of the capacitor element with a resin, and the anode lead frame is flush with the surface mounting portion that forms the mounting surface and the surface mounting portion is mounted with the capacitor element. A strip-shaped connection piece is disposed only on one of the side surfaces of the surface mounting portion so as to be parallel to the longitudinal direction of the strip, and the strip-shaped connection piece The surface mounting portion is connected to the surface mounting portion at a side surface at one end thereof, and is approximately 90 with respect to the surface mounting portion surface in the vicinity of a portion where the connection portion connected to the surface mounting portion and the side surface is interrupted on the cathode lead frame side. A chip capacitor is provided, which is bent and raised at a predetermined angle, and is further bent at the connection portion to the surface mounting portion side at approximately 90 degrees with respect to the surface mounting portion surface .

In order to achieve the above object, according to a fourth aspect of the present invention, as a fourth feature, the connection piece is on the same plane as the surface mounting portion and parallel to a longitudinal direction on which the capacitor element is mounted. Are provided on both side surfaces of the surface mounting portion, the connection pieces on the both side surfaces are in the vicinity of a portion where the connection portion connected to the surface mounting portion and the side surface is interrupted on the cathode lead frame side. The surface mounting portion surface is bent at approximately 90 degrees and raised, and each connection piece is bent at the connection portion to the surface mounting portion side at approximately 90 degrees with respect to the surface mounting portion surface, and the surface Provided is a chip-type capacitor characterized in that a front end surface is abutted at a position contacting a surface of a mounting portion or the anode lead wire above.

  According to the chip capacitor lead frame of the present invention, the anode lead frame includes the surface mounting portion and the connection piece, and the connection piece is disposed on the upper surface of the surface mounting portion by subjecting the connection piece to a predetermined bending process. Therefore, since the connection with the anode lead wire is possible, it is possible to flexibly cope with the change in the connection height of the capacitor element with the anode lead wire, and the connection can be surely and easily performed.

  According to the chip capacitor of the present invention, the anode lead frame configured to include the surface mounting portion and the connection piece is subjected to a predetermined bending process by the connection piece once or twice. The tip-side portion is placed on the surface mounting part, and the anode lead wire is connected to a part of the tip-side portion, so it can flexibly respond to changes in the height of connection with the anode lead wire of the capacitor element and connect Can be reliably and easily performed.

  According to the chip capacitor lead frame manufacturing method of the present invention, an anode lead frame including a surface mounting portion and a connection piece is formed, the connection piece is raised to approximately 90 degrees in the vicinity of the root portion, and the root portion is further formed. Because it bends approximately 90 degrees inside the vicinity of the wire or approximately 180 degrees near the root portion, it can flexibly respond to changes in the connection height of the capacitor element with the anode lead wire, and the connection is reliable. And it becomes easy to do.

  FIG. 1 shows a chip capacitor according to an embodiment of the present invention. The chip capacitor 20 includes a capacitor element 1 having a cylindrical or prismatic outer shape, an insulating plate 2 provided on one end face of the capacitor element 1, an anode lead wire 3 protruding from the center of the insulating plate 2, A cathode layer 4 as a cathode provided on the outer surface of the capacitor element 1, a cathode lead frame 31 as an anode electrode connected to the cathode layer 4, and an anode electrode connected to the anode lead wire 3 The anode lead frame 32, the anode lead frame 32, and the exterior resin 9 that incorporates the members and seals the bottom surfaces of the two lead frames are exposed. For the exterior resin 9, for example, an epoxy resin is used.

  After the exterior resin 9 is applied, the outer frame portions of the cathode lead frame 31 and the anode lead frame 32 are cut along the side surfaces of the exterior resin 9. The mounting surfaces (lower surfaces) of the cathode lead frame 31 and the anode lead frame 32 are connected to the pattern surface of the printed circuit board 10 such as an electronic device by solder 11 (or a conductive adhesive). By cutting the outer frame portion after the exterior resin 9 is provided, the positions of the cathode lead frame 31 and the anode lead frame 32 are shifted, or the positional shift occurs between the cutting position of the outer frame portion and the side surface of the exterior resin 9. Can be prevented.

  FIG. 2 shows a configuration (plan view) of the cathode lead frame 31 and the anode lead frame 32, and FIG. 3 shows a first embodiment of the lead frame for a chip capacitor according to the present invention. The chip capacitor lead frame 30 is in a state before processing. In FIG. 3, only the cathode lead frame 31 and the anode lead frame 32 for one capacitor are illustrated, and an outer frame portion provided in a strip shape on both sides, a resin film attached to the back surface, and the like are illustrated. Is omitted.

  The anode lead frame 32 includes a surface mounting portion 32a and a connection piece 32b having the same plate thickness, and a “42Ni” material is used as the material thereof. Since the melting point of the “42Ni” material is close to the melting point of tantalum used for the capacitor element 1, the connection with the anode lead wire 3 can be performed by resistance welding. As shown in FIG. 3, the connection piece 32b before bending extends from the side surface portion of the surface mounting portion 32a so as to be parallel to the side surface of the surface mounting portion 32a, and is bent twice (A in FIG. 3). As shown in FIG. 2, the tip of the connection piece 32 b is disposed on the surface mounting portion 32 a in a state orthogonal to the anode lead wire 3. Is done.

  The capacitor element 1 is mounted on the cathode lead frame 31 and the anode lead frame 32 processed in the state of FIG. The surface mounting portion 32 a of the anode lead frame 32 is on the same plane as the cathode lead frame 31. The connection piece 32b is on the surface mounting portion 32a, and the upper surface thereof is in contact with the anode lead wire 3. In this state, the anode lead wire 3 and the connection piece 32b are welded by a welding machine. Next, the cathode lead frame 31 and the cathode layer 4 are connected by the solder 12. This connection may be performed prior to the connection between the anode lead wire 3 and the connection piece 32b.

  Next, the exterior resin 9 forms a rectangular shape or the like so as to cover the capacitor element 1, the anode lead wire 3, and the connection piece 32 b with the bottom surfaces of the cathode lead frame 31 and the surface mounting portion 32 a exposed. To be molded. Next, when the outer frame portion (not shown) of the chip-type capacitor lead frame 30 is cut along both end faces (left and right end faces in FIG. 1) of the exterior resin 9, the state shown in FIG. 1 is obtained.

  The completed chip capacitor 20 is mounted on the printed circuit board 10 mounted on an electronic device or the like. At that time, the resin film (not shown) adhered to the cathode lead frame 31 and the connection piece 32b is peeled off, and the cathode lead frame is formed on the circuit pattern at a predetermined position of the printed circuit board 10 by the solder 11 using a reflow furnace or the like. 31 and the surface mounting part 32a are connected.

  According to the chip type capacitor of FIG. 1, since the connection auxiliary member required in the conventional configuration is unnecessary, the welding operation can be performed once. By reducing the number of weldings, the influence of thermal deformation during welding can be reduced. Further, by changing the bending process of the connection piece 32b, the height setting of the connection piece 32b can be varied, and even when the height of the anode lead wire 3, that is, the capacitance of the capacitor element 1 is different. It becomes possible to deal with it easily. Further, since the connection auxiliary member is not required, the internal volume of the chip-type capacitor 20 can be effectively used. When the exterior resin 9 has the same size as the conventional one, the capacitance can be made larger than that of the conventional capacitor. Can do.

  In addition, since the connection piece 32b is connected to the side surface of the surface mounting portion 32a and is not accompanied by bending from the outer frame portion side, the rigidity in the vicinity of the outer frame portion side is not lowered. The external force that can be deformed can be reduced, and the flatness of the surface mounting portion 32a can be ensured. This effect becomes more remarkable as the shape of the lead frame becomes finer.

  FIG. 4 shows the steps of the method for manufacturing a lead frame for a chip capacitor according to the present invention. This step needs to be completed before the capacitor element 1 is mounted. First, from the state of FIG. 3 and FIG. 4 (a), as shown in FIG. 4 (b), the tip of the connection piece 32b is vertically raised at the position of the line AA in FIG. At this time, the raised portion is raised while the plate-like property is maintained, so that unevenness or bending is not generated. Further, when the connection piece 32b is bent at 90 degrees at the position of the line BB in FIG. 3 so that the tip of the connection piece 32b overlaps the upper surface of the surface mounting portion 32a, the shape of FIG. This shape is the anode lead frame 32 shown in FIGS.

  In FIG. 3, the height from the upper surface of the anode lead frame 32 to the anode lead wire 3 can be arbitrarily set by changing the width w of the portion (tip portion) ahead of the position of the AA line of the connection piece 32b. Even if the height of the anode lead wire 3, that is, the capacitance of the capacitor element 1 is changed, it can be easily handled.

  FIG. 5 shows a second embodiment of the lead frame according to the present invention. In FIG. 5, (a) shows the state before processing, and (b) and (c) show the state after bending the connecting portion. In addition, in (a), illustration of the outer frame part provided in the strip | belt shape on both sides, the resin film stuck on the back surface, etc. is abbreviate | omitted.

  In the above embodiment, the connection piece 32b is bent twice, but it can be connected to the anode lead wire 3 even with a single bending configuration, and this embodiment realizes this. As shown in FIG. 5A, the chip-type capacitor lead frame 50 includes a cathode lead frame 51 and an anode lead frame 52. The anode lead frame 52 includes a surface mounting portion 52a and a connection piece 52b. ing. The connection piece 52b has a strip shape (long plate shape) and is formed so as to extend in a direction perpendicular to the anode lead wire 3. When the connection piece 52b is bent upward from the position of the CC line in FIG. 5A and is bent so as to rotate 180 degrees as a whole, the connection piece 52b is surface-mounted as shown in FIG. 5C. It adheres to the upper surface of 52a. If the sum of the thickness of the surface mounting portion 52a and the thickness of the connecting piece 52b is equal to or slightly higher than the height of the anode lead wire 3, the connecting piece 52b as shown in FIGS. 5B and 5C. The upper surface of this contacts the lower surface of the anode lead wire 3. In this state, the connection piece 52b and the anode lead wire 3 are connected by welding.

  According to the chip-type capacitor lead frame 50 shown in FIG. 5, since the connection work with the anode lead wire 3 can be performed only by bending the connecting piece 52b once at 180 degrees, the height of the anode lead wire 3 is low, that is, the capacitor. The element 1 is suitable for use in a small-capacitance capacitor having a relatively small outer diameter.

  FIG. 6 shows a third embodiment of the lead frame according to the present invention. In FIG. 6, (a) shows the state before processing, and (b) and (c) show the state after bending the connecting portion. In addition, in (a), illustration of the outer frame part provided in the strip | belt shape on both sides, the resin film stuck on the back surface, etc. is abbreviate | omitted.

  The present embodiment is characterized in that connecting pieces are provided on both sides of the surface mounting portion, and the two connecting pieces are bent so as to overlap the surface mounting portion. As shown in FIG. 6A, the chip-type capacitor lead frame 60 includes a cathode lead frame 61 and an anode lead frame 62. The anode lead frame 62 includes a surface mounting portion 62a, connection pieces 62b, 62c. The connecting pieces 62b and 62c are strip-shaped (long plate-shaped), and are formed so as to be orthogonal to the anode lead wire 3 and arranged on a straight line.

  First, the connection piece 62b is bent upward from the position of the DD line in FIG. 6A, and further bent so as to rotate 180 degrees, and is brought into close contact with the upper surface of the surface mounting portion 62a. Next, the connection piece 62c is bent upward from the position of the EE line, and further bent so as to rotate 180 degrees, and is brought into close contact with the connection piece 62b. Thereby, the part below the installation position of the connection piece 62b becomes the thickness of three sheets of the surface mounting part 62a like (c) of FIG. Therefore, the chip-type capacitor lead frame 60 shown in FIG. 6 is suitable for use in a capacitor in which the position of the anode lead wire 3 is higher than that of the chip-type capacitor lead frame 50 shown in FIG. ing. Finally, as shown in FIGS. 6B and 6C, the capacitor element 1 is mounted on the chip-type capacitor lead frame 60, and the lower surface of the anode lead wire 3 is brought into contact with the upper surface of the connection piece 62b. The connecting piece 62b and the anode lead wire 3 are connected by welding.

  According to the chip-type capacitor 60 of FIG. 6, since each of the connection pieces 62b and 62c can be bent once at 180 degrees and the two connection pieces can be arranged so as to overlap the surface mounting portion 62a, the upper surface of the connection piece 62b Since the height is equivalent to three of the thickness of the surface mounting portion 62a, the capacity of the capacitor element 1 is increased, and accordingly, even when the position of the anode lead wire 3 is increased, it is possible to easily cope with it.

  FIG. 7 shows a fourth embodiment of the lead frame according to the present invention. In FIG. 7, since the shape of the lead frame before bending is substantially the same as that in FIG. 6, the illustration is omitted here. The present embodiment is characterized in that the connection pieces 62b and 62c in FIG. 6 are bent so as to be butted in a “f” shape or an inverted V shape without being overlapped (without being in close contact with the surface mounting portion 62a). .

  As shown in FIG. 7A, when each of the connecting pieces 62b and 62c is bent inward so as to have an angle θ, as shown in FIG. A U-shaped connecting portion is formed, and the anode lead wire 3 can be connected at the top thereof.

  According to the chip-type capacitor lead frame 70 of FIG. 7, the bending angle of the connection pieces 62b and 62c, and further the positions of the DD line and the EE line can be easily changed. Can respond to height changes. Further, if the tips of the connecting pieces 62b and 62c are made to intersect with each other in an X shape without abutting each other, it is possible to cope with a change in the height of the anode lead wire 3 without changing the angle θ. Further, in the present embodiment, when the anode lead wire 3 and the tips of the connection pieces 62b and 62c are welded, the anode lead wire 3 can be supported by the tips of the connection pieces 62b and 62c, so that it can withstand the force applied from above. It has a structure.

  FIG. 8 shows a fifth embodiment of a lead frame for a chip capacitor according to the present invention. In FIG. 8, (a) shows the state before processing, and (b) and (c) show the state after bending the connecting portion. In addition, in (a), illustration of the outer frame part provided in the strip | belt shape on both sides, the resin film stuck on the back surface, etc. is abbreviate | omitted.

  In the embodiment of FIG. 8, the anode lead frame 32 of FIG. 3 is provided with connecting pieces 82b and 82c having the same shape as the connecting piece 32b on both sides, and the bending of the connecting pieces 82b and 82c is also 90 degrees. Two times each. However, since the tips of the connection pieces 82b and 82c are in contact with the surface mounting portion 82a, the lengths of the connection pieces 82b and 82c are shorter than those in FIG.

  As shown in FIG. 8A, the chip-type capacitor lead frame 80 includes a cathode lead frame 81 and an anode lead frame 82. The anode lead frame 82 includes a surface mounting portion 82a and connection pieces 82b and 82c. It has. The connection pieces 82b and 82c have a belt shape and are formed to be parallel to both sides of the surface mounting portion 82a. As described with reference to FIG. 3, the bending process is sequentially performed on the connection pieces 82 b and 82 c to rise to 90 degrees from the root (the position of the line AA).

  Next, when 90 degree bending is performed from the position of the line BB shown in FIG. 3, as shown in FIG. 8C, the connection pieces 82b and 82c are in close contact with the surface mounting portion 82a. In addition, the ends of the connection pieces 82b and 82c are brought into contact with each other. The upper surface of the connection piece 82b is in contact with the lower surface of the anode lead wire 3. As shown in FIGS. 8B and 8C, the anode lead wire 3 is connected to the tips of the connection pieces 82b and 82c by welding in a state of being placed on the abutting portions of the connection pieces 82b and 82c.

  According to the chip-type capacitor lead frame 80 of FIG. 8, as in the first embodiment, by changing the width w of the tip end portions of the connection pieces 82b and 82c, the anode lead is formed from the upper surface of the anode lead frame 82. The height up to the line 3 can be arbitrarily adjusted, and even when the height of the anode lead wire 3, that is, the capacity of the capacitor element 1 is changed, it can be easily handled.

  In each of the above embodiments, the bending angle is set to 90 degrees or 180 degrees. However, it is not necessarily strictly 90 degrees or 180 degrees, and the allowable angle can be freely set.

  Further, in the anode lead frame of FIGS. 3 and 8, the connection piece may be extended to the opposite side of the drawing.

  Furthermore, the connection piece in FIG. 5 may be provided on the opposite side. In FIG. 6, the connecting piece 62c may be provided at the lower stage and the connecting piece 62b may be provided at the upper stage.

  4, 5, 6, and 8, the configuration in which the connection piece is closely attached to the surface mounting portion or the lower connection piece is shown. However, the connection piece has a certain angle and the tip portion is the surface mounting portion. The structure which floats from the surface of may be sufficient.

  Further, in the configuration of FIG. 8, the connection pieces 82 b and 82 c can be bent into a “F” shape according to the height of the anode lead wire 3 as shown in FIG. 7.

It is a front sectional view showing a chip type capacitor concerning an embodiment of the invention. It is a top view which shows the structure of the cathode lead frame of FIG. 1, and an anode lead frame. 1 is a plan view showing a first embodiment of a lead frame (before processing) according to the present invention. It is a manufacturing process figure which shows the manufacturing method of the lead frame for chip type capacitors which concerns on this invention. The 2nd Embodiment of the lead frame which concerns on this invention is shown, (a) is a top view before a bending process, (b) is a front view after a bending process, (c) is a side view after a bending process. . 3 shows a third embodiment of a lead frame according to the present invention, where (a) is a plan view before bending, (b) is a front view after bending, and (c) is a side view after bending. FIG. . The 4th Embodiment of the lead frame which concerns on this invention is shown, (a) is the front view after a bending process, (b) is the side view after a bending process. FIG. 5 shows a fifth embodiment of the lead frame according to the present invention, where (a) is a plan view before bending, (b) is a front view after bending, and (c) is a side view after bending. . It is front sectional drawing which shows the structure of the conventional chip type capacitor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Capacitor element 2 Insulation board 3 Anode lead wire 4 Cathode layer 5 Cathode lead frame 6 Anode lead frame 7 Connection auxiliary member 8 Insulation layer 9 Exterior resin 10 Printed circuit board 11 Solder 12 Solder 20 Chip type capacitor 30, 50, 60, 70, 80 Chip type lead frame for capacitor 31, 51, 61, 81 Cathode lead frame 32, 52, 62, 82 Anode lead frame 32a, 52a, 62a, 82a Surface mount part 32b, 52b, 62b, 62c, 82b, 82c Connection Piece 100 Chip type capacitor

Claims (4)

A cathode lead frame on which a capacitor element in which an anode lead wire protrudes from one of the side surfaces is mounted, a surface mounting part to be a mounting surface, and a longitudinal direction on which the capacitor element is mounted on the same plane as the surface mounting part anode formed by connecting in one or arranged strip-shaped connecting piece on both sides, the strip-shaped connecting piece the surface mounting portion and the side surface at the strip end of the surface mount portion side so as to be parallel to Formed integrally with the lead frame,
The connection piece, up by bending approximately 90 degrees from the surface mounting portion surface in the vicinity of the portion cut off by the cathode lead frame side of the coupled coupling parts in the surface mounting portion and the side surface, further wherein the connecting portion The side surface of the surface mounting portion is turned to the surface of the surface mounting portion by bending the surface mounting portion side to the surface mounting portion surface at approximately 90 degrees with respect to the surface mounting portion side. A method of manufacturing a lead frame for a chip-type capacitor, wherein the tip end surface of the portion close to the tip end is abutted at a position in contact with the anode lead wire. When the connection piece is provided on the both side surfaces of the surface mount portion, the tip-sided portion abutting the front end surface while being disposed in close contact and equal to the surface mount portion on, or the anode the process according to claim 1 chip capacitor lead frame, wherein the matching of the front end face at a position in contact with the lead wire. A capacitor element with an anode lead protruding from one of the side surfaces, a cathode lead frame connected to the cathode with the capacitor element mounted, and connected to the anode lead with the capacitor element mounted An anode lead frame, and an exterior resin for sealing the periphery of the capacitor element with the mounting surface of the cathode lead frame and the anode lead frame in the same plane and with the mounting surface exposed.
The anode lead frame is a surface mounting portion that forms the mounting surface ;
A strip-shaped connection piece is disposed only on one side surface of the surface mounting portion so as to be on the same plane as the surface mounting portion and parallel to the longitudinal direction of mounting the capacitor element ,
The strip-shaped connecting piece is connected to the surface mounting portion and the side surface at one end thereof,
Launched by bending approximately 90 degrees from the surface mounting portion surface in the vicinity of the portion cut off by the cathode lead frame side of the coupled coupling parts in the surface mounting portion and the side surface, wherein the surface mounting portion further by the connecting portion A chip-type capacitor, wherein the chip-type capacitor is bent at an angle of approximately 90 degrees with respect to the surface mounting portion surface . The connection piece of claim 3, set on both sides of the surface mounting portion so as to be parallel to the longitudinal direction for mounting a on the surface mounting portion coplanar and said capacitor element vignetting Each connection piece on both side surfaces is approximately 90 degrees with respect to the surface mounting portion surface in the vicinity of a portion where the connection portion connected to the surface mounting portion on the side surface is interrupted on the cathode lead frame side. raised by bending, further Niso respectively connecting pieces are bent at substantially 90 degrees with respect to the surface mount portion side to the surface mounting portion at the connecting portion, the surface or the upper of the surface mounting portion 4. The chip capacitor according to claim 3 , wherein a tip surface is abutted at a position in contact with the anode lead wire.

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