JP4329204B2 - Electronic device and heating / cooling method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic device including a heat generating member such as a personal computer device including a microprocessor, and a heating / cooling method thereof .
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a microprocessor included in a personal computer device or the like has a large amount of heat generated during operation, and generally has a cooling device attached thereto. For example, a fan that is rotated by a motor is disposed in the vicinity of the microprocessor, and the rotation of the fan causes the air in the vicinity of the microprocessor to be discharged outside the computer device to cool the microprocessor. is there.
[0003]
[Problems to be solved by the invention]
However, a cooling device using such a fan requires electric power to rotate the fan, which increases the power consumption of the computer device. Moreover, in order to obtain a certain degree of cooling effect, a relatively large fan is required, and there is a problem that a certain amount of noise is generated as the fan rotates.
[0004]
Further, since the conventional cooling device is basically cooled by an air flow, it has been difficult to use it for purposes other than cooling.
[0005]
Here, the microprocessor of the computer device has been described as an example, but there are similar problems in various electronic devices that generate heat during the operation of the device.
[0006]
A first object of the present invention is to enable efficient cooling of a heat generating part provided in an electronic device with a small amount of power.
[0007]
A second object of the present invention is to make it possible to use a cooling mechanism provided in an electronic device for other purposes.
[0008]
[Means for Solving the Problems]
The electronic device of the present invention is
A heat-generating member that generates heat upon operation of the device;
A heat exchanging portion disposed in the vicinity of the heat generating member;
A regenerative heat exchange unit having one end connected to the heat exchange unit;
First and second sealed spaces to which the other ends of the regenerative heat exchange unit are connected;
First and second piezoelectric members disposed in each of the first and second sealed spaces and deformed by application of an external signal;
And deformation of the deformed state and the second piezoelectric member of the first piezoelectric member, so that a predetermined phase difference, both to apply a signal to each of the piezoelectric member, the ambient temperature when starting up the apparatus When the device is in a low state, a signal is applied to the first and second piezoelectric members so as to compress the first and second sealed spaces, and after the device is activated, the first and second piezoelectric members are A controller for applying a signal to the first and second piezoelectric members so as to expand the inside of the sealed space ;
The phase difference between the deformation states of the first and second piezoelectric members by the control unit is about 90 degrees .
Moreover, the heating / cooling method of the present invention comprises:
A heat-generating member that generates heat upon operation of the device;
A heat exchanging portion disposed in the vicinity of the heat generating member;
A regenerative heat exchange unit having one end connected to the heat exchange unit;
First and second sealed spaces to which the other ends of the regenerative heat exchange unit are connected;
First and second piezoelectric members disposed in each of the first and second sealed spaces and deformed by application of an external signal;
And deformation of the deformed state and the second piezoelectric member of the first piezoelectric member, so that a predetermined phase difference, both to apply a signal to each of the piezoelectric member, the ambient temperature when starting up the apparatus When the device is in a low state, a signal is applied to the first and second piezoelectric members so as to compress the first and second sealed spaces, and after the device is activated, the first and second piezoelectric members are In the heating / cooling method of the heat generating member in the electronic apparatus including a control unit for applying a signal to the first and second piezoelectric members so as to expand the inside of the sealed space,
When the device is activated, the control unit applies a signal to the first and second piezoelectric members so as to compress the first and second sealed spaces, and the deformed state of the first piezoelectric member. And applying a signal to each piezoelectric member such that the deformation state of the second piezoelectric member has a predetermined phase difference;
After controlling the above steps to start the device, the control unit applies a signal to the first and second piezoelectric members so as to expand the inside of the first and second sealed spaces, and and deformation of the first piezoelectric member deformed state and the second piezoelectric member is such that a predetermined phase difference, and chromatic and applying a signal to each of the piezoelectric member,
The phase difference between the deformation states of the first and second piezoelectric members by the control unit is about 90 degrees.
[0009]
According to the present invention, in an electronic device having a heat generating member that generates heat by the operation of the device, when the device is started, the first and second piezoelectric members are vibrated to a predetermined state with a predetermined phase difference. By compressing the inside of the 1st and 2nd sealed space, the gas in the 1st and 2nd sealed space can be made to flow to the heat exchange part side. At that time, the heat accumulated in the regenerative heat exchange unit can be sent to the heat exchange unit, and as a result, the heat generating member in the vicinity of the heat exchange unit can be heated.
Then, after the start-up, when the heat generating member generates heat due to the operation of the electronic device, the first and second piezoelectric members are vibrated in a predetermined state with a predetermined phase difference, and the first and second sealed spaces are By expanding the gas, the gas in the heat exchange part is discharged to the first and second sealed spaces, and the heat transmitted from the heat generating member to the heat exchange part is guided to the first and second sealed spaces. it can. At that time, heat is absorbed by the regenerative heat exchange unit, and as a result, the heat generating member in the vicinity of the heat exchange unit can be cooled.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.
[0015]
In the present embodiment, the electronic device is provided with a heating element inside. That is, as shown in FIG. 3, for example, the present invention is applied to a so-called notebook personal computer device 100 that is configured to be portable as an electronic device. In this personal computer device 100, a keyboard unit 101 and a display panel unit 102 are connected in a rotatable state. For example, a microprocessor 112 is arranged at a predetermined position of a circuit board 111 arranged inside the keyboard unit 101. (In FIG. 3, the microprocessor 112 is indicated by a broken line).
[0016]
The microprocessor 112 is one of semiconductor elements that perform necessary arithmetic processing in the apparatus when the personal computer apparatus 100 is operated, and becomes a heating element that generates heat to a relatively high temperature during the operation. Here, in this example, the thermoelectric conversion unit 10 is arranged on the microprocessor 112, and the heat generated in the microprocessor 112 is cooled by the thermoelectric conversion unit 10.
[0017]
FIG. 1 is a diagram illustrating an internal configuration of the thermoelectric conversion unit 10. The thermoelectric conversion unit 10 is configured based on a so-called Stirling engine principle, and is entirely configured of metal, porcelain, synthetic resin, or the like. In the thermoelectric conversion unit 10 of this example, a heat exchange unit 11 which is a heat absorption unit heated by heat generated by the microprocessor 112 is set.
[0018]
The surface of the heat exchanging portion 11 is in contact with the highest temperature portion of the surface of the microprocessor 112. That is, for example, as shown in FIG. 3, the thermoelectric conversion unit 10 is fixed to the circuit board 111 in a state where the heat exchange unit 11 of the thermoelectric conversion unit 10 is arranged on the microprocessor 112 arranged on the circuit board 111. I have to do it. Although a mechanism for fixing the thermoelectric conversion unit 10 is omitted in FIG. 3, for example, the thermoelectric conversion unit 10 is fixed by using some fixing bracket, or by using a connecting member such as a screw.
[0019]
Returning to the description of the configuration of the thermoelectric conversion unit 10, the first piston 13 and the second piston 14 are connected to the heat exchange unit 11 in the thermoelectric conversion unit 10 via the regenerative heat exchange unit 12. A sealed space is formed by these members 11, 12, 13, and 14. The regenerative heat exchanging unit 12 is configured such that the gas can move between the gas in the heat exchanging unit 11 and the gas in both the pistons 13 and 14 with less heat transfer. Specific configurations of the regenerative heat exchange unit 12 include, for example, a configuration in which a mesh-like metal is disposed, a configuration in which a sponge-like resin is filled, and the like. An appropriate configuration may be selected depending on the characteristics of the gas filled in the pipe.
[0020]
A first piezoelectric film 15 is disposed on the first piston 13, and a second piezoelectric film 16 is disposed on the second piston 14. Each of the piezoelectric films 15 and 16 is configured to vibrate with a voltage applied by the power supply circuit 20. That is, both the piezoelectric films 15 and 16 are configured by bonding members that are bent by application of voltage, and the degree of bending can be controlled by the applied voltage value, and the bending direction can be controlled by the polarity of the applied voltage. It is. The power supply circuit 20 operates with a power supply supplied from, for example, a secondary battery 21 built in the personal computer device 100. In this example, a piezoelectric film is used as a member that vibrates when a signal is applied. However, other piezoelectric members may be used as long as they vibrate similarly.
[0021]
The piezoelectric films 15 and 16 vibrate in the pistons 13 and 14, so that the volume of the space connected to the regenerative heat exchange unit 12 changes, and the internal air is moved to the regenerative heat exchange unit 12 side. It acts to extrude or reversely suck out from the regenerative heat exchanger 12 side, and functions as a piston. In this case, the volume in both pistons 13 and 14 is set to be larger than the volume in the heat exchanging portion 11, for example, and sufficient airflow is generated with respect to the heat exchanging portion 11 by the vibration of the piezoelectric films 15 and 16. To.
[0022]
The vibration state of the first and second piezoelectric films 15 and 16 by the control of the power supply circuit 20 is that there is no phase difference when both piezoelectric films are in the same deformation state, and one piezoelectric film is deformed in one. When the other piezoelectric film is deformed in the opposite direction and the phase difference is 180 degrees, the power source unit 20 is connected to both the piezoelectric films 15 and 16 so that the phase difference between the piezoelectric films 15 and 16 is about 90 degrees. The voltage applied to 16 is controlled. Here, the same deformed state indicates the same state as seen from the functions of the pistons 13 and 14, and specifically, for example, the first piezoelectric film so as to push out gas to the regenerative heat exchange unit 12 side. When 15 is deformed, there is no phase difference when the second piezoelectric film 16 is also in a state where gas is pushed out to the regenerative heat exchange unit 12 side.
[0023]
FIG. 2 shows an example of voltage waveforms applied by the power supply circuit 20 to the first and second piezoelectric films 15 and 16. When the voltage applied to the first piezoelectric film 15 is a sine waveform a, the sine waveform b which is a voltage applied to the second piezoelectric film 16 is a waveform delayed by 90 ° from the waveform a, and the first piezoelectric film The movement of 15 and the movement of the second piezoelectric film 16 are caused to resonate so that there is a phase difference of 90 °. The voltage applied to both piezoelectric films 15 and 16 may be a waveform obtained by analog conversion of a digital signal in addition to directly generating such an analog waveform in the power supply circuit 20.
[0024]
Thus, by causing the first and second piezoelectric films 15 and 16 to resonate, a highly efficient Stirling engine is configured, and the heat exchange unit 11 can be cooled. That is, by operating the personal computer device 100, the microprocessor 112 generates heat, and the gas in the heat exchanging unit 11 to which the heat from the microprocessor 112 is transmitted also generates heat. Here, the first and second piezoelectric members are caused to vibrate in a predetermined state with a predetermined phase difference, and the first and second piezoelectric films 15 and 16 are caused to resonate and move in the heat exchange unit 11. Is discharged to the first and second pistons 13 and 14 side, so that heat transmitted to the heat exchange unit 11 is sent to the regenerative heat exchange unit 12 side, and heat is generated in the regenerative heat exchange unit 12. As a result, the heat exchange unit 11 and the microprocessor 112 adjacent to the heat exchange unit 11 are cooled.
[0025]
In addition, although the thermoelectric conversion part 10 shown in FIG. 1 shall fill the gas in the space sealed with the members 11, 12, 13, and 14, you may make it fill with some liquid.
[0026]
Moreover, the thermoelectric conversion part 10 shown in FIG. 1 is good also as a structure which forms the members 11, 12, 13, 14, etc. on a semiconductor, for example using the technique of a micromachine. Alternatively, it may be formed by etching a metal on a resin substrate, or a metal, porcelain or resin may be formed by laser processing. In any case, when used for cooling the microprocessor 112 of the personal computer device 100 as in this example, the microprocessor 112 is a very small element, so the thermoelectric conversion unit 10 is also as small as possible. It is preferable to configure. Therefore, for example, in the example shown in FIG. 3, the thermoelectric conversion unit 10 has a slightly larger shape than the microprocessor 112, but if the thermoelectric conversion unit 10 can be manufactured in a shape substantially equivalent to the microprocessor 112, Such a size may be used.
[0027]
Thus, according to the thermoelectric conversion part 10 attached to the electronic apparatus (personal computer apparatus 100) of this example, an internal heat generating body (microprocessor) can be cooled. In particular, as in the microprocessor of the personal computer device as in this example, efficient cooling can be achieved when the heat generating parts are concentrated in one place (or several places), which is suitable for this kind of small electronic equipment. is there. In addition, the operating sound during cooling is only the sound generated with the vibration of the piezoelectric films 16 and 16 in the thermoelectric conversion unit 10 which is a sealed space, and is compared with the case of cooling with a fan device or the like. And very quiet.
[0028]
In addition, although the operation | movement at the time of using the thermoelectric conversion part 10 as a cooling device was demonstrated so far, you may make it operate | move the thermoelectric conversion part 10 reversely and to function as a heating apparatus. That is, the heat exchanging portion 11 (and its surroundings) is heated by causing the first and second piezoelectric films 15 and 16 to resonate with a phase difference of 90 ° in a state opposite to that during cooling. It becomes a Stirling engine. Specifically, by vibrating the piezoelectric films 15 and 16 in the first and second pistons 13 and 14, the gas in the pistons 13 and 14 is compressed, and the gas flows to the heat exchange unit 11 side. Can be made. At that time, the heat accumulated in the regenerative heat exchange unit 12 can be sent to the heat exchange unit 11, and as a result, the heat exchange unit 11 and its surroundings can be heated.
[0029]
In such a heating operation, for example, when the device is activated, when the ambient temperature is low, the thermoelectric conversion unit 10 is first operated as a heating device, and the portion is heated to a certain temperature (the device is stabilized). After the device is started up after being started up, and when that part generates heat due to the operation of the device, the thermoelectric conversion unit 10 is operated as a cooling device to perform the cooling operation. Also good. Note that the thermoelectric conversion unit 10 may be operated only as a heating device, and the cooling operation may not be performed.
[0030]
In the above-described embodiment, only the thermoelectric conversion unit of this example is arranged as a cooling mechanism inside the device, but may be combined with another cooling mechanism. For example, a portion having a particularly high heat generation temperature may be intensively cooled by the thermoelectric conversion unit of this example while cooling the entire inside of the apparatus with a cooling fan.
[0031]
Further, in the above-described embodiment, the example in which the thermoelectric conversion unit is a cooling device for a microprocessor in a notebook personal computer device has been described. However, for other computer devices such as other desktop personal computer devices. Of course, it can be used as a cooling device, or it can be used as a cooling device or a heating device in various electronic devices other than a computer device.
[0032]
【The invention's effect】
According to the present invention, in an electronic device having a heat generating member that generates heat by the operation of the device, when the device is activated at a low ambient temperature, the vibration of the first piezoelectric member and the vibration of the second piezoelectric member are repeated. By doing so, the electronic device can be activated after the heating member is efficiently heated to a certain temperature (the temperature at which the device operates stably).
After the start-up, when the heat generating member generates heat by the operation of the electronic device, the heat generating member can be efficiently cooled by repeatedly performing the vibration of the first piezoelectric member and the vibration of the second piezoelectric member. .
[Brief description of the drawings]
FIG. 1 is a schematic diagram illustrating an internal configuration of a thermoelectric conversion unit according to an embodiment of the present invention.
FIG. 2 is a waveform diagram showing an example of voltage waveforms generated in two piezoelectric films according to an embodiment of the present invention.
FIG. 3 is a perspective view illustrating a partially broken example of the electronic apparatus according to the embodiment of the invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Thermoelectric conversion part, 11 ... Heat exchange part, 12 ... Regenerative heat exchange part, 13 ... 1st piston part, 14 ... 2nd piston part, 15 ... 1st piezoelectric film, 16 ... 2nd piezoelectric film 20 ... power supply circuit, 100 ... personal computer device, 111 ... circuit board, 112 ... microprocessor

Claims (3)

A heat generating member made of a microprocessor that generates heat upon operation of the device;
A heat exchanging portion disposed in the vicinity of the heat generating member;
A regenerative heat exchange unit having one end connected to the heat exchange unit;
First and second sealed spaces to which the other ends of the regenerative heat exchange unit are connected;
First and second piezoelectric members disposed in each of the first and second sealed spaces and deformed by application of an external signal;
A signal is applied to each piezoelectric member so that the deformation state of the first piezoelectric member and the deformation state of the second piezoelectric member have a predetermined phase difference. When the device is in a low state, a signal is applied to the first and second piezoelectric members so as to compress the first and second sealed spaces, and after the device is activated, the first and second piezoelectric members are A controller for applying a signal to the first and second piezoelectric members so as to expand the inside of the sealed space;
An electronic apparatus in which a phase difference between deformation states of the first and second piezoelectric members by the control unit is about 90 degrees. A heat generating member made of a microprocessor that generates heat upon operation of the device;
A heat exchanging portion disposed in the vicinity of the heat generating member;
A regenerative heat exchange unit having one end connected to the heat exchange unit;
First and second sealed spaces to which the other ends of the regenerative heat exchange unit are connected;
First and second piezoelectric members disposed in each of the first and second sealed spaces and deformed by application of an external signal;
A signal is applied to each piezoelectric member so that the deformed state of the first piezoelectric member and the deformed state of the second piezoelectric member have a predetermined phase difference. In addition, a signal is applied to the first and second piezoelectric members so as to compress the inside of the second sealed space, and the first and second sealed spaces are expanded after the device is activated. And a heating / cooling method for the heat generating member in the electronic apparatus comprising a controller for applying a signal to the second piezoelectric member,
When the ambient temperature is low when the device is activated, the control unit applies a signal to the first and second piezoelectric members so as to compress the first and second sealed spaces. And applying a signal to each piezoelectric member such that the deformation state of the first piezoelectric member and the deformation state of the second piezoelectric member have a predetermined phase difference;
After controlling the above steps to start the device, the control unit applies a signal to the first and second piezoelectric members so as to expand the inside of the first and second sealed spaces, and Applying a signal to each piezoelectric member such that the deformation state of the first piezoelectric member and the deformation state of the second piezoelectric member have a predetermined phase difference,
A heating / cooling method in which a phase difference between deformation states of the first and second piezoelectric members by the control unit is about 90 degrees. The heating / cooling method according to claim 2 ,
The heating / cooling method, wherein the heat generating member is a microprocessor.

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