JP4301426B2 - External electrode forming apparatus and external electrode forming method for electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an external electrode forming apparatus and an external electrode forming method for an electronic component, and in particular, an apparatus for applying a conductive paste to be an external electrode on a part of a side surface of a component main body provided for the electronic component, and It is about the method.
[0002]
[Prior art]
The external appearance of an electronic component of interest to the present invention is shown in perspective views in FIGS. 3 and 4, respectively. The electronic component 1 shown in FIG. 3 or the electronic component 2 shown in FIG. 4 constitutes an electronic component such as a capacitor having three or more terminals, a capacitor array, an inductor array, an LC composite filter, and a capacitor network. is there.
[0003]
The electronic component 1 shown in FIG. 3 includes a rectangular parallelepiped component main body 3, for example. As the external electrodes provided in the electronic component 1, end surface electrodes 6 and 7 are formed on the opposing end surfaces 4 and 5 of the component body 3, respectively, and the opposing side surfaces 8 and 9 are on part of the opposing side surfaces 8 and 9, respectively. The side electrodes 10 and 11 are respectively formed with a predetermined width.
[0004]
The end face electrodes 6 and 7 are not only on the end faces 4 and 5, respectively, but also on the adjacent face extensions 14 extending to the side faces 7 and 8 adjacent to the end faces 4 and 5 and part of each of the other pair of side faces 12 and 13. And 15. The side electrodes 10 and 11 have not only portions extending on the side surfaces 8 and 9, but also adjacent surface extensions 16 and 17 extending to portions of the side surfaces 12 and 13 adjacent to the side surfaces 8 and 9, respectively. is doing.
[0005]
These adjacent surface extensions 14 to 17 are for improving solderability with a wiring board (not shown) when the electronic component 1 is mounted.
[0006]
On the other hand, the electronic component 2 shown in FIG. 4 includes, for example, a rectangular parallelepiped component main body 18. As an external electrode provided in the electronic component 2, a plurality of, for example, four side electrodes 20 are partially formed with a predetermined width on one side surface 19 of the component body 18, and the side surface facing the side surface 19. On the 21, a plurality of, for example, four side electrodes 22 are partially formed with a predetermined width.
[0007]
The side electrode 20 has not only a portion extending on the side surface 19 but also an adjacent surface extension 25 extending to a part of each of the side surfaces 23 and 24 adjacent to the side surface 19. The side electrode 22 has not only a portion extending on the side surface 21 but also an adjacent surface extension 26 extending to a part of each of the side surfaces 23 and 24 adjacent to the side surface 21.
[0008]
Of particular interest to the present invention is the technique for forming the side electrodes 10, 11, 20 and 22 described above.
[0009]
On the other hand, an external electrode forming apparatus for an electronic component which is an apparatus for forming side electrodes as described above and which is of interest to the present invention is described in Japanese Patent Application Laid-Open No. 11-191521 by the present applicant. FIG. 5 shows an external electrode forming apparatus 31 for an electronic component described in this publication. The external electrode forming apparatus 31 is improved so as to reduce the variation in the applied amount of the conductive paste to be the side electrode.
[0010]
More specifically, FIG. 5 shows a state in which a conductive paste to be the side electrode 20 having a predetermined width is applied on a part of the side surface 19 of the component body 18 of the electronic component 2 shown in FIG. ing.
[0011]
Referring to FIG. 5, the external electrode forming apparatus 31 includes a slit plate 32 and a plunger member 33.
[0012]
The slit plate 32 is made of, for example, a rigid body such as metal or ceramic, and has first and second main surfaces 34 and 35 opposed to each other at a predetermined interval, and thus has a predetermined thickness. ing. The first main surface 34 side of the slit plate 32 is a surface in contact with the side surface 19 (or 21) of the component main body 18.
[0013]
The slit plate 32 is filled with a conductive paste 36 and is provided with a plurality of slits 37 having a width corresponding to the width to which the conductive paste 36 is to be applied.
[0014]
On the other hand, the plunger member 33 is disposed on the second main surface 35 side of the slit plate 32, and has a plurality of convex portions 38 that can respectively enter the slit 37. The plunger member 33 including the convex portion 38 is entirely composed of a rigid body such as metal.
[0015]
The plunger member 33 operates so as to be relatively close to and separated from the slit plate 32 by a driving means (not shown). When the plunger member 33 comes close to the slit plate 32, the convex portion 38 enters the slit 37, and accordingly, the conductive paste 36 filled in the slit 37 is the first main part of the slit plate 32. It is supplied so as to rise to the surface 34 side.
[0016]
As described above, the conductive paste 36 supplied so as to rise to the first main surface 34 side of the slit plate 32 is applied to a part of the side surface 19 of the component main body 18 and is adjacent to the side surface 19. It is also provided on each part of the side surfaces 23 and 24.
[0017]
In this way, application of the conductive paste 36 to be the side electrode 20 is achieved.
[0018]
The same operation is performed on the other side surface 21 of the component main body 18.
[0019]
Thereafter, the conductive paste 36 applied on the component main body 18 is baked, whereby the electronic component 2 in which the side electrodes 20 and 22 as external electrodes are formed on the component main body 18 is completed.
[0020]
FIG. 5 shows only a part of each of the slit plate 32 and the plunger member 33. Usually, the slit plate 32 is provided with a plurality of sets of slits 37 with four slits 37 as one set, and the plunger member 33 has a plurality of sets of convex portions 38 with four convex portions 38 as one set. Is provided. Therefore, the external electrode forming device 31 is configured to be able to apply the conductive paste 36 for the side electrodes 20 or 22 to the plurality of component bodies 18 at the same time.
[0021]
According to the external electrode forming apparatus 31, the amount of the conductive paste 36 in each slit 37 can be made constant, and the stroke of each convex portion 38 can be made constant, so one component main body 18 can reduce the variation in the amount of the conductive paste 36 applied to each of the four side electrodes 20 or 22 and reduce the variation in the amount of the conductive paste 36 applied between the plurality of component bodies 18. Can be reduced.
[0022]
With respect to the application of the conductive paste for the side electrodes 10 and 11 formed on the component body 3 of the electronic component 1 shown in FIG. 3, the slit plate 32 and the convex portion 38 in which the number and arrangement of the slits 37 are changed. By using the plunger member 33 whose number and arrangement state are changed, the external electrode forming apparatus similar to the external electrode forming apparatus 31 shown in FIG. 5 can be used.
[0023]
[Problems to be solved by the invention]
As described above, the slit plate 32 and the plunger member 33 are made of a rigid body. Therefore, the slit 37 of the convex portion 38 is in a state where the convex portion 38 made of the rigid body is in contact with the inner surface defining the slit 37 made of the rigid body. The mating state is achieved.
[0024]
However, since the convex part 38 must be movable in the slit 37, it is extremely difficult or impossible to eliminate any gap between the convex part 38 made of a rigid body and the inner surface of the slit 37. Close to.
[0025]
Therefore, the problem of leakage of the conductive paste 36 through this gap cannot be avoided. For example, when the conductive paste 36 leaks from the gap to the second main surface 35 side of the slit plate 32, or the leaked conductive paste 36 accumulates between adjacent convex portions 38. Next, when the convex portion 38 enters the slit 37, the leaked conductive paste 36 is also introduced into the slit 37, and the supply amount of the conductive paste 36 due to one stroke of the convex portion 38 varies. May cause.
[0026]
The variation in the supply amount of the conductive paste 36 as described above mainly causes the variation in the application length 39 of the conductive paste 36 shown in FIG. 5 on the side surface 23 or 24 of the electronic component body 18, and as a result. , The length of the adjacent surface extension 25 or 26 shown in FIG. 4 varies.
[0027]
In addition, air may be mixed into the conductive paste 36 through the gaps described above. In this case, bubbles are brought into the conductive paste 36 filled in the slit 37. As a result, pinholes or voids are generated in the formed side electrode 20 or 22, or air bubbles are blown in the application step of the conductive paste 36, so that the conductive paste 36 is applied to an undesired portion of the component body 18. May adhere or the outline of the formed side electrode 20 or 22 may be disturbed.
[0028]
Accordingly, an object of the present invention is to provide an external electrode forming apparatus and an external electrode forming method for an electronic component that can solve the above-described problems.
[0029]
[Means for Solving the Problems]
The present invention is first directed to an external electrode forming apparatus for an electronic component for applying a conductive paste to be an external electrode with a predetermined width on a part of a side surface of a component body of the electronic component.
[0030]
The external electrode forming apparatus for an electronic component has first and second main surfaces facing each other with a predetermined interval, substantially as in the case of the prior art described above, and the first main surface side is the component. A rigid slit plate provided with a plurality of slits having a width corresponding to the width to which the conductive paste is to be applied, the surface being in contact with the side surface of the main body and being filled with the conductive paste And a plunger member having a convex part that can be inserted into the slit, and a conductive paste filled in the slit, which is disposed on the second main surface side of the slit plate. Drive means for driving the convex portion into the slit so as to apply the conductive paste in the slit onto a part of the side surface of the component main body while supplying it so as to rise to the side. .
[0031]
Then, to solve the technical problems described above, the external electrode forming apparatus of the electronic component, further, while surrounding the protrusion described above, it is disposed in contact with the second major surface side of the slit plate, the slit plate A packing member made of an elastic body and a reinforcing plate made of a rigid body extending along the packing member . The packing member includes a reinforcing plate and a slit plate. are positioned in a state sandwiched between, when the protrusion is positioned in the slit, the convex portion and the packing member is characterized by being in contact without any gap.
[0035]
The present invention also provides an external electrode for an electronic component comprising the steps of preparing a component main body of the electronic component and applying a conductive paste to be an external electrode with a predetermined width on a part of a side surface of the component main body. Also directed to forming methods.
[0036]
In this method of forming an external electrode for an electronic component, first, the first and second main surfaces are opposed to each other with a predetermined interval, and the first main surface side is a surface in contact with the side surface of the component main body. A slit plate made of a rigid body provided with a plurality of slits having a width corresponding to the width to which the adhesive paste is to be applied, and disposed on the second main surface side of the slit plate, and enters the slit A plunger member having a possible convex portion and a plate-like shape that is arranged in contact with the second main surface of the slit plate while surrounding the convex portion and extends along the second main surface of the slit plate A packing member made of an elastic body and a reinforcing plate made of a rigid body extending along the packing member . The packing member is positioned in a state of being sandwiched between the reinforcing plate and the slit plate, and the convex portion is in the slit. When located at The packing member are in contact without any gap, the external electrode forming apparatus is provided.
[0037]
Then, the conductive paste is filled in the slit, the side surface of the component main body is brought into contact with the first main surface of the slit plate, and then the convex portion is inserted into the slit, whereby the conductive material filled in the slit is filled. Each step of applying the conductive paste in the slit onto a part of the side surface of the component main body while supplying the conductive paste so as to rise to the first main surface side, and further baking the conductive paste Is implemented.
[0038]
In the step of projecting the convex portion into the slit, the thickness of the conductive paste applied on the side surface of the component main body can be changed by changing the distance between the tip of the convex portion and the side surface of the component main body at the end position of the plunging. You may make it adjust.
[0039]
Moreover, it is preferable that the conductive paste in the slit is also applied to a part of the surface adjacent to the side surface of the component main body in the step of projecting the convex portion into the slit.
[0040]
In the case described above, in the step of projecting the convex portion into the slit, the application length of the conductive paste on the surface adjacent to the side surface of the component main body may be adjusted by changing the stroke of the convex portion. Good.
[0041]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 and FIG. 2 are for explaining an external electrode forming apparatus 41 for an electronic component according to an embodiment of the present invention. Here, in FIG. 1, the overall configuration of the external electrode forming apparatus 41 is shown in a front view with a partial cross section. 2 is an enlarged view of a portion of the external electrode forming apparatus 41 shown in FIG.
[0042]
The external electrode forming apparatus 41 shown in FIGS. 1 and 2 is shown as one for forming the side electrodes 10 and 11 in the electronic component 1 shown in FIG.
[0043]
The external electrode forming apparatus 41 includes a slit plate 42 and a plunger member 3. In the external electrode forming apparatus 41, a plurality of component main bodies 3 are handled in a state of being held by a holder 44.
[0044]
The slit plate 42 is made of, for example, a rigid body such as metal or ceramic, and has first and second main surfaces 45 and 46 opposed to each other at a predetermined interval, and therefore has a predetermined thickness. is doing. The first main surface 45 side of the slit plate 42 is a surface in contact with the side surface 8 or 9 of the component body 3.
[0045]
The slit plate 42 is provided with a plurality of slits 48 that are filled with the conductive paste 47 and have a width corresponding to the width to which the conductive paste 47 is to be applied.
[0046]
On the other hand, the plunger member 43 is disposed on the second main surface 46 side of the slit plate 42 and has a plurality of convex portions 49 that can respectively enter the slit 48. In this embodiment, the whole plunger 43 including the convex part 49 is comprised from the rigid body like a metal, for example.
[0047]
The plunger member 43 is operated so as to be relatively close to and separated from the slit plate 42 by a driving means (not shown) as indicated by arrows 50 and 51. When the plunger member 43 moves in the direction of the arrow 50, the convex portion 49 enters the slit 48, and accordingly, the conductive paste 47 filled in the slit 48 is on the first main surface 45 side of the slit plate 42. Supplied to swell.
[0048]
The external electrode forming apparatus 41 also includes a packing member 52 made of an elastic body and arranged in contact with the second main surface 46 of the slit plate 42 while surrounding the convex portion 49. As a material constituting the packing member 52, for example, silicone rubber is advantageously used. In this embodiment, the packing member 52 has a plate shape extending along the second main surface 46 of the slit plate 42.
[0049]
Further, a reinforcing plate 53 made of a rigid body is disposed so as to extend along the packing member 52, and the packing member 52 is fixed by screwing the reinforcing plate 53 to the slit plate 42 (not shown) or the like. The positioning is ensured in a state of being sandwiched between the reinforcing plate 53 and the slit plate 42.
[0050]
The packing member 52 made of, for example, silicone rubber is preferably prepared in a state of being molded on the reinforcing plate 53 and integrated with the reinforcing plate 53.
[0051]
Next, a method for applying the conductive paste 47 to the component main body 3 using the external electrode forming apparatus 42 will be described.
[0052]
First, the conductive paste 47 is filled in each slit 48 of the slit plate 42. In filling the conductive paste 47, the conductive paste 47 is usually supplied from above the slit 48. More specifically, the following several methods may be employed. it can.
[0053]
For example, an appropriate amount of the conductive paste 47 is placed on the first main surface 45 of the slit plate 42, and a squeegee (not shown) is allowed to act on the first main surface 45 of the slit plate 42, thereby The conductive paste 47 can be filled in each slit 48.
[0054]
In the above-described filling process of the conductive paste 47, the convex portion 49 is preferably positioned so as to close the opening of the slit 48 on the second main surface 46 side.
[0055]
Further, in a state where the convex portion 49 is inserted into the slit 48, the conductive paste 47 is applied so as to cover the slit 48 on the first main surface 45 side of the slit plate 42, and then the convex portion 49 is It is also possible to move in the direction of the arrow 51, thereby sucking the conductive paste 47 into the slit 48 and filling the slit 48 with the conductive paste 47.
[0056]
Next, the holder 4 holding the plurality of component bodies 3 is brought close to the slit plate 42, whereby one side surface 8 of the component body 3 is brought into contact with the first main surface 45 of the slit plate 42. The
[0057]
Next, as shown by the arrow 50, the plunger member 43 is brought close to the slit plate 42, thereby causing the convex portion 49 to enter the slit 48. As a result, the conductive paste 47 filled in the slit 48 is supplied so as to rise to the first main surface 45 side of the slit plate 42 and is applied onto a part of the side surface 8 of the component body 3. At the same time, the conductive paste 47 is also applied to each part of the side surfaces 12 and 13 adjacent to the side surface 8 of the component body 3.
[0058]
In the step of applying the conductive paste 47 described above, that is, the step of causing the protrusion 49 to enter the slit 48, by changing the distance 54 between the tip of the protrusion 49 and the side surface 8 of the component body 3 at the end position of the protrusion. The applied thickness of the conductive paste 47 on the side surface 8 of the component body 3 can be adjusted.
[0059]
Further, in the step of causing the protrusion 49 to enter the slit 48, the supply amount of the conductive paste 47 can be changed by changing the stroke of the protrusion 49, whereby the component body 3 of the conductive paste 47 can be changed. The application length 55 on each of the side surfaces 12 and 13 can be adjusted.
[0060]
As shown well in FIG. 2, when the convex portion 49 is located in the slit 48, the convex portion 49 and the packing member 52 are in contact with each other without a gap. Accordingly, when the convex portion 49 operates in the slit 48 due to the movement of the plunger 43 in each direction indicated by the arrows 50 and 51, the packing member 52 is disposed, so that the conductive paste 47 in the slit 48 is convex. It does not leak through the gap between the portion 49 and the inner surface of the slit 48, and air does not enter the conductive paste 47 in the slit 48.
[0061]
After the conductive paste 47 is applied on a part of one side surface 8 of the component main body 3 and each of the side surfaces 12 and 13 adjacent to the conductive paste 47 as described above, the same operation is performed in the component main body. 3 is also performed on the other side surface 9 of the third.
[0062]
Thereafter, the conductive paste 47 applied onto the component body 3 is baked, thereby forming side electrodes 10 and 11 as external electrodes having adjacent surface extensions 16 and 17, respectively, as shown in FIG. In addition, the electronic component 1 is completed.
[0063]
Above, the invention has been described in connection with the embodiment of forming the side electrodes 10 and 11 in the electronic component 1 shown in FIG. 3, the number and arrangement as well as the plunger member 43 of the slit 48 in the slit plate 42 The external electrode forming apparatus 41 shown in FIGS. 1 and 2 is applied to the formation of the side electrodes 20 and 22 in the electronic component 2 shown in FIG. 4 by changing the number and arrangement of the convex portions 49. can do.
[0064]
【The invention's effect】
As described above, according to the present invention, the convex portion provided in the plunger member is plunged into the slit formed in the slit plate, whereby the conductive paste filled in the slit is transferred to the first main portion of the slit plate. A state in which the conductive paste in the slit is applied onto a part of the side surface of the component body while being supplied so as to rise to the surface side, and in contact with the second main surface of the slit plate while surrounding the convex portion Thus, since the packing member made of an elastic body is arranged, it is possible to advantageously prevent the conductive paste from leaking through the gap between the convex portion and the inner surface of the slit.
[0065]
As a result, the conductive paste once leaked is introduced again into the slit, thereby preventing variation in the amount of conductive paste applied to the component body. It is possible to prevent the adhesive paste from being improperly applied.
[0066]
Therefore, according to the present invention, as described above, the protrusion of the conductive paste is inserted into the slit, thereby providing the conductive paste filled in the slit on the component body. The effect that the variation in the applied amount can be reduced can be reliably achieved without being reduced.
[0067]
Further, according to the present invention, the packing member, since a plate-like shape extending along the second major surface of the slit plate, it is possible to arrange the packing member in a stable state.
[0068]
Moreover, according to this invention, the reinforcing plate which consists of a rigid body extended along the plate-shaped packing member as described above is further provided, and the packing member is sandwiched between the reinforcing plate and the slit plate. since the positioned state, made of an elastic material, i.e. even deformable packing member can be reliably positioned the same.
[0069]
Further, according to the external electrode forming apparatus of an electronic component according to the present invention, applied since a plurality of slits are provided in the slit plate for a plurality of locations or a plurality of the component body of the component body, the conductive paste simultaneously And the paste application process can be efficiently performed.
[0070]
In the method of forming an external electrode of an electronic component according to the present invention, when the convex portion is inserted into the slit, the distance between the tip end portion of the convex portion and the side surface of the component main body at the end position of the protrusion is changed. The applied thickness of the conductive paste can be adjusted.
[0071]
In addition, when the convex portion enters the slit, the conductive paste in the slit can be applied to a part of the surface adjacent to the side surface of the component main body, if necessary. The external electrode having the adjacent surface extension can be formed.
[0072]
In the case described above, when the convex portion is inserted into the slit, the application length of the conductive paste on the surface adjacent to the side surface of the component main body can be adjusted by changing the stroke of the convex portion.
[Brief description of the drawings]
FIG. 1 is a front view showing a partial cross section of an overall configuration of an external electrode forming apparatus 41 for an electronic component according to an embodiment of the present invention.
FIG. 2 is an enlarged front view showing a part of the external electrode forming apparatus 41 shown in FIG.
FIG. 3 is a perspective view showing an external appearance of an electronic component 1 that is of interest to the present invention.
FIG. 4 is a perspective view showing the appearance of another electronic component 2 of interest to the present invention.
FIG. 5 is a front view showing a partial cross section of a conventional external electrode forming apparatus 31 of interest to the present invention.
[Explanation of symbols]
1, 2 Electronic component 3, 18 Component body 8, 9, 19, 21 Side surface 10, 11, 20, 22 Side electrode 12, 13, 23, 24 Side surface (adjacent surface)
16, 17, 25, 26 Adjacent surface extension 41 External electrode forming device 42 Slit plate 43 Plunger member 45 First main surface 46 Second main surface 47 Conductive paste 48 Slit 49 Protruding portion 52 Packing member 53 Reinforcing plate 54 Interval 55 Granted length

Claims (5)

An external electrode forming apparatus for an electronic component for applying a conductive paste to be an external electrode with a predetermined width on a part of a side surface of a component body of the electronic component,
The first and second main surfaces facing each other at a predetermined interval, the first main surface side being a surface in contact with the side surface of the component main body, and for filling the conductive paste A slit plate made of a rigid body provided with a plurality of slits having a width corresponding to the width to which the conductive paste is to be applied;
A plunger member that is disposed on the second main surface side of the slit plate and has a convex portion that can enter the slit;
While supplying the conductive paste filled in the slit so as to rise to the first main surface side, to apply the conductive paste in the slit on a part of the side surface of the component body, Driving means for driving the convex portion to enter the slit;
A packing made of an elastic body that surrounds the convex portion and is arranged in contact with the second main surface of the slit plate, and has a plate shape extending along the second main surface of the slit plate. A member ,
A reinforcing plate made of a rigid body extending along the packing member ,
The packing member is positioned in a state of being sandwiched between the reinforcing plate and the slit plate,
When the convex portion is positioned in the slit, the convex portion and the packing member are in contact with each other without a gap,
External electrode forming device for electronic parts . An electronic component external electrode forming method comprising each step of preparing a component main body of an electronic component and applying a conductive paste to be an external electrode with a predetermined width on a part of a side surface of the component main body. ,
It has 1st and 2nd main surfaces which oppose each other at a predetermined interval, the first main surface side is a surface in contact with the side surface of the component main body, and corresponds to a width to which the conductive paste is to be applied. A slit plate made of a rigid body provided with a plurality of slits having a width to be
A plunger member that is disposed on the second main surface side of the slit plate and has a convex portion that can enter the slit;
A packing made of an elastic body that surrounds the convex portion and is arranged in contact with the second main surface of the slit plate, and has a plate shape extending along the second main surface of the slit plate. A member ,
A reinforcing plate made of a rigid body extending along the packing member ,
The packing member is positioned in a state of being sandwiched between the reinforcing plate and the slit plate,
When the convex portion is positioned in the slit, the convex portion and the packing member are in contact with each other without a gap,
Preparing an external electrode forming apparatus;
Filling the slit with the conductive paste;
Contacting the side surface of the component main body with the first main surface;
Next, the conductive portion in the slit is supplied while the convex portion enters the slit, thereby supplying the conductive paste filled in the slit so as to rise to the first main surface side. Applying paste on a part of the side surface of the component body;
A method of forming an external electrode of an electronic component, comprising: baking the conductive paste. In the step of projecting the convex portion into the slit, the conductive paste on the side surface of the component main body is changed by changing the distance between the front end portion of the convex portion and the side surface of the component main body at the end position of the projection. The method for forming an external electrode of an electronic component according to claim 2 , wherein the applied thickness is adjusted. In the step of rush the protrusion in the slit, the electronic component according to the conductive paste is also applied on a portion of surface adjacent to the side surface of the component body, according to claim 2 or 3 in the slit External electrode forming method. In the step of projecting the convex portion into the slit, the application length of the conductive paste on the surface adjacent to the side surface of the component main body is adjusted by changing the stroke of the convex portion. The method of forming an external electrode for an electronic component according to claim 4 .

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