JP4285612B2 - Susceptor - Google Patents

Description

  The present invention relates to a susceptor that heats or cools a substrate, and more particularly to a susceptor that is used in a substrate heat treatment apparatus that heats or cools a substrate such as a semiconductor wafer or liquid crystal glass in a manufacturing process of a semiconductor element or a liquid crystal panel.

  In the manufacturing process of a semiconductor element or a liquid crystal panel, a substrate 31 such as a semiconductor wafer or liquid crystal glass is heated or cooled using a substrate heat treatment apparatus 30 as shown in FIG. In this substrate heat treatment apparatus 30, the susceptor 32 that heats or cools the substrate 31 has a structure in which a heating source or a cooling source 33 is sandwiched between the heat transfer plate 34 and the holding plate 35 from above and below, and the heat transfer plate As the material of 34 and the presser plate 35, aluminum, aluminum alloy, copper, copper alloy or the like excellent in thermal conductivity is used.

  The heat transfer plate 34 and the pressing plate 35 are joined by welding or brazing the outer peripheral portion. However, since pinholes and gas entrainment occur at that time, there is a problem that the strength of the joint portion is reduced. there were. In addition, when the inside of the substrate heat treatment apparatus is evacuated, gas or the like leaks from the pinhole and lowers the degree of vacuum, which has an adverse effect on the heat treatment of the substrate.

  In order to solve these problems, Patent Document 1 proposes a susceptor in which an annular protrusion and an annular groove are provided at a position opposite to a joint surface between a heat transfer plate and a pressing plate, and they are combined and forged and compressed. Yes.

However, in the invention described in Patent Document 1, since the shape of the annular protrusion and the annular groove is simple, it is possible to improve the airtightness of the joint surface to a degree that can cope with high vacuum and heat treatment in liquid. There was a problem that it was difficult. In addition, since the temperature is raised to near the temperature of the heating region used as the heater plate (for example, 400 ° C.) and forging is performed, depending on the material of the heat transfer plate and the holding plate, the characteristics may change due to deformation or structural change. In addition, there is a problem that the manufacturing cost increases because special equipment and work are required.
JP 2002-270347 A

  It is an object of the present invention to provide a susceptor that improves the airtightness of the joint surface and is easy to manufacture at low cost without deformation or characteristic change.

In order to achieve the above object, the present invention provides a susceptor formed by sandwiching a substrate heating unit and joining a first plate and a second plate, and a tip-shaped tip portion formed on a joint surface of the first plate. provided with an annular protruding portion having a cross section at a position opposed to the annular protrusion of the joint surface of the second plate is provided with an annular groove of reverse trapezoidal shape, a pressure is fitted to the annular protrusion to the annular groove in addition By caulking , the annular projection is compressed and plastically deformed at the bottom surface of the annular groove, and the tip of the annular projection is expanded to be in close contact with the slope of the annular groove. it is an feature.

  A convex portion is formed on the bottom surface of the annular groove. In addition, a notch is formed on the side surface of the annular protrusion having the same height as the base of the tip of the tip. A sealing material is interposed between the annular protrusion and the annular groove, and an O-ring or a metal seal is preferably used as the sealing material.

As the substrate heating means, a metal foil heater, a mica winding heater or a sheathed heater is used.
Further, a substrate cooling means can be used instead of the substrate heating means.
The substrate cooling means is composed of a pipe material or a gap through which the coolant flows.

  According to the present invention, the heat transfer plate and the holding plate of the susceptor are provided with an annular protrusion having a tip-shaped tip provided on one joint surface, and a groove portion having an inverted trapezoidal cross section provided on the other joint surface. Since the annular protrusion is plastically deformed within the groove and the cracked portion is expanded and is in close contact with the inclined surface of the groove, the airtightness of the joint surface can be improved. Further, since caulking can be performed at room temperature using a general press machine, the susceptor is not deformed or its characteristics are changed, the manufacturing cost can be reduced, and the manufacturing can be facilitated. it can.

  Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an assembled sectional view of a susceptor according to a first embodiment of the present invention.
The susceptor 1 is manufactured by sandwiching a planar heater 2 as a substrate heating source from above and below by a heat transfer plate 3 and a holding plate 4 and joining at a joint A. A substrate such as a semiconductor wafer or liquid crystal glass is placed on the heat transfer plate 3 directly or via a plurality of proximity pins (not shown), and is heated by the surface heater 2 through the heat transfer plate 3. The The planar shape of the susceptor 1 is circular when the substrate is a semiconductor wafer, and rectangular when the substrate is glass for liquid crystal.

  As the planar heater 2, a metal foil heater or a mica winding heater is used, and is fixed to the lower surface 7 of the heat transfer plate 3 together with the heat shielding plate 5 by screws or the like. As a material for the heat transfer plate 3 and the pressing plate 4, aluminum, aluminum alloy, copper, copper alloy, or the like excellent in thermal conductivity is used.

  A joining portion A between the heat transfer plate 3 and the pressing plate 4 is transferred to the upper surface 6 which is a joining surface of the pressing plate 4 so as to face the protruding portion 8 provided in an annular shape along the outer periphery. It is comprised from the groove part 9 provided in the lower surface 7 which is a joining surface of the heat | fever plate 3 cyclically | annularly. As shown in FIG. 2, the tip of the protrusion 8 of the presser plate 4 has a bifurcated tip 8a, and the groove 9 of the heat transfer plate 3 has an inverted trapezoidal cross section.

  The susceptor 1 inserts the protrusion 8 of the presser plate 4 into the groove 9 of the heat transfer plate 3 and caulks it by applying vertical pressure, thereby connecting the heat transfer plate 3 and the presser plate 4 as shown in FIG. Manufactured by joining.

  At this time, the protrusion 8 fitted in the groove 9 as shown in FIG. 4 (a) is compressed and plastically deformed at the bottom surface 9a of the groove 9 as shown in FIG. 4 (b), and the cracked portion 8a is expanded. Since it opens and closely adheres to a part of the slope 9b of the groove part 9, the airtightness of the joint surface can be improved as compared with the conventional case. Further, since caulking can be performed at room temperature using a general press machine, the susceptor is not deformed or its characteristics are not changed, the manufacturing cost can be reduced, and the manufacturing is easy. Can be.

  With respect to the width W1 and height H1 of the protrusion 8 and the opening width W2 and depth H2 of the groove 9 shown in FIG. 5, the width W1 is slightly smaller than the opening width W2 in order to ensure caulking securely and firmly. In addition to reducing the size, it is preferable to set the size so that 60 to 80% of the volume of the groove 9 is filled with the protrusion 8 after caulking. In addition, in order to improve the adhesion between the front cracked portion 8a of the protrusion 8 and the slope 9b of the groove 9, the angle α between the inner slope 8b of the front crack 8a and the vertical direction is set so that the slope 9b of the groove 9 is The angle β is preferably smaller than the angle β, and specifically, the angle α is 10 to 45 ° and the angle β is 20 to 45 °.

FIG. 6 shows the joint portion of the susceptor according to the second embodiment of the present invention.
In this embodiment, the convex portion 10 is provided on a part of the bottom surface 9 a of the groove portion 9. A taper 10a is formed at the end of the convex portion 10 so that the tip of the tip cracked portion 8a of the projection 8 abuts when caulking.

  Thus, by providing the convex part 10 in the bottom face 9a of the groove part 9, since the front crack part 8a of the projection part 8 can be expanded reliably along the taper 10a of the convex part 10, the heat transfer plate 3 can improve the airtightness of the joint surface between the pressure plate 3 and the pressing plate 4, and can facilitate the manufacturing operation.

FIG. 7 shows the joint portion of the susceptor according to the third embodiment of the present invention.
In this embodiment, a notch 11 is provided on the outer periphery of the protrusion 8 corresponding to the root position of the front cracked portion 8a of the protrusion 8.

  By providing the notch 11 in this manner, the tip cracked portion 8a of the protrusion 8 is easily expanded when bent by the notch 11 during caulking. The airtightness of the joint surface can be improved, and the manufacturing operation can be further facilitated.

FIG. 8 shows the joint portion of the susceptor according to the fourth embodiment of the present invention.
In this embodiment, as shown to Fig.8 (a), the sealing material 12 is mounted or fixed between the cracked parts 8a of the projection part 8. FIG. As the sealing material 12, an O-ring made of natural rubber, fluorine rubber or silicon rubber, or a metal seal made of Inconel or stainless steel can be used.

  By using the sealing material 12 in this way, the sealing material is interposed between the front cracked portion 8a and the bottom surface 9a of the groove portion 9 as shown in FIG. Can be further improved. The height H1 of the protrusion 8 and the depth H2 of the groove 9 at this time are preferably set so that 70 to 90% of the volume of the groove 9 is filled with the protrusion 8 and the sealing material 12 after caulking. .

  As another example of this embodiment, as shown in FIG. 9, the sealing material 12 is formed of a hollow thin pipe whose outer diameter is slightly smaller than the opening of the groove portion 9, so that it is projected when caulked. The function as a sealing material can be further improved by facilitating opening of the cracked portion 8a of the portion 8. The hollow thin-walled pipe is preferably made of a metal having a low hardness such as aluminum, aluminum alloy, copper or copper alloy.

  Of course, in all the embodiments described above, the protrusion 8 may be provided on the heat transfer plate 3 and the groove 9 may be provided on the holding plate 4. Moreover, although the protrusion part 8 and the groove part 9 are provided in the outer peripheral part of the heat-transfer plate 3 and the pressing board 4, it can also provide in another suitable location according to the magnitude | size and shape of a susceptor.

  For example, in the case of a large-sized semiconductor wafer susceptor having a diameter of 12 inches or more, by providing a protrusion 8 and a groove 9 near the center as shown in FIG. The airtightness of the can be further improved. As another example, when a lifter pin for transferring the substrate between the susceptor and the transfer jig is provided, a protrusion 8 and a groove 9 are provided around the insertion hole of the lifter pin formed in the susceptor. As a result, the airtightness of the joint surface can be improved.

  As a substrate heating source disposed between the heat transfer plate 3 and the holding plate 4, in addition to the planar heater, as shown in FIG. 11, a mounting groove 13 that runs in a meandering shape or a concentric shape as shown in FIG. A heater 14 may be embedded. In addition, by installing a cooling pipe directly in the mounting groove 13 and flowing a cooling medium such as air, water, refrigerant, etc. into the inside thereof, a substrate cooling source can be used instead of the substrate heating source. it can.

It is assembly sectional drawing of the susceptor which consists of 1st Embodiment of this invention. It is an expanded sectional view of the A section in FIG. It is a susceptor which consists of a 1st embodiment of the present invention. It is explanatory drawing explaining the effect | action of a junction part. It is explanatory drawing explaining the shape of a junction part. It is a junction part of the susceptor which consists of the 2nd Embodiment of this invention. It is a junction part of the susceptor which consists of the 3rd Embodiment of this invention. It is a junction part of the susceptor which consists of the 4th Embodiment of this invention. It is a junction part of the susceptor which consists of another example of the 4th Embodiment of this invention. It is an example of the susceptor which consists of 1st Embodiment of this invention. This is an example in which a sheathed heater is used as the substrate heating means of the present invention. It is an example of the substrate heat processing apparatus which incorporated the susceptor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Susceptor 2 Planar heater 3 Heat transfer plate 4 Holding plate 5 Thermal shielding plate 6 Upper surface of holding plate 7 Lower surface 8 of heat transfer plate Projection 9 Groove 10 Protrusion 11 Notch 12 Sealing material 13 Mounting groove 14 Sheath heater

Claims (8)

A susceptor formed by sandwiching a substrate heating means and joining the first plate and the second plate,
Provided with an annular protruding portion having a tip-split shape of the front end portion on the bonding surface of the first plate, cross section at a position opposed to the annular protrusion of the joint surface of the second plate is provided with an annular groove of reverse trapezoidal shape, wherein by occupying the annular projection Teka applying pressure is fitted in the annular groove, with plastic deformation by compressing the annular protrusions in the annular groove of the bottom, by widening the distal end portion of the annular protrusion A susceptor that is in close contact with the inclined surface of the annular groove .   The susceptor according to claim 1, wherein a convex portion is formed on a bottom surface of the annular groove portion.   The susceptor according to claim 1 or 2, wherein a notch is formed on a side surface of the annular projection having the same height as the base of the tip of the tip-shaped crack.   The susceptor according to claim 1, wherein a sealing material is interposed between the annular protrusion and the annular groove.   The susceptor according to claim 4, wherein the sealing material is an O-ring or a metal seal.   The susceptor according to any one of claims 1 to 5, wherein the substrate heating means is a metal foil heater, a mica winding heater or a sheathed heater.   The susceptor according to any one of claims 1 to 5, wherein a substrate cooling means is sandwiched between the first plate and the second plate instead of the substrate heating means.   The susceptor according to claim 7, wherein the substrate cooling means is a pipe material or a gap through which a coolant flows.

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