JP4268155B2 - Component mounting equipment - Google Patents

Description

The present invention, real SoSo location of parts, and more particularly, printing of parts relates to real SoSo location of components to be mounted on a mounting object with an electrical connection of the metal parts, for example, in a state which is not subjected to the package It is suitable for mounting electronic components such as bare IC chips that are mounted on a circuit board such as a wiring board to manufacture an electronic circuit board.

  In the bare IC chip, for example, a circuit pattern is formed on a semiconductor wafer by using a thin film technique, and is used for manufacturing an electronic circuit board by mounting on a printed board. As shown in FIG. 11, in the bare IC chip a, an electrode d for electrical joining to a conductor land c formed on a circuit board b by printed wiring or the like is formed together with a circuit pattern, and the electrode d is formed without being packaged. The so-called surface mounting is performed in which the bonding surface e held is opposed to the bonding surface f having the conductor land c of the circuit board b and the conductor land c and the electrode d are fixed in an electrical connection state. As shown in FIG. 12, a resin sealing material g is filled between the joint surfaces e and f to seal the circuit pattern and the like formed on the joint surface e of the bare IC chip a including the electrical joint portion from the surroundings. I try to stop.

  Recently, in order to perform such mounting, a metal bump h as shown in FIG. 11 is formed on the electrode d of the bare IC chip a by wire bonding or the like, and the bare IC chip a is attached to the suction nozzle n. The bump h is pressed against the conductor land c of the circuit board b so as to face the predetermined position on the positioned circuit board b to be electrically bonded, and the bump h or Both are fixed with an adhesive j applied in advance to the conductor land c or a solder paste for assisting the electrical joining, and the bare IC chip a is mounted on the circuit board b, and then as shown in FIG. The circuit board b is held obliquely, and a sealing material g is poured between the joint surfaces e and f of the bare IC chip a and the circuit board b using a dispenser k or the like as indicated by a virtual line, for example, I'll show you a solid line So that sealing treatment is filled in.

  However, in such a conventional method, a sealing material is provided between the step of mounting the bare IC chip a on the circuit board b, and the joint surfaces e and f between the circuit board b and the bare IC chip a mounted on the circuit board b. The process of pouring g differs greatly in the handling and work of the circuit board, and the work is carried out with different devices, so that the equipment cost is high. Moreover, since it takes a long time to pour the sealing material g between the joint surfaces e and f, the productivity is low. For example, in the case of a bare IC chip a having a size of 10 mm × 10 mm, while the dispenser k is reciprocated along the upper side of the bare IC chip a and the sealing material g is supplied to the entire width thereof, the sealing material g The work is finished after waiting to fill the entire area between the joint surfaces e and f to the extent that the wetting spread portion m as shown in FIG. 12 is formed around the bare IC chip a. Such mounting takes about 10 seconds per bare IC chip a. Further, since the interval between the joining surfaces e and f is very narrow, for example, about 50 μm, the viscosity range of the sealing material g used is as narrow as 2000 to 3000 cps even when the sealing material g is poured over a long time as described above. The degree of freedom of selection is low. Moreover, since it is necessary to heat the sealing material g in this viscosity range to a relatively high temperature of 40 ° C. to 60 ° C., the working time is also long in this aspect, and the heat consumption is large and saving energy. It is disadvantageous.

In addition, the filler material of the sealing material g poured between the joining surfaces e and f can be unevenly distributed, which may lead to sealing failure. Further, since the electrical bonding between the bump h of the bare IC chip a and the conductor land c of the circuit board b is only contact, contact failure sometimes occurs in the fixing with the adhesive j and the sealing material g, Yield decreases. If this is fixed by solder paste, heat and time are further consumed to heat and cure the solder paste.

An object of the present invention, heat less consumption in a short time with simple equipment, yet be implemented aiming sufficient electrical connection between the component and the mounting object is to provide a real SoSo location of the component .

In order to achieve the above object, a component mounting apparatus according to the present invention includes a component supply unit that supplies a component to a predetermined position, and a mounting object on which the component is mounted is supplied to the component mounting position. After being subjected to the above, the mounting object handling means for transferring it to the other and the component supplied by the component supply unit are held and handled by the component handling tool, and the joint surface having the electrical junction of the component is attached to the mounting object. Ultrasonic vibration is applied to the component handling means for mounting by using the component handling means that is positioned and pressed so that the two electrical junctions face each other, facing the joining surface having the electrical joint, and for mounting. The component handling tool holds the component that connects the means, opposes and press-contacts the mounting object, applies ultrasonic vibration to the component, and joins the electrical joints between the component and the mounting object, and component mounting The metal electrical joints of the parts to be handled by the component handling means are opposed to the metal electrical joints of the parts to be handled by the mounting object handling means. The sealing material provided to a part of one or both of the joint surfaces of the adhesive is preliminarily applied to the whole or a part thereof, and the sealing material provided to a part of the joint surface is pressure-welded with the supply to the whole area and is subjected to ultrasonic vibration. At least one joint surface of the control means for ultrasonically joining the electrical joints between the component and the mounting object by means of the means, the mounting object handled by the mounting object handling means, and the component handled by the component handling means And a sealing material supply means for supplying a sealing material that is acted on by the control means until they are aligned. Depending on the type, it is possible to change the sealing material supply conditions by the sealing material supply means, and further, image recognition information of the filling state of the sealing material when the component is mounted on the mounting target Detecting means for detecting an excess or deficiency in the amount of the sealing material supplied, and the control means corrects the amount of the sealing material provided by the sealing material supply means according to the detected excess or deficiency of the sealing material. Is one feature.

In such a configuration, first, friction is caused by ultrasonic vibration applied to the component in a pressure contact state between the electrical joint portion of the component and the electrical joint portion of the mounting target, and the electrical joint portions are ultrasonically joined together with melting. At the same time, when the electrical joints are pressed together, one or both of the joint surfaces are preliminarily pressed against each other by pressing them close to each other, so that no necessary work and time are required. Because the range is forcibly filled instantly, electrical joining between electrical joints and filling the sealing material to the required range can be accomplished in a short time in one operation. The sealing material used is not limited in viscosity as in the case of pouring, and can be cured in a short time together with the above work at a low temperature using a material with a high viscosity, so the parts can be mounted in a short time with simple work and equipment. Less heat It is achieved in costs. In addition, the components can be automatically and stably achieved at a high speed on the mounting surface of the mounting object simply by controlling the component supply unit, the mounting object handling means, and the joining means by the control means according to a predetermined program. In addition, the electrical joining between the electrical joints involves metal joining and is reliable, and there is no generation of defective products due to poor contact, improving yield. Therefore, the product cost can be reduced.

Second, including the provision of sealing material to at least one of the parts products and implement the object, it is possible to automatically achieve the component mounting by one apparatus.

Third, to handle a plurality of types of components such as the size is different in the junction surface, such as by donating sealing material in an amount and condition of the donor suitable for each may be different depending on the type of components It is possible to automatically cope with differences in sealing conditions. The types of components to be mounted from time to time can be obtained from manually input component information, component information by a mounting program, supplied components and component information read from support members thereof.

Fourth, it is possible to correspond to this even if excess or shortage for some reason dosage of sealing material at the set conditions, as always proper sealing state can be obtained.

The sealing material can be cured by natural drying, but at least at the component mounting position, if there is a heating means that cures the sealing material directly or indirectly, it is compulsory simultaneously with the joining operation of the components. In a short time, it is preferable that the mounting can be completed by being surely cured. Heating may be performed by a heater, but may be cured using light such as ultraviolet rays.

  Further objects and features of the present invention will become apparent from the following detailed description and drawings. Each feature of the present invention can be used alone or in combination in various combinations as much as possible.

According to the present invention, first, electrical joining between electrical joints and filling a sealing material to a necessary range can be achieved and used in a short time in one operation. The sealing material is not limited in viscosity as in the case of pouring, and it can be cured in a short time together with the above work at a low temperature using a material with a high viscosity, so the parts can be mounted in a short time with simple work and equipment. Achieved with heat consumption. Moreover, electrical joining between electrical joints is accompanied by metal joining due to friction with ultrasonic vibration applied to the parts, which is reliable, does not cause defective products due to poor contact, improves yield, and can be joined in a short time. . Therefore, the product cost can be reduced.

Secondly, the sealing material may be provided in a lump to at least one of the joint surfaces of the component and the mounting target, and may be provided in a timely manner by application with a dispenser, printing, or transfer. Since it can be provided easily and in a short time during the handling operation of the component for mounting the component and the object to be mounted or in connection with this handling operation, the above-described characteristics are not particularly impaired. Third, in order to handle multiple types of parts with different joint sizes, etc., the seal may differ depending on the type of parts, for example, by providing sealing material in an appropriate amount and state. It is possible to automatically cope with differences in stopping conditions. The types of components to be mounted from time to time can be obtained from manually input component information, component information by a mounting program, supplied components and component information read from support members thereof. Fourthly, even if the supply amount of the sealing material under the set conditions is excessive or insufficient for some reason, it is possible to always obtain an appropriate sealing state corresponding to this.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a component mounting method and apparatus according to the present invention will be described below with reference to FIGS. 1 to 10 together with examples to help understanding of the present invention.

  In this embodiment, the semiconductor wafer 1 is diced into individual bare IC chips 3 on a dicing sheet 2 as shown in FIGS. 5 and 10 as a component, and a printed wiring board or the like is used as shown in FIG. The circuit board 4 is an object to be mounted, and metal bonding that is ultrasonically bonded by friction using ultrasonic vibration between the electric bonding portions 5 and 6 by relative movement of the two, that is, the bare IC chip 3 is circuited together with electric bonding. This is an example of mounting on the substrate 4. As an example, the electrical joint 5 of the bare IC chip 3 is made of a metal formed on the semiconductor wafer 1 by an electrode 7 formed by a thin film technique and formed by a wire bonding technique. The bumps 8 and the electrical joints 6 of the circuit board 4 are conductor lands 9 formed on the surface thereof. However, the present invention is not limited to this, and other electronic components and various components other than electronic components can be applied to various mounting objects including plates and other forms other than circuit boards. It can be applied to all cases in which electrical joints by various relative movements, including the case of ultrasonic vibration, are melted and joined by friction in a pressure contact state and mounted in various ways.

  As shown in FIG. 1, the component mounting method of the present embodiment is based on the approach of the bare IC chip 3 and the circuit board 4 when the bumps 8 of the bare IC chip 3 are pressed against the conductor lands 9 of the circuit board 4. 1 or both of which are preliminarily provided with, for example, silica and a resin binder, and the necessary range between them, for example, FIG. As shown in FIG. 10, ultrasonic vibration is applied to the bare IC chip 3 in addition to filling an area having an appropriate wetting and spreading portion 13 from the periphery between the opposing joint surfaces 3 a and 4 a to the outside. The bumps 8 of the bare IC chip 3 and the conductor lands 9 of the circuit board 4 are rubbed in the above-mentioned pressure contact state, so that the bumps 8 and the conductor lands 9 are ultrasonically joined together with melting, and the weld joint 1 The aim of electrical connection with a implementing a bare IC chip 3 to the circuit board 4.

  In order to apply ultrasonic waves while the bumps 8 of the bare IC chip 3 are pressed against the conductor lands 9 of the circuit board 4, for example, a suction nozzle 14 as a component handling tool for automatically handling the bare IC chip 3 for mounting. In the component mounting apparatus shown in FIG. 5, the pressure contact is performed with a magnetic pressure of about 500 g to 5 kg by a voice coil motor 15 that raises and lowers the suction nozzle 14, and the suction nozzle 14 is touched. A horn 17 that receives vibration from the piezoelectric element 16 is connected, and ultrasonic vibration having a vibration frequency of 60 KHz and an amplitude of about 1 to 2 μm is applied to the suction nozzle 14, and the bumps 8 and the conductor lands 9 that are in pressure contact are applied. Friction is generated and ultrasonic bonding is performed with both melting. However, depending on the type of the component, various component handling tools such as a chuck type, an adhesive, a screw or the like can be used, and ultrasonic vibration may be applied to the component handled via the component handling tool. As shown in FIG. 9, the suction nozzle 14 is connected to the support shaft 81 via an elastic tube 82 so as not to be broken when the ultrasonic vibration is applied, and from the support shaft 81 side through the elastic tube 82. The suction action also extends to the suction nozzle 14. However, the specific configuration for that purpose is not particularly questioned and can be designed in various ways.

  When joining with melting due to friction between the electrical joints 5 and 6 is performed by ultrasonic vibration applied to at least one of the component and the mounting target as described above, the required time is shortened to 1/10 second unit. In principle, the present invention is not limited to this. As described above, the electrical joints 5 and 6 may be rubbed and melted by the relative movement between the component and the mounting target to be joined.

  As described above, in the pressed contact state between the bumps 8 of the bare IC chip 3 and the conductor lands 9 of the circuit board 4, ultrasonic vibration is applied to the bare IC chip 3 to rub the bumps 8 and the conductor lands 9. At the same time that the electric joints 5 and 6 are ultrasonically joined together with melting and are electrically joined together, the joint surface 3a of the bare IC chip 3 and the circuit board 4 when the bumps 8 and the conductor lands 9 are pressure-welded. 4a, since the sealing material 11 provided in advance to at least one of them is pressed by approaching each other and forcedly filled in a necessary range between each other without special work and time, the bumps 8 and Electrical connection between the conductor lands 9 and filling of the sealing material 11 within a necessary range can be achieved in a short time in one operation, and only one device is required.

  Further, the sealing material 11 to be used is not limited in viscosity as in the case of pouring, and can be set in a wide range of viscosity, for example, 2000 to 10000 cps. It is cured in a short time with the work. Types of the sealing material 11 include epoxy, acrylic, polyimide, etc., and an adhesive in which an acid anhydride type or phenol type is mixed as a curing material as a binder of a filler material such as silica. Was used. However, it is not limited to these, and various things including those to be developed can be adopted.

  In short, the mounting of components such as the bare IC chip 3 to the mounting object such as the circuit board 4 can be achieved with a simple operation and apparatus with a small heat consumption in a short time. In addition, the electrical joining of the bumps 8 and the conductor lands 9 as the electrical joints 5 and 6 is reliable with metal joining, particularly welding joining, and there is no generation of defective products due to poor contact and yield is improved. . Therefore, the product cost can be reduced. In this connection, the time required for mounting the bare IC chip 3 having a size of 10 mm × 10 mm on the circuit board 4 by ultrasonic bonding with a sealing process was shortened to about 0.4 seconds.

Further, the sealing material 11 is formed in a lump on at least one of the joint surfaces 3a and 4a of the bare IC chip 3 and the circuit board 4 on the upward surface and the downward surface as indicated by a virtual line in FIG. 1 and by a broken line in FIG. Air should be less likely to get mixed in. As shown in FIGS. 3 and 10, the sealing material 11 may be supplied from below or from above using a dispenser, or by printing or transfer. Printing and transfer are suitable for providing a downward surface without dripping. However, as shown in FIG. 2, the bonding surface 3a of the bare IC chip 3 sucked and held by the suction nozzle 14 may be brought close to and attached to the encapsulating material 11 which is piled up.

  These operations can be performed easily and in a short time by using the time lag during the handling operation of the bare IC chip 3 and the circuit board 4 for mounting the components. In some cases, it may be performed in the previous work related to the handling work.

  In place of the bumps 8 on the electrodes 7 of the embodiment shown in FIGS. 1 and 2, bumps may be formed on the conductor lands 9 of the circuit board 4, components such as the bare IC chip 3, the circuit board 4, etc. When bumps are used for at least one of the electrical joints of the mounting object, ultrasonic bonding at the local electrical joint between the component such as the bare IC chip 3 and the mounting object such as the circuit board 4 is sufficient. This can be achieved reliably with a certain amount of metal parts and without interference or damage in other parts.

  As a component mounting apparatus that achieves the above method, as shown in FIG. 5, a component supply unit 21 that supplies components such as a bare IC chip 3 to a predetermined position A, and components are mounted with electrical joining. The mounting object such as the circuit board 4 to be supplied is supplied to the component mounting position B and used for mounting the component, and then the mounting object handling means 22 for transferring the mounting object to the other and the component supplied by the component supply unit 21 are sucked. A bonding surface 3a having an electric bonding portion 5 such as a bump 8 of a component such as a bare IC chip 3 is held and held by a component handling tool such as a nozzle 14 as a conductor land 9 of a mounting object such as a circuit board 4 or the like. Components such as a suction nozzle 14 and a component handling means 23 that are opposed to the joint surface 4a having the electrical joint 6 and are positioned and pressed so that the two electrical joints 5 and 6 face each other. take The ultrasonic vibration means 24 for applying ultrasonic vibration to the component held by the tool through the tool, and the metal electric of the mounting object such as the circuit board 4 handled by the mounting object handling means 22 at the component mounting position B Each of the bonding lands 9 and the like is made by pressing the bumps 8 and the like which are metallic electric joints of the parts such as the bare IC chip 3 handled by the part handling means 23 to the conductor lands 9 and the like which are the joints. The bumps 8 and the conductor lands 9 are pressed by pressing the sealing material 11 provided in advance on one of the surfaces 3a and 4a to fill the necessary range between the joint surfaces 3a and 4a and using the ultrasonic vibration means 24. It is sufficient to provide the control means 25 for ultrasonically joining the electrical joints such as the above, and the control means 25 according to the predetermined program data 26 shown in FIG. In work control can be achieved at high speed such a method automatically stably.

  Although it is preferable to use a microcomputer as the control means 25, the present invention is not limited to this, and various configurations and control formats can be adopted. The program data 26 may have any form and configuration, such as data stored in an internal or external memory of the control means 25, or data based on sequence control configured with a hardware circuit.

In the embodiment shown in FIG. 5, the mounting object handling means 22 is provided in the front part of the base 31, and the circuit board 4 is handled so that the joint surface 4a with the bare IC chip 3 faces upward, and it is simple from above. To be implemented. The mounting object handling means 22 is a conveying means for conveying the circuit board 4 along the rail 32 from the loader portion 33 at one end to the unloader portion 34 at the other end in the X direction. However, depending on the size, shape, form, etc. of the mounting object such as the circuit board 4 being small, it may be a means for carrying it. The part of the range of the component mounting position B set immediately on the downstream side of the loader unit 33 is an independent rail 32a as shown in FIGS. 5 and 6, and the rail 32 is received by the rail 32a and the rail 32a. A bonding stage 35 that sucks and holds the circuit board 4 from below is supported by a Y-direction table 36 that moves in the Y direction perpendicular to the X direction, and the transfer position B1 of the circuit board 4 aligned with the rails 32 is provided. 5 is moved back and forth between the mounting work position B2 shown in FIG.

  Thus, each time the circuit board 4 reaches the rail 32a at the component mounting position B from the loader unit 33, the circuit board 4 is received by the stopper 30a at a predetermined position on the bonding stage 35, and then the received circuit board 4 is received. The position is adjusted by pressing against one side of the rail 32a by the pressing element 30b. The circuit board 4 after the position adjustment is sucked and held by the bonding stage 35. At the same time, the bonding stage 35 is moved and positioned to the mounting work position B2, and used for mounting components on the circuit board 4 that is sucked and held. The bonding stage 35 is moved to the transfer position B1 aligned with the rail 32 every time the mounting of the component is finished at the mounting work position B2, and the suction of the circuit board 4 is released and the circuit board 4 after mounting the component is moved from the rail 32a to the rail 32. It is sent to the downstream side of the sheet and conveyed to the unloader section 34 to be carried out to the other. As described above, a large number of circuit boards 4 can be sequentially used for mounting components such as the bare IC chip 3 to continuously manufacture electronic circuit boards.

  On the other hand, the loader unit 33 and the bonding stage 35 are provided with a preheating unit 33a and a main heating unit 35a in which a heater is embedded, for example, to preheat the circuit board 4 used for component mounting while being in each position. And this heating is performed so that the sealing material 11 filled between the circuit board 4 and the bare IC chip 3 can be heated to about 25 ° C. Since the heating is relatively low temperature, the sealing material 11 can be substantially cured during the operation of ultrasonically bonding the bare IC chip 3 to the circuit board 4, and preheating can be omitted. However, if preheating is performed, it can be heated more easily. However, light such as ultraviolet rays can be used to cure the sealing material 11.

  A component supply unit 21 is provided on the downstream side of the component mounting position B of the rail 32 and behind the rail 32, and a component magazine 38 that stocks components obtained by dicing the semiconductor wafer 1 into individual bare IC chips 3 on the dicing sheet 2. By mounting the magazine lifter 41 that moves up and down and the bare IC chip 3 of a predetermined type stocked in the component magazine 38 to oppose a loading / unloading means (not shown) by setting the height of the component magazine 38 by the magazine lifter 41, An expanding table 37 is provided which holds the dicing sheet 2 pushed out or pulled out, expands the dicing sheet 2 and widens the interval between the bare IC chips 3 to facilitate picking up.

  The expand base 37 is moved in the X direction by the X direction table 42 and moved in the Y direction by the Y direction table 43, so that the supply of the bare IC chips 3 on the dicing sheet 2 is pushed up from below the dicing sheet 2. The components are sequentially positioned at the component supply position A where the rod 44 is located so that the supply can be made as much as necessary. When the supply of the bare IC chip 3 is completed or the type of the bare IC chip 3 to be supplied is changed, the dicing sheet 2 on the expand base 37 is replaced with a necessary one. As a result, various types of bare IC chips 3 can be automatically supplied and mounted as needed. But the component supply part 21 should just be set as the structure according to the kind and form of components to mount, and the component supply part 21 of various structures can be provided side by side.

As described above, the circuit board 4 is used for mounting components such as the bare IC chip 3 with the bonding surface 4a facing upward, and the component supply unit 21 supplies the bare IC chip 3 with the bonding surface 3a facing upward. Corresponding to being provided for mounting on the upward circuit board 4, in the present embodiment, the component handling means 23 is used to replace the components such as the bare IC chip 3 with the bonding surface 3a facing upward. After holding and picking up from above by a suction nozzle 45 or the like which is an example of a component handling tool, the suction nozzle 45 is turned, specifically, on the suction surface 45a of the component handling end of the suction nozzle 45, or A component reversing hand as shown in FIG. 7 that handles the components such as the bare IC chip 3 so as to turn around the position C away from the suction surface 45a and reverse the bonding surface 3a downward. 23a and the ultrasonic vibration means 24 are mounted, and components such as the bare IC chip 3 with the joint surface 3a being lowered by the component reversing means 23a are picked up from above and then picked up by the mounting object handling means 22. 8 and 9 is used to handle components so as to be used for ultrasonic bonding with a mounting object such as a circuit board 4 whose bonding surface 4a is facing upward at the mounting position B. Yes.

  As a result, the semiconductor wafer 1 is supplied in a packaged state in which the dicing sheet 2 is expanded by the expanding table 37 at a predetermined position, such as the bare IC chip 3 diced on the dicing sheet 2 and having the bonding surface 3a facing upward. In the case where it is repeatedly mounted by repeatedly using a large number even if it is supplied exclusively as in the embodiment shown in the figure or combined with parts in different packing forms, The bare IC chip 3 or the like is picked up from above by the reversing means 23a and reversed so that the joint surface 3a faces downward, and then picked up from above by the joining means 23b and handled by the mounting object handling means 22. At the component mounting position B, a mounting object such as a circuit board 4 with the joint surface 4a facing upward is pressed from above to be How bumps 8 and conductive land 9 is a electrical junction 5,6 and ultrasonically bonding the. In this way, the mounting of the circuit board 4 or the like in which the components supplied upward such as the bare IC chip 3 are handled upward by the handling of the components such as the bare IC chip 3 in which the reversing means 23a and the joining means 23b cooperate. It can be implemented repeatedly on the target repeatedly without any confusion.

  In the embodiment shown in the figure, the reversing means 23a is reversed so that the component supply position A for picking up the components such as the bare IC chip 3 to be fed and the bonding surface 3a of the picked-up bare IC chip 3 are directed downward. The base 57 that is reciprocated by the X-direction table 56 between the delivery position D to be used for the pickup for joining by the joining means 23b is provided with a motor 51 and a horizontal shaft 52 that is rotationally driven by this. Around the shaft 52, there is a component reversing head 54 equipped with one or a plurality of suction nozzles 45 as an example of a component handling tool in the radial direction. The suction nozzle 45 is axially moved by an air cylinder 55 on the component reversing head 54. To be moved forward and backward.

  As a result, the reversing means 23a moves up and down the suction nozzle 45 that is directed downward at the component supply position A, picks up and picks up the bare IC chip 3 supplied thereto, and then moves the suction nozzle 45 to the position C. , The joint surface 3a of the picked-up bare IC chip 3 is inverted from upward to downward, moved to the delivery position D, and used for pickup by the joining means 23b.

  The joining means 23b has the suction nozzle 14, and is reciprocated between the delivery position D and the mounting position B by the X-direction table 58, and the bare IC chip with the joining surface 3a facing downward at the delivery position D. 3 is picked up, picked up, moved to the mounting position B1 of the mounting position B, and repeatedly brought into pressure contact with a predetermined position of the circuit board 4 positioned there and performing ultrasonic bonding as described above. . Therefore, by the cooperation of the reversing unit 23a and the joining unit 23b, the bare IC chip 3 supplied with the joining surface 3a facing upward in the component supply unit 21 can be mounted on the circuit board 4 as necessary. However, even if the reversing means 23a side does not move in the X direction and is fixed at the component supply position A, the joining means 23b only needs to reciprocate between the component supply position A and the mounting position B. Moreover, the reverse may be sufficient.

  By combining the movement of the bonding means 23b in the X direction and the movement of the bonding stage 35 in the Y direction, components such as the bare IC chip 3 can be mounted at any position on the circuit board 4. However, the moving system for that purpose can be changed variously as required.

  However, the reversing means 23a and the joining means 23b are not limited to those reciprocally moved linearly, and can be combined with various movements including non-linear movements, such as the bare IC chip 3 Various parts may be handled with any movement trajectory.

  Furthermore, the apparatus according to the present embodiment includes at least joint surfaces 3a and 4a between a mounting target such as the circuit board 4 handled by the mounting target handling means 22 and a component such as the bare IC chip 3 handled by the component handling means 23. On the other hand, there is provided sealing material supply means 61 which is operated by the control means 25 and supplies the sealing material 11 until they are aligned. As a result, the mounting of the components such as the bare IC chip 3 is automatically performed by one device including the provision of the sealing material 11 to at least one of the components such as the bare IC chip 3 and the mounting target such as the circuit board 4. Can be achieved.

  In the embodiment shown in the figure, as shown in FIG. 5, the X-direction table 58 is equipped with the sealing material supply means 61 so as to be moved in the X direction together with the joining means 23b. 62 is lowered by the cylinder 63, and the sealing material 11 is provided to the side of the joint surface 4a of the circuit board 4 as shown by the phantom line in FIG. Simultaneously with retracting the donating means 61 to the side, the joining means 23b is moved to the component mounting position B and the parts such as the bare IC chip 3 held by the suction nozzle 14 are provided on the encapsulating material 11 Then, ultrasonic bonding is performed by pressing the circuit board 4 to the circuit board 4.

  Here, the control means 25 changes the supply condition of the sealing material 11 by the sealing material supply means 61 according to the type of component to be mounted. As a result, in order to handle a plurality of types of parts having different joining surface sizes and the like, the sealing material 11 may be provided depending on the type of parts, for example, by providing the sealing material 11 in an appropriate amount and state. It is possible to automatically cope with differences in stopping conditions. As shown in FIG. 10, the supply amount of the sealing material 11 is adjusted by adjusting the pressure of the air that opens the electromagnetic valve 64 and the like at the time of supply, blows into the dispenser 62, pressurizes the sealing material 11, and discharges a certain amount. Can be adjusted. The supply state can be achieved by providing a plurality of sealing material supply means 61 and using them differently. For example, there is a difference between a form that swells up in one lump and a form that is provided to the entire area of the joining surface 4a, or a difference in which the side to which the sealing material 11 of the joining surfaces 3a and 4a is provided is provided or both. Of course, it is possible to switch to multi-point donation, but it is necessary to devise so that air does not enter.

  The types of components that are sometimes mounted include component information 71 that is manually input, program data 26 for mounting components, component information by internal or external memory 70, types of components such as supplied bare IC chip 3, It can be obtained from component information read from a product type display such as a bar code 72 attached to a dicing sheet 2 which is a component support member or a tray (not shown). For these readings, the recognition camera 73 for recognizing the type of the bare IC chip 3 or the like provided at the component supply position A, or the component provided at the mounting position B2 of the component mounting position B and held by the suction nozzle 14 In order to recognize the image, such as the suction direction for the rotation correction and the state of the joint surface of the circuit board 4, a recognition camera 74 that is switched upward and downward may be used. An image processing circuit 75 that processes image data can also be shared. Therefore, a special device is not required for recognizing parts information as an image.

Further, when a component such as the bare IC chip 3 is mounted on a mounting object such as the circuit board 4, the full state of the sealing material 11 is imaged by the recognition camera 74 as shown in FIG. And detecting means 25a by an internal function of the control means 25 for detecting the excess or deficiency of the supply amount of the sealing material 11 from information obtained by image recognition of the presence or absence and the size of the wet spreading portion 13 and detected. In accordance with the excess or deficiency of the sealing material 11, the control means 25 corrects the supply amount of the sealing material 11 by the sealing material supply means 61. As a result, even if the supply amount of the sealing material 11 under a predetermined condition is excessive or insufficient for some reason, it is possible to always obtain an appropriate sealing state corresponding to this.

  A monitor 76 is connected to the image processing circuit 75 so that these image recognition states can be monitored.

  INDUSTRIAL APPLICABILITY The present invention can be practically used for mounting electronic components on a substrate and the like, and productivity and yield are improved.

It is sectional drawing of the principal part which shows embodiment of the mounting method and apparatus of this invention. It is explanatory drawing which shows an example of the supply state of the sealing material to the joint surface of components. It is explanatory drawing which shows another example of the supply state of the sealing material to the joint surface of components. It is explanatory drawing which shows another example of the supply state of the sealing material to the joint surface of components. It is a perspective view which shows the schematic structure of the whole apparatus of FIG. It is a perspective view of the bonding stage in the component mounting position of the apparatus of FIG. It is a perspective view which shows the inversion means in the component handling means of the apparatus of FIG. It is a perspective view which shows the joining means in the component handling means of the apparatus of FIG. It is sectional drawing of the joining means of FIG. It is a block diagram which shows the main control systems by the control means of the apparatus of FIG. It is sectional drawing which shows the temporary mounting state of the components in the conventional component mounting method. It is sectional drawing which shows the mounting state which performed the sealing process of the conventional temporarily mounted components.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 2 Dicing sheet 3 Bare IC chip 4 Circuit board 3a, 4a Joint surface 5, 6 Electrical junction 7 Electrode 8 Bump 9 Conductor land 10 Weld joint 11 Sealing material 13 Wet spreading part 14, 45 Adsorption nozzle 15 Voice Coil motor 21 Component supply unit 22 Mounting object handling unit 23 Component handling unit 23a Inversion unit 23b Joining unit 24 Ultrasonic vibration unit 25 Control unit 25a Detection unit 26 Program data 33 Loader unit 35 Bonding stage 33a Preheating unit 35a Main heating unit 37 Expanding table 61 Sealing material supply means 62 Dispenser 70 Memory 72 Bar code 73, 74 Recognition camera 75 Image processing circuit

Claims (1)

A component supply unit for supplying the component to a predetermined position, a mounting object handling means for supplying the mounting object on which the component is mounted to the component mounting position and providing the component for mounting, and then transferring the mounted object to another position;
The components supplied by the component supply unit are held and handled by the component handling tool, and the electrical connection between the components is carried out with the joint surface having the electrical joint of the component facing the joint surface having the electrical joint of the object to be mounted. Parts handling means for positioning and pressing so that the parts face each other and for mounting;
The ultrasonic vibration means is connected to the component handling tool of the component handling means, and the component handling tool holds the component that faces and press-contacts the mounting object, and applies ultrasonic vibration to the component, A joining means for joining the joints;
At the component mounting position, the metal electrical joints of the parts handled by the component handling means are opposed to the metal electrical joints of the mounting objects handled by the mounting object handling means, and the electrical joints are then connected to each other. In addition, the sealing material provided to a part of the joint surface is preliminarily applied to the whole or a part of one or both of the joint surfaces, and the part of the sealing material is pressed and applied to the whole region. A control means for ultrasonically joining electrical joints between the component and the mounting object by operating a sonic vibration means;
At least one joint surface between the mounting object handled by the mounting object handling means and the component handled by the component handling means is acted by the control means to provide a sealing material until they are aligned with each other. A sealing material supply means,
Furthermore, the control means can change the sealing material supply condition by the sealing material supply means according to the type of component to be mounted,
Furthermore, when the component is mounted on the mounting object, a detecting means for detecting the excess or deficiency of the amount of sealing material provided from information obtained by image recognition of the filling state of the sealing material is provided,
The component mounting apparatus according to claim 1, wherein the control unit corrects the supply amount of the sealing material by the sealing material supply unit according to the detected excess or shortage of the sealing material.

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