JP4224867B2 - Surface treatment agent for precious metal material or precious metal plating material, adhesive material with resin adhered through film made of the treatment agent, surface treatment method, and adhesion method with resin - Google Patents
Surface treatment agent for precious metal material or precious metal plating material, adhesive material with resin adhered through film made of the treatment agent, surface treatment method, and adhesion method with resin Download PDFInfo
- Publication number
- JP4224867B2 JP4224867B2 JP21901397A JP21901397A JP4224867B2 JP 4224867 B2 JP4224867 B2 JP 4224867B2 JP 21901397 A JP21901397 A JP 21901397A JP 21901397 A JP21901397 A JP 21901397A JP 4224867 B2 JP4224867 B2 JP 4224867B2
- Authority
- JP
- Japan
- Prior art keywords
- compounds
- noble metal
- surface treatment
- metal plating
- treatment agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims description 50
- 238000007747 plating Methods 0.000 title claims description 38
- 239000012756 surface treatment agent Substances 0.000 title claims description 23
- 229920005989 resin Polymers 0.000 title claims description 16
- 239000011347 resin Substances 0.000 title claims description 16
- 238000004381 surface treatment Methods 0.000 title claims description 15
- 238000000034 method Methods 0.000 title claims description 9
- 239000003795 chemical substances by application Substances 0.000 title claims description 4
- 239000010970 precious metal Substances 0.000 title description 9
- 239000000853 adhesive Substances 0.000 title description 5
- 230000001070 adhesive effect Effects 0.000 title description 5
- 229910000510 noble metal Inorganic materials 0.000 claims description 68
- 239000007769 metal material Substances 0.000 claims description 29
- 150000001875 compounds Chemical class 0.000 claims description 18
- -1 alkylsilane compounds Chemical class 0.000 claims description 16
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 15
- 239000006179 pH buffering agent Substances 0.000 claims description 10
- 238000005507 spraying Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000003960 organic solvent Substances 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- 239000004094 surface-active agent Substances 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 6
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 5
- 150000004756 silanes Chemical class 0.000 claims 4
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical class S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 claims 4
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 claims 4
- 239000006174 pH buffer Substances 0.000 claims 2
- 230000000694 effects Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 1H-imidazole silane Chemical compound [SiH4].N1C=NC=C1 ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- JFSOGGYRDJSWEO-UHFFFAOYSA-N [SiH4].N1=CNC2=C1C=CC=C2 Chemical compound [SiH4].N1=CNC2=C1C=CC=C2 JFSOGGYRDJSWEO-UHFFFAOYSA-N 0.000 description 1
- XCMSVSBUVANQIE-UHFFFAOYSA-N [SiH4].N1N=NC2=C1C=CC=C2 Chemical compound [SiH4].N1N=NC2=C1C=CC=C2 XCMSVSBUVANQIE-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Chemical Treatment Of Metals (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、貴金属素材または貴金属めっき材用の表面処理剤および表面処理方法に関するものである。
【０００２】
【従来の技術】
近年、貴金属素材または貴金属めっきを施した素材と樹脂とを接着する機会が増えてきた。例えば、メガネ等の装飾品におけるプラスチックとの接着、プリント配線板におけるレジストとの接着、コネクタにおけるソケットとの接着、リードフレームにおけるモールディング樹脂との接着等がある。
しかし、貴金属素材または貴金属めっき材と樹脂との接着の場合、接着力が低いことが問題であった。そのため、貴金属めっき材と樹脂の接着力を向上させるために、研磨やエッチングなどの機械的方法により素材の表面を粗化したり、貴金属めっき条件を変化させめっき表面を粗化させる等の方法によって樹脂とのアンカー効果を増加させる方法が行われていた。
このような従来の方法では、貴金属素材または貴金属めっきの外観が変化するばかりでなく、電気特性や機械特性を損なう可能性が大きかった。また、複雑な形状のめっき材では均一に表面を粗化することが難しく、樹脂との均一な接着を得られないという問題もあった。
【０００３】
【発明が解決しようとする課題】
本発明では、貴金属素材または貴金属めっき材と樹脂とを均一に接着し、しかも電気特性や機械特性を損なうことなく接着力を向上させる手段を提供することを目的とした。
【０００４】
【課題を解決するための手段】
本発明者らは、上記の課題を解決するために鋭意研究を行った結果、シランカップリング剤を主成分として含有する表面処理剤により貴金属素材または貴金属めっき材の表面処理を行うことにより、貴金属素材または貴金属めっき材と樹脂との接着力を向上させることが可能であることを見いだした。
【０００５】
本発明は、この知見に基づき、
１．シランカップリング剤を主成分とし、さらに溶媒として水または有機溶剤を含有することを特徴とする貴金属素材または貴金属めっき材用表面処理剤
【０００６】
２．シランカップリング剤が、アミノシラン化合物、エポキシシラン化合物、ビニルシラン化合物、メルカプトシラン化合物、アルキルシラン化合物、ハロゲノシラン化合物、ポリマー型シラン化合物、またはアゾールシラン化合物またはこれらの誘導体から選択された１種以上であることを特徴とする、上記１に記載の貴金属素材または貴金属めっき材用表面処理剤
【０００７】
３．さらに、ｐＨ緩衝剤または界面活性剤あるいはその双方を含むことを特徴とする上記１〜２のいずれかに記載の貴金属素材または貴金属めっき材用表面処理剤
【０００８】
４．シランカップリング剤を主成分とし、さらに溶媒として水または有機溶剤を含有することを特徴とする貴金属素材または貴金属めっき材用表面処理剤に貴金属素材または貴金属めっき材を浸漬するかあるいは該表面処理剤を貴金属素材または貴金属めっき材に散布またはスプレーすることを特徴とする貴金属素材または貴金属めっき材の表面処理方法
を提供するものである。
【０００９】
【発明の実施の形態】
本発明において対象とする貴金属素材または貴金属めっき材とは、金、銀、パラジウム、ロジウム、オスミウム、イリジウム、白金などの貴金属あるいはこれらの貴金属の合金からなる素材または銅などの素材表面に貴金属あるいは貴金属合金をめっきした素材を意味する。すなわち、貴金属あるいは貴金属合金の表面が存在する全ての材料を包含するものである。
【００１０】
本発明に係る表面処理剤は、その主成分としてシランカップリング剤を含有するものである。ここでシランカップリング剤としては、アミノシラン化合物、エポキシシラン化合物、ビニルシラン化合物、メルカプトシラン化合物、アルキルシラン化合物、ハロゲノシラン化合物、ポリマー型シラン化合物、またはアゾールシラン化合物またはこれらの誘導体から選択された１種以上を含むものであれば良い。例えば、アミノシラン、エポキシシラン、イミダゾールシラン、ベンズイミダゾールシラン、ベンゾトリアゾールシラン等を挙げることができる。
【００１１】
本発明に係る表面処理剤ではこれらのシランカップリング剤から１種以上が選択され、好ましくは０．１ｍｇ／ｌ〜１００ｇ／ｌ（より好ましくは、１０ｍｇ／ｌ〜１０ｇ／ｌ）の割合で含有させるようにする。これは、シランカップリング剤の含有割合が０．１ｍｇ／ｌよりも少ないと接着力向上効果が十分ではなく、また、１００ｇ／ｌを越える割合で含有させてもそれ以上の効果を期待することができないためである。
【００１２】
主成分であるシランカップリング剤の溶媒としては、通常は水が用いられるが、主成分が水に溶けにくい場合には、必要に応じてアルコール、ケトン等の有機溶剤を添加する。
【００１３】
また、本発明に係る表面処理剤には、必要に応じてｐＨ緩衝剤または界面活性剤あるいはその双方をも含むことが可能である。
ｐＨ緩衝剤としては、ホウ酸系、リン酸系、有機酸系のｐＨ緩衝剤を使用することが可能であり、これらを添加する場合にはそれらの含有割合が１〜１００ｇ／ｌ、好ましくは１０〜５０ｇ／ｌとなるように添加する。
【００１４】
界面活性剤としては、アニオン系、カチオン系、ノニオン系のいずれかまたはそれらの混合物を用いることが可能であり、これらを添加する場合にはそれらの含有割合が１μｇ／ｌ〜１０ｇ／ｌ、好ましくは１０μｇ／ｌ〜１ｇ／ｌとなるように添加する。
【００１５】
本発明に係る表面処理剤のｐＨは、上記の成分が溶解するｐＨであれば良く、特には限定されない。
また、表面処理剤の温度は、好ましくは５〜８０℃、より好ましくは１０〜５０℃とする。
【００１６】
本発明に係る上記表面処理剤を使用する貴金属素材または貴金属めっき材の表面処理は、基材となる貴金属素材または貴金属めっき材を上記の表面処理剤に浸漬するか、あるいは該表面処理剤を貴金属素材または貴金属めっき材に散布またはスプレーすることによって行うことができる。
この際の処理時間は、０．１秒〜１０分で良く、好ましくは１〜６０秒である。
【００１７】
本発明に係るシランカップリング剤を主成分とする表面処理剤に貴金属素材または貴金属めっき材を浸漬、散布またはスプレーすることによって、貴金属素材または貴金属めっき材の表面にシランカップリング被膜が数〜数百 程度、均一に吸着することになり、そのカップリング効果で、貴金属と樹脂とを強固に接着することが可能である。樹脂の種類は、エポキシ系、ポリイミド系、フェノール系、シリコーン系等の熱硬化性樹脂のみならず、ポリ塩化ビニル、ポリエチレン、ポリプロピレン、ポリスチレン等の熱可塑性樹脂に対しても適用することが可能である。本発明の表面処理方法は、溶液への浸漬あるいは溶液の散布またはスプレーによるものであり工程が非常に簡単で、また、複雑な形状の素材でも均一に吸着させることができるため、樹脂との均一な接着力を得ることができる。
【００１８】
【実施例】
以下、実施例に基づいて本発明を説明する。
試験素材として、下記の貴金属めっき材を用意した。
【００１９】
【表１】
各基材について、“エポキシ樹脂とのシェア強度”を測定した。エポキシ樹脂の硬化条件は、１７５℃、５時間で行った。
また、基材表面の外観を目視により判定した。これらの結果を前記表１に併せて示す。
【００２１】
比較例として、基材の表面処理剤への浸漬または散布を行なわなかったもの、および表面処理の代わりに粗化処理を行ったものについて、実施例と同様にエポキシ樹脂との接着を行い、“エポキシ樹脂とのシェア強度”の測定および基材の外観の目視判定を行った。
ここで、粗化処理は下記の条件で行った。
ペーパー研磨） ＳｉＣ研磨紙＃６００を使用
ブラスト研磨） アルミナ粒子＃１００を使用、ブラスト圧力：３kg/cm2
これらの比較例の結果を表２に示す。
【００２２】
【表２】
表１、表２に示される結果から、本発明に係る表面処理を行った場合には、表面処理を行わなかった場合に比べエポキシ樹脂とのシェア強度が大きく優れた接着力を示した。また、本発明に係る表面処理の代わりに粗化処理を行った場合には、素材の外観は光沢がなく表面が不均一であったが、本発明の表面処理を行った場合には素材の外観は極めて良好であった。
【００２４】
【発明の効果】
以上説明したように、本発明によれば、貴金属素材または貴金属めっき材と樹脂とを均一に接着し、しかも電気特性や機械特性を損なうことなく接着力を向上させることが可能である。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface treatment agent and a surface treatment method for a noble metal material or a noble metal plating material.
[0002]
[Prior art]
In recent years, there have been increased opportunities to bond a precious metal material or a precious metal plated material and a resin. For example, there are adhesion to plastics such as glasses, adhesion to a resist on a printed wiring board, adhesion to a socket in a connector, adhesion to a molding resin in a lead frame, and the like.
However, in the case of adhesion between a noble metal material or a noble metal plating material and a resin, there is a problem that the adhesive strength is low. Therefore, in order to improve the adhesion between the precious metal plating material and the resin, the resin surface is roughened by a mechanical method such as polishing or etching, or the plating surface is roughened by changing the precious metal plating conditions. There has been a method of increasing the anchor effect.
In such a conventional method, not only the appearance of the noble metal material or the noble metal plating is changed, but also there is a great possibility that the electrical characteristics and the mechanical characteristics are impaired. In addition, it is difficult to uniformly roughen the surface of the plating material having a complicated shape, and there is a problem that uniform adhesion with the resin cannot be obtained.
[0003]
[Problems to be solved by the invention]
An object of the present invention is to provide means for uniformly bonding a noble metal material or a noble metal plating material and a resin, and improving the adhesion without impairing electrical characteristics and mechanical characteristics.
[0004]
[Means for Solving the Problems]
As a result of intensive studies to solve the above-mentioned problems, the present inventors have performed a surface treatment of a noble metal material or a noble metal plating material with a surface treatment agent containing a silane coupling agent as a main component, thereby precious metal. It has been found that it is possible to improve the adhesion between the material or the precious metal plating material and the resin.
[0005]
The present invention is based on this finding,
1. A surface treatment agent for a noble metal material or a noble metal plating material, characterized by comprising a silane coupling agent as a main component and further containing water or an organic solvent as a solvent.
2. The silane coupling agent is at least one selected from an aminosilane compound, an epoxysilane compound, a vinylsilane compound, a mercaptosilane compound, an alkylsilane compound, a halogenosilane compound, a polymer type silane compound, an azolesilane compound, or a derivative thereof. The surface treatment agent for a noble metal material or a noble metal plating material as described in 1 above, wherein
3. The surface treatment agent for a noble metal material or noble metal plating material according to any one of the above 1 to 2, further comprising a pH buffering agent and / or a surfactant.
4). A noble metal material or noble metal plating material is immersed in a noble metal material or a surface treatment agent for noble metal plating material, characterized by containing a silane coupling agent as a main component and further containing water or an organic solvent as a solvent, or the surface treatment agent A surface treatment method of a noble metal material or a noble metal plating material, characterized in that is sprayed or sprayed on a noble metal material or a noble metal plating material.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
The noble metal material or noble metal plating material targeted in the present invention is a noble metal or noble metal on the surface of a noble metal such as gold, silver, palladium, rhodium, osmium, iridium, platinum or a material made of an alloy of these noble metals or copper. It means a material plated with an alloy. That is, it includes all materials having a surface of a noble metal or a noble metal alloy.
[0010]
The surface treating agent according to the present invention contains a silane coupling agent as its main component. Here, the silane coupling agent is one selected from an aminosilane compound, an epoxysilane compound, a vinylsilane compound, a mercaptosilane compound, an alkylsilane compound, a halogenosilane compound, a polymer type silane compound, an azolesilane compound, or a derivative thereof. Anything including the above may be used. For example, aminosilane, epoxy silane, imidazole silane, benzimidazole silane, benzotriazole silane, and the like can be given.
[0011]
In the surface treatment agent according to the present invention, one or more of these silane coupling agents are selected, and preferably contained at a ratio of 0.1 mg / l to 100 g / l (more preferably 10 mg / l to 10 g / l). I will let you. This means that if the content of the silane coupling agent is less than 0.1 mg / l, the effect of improving the adhesive strength is not sufficient, and even if it is contained in a proportion exceeding 100 g / l, a further effect is expected. This is because they cannot.
[0012]
As a solvent for the silane coupling agent as the main component, water is usually used. However, when the main component is difficult to dissolve in water, an organic solvent such as alcohol or ketone is added as necessary.
[0013]
Further, the surface treatment agent according to the present invention can contain a pH buffering agent and / or a surfactant as necessary.
As the pH buffering agent, it is possible to use boric acid-based, phosphoric acid-based and organic acid-based pH buffering agents, and when these are added, the content ratio thereof is 1 to 100 g / l, preferably Add to 10-50 g / l.
[0014]
As the surfactant, any of anionic, cationic, nonionic or a mixture thereof can be used. When these are added, their content is preferably 1 μg / l to 10 g / l, preferably Is added at 10 μg / l to 1 g / l.
[0015]
The pH of the surface treatment agent according to the present invention is not particularly limited as long as the above components are dissolved.
The temperature of the surface treatment agent is preferably 5 to 80 ° C, more preferably 10 to 50 ° C.
[0016]
The surface treatment of the noble metal material or the noble metal plating material using the surface treatment agent according to the present invention is performed by immersing the noble metal material or the noble metal plating material as a base material in the surface treatment agent or by using the surface treatment agent as a noble metal. This can be done by spraying or spraying on the material or precious metal plating material.
The processing time at this time may be 0.1 second to 10 minutes, preferably 1 to 60 seconds.
[0017]
By immersing, spraying or spraying a noble metal material or a noble metal plating material on the surface treatment agent containing the silane coupling agent as the main component according to the present invention, several to several silane coupling films are formed on the surface of the noble metal material or the noble metal plating material. It will adsorb uniformly about a hundred, and its coupling effect makes it possible to firmly bond the noble metal and the resin. Resin types can be applied not only to thermosetting resins such as epoxy, polyimide, phenol, and silicone, but also to thermoplastic resins such as polyvinyl chloride, polyethylene, polypropylene, and polystyrene. is there. The surface treatment method of the present invention is based on immersion in a solution or spraying or spraying of a solution. The process is very simple, and even a complex-shaped material can be adsorbed uniformly. Can provide a good adhesive strength.
[0018]
【Example】
Hereinafter, the present invention will be described based on examples.
The following noble metal plating materials were prepared as test materials.
[0019]
[Table 1]
For each substrate, the “shear strength with epoxy resin” was measured. The epoxy resin was cured at 175 ° C. for 5 hours.
Moreover, the external appearance of the base-material surface was determined visually. These results are also shown in Table 1 above.
[0021]
As a comparative example, the substrate was not immersed or dispersed in the surface treatment agent, and the surface treatment was roughened instead of the surface treatment. Measurement of “shear strength with epoxy resin” and visual judgment of the appearance of the substrate were performed.
Here, the roughening treatment was performed under the following conditions.
Paper polishing) Blasting using SiC polishing paper # 600 Alumina particles # 100 are used, blasting pressure: 3 kg / cm 2
Table 2 shows the results of these comparative examples.
[0022]
[Table 2]
From the results shown in Tables 1 and 2, when the surface treatment according to the present invention was performed, the shear strength with the epoxy resin was large and excellent as compared with the case where the surface treatment was not performed. In addition, when the roughening treatment was performed instead of the surface treatment according to the present invention, the appearance of the material was not glossy and the surface was uneven, but when the surface treatment of the present invention was performed, The appearance was very good.
[0024]
【The invention's effect】
As described above, according to the present invention, the noble metal material or the noble metal plating material and the resin can be uniformly bonded, and the adhesive force can be improved without impairing the electrical characteristics and mechanical characteristics.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21901397A JP4224867B2 (en) | 1997-07-31 | 1997-07-31 | Surface treatment agent for precious metal material or precious metal plating material, adhesive material with resin adhered through film made of the treatment agent, surface treatment method, and adhesion method with resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21901397A JP4224867B2 (en) | 1997-07-31 | 1997-07-31 | Surface treatment agent for precious metal material or precious metal plating material, adhesive material with resin adhered through film made of the treatment agent, surface treatment method, and adhesion method with resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1150262A JPH1150262A (en) | 1999-02-23 |
| JP4224867B2 true JP4224867B2 (en) | 2009-02-18 |
Family
ID=16728897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21901397A Expired - Fee Related JP4224867B2 (en) | 1997-07-31 | 1997-07-31 | Surface treatment agent for precious metal material or precious metal plating material, adhesive material with resin adhered through film made of the treatment agent, surface treatment method, and adhesion method with resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4224867B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60021972T2 (en) | 1999-09-21 | 2006-06-22 | Konica Corp. | Apparatus and method for X-ray imaging |
| JP4865525B2 (en) * | 2006-08-03 | 2012-02-01 | イッツウェル カンパニー リミテッド | SML type light emitting diode lamp element and manufacturing method thereof |
| JP6350351B2 (en) * | 2015-03-20 | 2018-07-04 | トヨタ自動車株式会社 | Metal substrate surface treatment method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2841972B2 (en) * | 1991-10-25 | 1998-12-24 | 三菱マテリアル株式会社 | Silver alloy conductor foil with protective film and method for producing the same |
| JPH0873775A (en) * | 1994-09-02 | 1996-03-19 | Nippon Parkerizing Co Ltd | Metal surface treatment agent for film formation with excellent fingerprint resistance, corrosion resistance, and coating adhesion and treatment method |
-
1997
- 1997-07-31 JP JP21901397A patent/JP4224867B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1150262A (en) | 1999-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3333551B2 (en) | Improved method for providing a metal coating on diamond and articles obtained thereby | |
| EP0764704B1 (en) | Use of preceramic polymers as electronic adhesives | |
| KR102270526B1 (en) | Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite | |
| KR102440121B1 (en) | Method for manufacturing a printed wiring board | |
| CN1383705A (en) | Carrier-field copper foil circuit, printed circuit board mfg. method using circuit, and printed circuit board | |
| KR20070088611A (en) | Copper Clad Laminates for Electroless Plating Pretreatment and Flexible Substrates | |
| KR102141196B1 (en) | Substrate for electroless plating, method of manufacturing the same, and metal plating method using the same | |
| JP3277463B2 (en) | Metal plating pretreatment agent and metal plating method using the same | |
| JP4224867B2 (en) | Surface treatment agent for precious metal material or precious metal plating material, adhesive material with resin adhered through film made of the treatment agent, surface treatment method, and adhesion method with resin | |
| WO2007070142A1 (en) | Method of using ultrasonics to plate silver | |
| US5183692A (en) | Polyimide coating having electroless metal plate | |
| JP3371072B2 (en) | Copper or copper alloy discoloration prevention liquid and discoloration prevention method | |
| EP0310010B1 (en) | Multilayer printed circuit board formation | |
| KR20170117073A (en) | Pretreatment agent for electroless plating, and pretreatment method and manufacturing method for printed wiring board in which pretreatment agent for electroless plating is used | |
| JP2002069661A (en) | Surface treatment method for copper | |
| WO2013028309A1 (en) | Tarnish inhibiting composition for metal leadframes | |
| JP4082625B2 (en) | Epoxy bleed-out prevention agent | |
| JP2001244383A (en) | Semiconductor device | |
| JPH01500913A (en) | Method for metallization of non-conductive substrates | |
| JPH075868B2 (en) | Adhesive composition | |
| JPH04180572A (en) | Method for electroless plating | |
| JPH01246894A (en) | Electroless plating method | |
| TW595288B (en) | Manufacturing method of circuit board | |
| JP2798565B2 (en) | Conductive resin paste for semiconductors | |
| JPH10256279A (en) | Support substrate and manufacture therefor, electronic part device, and support-substrate surface treatment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040408 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060411 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060519 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060912 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061106 |
|
| A911 | Transfer of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20061211 |
|
| A912 | Removal of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20070126 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20081117 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111205 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111205 Year of fee payment: 3 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111205 Year of fee payment: 3 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111205 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121205 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121205 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131205 Year of fee payment: 5 |
|
| LAPS | Cancellation because of no payment of annual fees |