JP4217095B2 - Substrate cleaning processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate cleaning processing apparatus, and more particularly to a substrate cleaning processing apparatus that rotates a plate-like substrate such as a semiconductor wafer or a glass substrate and performs a cleaning process using pure water or a chemical solution.
[0002]
[Prior art]
[Patent Document 1]
Japanese Patent Laid-Open No. 2002-373877
Conventionally, a substrate cleaning processing apparatus is a manufacturing process for manufacturing a plate-like substrate such as a conductor wafer or a glass substrate, and is used as an apparatus for cleaning the surface of the substrate with pure water or a chemical solution while the substrate is rotated. 2. Description of the Related Art Substrate cleaning processing apparatuses that perform cleaning processing by spraying are known. This conventional substrate cleaning apparatus not only removes particles adhering to the surface of the substrate, but also effectively reattaches foreign matter or attaches a watermark after processing due to the mist of cleaning liquid that rotates and cleans. It is an important purpose to prevent it. FIG. 5 is a block diagram showing an embodiment of a conventional substrate cleaning apparatus for preventing such an adverse effect caused by mist. FIG. 6 is a configuration diagram showing another embodiment of a conventional substrate cleaning apparatus. FIG. 7 is a cross-sectional view showing a cross section taken along the line C-C shown in FIG.
[0004]
As shown in FIG. 5, one embodiment of a conventional substrate cleaning apparatus is configured to place a substrate 1 horizontally and rotatably support the substrate 1. On the rotating substrate 1, pure water or a chemical solution is used. A nozzle (not shown) for performing a cleaning process by injecting a cleaning liquid, and an exhaust cup 30 provided with an exhaust port 31 for closing the rotating table 34 and the nozzle so as to cover from the outside and discharging a mist of the cleaning liquid on the side surface. And. Such a conventional substrate cleaning apparatus removes particles adhering to the surface by spraying the cleaning liquid from the nozzle onto the surface of the substrate 1 while the substrate 1 is placed on the turntable 34 and rotated. At this time, in the exhaust cup 30, in order to prevent the cleaning liquid sprayed from the nozzle to the substrate 1 from becoming mist and floating inside, the exhaust port 31 is provided on the side surface so that the mist can be discharged locally (for example, Patent Document 1).
[0005]
On the other hand, unlike the substrate cleaning processing apparatus in which such an exhaust port 31 is provided on the side surface of the exhaust cup 30, another embodiment of the conventional substrate cleaning processing apparatus in which a plurality of exhaust ports are provided on the bottom surface in the exhaust cup is known. It has been. As shown in FIG. 6, another embodiment of the conventional substrate cleaning processing apparatus in which the exhaust port is provided on the bottom surface in the exhaust cup has a turntable 44 that rotatably supports the substrate 1 and this rotation. A nozzle (not shown) for injecting a cleaning liquid onto the substrate 1 and an exhaust cup 40 that is closed so as to cover the rotating table 44 and the nozzle are provided. Unlike the substrate cleaning processing apparatus shown in FIG. 5, this substrate cleaning processing apparatus is provided with a plurality of exhaust ports 42 on the closed bottom surface in the exhaust cup 40. As shown in FIG. 7, for example, when four exhaust ports 42 are provided on the bottom surface in the exhaust cup 40, the exhaust ports 42 are arranged in the vicinity of the outer periphery of the substrate 1 in the cavity of the exhaust cup 40 and are equally divided on the circumference. It is arranged at each position. Therefore, since the mist of the cleaning liquid is uniformly exhausted from the surface of the substrate 1 to the outer exhaust port 42 in the exhaust cup 40, it is possible to effectively prevent the mist from floating inside. In the exhaust cup 40 shown in FIGS. 5 and 6, the cleaning liquid sprayed on the surface of the substrate 1 is scattered on the closed inner wall surface and rebounds to prevent reattachment to the substrate 1. A shade-shaped liquid receiving inclined surface D inclined at a predetermined angle is provided on the inner wall surrounding the outer periphery of the substrate 1.
[0006]
As described above, in the conventional substrate cleaning apparatus, as shown in FIGS. 5 and 6, the exhaust cup 30 is provided by providing at least one exhaust port 31, 42 on the side surface or the bottom surface of the exhaust cup 30, 40. , The mist of the floating cleaning liquid generated in 40 is effectively exhausted to effectively prevent adverse effects such as the reattachment of foreign matters and the adhesion of watermarks.
[0007]
[Problems to be solved by the invention]
However, in the conventional substrate cleaning apparatus, as shown in FIG. 5, in the case where only one exhaust port 31 is provided on the side surface of the exhaust cup 30, the exhaust port 31 having only one exhaust port has recently become a device. With the progress of miniaturization and the higher cleanliness of the substrate, the adhesion of minute foreign matters contained in the mist, which has been ignored until now, has become a problem, and it is not possible to cope with it sufficiently. In particular, in the substrate cleaning apparatus having such a structure, the mist floating by the airflow E directed to the exhaust port 31 at one side shown in FIG. 5 in parallel with the front and back surfaces of the substrate 1 is discharged. As a result of the rotation of the substrate 1 with respect to the airflow E, an airflow F that is engulfed toward the front surface and the back surface is also generated. As a result, mist stays in the exhaust cup 30 and fine foreign matter adheres to the surface of the substrate 1. There was a problem that.
[0008]
Further, in the conventional substrate cleaning apparatus, in the case of a structure in which a plurality of exhaust ports 42 are provided in the lower part of the exhaust cup 40 shown in FIG. 6, as shown in FIG. Since the exhaust port 42 is disposed, an air flow G directly directed from the surface of the substrate 1 to the exhaust port 42 on the outer peripheral side is generated, and mist is discharged uniformly in the exhaust cup 40. In the weak portion, an air flow H toward the center of the substrate 1 is generated, mist stays, and foreign matter reattaches to the surface of the substrate 1. In this case, there is a problem in that the contamination is diffused by the foreign matter reattached to the surface during transport of the substrate 1 or transfer to the next process.
The present invention solves such a problem, and can prevent the re-adhesion of foreign matters due to the stay of mist on the outer surface of the substrate in the exhaust cup, movement in the central direction, and entrainment on the outer surface of the substrate. An object is to provide an apparatus.
[0009]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention provides a substrate cleaning processing apparatus that horizontally supports a plate-like substrate such as a semiconductor wafer or a glass substrate and rotatably supports the substrate with a pure water or a chemical solution. In addition, an exhaust cavity is provided inside the outer periphery of the substrate that is larger than the outer periphery and surrounded by a donut shape, and an inclined drainage bottom surface that extends from the lower end of the inner wall that surrounds the lower side of the substrate to the center. An exhaust cup and a cap-shaped liquid receiving slope that covers the top of the exhaust cup and has an outer peripheral lower end located below the back surface of the substrate and is inclined to cover the outside of the substrate from the lower end to the top. The substrate is equipped with a supply unit that supplies clean air to the upper center of the inclined surface by allowing the inclined surface to receive liquid droplets scattered horizontally from the substrate by centrifugal force and draining it to the bottom of the exhaust cup. Washable occlusion blocked from the outside A lid member provided between a predetermined size hole in which an opening over the inner wall the entire circumference of the exhaust cup surrounding the bottom of the substrate can be discharged uniformly retention mist toward the circumferential outward from the center of the substrate, or A plurality of opening holes such as slits of a predetermined width are provided 30 mm to 50 mm below the back surface of the substrate, and the closed space that closes the adjacent substrate through the opening hole communicates with the exhaust cavity in the exhaust cup, The stationary mist in the enclosed space cleaned by storing the substrate is guided from the opening hole into a cavity with a low internal pressure for exhaust, and can be exhausted with at least one exhaust port connected from the outside in this cavity. Provided.
[0010]
Here, the inner wall of the exhaust cup is preferably provided with a radius 40 to 80 mm larger than the rotation radius of the substrate. Moreover, it is preferable that the outer periphery lower end which covers the upper surface of an exhaust cup is located 10-15 mm lower side from the back surface of a board | substrate. Moreover, it is preferable that the angle of the inclined surface which covers the outer side of a board | substrate to the upper part from the outer periphery lower end which covers the exhaust cup is inclined 30-40 degrees. In addition, the opening hole provided in the inner wall of the exhaust cup opens in a slit shape in the inner wall and is provided parallel, perpendicular or at an appropriate angle with respect to the substrate, and is set 30 mm to 50 mm below the back surface of the substrate. it is preferred that the. Also, the opening hole formed in the inner wall of the exhaust cup is opened by holes or slits in the inner wall, its total area is preferably provided substantially equal to the area of the exhaust port formed in the cavity of the exhaust cup. Also, the exhaust port is provided at least one or more places on the bottom or side of the exhaust cavity of the exhaust cup, it is preferred that each disposed circumferentially equally divided positions in the case of providing a plurality in the cavity . In another embodiment of the exhaust port, when only one location is provided on the bottom or side of the exhaust cup, a plurality of exhaust ducts are extended from this location into the exhaust cavity and the tip is equally divided on the circumference. It is preferable to arrange each at the positions.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Next, an embodiment of a substrate cleaning apparatus according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a partially cutaway configuration diagram showing a first embodiment of a substrate cleaning apparatus according to the present invention. FIG. 2 is a view showing a state in which the substrate cleaning apparatus shown in FIG. 1 is assembled. FIG. 3 is a block diagram showing a second embodiment of the substrate cleaning apparatus according to the present invention. FIG. 4 is a diagram showing an arrangement state of the exhaust duct 13 when the substrate cleaning apparatus shown in FIG. 3 is viewed from above.
[0012]
As shown in FIG. 1, the substrate cleaning apparatus according to the first embodiment of the present invention is provided with a plurality of exhaust ports 12 on the bottom surface of the exhaust cup 10 as in the prior art shown in FIG. A turntable 14 that horizontally supports the substrate 1 placed in the substrate 10 and a nozzle (not shown) that performs a cleaning process by injecting a cleaning liquid such as pure water or a chemical onto the rotating substrate 1. And. Further, unlike the prior art shown in FIG. 6, the first embodiment is provided with an exhaust cavity A inside the outer periphery of the substrate 1 that is larger and lower than the outer periphery of the substrate 1, and the lower side of the substrate 1. An exhaust cup 10 having an inclined bottom surface 16 for drainage extending from the lower end of the inner wall 18 to the center, and the substrate 1 is stored on the top of the bottom surface 16 so as to cover the top of the exhaust cup 10 from the outside. And a lid 20 that provides a closed and washable closed space B. The exhaust cup 10 is provided with a plurality of opening holes 18a with slits of a predetermined width over the entire inner wall 18 surrounding the lower side of the substrate 1, and a closed space B for closing the adjacent substrate 1 through the opening holes 18a. The exhaust cavity A is communicated. Therefore, in the first embodiment, as shown in FIG. 2, a plurality of staying mists in the closed space B in which the substrate 1 is housed and cleaned are opened around the inside of the exhaust cup 10 and the lid 20 assembled. The opening 18a is guided into the cavity A where the internal pressure for exhaust is low, and is exhausted from the exhaust port 12.
[0013]
Here, the exhaust cup 10 is provided so as to surround the lower side of the substrate 1, and the radius of the inner wall 18 surrounding the lower side is preferably 40 to 80 mm larger than the rotation radius of the substrate 1, that is, the substrate 1. A large opening diameter of the inner wall 18 is provided so that the width C shown in FIG. The inner wall 18 is provided with a plurality of opening holes 18a that are elongated in the vertical direction along the entire circumference and opened in a slit shape with a predetermined width. At this time, the opening hole 18 a is not limited to a slit shape that is elongated in the vertical direction. For example, the opening hole 18 a may be opened parallel to or at an appropriate angle with respect to the substrate 1. Furthermore, the opening hole 18a is not limited to opening in a slit shape, and may be, for example, a large number of round holes such as a punching plate, or a long hole with a wavy line or a curve. The opening hole 18a is disposed 30 mm to 50 mm below the width D shown in FIG. 2 from the back surface of the substrate 1 installed in the exhaust cup 10 so that the mist floating around the substrate 1 can be discharged well. can do. The opening hole 18a is preferably provided approximately equal to the total area of the plurality of exhaust ports 12 opened on the inner bottom surface of the cavity A of the exhaust cup 10, but, for example, resistance when discharging the stay mist from the closed space B to the cavity A When reducing the flow rate, it is desirable to provide a larger area than the area of the discharge port 12, and conversely to increase the flow velocity, it is desirable to provide a smaller value.
[0014]
Further, the exhaust cup 10 is inclined at an angle downward from the lower end of the inner wall 18 surrounding the lower side of the substrate 1 toward the center, and at least one or more at the lowest part (one in FIGS. 1 and 2). The bottom surface 16 provided with the drainage hole 17 is provided. The bottom surface 16 is not limited to being inclined downward toward the center. For example, a plurality of drain holes 17 may be provided at the lower end of the outer periphery by inclining upward toward the center in a conical shape. The bottom surface 16 formed in this way, when the cleaning liquid floats due to mist formation, adheres to the substrate 1 or the like, is cooled and dropped, and serves as a liquid receiver in the downward direction to the drain hole 17 by the inclined surface. It is provided to collect and discharge. In addition, the drain hole 17 is provided so that the total area is set small with respect to the exhaust port 12 provided on the bottom surface of the cavity A, the pressure in the closed space B is increased, and the pressure in the cavity A is decreased. Yes. As a result, the mist generated in the closed space B is inevitably induced in the cavity A having a low pressure, and is automatically discharged from the exhaust port 12. On the other hand, a plurality of exhaust ports 12 are connected from the outside of the exhaust cup 10 to the bottom surface in the cavity A, and the bottom surfaces in the cavity A are equally divided on the circumference as in the prior art shown in FIG. Are arranged respectively. Thus, the mist generated in the closed space B can be evenly diffused (guided) from the center in the inner wall 18 toward the outer circumference and discharged to the exhaust port 12 through the opening hole 18a.
[0015]
In addition, as shown in FIG. 2, the lower end of the outer periphery that covers the exhaust cup 10 is positioned on the lower side of the lid 20 from the rear surface of the substrate 1 by 10 mm to 15 mm below the width E, and the substrate is directed from the lower end toward the upper portion. A cap-shaped liquid receiving inclined surface 22 (see FIG. 3) having a predetermined angle α inclined by 30 to 40 ° is provided so as to cover the outer side of 1. Further, the lid 20 extends in a cylindrical shape from the upper center of the slope 22 shown in FIG. 1 and communicates therewith, and a supply unit 24 for supplying clean air into the closed space B through the cylindrical shape. Provided. As a result, in the closed space B, the liquid droplets scattered in the horizontal direction by the centrifugal force from the rotating substrate 1 hit the above-described slope and can flow out downward without remaining, and the next liquid droplet is placed on the previous liquid droplet. It is possible to prevent the foreign matter contained in the droplets from re-adhering to the surface of the substrate 1 without being scattered in various directions due to the collision between the liquid enemies that collide.
[0016]
When cleaning is performed using the first embodiment of the substrate cleaning processing apparatus according to the present invention formed as described above, the closed space B of the drain cup 10 is closed by the lid 20 while the substrate 1 is held on the turntable 14. After that, a cleaning process is performed by spraying a cleaning liquid onto the surface of the substrate 1 from a nozzle (not shown). At this time, in the closed space B, the mist is uniformly and efficiently discharged from the outer periphery of the substrate 1 and the droplets are prevented from being scattered by the cap-shaped liquid receiving inclined surface inclined to the outer periphery of the lid 20. Re-adhesion of foreign matter is suppressed.
[0017]
Specifically, the mist generated by the cleaning process is guided from the closed space B having a high pressure into the cavity A having a low pressure, and a plurality of mists arranged on the bottom surface of the drain cup 10 are equally divided on the circumference. The exhaust ports 12 are uniformly exhausted toward the outer inner wall 18 in the closed space B. At this time, the opening hole 18 a of the drainage cup 10 can adjust the suction speed of the exhaust port 12 by adjusting the number and size of the holes opened with respect to the total area of the exhaust port 12. The mist and droplets are prevented from scattering toward the surface of the substrate 1 by centrifugal force from the outer periphery.
[0018]
As described above, according to the first embodiment of the substrate cleaning apparatus of the present invention, the closed space B in which the substrate 1 is accommodated and closed, and the cavity in which the exhaust ports 12 are equally divided and arranged in the lower part in the lower part. 7 is connected through the opening hole 18a, so that the mist in the closed space B with a high internal pressure is uniformly guided into the cavity A with a low pressure to be exhausted. Therefore, as in the prior art shown in FIG. In addition, it is possible to prevent the mist from staying in the center without generating the air flow H toward the center due to the strength of the air flow on the surface of the substrate 1. By preventing the mist from staying in this way, it is possible to prevent foreign matters from reattaching to the surface of the substrate 1 and to prevent the contamination from diffusing when the substrate 1 is transported or transferred to the next process.
[0019]
Next, a second embodiment of the substrate cleaning apparatus according to the present invention will be described in detail with reference to FIGS. Here, the components other than the exhaust port 11 and the exhaust duct 13 shown in FIGS. 3 and 4 are the same as those in the first embodiment shown in FIGS. 1 and 2, and the same reference numerals are used for the same components. In addition, overlapping explanation is omitted.
[0020]
As shown in FIG. 3, in the second embodiment of the substrate cleaning apparatus according to the present invention, as in the first embodiment shown in FIG. 1, the substrate 1 is horizontally placed and rotated so as to be rotatable. A base 14, a nozzle (not shown) that performs a cleaning process by injecting a cleaning liquid such as pure water or a chemical solution onto the rotating substrate 1, and an interior that surrounds the outer side of the substrate 1 in a donut shape that is larger than the outer periphery of the substrate 1 The exhaust cup 10 is provided with an inclined bottom surface 16 for drainage extending from the lower end of the inner wall 18 surrounding the substrate 1 with the exhaust cavity A, and the bottom surface 16 is covered with the top of the exhaust cup 10. And a lid 20 that houses the substrate 1 and provides a washable closed space A closed from the outside. Further, unlike the first embodiment, the second embodiment does not connect a plurality of exhaust ports to the lower portion of the exhaust cup, but instead has an exhaust port on the side surface of the exhaust cup 10 as in the prior art shown in FIG. 11 is provided in one place. Further, in the second embodiment, a plurality of exhaust ducts 13 extending into the exhaust cavity A are disposed via the exhaust port 11 provided only at one place on the side surface of the exhaust cup 10.
[0021]
Here, as shown in FIG. 4, four exhaust ducts 13 extend into the cavity A (see FIG. 3) via the exhaust ports 11, and the tips thereof are evenly distributed on the circumference of the cavity A. They are arranged at predetermined divided positions. Therefore, in the second embodiment, as in the first embodiment, mist generated by cleaning in the closed space B of the exhaust cup 10 shown in FIG. 3 is passed through the opening hole 18a provided in the inner wall 18. The air can be exhausted into the cavity A having the exhaust port 11 by being uniformly guided over the entire circumference.
[0022]
As described above, according to the second embodiment of the substrate cleaning apparatus of the present invention, even in the exhaust port 11 provided at only one place on the side surface of the exhaust cup 10, a plurality of exhaust ducts 13 are interposed in the inside of the circle in the cavity A. By disposing the tips of the exhaust ducts 13 at predetermined positions that are evenly divided on the circumference, an airflow F that is engulfed toward the front and back surfaces by the rotation of the substrate 1 as in the prior art shown in FIG. 5 is generated. In addition, since the mist in the closed space B can be uniformly guided over the entire circumference and exhausted into the cavity A, the same effect as in the first embodiment can be obtained. In the second embodiment, since the exhaust port 11 is provided only at one place on the side surface of the exhaust cup 10, it is possible to reduce the arrangement space compared to the first embodiment.
[0023]
Although the embodiments of the substrate cleaning apparatus according to the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and can be modified without departing from the scope of the invention.
For example, the embodiment has been described in which four exhaust ducts (see FIG. 4) are interposed in the exhaust port provided only at one side of the exhaust cup. However, the present invention is not limited to this. It is also possible to arrange two or more exhausts.
[0024]
【The invention's effect】
As described above, according to the substrate cleaning processing apparatus of the present invention, by providing the exhaust (opening hole) surrounding the entire lower periphery of the substrate, the air flow on the substrate surface is controlled in the closed space of the exhaust cup so as to be uniformly in the cavity. Therefore, it is possible to prevent mist from staying on the substrate surface and moving toward the center, and to prevent reattachment of foreign matters. Furthermore, it is possible to prevent foreign matter from adhering to the back surface by suppressing the back surface of the substrate. As a result, it is possible to efficiently perform a substrate cleaning process such as a semiconductor device or a glass substrate that requires high cleanliness, and it is possible to manufacture an inexpensive and high-performance product.
[Brief description of the drawings]
FIG. 1 is a partially cutaway configuration diagram showing a first embodiment of a substrate cleaning apparatus according to the present invention.
FIG. 2 is a view showing a state where the substrate cleaning apparatus shown in FIG. 1 is assembled.
FIG. 3 is a configuration diagram showing a second embodiment of a substrate cleaning apparatus according to the present invention.
4 is a view showing an arrangement state of exhaust ducts when the substrate cleaning apparatus shown in FIG. 3 is viewed from above. FIG.
FIG. 5 is a configuration diagram showing an embodiment of a conventional substrate cleaning apparatus.
FIG. 6 is a configuration diagram showing another embodiment of a conventional substrate cleaning apparatus.
7 is a cross-sectional view showing a cross section taken along line CC shown in FIG. 6;
[Explanation of symbols]
A Cavity B Closed space 1 Substrate 10 Exhaust cup 12 Exhaust port 14 Turntable 16 Bottom surface 17 Exhaust hole 18 Inner wall 18a Open hole

Claims (9)

In a substrate cleaning processing apparatus that horizontally supports a plate-like substrate such as a semiconductor wafer or a glass substrate and rotatably supports it, and performs a cleaning process with pure water or a chemical solution.
An exhaust cup having an exhaust cavity inside a donut-shaped outer side that is larger and lower than the outer periphery of the substrate, and an inclined drainage bottom surface extending from the lower end of the inner wall surrounding the lower side of the substrate to the center When,
Covered on the upper part of the exhaust cup, the lower end of the outer periphery is located below the back surface of the substrate, and a cap-shaped liquid receiving slope inclined to cover the outside of the substrate is provided on the upper side from the lower end, Provided with a supply section for receiving droplets scattered in the horizontal direction by centrifugal force from the substrate and allowing the inclined surface to drain the bottom surface of the exhaust cup and supplying clean air in communication with the upper center of the inclined surface. A lid that houses the substrate and provides a washable closed space closed from the outside,
A hole having a predetermined size or a slit having a predetermined width that is opened over the entire inner wall of the exhaust cup that surrounds the lower side of the substrate so that the stationary mist can be discharged uniformly from the center of the substrate toward the outer circumference. A plurality of opening holes such as 30 mm to 50 mm below the back surface of the substrate, and a closed space for closing the adjacent substrate through the opening hole communicates with an exhaust cavity in the exhaust cup, A stationary mist in the enclosed space that has been housed and cleaned is guided from the opening hole into the cavity where the internal pressure for exhaust is low, and at least one or more exhaust ports connected from outside to the cavity are provided. substrate cleaning apparatus, characterized in that Ru arranged to be evacuated with. The substrate cleaning apparatus according to claim 1 ,
The substrate cleaning apparatus according to claim 1, wherein an inner wall of the exhaust cup is provided with a radius 40 to 80 mm larger than a rotation radius of the substrate. In the substrate cleaning processing apparatus according to claim 1 or 2 ,
The substrate cleaning apparatus according to claim 1, wherein a lower end of the outer periphery of the lid covering the exhaust cup is positioned 10 to 15 mm below the back surface of the substrate. In the substrate cleaning processing apparatus according to any one of claims 1 to 3 ,
The substrate cleaning apparatus according to claim 1, wherein the lid inclines the angle of the inclined surface covering the outside of the substrate from the lower end of the outer periphery covering the exhaust cup upward to 30 to 40 °. In the substrate cleaning processing apparatus according to any one of claims 1 to 4 ,
The opening hole provided in the inner wall of the exhaust cup opens in a slit shape in the inner wall and is provided at a parallel, vertical, or appropriate angle with respect to the substrate, and is 30 mm to 50 mm below the back surface of the substrate. A substrate cleaning apparatus characterized by being installed on the side. The substrate cleaning apparatus according to any one of claims 1 to 5 ,
The opening hole provided in the inner wall of the exhaust cup is opened by a hole or a slit in the inner wall, and the total area thereof is provided approximately equal to the area of the exhaust port provided in the cavity of the exhaust cup. Substrate cleaning processing device. The substrate cleaning apparatus according to any one of claims 1 to 6 ,
The bottom surface of the exhaust cup is inclined at an angle downward from the lower end of the inner wall surrounding the lower side of the substrate toward the center, and at least one drainage hole is provided at the lowest portion. A substrate cleaning processing apparatus. The substrate cleaning apparatus according to any one of claims 1 to 7 ,
The exhaust port is provided in at least one place on the bottom surface or side surface in the exhaust cavity of the exhaust cup, and when a plurality of the exhaust ports are provided in the cavity, the exhaust ports are arranged at positions equally divided on the circumference. Substrate cleaning processing device. The substrate cleaning apparatus according to claim 8 ,
When only one exhaust port is provided on the bottom or side surface of the exhaust cup, a plurality of exhaust ducts are extended from the single location into the exhaust cavity, and the tips are equally divided on the circumference. A substrate cleaning apparatus characterized by being arranged.

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