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JP4215693B2 - Wire bonding method - Google Patents

Wire bonding method Download PDF

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JP4215693B2
JP4215693B2 JP2004236405A JP2004236405A JP4215693B2 JP 4215693 B2 JP4215693 B2 JP 4215693B2 JP 2004236405 A JP2004236405 A JP 2004236405A JP 2004236405 A JP2004236405 A JP 2004236405A JP 4215693 B2 JP4215693 B2 JP 4215693B2
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Prior art keywords
wire
bonding
capillary
wiring
pad
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JP2006054383A (en
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竜成 三井
広司 渡辺
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Shinkawa Ltd
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Shinkawa Ltd
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Priority to TW094122130A priority patent/TW200608501A/en
Priority to KR20050065072A priority patent/KR100660821B1/en
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L2224/4805—Shape
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

本発明は、ワイヤボンディング方法に係り、特にファインピッチ化及び低ループ化に好適なワイヤボンディング方法に関する。   The present invention relates to a wire bonding method, and more particularly to a wire bonding method suitable for fine pitch and low loop.

第１ボンド点にボールをボンディングするボールボンディング方法は、ワイヤ径の約３〜４倍のボールを潰して接合させるため、多くの面積を必要とし、ファインピッチ化の要望に応えることができない。またボールのネック部は再結晶領域となっており、硬くて脆いため、ワイヤループは、再結晶領域部分より上の部分から折り曲げる必要がある。このため、低ループ化の要望に応えることができない。   The ball bonding method of bonding a ball to the first bond point requires a large area because the ball is crushed and bonded to about 3 to 4 times the wire diameter, and cannot meet the demand for fine pitch. Further, since the neck portion of the ball is a recrystallized region and is hard and brittle, the wire loop needs to be bent from a portion above the recrystallized region portion. For this reason, the request for lowering the loop cannot be met.

この改善策としての、第１ボンド点にワイヤ自体をボンディングするウェッジボンディング方法は、ボールを形成しないのでファインピッチ化及び低ループ化に好適である。この種のワイヤボンディング方法として、例えば特許文献１及び２が挙げられる。
特開平７−１４７２９６号公報 特開２００２−６４１１７号公報 A wedge bonding method for bonding the wire itself to the first bond point as an improvement measure is suitable for fine pitch and low loop because a ball is not formed. Examples of this type of wire bonding method include Patent Documents 1 and 2.
JP-A-7-147296 JP 2002-64117 A

特許文献１は、キャピラリより突出したワイヤ先端部の近傍にワイヤ屈曲用ロッドが配設されている。第１ボンド点にワイヤをボンディングする前にワイヤ屈曲用ロッドが移動してワイヤ先端部をキャピラリの下面に折り曲げる。   In Patent Document 1, a wire bending rod is disposed in the vicinity of a wire tip protruding from a capillary. Before the wire is bonded to the first bond point, the wire bending rod moves to bend the wire tip to the lower surface of the capillary.

特許文献２は、キャピラリのワイヤ供給孔を取り巻くように複数個の電磁石又は放射状に配置された複数の吸引孔からなる吸引保持手段を設けている。この吸引保持手段に電源又は負圧発生手段の出力が切り換え手段によって吸引する方向が変えられるようになっている。   In Patent Document 2, suction holding means including a plurality of electromagnets or a plurality of radially arranged suction holes is provided so as to surround the wire supply hole of the capillary. The suction and holding means can change the direction in which the output of the power source or the negative pressure generating means is sucked by the switching means.

特許文献１及び２は、従来のワイヤボンディング装置にワイヤ屈曲用ロッド又は吸引保持手段を設ける必要がある。また特許文献１は、ワイヤ先端部をワイヤ屈曲用ロッドで強制的に折り曲げるので、折り曲げのミスは生じなく信頼性を有するが、ワイヤ屈曲用ロッドの移動する方向によってワイヤ先端部の曲がる向きが決まってしまう。即ち、ボンディング面に押し付けられるワイヤの横たわる向きが決まる。このため、ワイヤボンディングできる向きが制限され、異なる向きにワイヤボンディングするには、ワークを回転させる必要がある。   In Patent Documents 1 and 2, it is necessary to provide a wire bending rod or suction holding means in a conventional wire bonding apparatus. Further, in Patent Document 1, since the wire tip is forcibly bent by the wire bending rod, there is no mistake in bending and the reliability is ensured. However, the bending direction of the wire tip is determined by the moving direction of the wire bending rod. End up. That is, the lying direction of the wire pressed against the bonding surface is determined. For this reason, the direction in which wire bonding can be performed is limited, and in order to wire bond in different directions, it is necessary to rotate the workpiece.

特許文献２は、ワイヤ先端部を任意の方向（実施例は４方向）に電磁石又は吸引孔による吸引保持手段で折り曲げるものであるが、キャピラリの下端にほぼ垂直に伸びた直径約２０〜５０μｍのワイヤを前記した間接的な手段で折り曲げるのは、折り曲げの信頼性が低い。また電磁石による場合には、ワイヤの材質は、磁性材である必要があり、通常使用されているアルミニウム、金、銅等はそのままでは使用できない。   In Patent Document 2, the wire tip is bent in an arbitrary direction (four directions in the embodiment) by an electromagnet or suction-holding means using suction holes, and has a diameter of about 20 to 50 μm extending substantially perpendicular to the lower end of the capillary. Bending the wire by the above-mentioned indirect means has low reliability of bending. In the case of using an electromagnet, the material of the wire needs to be a magnetic material, and commonly used aluminum, gold, copper, etc. cannot be used as they are.

本発明の第１の課題は、既存のワイヤボンディング装置を何ら改造することなくファインピッチ化及び低ループ化が図れると共に、ワイヤ先端部の曲げの信頼性の向上が図れるワイヤボンディング方法を提供することにある。   A first object of the present invention is to provide a wire bonding method capable of reducing the fine pitch and reducing the loop without modifying the existing wire bonding apparatus and improving the bending reliability of the wire tip. It is in.

本発明の第２の課題は、既存のワイヤボンディング装置によってワイヤ先端部の曲げられる方向を自由に制御できるワイヤボンディング方法を提供することにある。   The second object of the present invention is to provide a wire bonding method that can freely control the direction in which the wire tip is bent by an existing wire bonding apparatus.

上記課題を解決するための本発明の請求項１は、第１ボンド点であるダイのパッドに第１ボンディングを行った後、第２ボンド点である配線上に第２ボンディングを行い、前記パッドと前記配線間をワイヤで接続するワイヤボンディング方法において、前記第１ボンディング工程直前の第２ボンディング工程は、第２ボンド点にワイヤをボンディングさせた後にクランパを開の状態でクランパとキャピラリを共に上昇させる工程と、その後、クランパを閉じてワイヤをクランプし、次にボンディングするパッドと配線を結ぶ方向に平行で、かつ第１ボンド点であるパッド側に移動させてワイヤを切断することにより、キャピラリの下端より突出したワイヤの先端を第２ボンド点である配線方向に折り曲げて曲げ部を形成する工程とからなり、その後の前記第１ボンディング工程は、前記曲げ部をパッドにボンディングして下部第１ボンディング部を形成する工程と、キャピラリを上昇及び前記配線側に移動させ、その後キャピラリを下降させてワイヤを前記下部第１ボンディング部上に重ねて接続して上部第１ボンディング部を形成する工程とからなることを特徴とする。 According to a first aspect of the present invention for solving the above-described problem, the first bonding is performed on the pad of the die that is the first bonding point, and then the second bonding is performed on the wiring that is the second bonding point. In the wire bonding method in which the wires are connected to each other by a wire, the second bonding step immediately before the first bonding step is to lift both the clamper and the capillary with the clamper opened after the wire is bonded to the second bonding point. And then clamping the wire by closing the clamper, cutting the wire by moving to the pad side which is the first bond point in parallel to the direction connecting the pad and wiring to be bonded next, and cutting the wire A step of bending the tip of the wire protruding from the lower end of the wire in the wiring direction as the second bond point to form a bent portion, After the first bonding step, the bending portion is bonded to the pad to form the lower first bonding portion, the capillary is raised and moved to the wiring side, and then the capillary is lowered to wire the wire. And a step of forming an upper first bonding part by overlapping and connecting on the lower first bonding part.

上記課題を解決するための本発明の請求項２は、第１ボンド点であるダイのパッドに第１ボンディングを行った後、第２ボンド点である配線上に第２ボンディングを行い、前記パッドと前記配線間をワイヤで接続するワイヤボンディング方法において、前記配線上に予めバンプを形成し、このバンプ形成工程におけるワイヤ切断工程によって、キャピラリの先端部より突出したワイヤを横方向に折り曲げて曲げ部を形成し、その後前記曲げ部を前記パッドにボンディングして前記第１ボンディング工程を行うことを特徴とする。   According to a second aspect of the present invention for solving the above-mentioned problems, the first bonding is performed on the pad of the die that is the first bond point, and then the second bonding is performed on the wiring that is the second bond point, and the pad In the wire bonding method for connecting between the wiring and the wiring by a wire, a bump is formed in advance on the wiring, and the wire protruding from the tip of the capillary is bent in the lateral direction by the wire cutting step in the bump forming step to bend the bent portion. Then, the bent portion is bonded to the pad, and the first bonding step is performed.

上記課題を解決するための本発明の請求項３は、上記請求項２において、前記第１ボンディング工程は、前記曲げ部をパッドにボンディングして下部第１ボンディング部を形成する工程と、キャピラリを上昇及び前記配線側に移動させ、その後キャピラリを下降させてワイヤを前記下部第１ボンディング部上に重ねて接続して上部第１ボンディング部を形成する工程とからなることを特徴とする。 Claim 3 of the present invention for solving the above problems, Oite to the claim 2, wherein the first bonding step includes the steps of forming a first bonding portion lower by bonding the bent portion to the pad, And a step of forming the upper first bonding portion by moving the capillary up and moving to the wiring side, and then lowering the capillary so as to overlap and connect the wire on the lower first bonding portion.

上記課題を解決するための本発明の請求項４は、上記請求項２において、前記バンプ形成工程におけるワイヤ切断工程は、クランパでワイヤをクランプし、次にボンディングするパッドと配線を結ぶ方向に平行で、かつパッド側又は配線側にキャピラリを移動させてワイヤを切断して前記曲げ部を形成することを特徴とする。 According to a fourth aspect of the present invention for solving the above-mentioned problems, in the second aspect, the wire cutting step in the bump forming step is parallel to a direction in which the wire is clamped by a clamper and a pad to be bonded and a wiring are connected next. In addition, the bent portion is formed by moving the capillary toward the pad side or the wiring side to cut the wire.

第２ボンド点である配線に第２ボンディング部を形成して第２ボンディング部の付け根よりワイヤを切断する時に、キャピラリの先端部に突出したワイヤ先端部に曲げ部を形成する。即ち、第１ボンド点にボンディングする場合のワイヤ先端部の曲げ部を特別な装置を設けることなく、既存のワイヤボンディング装置によって形成することができる。また前記切断時にワイヤ先端部は自然に曲げられて曲げ部が形成されるので、ワイヤ先端部の曲げの信頼性、即ちボンディングの信頼性が向上する。また第１ボンディング工程は、下部第１ボンディング部上に上部第１ボンディング部を形成するので、パッドへのボンディング強度の信頼性が向上する。 When the second bonding portion is formed on the wiring that is the second bond point and the wire is cut from the base of the second bonding portion, a bent portion is formed at the tip of the wire protruding from the tip of the capillary. That is, the bending portion of the wire tip when bonding to the first bond point can be formed by an existing wire bonding apparatus without providing a special apparatus. Further, since the wire tip is naturally bent at the time of cutting to form a bent portion, the bending reliability of the wire tip, that is, the bonding reliability is improved. In the first bonding step, since the upper first bonding portion is formed on the lower first bonding portion, the reliability of the bonding strength to the pad is improved.

本発明の第１の実施の形態を図１及び図２により説明する。図２に示すように、セラミック基板やプリント基板又はリードフレーム等よりなる回路基板１上には、パッド２が形成されたダイ３がマウントされている。また回路基板１には配線４が形成されている。   A first embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 2, a die 3 on which pads 2 are formed is mounted on a circuit board 1 made of a ceramic substrate, a printed board, a lead frame, or the like. A wiring 4 is formed on the circuit board 1.

図１（ａ）に示すように、クランパ５を通してキャピラリ６に挿通されたワイヤ１０の先端部は、第２ボンド点である配線４側のキャピラリ６の下面方向に曲げられた曲げ部１１が形成されている。このワイヤ１０の先端部の曲げ部１１の形成については後記する。またワイヤ１０をクランプするクランパ５は閉じた状態にある。この状態で図１（ｂ）に示すように、キャピラリ６が下降して第１ボンド点であるパッド２に曲げ部１１をボンディングして下部第１ボンディング部１２を形成する。またクランパ５は開状態となる。   As shown in FIG. 1A, the tip of the wire 10 inserted into the capillary 6 through the clamper 5 is formed with a bent portion 11 bent toward the lower surface of the capillary 6 on the wiring 4 side, which is the second bond point. Has been. The formation of the bent portion 11 at the tip of the wire 10 will be described later. The clamper 5 for clamping the wire 10 is in a closed state. In this state, as shown in FIG. 1B, the capillary 6 is lowered and the bent portion 11 is bonded to the pad 2 as the first bond point to form the lower first bonding portion 12. Further, the clamper 5 is opened.

次に図１（ｃ）に示すように、キャピラリ６を上昇させ、続いて図１（ｄ）に示すように、キャピラリ６を配線４側に移動させる。次に図１（ｅ）に示すように、キャピラリ６を下降させ、図１（ｄ）に示すワイヤ部分１３を折り曲げて下部第１ボンディング部１２上にワイヤ部分１３をボンディングして上部第１ボンディング部１４を形成する。   Next, as shown in FIG. 1C, the capillary 6 is raised, and then the capillary 6 is moved to the wiring 4 side as shown in FIG. Next, as shown in FIG. 1 (e), the capillary 6 is lowered, the wire portion 13 shown in FIG. 1 (d) is bent, and the wire portion 13 is bonded onto the lower first bonding portion 12 to bond the upper first bonding. Part 14 is formed.

その後は従来と同様に第２ボンド点である配線４にワイヤ１０を接続する。即ち、図１（ｆ）に示すように、キャピラリ６は上昇及び図２（ａ）に示すように、配線４の方向に移動してワイヤ１０を繰り出し、その後下降してワイヤ１０を配線４にボンディングして第２ボンディング部１５とする。   After that, the wire 10 is connected to the wiring 4 which is the second bond point as in the conventional case. That is, as shown in FIG. 1 (f), the capillary 6 is raised and moved in the direction of the wiring 4 to feed out the wire 10 as shown in FIG. 2 (a), and then lowered to move the wire 10 into the wiring 4. The second bonding part 15 is formed by bonding.

次に本実施の形態の特徴とする工程が行われる。図２（ｂ）に示すように、クランパ５及びキャピラリ６が共に一定量上昇する。続いてクランパ５が閉じ、図２（ｃ）に示すように、クランパ５及びキャピラリ６は共に第１ボンド点であるパッド２側に移動する。これにより、ワイヤ１０は第２ボンディング部１５の根元より切断されると共に、キャピラリ６の下端より突出したワイヤ１０の先端は第２ボンド点である配線４側のキャピラリ６の下面方向に曲げられた曲げ部１１が形成される。   Next, a process characteristic of the present embodiment is performed. As shown in FIG. 2B, both the clamper 5 and the capillary 6 rise by a certain amount. Subsequently, the clamper 5 is closed, and as shown in FIG. 2C, both the clamper 5 and the capillary 6 move to the pad 2 side which is the first bond point. As a result, the wire 10 is cut from the base of the second bonding portion 15 and the tip of the wire 10 protruding from the lower end of the capillary 6 is bent toward the lower surface of the capillary 6 on the wiring 4 side, which is the second bond point. A bent portion 11 is formed.

このように、第２ボンド点である配線４に第２ボンディング部１５を形成して第２ボンディング部１５の付け根よりワイヤ１０を切断する時に、キャピラリ６の先端部に突出したワイヤ先端部に曲げ部１１を形成する。即ち、第１ボンド点にボンディングする場合のワイヤ先端部の曲げ部１１を特別な装置を設けることなく、既存のワイヤボンディング装置によって形成することができる。また前記切断時にワイヤ先端部は自然に曲げられて曲げ部１１が形成されるので、ワイヤ先端部の曲げの信頼性、即ちボンディングの信頼性が向上する。また前記のように形成された曲げ部１１は、第１ボンド点にボンディングしてまず下部第１ボンディング部１２を形成し、その後この下部第１ボンディング部１２上にワイヤ１０を折り曲げて重ね合わせて上部第１ボンディング部１４を形成するので、第１ボンド点へのボンディング強度の信頼性が一段と向上する。更に曲げ部１１の曲げ方向は、ワイヤ１０を切断する時に次に接続するパッド２と配線４に平行で、かつ第１ボンド点であるパッド２側にキャピラリ６を移動させる。これにより、ワイヤ先端部の曲げ部１１の方向を次のボンディングに適した方向に曲げることができる。   In this way, when the second bonding portion 15 is formed on the wiring 4 that is the second bonding point and the wire 10 is cut from the root of the second bonding portion 15, the wire is bent to the tip end of the wire protruding from the tip end of the capillary 6. Part 11 is formed. That is, the bending portion 11 at the tip end of the wire for bonding to the first bond point can be formed by an existing wire bonding apparatus without providing a special apparatus. Further, since the wire tip is naturally bent at the time of cutting to form the bent portion 11, the reliability of bending of the wire tip, that is, the reliability of bonding is improved. The bent portion 11 formed as described above is bonded to the first bond point to first form the lower first bonding portion 12, and then the wire 10 is bent and overlapped on the lower first bonding portion 12. Since the upper first bonding portion 14 is formed, the reliability of the bonding strength to the first bond point is further improved. Further, when the wire 10 is cut, the bending portion 11 is parallel to the pad 2 and the wiring 4 to be connected next, and the capillary 6 is moved to the pad 2 side which is the first bond point. Thereby, the direction of the bending part 11 of a wire front-end | tip part can be bent in the direction suitable for the next bonding.

なお、キャピラリ６に挿通されたワイヤ１０を最初にボンディングする時は、ワイヤ先端部に曲げ部１１は形成されていないので、ワークの余裕のある場所に捨てボンディング等を行って曲げ部１１を形成する必要があることは言うまでもない。   When the wire 10 inserted through the capillary 6 is bonded for the first time, the bending portion 11 is not formed at the tip of the wire. It goes without saying that you need to do it.

本発明の第２の実施の形態を図３乃至図５により説明する。なお、前記第１の実施の形態（図１及び図２）と同じ又は相当部材には同一符号を付し、その詳細な説明は省略する。前記実施の形態は、図１（ａ）に示す曲げ部１１は図２（ｂ）（ｃ）のように第２ボンド点に第２ボンディング部１５を形成してワイヤ１０を切断する工程で形成した。本実施の形態は、図３（ｇ）に示す曲げ部１１は、第２ボンド点である配線４上にバンプ２０を形成する図３（ａ）乃至（ｆ）の工程を行って形成するものである。   A second embodiment of the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the same or equivalent member as the said 1st Embodiment (FIG.1 and FIG.2), and the detailed description is abbreviate | omitted. In the embodiment, the bending portion 11 shown in FIG. 1A is formed in a process of forming the second bonding portion 15 at the second bond point and cutting the wire 10 as shown in FIGS. 2B and 2C. did. In the present embodiment, the bent portion 11 shown in FIG. 3G is formed by performing the steps of FIGS. 3A to 3F in which the bump 20 is formed on the wiring 4 which is the second bond point. It is.

まず、図３（ａ）に示すように、ワイヤ１０の先端に図示しない電気トーチによりボール２１を形成し、その後、クランパ５は開状態となる。次に図３（ｂ）に示すように、キャピラリ６が下降して第２ボンド点である配線４にボール２１をボンディングする。これにより、ボール２１の一部は貫通孔６ａ内に盛り上がり、バンプ２０上にホール部分２２が形成される。続いて図３（ｃ）に示すように、キャピラリ６の下端のエッジ部６ｂがホール部分２２の高さ以内に位置するようにキャピラリ６を上昇させる。   First, as shown in FIG. 3A, the ball 21 is formed at the tip of the wire 10 by an electric torch (not shown), and then the clamper 5 is opened. Next, as shown in FIG. 3B, the capillary 6 is lowered and a ball 21 is bonded to the wiring 4 which is the second bond point. Thereby, a part of the ball 21 rises in the through hole 6 a, and a hole portion 22 is formed on the bump 20. Subsequently, as shown in FIG. 3C, the capillary 6 is raised so that the edge 6 b at the lower end of the capillary 6 is located within the height of the hole portion 22.

次に図３（ｄ）に示すように、キャピラリ６を第１ボンド点であるパッド２側方向に移動させ、バンプ２０とワイヤ１０との接続部に薄肉部２３を形成する。次に図３（ｅ）に示すように、クランパ５及びキャピラリ６が共に一定量上昇する。続いてクランパ５が閉じ、図３（ｆ）に示すように、クランパ５及びキャピラリ６は共に第１ボンド点であるパッド２側に移動する。これにより、ワイヤ１０は薄肉部２３より切断されると共に、キャピラリ６の下端より突出したワイヤ１０の先端は第２ボンド点である配線４側のキャピラリ６の下面方向に曲げられた曲げ部１１が形成される。   Next, as shown in FIG. 3 (d), the capillary 6 is moved in the direction of the pad 2, which is the first bond point, and a thin portion 23 is formed at the connection portion between the bump 20 and the wire 10. Next, as shown in FIG. 3E, both the clamper 5 and the capillary 6 rise by a certain amount. Subsequently, the clamper 5 is closed, and as shown in FIG. 3F, both the clamper 5 and the capillary 6 move to the pad 2 side which is the first bond point. As a result, the wire 10 is cut from the thin portion 23, and the tip of the wire 10 protruding from the lower end of the capillary 6 has a bent portion 11 bent toward the lower surface of the capillary 6 on the wiring 4 side, which is the second bond point. It is formed.

次に図３（ｇ）及び図４（ａ）に示すように、キャピラリ６はパッド２の上方に移動させられる。ここで、図３（ｇ）と図４（ａ）は同じ状態を示す。また図４（ａ）は前記第１の実施の形態の図１（ａ）と同じ状態を示す。そこで、その後は図１（ａ）乃至（ｆ）と同じ図４（ａ）乃至（ｆ）の工程が行われる。   Next, as shown in FIGS. 3G and 4A, the capillary 6 is moved above the pad 2. Here, FIG. 3G and FIG. 4A show the same state. FIG. 4A shows the same state as FIG. 1A of the first embodiment. Therefore, thereafter, the same steps of FIGS. 4A to 4F as in FIGS. 1A to 1F are performed.

図４（ａ）の状態より図４（ｂ）に示すように、キャピラリ６が下降して第１ボンド点であるパッド２に曲げ部１１をボンディングして下部第１ボンディング部１２を形成する。またクランパ５は開状態となる。   As shown in FIG. 4B from the state of FIG. 4A, the capillary 6 descends and the bent portion 11 is bonded to the pad 2 that is the first bond point to form the lower first bonding portion 12. Further, the clamper 5 is opened.

次に図４（ｃ）に示すように、キャピラリ６を上昇させ、続いて図４（ｄ）に示すように、キャピラリ６を配線４側に移動させる。次に図４（ｅ）に示すように、キャピラリ６を下降させ、図４（ｄ）に示すワイヤ部分１３を折り曲げて下部第１ボンディング部１２上にワイヤ部分１３をボンディングして上部第１ボンディング部１４を形成する。   Next, as shown in FIG. 4C, the capillary 6 is raised, and then, as shown in FIG. 4D, the capillary 6 is moved to the wiring 4 side. Next, as shown in FIG. 4 (e), the capillary 6 is lowered, the wire portion 13 shown in FIG. 4 (d) is bent, and the wire portion 13 is bonded onto the lower first bonding portion 12 to bond the upper first bonding. Part 14 is formed.

その後は第２ボンド点である配線４上に形成されたバンプ２０上にワイヤ１０を接続する。即ち、図４（ｆ）に示すように、キャピラリ６は上昇及び図５（ａ）に示すように、配線４の方向に移動してワイヤ１０を繰り出し、その後下降してワイヤ１０をバンプ２０にボンディングして第２ボンディング部１５とする。次にクランパ５及びキャピラリ６が共に上昇し、この上昇途中でクランパ５が閉じ、ワイヤ１０は第２ボンディング部１５の付け根より切断される。 Thereafter, the wire 10 is connected to the bump 20 formed on the wiring 4 which is the second bond point. That is, as shown in FIG. 4 (f), the capillary 6 is raised and moved in the direction of the wiring 4 as shown in FIG. 5 (a) to feed out the wire 10, and then lowered to bring the wire 10 into the bump 20 The second bonding part 15 is formed by bonding. Next, both the clamper 5 and the capillary 6 are raised, and the clamper 5 is closed in the middle of the rise, and the wire 10 is cut from the base of the second bonding portion 15.

このように、第２ボンド点である配線４にバンプ２０を形成し、該バンプ２０よりワイヤ１０を切断する時に、キャピラリ６の先端部に突出したワイヤ先端部に曲げ部１１を形成するので、本実施の形態も前記実施の形態と同様の効果が得られる。即ち、第１ボンド点にボンディングする場合のワイヤ先端部の曲げ部１１を特別な装置を設けることなく、既存のワイヤボンディング装置によって形成することができる。また前記切断時にワイヤ先端部は自然に曲げられて曲げ部１１が形成されるので、ワイヤ先端部の曲げの信頼性、即ちボンディングの信頼性が向上する。また前記のように形成された曲げ部１１は、第１ボンド点にボンディングしてまず下部第１ボンディング部１２を形成し、その後この下部第１ボンディング部１２上にワイヤ１０を折り曲げて重ね合わせて上部第１ボンディング部１４を形成するので、第１ボンド点へのボンディング強度の信頼性が一段と向上する。更に、ワイヤ１０を切断する時に次に接続するパッド２と配線４に平行で、かつ第１ボンド点であるパッド２側にキャピラリ６を移動させる。これにより、ワイヤ先端部の曲げ部１１の方向を次のボンディングに適した方向に曲げることができる。     In this way, when the bump 20 is formed on the wiring 4 that is the second bond point, and the wire 10 is cut from the bump 20, the bent portion 11 is formed at the tip of the wire protruding from the tip of the capillary 6. In the present embodiment, the same effects as those of the above embodiment can be obtained. That is, the bending portion 11 at the tip end of the wire for bonding to the first bond point can be formed by an existing wire bonding apparatus without providing a special apparatus. Further, since the wire tip is naturally bent at the time of cutting to form the bent portion 11, the reliability of bending of the wire tip, that is, the reliability of bonding is improved. The bent portion 11 formed as described above is bonded to the first bond point to first form the lower first bonding portion 12, and then the wire 10 is bent and overlapped on the lower first bonding portion 12. Since the upper first bonding portion 14 is formed, the reliability of the bonding strength to the first bond point is further improved. Further, when the wire 10 is cut, the capillary 6 is moved to the pad 2 side which is the first bond point and parallel to the pad 2 and wiring 4 to be connected next. Thereby, the direction of the bending part 11 of a wire front-end | tip part can be bent in the direction suitable for the next bonding.

なお、前記各実施の形態においては、曲げ部１１を第２ボンド点方向に曲げたが、第１ボンド点方向に曲げてもよい。即ち、図１及び図２に示す第１の実施の形態においては、図２（ｂ）の工程後、キャピラリ６を第１ボンド点であるパッド２から遠ざかる方向に移動させることにより、曲げ部１１を第１ボンド点方向に曲げさせることができる。図３乃至図５に示す第２の実施の形態においては、図３（ｃ）の工程後、図３（ｄ）と逆にキャピラリ６を第２ボンド点である配線４側方向に移動させ、バンプ２０とワイヤ１０との接続部に薄肉部２３を形成する。次にクランパ５及びキャピラリ６を共に一定量上昇させた後、クランパ５が閉じ、図３（ｆ）と逆にクランパ５及びキャピラリ６は共に第２ボンド点である配線４側に移動させる。これにより、ワイヤ１０は薄肉部２３より切断されると共に、キャピラリ６の下端より突出したワイヤ１０の先端は第１ボンド点であるパッド２側のキャピラリ６の下面方向に曲げられた曲げ部１１が形成される。   In each of the above embodiments, the bent portion 11 is bent in the second bond point direction, but may be bent in the first bond point direction. That is, in the first embodiment shown in FIGS. 1 and 2, after the step of FIG. 2B, the bending portion 11 is moved by moving the capillary 6 away from the pad 2 which is the first bond point. Can be bent in the direction of the first bond point. In the second embodiment shown in FIGS. 3 to 5, after the step of FIG. 3 (c), the capillary 6 is moved in the direction of the wiring 4 side, which is the second bond point, contrary to FIG. 3 (d). A thin portion 23 is formed at the connection portion between the bump 20 and the wire 10. Next, after both the clamper 5 and the capillary 6 are raised by a certain amount, the clamper 5 is closed, and the clamper 5 and the capillary 6 are both moved to the wiring 4 side, which is the second bond point, contrary to FIG. As a result, the wire 10 is cut from the thin portion 23, and the tip of the wire 10 protruding from the lower end of the capillary 6 has a bent portion 11 bent toward the lower surface of the capillary 6 on the pad 2 side, which is the first bond point. It is formed.

また、曲げ部１１の曲げを第２ボンド点方向又は第１ボンド点方向に曲げる場合、即ちワイヤループ方向に曲げる場合について説明したが、ワイヤループ方向にある角度を以て曲げを形成してもよい。しかし、本実施の形態のように、第２ボンド点方向又は第１ボンド点方向に曲げた方がファインピッチ化に対して好ましい。   Further, the case where the bending portion 11 is bent in the second bond point direction or the first bond point direction, that is, the case where the bending portion 11 is bent in the wire loop direction has been described, but the bending may be formed with an angle in the wire loop direction. However, as in this embodiment, it is preferable to bend in the second bond point direction or the first bond point direction for fine pitch.

前記の方法を第１の実施の形態に適用した場合は、曲げ部１１を形成する時に、キャピラリ６の先端が第１ボンド点と第２ボンド点に接続されたワイヤ１０から遠ざかる方向に移動するので、キャピラリ６の先端がワイヤ１０に接触する危険性が回避される。即ち、ワイヤ１０切断時のキャピラリ６の上昇高さを低くすることができ、より短い曲げ部１１を形成できるので、より小さいパッド２にも対応できる。また前記の方法を第２の実施の形態に適用した場合でも、隣のワイヤ１０へのキャピラリ６の接触が回避できる。   When the above method is applied to the first embodiment, the tip of the capillary 6 moves away from the wire 10 connected to the first bond point and the second bond point when the bent portion 11 is formed. Therefore, the risk that the tip of the capillary 6 contacts the wire 10 is avoided. That is, the rising height of the capillary 6 at the time of cutting the wire 10 can be reduced, and a shorter bent portion 11 can be formed. Even when the above method is applied to the second embodiment, the contact of the capillary 6 with the adjacent wire 10 can be avoided.

また、前記各実施の形態においては、図１（ｂ）又は図４（ｂ）に示すように、第１ボンド点であるパッド２に下部第１ボンディング部１２を形成した後、この下部第１ボンディング部１２上に図１（ｃ）乃至図１（ｅ）又は図４（ｃ）乃至図４（ｅ）の工程によって上部第１ボンディング部１４を形成した。しかし、図１（ｂ）又は図４（ｂ）による下部第１ボンディング部１２を形成した後、上部第１ボンディング部１４の形成工程を行わないで、キャピラリ６を上昇、第２ボンド点である配線４方向に移動させ、配線４にボンディングを行ってもよい。しかし、実施の形態のように下部第１ボンディング部１２上に上部第１ボンディング部１４を形成すると、パッド２へのボンディング強度の信頼性が向上する。   Further, in each of the above embodiments, as shown in FIG. 1B or FIG. 4B, after the lower first bonding portion 12 is formed on the pad 2 that is the first bond point, the lower first An upper first bonding portion 14 was formed on the bonding portion 12 by the steps of FIGS. 1C to 1E or FIGS. 4C to 4E. However, after forming the lower first bonding part 12 according to FIG. 1B or FIG. 4B, the capillary 6 is raised without performing the process of forming the upper first bonding part 14, which is the second bond point. The wiring 4 may be bonded by moving in the direction of the wiring 4. However, if the upper first bonding portion 14 is formed on the lower first bonding portion 12 as in the embodiment, the reliability of the bonding strength to the pad 2 is improved.

本発明のワイヤボンディング方法の第１の実施の形態を示す工程図である。It is process drawing which shows 1st Embodiment of the wire bonding method of this invention. 図１の続きの工程図である。FIG. 2 is a process diagram following FIG. 1. 本発明のワイヤボンディング方法の第２の実施の形態を示す工程図である。It is process drawing which shows 2nd Embodiment of the wire bonding method of this invention. 図３（ｆ）の続きの工程図である。FIG. 4 is a process diagram subsequent to FIG. 図４の続きの工程図である。FIG. 5 is a process diagram subsequent to FIG. 4.

符号の説明Explanation of symbols

１ 回路基板
２ パッド
３ ダイ
４ 配線
５ クランパ
６ キャピラリ
１０ ワイヤ
１１ 曲げ部
１２ 下部第１ボンディング部
１４ 上部第１ボンディング部
１５ 第２ボンディング部
２０ バンプ
２１ ボール DESCRIPTION OF SYMBOLS 1 Circuit board 2 Pad 3 Die 4 Wiring 5 Clamper 6 Capillary 10 Wire 11 Bending part 12 Lower first bonding part 14 Upper first bonding part 15 Second bonding part 20 Bump 21 Ball

Claims (4)

第１ボンド点であるダイのパッドに第１ボンディングを行った後、第２ボンド点である配線上に第２ボンディングを行い、前記パッドと前記配線間をワイヤで接続するワイヤボンディング方法において、前記第１ボンディング工程直前の第２ボンディング工程は、第２ボンド点にワイヤをボンディングさせた後にクランパを開の状態でクランパとキャピラリを共に上昇させる工程と、その後、クランパを閉じてワイヤをクランプし、次にボンディングするパッドと配線を結ぶ方向に平行で、かつ第１ボンド点であるパッド側に移動させてワイヤを切断することにより、キャピラリの下端より突出したワイヤの先端を第２ボンド点である配線方向に折り曲げて曲げ部を形成する工程とからなり、その後の前記第１ボンディング工程は、前記曲げ部をパッドにボンディングして下部第１ボンディング部を形成する工程と、キャピラリを上昇及び前記配線側に移動させ、その後キャピラリを下降させてワイヤを前記下部第１ボンディング部上に重ねて接続して上部第１ボンディング部を形成する工程とからなることを特徴とするワイヤボンディング方法。 In the wire bonding method of performing the first bonding on the pad of the die that is the first bond point, performing the second bonding on the wiring that is the second bond point, and connecting the pad and the wiring with a wire, The second bonding step immediately before the first bonding step includes the step of raising the clamper and the capillary together with the clamper opened after bonding the wire to the second bond point, and then closing the clamper to clamp the wire, Next, the tip of the wire protruding from the lower end of the capillary is the second bond point by moving the wire to the pad side which is the first bond point in parallel to the direction connecting the pad and wiring to be bonded and cutting the wire. Forming a bent portion by bending in the wiring direction, and the subsequent first bonding step includes the bending step. Forming a lower first bonding portion by bonding to the pad, and raising and moving the capillary to the wiring side, and then lowering the capillary so that the wire is superimposed on the lower first bonding portion and connected to the upper portion A wire bonding method comprising: forming a first bonding portion. 第１ボンド点であるダイのパッドに第１ボンディングを行った後、第２ボンド点である配線上に第２ボンディングを行い、前記パッドと前記配線間をワイヤで接続するワイヤボンディング方法において、前記配線上に予めバンプを形成し、このバンプ形成工程におけるワイヤ切断工程によって、キャピラリの先端部より突出したワイヤを横方向に折り曲げて曲げ部を形成し、その後前記曲げ部を前記パッドにボンディングして前記第１ボンディング工程を行うことを特徴とするワイヤボンディング方法。   In the wire bonding method of performing the first bonding on the pad of the die that is the first bond point, performing the second bonding on the wiring that is the second bond point, and connecting the pad and the wiring with a wire, A bump is formed in advance on the wiring, and a wire cutting step in this bump forming step is performed to bend the wire protruding from the tip of the capillary in a lateral direction to form a bent portion, and then bond the bent portion to the pad. A wire bonding method comprising performing the first bonding step. 前記第１ボンディング工程は、前記曲げ部をパッドにボンディングして下部第１ボンディング部を形成する工程と、キャピラリを上昇及び前記配線側に移動させ、その後キャピラリを下降させてワイヤを前記下部第１ボンディング部上に重ねて接続して上部第１ボンディング部を形成する工程とからなることを特徴とする請求項２記載のワイヤボンディング方法。   The first bonding step includes a step of bonding the bent portion to a pad to form a lower first bonding portion, a step of raising the capillary and moving it to the wiring side, and then lowering the capillary to bring the wire into the lower first portion. The wire bonding method according to claim 2, further comprising a step of forming an upper first bonding portion by overlapping and bonding on the bonding portion. 前記バンプ形成工程におけるワイヤ切断工程は、クランパでワイヤをクランプし、次にボンディングするパッドと配線を結ぶ方向に平行で、かつパッド側又は配線側にキャピラリを移動させてワイヤを切断して前記曲げ部を形成することを特徴とする請求項２記載のワイヤボンディング方法。   The wire cutting step in the bump forming step includes clamping the wire with a clamper, and parallel to the direction connecting the pad and wiring to be bonded next, and moving the capillary to the pad side or wiring side to cut the wire and bending the wire The wire bonding method according to claim 2, wherein a portion is formed.
JP2004236405A 2004-08-16 2004-08-16 Wire bonding method Expired - Fee Related JP4215693B2 (en)

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