JP4209456B1 - Lamination bonding equipment jig - Google Patents

Abstract

An object of the present invention is to make it easier to place a target substrate at a predetermined position.
A support portion 52 on which a chuck contact surface 61 that contacts a chuck 11 that holds a bonding target substrate is formed, and an alignment portion 53 on which an alignment surface 59 that contacts an edge of the alignment target substrate 50 is formed. And. The chuck 11 has a first fitting portion 63 formed on the surface that contacts the chuck contact surface 61. The support portion 52 has a second fitting portion 58 formed on the chuck contact surface 61. At this time, the multi-layer joining apparatus jig 51 is arranged so that the first fitting portion 63 and the second fitting portion 58 are fitted, and the edge of the alignment target substrate 50 contacts the alignment surface 59. By arranging the alignment target substrate 50 as described above, the alignment target substrate 50 can be more easily arranged at a predetermined position.
[Selection] Figure 4

Description

  The present invention relates to a jig for a laminating / bonding apparatus, and more particularly to a jig for a laminating / bonding apparatus that is used when a laminating / joining apparatus that joins objects to be bonded holds the objects to be bonded.

  A lamination joining method for joining two substrates is known. In such a laminated joining method, it is desired to join the two substrates with higher accuracy, and the two opposing surfaces of the two substrates are maintained parallel to each other. It is desirable to bond substrates. A lamination joining method is known in which two substrates are joined by heating. In such a laminated bonding method, thermal strain is generated in the chuck that holds the substrate, and the two surfaces to be bonded of the two substrates may not be maintained parallel to each other. It is desired to bond the two substrates with higher precision while maintaining the parallelness of the two surfaces to be bonded. Furthermore, there is a demand for a jig for a laminated bonding apparatus that makes it easier to place the two substrates on the chuck.

  Japanese Laid-Open Patent Publication No. 2001-118292 discloses a surface in an information processing apparatus that can detect variations in probe electrodes used for surface matching and correct the variations before or during the surface matching by simpler means. A combination method is disclosed. The surface alignment method includes a recording medium, a plurality of probe electrodes arranged to face the recording medium, an actuator provided on each of the plurality of probe electrodes, and a support that supports the plurality of probe electrodes. A tilt mechanism for correcting the tilt of the support with respect to the recording medium, means for relatively displacing the recording medium and the probe electrode in an in-plane direction parallel to the surface of the recording medium, and an upper surface of the recording medium In the information processing apparatus having means for recording / reproducing in the presence of the probe electrode, the surface of the recording medium and the tip of the plurality of probe electrodes with respect to the scanning plane drawn by the tip of the plurality of probe electrodes by the displacement means In the surface alignment method for performing surface alignment with a configured surface, a signal is detected from a specific probe electrode among the plurality of probe electrodes. Detecting the increase rate of the detection signal for each specific probe electrode using the detection signal, and the specific probe electrode so that the increase rates of the specific probe electrodes are the same. And a step of controlling the tilt mechanism so that the signals detected from the specific probe electrodes are equal to each other.

  Japanese Laid-Open Patent Publication No. 05-160340 discloses a three-dimensional LSI laminating apparatus in which the positions of elements between layers can be precisely aligned and bonded. The three-dimensional LSI stacking apparatus is a large stroke, low resolution coarse motion having three axes of X, Y, Z and at least one of the rotation axes θX, θY, θZ around these axes for a total of four or more control axes. A fine stroke stage with a small stroke and high resolution having a stage, three axes of X, Y, and Z, and a total of six axes of rotations XX, θY, and θZ around each axis, the coarse stage and the fine movement Two wafers that can be aligned in the X and Y directions and positioned and pressed in the Z direction by the stage, a sensor that detects the interval in the Z direction, which is the vertical direction of the two wafers, and a load at the time of wafer bonding. Load cell; position detecting means for detecting positional deviation in XY direction which is in-plane direction of two wafers; curing adhesive means for curing and bonding two wafers with adhesive; and moving mechanism for moving and positioning both means In the apparatus, the two wafers are aligned in the XY direction by performing closed loop control of the coarse movement stage and the fine movement stage based on the positional deviation in the XY directions of the two wafers detected by the position detecting means. And adjusting the parallelism of the two wafers and pushing the two wafers by performing closed loop control of the coarse movement stage and the fine movement stage based on the interval detected by the sensor and the load detected by the load cell. It is characterized by the provision of a control device that performs the guessing.

  Japanese Patent Application Laid-Open No. 09-148207 discloses a three-dimensional LSI stacking apparatus capable of manufacturing a high-precision three-dimensional LSI by bonding two wafers with high accuracy without deformation. In the three-dimensional LSI stacking apparatus, the quartz glass holding the upper wafer on the lower surface is fixed to the upper part of the main body stage through the housing, while the moving stage holding the lower wafer facing the upper wafer on the upper surface is It is supported so as to be movable and adjustable in three directions orthogonal to the main body stage, and an adhesive is applied to at least one surface of the upper wafer and the lower wafer facing each other, and the moving stage is moved to the upper wafer. On the other hand, in the state where the lower wafer is positioned and pressed, the upper wafer and the lower wafer are bonded to each other by irradiating the thermal energy ray transmitted through the quartz glass from above to cure the adhesive. In the three-dimensional LSI stacking apparatus that forms the original LSI, the lower wafer on the moving stage is pressed against the upper wafer. It is characterized in that the transparent deformation resistance member for preventing deformation of the quartz glass is provided on the upper surface of the quartz glass that.

JP 2001-118292 A JP 05-160340 A JP 09-148207 A

  The subject of this invention is providing the jig | tool for lamination | stacking joining apparatuses which makes it easier to arrange | position the joining object to the chuck | zipper holding a joining object.

  In the following, means for solving the problems will be described using the reference numerals used in the best modes and embodiments for carrying out the invention in parentheses. This reference numeral is added to clarify the correspondence between the description of the claims and the description of the best mode for carrying out the invention / example, and is described in the claims. It should not be used to interpret the technical scope of the invention.

  The jigs (51), (71), (91), and (101) for the laminating and bonding apparatus according to the present invention are the support portions on which the chuck contact surfaces (61, 62) that contact the chuck (11) that holds the substrates to be joined are formed. (52) (72) (92) (102) and alignment in which alignment surfaces (59) (79) contacting the edges of the alignment target substrates (50) (70) (90) (100) are formed Parts (53, 54) (74) (93, 94) (104). The chuck (11) has a first fitting portion (63) formed on the surface that contacts the chuck contact surface (61, 62). The support portions (52), (72), (92), and (102) are formed on the chuck contact surfaces (61, 62) with the second fitting portions (58) and (78) that fit into the first fitting portion (63). Is done. At this time, the jigs (51), (71), (91), and (101) for the laminating and bonding apparatus are fitted so that the first fitting portion (63) and the second fitting portions (58) and (78) are fitted. By arranging, it can be arranged at a predetermined position with respect to the chuck (11). When the jigs (51), (71), (91), and (101) for the laminating and bonding apparatus are further arranged at predetermined positions with respect to the chuck (11), the alignment target substrates (50) (70) ( By positioning the alignment target substrates (50), (70), (90), and (100) so that the edges of (90) and (100) are in contact with the alignment surfaces (59) and (79), the alignment is performed at a predetermined position. The target substrates (50), (70), (90), and (100) can be arranged more easily.

  The jig | tool (71) (101) for lamination | stacking joining apparatuses by this invention contacts a part of surface which opposes the chuck | zipper (11) of the alignment target board | substrates (70) (100), and positions the alignment object. It further includes a pedestal portion (73) (103) on which a supporting surface (81) to be supported is formed. The support portions (72) and (102) support the pedestal portions (73) and (103) so as not to contact the chuck (11). When the jigs (71) and (101) for the laminating and bonding apparatus are disposed at predetermined positions with respect to the chuck (11), the jigs (71) and (101) do not come into contact with other objects (50) held by the chuck (11). The alignment target substrates (70) and (100) can be arranged at predetermined positions.

  The jig | tool (71) (101) for lamination | stacking joining apparatuses by this invention supports the alignment part (74) (104) so that it can move with respect to a support part (72) (102). ). The jigs (71) and (101) for the laminating and bonding apparatus are provided with alignment portions (74) and (104) when the opposing chuck (12) facing the chuck (11) holds the alignment target substrates (70) and (100). ) Can be retracted, and the alignment portions (74) and (104) can be prevented from obstructing the holding.

  The alignment portion support portion (83) is formed of an elastic body having one end bonded to the support portions (72) and (102) and the other end bonded to the alignment portions (74) and (104). The jigs (71) and (101) for the laminating and bonding apparatus are such that the support portions (72) and (102) are elastically deformed when the opposing chuck (12) facing the chuck (11) holds the object to be aligned. It is preferable to retract the alignment portions (74) (104).

  The jigs (71) (101) for the laminating and bonding apparatus according to the present invention are marks that are aligned with the mark (85) formed on the edge when the alignment target substrates (70) (100) are arranged at predetermined positions. It further includes a mark alignment portion (105) on which an alignment surface (84) is formed. At this time, the jigs (71) and (101) for the laminating and bonding apparatus are arranged such that the alignment target substrates (70) and (100) are arranged so that the marks (85) are aligned with the mark alignment surfaces (84). The alignment target substrates (70) and (100) can be more easily arranged at the positions.

  The alignment target substrates (50) and (90) are in contact with the alignment surface (59) with their edges in contact with the chuck (11). At this time, the jig | tool (51) (91) for lamination | stacking joining apparatuses can arrange | position an alignment object board | substrate (50) (90) more easily in the predetermined position on a chuck | zipper (11).

  The jig (91) for a laminating and bonding apparatus according to the present invention has a mark alignment in which a mark alignment surface is formed in contact with a mark formed on an edge of the alignment target substrate (90) when the alignment target substrate (90) is disposed at a predetermined position. A portion (94) is further provided. At this time, the jig (91) for the laminating and bonding apparatus places the alignment target substrate (90) at a predetermined position by arranging the alignment target substrate (90) so that the mark contacts the alignment surface. It can be arranged more easily.

  According to the jig | tool for lamination | stacking joining apparatuses by this invention, the user can arrange | position the joining object to the chuck | zipper holding a joining object more easily.

  With reference to drawings, embodiment of the jig | tool for lamination | stacking joining apparatuses by this invention is described. As shown in FIG. 1, a lamination joining apparatus 1 to which a jig for a lamination joining apparatus according to the present invention is applied includes a gantry 2, a base 3, a pressure contact driving device 5, a stage 6, a leaf spring 7, and an alignment tool. A driving device 8, a lower chuck 11, an upper chuck 12, piezoelectric elements 14-1 to 14-3, load cells 15-1 to 15-3, and a control device 16 are provided. The control device 16 is a computer and includes a CPU, a storage device, an input device, a display device, and an interface (not shown). The CPU executes a computer program installed in the control device 16 to control the storage device, the input device, the output device, and the interface. The storage device records the computer program, records information used by the CPU, and records information generated by the CPU. The input device outputs information generated by being operated by the user to the CPU. Examples of the input device include a keyboard and a mouse. The display device displays a screen generated by the CPU. The interface outputs information generated by an external device connected to the control device 16 to the CPU, and outputs information generated by the CPU to the external device.

  The base 3 is supported by the bottom plate 10 so as to be movable in the vertical direction. The base 3 has a flat support surface at its upper end. The support surface is perpendicular to the vertical direction. The pressure contact driving device 5 is controlled by the control device 16 to drive the base 3 in parallel to the bottom plate 10 in the vertical direction. The stage 6 is formed in a plate shape and is disposed on the upper side of the base 3 so as to face the support surface of the base 3. The leaf spring 7 is formed of an elastic body and is joined to a part of the stage 6. The alignment driving device 8 is supported by the base 3 and is supported by a leaf spring 7 so that the stage 6 is separated from the support surface of the base 3 by about 100 μm. The alignment driving device 8 is controlled by the control device 16 so that the stage 6 translates in parallel in the horizontal direction, or the stage 6 rotates around a rotation axis parallel to the vertical direction. The leaf spring 7 is driven.

  The lower chuck 11 is generally formed in a disc shape. The piezoelectric elements 14-1 to 14-3 are respectively arranged at three positions that divide the circumference of the disk of the lower chuck 11 into three equal parts. Each of the piezoelectric elements 14-1 to 14-3 has one end joined to the base 3 and the other end joined to the lower chuck 11. Each of the piezoelectric elements 14-1 to 14-3 is controlled by the control device 16 to expand and contract. The load cell 15-i (i = 1, 2, 3) measures the force applied to the piezoelectric element 14-i and outputs the force to the control device 16.

  The gantry 2 is formed in a structure in which a base 3, a pressure driving device 5, a stage 6, a leaf spring 7, an alignment driving device 8, a lower chuck 11, and an upper chuck 12 are disposed inside. It is joined. The upper chuck 12 is disposed so as to face the lower chuck 11 and is joined to the gantry 2.

  At this time, when the plate spring 7 presses the substrate set on the lower chuck 11 and the substrate set on the upper chuck 12, that is, the stage 6 is moved vertically upward by the press drive device 5. The stage 6 is elastically deformed so as to come into contact with the support surface of the base 3. In the multi-layer bonding apparatus 1, the base 3 supports the stage 6 in this manner, so that the load of the alignment driving device 8 is applied to the substrate set on the lower chuck 11 and the substrate set on the upper chuck 12. Greater loads can be applied.

  FIG. 2 shows the lower chuck 11. The lower chuck 11 is formed of a support side portion 21 and a substrate side portion 22. The support side portion 21 is a portion joined to the piezoelectric elements 14-1 to 14-3 and is made of quartz glass. The substrate side portion 22 is a portion bonded to the opposite side of the support side portion 21 to the side bonded to the piezoelectric elements 14-1 to 14-3, and is made of aluminum nitride having better heat transfer than the support side portion 21. Is formed.

  The lower chuck 11 includes a vacuum chuck pipe 23, a cooling pipe 24, and a heater 25. One end of the vacuum chuck pipe 23 is connected to the holding surface of the lower chuck 11 facing the upper chuck 12, and the other end is connected to an external exhaust device. When the substrate is disposed on the holding surface facing the upper chuck 12, the lower chuck 11 has its air exhausted through the vacuum chuck pipe 23 from the holding surface facing the upper chuck 12. Hold the substrate. The cooling pipe 24 is formed in the support side portion 21 and cools the lower chuck 11 and cools the substrate held by the lower chuck 11 by flowing nitrogen gas. The heater 25 is disposed inside the support side portion 21 and is controlled by the control device 16 to heat the substrate held by the lower chuck 11. The lower chuck 11 further has a hole 26 formed therein.

  The upper chuck 12 includes a support side portion 31 and a substrate side portion 32. The support side portion 31 is a portion joined to the gantry 2 and is made of quartz glass. The substrate side portion 32 is a portion that is joined to the opposite side of the support side portion 31 that is joined to the gantry 2, and is made of aluminum nitride that has better heat transfer than the support side portion 31. The heater 35 is disposed inside the support side portion 31 and is controlled by the control device 16 to heat the substrate held by the upper chuck 12.

  The upper chuck 12 includes a vacuum chuck pipe 33, a cooling pipe 34, a heater 35, and a hole 36. One end of the vacuum chuck pipe 33 is connected to the holding surface facing the lower chuck 11 of the upper chuck 12, and the other end is connected to an external exhaust device. The upper chuck 12 is configured such that when the substrate is disposed on the holding surface facing the lower chuck 11, air is exhausted from the holding surface facing the lower chuck 11 through the vacuum chuck pipe 33. Hold the substrate. The vacuum chuck pipe 33 includes a central vacuum chuck pipe and a peripheral vacuum chuck pipe that can be evacuated independently of each other. The central vacuum chuck pipe is arranged at the center of the holding surface of the upper chuck 12 so as to hold the center of the substrate held by the upper chuck 12. The peripheral vacuum chuck piping (not shown) is arranged at the peripheral edge of the holding surface of the upper chuck 12 so as to hold the peripheral edge of the substrate held by the upper chuck 12. The cooling pipe 34 is formed in the support side portion 31 and cools the upper chuck 12 and cools the substrate held by the upper chuck 12 by flowing nitrogen gas. The upper chuck 12 is further formed with a hole 36.

  The lower chuck 11 and the upper chuck 12 are made of aluminum nitride with relatively small thermal strain. For this reason, the laminate bonding apparatus 1 heats and bonds the substrate held by the lower chuck 11 and the substrate held by the upper chuck 12 to the substrate held by the lower chuck 11 and the upper chuck 12. Therefore, the change in parallelism with the substrate held by the substrate is small, a load is applied more uniformly, and bonding can be performed with higher accuracy.

  The multilayer bonding apparatus 1 further includes an alignment device 19. The alignment device 19 includes a transmitted light illumination 41, a lens driving device 42, a coaxial incident illumination 45, a lens 44, and a camera 43. The transmitted light illumination 41 is disposed inside the hole 26 and is controlled by the control device 16 to generate infrared rays. The lens driving device 42 supports the coaxial incident illumination 45, the lens 44, and the camera 43 on the gantry 2, and is controlled by the control device 16 so that the coaxial incident illumination 45, the lens 44, and the camera 43 are attached to the gantry 2. Drive vertically. The coaxial incident illumination 45 is controlled by the control device 16 to generate infrared rays. The lens 44 is formed in a size smaller than the hole 36 of the lower chuck 11 and is disposed inside the hole 36. The lens 44 irradiates the substrate held by the lower chuck 11 with infrared rays generated by the coaxial incident illumination 45 or irradiates the substrate held by the upper chuck 12 with the infrared rays. Further, the lens 44 transmits infrared rays reflected or transmitted through the substrate held by the lower chuck 11 to the camera 43, and transmits infrared rays reflected or transmitted through the substrate held by the upper chuck 12 to the camera 43. The camera 43 generates an image of the substrate held by the lower chuck 11 based on the infrared light transmitted through the lens 44 and generates an image of the substrate held by the upper chuck 12.

  In general, the higher the magnification of the lens 44, the shorter the working distance. The multi-layer bonding apparatus 1 can reduce the distance between the lens 44 and the substrate held by the lower chuck 11 or the upper chuck 12 by disposing the lens 44 inside the hole 36 of the lower chuck 11. A lens having a higher magnification can be applied to the lens 44. When the lens having a higher magnification is applied to the lens 44, the multilayer bonding apparatus 1 can image the substrate held by the lower chuck 11 or the upper chuck 12 with higher accuracy. The substrate held by the upper chuck 12 can be aligned with higher accuracy, and the substrate held by the lower chuck 11 and the substrate held by the upper chuck 12 can be joined with higher accuracy.

  The piezoelectric elements 14-1 to 14-3 can rotate and move the lower chuck 11 around a rotation axis perpendicular to the vertical direction, that is, the inclination of the lower chuck 11 can be changed. The piezoelectric elements 14-1 to 14-3 are further arranged closer to the lower chuck 11 than the alignment driving device 8 and the pressure contact driving device 5. For this reason, the multilayer bonding apparatus 1 can reduce the horizontal displacement of the lower chuck 11 when the inclination of the lower chuck 11 is changed using the piezoelectric elements 14-1 to 14-3. The substrate held by the side chuck 11 and the substrate held by the upper chuck 12 can be bonded with higher accuracy.

  FIG. 3 shows an 8-inch substrate lower set jig. The 8-inch substrate lower set jig 51 includes a support portion 52, an alignment portion 53, an alignment portion 54, and a handle 55. The alignment portion 53 is joined to the support portion 52. The alignment portion 54 is joined to the support portion 52. The handle 55 is joined to the support portion 52.

  As shown in FIG. 4, the lower chuck 11 has a holding surface 60, an attachment surface 61, an attachment surface 62, and a protrusion 63. The holding surface 60 is formed flat so as to face the upper chuck 12. The attachment surface 61 is formed along the side surface of the cylinder whose bottom surface is the holding surface 60, that is, is formed adjacent to the holding surface 60 and perpendicular to the holding surface 60. The attachment surface 62 is formed flat so as to face the upper chuck 12 outside the holding surface 60 and the attachment surface 61. The protrusion 63 is formed on the attachment surface 62.

  As shown in FIG. 4, the support portion 52 of the 8-inch substrate lower set jig 51 has an attachment surface 56, an attachment surface 57, and a hole 58. The attachment surface 56 is formed in a curved surface that is in close contact with a part of the attachment surface 61 of the lower chuck 11. The attachment surface 57 is formed flat so as to be in close contact with a part of the attachment surface 62 of the lower chuck 11. The hole 58 is formed so that the protrusion 63 of the lower chuck 11 is inserted. The 8-inch substrate lower side setting jig 51 has a projection 63 inserted into the hole 58, the attachment surface 56 is in close contact with the attachment surface 62, and the attachment surface 57 is in close contact with the attachment surface 61. Attached to the side chuck 11.

  The alignment portion 53 is formed with an alignment surface 59. The alignment surface 59 is formed to be parallel to the vertical direction. The alignment surface 59 contacts the edge of the substrate 50 disposed at a predetermined position on the holding surface 60 of the lower chuck 11 when the 8-inch substrate lower set jig 51 is attached to the lower chuck 11. It is formed to do. The alignment portion 54 has a mark alignment surface. The mark alignment surface is formed to be parallel to the vertical direction. The mark alignment surface contacts the notch of the substrate 50 arranged at a predetermined position on the holding surface 60 of the lower chuck 11 when the 8-inch substrate lower set jig 51 is attached to the lower chuck 11. It is formed to do.

  FIG. 5 shows an 8-inch substrate upper side setting jig. The 8-inch substrate upper side setting jig 71 includes a support portion 72, two pedestal portions 73, two alignment portions 74, and a mark alignment portion 75. The support portion 72 is formed in a ring shape. The two pedestal portions 73 are joined to the support portion 72. The two alignment portions 74 are joined to the two pedestal portions 73, respectively. The mark alignment portion 75 is joined to the support portion 72.

  As shown in FIG. 6, the support portion 72 of the 8-inch substrate upper side setting jig 71 has an attachment surface 76, an attachment surface 77, and a hole 78. The attachment surface 76 is formed in a curved surface that is in close contact with the attachment surface 61 of the lower chuck 11. The attachment surface 77 is formed flat so as to be in close contact with the attachment surface 62 of the lower chuck 11. The hole 78 is formed so that the protrusion 63 of the lower chuck 11 is inserted. The 8-inch board upper set jig 71 has a protrusion 63 inserted into the hole 78, the attachment surface 76 is in close contact with the attachment surface 62, and the attachment surface 77 is in close contact with the attachment surface 61. Attached to the chuck 11.

  The two pedestal portions 73 and the mark alignment portions 75 are respectively formed so that the thickness of the substrate 50 from the holding surface 60 of the lower chuck 11 when the 8-inch substrate upper setting jig 71 is attached to the lower chuck 11. It is supported by the support part 72 so that it may leave | separate above. Each of the two pedestal portions 73 is formed with a hole 80 and a substrate support surface 81. In the mark alignment portion 75, the substrate support surface 81 is formed in the same manner as the pedestal portion 73. The three substrate support surfaces 81 respectively formed on the two pedestal portions 73 and the mark alignment portions 75 are arranged along the same plane.

  The alignment portion 74 is formed of an alignment main body portion 83, an elastic deformation portion 83, and a support portion 84. The support portion 84 is joined to the pedestal portion 73 and supports the alignment portion 74 to the pedestal portion 73. The elastic deformation portion 83 is formed of an elastic body, and can be elastically deformed such that the alignment main body portion 83 and the elastic deformation portion 83 are inserted into the holes 80 of the pedestal portion 73. The alignment main body portion 83 is formed with an alignment surface 79. As shown in FIG. 5, the mark alignment portion 75 has a mark alignment surface 86 formed thereon.

  As shown in FIG. 7, the 8-inch substrate upper set jig 71 supports the substrate 70 at a predetermined position with the substrate support surface 81 coming into contact with the substrate 70. The alignment surface 79 is formed so that the edge of the substrate 70 contacts when the 8-inch substrate upper setting jig 71 is attached to the lower chuck 11 and supports the substrate 70 at a predetermined position. When the 8-inch substrate upper set jig 71 is attached to the lower chuck 11 and the substrate 70 is supported at a predetermined position, the mark alignment surface 86 follows a curved surface along which a notch 85 formed on the substrate 70 follows. Is formed.

  FIG. 8 shows a jig for setting the lower side of the 2-inch substrate. The 2-inch substrate lower set jig 91 includes a support portion 92, an alignment portion 93, a mark alignment portion 94, and a handle 95. The alignment portion 93 is joined to the support portion 92. The mark alignment portion 94 is joined to the support portion 92. The handle 95 is joined to the support portion 92.

  The support portion 92 of the 2-inch substrate lower set jig 91 is formed with two attachment surfaces and holes in the same manner as the 8-inch substrate lower set jig 51. One of the two attachment surfaces is formed into a curved surface that is in close contact with a part of the attachment surface 61 of the lower chuck 11. The other of the two attachment surfaces is formed flat so as to be in close contact with a part of the attachment surface 62 of the lower chuck 11. The hole is formed so that the protrusion 63 of the lower chuck 11 is inserted. The jig 91 for setting the lower side of the 2-inch substrate is attached to the lower chuck 11 by the protrusion 63 being inserted into the hole and the two attachment surfaces being in close contact with the attachment surface 62 and the attachment surface 61, respectively. It is done.

  The alignment portion 93 has an alignment surface. The alignment surface is formed so as to be parallel to the vertical direction. The alignment surface contacts the edge of the substrate 90 disposed at a predetermined position on the holding surface 60 of the lower chuck 11 when the 2-inch substrate lower set jig 91 is attached to the lower chuck 11. It is formed to do. The mark alignment portion 94 has a mark alignment surface. The mark alignment surface is formed to be parallel to the vertical direction. The mark alignment surface is an orientation flat of the substrate 90 disposed at a predetermined position on the holding surface 60 of the lower chuck 11 when the 2-inch substrate lower setting jig 91 is attached to the lower chuck 11. It is formed to contact.

  FIG. 9 shows a jig for setting the upper side of the 2-inch substrate. Similar to the 8-inch substrate upper side setting jig 71, the 2-inch substrate upper side setting jig 101 includes a support portion 102, two pedestal portions 103, two alignment portions 104, and a mark alignment portion 105. ing. The support portion 102 is formed in a ring shape. The two pedestal portions 103 are joined to the support portion 102. The two alignment portions 104 are joined to the two pedestal portions 103, respectively. The mark alignment part 105 is joined to the support part 102.

  In the same manner as the support portion 72 of the 8-inch substrate upper set jig 71, the support portion 102 of the 2-inch substrate upper set jig 101 is formed with two attachment surfaces and holes. One of the two attachment surfaces is formed in a curved surface that is in close contact with the attachment surface 61 of the lower chuck 11. The other of the two attachment surfaces is formed flat so as to be in close contact with the attachment surface 62 of the lower chuck 11. The hole is formed so that the protrusion 63 of the lower chuck 11 is inserted. The 2-inch substrate upper setting jig 101 is attached to the lower chuck 11 by inserting the protrusion 63 into the hole and bringing the two attachment surfaces into close contact with the attachment surface 62 and the attachment surface 61, respectively.

  The two pedestal portions 103 and the mark aligning portion 105 are each equal to or more than the thickness of the substrate from the holding surface 60 of the lower chuck 11 when the 2-inch substrate upper setting jig 101 is attached to the lower chuck 11. It is supported by the support part 102 so that it may leave | separate. The two pedestal portions 103 each have a hole and a substrate support surface. The mark alignment portion 105 is formed with a substrate support surface in the same manner as the pedestal portion 103. Three substrate support surfaces respectively formed on the two pedestal portions 103 and the mark alignment portions 105 are arranged along the same plane.

  The alignment portion 104 is formed with an alignment surface in the same manner as the alignment portion 74. The alignment portion 104 is elastically deformable so that the portion where the alignment surface is formed is inserted into the hole of the pedestal portion 103. In the mark alignment portion 105, a mark alignment surface 108 is formed.

  As shown in FIG. 10, the 2-inch substrate upper side setting jig 101 supports the substrate 100 at a predetermined position with the substrate support surface coming into contact with the substrate 100. The alignment surface of the alignment portion 104 is formed so that the edge of the substrate 100 contacts when the 2-inch substrate upper set jig 101 is attached to the lower chuck 11 and the substrate 100 is supported at a predetermined position. Has been. When the 2-inch substrate upper setting jig 101 is attached to the lower chuck 11 and the substrate 100 is supported at a predetermined position, the mark alignment surface 108 follows a plane along which an orientation flat formed on the substrate 100 is aligned. Is formed.

  FIG. 11 shows an arrangement plate held by the lower chuck 11. The arrangement plate 111 is formed from a semiconductor wafer, and the surface facing the substrate to be bonded is composed of a hydrophobic portion 112 and hydrophilic portions 113-1 to 113-n (n = 2, 3, 4,...). Is formed. The hydrophobic portion 112 is formed more hydrophobic than the hydrophilic portions 113-1 to 113-n. Each of the hydrophilic portions 113-1 to 113-n is formed in a shape (for example, a rectangular shape) that matches a chip to be bonded using the multilayer bonding apparatus 1, and is disposed so as to be surrounded by the hydrophobic portion 112. Yes. The arrangement plate 111 is further formed with a notch or an orientation flat at the periphery, and two alignment marks are formed in the hydrophobic portion 112.

  FIG. 12 shows the adapter plate held by the upper chuck 12. The adapter plate 114 is formed with a recess 115 and a plurality of holes 116. The recess 115 is formed on the surface opposite to the surface facing the substrate to be bonded. The plurality of holes 116 are formed so as to penetrate the surface facing the substrate to be bonded and the recess 115, and when the adapter plate 114 faces the placement plate 111, the holes 116-1 are formed in the hydrophilic portions 113-113-n. It arrange | positions so that it may oppose. The adapter plate 114 is evacuated from the peripheral vacuum chuck piping of the vacuum chuck piping 33, so that the outer peripheral portion of the surface opposite to the surface facing the substrate to be joined is removed from the upper chuck 12. It is adsorbed and held on the upper chuck 12. When the adapter plate 114 is held by the upper chuck 12, air is exhausted through the recess 115 and the plurality of holes 116 by the central vacuum chuck pipe of the vacuum chuck pipe 33, thereby the plurality of holes 116. The chip 119 arranged in contact with the substrate is held. The adapter plate 114 is further formed with a notch or an orientation flat at the periphery. The chip 119 has an adhesive disposed on the surfaces to be joined. Examples of the adhesive include metal bumps and ultraviolet curable resins.

  The lamination bonding method executed using the lamination bonding apparatus 1 includes an operation for holding the substrate on the chuck, an operation for holding the chip on the arrangement plate, an operation for aligning the substrate, and an operation for bonding the substrate. .

  The operation of holding the substrate on the chuck includes the operation of holding the 8-inch substrate on the lower chuck 11, the operation of holding the 8-inch substrate on the upper chuck 12, the operation of holding the 2-inch substrate on the lower chuck 11, and the upper chuck. 12 to hold a 2-inch substrate.

  When the user holds the 8-inch substrate on the lower chuck 11, first, the projection 63 of the lower chuck 11 is inserted into the hole 58 of the jig 51 for lowering the 8-inch substrate, and the attachment surface 56 is attached to the attachment surface 56. The 8-inch substrate lower set jig 51 is attached to the lower chuck 11 by bringing the attachment surface 57 into close contact with the attachment surface 61. The user then places the 8 inch substrate in contact with the holding surface 60 of the lower chuck 11, and then the edge of the 8 inch substrate contacts the alignment surface 59 and the notch of the 8 inch substrate is aligned with the alignment portion 54. The 8-inch substrate is slid so as to contact the mark alignment surface. Next, the user holds the 8-inch substrate on the lower chuck 11 and removes the 8-inch substrate lower set jig 51 from the lower chuck 11.

  When the user holds the 8-inch substrate on the upper chuck 12, first, the protrusion 63 of the upper chuck 12 is inserted into the hole 78 of the upper jig 71 for setting the 8-inch substrate, and the mounting surface 76 is brought into close contact with the mounting surface 62. Then, the mounting surface 77 is brought into close contact with the mounting surface 61, thereby attaching the 8-inch substrate upper side setting jig 71 to the lower chuck 11. The user then places the 8-inch substrate in contact with the substrate support surface 81, and then the edge of the 8-inch substrate contacts the alignment surface 79 and the notch of the 8-inch substrate aligns with the mark alignment surface 86. Slide the 8-inch substrate. Next, the user uses the pressing drive device 5 to bring the lower chuck 11 closer to the upper chuck 12 and to hold the 8-inch substrate on the upper chuck 12 when the 8-inch substrate contacts the upper chuck 12. Next, the user removes the 8-inch substrate upper side setting jig 71 from the upper side chuck 12.

  When the user holds the 2-inch substrate on the lower chuck 11, first, the projection 63 of the lower chuck 11 is inserted into the hole of the jig 91 for setting the lower side of the 2-inch substrate, and the two attachment surfaces are attached to the attachment surface. The jig 91 for setting the lower side of the 2-inch substrate is attached to the lower chuck 11 by bringing it into close contact with 62 and the attachment surface 61. The user then places the 2 inch substrate in contact with the holding surface 60 of the lower chuck 11 and then the edge of the 2 inch substrate contacts the alignment surface of the alignment portion 93 and the orientation flat of the 2 inch substrate. The 2 inch substrate is slid so that is in contact with the mark alignment surface of the mark alignment portion 94. Next, the user holds the 8-inch substrate on the lower chuck 11 and removes the 2-inch substrate lower set jig 91 from the lower chuck 11.

  When the user holds the 2-inch substrate on the upper chuck 12, first, the protrusion 63 of the upper chuck 12 is inserted into the hole of the 2-inch substrate upper setting jig 101, and the two attachment surfaces are attached to the attachment surface 62. The 2-inch substrate upper set jig 101 is attached to the lower chuck 11 by being in close contact with the surface 61. The user then places the 2 inch substrate in contact with the substrate support surface, and then the edge of the 2 inch substrate contacts the alignment surface of the alignment portion 104 and the orientation flat of the 2 inch substrate aligns the mark alignment surface 108. The 2 inch substrate is slid so as to be aligned with each other. Next, the user brings the lower chuck 11 close to the upper chuck 12 by using the pressure contact driving device 5 and causes the upper chuck 12 to hold the 2-inch substrate when the 2-inch substrate contacts the upper chuck 12. Next, the user removes the 2-inch substrate upper side setting jig 101 from the upper side chuck 12.

  According to such an operation, the user can more easily hold the substrate at a predetermined position of the lower chuck 11 so that the alignment mark of the substrate is imaged by the alignment device 19. The substrate can be held more easily at a predetermined position. When holding the substrate on the upper chuck 12 after holding the substrate on the lower chuck 11, the 8-inch substrate upper set jig 71 or the 2-inch substrate upper set jig 101 is placed on the substrate of the lower chuck 11. It is possible to prevent the substrate of the lower chuck 11 from being damaged without contact.

  In the operation of holding the chip 119 on the placement plate 111, the user first holds the adapter plate 114 on the upper chuck 12 in the same manner as the operation of holding the substrate on the chuck. When the adapter plate 114 is held by the upper chuck 12, the user uses the central vacuum chuck pipe of the vacuum chuck pipe 33 to exhaust air through the recess 115 and the plurality of holes 116. The chip 119 disposed in contact with the hole 116 is held by the adapter plate 114. Next, the user causes the lower chuck 11 to hold the placement plate 111 by using an operation of holding the substrate by the chuck. After the user drops water droplets on the hydrophilic portions 113-1 to 113-n of the arrangement plate 111, the user stops the exhaust by the central vacuum chuck pipe of the vacuum chuck pipe 33 of the upper chuck 12, and the arrangement plate The chip 119 is dropped on the substrate 111. At this time, the tip 119 moves so as to coincide with the hydrophilic portions 113-1 to 113-n due to the surface tension of the water droplets, and after the water droplets are dried, the hydrophilic portions 113-1 to 113-n are highly accurate. Retained. The user removes the adapter plate 114 from the upper chuck 12 after the chip 119 is held on the placement plate 111. According to such an operation, the user does not need to place the chip directly on the placement plate 111 with high precision, and does not need to place the chip on the adapter plate 114 with high precision. The chip 119 can be more easily held at the position.

  The operation of aligning the substrate is performed after performing the operation of holding the substrate on the chuck. First, the control device 16 brings the lower chuck 11 closer to the upper chuck 12 to a predetermined distance by using the pressing drive device 5. The control device 16 drives the lens 44 using the lens driving device 42 so that the lens 44 is disposed inside the hole 36 of the upper chuck 12. The control device 16 irradiates the substrate held by the lower chuck 11 and the substrate held by the upper chuck 12 with infrared rays using the transmitted light illumination 41 or the coaxial incident illumination 45. The control device 16 images the substrate alignment mark held by the lower chuck 11 and the substrate alignment mark held by the upper chuck 12 in an image using the camera 43. At this time, the control device 16 focuses by driving the lens 44 using the lens driving device 42. The control device 16 uses the alignment drive device 8 so that the alignment mark of the substrate held by the lower chuck 11 and the alignment mark of the substrate held by the upper chuck 12 are projected onto the image. The side chuck 11 is driven.

  The operation of bonding the substrates is performed after the operation of aligning the substrates. First, the control device 16 drives the lens 44 using the lens driving device 42 so that the lens 44 is disposed outside the hole 36 of the upper chuck 12. The control device 16 heats the substrate held on the lower chuck 11 using the heater 25 and heats the substrate held on the upper chuck 12 using the heater 35. The control device 16 keeps the load cells 15-1 to 15-3 fully extended. Next, the control device 16 executes the operation in the first mode and the operation in the second mode.

  After the lens 44 is thus disposed outside the hole 36 of the upper chuck 12, the lens 44 is damaged by the heat by heating the lower chuck 11 or the substrate held by the upper chuck 12. It is prevented.

  The operation in the first mode is performed independently for each of the piezoelectric elements 14-1 to 14-3. FIG. 13 shows the operation of the first mode in the piezoelectric element 14-i. The control device 16 measures the force applied to the piezoelectric elements 14-1 to 14-3 using the load cells 15-1 to 15-3 (step S1). The control device 16 determines whether or not a portion of the substrate held by the lower chuck 11 that corresponds to the piezoelectric element 14-i is in contact with the substrate held by the upper chuck 12 (step S2). That is, the control device 16 determines whether or not the force applied to the piezoelectric element 14-i is greater than a predetermined force.

  The control device 16 applies a force applied to the piezoelectric element 14-i larger than a predetermined force (step S2, YES), and is applied to the piezoelectric element 14-j (j = 1, 2, 3; j ≠ i). When the force is smaller than the predetermined force (step S3, NO), the piezoelectric element 14-i is shortened by a predetermined length (step S4). The control device 16 repeatedly performs the operations of steps S1 to S3 until the total force applied to the piezoelectric elements 14-1 to 14-3 becomes larger than a predetermined force. When all of the forces applied to the piezoelectric elements 14-1 to 14-3 are larger than the predetermined force (step S3, YES), the control device 16 starts the operation in the second mode.

  FIG. 14 shows the operation in the second mode. The control device 16 measures the force applied to the piezoelectric elements 14-1 to 14-3 using the load cells 15-1 to 15-3 (step S11). The control device 16 drives the lower chuck 11 using the press contact driving device 5 so that the sum of the three measured forces becomes a predetermined value (step S12). The control device 16 expands and contracts the piezoelectric element 14-1 so that the force applied to the piezoelectric element 14-1 is 1/3 of the predetermined force (step S13). The control device 16 expands and contracts the piezoelectric element 14-2 so that the force applied to the piezoelectric element 14-2 becomes 1/3 of the predetermined force (step S14). The control device 16 expands and contracts the piezoelectric element 14-3 so that the force applied to the piezoelectric element 14-3 is 1/3 of the predetermined force (step S15). The control device 16 repeatedly executes the operations of steps S11 to S15 until the time when the sum of the three measured forces reaches a predetermined value exceeds a predetermined time. When the operation of the second mode is completed, the control device 16 causes the nitrogen gas to flow through the cooling pipe 24 so as to cool to a predetermined temperature, and separates the lower chuck 11 from the upper chuck 12 to a predetermined distance.

  According to such an operation, the substrate held by the lower chuck 11 and the substrate held by the upper chuck 12 are bonded by the adhesive, and one bonded substrate is generated. According to such cooling, the bonded substrate can be taken out from the lower chuck 11 or the upper chuck 12 earlier than cooling by cooling, and a plurality of pairs of bonding target substrates can be bonded faster. it can.

  The substrate held by the lower chuck 11 or the upper chuck 12 can be replaced with another substrate that does not include the adapter plate 111. As the substrate, a substrate in which a plurality of patterns respectively formed on a plurality of MEMS are formed on one semiconductor wafer is exemplified. At this time, the multi-layer bonding apparatus 1 can be bonded with high accuracy in the same manner as the substrate including the adapter plate 111. The multi-layer bonding apparatus 1 is a case where some of the plurality of patterns formed on the semiconductor wafer are defective, and when the semiconductor wafer is bonded, it may adversely affect other good patterns. is there. In the case of using the adapter plate 111, the multi-layer bonding apparatus 1 can remove and bond the defective chips when the plurality of chips 119 include defective chips, and all of the plurality of chips 119 can be joined. Therefore, it is possible to join the plurality of chips 119 more efficiently.

FIG. 1 is a cross-sectional view showing an embodiment of a multilayer bonding apparatus according to the present invention. FIG. 2 is a cross-sectional view showing the alignment apparatus, showing the lower chuck and the upper chuck. FIG. 3 is a perspective view showing an 8-inch substrate lower set jig. FIG. 4 is a cross-sectional view showing an 8-inch substrate lower set jig. FIG. 5 is a perspective view showing an 8-inch substrate upper side setting jig. FIG. 6 is a cross-sectional view showing an 8-inch substrate upper side setting jig. FIG. 7 is a perspective view showing an 8-inch substrate upper side setting jig on which a substrate is set. FIG. 8 is a perspective view showing a jig for setting the lower side of the 2-inch substrate. FIG. 9 is a perspective view showing a 2-inch substrate upper side setting jig. FIG. 10 is a perspective view showing a 2-inch substrate upper side setting jig on which the substrate is set. FIG. 11 is a plan view showing an arrangement plate. FIG. 12 is a cross-sectional view showing the adapter plate. FIG. 13 is a flowchart showing the operation in the first mode. FIG. 14 is a flowchart showing the operation in the second mode.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1: Lamination joining apparatus 2: Stand 3: Base 5: Pressure-contact drive device 6: Stage 7: Leaf spring 8: Alignment drive device 10: Bottom plate 11: Lower chuck 12: Upper chuck 14-1 to 14-3: Piezoelectric elements 15-1 to 15-3: Load cell 16: Control device 19: Alignment device 21: Support side portion 22: Substrate side portion 23: Vacuum chuck piping 24: Cooling piping 25: Heater 26: Hole 31: Support side Portion 32: Substrate side portion 33: Vacuum chuck piping 34: Cooling piping 35: Heater 36: Hole 41: Transmitted light illumination 42: Lens drive device 43: Camera 44: Lens 45: Coaxial illumination 50: Substrate 51: Inch substrate lower side setting jig 52: support portion 53: alignment portion 54: alignment portion 55: handle 56: mounting surface 57: Mounting surface 58: Hole 59: Positioning surface 60: Holding surface 61: Mounting surface 62: Mounting surface 63: Projection 70: Board 71: Inch board upper side setting jig 72: Support part 73: Base part 74: Positioning Portion 75: Marking portion 76: Mounting surface 77: Mounting surface 78: Hole 79: Positioning surface 80: Hole 81: Substrate supporting surface 83: Portion 84: Supporting portion 85: Notch 86: Marking surface 90: Substrate 91: Inch substrate lower set jig 92: Support portion 93: Position alignment portion 94: Mark alignment portion 95: Handle 100: Substrate 101: Inch substrate upper side set jig 102: Support portion 103: Base portion 104: Position alignment portion 105: Mark alignment portion 108: Mark alignment surface 111: Placement plate 112: Hydrophobic portion 11 3-1 to 113-n: hydrophilic portion 114: adapter plate 115: depression 116: plural holes 119: chip

Claims (4)

A support portion on which a chuck contact surface that contacts a chuck that holds a bonding target substrate is formed;
An alignment portion where an alignment surface is formed in contact with the edge of the alignment target substrate ;
A pedestal portion on which a support surface for supporting the alignment target substrate is formed in contact with a part of the surface of the alignment target substrate facing the chuck ;
The chuck has a first fitting portion formed on a surface that contacts the chuck contact surface,
The support part has a second fitting part that fits into the first fitting part formed on the chuck contact surface ,
The supporting portion is a jig for a laminating and bonding apparatus that supports the pedestal portion so as not to contact the chuck . In claim 1 ,
The jig | tool for lamination | stacking joining apparatuses which further comprises the alignment part support part which supports the said alignment part so that movement with respect to the said support part is possible. In claim 2 ,
The alignment portion support portion is formed of an elastic body having one end bonded to the support portion and the other end bonded to the alignment portion. In any one of Claims 1-3 .
A jig for a laminating and bonding apparatus, further comprising a mark aligning portion on which a mark aligning surface aligned with a mark formed on the edge when the alignment target substrate is disposed at a predetermined position .

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