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JP4197985B2 - Electronic equipment housing - Google Patents

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Publication number
JP4197985B2
JP4197985B2 JP2003127441A JP2003127441A JP4197985B2 JP 4197985 B2 JP4197985 B2 JP 4197985B2 JP 2003127441 A JP2003127441 A JP 2003127441A JP 2003127441 A JP2003127441 A JP 2003127441A JP 4197985 B2 JP4197985 B2 JP 4197985B2
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JP
Japan
Prior art keywords
case
case body
main body
electronic device
frequency unit
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JP2003127441A
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Japanese (ja)
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JP2004335617A (en
Inventor
久和 大野
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Maspro Denkoh Corp
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Maspro Denkoh Corp
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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は,筐体内に収納したケース本体に電子回路を複数の独立ブロックで構成して組込んだ電子機器筐体において,上記ブロックに収納された電子部品のイミュニティーを向上させると共に,放熱を効率化する電子機器筐体に関する。
【0002】
【従来の技術】
従来の電子機器筐体においては,シールド構造の金属製材料で形成された内ケースの中に,増幅回路や周波数変換回路などが内蔵された高周波ユニットをケース本体に収納させている。この高周波ユニットはケース背面壁の内側に取付けネジ等によって取付けられている。この方法には,上記内ケースを,プリント基板と,そのプリント基板を前面から覆って本体ケースの底面に固定するように構成した方法(例えば,特許文献1参照)や,
内ケースには,プリント基板の裏側(アース面側)にも金属製材料で形成された蓋体を備えさせた高周波ユニットを,本体ケースの底面に固定する方法がある。(例えば,特許文献2参照)
【0003】
【特許文献1】
特開平2001−111273号公報
【特許文献2】
特開平7−288389号公報
【0004】
【発明が解決しようとする課題】
ところが,こうした高周波機器は小型で軽量な取付け性の良いものが求められると共に,テレビ受信機器に代表される高周波機器のように,伝送周波数帯域の広帯域化が必要となってきた。例えば従来のVHF,UHF放送からBS・110°CSデジタル放送までを,一本の同軸ケーブルで宅内に引き込もうとする場合,70〜2600MHzの周波数帯域を伝送したり,増幅したりする必要がある。更に上記BS・110°CSデジタル放送や,新しく始まるUHF帯を利用した地上波デジタル放送は,変調方式がデジタルであるため,妨害波があると受信映像に障害が発生する問題がある。このため電子機器筐体のケース本体に取付けられるシールドケースのイミュニティーを良くする必要があった。
しかし,従来の電子機器筐体のように,高周波ユニットをケース本体に取付けるに当たって,参考文献1に示すような,ケース本体の底面側を開放した内ケースでもってシールドする方法は,内ケースをケース本体の底面に固定する係止部が設けられる箇所が限られてくるので,ケース本体と内ケースとの間のシールド特性が良くないと言った問題が有った。
更に,参考文献2に示すような,プリント基板の表面側も裏面側もシールドされた内ケースを,アルミダイキャスト等でできたケース本体に固定する方法では,上記内ケースをケース本体の底面の内側に固定するために,上記内ケースの外周面等を利用して固定部等をもうける必要があった。こうした固定部は内ケースに一体的に形成するのが一般的であり,この結果,内ケースには数箇所の透孔ができることになり,これらによってシールド性が劣化する問題があった。
また,参考文献1に示すような例で電子機器筐体を作ると,プリント基板とケース本体の底面との間に設けた空間が大きいので,プリント基板に装着された電子部品から発生する熱に対する放熱効果は大きいものの,電子機器筐体の外形寸法が大きくなると言った問題もあった。
そこで本発明においては,上記従来の技術の問題点を解決するためになされたものであり,
その目的は,屋外用にも屋内用にも使用可能な電子機器筐体を提供することにある。
他の目的は,屋外用にも屋内用にも使用可能で,イミュニティーの良い電子機器筐体を提供することにある。
他の目的は,電子回路を複数の独立ブロックで構成し,夫々のブロック間をシールドして組み込んだケース本体と,当該ケース本体を収納するカバーとからなる,屋外用にも屋内用にも使用可能な電子機器筐体を提供することにある。
他の目的は,電子回路を複数の独立ブロックで構成し,夫々のブロック間をシールドして組み込んだケース本体と,当該ケース本体を収納するカバーとからなり,ケース本体とブロックとの間に空間を備えた,屋外用にも屋内用にも使用可能な電子機器筐体を提供することにある。
他の目的は,屋外用にも屋内用にも使用可能で,小型で且つ放熱効果の良い電子機器筐体を提供することにある。
【0005】
【課題を解決するための手段】
上記課題を解決するために,請求項1の発明は信号処理装置の電子回路を複数の独立ブロックで構成し,夫々のブロック間をシールドして組み込んだケース本体と,当該ケース本体を収納するカバーとからなる電子機器筐体において,当該電子機器筐体の取付け面を底面とした場合,ケース本体の一側面側に複数の接続端子を敷設するよう構成され,上記各ブロックは,当該ケース本体と係止手段によって係止されると共に,当該係止手段部分以外はケース本体の底面,上面及び上記一側面以外の側面との間に空間を備えるように構成される。
【0006】
【発明の実施の形態】
以下に,本発明を具体化した実施形態の例を,図面を基に詳細に説明する。
図1は本発明の電子機器筐体を構成するケース本体と当該ケース本体に収納する電子回路ブロックの配置を示す,取付け面を底面とした分解斜視図である。図2は電子回路ブロックを収納したケース本体の上面図であり,一部を破断した図面である。図3は図2における破断部分の拡大詳細図である。図4は本発明の電子機器筐体の外観図であり,(a)は上面図,(b)は側面図である。図5は図4のA−A線一部断面図である。
【0007】
図1において51はケース本体であり,取付け面を底面として表示してある。ケース本体51は金属製材料によって図に示すように箱状に形成されており,前面51a側には入力端子2,電源供給端子4,出力端子3が敷設されている。
60,61,62は電子回路を収納した高周波ユニットであり,当該高周波ユニットは上記ケース本体にネジ54,54…でもって側面51b,51bに固着される。
70は電子回路が形成されたプリント基板であって,17c,30は電子部品の一部を示す。当該プリント基板70は上記ケース本体51の固着部56,56…にネジ70a,70a…でもって固着される。そして,接続端子2,4,3の中心導体と上記プリント基板の信号線とは接続される。
52は表示板であって,ケース本体の固着部57にネジ52a,52aでもって固着される。この時,表示板52には,プリント基板に載置された,例えば利得調整回路の調整手段である可変減衰器17cの操作部,スイッチ30等の操作部と相対抗した位置に操作窓52b,52cが形成され,当該操作窓52b,52cから,調整や切替が自在となるように形成されている。
【0008】
このように高周波ユニット等が収納されたケース本体51は,図4,5に示すように筐体50に収納され,ネジ50b,50b…でもって固着される。筐体50は取付け面50aを底面とすると,この筐体50の前面側と上面側の一部が開放された,金属製材料でもって箱状に形成されている。即ち,ケース本体51を収納すると,接続端子2,4,3が敷設されている前面51aと上記表示板52とが,上記開放部において表出されるように構成されている。更に,上記表示板52と相対抗する位置には,上記筐体50に開閉自在に蝶着された蓋体53が備えられており,取付け作業や取付後の調整時には,その作業を容易に行えるようにすると共に,作業完了時には防滴,防塵構造となる電子機器筐体1を構成している。
【0009】
次に,ケース本体51への高周波ユニットの収納について図3,4,5を用いて説明する。この高周波ユニットは本発明の実施例では3つ収納されている。この高周波ユニットは,例えばチューナー部であったり,変調部であったり,信号処理部であったり,その構成は問わない。また,本説明及び図においては,高周波ユニット間の接続についての詳細説明は省略する。
先ず,高周波ユニット62,61とケース本体とを係止手段65にネジ54,54…で固着する。更に,高周波ユニット61の上方側には高周波ユニット60を固着する。
【0010】
係止手段65の詳細について説明する。係止手段65はケース本体51の係止部65aと高周波ユニットの係止部65bとからなる。係止部65aはケース本体51の側面51bに,上記高周波ユニットの収納状態に応じて形成される。また,高周波ユニットの外周部には,上記ケース本体の側面51bに形成された係止部65aに相対抗する位置に係止部65bを形成されている。
係止部65aは,略中心に透孔66を備えた凹部67が形成されている。透孔66には止着ネジ54を挿通するのであるが,凹部67は,上記透孔66に止着ネジ54を取付けたときに,そのネジ頭が側面51bより外側に突出しない寸法になるように形成されている。
係止部65bは,略中央に雌ネジを形成したネジ孔63を備えた凸部64が形成されており,このネジ孔63と止着ネジ54とでもってケース本体51に高周波ユニット60,61,62を収納するのである。図2にはドライバー69等の工具を使って締付ける場合の図面を示す。60aは高周波ユニット60に収納された電子回路を形成したプリント基板である。
【0011】
この様に,高周波ユニットの収納が済んだなら,次に,プリント基板70を設置する。このプリント基板は,上記高周波ユニットをコントロールしたり,接続端子2,4,3を介して外部との信号を送受したりするよう構成されており,必用に応じて,プリント基板全体を金属製材料形成したケースでもってシールドしたり,シールドの必要な部分だけにシールドケースを備えさせたりしても良い。
このプリント基板70は止着ネジ70a,70a…でもって固着部56,56…に固着される。
【0012】
次に,プリント基板の上部には,樹脂製材料などで形成された表示板52を固着する。表示板52には上記プリント基板70に備えられた可変減衰器17cやスイッチ30等の操作部と相対抗する位置に操作窓52b,52cが備えさせてある。そして,当該操作窓52b,52cの周辺には,調整や切替にかかる説明が記されている。
【0013】
このように組立てられたケース本体51の,図4のA-A線における一部破断断面図を図5に示す。本発明においては,電子回路を独立ブロック60,61,62で構成し,夫々のブロック間をシールドして組み込んだケース本体51と,当該ケース本体51を収納する筐体50とでもって電子機器筐体1を構成している。そして,上記筐体50の取付け面を底面50aとした場合,ケース本体51の前面51a側に入力端子2,電源供給端子4,出力端子3の接続端子を敷設するよう構成され,上記前面51aの近傍であって,ケース本体51の上面方向に向かって,上記高周波ユニットをコントロールしたり,切替えたりできるような調整手段や,外部との接続端子がまとめられて配置させてあり,更には接続工事や調整等を容易に行うようにすると共に,設置後の防水・防滴・防塵のために,接続端子や調整手段を覆うように蓋体53が備えさせてある電子機器筐体1において,上記各ブロック60,61,62は,当該ケース本体51と係止手段65によって係止されると共に,当該係止手段部分65以外はケース本体51の底面,上面及び上記一側面51a以外の側面との間に空間を備えさせてあるように構成されている。
【0014】
高周波ユニット60,61,62とケース本体51の側面,底面との空間の寸法は図2,3,5に示すように,係止手段を除いてW1,W2,W3,W4となるように構成されている。
この空間は,夫々の高周波ユニットに収納されたプリント基板とケース本体の側面及び底面との間に設けた空間となって,プリント基板に装着された電子部品から発生する熱に対する放熱効果を持たせるも為のものである。
更には,高周波ユニットの構成において表面に突起物があっても取付けに支障が出ないような構造になっている。
尚,W1,W2,W3,W4は夫々等しい長さでも良いし,夫々異なる長さとなるように配置しても良い。
【0015】
高周波ユニットの側面に形成した係止部65bの凸部64と,ケース本体に形成した係止部65aの凹部67とは,相対抗して接する構成されており,ネジ54でもって締付けることで,上記凸部64と凹部67とが面で密着固定される。この結果,高周波ユニット60,61,62はシールド性を損なわれること無く,ケース本体51に固定されるのである。
尚,上記の凸部64,凹部67の形状は本発明の実施例に限定されるものではない。また,上記凸部64の外面側と上記凹部67の内面側に,ローレットを形成することで,より高周波信号に対するシールド性を向上させるよう構成しても良い。
【0016】
【発明の効果】
以上詳述したように,請求項1の発明によれば,電子回路を複数の独立ブロックで構成し,夫々のブロック間をシールドして組み込んだケース本体と,当該ケース本体を収納するカバーとからなる電子機器筐体において,当該電子機器筐体の取付け面を底面とした場合,ケース本体の一側面側に複数の接続端子を敷設するよう構成され,上記各ブロックは,当該ケース本体と係止手段によって係止されると共に,当該係止手段部分以外はケース本体の底面,上面及び上記一側面以外の側面との間に空間を備えたので,各ブロック,即ち増幅部,変調部,信号処理部等のような高周波ユニットの外周面には,高周波信号が漏れるような透孔が形成されずに,ケース本体と係止手段を介して密着固定されるのでイミュニティーの良い電子機器筐体が提供できる。また,ケース本体の側面及び底面と上記高周波ユニットとの間に空間を有する配置の構成としたので,結局,高周波ユニットとケース本体との間に空間が生じることになり,プリント基板に装着された電子部品による発熱を効率よく放熱できる放熱効果の高い,屋外と屋内の2様に使用できる筐体を備えた電子機器筐体を提供できるのである。
【図面の簡単な説明】
【図1】本発明の電子機器筐体を構成するケース本体と当該ケース本体に収納する電子回路ブロックの配置を示す,取付け面を底面とした分解斜視図である。
【図2】電子回路ブロックを収納したケース本体の上面図であり,一部を破断した図面である。
【図3】図2における破断部分の拡大詳細図である。
【図4】本発明の電子機器筐体の外観図であり,(a)上面図,(b)は側面図である。
【図5】図4のA−A線一部断面図である。
【符号の説明】
1…電子機器筐体,2…入力端子,3…出力端子,4…電源供給端子,17c…可変減衰器,30…スイッチ,50…筐体,50a…取付け面(底面),51…ケース本体,51a…前面,51b…側面,52…表示板,52a…ネジ,52b,52c…操作窓,53…蓋体,54…ネジ,56…固着部,57…固着部,60,61,62…高周波ユニット,63…ネジ孔,64…凸部,65…係止手段,65a…ケース本体の係止部,65b…高周波ユニットの係止部,66…透孔,67…凹部,69…工具,70…プリント基板,70a…ネジ,W1,W2,W3,W4…空間。
[0001]
BACKGROUND OF THE INVENTION
The present invention improves the immunity of the electronic components housed in the block and improves the heat dissipation efficiency in an electronic device housing in which an electronic circuit is built in a plurality of independent blocks in a case body housed in the housing. The present invention relates to an electronic device casing.
[0002]
[Prior art]
In a conventional electronic device casing, a high-frequency unit containing an amplifier circuit, a frequency conversion circuit, and the like is housed in a case body in an inner case formed of a shield-structured metal material. This high-frequency unit is attached to the inside of the back wall of the case with attachment screws or the like. In this method, the inner case is a printed circuit board, a method in which the printed circuit board is covered from the front surface and fixed to the bottom surface of the main body case (for example, see Patent Document 1),
For the inner case, there is a method in which a high-frequency unit having a lid formed of a metal material on the back side (ground side) of the printed board is fixed to the bottom surface of the main body case. (For example, see Patent Document 2)
[0003]
[Patent Document 1]
Japanese Patent Laid-Open No. 2001-111273 [Patent Document 2]
JP-A-7-288389 [0004]
[Problems to be solved by the invention]
However, such high-frequency devices are required to be small, light, and easy to install, and it has become necessary to widen the transmission frequency band like high-frequency devices typified by television receivers. For example, when the conventional VHF and UHF broadcasts to BS · 110 ° CS digital broadcasts are to be drawn into a house with a single coaxial cable, it is necessary to transmit or amplify the frequency band of 70 to 2600 MHz. Furthermore, the BS / 110 ° CS digital broadcast and the terrestrial digital broadcast using the newly started UHF band have a problem that a received video is disturbed if there is an interference wave because the modulation method is digital. Therefore, it is necessary to improve the immunity of the shield case attached to the case body of the electronic device casing.
However, when a high frequency unit is attached to the case body as in the case of a conventional electronic device casing, as shown in Reference 1, the method of shielding with the inner case with the bottom side of the case body opened is the case where the inner case is shielded. There is a problem that the shielding property between the case body and the inner case is not good because the place where the locking part for fixing to the bottom surface of the body is provided is limited.
Furthermore, in the method of fixing the inner case shielded on both the front side and the back side of the printed circuit board as shown in Reference Document 2 to the case body made of aluminum die cast or the like, the inner case is attached to the bottom surface of the case body. In order to fix the inner side, it is necessary to provide a fixing part or the like using the outer peripheral surface of the inner case. Such a fixing portion is generally formed integrally with the inner case, and as a result, several holes are formed in the inner case, which causes a problem that the shielding performance deteriorates.
Also, when an electronic device casing is made in the example shown in Reference 1, the space provided between the printed circuit board and the bottom surface of the case body is large, so that the heat generated from the electronic components mounted on the printed circuit board can be reduced. Although the heat dissipation effect was great, there was also a problem that the external dimensions of the electronic equipment casing were large.
Therefore, the present invention has been made to solve the above-mentioned problems of the prior art,
The purpose is to provide an electronic equipment housing that can be used both outdoors and indoors.
Another object is to provide an electronic device housing that can be used both outdoors and indoors and has good immunity.
Another purpose is to use both outdoor and indoor equipment, which consists of a case body that consists of a plurality of independent blocks, each block is shielded and incorporated, and a cover that houses the case body. It is to provide a possible electronic device casing.
Another object is that the electronic circuit is composed of a plurality of independent blocks, each of which includes a case body that is shielded and incorporated, and a cover that houses the case body, and a space between the case body and the block. It is to provide an electronic device housing that can be used both outdoors and indoors.
Another object is to provide an electronic device housing that can be used both outdoors and indoors, is small and has a good heat dissipation effect.
[0005]
[Means for Solving the Problems]
In order to solve the above problems, the invention of claim 1 is a case main body in which an electronic circuit of a signal processing device is constituted by a plurality of independent blocks and each block is shielded, and a cover for housing the case main body. When the mounting surface of the electronic device casing is a bottom surface, a plurality of connection terminals are laid on one side of the case body, and each of the blocks is connected to the case body. While being locked by the locking means, a space is provided between the bottom surface, the top surface, and the side surface other than the one side surface of the case body except for the locking means portion.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an example of an embodiment embodying the present invention will be described in detail with reference to the drawings.
FIG. 1 is an exploded perspective view showing the arrangement of a case main body and an electronic circuit block housed in the case main body constituting the electronic device casing of the present invention, with the mounting surface as the bottom surface. FIG. 2 is a top view of the case main body containing the electronic circuit block, and is a partially broken view. FIG. 3 is an enlarged detail view of a broken portion in FIG. 4A and 4B are external views of the electronic device casing of the present invention, in which FIG. 4A is a top view and FIG. 4B is a side view. 5 is a partial cross-sectional view taken along line AA of FIG.
[0007]
In FIG. 1, 51 is a case main body, and the mounting surface is displayed as a bottom surface. The case body 51 is formed in a box shape as shown in the figure by a metal material, and the input terminal 2, the power supply terminal 4, and the output terminal 3 are laid on the front surface 51a side.
Reference numerals 60, 61, and 62 denote high-frequency units that house electronic circuits, and the high-frequency units are fixed to the side surfaces 51b and 51b with screws 54, 54.
Reference numeral 70 denotes a printed circuit board on which an electronic circuit is formed, and 17c and 30 denote a part of electronic components. The printed circuit board 70 is fixed to the fixing portions 56, 56... Of the case body 51 with screws 70a, 70a. The central conductors of the connection terminals 2, 4 and 3 are connected to the signal line of the printed circuit board.
Reference numeral 52 denotes a display plate, which is fixed to the fixing portion 57 of the case body with screws 52a and 52a. At this time, on the display board 52, the operation window 52b, which is placed on the printed board, for example, at a position opposed to the operation unit of the variable attenuator 17c, which is an adjustment unit of the gain adjustment circuit, and the operation unit such as the switch 30. 52c is formed so that adjustment and switching can be freely performed from the operation windows 52b and 52c.
[0008]
As shown in FIGS. 4 and 5, the case main body 51 in which the high-frequency unit and the like are housed in this way is housed in the housing 50 and fixed with screws 50b, 50b. When the mounting surface 50a is the bottom surface, the housing 50 is formed in a box shape with a metal material in which a part of the front surface side and the upper surface side of the housing 50 is opened. That is, when the case main body 51 is housed, the front surface 51a on which the connection terminals 2, 4, and 3 are laid and the display plate 52 are exposed at the open portion. Further, a lid 53 hinged to the casing 50 so as to be openable and closable is provided at a position opposed to the display plate 52, so that the work can be easily performed at the time of attachment work or adjustment after attachment. In addition, the electronic device casing 1 is configured to have a drip-proof and dust-proof structure when the work is completed.
[0009]
Next, storage of the high-frequency unit in the case main body 51 will be described with reference to FIGS. Three high-frequency units are accommodated in the embodiment of the present invention. The high frequency unit may be, for example, a tuner unit, a modulation unit, a signal processing unit, or any other configuration. Further, in this description and the drawings, detailed description of the connection between the high frequency units is omitted.
First, the high frequency units 62 and 61 and the case main body are fixed to the locking means 65 with screws 54, 54. Further, the high frequency unit 60 is fixed to the upper side of the high frequency unit 61.
[0010]
Details of the locking means 65 will be described. The locking means 65 includes a locking portion 65a of the case body 51 and a locking portion 65b of the high frequency unit. The locking portion 65a is formed on the side surface 51b of the case body 51 according to the storage state of the high-frequency unit. Further, a locking portion 65b is formed on the outer peripheral portion of the high-frequency unit at a position opposed to the locking portion 65a formed on the side surface 51b of the case body.
The locking portion 65a is formed with a concave portion 67 having a through hole 66 at substantially the center. The fixing screw 54 is inserted into the through hole 66, but the recess 67 has a size such that the screw head does not protrude outward from the side surface 51b when the fixing screw 54 is attached to the through hole 66. Is formed.
The locking portion 65b is formed with a convex portion 64 having a screw hole 63 formed with a female screw in a substantially central portion. The high frequency units 60 and 61 are attached to the case body 51 with the screw hole 63 and the fixing screw 54. 62 are accommodated. FIG. 2 shows a drawing when tightening with a tool such as a screwdriver 69. Reference numeral 60a denotes a printed circuit board on which an electronic circuit housed in the high frequency unit 60 is formed.
[0011]
After the high-frequency unit is stored in this way, the printed circuit board 70 is installed next. This printed circuit board is configured to control the above high-frequency unit and send / receive signals to / from the outside via the connection terminals 2, 4 and 3. The entire printed circuit board is made of a metal material as required. Shielding may be performed with a formed case, or a shielding case may be provided only on a necessary part of the shielding.
This printed circuit board 70 is fixed to the fixing portions 56, 56... With fixing screws 70a, 70a.
[0012]
Next, a display board 52 formed of a resin material or the like is fixed to the upper part of the printed board. The display board 52 is provided with operation windows 52b and 52c at positions opposed to operation parts such as the variable attenuator 17c and the switch 30 provided on the printed circuit board 70. In the vicinity of the operation windows 52b and 52c, explanations relating to adjustment and switching are described.
[0013]
FIG. 5 shows a partially broken cross-sectional view of the case body 51 assembled in this way, taken along line AA in FIG. In the present invention, the electronic circuit is composed of independent blocks 60, 61, 62, and a case main body 51 in which the respective blocks are shielded and incorporated, and a casing 50 for housing the case main body 51, are included in the electronic equipment casing. The body 1 is constituted. When the mounting surface of the casing 50 is the bottom surface 50a, the connection terminal of the input terminal 2, the power supply terminal 4, and the output terminal 3 is laid on the front surface 51a side of the case body 51, and the front surface 51a Adjustment means that can control and switch the high-frequency unit toward the upper surface of the case main body 51, and connection terminals to the outside are arranged together and are further connected. In the electronic device housing 1 in which the lid 53 is provided so as to cover the connection terminal and the adjusting means for easy waterproofing, drip-proofing and dust-proofing after installation. Each block 60, 61, 62 is locked by the case body 51 and the locking means 65, and except for the locking means portion 65, the bottom surface, the top surface, and the one side surface 5 of the case main body 51. It is configured to are allowed provided the space between the side surface other than a.
[0014]
As shown in FIGS. 2, 3, and 5, the dimensions of the space between the high-frequency units 60, 61, 62 and the case main body 51 are W1, W2, W3, and W4 except for the locking means. Has been.
This space is a space provided between the printed circuit board housed in each high-frequency unit and the side and bottom surfaces of the case body, and has a heat dissipation effect for heat generated from electronic components mounted on the printed circuit board. It is also for money.
Furthermore, the structure of the high-frequency unit is such that mounting is not hindered even if there are protrusions on the surface.
W1, W2, W3, and W4 may have the same length, or may be arranged to have different lengths.
[0015]
The convex portion 64 of the locking portion 65b formed on the side surface of the high-frequency unit and the concave portion 67 of the locking portion 65a formed on the case body are configured to contact each other and are tightened with screws 54, The convex part 64 and the concave part 67 are closely fixed on the surface. As a result, the high-frequency units 60, 61, 62 are fixed to the case body 51 without impairing the shielding performance.
The shapes of the convex portions 64 and the concave portions 67 are not limited to the embodiments of the present invention. Further, a knurl may be formed on the outer surface side of the convex portion 64 and the inner surface side of the concave portion 67 so as to improve the shielding performance against high frequency signals.
[0016]
【The invention's effect】
As described above in detail, according to the first aspect of the present invention, the electronic circuit is constituted by a plurality of independent blocks, each of the blocks being shielded and incorporated, and the cover for housing the case body. When the mounting surface of the electronic device casing is a bottom surface, a plurality of connection terminals are laid on one side of the case body, and each block is engaged with the case body. Since there is a space between the bottom surface of the case body, the top surface, and the side surface other than the one side surface except for the locking means portion, each block, that is, the amplification unit, the modulation unit, and the signal processing is provided. Electronic device casing with good immunity, because the outer peripheral surface of the high-frequency unit such as a part is not closely formed with a through hole through which high-frequency signals leak, but is tightly fixed via the case body and the locking means It can be provided. In addition, since the arrangement has a space between the side surface and bottom surface of the case main body and the high frequency unit, a space is eventually formed between the high frequency unit and the case main body, and is attached to the printed circuit board. It is possible to provide an electronic device casing having a casing that can be used both outdoors and indoors with high heat dissipation effect that can efficiently dissipate heat generated by electronic components.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a case main body constituting an electronic device housing of the present invention and an arrangement of electronic circuit blocks housed in the case main body with an attachment surface as a bottom surface.
FIG. 2 is a top view of a case body housing an electronic circuit block, with a part thereof broken away.
FIG. 3 is an enlarged detail view of a broken portion in FIG. 2;
4A and 4B are external views of the electronic device casing of the present invention, where FIG. 4A is a top view and FIG. 4B is a side view.
5 is a partial cross-sectional view taken along line AA in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Electronic device housing, 2 ... Input terminal, 3 ... Output terminal, 4 ... Power supply terminal, 17c ... Variable attenuator, 30 ... Switch, 50 ... Housing, 50a ... Mounting surface (bottom surface), 51 ... Case body , 51a ... front face, 51b ... side face, 52 ... display board, 52a ... screw, 52b, 52c ... operation window, 53 ... lid, 54 ... screw, 56 ... fixing part, 57 ... fixing part, 60, 61, 62 ... High frequency unit 63 ... Screw hole 64 ... Protruding part 65 ... Locking means 65a ... Locking part of case main body 65b ... Locking part of high frequency unit 66 ... Through hole 67 ... Recessed part 69 ... Tool, 70 ... Printed circuit board, 70a ... Screw, W1, W2, W3, W4 ... Space.

Claims (1)

電子回路を複数の独立ブロックで構成し,夫々のブロック間をシールドして組み込んだケース本体と,当該ケース本体を収納するカバーとからなる電子機器筐体において,
当該電子機器筐体の取付け面を底面とした場合,ケース本体の一側面側に複数の接続端子を敷設するよう構成され,
上記各ブロックは,当該ケース本体と係止手段によって係止されると共に,当該係止手段部分以外はケース本体の底面,上面及び上記一側面以外の側面との間に空間を備えたことを特徴とした電子機器筐体。
In an electronic equipment housing comprising an electronic circuit composed of a plurality of independent blocks, a case main body in which each block is shielded and incorporated, and a cover for housing the case main body.
When the mounting surface of the electronic device casing is a bottom surface, a plurality of connection terminals are laid on one side of the case body.
Each of the blocks is locked by the case body and locking means, and a space is provided between the bottom surface, the top surface, and the side surface other than the one side surface of the case body except for the locking means portion. Electronic equipment housing.
JP2003127441A 2003-05-02 2003-05-02 Electronic equipment housing Expired - Fee Related JP4197985B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003127441A JP4197985B2 (en) 2003-05-02 2003-05-02 Electronic equipment housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003127441A JP4197985B2 (en) 2003-05-02 2003-05-02 Electronic equipment housing

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Publication Number Publication Date
JP2004335617A JP2004335617A (en) 2004-11-25
JP4197985B2 true JP4197985B2 (en) 2008-12-17

Family

ID=33503993

Family Applications (1)

Application Number Title Priority Date Filing Date
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