JP4194227B2 - Electronic component thermocompression bonding equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an improvement in a thermocompression bonding apparatus for electronic components suitable for thermocompression bonding of electronic components onto a substrate such as a flat panel display represented by a liquid crystal panel via an anisotropic conductive tape (film). .
[0002]
[Prior art]
In recent years, research and development of electronic devices has been remarkable, and in combination with the advancement and development of information technology (IT) via networks, a wide variety of model products have been provided.
[0003]
In particular, the spread of mobile communication devices equipped with computers has become widespread due to the reduction in size and size of electronic devices associated with research and development of semiconductor technology.
[0004]
In television receivers and the like, high-definition, thin, and large-screen display devices have been adopted in place of color CRTs due to advances in liquid crystal panel manufacturing technology and the like.
[0005]
In a liquid crystal panel, a plurality of electronic components such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuit) are sequentially placed on an electrode portion of a glass substrate via an adhesive such as an anisotropic conductive tape (film). Further, it is manufactured by being fixedly mounted by means of main pressure bonding in which a plurality of electronic parts are shared by a thermocompression bonding head.
[0006]
FIG. 3 is a perspective view of a principal part showing a schematic configuration of a conventional thermocompression bonding apparatus that performs main pressure bonding on a plurality of electronic components. A (liquid crystal glass) substrate 2 is placed on an XY-θ table 1. A plurality of electronic components 3 are preliminarily pressure-bonded on the electrode portions.
[0007]
A thermocompression bonding tool 4 for final pressure bonding is connected to a plunger of a vertical movement cylinder (not shown) on the substrate 2 which is transported and positioned by the XY-θ table 1, and is moved in a vertical direction to be temporarily pressure bonded. These electronic components 3 are configured to be finally crimped simultaneously.
[0008]
The thermocompression bonding tool 4 is fixed as shown in the enlarged front view of FIG. 4 (a) and the enlarged cross-sectional view of FIG. 4 (b) viewed from the AA line of FIG. 4 (a). A stainless steel heat block 42 is connected to the block 41 by a number of fixing screws 43 a, and a thermocompression bonding head 44 is fixed to the bottom surface of the heat block 42 by screws 441. The fixed block 41 is connected and fixed to a plunger of a vertical movement cylinder (not shown), and by the operation of the vertical movement cylinder, the thermocompression bonding head 44 presses a plurality of electronic components 3 on the substrate 2 at the same time and performs main compression bonding. Is configured to do.
[0009]
A plurality of heaters 45 are arranged in the heat block 42 in the longitudinal (lateral) direction, and the thermocompression bonding head 44 receives heat conduction from the heated heat block 42 and is connected to the surface of the substrate 2. In other words, a flat lower tip surface that is parallel to and highly accurate is formed. That is, the fixing block 41 is provided with an adjusting screw 43b screwed between each of the plurality of fixing screws 43a, and thermocompression bonding is performed by adjusting the pressing force on the surface of the heat block 42 by each tip. The parallelism and flatness of the lower end surface of the head 44 with respect to the surface of the substrate 2 are ensured.
[0010]
[Problems to be solved by the invention]
As described above, in the conventional thermocompression bonding apparatus for electronic components, the thermocompression bonding head 44 is attached and fixed to the bottom of the heat block 42 with screws 441, and a plurality of electronic components 3 temporarily bonded onto the substrate 2 are simultaneously attached. In order to perform thermocompression bonding, it is necessary that the lower end surface is flat and parallel to the surface of the substrate 2 with high precision, and a uniform pressing force is simultaneously applied to a plurality of electronic components on each substrate 2. Is done.
[0011]
However, the above-described conventional thermocompression bonding head 44 is closely attached and fixed to the bottom surface of the stainless steel heat block 42, and the heat block 42 has a plurality of heaters 45 arranged in the longitudinal direction. As described above, the heat block 42 itself thermally expanded around each heater 45.
[0012]
As a result, the thermocompression bonding head 44 that is closely fixed to the bottom surface of the heat block 42 is subjected to a change due to thermal expansion of the heat block 42, and as shown in FIG. The bottom surface of the head 44 was curved downward, and the bottom surface was deformed so that the height position undulated between the substrate 2 surface. Therefore, even if the parallel surface between the bottom surface of the thermocompression bonding head 44 and the surface of the substrate 2 is broken and the thermocompression bonding head 44 descends in the illustrated arrow (Z) direction to press the electronic component 3, anisotropy below the leads 32 is achieved. There is a phenomenon that a uniform thermal pressing force is not applied to the conductive tape (film) 22 and a good electrical connection cannot be obtained between the lead 32 and the electrode 21 of the substrate 2.
[0013]
Therefore, it is necessary to adjust the parallelism and flatness of the bottom surface of the thermocompression bonding head 44 by tightening or loosening the screws 43a and 43b. In this adjustment, due to the thermal expansion of the thermocompression bonding head 44 itself. In addition to the deformation of the bottom surface of the thermocompression bonding head 44 that occurs, the deformation due to thermal expansion of the heat block 42 must be adjusted, and the adjustment must be performed via the heat block 42. The work efficiency was poor. In addition, when the deformation due to thermal expansion of the heat block 42 is excessive, adjustment by the screws 43a and 43b cannot cope with it, and a good electrical connection between the electrode 21 of the substrate 2 and the lead 32 of the electronic component 3 can be obtained. There was a problem that the connection could not be obtained.
[0014]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component thermocompression bonding apparatus that can uniformly thermocompress electronic components placed on a substrate.
[0015]
[Means for Solving the Problems]
The present invention relates to a thermocompression bonding apparatus for an electronic component comprising a positioning mechanism for positioning a substrate, and a thermocompression bonding tool for thermocompression bonding a lead wire of the electronic component on the electrode of the substrate positioned by the positioning mechanism. The thermocompression bonding tool is composed of a heat block connected to the fixed block, and a thermocompression bonding head supported by the fixed block and provided so as to be slidable in the vertical direction while being in contact with the side surface of the heat block. To do.
[0016]
As described above, the thermocompression bonding apparatus for electronic components according to the present invention is provided with the thermocompression bonding head so as to be slidable in the vertical direction while being in contact with the side surface of the heat block. Even if the heat block is thermally deformed, the thermocompression bonding head can slide in the vertical direction on the contact surface with the heat block, and can ensure flatness on the lower end surface.
[0017]
Therefore, the bottom surface of the thermocompression bonding head maintains a flatness with high accuracy, and a parallelism with the substrate surface is ensured, so that uniform thermocompression can be performed on a plurality of electronic components. Quality implementation is possible.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of an electronic component thermocompression bonding apparatus according to the present invention will be described in detail with reference to FIGS. In addition, the same code | symbol is attached | subjected to the same structure as the conventional thermocompression bonding apparatus shown in FIG. 3 thru | or FIG. 5, and detailed description is abbreviate | omitted.
[0019]
That is, FIG. 1 is a perspective view showing a principal part of an embodiment of a thermocompression bonding apparatus for electronic components according to the present invention. A plurality of liquid crystal glass substrates 2 placed on an XY-θ table 1 are arranged on a liquid crystal glass substrate 2. The electronic components 3 are preliminarily pressure-bonded and placed.
[0020]
On the substrate 2 positioned by the XY-θ table 1, a thermocompression bonding tool 4 for final pressure bonding receives drive control of a vertical movement cylinder (not shown), and a plurality of electronic components 3 are placed on the substrate 2. It is comprised so that it may be thermocompression bonded to.
[0021]
The thermocompression bonding tool 4 includes a fixed block 41 and a stainless steel heat block as shown in the enlarged front view of FIG. 2 (a) and the cross-sectional view of the arrow direction from the AA line of FIG. 4 (a). The thermocompression bonding head 44 is configured to be supported and fixed to the fixing block 41 by a fixing screw 43a.
[0022]
As shown in FIG. 2B, the thermocompression bonding head 44 is provided with a plurality of through-holes 44a that are particularly large in the vertical direction. The through-holes 44a are inserted with play. The tip of the support bolt 47 is fixed to the heat block 42 with screws. In addition, a coil spring 48 is interposed between the head of the support bolt 47 and the surface of the thermocompression bonding head 44, and the coil spring 48 presses the thermocompression bonding head 44 against the surface of the heat block 42. 44 is configured to be slidable in the vertical (arrow Z) direction by being guided by the support bolt 47 while being in contact with the surface of the heat block 42.
[0023]
Further, the thermocompression bonding head 44 is inserted into a through hole formed in the fixing block 42, and a fixing screw 43a whose tip is screwed into an upper portion of the thermocompression bonding head 44, and a fixing block as shown in FIG. The screw is screwed into a female screw portion formed on 41, and the tip is brought into contact with the upper surface of the thermocompression bonding head 44, and is connected to the fixing block 42 by a plurality of adjusting screws 43b disposed between the fixing screws 43a. The flatness of the bottom surface of the thermocompression bonding head 44 can be finely adjusted by tightening or loosening the fixing screw 43a and the adjusting screw 43b.
[0024]
As described above, according to the thermocompression bonding apparatus according to the present invention, the thermocompression bonding head 44 is provided with the long through hole 44a having a large play especially in the vertical direction, and is pressed against the surface of the heat block 42 by the coil spring 48. Therefore, even if the support bolt 47 is displaced in the vertical direction (arrow Z) due to the thermal expansion of the heat block 42 while receiving the heat conduction from the heat block 42 by the heater 45, the thermocompression bonding head 44 is kept at the height position. Can be held constant.
[0025]
That is, a number of heaters 45 built in the longitudinal direction of the heat block 42 are built in, and even if the heat block 42 itself is thermally deformed in the vertical direction, the thermocompression bonding head 44 is in surface contact with the heat block 42. Since it slides in the up-and-down direction, it can maintain the flatness of the bottom face with high accuracy without receiving deformation load in the up-and-down direction while receiving heat conduction from the heat block 42.
[0026]
Even if the heat block 42 is deformed in the lateral direction (the length direction of the support bolt 47) due to thermal expansion, the thermocompression bonding head 44 is only slightly displaced in the lateral direction, and the parallelism with the substrate 2 And the flatness of the lower end surface is not impaired.
[0027]
In the above embodiment, the thermocompression bonding head 44 is configured to be pressed against the heat block 42 by the coil spring 48. However, the thermocompression bonding head 44 is vertically pressed while being pressed against the heat block 42 by the spring pressure. Since it should just be able to slide, it can comprise not only a coil spring but other press means, such as a leaf spring.
[0028]
In addition, when adjusting the flatness of the bottom surface of the thermocompression bonding head 44 with the screws 43a and 43b, deformation such as a curvature of the bottom surface caused by thermal expansion of the thermocompression bonding head 44 itself is directly screwed into the thermocompression bonding head 44. Alternatively, the adjustment can be made by tightening or loosening the abutting screws 43a and 43b, so that the flatness of the bottom surface of the thermocompression bonding head 44 can be adjusted efficiently and with high accuracy.
[0029]
In summary, according to the thermocompression bonding apparatus of the present invention, uniform thermocompression bonding can be performed simultaneously on a plurality of electronic components on a substrate, which can be used in a main crimping process in liquid crystal panel manufacturing and the like. It is possible to mount high-quality electronic components, and can exhibit remarkable effects in practice.
[0030]
In the above embodiment, the thermocompression bonding head 44 is provided with a through hole 44a, and the support bolt 47 is screwed into the heat block 42 through the through hole 44a to connect the thermocompression bonding head 44 and the heat block 42. For example, a through hole may be provided in the heat block 42 and a support bolt 47 may be screwed into the thermocompression bonding head 44 through the through hole to connect the thermocompression bonding head 44 and the heat block 42. .
[0031]
【The invention's effect】
The thermocompression bonding apparatus according to the present invention can prevent deformation of the bottom surface of the thermocompression bonding head, and can be used in a process of simultaneously crimping a large number of electronic components to obtain a remarkable effect in practice.
[Brief description of the drawings]
FIG. 1 is a perspective view of a principal part showing a schematic configuration of an embodiment of a thermocompression bonding apparatus according to the present invention.
2A is an enlarged front view of a main part of the apparatus shown in FIG. 1, and FIG. 2B is a cross-sectional view taken along the line AA in FIG.
FIG. 3 is a perspective view of a main part showing a schematic configuration of a conventional thermocompression bonding apparatus.
4A is an enlarged front view of the main part of the apparatus shown in FIG. 3, and FIG. 4B is a cross-sectional view of the device taken along the line AA in FIG. 4A.
5 is an enlarged front view illustrating a deformed state of the thermocompression bonding head of the apparatus shown in FIG.
[Explanation of symbols]
1 XY-θ table (positioning mechanism)
2 (liquid crystal glass) substrate 3 electronic component 4 thermocompression bonding tool 41 fixing block 42 heater block 43a fixing screw 43b adjusting screw 44 thermocompression bonding head 45 heater 46 heat insulation member 47 support bolt 48 coil spring

Claims (4)

In an electronic component thermocompression bonding apparatus equipped with a thermocompression bonding tool for thermocompression bonding of electronic component leads to substrate electrodes,
The thermocompression bonding tool is:
A heat block connected to a fixed block;
An electronic component thermocompression bonding apparatus comprising: a thermocompression bonding head supported by the fixed block and provided so as to be slidable in a vertical direction while being in contact with a side surface of the heat block. The thermocompression bonding apparatus for an electronic component according to claim 1, wherein the heat block is connected to the fixed block via a heat insulating member. 3. The thermocompression bonding apparatus for an electronic component according to claim 1, wherein the thermocompression bonding head is configured to be in press contact with the heat block by a spring pressure. The thermocompression bonding head is inserted into a through-hole formed in the fixing block, and a fixing screw having a tip screwed into a female screw portion formed in the thermocompression bonding head, and a female screw portion formed in the fixing block. The thermocompression bonding apparatus for an electronic component according to any one of claims 1 to 3, wherein the thermocompression bonding apparatus is supported by the fixing block by an adjustment screw screwed in and having a tip end abutted against the thermocompression bonding head. .

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