JP4192681B2 - Display device and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a display device and a manufacturing method thereof, and more particularly to a flat display device including a display panel having a configuration in which two panel substrates are bonded together and a manufacturing method thereof.
[0002]
[Prior art]
When an electric field exceeding a certain threshold is applied to the surface of a conductor such as metal or semiconductor placed in a vacuum, electrons pass through the barrier due to the tunnel effect, and electrons are emitted into the vacuum even at room temperature. This phenomenon is called field emission, and a cathode that emits electrons by this phenomenon is called a field emission cathode. In recent years, FED (Field Emission Display) has attracted attention as a flat display device (planar display device) in which a large number of micron-sized field emission cathodes are formed on a substrate by making full use of semiconductor processing technology. The FED emits electrons from an electrically selected (addressed) emitter by the concentration of an electric field, and causes the electrons to collide with the phosphor on the anode substrate side to display an image by excitation and emission of the phosphor. It is.
[0003]
An FED display panel has a structure in which a cathode substrate and an anode substrate are arranged to face each other with a minute gap therebetween, and a gap space portion therebetween is sealed in a vacuum state. Therefore, a spacer is interposed between the cathode substrate and the anode substrate so that they can withstand atmospheric pressure, and both substrates are supported by this spacer. As a spacer used in the FED, a spacer formed in a long thin plate shape is known. The spacer is assembled to the anode substrate. The spacer has a very high aspect ratio, for example, a height of 1 to 2 mm and a thickness of 0.05 to 0.1 mm. Therefore, in order to support the spacer in an upright state on the anode substrate, for example, a minute support is formed. As a technique for assembling the spacer to the anode substrate, for example, a technique described in Patent Document 1 below is known.
[0004]
[Patent Document 1]
JP 2000-156181 A
[0005]
By the way, during the operation of the FED, a high voltage (hereinafter also referred to as HV) is applied between the electrodes (anode electrode-cathode electrode) of the anode substrate and the cathode substrate facing each other through the spacer. At this time, in order to bring the contact interface between the cathode substrate and the spacer and the contact interface between the anode substrate and the spacer into a stable potential state, a conductive film is formed on the end surface on the long side of the spacer, The contact interface is held at an equipotential.
[0006]
On the other hand, when the spacer is attached to the anode substrate, the spacer is disposed in a state in which the end of the spacer protrudes from the anode electrode formed on the anode substrate (meaning the end in the longitudinal direction of the spacer in this specification), This protruding portion is used for spacer alignment. Specifically, for example, an image including an end portion of a spacer protruding from the anode electrode formation region is taken into a camera as an image of transmitted light that has passed through a transparent portion (glass portion) of the anode substrate, and thus obtained. Image data is processed to recognize the position of the spacer, and from there, the spacer is shifted in the XY direction by a predetermined amount so as to be adjusted to a specified position.
[0007]
[Problems to be solved by the invention]
However, when the spacer is disposed so that the end of the spacer protrudes from the anode electrode formation region, the conductive film formed on the end surface of the spacer as described above directly contacts the ground surface (glass surface) of the anode substrate. Will face each other. For this reason, when a high voltage is applied between the electrodes of the cathode substrate and the anode substrate, a minute discharge due to charge-up is likely to occur at the facing portion between the end surface of the spacer and the ground surface of the anode substrate. .
[0008]
The present invention has been made to solve the above-described problems, and an object of the present invention is to reliably prevent discharge when the end portion of the spacer protrudes from the anode electrode formation region on the anode substrate. Another object of the present invention is to provide a display device and a manufacturing method thereof.
[0009]
[Means for Solving the Problems]
A display device according to the present invention is a display device including a display panel having a configuration in which an anode substrate having an anode electrode formed in a substantially rectangular shape in plan view and a cathode substrate are bonded together via a plate-like spacer, The spacer has a conductive film on the end surface on the long side of the spacer, and is disposed in a state where the end of the spacer protrudes from the anode electrode formation region on the anode substrate. It has an electroconductive protrusion pattern part formed in the state which protrudes from the outer side and opposes the edge part of a spacer.
[0010]
In this display device, a conductive protruding pattern portion is formed so as to face the end portion (conductive film) of the spacer at the protruding portion from the anode electrode formation region. The potential state is stabilized. Therefore, it is difficult for discharge to occur at the end of the spacer.
[0011]
A manufacturing method of a display device according to the present invention is a display device including a display panel having a configuration in which an anode substrate having an anode electrode formed in a substantially rectangular shape in plan view and a cathode substrate are bonded together via a plate-like spacer. In the manufacturing method, a conductive protruding pattern portion is formed on a mounting line set on the anode substrate for mounting the spacer so as to protrude outward from the anode electrode forming region, and the spacer is formed on the anode substrate. When the is attached, the end of the spacer protrudes from the anode electrode formation region, and the end of the spacer faces the protruding pattern portion at the protruding portion.
[0012]
In this display device manufacturing method, a conductive protruding pattern portion is previously formed on an attachment line of an anode substrate, and when the spacer is actually attached, the end of the spacer is projected from the area where the anode electrode is formed. By arranging the portion (conductive film) to face the conductive protruding pattern portion, the potential state is stabilized between them. Therefore, it is difficult for discharge to occur at the end of the spacer.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0014]
FIG. 1 is a cross-sectional view showing the configuration of a display panel of an FED as an example of a display device to which the present invention is applied, and FIG. 2 is a perspective view showing the configuration of the display panel. In FIG. 1 and FIG. 2, a flat cathode substrate (cathode panel) 1 and a flat anode substrate (anode panel) 2 are arranged in an opposing state with a predetermined gap therebetween, and the two One panel structure (display panel) for displaying an image is formed by assembling a rectangular frame 3 between the substrates 1 and 2 so as to be integrally assembled.
[0015]
A plurality of electron-emitting devices are formed on the cathode substrate 1. A large number of these electron-emitting devices are formed in a two-dimensional matrix in the effective area of the cathode substrate 1 (area that actually functions as a display portion). Each electron-emitting device includes an insulating support substrate (for example, a glass substrate) 4 serving as a base of the cathode substrate 1, a cathode electrode 5, an insulating layer 6, and a gate sequentially formed in a stacked state on the support substrate 4. The electrode 7 includes a gate hole 8 formed in the gate electrode 7 and the insulating layer 6, and an electron emission portion 9 formed at the bottom of the gate hole 8.
[0016]
The cathode electrode 5 is formed in a stripe shape so as to form a plurality of cathode lines. The gate electrode 7 is formed in a stripe shape so as to form a plurality of gate lines intersecting (orthogonal) with each cathode line. The gate hole 8 is composed of a first opening 8A formed in the gate electrode 7 and a second opening 8B formed in the insulating layer 6 in a state communicating with the first opening 8A. Yes. The electron emission portion 9 serves as an electron emission source and has a so-called Spindt-type emitter structure in which a refractory metal such as molybdenum (Mo) is formed in a conical shape. In the electron emission portion 9, first, a release layer (not shown) is formed on the gate electrode 7 by, for example, oblique vapor deposition of aluminum, with openings 8A and 8B formed in the insulating layer 6 and the gate electrode 7, respectively. The refractory metal (Mo, etc.) used as the emitter material is vertically evaporated to gradually reduce the hole opening diameter to deposit the emitter material in a conical shape at the bottom of the gate hole 8, and then peel off the unnecessary emitter material. Obtained by removing together with the layer.
[0017]
The anode substrate 2 is a transparent substrate 12 serving as a base, a phosphor layer 13 and a black matrix 14 formed on the transparent substrate 12, and a transparent substrate 12 covering the phosphor layer 13 and the black matrix 14. The anode electrode 15 is formed. The phosphor layer 13 includes a phosphor layer 13R for red light emission, a phosphor layer 13G for green light emission, and a phosphor layer 13B for blue light emission. The black matrix 14 is formed between the phosphor layers 13R, 13G, and 13B for emitting each color. The anode electrode 15 is formed in a laminated state so as to cover the entire effective region of the anode substrate 2 so as to face the electron-emitting device of the cathode substrate 1.
[0018]
The cathode substrate 1 and the anode substrate 2 are bonded to each other at the outer peripheral portion (peripheral portion) via the frame 3. Further, a through-hole 16 for evacuation is provided in the ineffective area (area outside the effective area and not actually functioning as a display portion) of the cathode substrate 1. A tip tube 17 that is sealed after evacuation is connected to the through hole 16. However, since FIG. 1 shows the assembled state of the display device, the tip tube 17 is already sealed.
[0019]
In the display device having the panel structure configured as described above, a relative negative voltage is applied to the cathode electrode 5 from the scanning circuit 18, a relative positive voltage is applied to the gate electrode 7 from the control circuit 19, and the anode electrode 15 A positive voltage higher than that of the gate electrode 7 is applied from the acceleration power source 20. In such a display device, when an image is actually displayed, a scanning signal is input from the scanning circuit 18 to the cathode electrode 5 and a video signal is input from the control circuit 19 to the gate electrode 7.
[0020]
As a result, a voltage is applied between the cathode electrode 5 and the gate electrode 7, thereby concentrating the electric field on the sharpened portion of the electron emission portion 9, so that electrons penetrate the energy barrier by the quantum tunnel effect and the electron emission portion. 9 is released into the vacuum. The emitted electrons are attracted to the anode electrode 15 and move to the anode substrate 2 side, and collide with the phosphor layer 13 (13R, 13G, 13B) on the transparent substrate 12. As a result, since the phosphor layer 13 is excited by the collision of electrons and emits light, a desired image can be displayed on the display panel by controlling the light emission position in units of pixels.
[0021]
FIG. 3 is a perspective view including a partially broken portion showing a spacer mounting state. In the figure, a plurality of spacers 21 are interposed in a facing portion (gap space) between the cathode substrate 1 and the anode substrate 2. The spacer 21 serves as a support member for vacuum pressure resistance that supports the display panel constituting the vacuum vessel so as not to be deformed or broken under the influence of atmospheric pressure. For example, the spacer 21 is made of an insulating material such as ceramics. It is formed in a thin plate shape.
[0022]
4A and 4B show the overall structure of the spacer. FIG. 4A is a top view thereof, and FIG. 4B is a side view thereof. As shown in the figure, the spacer 21 has, for example, a thin plate shape with a thickness dimension of 0.05 to 0.1 mm, and is formed in a horizontally long rectangle when viewed from the side. A conductive film 22 is formed on the end surface on the long side of the spacer 21. The conductive film 22 is formed by depositing a metal material such as platinum (Pt), for example, and is continuous with a uniform thickness from one end in the longitudinal direction of the spacer 21 to the other end (the entire region in the spacer longitudinal direction). Is formed. The spacer 21 is obtained by assembling a predetermined number of spacers 21 on the anode substrate 2 in advance in a series of FED manufacturing processes and bonding the cathode substrate 1 and the anode substrate 2 through the spacer 21. Between the substrates 1 and 2.
[0023]
At that time, the anode substrate 2 has a support 23 for supporting the spacer 21 in an upright state (upright state with respect to the substrate surface of the anode substrate 2) as shown in FIG. A plurality of are formed. The support 23 is made of, for example, a polyimide resin, and is formed in a protruding shape on the black matrix 14 of the anode substrate 2 using a photolithography technique. Moreover, each support body 23 is arrange | positioned in the state which opposes on both sides of the attachment line in which the spacer 21 is attached in a straight line form. On the other hand, as shown in FIG. 5B, the spacer 21 is attached so as to be inserted between the support members 23 facing each other. The spacers 21 thus attached are in a state of being sandwiched (gripped) between the support members 23 on the anode substrate 2.
[0024]
6A and 6B show the attachment positions of the spacers on the anode substrate. FIG. 6A is an overall plan view, and FIG. 6B is an enlarged view of a part (P portion). On the anode substrate 2, a phosphor layer 13 is formed in an effective area that actually functions as a display portion in a state of being partitioned by a black matrix 14, and a slightly wider area so as to cover the effective area Thus, an anode electrode 15 serving as an aluminum metal back is formed. The anode electrode 15 is formed in a substantially rectangular shape in front view on the transparent substrate 12 as a base corresponding to the screen shape and screen size of the display panel. In addition, an attachment line for attaching the spacer 21 is set in advance on the anode substrate 2 so as to overlap the formation site of the black matrix 14. The spacer mounting lines are set in a straight line along the horizontal direction of the screen, and are set over a plurality of lines in the vertical direction of the screen.
[0025]
On the other hand, the spacers 21 are arranged in three lines per line in the horizontal direction of the screen and are arranged in a straight line on the spacer mounting line, and these sets are set in a predetermined direction in the vertical direction of the screen. It is arranged across multiple lines at a pitch. Further, in the horizontal direction of the screen, among the three spacers 21 arranged in a straight line, one end portion 21A of the left and right spacers 21 excluding the central portion is arranged in a state of protruding from the formation region (rectangular region) of the anode electrode 15. ing. That is, on both sides of the anode electrode 15, one end portion (right end portion) 21 </ b> A of the spacer 21 arranged on the right side and one end portion (left end portion) 21 </ b> A of the spacer 21 arranged on the left side are respectively formed regions of the anode electrode 15. It is arranged in a state of protruding from the (rectangular region).
[0026]
By the way, the number of spacers 21 and the interval between the spacers 21 are appropriately set according to the screen size of the FED display panel. For example, in the case of a relatively small screen size, one spacer is arranged per line. It can be done. In such a case, one end or both ends of the spacer are arranged on one side or both sides of the anode electrode 15 so as to protrude from the formation region of the anode electrode 15.
[0027]
The protruding portion (21A) of the spacer 21 from the anode electrode 15 is used for positioning (positioning, paralleling, etc.) of each spacer 21 when the spacers 21 are attached in groups of three on the anode substrate 2. Used. For example, an image including the end portion 21A of the spacer 21 that protrudes from the formation region of the anode electrode 15 is captured by the camera as an image of transmitted light that has passed through the transparent portion (glass portion) of the anode substrate 2, and an image obtained thereby. The data is processed to recognize the position of the spacer 21, and from there, the spacer 21 is shifted by a predetermined amount in the X-Y direction and adjusted to a specified position.
[0028]
At this time, a conductive protruding pattern portion 24 is formed at a position where the end portion 21 </ b> A of the spacer 21 is aligned so as to protrude outward from the formation region of the anode electrode 15. When the spacer 21 is attached to the anode substrate 2, the protruding pattern portion 24 faces the end portion 21 </ b> A of the spacer 21 that protrudes from the formation region of the anode electrode 15, for example, the black matrix 14 made of chromium oxide, It is integrally formed. At this time, the direction in which the end portion 21 </ b> A of the spacer 21 and the protruding pattern portion 24 face each other is the plate thickness direction of the anode substrate 2.
[0029]
FIG. 7 is a flowchart showing an example of a manufacturing process when the method for manufacturing a display device (FED) of the present invention is applied. In the figure, in the cathode substrate creation step F11, formation of the cathode electrode 5 (film formation, patterning), formation of the insulating layer 6 (film formation), formation of the gate electrode 7 (film formation, patterning), and formation of the gate hole 8 ( The cathode substrate 1 is formed by forming a hole) and forming the electron emission portion 9. Next, in the cathode substrate inspection step F12, it is inspected whether the cathode substrate 1 produced in the cathode substrate production step F11 is free from defects in appearance or characteristics.
[0030]
On the other hand, in the anode substrate creation step F21, the anode substrate 2 is created by forming the black matrix 14, forming the phosphor layer 13, forming the anode electrode 15 (film formation), and the like. In this anode substrate creation step F21, first, as shown in FIG. 8A, after the black matrix 14 and the protruding pattern portion 24 (see FIG. 6) are simultaneously formed on the base transparent substrate 12 with chromium oxide or the like. Then, a support 23 (see FIG. 5) is formed on the black matrix 14 using polyimide resin or the like.
[0031]
The protruding pattern portion 24 is formed on the spacer mounting line set on the anode substrate 2 so as to protrude from the formation region of the anode electrode 15 formed after the black matrix 14. As shown in FIG. 9, the dimensions of the protruding pattern portion 24 are in the horizontal and vertical directions (XY directions) of the screen with respect to the final mounting position of the spacer 21 (indicated by a two-dot chain line in the figure). What is necessary is just to set suitably considering the margin ((DELTA) X, (DELTA) Y) which considered the deformation | transformation of the spacer 21, the attachment error, etc., respectively. For example, the vertical direction (Y direction) of the screen may be set to about three times the thickness dimension of the spacer 21.
[0032]
Here, when the protruding pattern portion 24 is formed (patterned) simultaneously with the black matrix 14 using the black matrix 14 forming material (chromium oxide or the like), the protruding pattern is simply changed by changing the pattern shape of the black matrix 14 substantially. Since the portion 24 can be formed, a separate process step for forming the protruding pattern portion 24 is not necessary. Although not shown, the same effect can be obtained when the protruding pattern portion 24 is formed simultaneously with the anode electrode 15.
[0033]
Incidentally, the formation region of the anode electrode 15 is a rectangular region slightly wider than the effective region, and is a region set so as to cover the phosphor film 13 and the black matrix 14. Therefore, when the protruding pattern portion 24 is formed integrally with the anode electrode 15, the protruding pattern portion 24 is formed and arranged in a state of protruding outward from the outer edge portion of the rectangular region that is the formation region of the anode electrode 15. . However, the protruding pattern portion 24 may be formed separately from the black matrix 14 and the anode electrode 15.
[0034]
Next, as shown in FIG. 8B, after the phosphor layer 13 is formed at the pixel position partitioned by the black matrix 14, the phosphor layer 13 and the black matrix 14 are formed as shown in FIG. The anode electrode 15 is formed in a covered state. Thereby, the anode substrate 2 is obtained. Thereafter, in the anode substrate inspection step F22, it is inspected whether the anode substrate 2 created in the anode substrate creation step F21 is free from defects in appearance or characteristics.
[0035]
Further, in the spacer creating step F31, a long and thin plate-like spacer 21 is created as shown in FIG. 4 by cutting out from a plate-like spacer material (for example, ceramics) or surface polishing. At this time, the conductive film 22 is formed on the end surface on the long side of the spacer 21 using platinum or the like.
[0036]
Thereafter, in the spacer inspection step F32, it is inspected whether the spacer 21 created in the spacer creation step F31 has any appearance defect. Subsequently, in the spacer cleaning step F33, a cleaning process (for example, wet cleaning) is performed on the spacer 21 that has passed the inspection (non-defective product) in the spacer inspection step F32.
[0037]
Subsequently, in the spacer assembling step F41, a plurality of spacers 21 are assembled to the anode substrate 2 as shown in FIG. Since a plurality of support bodies 23 (see FIG. 5) are formed in advance on the spacer mounting line of the anode substrate 2, one end portion on the long side of the spacer 21 is inserted between these support bodies 23. A spacer 21 is attached on the anode substrate 2. At this time, on both sides of the anode electrode 15, the end portion 21 </ b> A of the spacer 21 protrudes from the formation region of the anode electrode 15, and the protruding portion (21 </ b> A) faces the protruding pattern portion 24. Although the positioning method for attaching the spacer 21 to the anode substrate 2 is as described above, the following procedure can be illustrated as a further supplement.
[0038]
First, the three spacers 21 to be mounted on one spacer mounting line on the anode substrate 2 are simultaneously held by a vacuum chuck or the like, and shifted from the final spacer 21 mounting position by a predetermined amount in the vertical direction of the screen ( The spacer 21 is arranged at the position where it is offset. At this time, the end portions 21 of the spacers 21 on both sides are arranged so as to protrude outward (horizontal direction) from the formation region of the anode electrode 15 as shown in FIG. In this state, light such as a lamp is irradiated from the non-electrode forming surface side of the anode substrate 2 and the transmitted light is taken into the camera on the side opposite to the lamp, whereby an image including the end 21A of the spacer 21 is obtained. As an image of transmitted light that has passed through the transparent part (glass part).
[0039]
Next, the image data obtained by capturing the image is processed to recognize the position of the spacer 21, and the shift amounts Lx and Ly from the target mounting position to be aimed at are obtained, and the shift is corrected (shift) The spacer 21 is shifted in the X and Y directions so that the amounts Lx and Ly become zero), and are adjusted to a specified position, and one end of the long side of the spacer 21 is inserted into the support 23 (see FIG. 5). . Thereafter, the spacers 21 are attached on the other spacer attachment lines on the anode substrate 2 in the same procedure as described above.
[0040]
In the substrate bonding step F42, the cathode substrate 1 and the anode substrate 2 are bonded together via the spacer 21. In this substrate bonding step 31, the cathode substrate 1 that has passed the inspection in the cathode substrate inspection step F12 and the anode substrate 2 that has passed the inspection in the anode substrate inspection step F22 and has the spacer 21 assembled in the spacer assembly step F41. As shown in FIG. 12, in a state where they face each other, they are bonded together with their relative positions aligned. At this time, for example, a rectangular frame 3 is attached to the outer peripheral portion of the anode substrate 2, and the cathode substrate 1 and the anode substrate 2 are joined to each other by a frit seal at the frame 3.
[0041]
Subsequently, in a post-process F43, as described above, exhaust processing for evacuating the inside of the display panel obtained by bonding the cathode substrate 1 and the anode substrate 2 and sealing the tip tube 17 (see FIG. 1) are sealed. Processing for cutting, TAB (Tape Automated Bonding) processing for electrical connection with the display control circuits 18, 19, 20 (see FIG. 1) is performed.
[0042]
Thus, in the present embodiment, the protruding pattern portion 24 is formed integrally with the black matrix 14 corresponding to the mounting position of the spacer 21, and the protruding pattern portion 24 is formed at the end of the spacer 21 in the plate thickness direction of the anode substrate 2. Since it is disposed so as to face the portion 21A, the conductive material formed on the end surface on the long side of the spacer 21 is shown in FIGS. 13A and 13B in the portion protruding from the formation region of the anode electrode 15. The film 22 does not directly face the ground surface (glass surface) of the anode substrate 2 but faces the conductive protruding pattern portion 24. Therefore, even when a high voltage is applied between the electrodes of the cathode substrate 1 and the anode substrate 2 when driving the assembled display panel, the end portion 21A of the spacer 21 and the protruding pattern portion 24 facing the end portion 21A The electric potential state is stabilized during this period, and discharge is less likely to occur.
[0043]
In the above-described embodiment, the Spindt-type emitter structure is shown as the emitter structure of the cathode substrate 1, but other than this, for example, a planar-type emitter structure formed by using a plurality of carbon nanotubes, etc. Other emitter structures may be used.
[0044]
【The invention's effect】
As described above, according to the present invention, when the end portion of the spacer protrudes from the anode electrode formation region on the anode substrate, the end portion (conductive film) of the spacer faces the conductive protruding pattern portion. Will do. As a result, the conductors face each other at the portion protruding from the anode electrode formation region, so that the potential state is stabilized between them. Therefore, it is possible to reliably prevent the occurrence of minute discharge at the spacer end.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating a configuration of a display panel of an FED as an example of a display device to which the present invention is applied.
FIG. 2 is a perspective view illustrating a configuration of a display panel of an FED as an example of a display device to which the present invention is applied.
FIG. 3 is a perspective view including a partially broken portion showing a mounting state of the spacer.
FIG. 4 is a view showing an overall structure of a spacer.
FIG. 5 is a view showing a support structure of a spacer.
FIG. 6 is a view showing a mounting position of a spacer on an anode substrate.
FIG. 7 is a flowchart showing an example of a manufacturing process when the method for manufacturing a display device (FED) of the present invention is applied.
FIG. 8 is a diagram showing a processing procedure of an anode substrate creation step.
FIG. 9 is a diagram showing a formation pattern of a protruding pattern portion of a black matrix.
FIG. 10 is a perspective view showing a spacer assembled state.
FIG. 11 is a diagram for explaining a spacer positioning procedure;
FIG. 12 is a diagram illustrating a substrate bonding process.
FIG. 13 is a diagram illustrating an arrangement state of spacers and protruding pattern portions.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Cathode substrate, 2 ... Anode substrate, 14 ... Black matrix, 15 ... Anode electrode, 21 ... Spacer, 22 ... Conductive film, 24 ... Projection pattern part

Claims (4)

A display device comprising a display panel having a configuration in which an anode substrate having an anode electrode formed in a substantially rectangular shape in plan view and a cathode substrate are bonded together via a plate-like spacer,
The spacer has a conductive film on the end surface on the long side of the spacer, and is disposed in a state where the end of the spacer protrudes from the anode electrode formation region on the anode substrate,
The display device according to claim 1, wherein the anode substrate has a conductive protruding pattern portion that protrudes outward from a region where the anode electrode is formed and is opposed to an end portion of the spacer. The display device according to claim 1, wherein the anode substrate has a black matrix, and the protruding pattern portion is formed integrally with the black matrix. A method of manufacturing a display device comprising a display panel having a configuration in which an anode substrate having an anode electrode formed in a substantially rectangular shape in plan view and a cathode substrate are bonded together via a plate-like spacer,
On the attachment line set on the anode substrate for attaching the spacer, a conductive protruding pattern portion is formed in a state protruding outward from the anode electrode forming region,
When attaching the spacer to the anode substrate, the spacer is disposed so that the end of the spacer protrudes from the anode electrode formation region, and the end of the spacer faces the protruding pattern at the protruding portion. A method for manufacturing a display device, comprising: disposing the display device. 4. The method for manufacturing a display device according to claim 3, wherein when the black matrix is formed on the anode substrate, the protruding pattern portion is formed simultaneously with the black matrix.

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