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JP4154806B2 - High frequency module - Google Patents

High frequency module Download PDF

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Publication number
JP4154806B2
JP4154806B2 JP18325099A JP18325099A JP4154806B2 JP 4154806 B2 JP4154806 B2 JP 4154806B2 JP 18325099 A JP18325099 A JP 18325099A JP 18325099 A JP18325099 A JP 18325099A JP 4154806 B2 JP4154806 B2 JP 4154806B2
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Japan
Prior art keywords
dielectric
signal transmission
transmission line
circuit
ground plane
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Expired - Fee Related
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JP18325099A
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JP2001015678A (en
JP2001015678A5 (en
Inventor
肇 川▲野▼
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP18325099A priority Critical patent/JP4154806B2/en
Priority to DE60027509T priority patent/DE60027509T2/en
Priority to EP00113569A priority patent/EP1069639B1/en
Priority to EP04021529A priority patent/EP1484815A1/en
Priority to US09/605,639 priority patent/US6597902B1/en
Publication of JP2001015678A publication Critical patent/JP2001015678A/en
Publication of JP2001015678A5 publication Critical patent/JP2001015678A5/ja
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Publication of JP4154806B2 publication Critical patent/JP4154806B2/en
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    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
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    • H01L2223/6605—High-frequency electrical connections
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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Description

【０００１】
【発明の属する技術分野】
この発明は内部に2つ以上のマイクロ波回路などの高周波回路及びその制御回路を有し、そのきょう体を多層誘電体で構成したマイクロ波モジュールに代表される高周波モジュールに関し、特に内部にもつマイクロ波回路間及びマイクロ波回路とその制御回路の実装構造に関するものである。
【０００２】
【従来の技術】
第8図は従来の誘電体を積層したパッケージを使用した実装方法によるマイクロ波モジュールの一実施例を示すマイクロ波モジュールの断面図、第9図はその裏面視図、第10図はその高周波コネクタと内部のマイクロ波回路との接続構造を示す図である。図において、1は最下部に位置する金属導体、2は第一の誘電体、3は第二の誘電体、4は第三の誘電体、5は第四の誘電体、6は第五の誘電体、12はマイクロ波回路の制御回路または制御用IC、13は第一のマイクロ波回路、15は高周波コネクタ、17は制御信号用ピン、18は誘電体内のスルーホール、21は上記高周波コネクタ15の芯線、24はシールリング、25は上フタである、27は接続用ワイヤであり、第一の誘電体2と第二の誘電体３の接続面及び第三の誘電体4と第四の誘電体5の接続面、第五の誘電体6面上に信号伝達線路面を設け、第二の誘電体3と第三の誘電体4との接続面 及び第四の誘電体5と第五の誘電体6との接合面には接地面が設けてある。
なお、ここでのマイクロ波回路とは、半導体基板上にＦＥＴ（電界効果トランジスタ）、キャパシタ等の回路構成要素を一体形成したマイクロ波回路（Ｍｏｎｏｌｉｔｈｉｃ Ｍｉｃｒｏｗａｖｅ ＩＣ）や、誘電体基板上に半導体を除いた回路構成要素を形成し、半導体を後から搭載したマイクロ波回路（Ｍｉｃｒｏｗａｖｅ ＩＣ）などを示し、一般に基板やその基板のパッケージの形状に応じて平たい長方形状を成す。
【０００３】
次に動作について説明する。制御信号用ピン17から入力された制御信号は、誘電体内のスルーホール18ａ、18ｂ、18Ｃ、18ｄを通り接続用ワイヤ27ｄを通って制御回路12に入力される。制御回路12の出力信号は接続用ワイヤ27ｃを通り、誘電体内のスルーホール18ｅ、18ｆなどを通り第三の誘電体4の信号伝達線路面を通り、接続用ワイヤ27ａ、27bなどを通じて第一のマイクロ波回路13に入力される。また、マイクロ波信号は高周波コネクタ15ａから入力され、接続用ワイヤ27ｅを通してマイクロ波回路13に入力され、上記制御信号に基づいて第一のマイクロ波回路13で処理された出力信号は、高周波コネクタ15ａと同様に第一のマイクロ波回路13に接続された高周波コネクタ15ｂから出力される。
【０００４】
また、マイクロ波回路を複数搭載する場合は、第二の誘電体3の接地面に複数のマイクロ波回路を配置し、二次元的に回路を展開することで実現でき、その場合マイクロ波回路間の接続はマイクロストリップ線路及び接続用ワイヤにて行う。
【０００５】
【発明が解決しようとする課題】
以上述べたように、従来の誘電体を積層したパッケージを使用したマイクロ波モジュールでは、2つ以上のマイクロ波回路を内部に搭載する場合、マイクロ波回路を搭載する面を1面しかもたない（例えば図８の場合、第二の誘電体3の接地面）ため、マイクロ波回路間の接続は平面内で実施する必要があった。また、2つ以上の高周波コネクタを必要とする場合は同一方向に設ける必要があった。
【０００６】
しかし、マイクロストリップ線路にて平面内に回路を増やしていくと、マイクロ波回路の投影面積（厚み方向に垂直な面の面積）が増大し、結果的にこのマイクロ波回路が実装されたマイクロ波モジュールを必要とするシステム内においてこのモジュールの占有面積が増大し、システムが大型化するという課題があった。
また、2つ以上の高周波コネクタを同一方向に設けた場合、マイクロ波モジュールの小型化が制限されるという課題があった。例えば、マイクロ波モジュールによってアレイアンテナを構成する場合、マイクロ波回路へマイクロ波信号を分配・供給する給電回路とマイクロ波回路からのマイクロ波信号を放射するアレイアンテナ素子を、マイクロ波モジュールに対して同一方向に配置するため、給電回路にマイクロ波信号の出力に加えて入力を行うための穴も設ける必要があり、その結果給電回路の実装スペースが少なくなる。
この発明は、係る課題を解決するために為されたものであり、複数の高周波回路を搭載する場合の実装面積を小さくし、また２つ以上の高周波コネクタを設ける場合にも同一方向ではなく相対する方向に設けることを可能とした高周波モジュールを得るものである。
【０００７】
【課題を解決するための手段】
第一の発明による高周波波モジュールは、複数の誘電体が積層されて形成された構造体に第一、第二の高周波回路を搭載して成る高周波モジュールにおいて、第一の高周波回路に接続される第一の信号伝達線路が形成された第一の誘電体と、第二の高周波回路に接続される第二の信号伝達線路が形成された第二の誘電体と、上記第一の信号伝達線路と第二の信号伝達線路を電磁結合して高周波信号を伝達する結合手段とを備え、上記第一の高周波回路と上記第二の高周波回路は、上記第一の誘電体と第二の誘電体の積層方向の投影面に互いに重なりを有するように離間して接地面上に配置されたものである。これによって高周波回路を階層型に配置でき、高周波モジュールの投影面積の増大を防ぐことを可能とした。
【０００８】
また、第二の発明による高周波モジュールは、上記結合手段は、一方の面が上記第一の誘電体における第一の信号伝達線路の形成面に当接し、他方の面にスロットを有する接地面が形成されるとともに、その接地面が上記第二の誘電体における上記第二の信号伝達線路の形成面と対向する面に当接した第三の誘電体を備えて成るものである。
【０００９】
また、第三の発明による高周波モジュールは、上記第一の高周波回路は上記第一の誘電体における第一の信号伝達線路の形成面と対向する面に当接した接地面上に載置され、上記第二の高周波回路は上記第三の誘電体における接地面上に載置されたものである。
【００１０】
また、第四の発明による高周波モジュールは、上記第一、第二の信号伝達線路は接地された線路とともにコプレナー線路を形成し、上記第一の高周波回路は上記第一の誘電体におけるコプレナー線路にバンプ接続された状態で上記第一の誘電体上に載置され、上記第二の高周波回路は上記第二の誘電体におけるコプレナー線路上にバンプ接続された状態で上記第二の誘電体上に載置されたものである。これによって、高周波回路周辺にワイヤ接続のためのスペースを設ける必要がなくなる。
【００１１】
また、第五の発明による高周波回路は、複数の誘電体が積層されて形成された構造体に高周波回路を搭載して成る高周波モジュールにおいて、上記高周波回路の上部に設けられ上記高周波回路に接続された信号伝達線路との間で高周波を伝達する第一の高周波コネクタと、上記高周波回路の下部に設けられ当該高周波回路との間で高周波を伝達する第二の高周波コネクタとを備え、上記第一の高周波コネクタは、上記信号伝達線路に接続された芯線とその芯線の周囲に上記信号伝達線路から離間して馬蹄状に配置された複数のスルーホールとを有して成るものである。これによって2つ以上の高周波コネクタを設ける場合にも同一方向ではなく、相対する方向に設けることを可能とする。
【００１２】
また、第六の発明による高周波モジュールは、内部にマイクロ波回路と、前記マイクロ波回路の制御回路と、前記マイクロ波回路と接続される高周波コネクタと、前記制御回路と接続される制御ピンと、前記マイクロ波回路と制御回路が搭載される部位を保護するためのカバーとを備える高周波モジュールにおいて、少なくとも2つ以上のマイクロ波回路と、少なくとも1つ以上のマイクロ波回路の制御回路と、最下部に位置し一部に貫通穴をもつ金属導体と、一方の面が上記金属導体と接合し、かつ他方の面に信号伝達線路を設け、一部に前記制御回路を収納するための貫通穴をもつ第一の誘電体と、上記金属導体の貫通穴を通り第一の誘電体の金属導体との接合面に設けられた接続パッドに設けられた制御信号用ピンと、一方の面が第一の誘電体の信号伝達線路面に接合し、かつ他方の面に接地面をもつ第二の誘電体と、一方の面が上記第二の誘電体の接地面に接合し、かつ他方の面に第二の接地面を設けた第三の誘電体と、一方の面が上記第三の誘電体の第二の接地面に接合し、かつ他方の面に信号伝達線路面を設けた第四の誘電体と、一方の面が上記第四の誘電体の信号伝達線路面に接合し、かつ他方の面に接地面を設けた第五の誘電体と、一方の面が上記第五の誘電体の接地面に接合し、かつ他方の面に信号伝達線路面を設けた第六の誘電体と、一方の面が上記第六の誘電体の信号伝達線路面に接合し、かつ他方の面が接地された第七の誘電体と、上記第一から第七の誘電体中に設けられ、各信号伝達線路面と導通のとれるスルーホールと、第四の誘電体の接地面内に設けたスロットと、第七の誘電体の接地面内に設けたスロットと、上記金属導体に垂直に設けられ、第一から第三の誘電体を貫通する同軸型の第一の高周波コネクタとを備えることを特徴とした多層誘電体で構成するパッケージと、一方の面を接地面とし他方の面を信号伝達線路面とする第八の誘電体と、一方の面が上記第八の誘電体の信号伝達線路面と接合し、かつ他方の面に接地面を設けた第九の誘電体と、第九の誘電体の接地面に垂直に設けられ中心導体と第八の誘電体の信号伝達面の信号伝達線路との接続を第九の誘電体に設けた馬蹄形状に配置したスルーホールで実施した第二の高周波コネクタで構成し第八の誘電体の接地面を上記パッケージとの接合面とする上記パッケージの上部カバーと、上記パッケージの最下部の金属導体に設けた上記制御回路用貫通穴に接合する金属で構成する下部カバーとで構成し、上記第二の誘電体の接地面に上記制御回路を搭載し、金属ワイヤで上記制御回路と第一の誘電体の信号伝達線路を接続し、上記第三の誘電体の第二の接地面に第一のマイクロ波回路を搭載し、金属ワイヤにて上記第四の誘電体の信号伝達線路を接続し、上記第五の誘電体の接地面に第二のマイクロ波回路を搭載し、金属ワイヤにて上記第六の誘電体の信号伝達線路に接続し、上記制御信号用ピンから制御回路を上記第一の誘電体及び第二の誘電体の信号伝達線路及びスルーホールで接続し、上記制御回路から第一及び第二のマイクロ波回路への接続を上記第一から第六までの誘電体の信号伝達線路及びスルーホールにて実施し、第一の高周波コネクタと第一のマイクロ波回路との接続を金属ワイヤにて実施し、第一のマイクロ波回路と第二のマイクロ波回路との接続を上記第四の誘電体の信号伝達線路内の線路と第四の誘電体の接地面に設けたスロットと第五の誘電体の信号伝達線路内の線路との電磁結合で実施し、第二のマイクロ波回路と上記上部カバー内の第二の高周波コネクタの接続を第六の誘電体の信号伝達線路と第七の誘電体のスロットと第八の誘電体の信号伝達線路との電磁結合及び第九の誘電体の上記馬蹄形状のスルーホールで実施したものである。
【００１３】
また、第七の発明による高周波モジュールは、内部にマイクロ波回路と、前記マイクロ波回路の制御回路と、前記マイクロ波回路と接続される高周波コネクタと、前記制御回路と接続される制御ピンと、前記マイクロ波回路と制御回路が搭載される部位を保護するためのカバーとを備える高周波モジュールにおいて、少なくとも2つ以上のマイクロ波回路と、少なくとも1つ以上のマイクロ波回路の制御回路と、最下部に位置し一部に貫通穴をもつ金属導体と、一方の面が上記金属導体と接合し、かつ他方の面に信号伝達線路を設け、一部に前記制御回路を収納するための貫通穴をもつ第一の誘電体と、上記金属導体の貫通穴を通り第一の誘電体の金属導体との接合面に設けられた接続パッドに設けられた制御信号用ピンと、一方の面が第一の誘電体の信号伝達線路面に接合し、かつ他方の面に接地面をもつ第二の誘電体と、一方の面が上記第二の誘電体の接地面に接合し、かつ他方の面に第二の接地面を設けた第三の誘電体と、一方の面が上記第三の誘電体の第二の接地面に接合し、かつ他方の面に信号伝達線路面を設けた第四の誘電体と、一方の面が上記第四の誘電体の信号伝達線路面に接合し、かつ他方の面に接地面を設けた第五の誘電体と、一方の面が上記第五の誘電体の接地面に接合し、かつ他方の面に信号伝達線路面を設けた第六の誘電体と、一方の面が上記第六の誘電体の信号伝達線路面に接合し、かつ他方の面が接地された第七の誘電体と、上記第一から第七の誘電体中に設けられ、各信号伝達線路面と導通のとれるスルーホールと、第四の誘電体の接地面内に設けたスロットと、第七の誘電体の接地面内に設けたスロットと、上記金属導体に垂直に設けられ、第一から第三の誘電体を貫通する同軸型の第一の高周波コネクタとを有する多層誘電体で構成されたパッケージと、一方の面を接地面とし他方の面を信号伝達線路面とする第八の誘電体と、一方の面が上記第八の誘電体の信号伝達線路面と接合し、かつ他方の面に接地面を設けた第九の誘電体と、第九の誘電体の接地面に垂直に設けられ中心導体と第八の誘電体の信号伝達面の信号伝達線路との接続を第九の誘電体に設けた馬蹄形状に配置したスルーホールで実施した第二の高周波コネクタで構成し第八の誘電体の接地面を上記パッケージとの接合面とする上記構造体の上部カバーと、上記パッケージの最下部の金属導体に設けた上記制御回路用貫通穴に接合する金属で構成する下部カバーとで構成し、上記第二の誘電体の接地面に上記制御回路を搭載し、バンプ接続にて上記制御回路と第一の誘電体の信号伝達線路を接続し、上記第四の誘電体の他方の面に第一のマイクロ波回路を搭載し、バンプ接続にて上記第四の誘電体の信号伝達線路を接続し、上記第六の誘電体の他方の面に第二のマイクロ波回路を搭載し、バンプ接続にて上記第六の誘電体の信号伝達線路に接続し、上記制御信号用ピンから制御回路を上記第一の誘電体及び第二の誘電体の信号伝達線路及びスルーホールで接続し、上記制御回路から第一及び第二のマイクロ波回路への接続を上記第一から第六までの誘電体の信号伝達線路及びスルーホールにて実施し、第一の高周波コネクタと第一のマイクロ波回路との接続を金属ワイヤにて実施し、第一のマイクロ波回路と第二のマイクロ波回路との接続を上記第四の誘電体の信号伝達線路内の線路と第四の誘電体の接地面に設けたスロットと第五の誘電体の信号伝達線路内の線路との電磁結合で実施し、第二のマイクロ波回路と上記上部カバー内の第二の高周波コネクタの接続を第六の誘電体の信号伝達線路と第七の誘電体のスロットと第八の誘電体の信号伝達線路との電磁結合及び第九の誘電体の上記馬蹄形状のスルーホールで実施したものである。
【００１４】
【発明の実施の形態】
実施の形態１．
第1図にこの発明による高周波モジュールであるマイクロ波モジュールの一実施例を示す実装断面図、第2図に第1図の裏面視図、第3図に第1図の第五の誘電体6と第六の誘電体7の接合部で切った時の上面視図、第4図に第1図の第七の誘電体8と第八の誘電体9の接合部で切った時の上面視図、第5図に第1図の高周波回路である第一のマイクロ波回路13と高周波回路である第二のマイクロ波回路14とを接続するための電磁結合部の拡大図、第6図に第1図の第二の高周波コネクタと第八及び第九の誘電体との接続部の拡大図を示す。
図において、1は最下部に位置し一部に貫通穴をもつ金属導体、2は一方の面が金属導体1と接合し かつ他方の面に信号伝達線路面をもつ第一の誘電体、3は一方の面が第一の誘電体2の信号伝達線路面に接合しかつ他方の面に接地面をもつ第二の誘電体、4は一方の面が第二の誘電体3の接地面に接合し かつ他方の面に第二の接地面をもつ第三の誘電体、5は一方の面が第三の誘電体4の第二の接地面に接合し かつ他方の面に信号伝達線路面をもつ第四の誘電体、6は一方の面が第四の誘電体5の信号伝達線路面に接合しかつ他方の面に接地面をもつ第五の誘電体、7は一方が第五の誘電体6の接地面に接合しかつ他方の面に信号伝達線路面をもつ第六の誘電体、8は一方の面が第六の誘電体7の信号伝達線路面に接合しかつ他方に接地面をもつ第七の誘電体、9は一方の面を接地面としかつ他方の面に信号伝達線路面をもつ第八の誘電体、10は一方の面が第八の誘電体9の信号伝達線路面に接合し、かつ他方の面に接地面をもつ第九の誘電体、11は金属導体1の制御回路を搭載するための貫通穴をカバーするためマイクロ波モジュール下部に設けられた金属カバー、12は制御回路、13は第一のマイクロ波回路、14は第二のマイクロ波回路、15は金属導体1に垂直に設けられかつ金属導体1及び第一の誘電体2から第三の誘電体4までを貫通する 第一の高周波コネクタ、16は第九の誘電体10に垂直に設けられかつ第九の誘電体10の接地面に設けられた第二の高周波コネクタ、17は金属導体1の貫通穴を通り第一の誘電体の金属導体1との接合面に接合された制御信号ピン、18は第一から第九の誘電体内に設けられたスルーホール、19は第五の誘電体の接地面に設けられたスロット、20は第七の誘電体の接地面に設けられたスロット、21は第一の高周波コネクタ15の芯、22は第一の高周波コネクタ15の内部誘電体、23は第二の高周波コネクタ16の芯、27は金属ワイヤである。
【００１５】
金属導体1と第一の誘電体2から第七の誘電体8と第一の高周波コネクタ15及び制御信号ピン17でこの発明のマイクロ波モジュールのきょう体を構成しており、第八の誘電体9と第九の誘電体10と第二の高周波コネクタ16とで上記マイクロ波モジュールの上部カバーを構成している。
【００１６】
次に動作について説明する。まず、制御信号であるが、制御信号ピン17から入力された制御信号は第一の誘電体2に設けられたスルーホール18ａを通り第一の誘電体2の信号伝達線路を通りさらにスルーホール18ｂを通り金属ワイヤ27ｃを通り制御回路12に入力される。制御回路12で処理された信号は金属ワイヤ27ｄを通り、スルーホール18ｄ、18ｅ、18ｆを通り第四の誘電体5の信号伝達線路に接続され、第3図の金属ワイヤ27ｇから27ｈを通して第一のマイクロ波回路13に入力される。また、同様に制御回路12から出力された制御信号は第一の誘電体2から第六の誘電体7の内部のスルーホール18を通り第六の誘電体7上の線号伝達線路に接続され第4図の金属ワイヤ27ｉから27ｊを通して第二のマイクロ波回路14に入力される。上記制御信号に基づいて、第一のマイクロ波回路及び第二のマイクロ波回路は動作を行う。次に高周波信号であるが、第一の高周波コネクタ15から入力された高周波信号は第1図の金属ワイヤ27ｅを通して第一のマイクロ波回路13に入力される。上記制御信号に基づいて処理された高周波信号はマイクロ波回路13から出力され第1図の金属ワイヤ27ａを通り第四の誘電体5の信号伝達線路に接続される。第四の誘電体5に接続された高周波信号は第5図に示す構造をしたスロット19を介し第六の誘電体7の信号伝達線路に電磁結合される。電磁結合された高周波信号は第1図の金属ワイヤ27ｆを通り第二のマイクロ波回路14に入力される。上記制御信号にて処理された高周波信号はマイクロ波回路14から出力され第1図の金属ワイヤ27ｋを通り第六の誘電体7の信号伝達線路に接続される。第六の誘電体7に入力された高周波信号はスロット19を用いた電磁結合と同様にスロット20を用いて第八の誘電体9の信号伝達線路に伝達され、第八の誘電体9の信号伝達線路に伝達された高周波信号は第6図に示すスルーホール18ｇを介し第九の誘電体10の接地面に設けた第二の高周波コネクタ16の芯23に接続される。このとき、第八の誘電体9及び第九の誘電体10の内部に、互いに平行な複数のスルーホール18hを芯23を囲むように馬蹄形に配置することで同軸コネクタと同様な高周波信号の接続が実現できる。スルーホール18hにおける各ホールの間隔および芯23との距離、ホールの径などは、使用するマイクロ波の周波数に応じた電磁遮蔽の性能とコネクタに要求されるインピーダンスに基づいて適宜設定される。このスルーホール18h、第二の同軸コネクタ23およびスロット20を用いて第六の誘電体7の信号伝達線路に対して垂直方向にマイクロ波信号を伝達することにより、２つの同軸コネクタを同一方向に設けて金属導体１側に配置した場合と比べて実装場所の制限がなくなる。また、第二の高周波コネクタ16は芯23を第八の誘電体9の信号伝達線路に接続し、芯23の周囲にスルーホール18ｈを設けることによって形成されるため、同軸コネクタと信号伝達線路を接続するための金属ワイヤとその接続のためのスペースを設ける必要がなく、多層誘電体への実装に適している。
以上の構成により、スロット19を介して第四の誘電体5の信号伝達線路と第六の誘電体7の信号伝達線路を電磁結合で接続することによって、第一、第二のマイクロ波回路13、14を上下方向（積層方向）に配置でき、マイクロ波モジュールの投影面積の増大を防ぐことが可能となり、マイクロ波モジュールを小型化できる。
なお、上記マイクロ波モジュールの構成は、マイクロ波以外の周波数帯域を扱う高周波回路、例えばミリ波帯域の高周波回路などにも適用できることは言うまでもない。
【００１７】
実施の形態２．
この発明における他の実施例を第7図に示す。第7図において、1から23は第1図と同じ、26は制御回路12と第二の誘電体3 及び第一のマイクロ波回路13と第四の誘電体5 及び第二のマイクロ波回路14と第六の誘電体7とを接続する 例えば金のボールで形成したバンプである。
【００１８】
次に動作について説明する。まず、制御信号であるが、制御信号ピン17から入力された制御信号は第一の誘電体2に設けられたスルーホール18ａを通り第二の誘電体3の信号伝達線路を通りバンプ26ｂを通り制御回路12に入力される。制御回路12で処理された信号はバンプ26ａを通りスルーホール18ｄ、18ｅ、18ｆを通り第四の誘電体5の信号伝達線路に接続されバンプ26にて第一のマイクロ波回路13に入力される。また、同様に制御回路から出力された制御信号は第一の誘電体2から第六の誘電体7の内部のスルーホール18を通り第六の誘電体7上の信号伝達線路に接続され第二のマイクロ波回路14に入力される。上記制御信号にのっとり、第一のマイクロ波回路 及び第二のマイクロ波回路は動作を行う。次に高周波信号であるが、第一の高周波コネクタ15から入力された高周波信号は第１図の金属ワイヤ27ｌを通り第四の誘電体5の信号伝達線路に接続され、バンプ26ｄを通り第一のマイクロ波回路13に入力される。上記制御信号にのっとり処理された高周波信号はマイクロ波回路13から出力されバンプ26ａを通り第四の誘電体5の信号伝達線路に接続される。この場合、誘電体５の信号伝達線路にコプレナー線路を用いると、バンプ接続構造上有利である。第四の誘電体に接続された高周波信号は第5図に示す構造をしたスロット19を介し第六の誘電体7の信号伝達線路に電磁結合される。電磁結合された高周波信号は第7図のバンプ26ｃを通り第二のマイクロ波回路14に入力される。上記制御信号にて処理された高周波信号はマイクロ波回路14から出力され第7図のバンプ26ｄを通り第六の誘電体7の信号伝達線路に接続される。第六の誘電体7に入力された高周波信号はスロット19を用いた電磁結合と同様にスロット20を用いて第八の誘電体9の信号伝達線路に伝達され、第九の信号伝達線路に伝達された高周波信号は第6図に示すスルーホール18ｇを介し第九の誘電体10の接地面に設けた第二の高周波コネクタ16の芯23に接続される。このとき、実施の形態１と同様に第八の誘電体9及び第九の誘電体10の内部に馬蹄形にスルーホール18を配置することで同軸コネクタと同様な高周波信号の接続が実現できる。また、バンプ接続を用いることにより、第一、第二のマイクロ波回路13、14の周辺にワイヤ接続のためのスペースをなくすことで、マイクロ波モジュールを一層小型化できる。
【００１９】
【発明の効果】
この発明は以上説明した通り、2つ以上の高周波回路を電磁結合を用いて接続することで、上下方向（積層方向）に配置でき、高周波モジュールの投影面積の増大を防ぐことを可能とし、高周波モジュールを小型化できる効果がある。
【００２０】
また、2つ以上の高周波コネクタを設ける場合にも同一方向ではなく、相対する方向に設けることを可能とし、高周波モジュールの小型化の制限を緩和し、高周波モジュールをより小型化できる効果がある。
【００２１】
さらにまた、高周波回路と誘電体の接続をバンプ構造を用いて実施することで、高周波回路周辺にワイヤ接続のためのスペースをなくすことで、高周波モジュールをさらに一層小型化できる効果がある。
【図面の簡単な説明】
【図１】 この発明の実施の形態１の横断面図である。
【図２】 図１の裏面視図である。
【図３】 図1の第五の誘電体6と第六の誘電体7の接合部で切り離した時の断面の上視図である。
【図４】 図1の第七の誘電体8と第八の誘電体9との接合部で切り離した時の断面の上視図である。
【図５】 図1の第一のマイクロ波回路13と第二のマイクロ波回路14とを接続するための電磁結合部の拡大図である。
【図６】 図1の第二の高周波コネクタと第八及び第九の誘電体との接続部の拡大図を示す。
【図７】 この発明による実施の形態２の横断面図である。
【図８】 従来の実施例の横断面図である。
【図９】 図8の裏面視図である。
【図１０】 従来の実施例の高周波コネクタと第一のマイクロ波回路との接続部の拡大図である。
【符号の説明】
1 金属導体
2 第一の誘電体
3 第二の誘電体
4 第三の誘電体
5 第四の誘電体
6 第五の誘電体
7 第六の誘電体
8 第七の誘電体
9 第八の誘電体
10 第九の誘電体
11 下部金属カバー
12 マイクロ波回路の制御回路
13 第一マイクロ波回路
14 第二のマイクロh回路
15 第一の高周波コネクタ
16 第二の高周波コネクタ
17 制御信号ピン
18 誘電体内のスルーホール
19 スロット
20 スロット
21 第一の高周波コネクタの芯
22 第一の高周波コネクタの内部誘電体
23 第二の高周波コネクタの芯
24 シールリング
25 上部金属カバー
26 バンプ
27 金属ワイヤ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a high-frequency module represented by a microwave module having two or more high-frequency circuits such as a microwave circuit and its control circuit, and a casing made of a multi-layer dielectric, and in particular, a micro-circuit included therein. The present invention relates to a mounting structure of a microwave circuit and its control circuit.
[0002]
[Prior art]
FIG. 8 is a cross-sectional view of a microwave module showing an embodiment of a microwave module by a mounting method using a conventional package in which dielectrics are laminated, FIG. 9 is a rear view thereof, and FIG. 10 is a high-frequency connector thereof It is a figure which shows the connection structure of an internal microwave circuit. In the figure, 1 is the lowermost metal conductor, 2 is the first dielectric, 3 is the second dielectric, 4 is the third dielectric, 5 is the fourth dielectric, 6 is the fifth Dielectric material, 12 is a control circuit or control IC for a microwave circuit, 13 is a first microwave circuit, 15 is a high frequency connector, 17 is a control signal pin, 18 is a through hole in the dielectric, and 21 is the above high frequency connector 15 core wires, 24 is a seal ring, 25 is an upper lid, 27 is a connection wire, the connection surface of the first dielectric 2 and the second dielectric 3, and the third dielectric 4 and the fourth The signal transmission line surface is provided on the connection surface of the dielectric 5 and the surface of the fifth dielectric 6, the connection surface of the second dielectric 3 and the third dielectric 4, and the fourth dielectric 5 and the first A ground plane is provided on the joint surface with the fifth dielectric 6.
The microwave circuit here refers to a microwave circuit (Monolithic Microwave IC) in which circuit components such as an FET (field effect transistor) and a capacitor are integrally formed on a semiconductor substrate, or a semiconductor on a dielectric substrate. A microwave circuit (Microwave IC) in which a circuit component is formed and a semiconductor is mounted later is shown, and generally a flat rectangular shape is formed according to the shape of a substrate or a package of the substrate.
[0003]
Next, the operation will be described. The control signal input from the control signal pin 17 is input to the control circuit 12 through the through holes 18a, 18b, 18C, and 18d in the dielectric and through the connection wires 27d. The output signal of the control circuit 12 passes through the connecting wire 27c, passes through the through holes 18e and 18f in the dielectric, passes through the signal transmission line surface of the third dielectric 4, and passes through the connecting wires 27a and 27b to Input to the microwave circuit 13. The microwave signal is input from the high frequency connector 15a, input to the microwave circuit 13 through the connection wire 27e, and the output signal processed by the first microwave circuit 13 based on the control signal is the high frequency connector 15a. In the same manner as described above, the signal is output from the high frequency connector 15b connected to the first microwave circuit 13.
[0004]
Also, when multiple microwave circuits are mounted, it can be realized by arranging multiple microwave circuits on the ground plane of the second dielectric 3 and deploying the circuits in two dimensions. These connections are made with microstrip lines and connecting wires.
[0005]
[Problems to be solved by the invention]
As described above, in a microwave module using a conventional package in which dielectrics are stacked, when two or more microwave circuits are mounted inside, there is only one surface on which the microwave circuit is mounted ( For example, in the case of FIG. 8, the connection between the microwave circuits has to be performed in a plane because of the ground plane of the second dielectric 3. Further, when two or more high-frequency connectors are required, they must be provided in the same direction.
[0006]
However, increasing the number of circuits in a plane using a microstrip line increases the projected area of the microwave circuit (the area of the surface perpendicular to the thickness direction), and as a result, the microwave on which the microwave circuit is mounted. In a system that requires a module, the occupied area of the module increases, and there is a problem that the system becomes larger.
Further, when two or more high-frequency connectors are provided in the same direction, there is a problem that miniaturization of the microwave module is limited. For example, when an array antenna is configured by a microwave module, a power feeding circuit that distributes and supplies a microwave signal to the microwave circuit and an array antenna element that radiates the microwave signal from the microwave circuit are connected to the microwave module. In order to arrange in the same direction, it is necessary to provide a hole for inputting in addition to the output of the microwave signal in the power supply circuit, and as a result, the space for mounting the power supply circuit is reduced.
The present invention has been made in order to solve the above-described problem, and reduces the mounting area when a plurality of high-frequency circuits are mounted, and also when two or more high-frequency connectors are provided, the relative direction is not the same. Thus, a high-frequency module that can be provided in the direction to be obtained is obtained.
[0007]
[Means for Solving the Problems]
A high-frequency wave module according to a first invention is a high-frequency module in which a first and second high-frequency circuits are mounted on a structure formed by laminating a plurality of dielectrics, and is connected to the first high-frequency circuit. A first dielectric formed with a first signal transmission line; a second dielectric formed with a second signal transmission line connected to a second high-frequency circuit; and the first signal transmission line. And a coupling means for transmitting a high frequency signal by electromagnetically coupling the second signal transmission line, wherein the first high frequency circuit and the second high frequency circuit are the first dielectric and the second dielectric. The projection surfaces in the stacking direction are arranged on the ground plane so as to be overlapped with each other. As a result, the high-frequency circuits can be arranged in a hierarchical manner, and an increase in the projected area of the high-frequency module can be prevented.
[0008]
In the high-frequency module according to the second aspect of the invention, the coupling means includes a grounding surface having one surface abutting on the first signal transmission line forming surface of the first dielectric and a slot on the other surface. The third dielectric is formed, and the grounding surface is in contact with the surface of the second dielectric that faces the formation surface of the second signal transmission line.
[0009]
In the high-frequency module according to the third aspect of the invention, the first high-frequency circuit is placed on a ground plane that is in contact with a surface of the first dielectric that faces the formation surface of the first signal transmission line, The second high-frequency circuit is placed on the ground plane in the third dielectric.
[0010]
In the high frequency module according to the fourth invention, the first and second signal transmission lines form a coplanar line together with a grounded line, and the first high frequency circuit is a coplanar line in the first dielectric. The second high-frequency circuit is placed on the first dielectric in a bump-connected state, and the second high-frequency circuit is bump-connected on the coplanar line in the second dielectric. It is placed. This eliminates the need for a space for wire connection around the high-frequency circuit.
[0011]
A high frequency circuit according to a fifth aspect of the present invention is a high frequency module comprising a high frequency circuit mounted on a structure formed by laminating a plurality of dielectrics, and is provided above the high frequency circuit and connected to the high frequency circuit. A first high-frequency connector that transmits a high frequency to and from the signal transmission line, and a second high-frequency connector that is provided below the high-frequency circuit and transmits a high frequency to and from the high-frequency circuit. The high-frequency connector includes a core wire connected to the signal transmission line and a plurality of through holes arranged in a horseshoe shape around the core wire so as to be separated from the signal transmission line. As a result, even when two or more high-frequency connectors are provided, they can be provided in opposite directions rather than in the same direction.
[0012]
A high frequency module according to a sixth aspect of the invention includes a microwave circuit, a control circuit for the microwave circuit, a high frequency connector connected to the microwave circuit, a control pin connected to the control circuit, In a high-frequency module including a microwave circuit and a cover for protecting a part on which the control circuit is mounted, at least two microwave circuits, at least one control circuit of the microwave circuit, and a lowermost part A metal conductor that is located and partially has a through hole, one surface is joined to the metal conductor, a signal transmission line is provided on the other surface, and a part has a through hole for accommodating the control circuit A control signal pin provided on a connection pad provided on a joint surface between the first dielectric and the metal conductor of the first dielectric passing through the through hole of the metal conductor, and one surface is the first A second dielectric having a ground plane on the other surface and a ground plane on the other surface; one side bonded to the ground plane of the second dielectric and a second plane on the other surface; A third dielectric having a second ground plane, and a fourth dielectric having one surface bonded to the second ground plane of the third dielectric and a signal transmission line plane on the other surface. A fifth dielectric having one surface joined to the signal transmission line surface of the fourth dielectric and a ground surface on the other surface, and one surface of the fifth dielectric A sixth dielectric having a signal transmission line surface on the other surface and a signal transmission line surface on the other surface, one surface bonded to the signal transmission line surface of the sixth dielectric, and the other surface grounded Provided in the first to seventh dielectrics, through holes that can be electrically connected to each signal transmission line surface, and provided in the ground plane of the fourth dielectric. A slot, a slot provided in the ground plane of the seventh dielectric, and a coaxial first high-frequency connector that is provided perpendicular to the metal conductor and penetrates the first to third dielectrics. A package composed of a multilayer dielectric characterized by the following: an eighth dielectric having one surface as a ground plane and the other as a signal transmission line surface; and one surface transmitting the signal from the eighth dielectric. A ninth dielectric that is joined to the line surface and has a grounding surface on the other surface, and a signal on the signal transmission surface of the center conductor and the eighth dielectric that is provided perpendicular to the grounding surface of the ninth dielectric The connection with the transmission line is composed of a second high frequency connector implemented by a horseshoe-shaped through hole provided in the ninth dielectric, and the ground plane of the eighth dielectric is used as a joint surface with the package Provided on the top cover of the package and the bottom metal conductor of the package And a lower cover made of metal joined to the through hole for the control circuit, the control circuit is mounted on the ground plane of the second dielectric, and the control circuit and the first dielectric are made of metal wire. A signal transmission line is connected, the first microwave circuit is mounted on the second ground plane of the third dielectric, the signal transmission line of the fourth dielectric is connected by a metal wire, and the first A second microwave circuit is mounted on the ground plane of the fifth dielectric, connected to the signal transmission line of the sixth dielectric by a metal wire, and the control circuit is connected to the first dielectric from the control signal pin. And the second dielectric signal transmission line and through-holes, and the connection from the control circuit to the first and second microwave circuits is the first to sixth dielectric signal transmission lines and Implemented through hole, first high frequency connector and first microphone The connection to the wave circuit is performed with a metal wire, and the connection between the first microwave circuit and the second microwave circuit is performed between the line in the signal transmission line of the fourth dielectric and the fourth dielectric. Conducted by electromagnetic coupling between the slot provided on the ground plane and the line in the fifth dielectric signal transmission line, and the connection between the second microwave circuit and the second high frequency connector in the upper cover is the sixth This is implemented by electromagnetic coupling of a dielectric signal transmission line, a seventh dielectric slot, and an eighth dielectric signal transmission line, and the horseshoe-shaped through-hole of the ninth dielectric.
[0013]
Further, a high frequency module according to a seventh aspect of the invention includes a microwave circuit, a control circuit for the microwave circuit, a high frequency connector connected to the microwave circuit, a control pin connected to the control circuit, In a high-frequency module including a microwave circuit and a cover for protecting a part on which the control circuit is mounted, at least two microwave circuits, at least one control circuit of the microwave circuit, and a lowermost part A metal conductor that is located and partially has a through hole, one surface is joined to the metal conductor, a signal transmission line is provided on the other surface, and a part has a through hole for accommodating the control circuit A control signal pin provided on a connection pad provided on a joint surface between the first dielectric and the metal conductor of the first dielectric passing through the through hole of the metal conductor, and one surface is the first A second dielectric having a ground plane on the other surface and a ground plane on the other surface; one side bonded to the ground plane of the second dielectric and a second plane on the other surface; A third dielectric having a second ground plane, and a fourth dielectric having one surface bonded to the second ground plane of the third dielectric and a signal transmission line plane on the other surface. A fifth dielectric having one surface joined to the signal transmission line surface of the fourth dielectric and a ground surface on the other surface, and one surface of the fifth dielectric A sixth dielectric having a signal transmission line surface on the other surface and a signal transmission line surface on the other surface, one surface bonded to the signal transmission line surface of the sixth dielectric, and the other surface grounded Provided in the first to seventh dielectrics, through holes that can be electrically connected to each signal transmission line surface, and provided in the ground plane of the fourth dielectric. A multilayer having a slot, a slot provided in the ground plane of the seventh dielectric, and a coaxial first high-frequency connector provided perpendicular to the metal conductor and penetrating the first to third dielectrics A package composed of a dielectric, an eighth dielectric having one surface as a ground plane and the other as a signal transmission line surface, and one surface joined to the signal transmission line surface of the eighth dielectric And a ninth dielectric provided with a ground plane on the other surface, and a center conductor provided perpendicular to the ground plane of the ninth dielectric and a signal transmission line on the signal transmission surface of the eighth dielectric. The upper part of the structure is composed of a second high-frequency connector implemented by a horseshoe-shaped through-hole connected to the ninth dielectric, and the ground plane of the eighth dielectric is the joint surface with the package A cover and a through hole for the control circuit provided on the lowermost metal conductor of the package. It is composed of a lower cover made of metal joined to the hole, the control circuit is mounted on the ground surface of the second dielectric, and the control circuit and the signal transmission line of the first dielectric are connected by bump connection. Connecting, mounting the first microwave circuit on the other surface of the fourth dielectric, connecting the signal transmission line of the fourth dielectric by bump connection, and connecting the other of the sixth dielectric The second microwave circuit is mounted on the surface, connected to the signal transmission line of the sixth dielectric by bump connection, and the control circuit is connected to the first dielectric and the second dielectric from the control signal pin. Connected with dielectric signal transmission lines and through-holes, and connected from the control circuit to the first and second microwave circuits with the first to sixth dielectric signal transmission lines and through-holes. Connection between the first high frequency connector and the first microwave circuit. A slot provided in the wire in the signal transmission line of the fourth dielectric and the ground plane of the fourth dielectric for connection with the first microwave circuit and the second microwave circuit. And the fifth dielectric signal transmission line, and the second microwave circuit and the second high frequency connector in the upper cover are connected by a sixth dielectric signal transmission line. And the seventh dielectric slot and the eighth dielectric signal transmission line, and the ninth dielectric through the horseshoe-shaped through-hole.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
FIG. 1 is a mounting sectional view showing an embodiment of a microwave module which is a high-frequency module according to the present invention, FIG. 2 is a rear view of FIG. 1, and FIG. 3 is a fifth dielectric 6 of FIG. FIG. 4 is a top view when cut at the junction of the sixth dielectric 7 and FIG. 4 is a top view when cut at the junction of the seventh dielectric 8 and the eighth dielectric 9 in FIG. FIG. 5, FIG. 5 is an enlarged view of an electromagnetic coupling unit for connecting the first microwave circuit 13 which is the high frequency circuit of FIG. 1 and the second microwave circuit 14 which is the high frequency circuit, and FIG. FIG. 8 shows an enlarged view of a connection portion between the second high frequency connector of FIG. 1 and the eighth and ninth dielectrics.
In the figure, 1 is a metal conductor located at the bottom and partly having a through hole, 2 is a first dielectric having one surface joined to the metal conductor 1 and a signal transmission line surface on the other surface, 3 Is a second dielectric having one surface bonded to the signal transmission line surface of the first dielectric 2 and a ground surface on the other surface, and 4 is a ground surface of the second dielectric 3 on one surface. A third dielectric having a second ground plane on the other side, 5 is joined to the second ground plane of the third dielectric 4 on one side and the signal transmission line surface on the other side A fifth dielectric having one surface bonded to the signal transmission line surface of the fourth dielectric 5 and a ground plane on the other surface, and 7 having a fifth dielectric. A sixth dielectric having a signal transmission line surface bonded to the ground surface of the dielectric 6 and having a signal transmission line surface on the other surface, 8 has one surface bonded to the signal transmission line surface of the sixth dielectric 7 and the other. 7th dielectric with ground 9 is an eighth dielectric having one surface as a ground plane and a signal transmission line surface on the other surface, 10 is bonded to the signal transmission line surface of the eighth dielectric 9 on one surface, and the other Ninth dielectric having a ground plane on the surface, 11 is a metal cover provided at the bottom of the microwave module to cover the through hole for mounting the control circuit of metal conductor 1, 12 is the control circuit, 13 is the first One microwave circuit, 14 is a second microwave circuit, 15 is provided perpendicular to the metal conductor 1 and penetrates the metal conductor 1 and the first dielectric 2 to the third dielectric 4 A high frequency connector, 16 is a second high frequency connector provided perpendicularly to the ninth dielectric 10 and provided on the ground plane of the ninth dielectric 10, and 17 is a first dielectric through the through hole of the metal conductor 1. Control signal pin 18 joined to the joint surface with the metal conductor 1 of the body, 18 is a through provided in the first to ninth dielectric bodies Hole, 19 is a slot provided on the ground plane of the fifth dielectric, 20 is a slot provided on the ground plane of the seventh dielectric, 21 is the core of the first high frequency connector 15, and 22 is the first The internal dielectric of the high frequency connector 15, 23 is the core of the second high frequency connector 16, and 27 is a metal wire.
[0015]
The metal conductor 1, the first dielectric 2, the seventh dielectric 8, the first high-frequency connector 15, and the control signal pin 17 constitute the casing of the microwave module of the present invention, and the eighth dielectric The ninth dielectric member 10 and the second high-frequency connector 16 constitute the upper cover of the microwave module.
[0016]
Next, the operation will be described. First, as a control signal, a control signal input from the control signal pin 17 passes through a through hole 18a provided in the first dielectric 2, passes through a signal transmission line of the first dielectric 2, and further passes through a through hole 18b. Through the metal wire 27c and input to the control circuit 12. The signal processed by the control circuit 12 passes through the metal wire 27d, is connected to the signal transmission line of the fourth dielectric 5 through the through holes 18d, 18e and 18f, and passes through the metal wires 27g to 27h in FIG. Is input to the microwave circuit 13. Similarly, the control signal output from the control circuit 12 is connected to the line transmission line on the sixth dielectric 7 through the first dielectric 2 through the through hole 18 in the sixth dielectric 7. It is input to the second microwave circuit 14 through the metal wires 27i to 27j in FIG. Based on the control signal, the first microwave circuit and the second microwave circuit operate. Next, as a high-frequency signal, the high-frequency signal input from the first high-frequency connector 15 is input to the first microwave circuit 13 through the metal wire 27e shown in FIG. The high-frequency signal processed based on the control signal is output from the microwave circuit 13 and connected to the signal transmission line of the fourth dielectric 5 through the metal wire 27a of FIG. The high frequency signal connected to the fourth dielectric 5 is electromagnetically coupled to the signal transmission line of the sixth dielectric 7 through the slot 19 having the structure shown in FIG. The electromagnetically coupled high frequency signal is input to the second microwave circuit 14 through the metal wire 27f shown in FIG. The high frequency signal processed by the control signal is output from the microwave circuit 14 and connected to the signal transmission line of the sixth dielectric 7 through the metal wire 27k of FIG. The high frequency signal input to the sixth dielectric 7 is transmitted to the signal transmission line of the eighth dielectric 9 using the slot 20 similarly to the electromagnetic coupling using the slot 19, and the signal of the eighth dielectric 9 is transmitted. The high frequency signal transmitted to the transmission line is connected to the core 23 of the second high frequency connector 16 provided on the ground plane of the ninth dielectric 10 through the through hole 18g shown in FIG. At this time, inside the eighth dielectric 9 and the ninth dielectric 10, a plurality of through holes 18h parallel to each other are arranged in a horseshoe shape so as to surround the core 23, thereby connecting high-frequency signals similar to the coaxial connector Can be realized. The distance between each hole in the through hole 18h, the distance from the core 23, the diameter of the hole, and the like are appropriately set based on the electromagnetic shielding performance and the impedance required for the connector according to the frequency of the microwave used. By using this through hole 18h, the second coaxial connector 23 and the slot 20 to transmit a microwave signal in a direction perpendicular to the signal transmission line of the sixth dielectric 7, the two coaxial connectors are aligned in the same direction. Compared with the case where it is provided and arranged on the metal conductor 1 side, there are no restrictions on the mounting location. The second high-frequency connector 16 is formed by connecting the core 23 to the signal transmission line of the eighth dielectric 9 and providing a through hole 18h around the core 23, so that the coaxial connector and the signal transmission line are connected. It is not necessary to provide a metal wire for connection and a space for the connection, and is suitable for mounting on a multilayer dielectric.
With the above configuration, the first and second microwave circuits 13 are connected by electromagnetically coupling the signal transmission line of the fourth dielectric 5 and the signal transmission line of the sixth dielectric 7 via the slot 19. 14 can be arranged in the vertical direction (stacking direction), the increase in the projected area of the microwave module can be prevented, and the microwave module can be miniaturized.
Needless to say, the configuration of the microwave module can be applied to a high-frequency circuit that handles a frequency band other than the microwave, such as a high-frequency circuit in the millimeter wave band.
[0017]
Embodiment 2. FIG.
Another embodiment of the present invention is shown in FIG. In FIG. 7, 1 to 23 are the same as in FIG. 1, and 26 is a control circuit 12, a second dielectric 3, and a first microwave circuit 13, a fourth dielectric 5, and a second microwave circuit 14. For example, a bump formed of a gold ball.
[0018]
Next, the operation will be described. First, as a control signal, the control signal input from the control signal pin 17 passes through the through hole 18a provided in the first dielectric 2 and the signal transmission line of the second dielectric 3 and the bump 26b. Input to the control circuit 12. The signal processed by the control circuit 12 is connected to the signal transmission line of the fourth dielectric 5 through the through holes 18d, 18e and 18f through the bump 26a, and is input to the first microwave circuit 13 through the bump 26. . Similarly, the control signal output from the control circuit passes through the through hole 18 in the first dielectric 2 to the sixth dielectric 7 and is connected to the signal transmission line on the sixth dielectric 7. Are input to the microwave circuit 14. In accordance with the control signal, the first microwave circuit and the second microwave circuit operate. Next, as a high-frequency signal, the high-frequency signal input from the first high-frequency connector 15 is connected to the signal transmission line of the fourth dielectric 5 through the metal wire 27l in FIG. Is input to the microwave circuit 13. The high-frequency signal processed according to the control signal is output from the microwave circuit 13 and connected to the signal transmission line of the fourth dielectric 5 through the bump 26a. In this case, using a coplanar line as the signal transmission line of the dielectric 5 is advantageous in terms of the bump connection structure. The high frequency signal connected to the fourth dielectric is electromagnetically coupled to the signal transmission line of the sixth dielectric 7 through the slot 19 having the structure shown in FIG. The electromagnetically coupled high-frequency signal is input to the second microwave circuit 14 through the bump 26c in FIG. The high frequency signal processed by the control signal is output from the microwave circuit 14 and connected to the signal transmission line of the sixth dielectric 7 through the bump 26d of FIG. The high frequency signal input to the sixth dielectric 7 is transmitted to the signal transmission line of the eighth dielectric 9 using the slot 20 in the same manner as the electromagnetic coupling using the slot 19, and is transmitted to the ninth signal transmission line. The high frequency signal thus connected is connected to the core 23 of the second high frequency connector 16 provided on the ground plane of the ninth dielectric 10 through the through hole 18g shown in FIG. At this time, the same high frequency signal connection as that of the coaxial connector can be realized by arranging the through-holes 18 in a horseshoe shape inside the eighth dielectric 9 and the ninth dielectric 10 as in the first embodiment. In addition, by using bump connection, the microwave module can be further reduced in size by eliminating the space for wire connection around the first and second microwave circuits 13 and 14.
[0019]
【The invention's effect】
As described above, the present invention can be arranged in the vertical direction (stacking direction) by connecting two or more high-frequency circuits using electromagnetic coupling, and can prevent an increase in the projected area of the high-frequency module. The module can be downsized.
[0020]
Further, when two or more high-frequency connectors are provided, they can be provided in opposite directions rather than in the same direction, and there is an effect that the restriction on miniaturization of the high-frequency module can be relaxed and the high-frequency module can be further miniaturized.
[0021]
Furthermore, by connecting the high-frequency circuit and the dielectric using a bump structure, there is an effect that the high-frequency module can be further reduced in size by eliminating the space for wire connection around the high-frequency circuit.
[Brief description of the drawings]
FIG. 1 is a transverse sectional view of Embodiment 1 of the present invention.
2 is a rear view of FIG. 1. FIG.
FIG. 3 is a top view of a cross section when cut off at a junction between a fifth dielectric 6 and a sixth dielectric 7 in FIG.
4 is a top view of a cross section when cut off at a junction between a seventh dielectric 8 and an eighth dielectric 9 in FIG. 1. FIG.
FIG. 5 is an enlarged view of an electromagnetic coupling unit for connecting the first microwave circuit 13 and the second microwave circuit 14 of FIG. 1;
6 shows an enlarged view of a connection portion between the second high frequency connector of FIG. 1 and the eighth and ninth dielectrics. FIG.
FIG. 7 is a cross sectional view of a second embodiment according to the present invention.
FIG. 8 is a cross-sectional view of a conventional example.
9 is a rear view of FIG. 8. FIG.
FIG. 10 is an enlarged view of a connection portion between the high frequency connector of the conventional example and the first microwave circuit.
[Explanation of symbols]
1 Metal conductor
2 First dielectric
3 Second dielectric
4 Third dielectric
5 Fourth dielectric
6 Fifth dielectric
7 Sixth dielectric
8 Seventh dielectric
9 Eighth dielectric
10 Ninth dielectric
11 Lower metal cover
12 Microwave circuit control circuit
13 First microwave circuit
14 Second micro-h circuit
15 First high frequency connector
16 Second high frequency connector
17 Control signal pin
18 Through hole in dielectric
19 slots
20 slots
21 Core of the first high frequency connector
22 Internal dielectric of the first high frequency connector
23 Core of second high frequency connector
24 Seal ring
25 Top metal cover
26 Bump
27 Metal wire

Claims (3)

複数の誘電体が積層されて形成された構造体に第一、第二の高周波回路を搭載して成る高周波モジュールにおいて、
第一の高周波回路に接続される第一の信号伝達線路が形成された第一の誘電体と、
第二の高周波回路に接続される第二の信号伝達線路が形成された第二の誘電体と、
一方の面が上記第一の誘電体における第一の信号伝達線路の形成面に当接し、他方の面に上記第一の信号伝達線路と第二の信号伝達線路を電磁結合して高周波信号を伝達するスロットを有する接地面が形成されるとともに、その接地面が上記第二の誘電体における上記第二の信号伝達線路の形成面と対向する面に当接した第三の誘電体と、
上記第一の高周波回路と上記第二の高周波回路は、上記第一の誘電体と第二の誘電体の積層方向の投影面に互いに重なりを有するように離間して接地面上に配置され、
上記第一の高周波回路は上記第一の誘電体における第一の信号伝達線路の形成面と対向する面に当接した接地面上に載置され、上記第二の高周波回路は上記第三の誘電体における接地面上に載置された、
ことを特徴とする高周波モジュール。In a high frequency module comprising a first and second high frequency circuits mounted on a structure formed by laminating a plurality of dielectrics,
A first dielectric formed with a first signal transmission line connected to the first high-frequency circuit;
A second dielectric formed with a second signal transmission line connected to the second high-frequency circuit;
One surface is in contact with the first signal transmission line forming surface of the first dielectric, and the first signal transmission line and the second signal transmission line are electromagnetically coupled to the other surface to generate a high-frequency signal. A ground plane having a slot for transmitting is formed, and the ground plane is in contact with a surface of the second dielectric facing the formation surface of the second signal transmission line;
The first high-frequency circuit and the second high-frequency circuit are arranged on a ground plane so as to be spaced apart from each other so as to overlap each other in the projection plane in the stacking direction of the first dielectric and the second dielectric,
The first high-frequency circuit is placed on a grounding surface that is in contact with a surface of the first dielectric that faces the formation surface of the first signal transmission line, and the second high-frequency circuit is the third high-frequency circuit. Placed on the ground plane in the dielectric,
A high-frequency module characterized by that. 内部にマイクロ波回路と、前記マイクロ波回路の制御回路と、前記マイクロ波回路と接続される高周波コネクタと、前記制御回路と接続される制御ピンと、前記マイクロ波回路と制御回路が搭載される部位を保護するためのカバーとを備える高周波モジュールにおいて、少なくとも2つ以上のマイクロ波回路と、少なくとも1つ以上のマイクロ波回路の制御回路と、最下部に位置し一部に貫通穴をもつ金属導体と、一方の面が上記金属導体と接合し、かつ他方の面に信号伝達線路を設け、一部に前記制御回路を収納するための貫通穴をもつ第一の誘電体と、上記金属導体の貫通穴を通り第一の誘電体の金属導体との接合面に設けられた接続パッドに設けられた制御信号用ピンと、一方の面が第一の誘電体の信号伝達線路面に接合し、かつ他方の面に接地面をもつ第二の誘電体と、一方の面が上記第二の誘電体の接地面に接合し、かつ他方の面に第二の接地面を設けた第三の誘電体と、一方の面が上記第三の誘電体の第二の接地面に接合し、かつ他方の面に信号伝達線路面を設けた第四の誘電体と、一方の面が上記第四の誘電体の信号伝達線路面に接合し、かつ他方の面に接地面を設けた第五の誘電体と、一方の面が上記第五の誘電体の接地面に接合し、かつ他方の面に信号伝達線路面を設けた第六の誘電体と、一方の面が上記第六の誘電体の信号伝達線路面に接合し、かつ他方の面が接地された第七の誘電体と、上記第一から第七の誘電体中に設けられ、各信号伝達線路面と導通のとれるスルーホールと、第四の誘電体の接地面内に設けたスロットと、第七の誘電体の接地面内に設けたスロットと、上記金属導体に垂直に設けられ、第一から第三の誘電体を貫通する同軸型の第一の高周波コネクタとを有する多層誘電体で構成されたパッケージと、一方の面を接地面とし他方の面を信号伝達線路面とする第八の誘電体と、一方の面が上記第八の誘電体の信号伝達線路面と接合し、かつ他方の面に接地面を設けた第九の誘電体と、第九の誘電体の接地面に垂直に設けられ中心導体と第八の誘電体の信号伝達面の信号伝達線路との接続を第九の誘電体に設けた馬蹄形状に配置したスルーホールで実施した第二の高周波コネクタで構成し第八の誘電体の接地面を上記パッケージとの接合面とする上記構造体の上部カバーと、上記パッケージの最下部の金属導体に設けた上記制御回路用貫通穴に接合する金属で構成する下部カバーとで構成し、上記第二の誘電体の接地面に上記制御回路を搭載し、金属ワイヤで上記制御回路と第一の誘電体の信号伝達線路を接続し、上記第三の誘電体の第二の接地面に第一のマイクロ波回路を搭載し、金属ワイヤにて上記第四の誘電体の信号伝達線路を接続し、上記第五の誘電体の接地面に第二のマイクロ波回路を搭載し、金属ワイヤにて上記第六の誘電体の信号伝達線路に接続し、上記制御信号用ピンから制御回路を上記第一の誘電体及び第二の誘電体の信号伝達線路及びスルーホールで接続し、上記制御回路から第一及び第二のマイクロ波回路への接続を上記第一から第六までの誘電体の信号伝達線路及びスルーホールにて実施し、第一の高周波コネクタと第一のマイクロ波回路との接続を金属ワイヤにて実施し、第一のマイクロ波回路と第二のマイクロ波回路との接続を上記第四の誘電体の信号伝達線路内の線路と第四の誘電体の接地面に設けたスロットと第五の誘電体の信号伝達線路内の線路との電磁結合で実施し、第二のマイクロ波回路と上記上部カバー内の第二の高周波コネクタの接続を第六の誘電体の信号伝達線路と第七の誘電体のスロットと第八の誘電体の信号伝達線路との電磁結合及び第九の誘電体の上記馬蹄形状のスルーホールで実施したことを特徴とする高周波モジュール。  Inside the microwave circuit, the control circuit of the microwave circuit, the high frequency connector connected to the microwave circuit, the control pin connected to the control circuit, and the part where the microwave circuit and the control circuit are mounted A high-frequency module including a cover for protecting at least two microwave circuits, at least one control circuit for the microwave circuits, and a metal conductor located at the bottom and partially having a through hole A first dielectric having one surface joined to the metal conductor and a signal transmission line on the other surface, and having a through hole for accommodating the control circuit in a part thereof, and the metal conductor A control signal pin provided on the connection pad provided on the joint surface with the metal conductor of the first dielectric through the through hole, one surface joined to the signal transmission line surface of the first dielectric, and The other A second dielectric having a ground plane on one side, a third dielectric having one side bonded to the ground plane of the second dielectric and a second ground plane on the other side; Is connected to the second grounding surface of the third dielectric, and the other surface is provided with a signal transmission line surface, and one surface is the signal of the fourth dielectric. A fifth dielectric body joined to the transmission line surface and provided with a ground plane on the other surface, one surface joined to the ground plane of the fifth dielectric body, and the signal transmission line surface to the other surface A seventh dielectric having one surface bonded to the signal transmission line surface of the sixth dielectric and the other surface grounded, and the first to seventh Provided in the dielectric, and provided in the ground plane of the seventh dielectric, through-holes that can be electrically connected to each signal transmission line plane, slots provided in the ground plane of the fourth dielectric, A package formed of a multilayer dielectric having a slot and a coaxial first high-frequency connector provided perpendicularly to the metal conductor and penetrating the first to third dielectrics; And an eighth dielectric having the other surface as a signal transmission line surface, and a ninth surface in which one surface is joined to the signal transmission line surface of the eighth dielectric and a ground plane is provided on the other surface. The connection between the dielectric and the signal conductor of the eighth dielectric signal transmission surface provided perpendicular to the ground plane of the ninth dielectric is arranged in a horseshoe shape provided in the ninth dielectric. The upper cover of the structure, which is composed of a second high-frequency connector implemented in a through-hole and has the grounding surface of the eighth dielectric as the joint surface with the package, and the metal conductor at the bottom of the package With the lower cover made of metal joined to the control circuit through hole The control circuit is mounted on the ground plane of the second dielectric, the control circuit and the first dielectric signal transmission line are connected with a metal wire, and the second dielectric second The first microwave circuit is mounted on the ground plane, the signal transmission line of the fourth dielectric is connected by a metal wire, and the second microwave circuit is mounted on the ground plane of the fifth dielectric. And connecting to the sixth dielectric signal transmission line by a metal wire, and connecting the control circuit from the control signal pin through the first dielectric and second dielectric signal transmission lines and through-holes. The connection from the control circuit to the first and second microwave circuits is performed through the first to sixth dielectric signal transmission lines and through holes, and the first high-frequency connector and the first microwave circuit are connected. The first microwave circuit is connected to the wave circuit with a metal wire. A line in the fourth dielectric signal transmission line, a slot provided in the ground plane of the fourth dielectric, a line in the fifth dielectric signal transmission line, and a connection in the second microwave circuit; The second microwave circuit and the second high frequency connector in the upper cover are connected by the sixth dielectric signal transmission line, the seventh dielectric slot and the eighth dielectric. A high frequency module implemented by electromagnetic coupling with the signal transmission line and the horseshoe-shaped through-hole of the ninth dielectric. 内部にマイクロ波回路と、前記マイクロ波回路の制御回路と、前記マイクロ波回路と接続される高周波コネクタと、前記制御回路と接続される制御ピンと、前記マイクロ波回路と制御回路が搭載される部位を保護するためのカバーとを備える高周波モジュールにおいて、少なくとも2つ以上のマイクロ波回路と、少なくとも1つ以上のマイクロ波回路の制御回路と、最下部に位置し一部に貫通穴をもつ金属導体と、一方の面が上記金属導体と接合し、かつ他方の面に信号伝達線路を設け、一部に前記制御回路を収納するための貫通穴をもつ第一の誘電体と、上記金属導体の貫通穴を通り第一の誘電体の金属導体との接合面に設けられた接続パッドに設けられた制御信号用ピンと、一方の面が第一の誘電体の信号伝達線路面に接合し、かつ他方の面に接地面をもつ第二の誘電体と、一方の面が上記第二の誘電体の接地面に接合し、かつ他方の面に第二の接地面を設けた第三の誘電体と、一方の面が上記第三の誘電体の第二の接地面に接合し、かつ他方の面に信号伝達線路面を設けた第四の誘電体と、一方の面が上記第四の誘電体の信号伝達線路面に接合し、かつ他方の面に接地面を設けた第五の誘電体と、一方の面が上記第五の誘電体の接地面に接合し、かつ他方の面に信号伝達線路面を設けた第六の誘電体と、一方の面が上記第六の誘電体の信号伝達線路面に接合し、かつ他方の面が接地された第七の誘電体と、上記第一から第七の誘電体中に設けられ、各信号伝達線路面と導通のとれるスルーホールと、第四の誘電体の接地面内に設けたスロットと、第七の誘電体の接地面内に設けたスロットと、上記金属導体に垂直に設けられ、第一から第三の誘電体を貫通する同軸型の第一の高周波コネクタとを有する多層誘電体で構成されたパッケージと、一方の面を接地面とし他方の面を信号伝達線路面とする第八の誘電体と、一方の面が上記第八の誘電体の信号伝達線路面と接合し、かつ他方の面に接地面を設けた第九の誘電体と、第九の誘電体の接地面に垂直に設けられ中心導体と第八の誘電体の信号伝達面の信号伝達線路との接続を第九の誘電体に設けた馬蹄形状に配置したスルーホールで実施した第二の高周波コネクタで構成し第八の誘電体の接地面を上記パッケージとの接合面とする上記構造体の上部カバーと、上記パッケージの最下部の金属導体に設けた上記制御回路用貫通穴に接合する金属で構成する下部カバーとで構成し、上記第二の誘電体の接地面に上記制御回路を搭載し、バンプ接続にて上記制御回路と第一の誘電体の信号伝達線路を接続し、上記第四の誘電体の他方の面に第一のマイクロ波回路を搭載し、バンプ接続にて上記第四の誘電体の信号伝達線路を接続し、上記第六の誘電体の他方の面に第二のマイクロ波回路を搭載し、バンプ接続にて上記第六の誘電体の信号伝達線路に接続し、上記制御信号用ピンから制御回路を上記第一の誘電体及び第二の誘電体の信号伝達線路及びスルーホールで接続し、上記制御回路から第一及び第二のマイクロ波回路への接続を上記第一から第六までの誘電体の信号伝達線路及びスルーホールにて実施し、第一の高周波コネクタと第一のマイクロ波回路との接続を金属ワイヤにて実施し、第一のマイクロ波回路と第二のマイクロ波回路との接続を上記第四の誘電体の信号伝達線路内の線路と第四の誘電体の接地面に設けたスロットと第五の誘電体の信号伝達線路内の線路との電磁結合で実施し、第二のマイクロ波回路と上記上部カバー内の第二の高周波コネクタの接続を第六の誘電体の信号伝達線路と第七の誘電体のスロットと第八の誘電体の信号伝達線路との電磁結合及び第九の誘電体の上記馬蹄形状のスルーホールで実施したことを特徴とする高周波モジュール。  Inside the microwave circuit, the control circuit of the microwave circuit, the high frequency connector connected to the microwave circuit, the control pin connected to the control circuit, and the part where the microwave circuit and the control circuit are mounted A high-frequency module including a cover for protecting at least two microwave circuits, at least one control circuit for the microwave circuits, and a metal conductor located at the bottom and partially having a through hole A first dielectric having one surface joined to the metal conductor and a signal transmission line on the other surface, and having a through hole for accommodating the control circuit in a part thereof, and the metal conductor A control signal pin provided on the connection pad provided on the joint surface with the metal conductor of the first dielectric through the through hole, one surface joined to the signal transmission line surface of the first dielectric, and The other A second dielectric having a ground plane on one side, a third dielectric having one side bonded to the ground plane of the second dielectric and a second ground plane on the other side; Is connected to the second grounding surface of the third dielectric, and the other surface is provided with a signal transmission line surface, and one surface is the signal of the fourth dielectric. A fifth dielectric body joined to the transmission line surface and provided with a ground plane on the other surface, one surface joined to the ground plane of the fifth dielectric body, and the signal transmission line surface to the other surface A seventh dielectric having one surface bonded to the signal transmission line surface of the sixth dielectric and the other surface grounded, and the first to seventh Provided in the dielectric, and provided in the ground plane of the seventh dielectric, through-holes that can be electrically connected to each signal transmission line plane, slots provided in the ground plane of the fourth dielectric, A package formed of a multilayer dielectric having a slot and a coaxial first high-frequency connector provided perpendicularly to the metal conductor and penetrating the first to third dielectrics; And an eighth dielectric having the other surface as a signal transmission line surface, and a ninth surface in which one surface is joined to the signal transmission line surface of the eighth dielectric and a ground plane is provided on the other surface. The connection between the dielectric and the signal transmission line of the eighth dielectric signal transmission surface provided perpendicular to the ground plane of the ninth dielectric is arranged in a horseshoe shape provided in the ninth dielectric. The upper cover of the structure, which is composed of a second high-frequency connector implemented in a through-hole and has the grounding surface of the eighth dielectric as the joint surface with the package, and the metal conductor at the bottom of the package With the lower cover made of metal joined to the control circuit through hole The control circuit is mounted on the ground plane of the second dielectric, the control circuit and the signal transmission line of the first dielectric are connected by bump connection, and the other of the fourth dielectric is connected. The first microwave circuit is mounted on the surface, the signal transmission line of the fourth dielectric is connected by bump connection, and the second microwave circuit is mounted on the other surface of the sixth dielectric. The signal connection line of the sixth dielectric is connected by bump connection, and the control circuit is connected by the signal transmission line of the first dielectric and the second dielectric and the through hole from the control signal pin. The connection from the control circuit to the first and second microwave circuits is performed through the first to sixth dielectric signal transmission lines and through holes, and the first high-frequency connector and the first microwave circuit are connected. The first microwave circuit is connected to the wave circuit with a metal wire. A line in the fourth dielectric signal transmission line, a slot provided in the ground plane of the fourth dielectric, a line in the fifth dielectric signal transmission line, and a connection in the second microwave circuit; The second microwave circuit and the second high frequency connector in the upper cover are connected by the sixth dielectric signal transmission line, the seventh dielectric slot and the eighth dielectric. A high frequency module implemented by electromagnetic coupling with the signal transmission line and the horseshoe-shaped through-hole of the ninth dielectric.
JP18325099A 1999-06-29 1999-06-29 High frequency module Expired - Fee Related JP4154806B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP18325099A JP4154806B2 (en) 1999-06-29 1999-06-29 High frequency module
DE60027509T DE60027509T2 (en) 1999-06-29 2000-06-27 Module with a high-frequency circuit
EP00113569A EP1069639B1 (en) 1999-06-29 2000-06-27 Radio-frequency circuit module
EP04021529A EP1484815A1 (en) 1999-06-29 2000-06-27 Radio-frequency circuit module
US09/605,639 US6597902B1 (en) 1999-06-29 2000-06-28 Radio-frequency circuit module

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JP18325099A JP4154806B2 (en) 1999-06-29 1999-06-29 High frequency module

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