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JP4138634B2 - Heat sink fixing device - Google Patents

Heat sink fixing device Download PDF

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Publication number
JP4138634B2
JP4138634B2 JP2003382140A JP2003382140A JP4138634B2 JP 4138634 B2 JP4138634 B2 JP 4138634B2 JP 2003382140 A JP2003382140 A JP 2003382140A JP 2003382140 A JP2003382140 A JP 2003382140A JP 4138634 B2 JP4138634 B2 JP 4138634B2
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Prior art keywords
heat sink
mounting
pressing member
fixing device
mounting board
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JP2005150192A (en
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浩 高橋
晴彦 坂井
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Fujitsu Ltd
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Fujitsu Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Description

本発明は、ヒートシンク固定装置に関するものである。    The present invention relates to a heat sink fixing device.

実装基板上の発熱素子を冷却するためのヒートシンクを実装基板上に固定するためのヒートシンク固定部材としては、特許文献１に記載のものが知られている。この従来例において、ヒートシンク固定部材はバネ性を有する金属製板材をコ字形状に折り曲げて形成される。固定部材の自由端部には、実装基板に開設された穴に挿通可能な脚部が形成され、脚部の先端にツメ部が形成される。   As a heat sink fixing member for fixing a heat sink for cooling the heat generating elements on the mounting substrate on the mounting substrate, the one described in Patent Document 1 is known. In this conventional example, the heat sink fixing member is formed by bending a metal plate having a spring property into a U shape. At the free end of the fixing member, a leg that can be inserted into a hole formed in the mounting substrate is formed, and a claw is formed at the tip of the leg.

ヒートシンクの固定は、上記脚部を実装基板側の穴に挿通させて行われ、脚部の挿通の際に弾性変形して穴を通過したツメ部は、挿通完了時に弾性復元力により原形に復帰し、実装基板からの脱離が防止される。
特開平１０-２７５９６８号公報 The heat sink is fixed by inserting the above-mentioned leg into the hole on the mounting board side, and the claw that elastically deforms when the leg is inserted and passes through the hole returns to its original shape by elastic restoring force when insertion is completed Thus, detachment from the mounting substrate is prevented.
Japanese Patent Laid-Open No. 10-275968

しかし、上述した従来例における固定部材は、導電体であるツメ部を実装基板の穴周囲に係止させて装着されるために、実装基板には、装着用の穴に加え、ツメ部によるパターン短絡防止のための配線禁止エリアを穴周囲に設定する必要が生じる。配線禁止エリアの設定は、実装基板上における配線スペースの減少をもたらし、配線密度の低下の原因となる。   However, since the fixing member in the above-described conventional example is mounted by locking the claw portion, which is a conductor, around the hole of the mounting substrate, the mounting substrate has a pattern by the claw portion in addition to the mounting hole. It is necessary to set a wiring prohibition area around the hole to prevent a short circuit. The setting of the wiring prohibited area causes a reduction in wiring space on the mounting substrate, which causes a reduction in wiring density.

また、固定部材の取り外しにはツメ部を変形させる必要がある。ツメ部の変形には比較的大きな力を要し、さらに、この操作は実装基板の実装面上で行う必要があるために、取り外し作業中に過って近接する配線パターンに傷を付けたり、あるいは断線を引き起こす可能性があり、使い勝手が悪いという欠点もある。   In addition, it is necessary to deform the claw portion in order to remove the fixing member. Deformation of the claw part requires a relatively large force, and furthermore, since this operation needs to be performed on the mounting surface of the mounting board, it may damage the wiring pattern that is too close during removal work, Or it may cause disconnection, and there is a disadvantage that it is not easy to use.

本発明は、以上の欠点を解消すべくなされたものであって、配線密度の低下を可及的に少なくし、かつ、使い勝手も良好なヒートシンク固定装置の提供を目的とする。   The present invention has been made to eliminate the above-described drawbacks, and an object of the present invention is to provide a heat sink fixing device that reduces the decrease in wiring density as much as possible and that is also easy to use.

発熱素子１の上面にヒートシンク７を装着するためのヒートシンク押さえ部材１０は、ヒートシンク７を上方から押さえつける押さえ部８の両端に押さえ部材連結部５を備える。押さえ部８をヒートシンク７上面に掛け渡した状態で、押さえ部材連結部５を下方に押し込むと、押さえ部８が弾性変形し、所定接触圧でヒートシンク７が発熱素子１に接触する。   A heat sink pressing member 10 for mounting the heat sink 7 on the upper surface of the heating element 1 includes pressing member connecting portions 5 at both ends of a pressing portion 8 that presses the heat sink 7 from above. When the pressing member connecting portion 5 is pushed downward in a state where the pressing portion 8 is stretched over the upper surface of the heat sink 7, the pressing portion 8 is elastically deformed, and the heat sink 7 contacts the heating element 1 with a predetermined contact pressure.

上記押さえ部８に下方への押圧力を付加するために実装基板２に装着される固定ピン６は、実装基板２に開設された取り付け孔３に実装基板２の裏面側から挿入され、一端部に設けた抜け止めフランジ４により装着方向への抜け止めがなされる。固定ピン６全体、あるいは抜け止めフランジ４のみ、さらには、抜け止めフランジ４の実装基板２との当接面のみが絶縁材料により形成され、実装基板２裏面に形成される配線パターンとの短絡が防止される。   A fixing pin 6 attached to the mounting board 2 in order to apply a downward pressing force to the pressing part 8 is inserted into the mounting hole 3 provided in the mounting board 2 from the back side of the mounting board 2 and has one end. The retaining flange 4 provided in the housing prevents the retaining member from coming off in the mounting direction. The entire fixing pin 6 or the retaining flange 4 alone, or only the contact surface of the retaining flange 4 with the mounting substrate 2 is formed of an insulating material, and a short circuit with the wiring pattern formed on the back surface of the mounting substrate 2 is caused. Is prevented.

したがってこの発明において、まず、実装基板２の裏面側から固定ピン６を挿入した後、実装基板２の表面側に突出した押さえ部材連結部５にヒートシンク押さえ部材１０の係止部９を係止させるだけで、ヒートシンク押さえ部材１０は適度に弾性変形してヒートシンク７を発熱素子１に押圧する。   Therefore, in the present invention, first, the fixing pin 6 is inserted from the back surface side of the mounting substrate 2, and then the locking portion 9 of the heat sink pressing member 10 is locked to the pressing member connecting portion 5 protruding to the front surface side of the mounting substrate 2. Only, the heat sink pressing member 10 is elastically deformed to press the heat sink 7 against the heating element 1.

この状態で、実装基板２の裏面には、絶縁性を有する抜け止めフランジ４が当接しているために、この当接領域に配線パターンを形成しても、短絡するおそれがない。この結果、当該領域を配線スペースとして利用することができる。また、ヒートシンク押さえ部材１０の装着、除去操作は、実装基板２上適宜高さに配置される押さえ部材連結部５への係止部９の係脱操作により行われるために、実装基板２に傷を付け、パターンを断線させるおそれがなくなる。   In this state, the retaining flange 4 having an insulating property is in contact with the back surface of the mounting substrate 2, so that even if a wiring pattern is formed in this contact region, there is no possibility of short circuit. As a result, the area can be used as a wiring space. In addition, the mounting and removal operation of the heat sink pressing member 10 is performed by engaging and disengaging the locking portion 9 with the pressing member connecting portion 5 arranged at an appropriate height on the mounting substrate 2, so that the mounting substrate 2 is not damaged. To eliminate the possibility of breaking the pattern.

本発明によれば、配線密度の低下を可及的に少なくし、かつ、使い勝手も良好にすることができる。   According to the present invention, it is possible to reduce a decrease in wiring density as much as possible and to improve usability.

図１、２に本発明の実施の形態を示す。図において２は表裏面に配線パターンが形成される実装基板、１はこの実装基板２に実装されるＣＰＵ等の発熱素子である。発熱素子１の上面には、放熱用のヒートスプレッダ１ａが形成される。   1 and 2 show an embodiment of the present invention. In the figure, 2 is a mounting substrate on which wiring patterns are formed on the front and back surfaces, and 1 is a heating element such as a CPU mounted on the mounting substrate 2. On the upper surface of the heating element 1, a heat spreader 1a for heat dissipation is formed.

７は発熱素子１を冷却するためのヒートシンクであり、アルミニウム、銅等の熱伝導性の良好な材料に切削加工を施して形成される。このヒートシンク７は、上記発熱素子１のヒートスプレッダ１ａに当接する平板部７ａの上面に複数のプレート状の放熱フィン７ｂ、７ｂ・・・を突設させて形成される。放熱フィン７ｂ間には、後述するヒートシンク押さえ部材１０を装着スペースが形成される。   7 is a heat sink for cooling the heat generating element 1 and is formed by cutting a material having good thermal conductivity such as aluminum or copper. The heat sink 7 is formed by projecting a plurality of plate-like heat radiation fins 7b, 7b,... On the upper surface of the flat plate portion 7a contacting the heat spreader 1a of the heat generating element 1. A space for mounting a heat sink pressing member 10 to be described later is formed between the radiation fins 7b.

このヒートシンク７をヒートスプレッダ１ａ上に圧接状態で装着するためのヒートシンク固定装置は、固定ピン６と、ヒートシンク押さえ部材１０とを有して構成される。また、このヒートシンク固定装置を装着するために、実装基板２には、発熱素子１の対角位置に予め２個の取り付け孔３、３が開設される。   A heat sink fixing device for mounting the heat sink 7 on the heat spreader 1 a in a pressure contact state includes a fixing pin 6 and a heat sink pressing member 10. Further, in order to mount this heat sink fixing device, two mounting holes 3 and 3 are opened in the mounting substrate 2 at diagonal positions of the heating element 1 in advance.

図２、３に示すように、固定ピン６は、合成樹脂材により形成され、上記実装基板２の取り付け孔３に挿通可能な軸部６ａと、軸部６ａの一端に形成される抜け止めフランジ４とを備える。軸部６ａの他端には、貫通状の連結体装着孔６ｂが設けられ、該連結体１２装着孔６ｂに連結体１２が装着される。   As shown in FIGS. 2 and 3, the fixing pin 6 is formed of a synthetic resin material, and a shaft portion 6 a that can be inserted into the mounting hole 3 of the mounting substrate 2 and a retaining flange formed at one end of the shaft portion 6 a. 4. The other end of the shaft portion 6a is provided with a through-hole connecting body mounting hole 6b, and the connecting body 12 is mounted in the connecting body 12 mounting hole 6b.

連結体１２は、金属線材を馬蹄形状に折り曲げた後、その自由端を対向方向にさらに折曲して取付部１２ａを形成したもので、図３（ｂ）に示すように、取付部１２ａを固定ピン６の連結体装着孔６ｂに挿入して装着される。取り付け状態において、馬蹄形の屈曲部は押さえ部材連結部５となる。   The connecting body 12 is formed by bending a metal wire into a horseshoe shape, and then bending the free end in the opposite direction to form an attachment portion 12a. As shown in FIG. The fixed pin 6 is inserted into the connecting body mounting hole 6b and mounted. In the attached state, the horseshoe-shaped bent portion becomes the pressing member connecting portion 5.

連結体１２、軸部６ａ、および抜け止めフランジ４は、後述する押さえ部８により上方に引き上げられた際に、容易に脱落することがないように、十分な強度を有するように形成される。また、連結体１２を装着した状態で軸部６ａが実装基板２の取り付け孔３に挿通可能となり、かつ、実装基板２に装着した状態で連結体１２が取付部１２ａ周りに回転して実装基板２表面に触れ、パターンショートを惹起しないように、軸部６ａには高さ方向に連結体保持溝６ｃが凹設される。   The connecting body 12, the shaft portion 6 a, and the retaining flange 4 are formed to have sufficient strength so that they will not easily fall off when pulled upward by a pressing portion 8 described later. Further, the shaft portion 6a can be inserted into the mounting hole 3 of the mounting substrate 2 with the connecting body 12 mounted, and the connecting body 12 rotates around the mounting portion 12a with the mounting body 2 mounted. (2) A connecting body holding groove 6c is recessed in the shaft portion 6a in the height direction so as not to touch the surface and cause a pattern short circuit.

ヒートシンク押さえ部材１０は、ブロック状の押さえ部８の両端に弾性脚１０ａを有して構成され、弾性脚１０ａの自由端部はＵ字形状に屈曲されて係止部９とされる。
したがってこの実施の形態において、ヒートシンク７の装着に際しては、まず、実装基板２の裏面から取り付け孔３に固定ピン６の軸部６ａを挿入し、次いで、装着スペースに嵌合させる状態で発熱素子１のヒートスプレッダ１ａ上面に載置されたヒートシンク７にヒートシンク押さえ部材１０を掛け渡し、この後、係止部９を固定ピン６側の押さえ部材連結部５に係止させる。押さえ部材連結部５への係止により、ヒートシンク押さえ部材１０の弾性脚１０ａはやや弾性変形して適度の圧接力をヒートスプレッダ１ａとヒートシンク７の平板部７ａとの間に発生させ、部材間の熱抵抗を減少させる。 The heat sink pressing member 10 is configured to have elastic legs 10 a at both ends of the block-shaped pressing portion 8, and the free ends of the elastic legs 10 a are bent into a U shape to serve as locking portions 9.
Therefore, in this embodiment, when mounting the heat sink 7, first, the shaft portion 6 a of the fixing pin 6 is inserted into the mounting hole 3 from the back surface of the mounting substrate 2, and then the heating element 1 is fitted in the mounting space. The heat sink pressing member 10 is hung on the heat sink 7 placed on the upper surface of the heat spreader 1a, and then the locking portion 9 is locked to the pressing member connecting portion 5 on the fixing pin 6 side. The elastic leg 10a of the heat sink pressing member 10 is slightly elastically deformed by the locking to the pressing member connecting portion 5, and an appropriate pressure contact force is generated between the heat spreader 1a and the flat plate portion 7a of the heat sink 7, and the heat between the members. Reduce resistance.

なお、以上において固定ピン６の押さえ部材連結部５は、軸部６ａに連結体１２を連結して形成されていたが、図４（ａ）、（ｂ）に示すように、軸部６ａに開設した穴をそのまま利用することも可能である。また、固定ピン６は絶縁性を確保し、かつ、所定の強度を得るために、合成樹脂材により形成されているが、図４（ａ）において鎖線で示すように、抜け止めフランジ４の実装基板２への当接面、すなわち、抜け止めフランジ４の上面に合成樹脂材等、絶縁材料により形成された平板状リング１３を介装させたり、あるいは図４（ｂ）に示すように、筒部を備えたリング１４を介装させることが可能である。   In the above, the pressing member connecting portion 5 of the fixing pin 6 is formed by connecting the connecting body 12 to the shaft portion 6a. However, as shown in FIGS. It is also possible to use the opened holes as they are. The fixing pin 6 is formed of a synthetic resin material in order to ensure insulation and to obtain a predetermined strength. However, as shown by a chain line in FIG. A flat ring 13 formed of an insulating material such as a synthetic resin material is interposed on the contact surface with the substrate 2, that is, the upper surface of the retaining flange 4, or as shown in FIG. It is possible to interpose a ring 14 having a portion.

さらに、図４（ｃ）に示すように、固定ピン６の軸部６ａ及び抜け止めフランジ４を弾性を有する合成樹脂材により形成し、さらに、軸部６ａ外周に実装基板２の取り付け孔３を弾性変形して挿通可能な突起１１を設けると、実装基板２に装着した状態で突起１１と抜け止めフランジ４が実装基板２を挟み付ける状態となるために、ぐらつき等を確実に防止することができる。   Further, as shown in FIG. 4 (c), the shaft portion 6a of the fixing pin 6 and the retaining flange 4 are formed of a synthetic resin material having elasticity, and the mounting hole 3 of the mounting substrate 2 is formed on the outer periphery of the shaft portion 6a. Providing the protrusion 11 that can be elastically deformed and inserted allows the protrusion 11 and the retaining flange 4 to sandwich the mounting board 2 in a state of being mounted on the mounting board 2, so that wobbling or the like can be reliably prevented. it can.

本発明を示す分解斜視図である。It is a disassembled perspective view which shows this invention. 図１の装着状態を示す図で、（ａ）は一部を破断して示す側面図、（ｂ）は平面図である。It is a figure which shows the mounting state of FIG. 1, (a) is a side view which fractures | ruptures and shows a part, (b) is a top view. 固定ピンを示す図で、（ａ）は側面図、（ｂ）は（ａ）の３Ｂ-３Ｂ線断面図、（ｃ）は平面図である。It is a figure which shows a fixing pin, (a) is a side view, (b) is the 3B-3B sectional view taken on the line of (a), (c) is a top view. 固定ピンの変形例を示す図で、（ａ）は断面図、（ｂ）は側面図、（ｃ）は他の変形例を示す半断面図である。It is a figure which shows the modification of a fixing pin, (a) is sectional drawing, (b) is a side view, (c) is a half sectional view which shows another modification.

符号の説明Explanation of symbols

１ 発熱素子
２ 実装基板
３ 取り付け孔
４ 抜け止めフランジ
５ 押さえ部材連結部
６ 固定ピン
７ ヒートシンク
８ 押さえ部
９ 係止部
１０ ヒートシンク押さえ部材
１１ 突起

DESCRIPTION OF SYMBOLS 1 Heating element 2 Mounting board 3 Mounting hole 4 Retaining flange 5 Holding member connection part 6 Fixing pin 7 Heat sink 8 Holding part 9 Locking part 10 Heat sink holding member 11 Protrusion

Claims (2)

発熱素子が実装された実装基板に開設された取り付け孔に挿通され、一端に前記実装基板との当接面が絶縁性を有する抜け止めフランジを備えるとともに、他端に押さえ部材連結部を備えた固定ピンと、
前記発熱素子上に載置されるヒートシンクの上面に架設されてヒートシンクを押さえつける押さえ部の両端に前記押さえ部材連結部への係止部を備えた弾性変形可能なヒートシンク押さえ部材とを有するヒートシンク固定装置。 A mounting hole provided in the mounting board on which the heat generating element is mounted is inserted, and a contact surface with the mounting board is provided with an insulating retaining flange at one end, and a pressing member connecting portion is provided at the other end. A fixing pin,
A heat sink fixing device having elastically deformable heat sink pressing members having engaging portions to the pressing member connecting portions at both ends of a pressing portion that is installed on the upper surface of the heat sink placed on the heat generating element and presses the heat sink. . 前記固定ピンは、弾性変形能に富む絶縁材料により形成され、かつ、実装基板への挿入時に前記抜け止めフランジと協働して実装基板を挟み付ける突起を備える請求項１記載のヒートシンク固定装置。


2. The heat sink fixing device according to claim 1, wherein the fixing pin is formed of an insulating material rich in elastic deformability, and includes a protrusion that sandwiches the mounting board in cooperation with the retaining flange when inserted into the mounting board.


JP2003382140A 2003-11-12 2003-11-12 Heat sink fixing device Expired - Fee Related JP4138634B2 (en)

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JP6501606B2 (en) * 2015-05-19 2019-04-17 ルネサスエレクトロニクス株式会社 Semiconductor device
CN108419360A (en) * 2018-05-11 2018-08-17 爱美达（上海）热能系统有限公司 A kind of radiator perforation anchor fixing device
US12207446B2 (en) 2022-08-02 2025-01-21 International Business Machines Corporation Adjustable retention device for heat sink assembly

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