JP4134850B2 - Resin tape application method - Google Patents

Description

  The present invention relates to a resin tape sticking apparatus and a sticking method used when an IC bare chip or other electronic component is mounted on a circuit board using a resin tape such as an anisotropic conductive resin tape or an insulating resin tape.

Conventionally, a technique has been used in which a thermosetting anisotropic conductive resin is attached to a circuit board, and an IC bare chip is pressed and heated on the conductive resin for mounting. In such mounting, when the anisotropic conductive resin tape is applied to the circuit board, for example, as disclosed in Patent Document 1, the resin is held on the circuit board while being held on the lower surface of the base tape. A technique is known in which a tape is supplied and pressed from above a base tape to attach a resin tape onto a circuit board.
JP 2002-184809 A

  However, when a wiring pattern is also formed on the back side of the circuit board, the circuit board cannot be sufficiently sucked and adsorbed on the table due to air leakage caused by unevenness on the back side, and a resin tape is stuck. When the base tape is later peeled off from the resin tape at a high speed, the circuit board is excessively lifted, and the position of the circuit board is shifted and subsequent processing (for example, application of the resin tape to other parts of the circuit board or IC chip) May cause problems. As a result, productivity decreases.

  In particular, in the case of a circuit board which is a multilayer board and has a large step on the surface where double-sided mounting is performed, if the circuit board is very thin or flexible, or is mounted like an IC bare chip When the resin tape to be attached to the circuit board is large due to the large parts and the force required to peel off the base tape is large, the problem of the circuit board floating becomes significant.

  The present invention has been made in view of the above problems, and prevents the circuit board from being lifted excessively when the base tape is peeled off from the resin tape affixed to the circuit board at a high speed with a relatively simple configuration. It is aimed.

The invention according to claim 1 is a resin tape affixing method for affixing a resin tape supplied in a state held by a base tape on a circuit board,
A substantially cylindrical small-diameter portion whose side surface is in contact with the surface opposite to the surface on which the resin tape of the base tape is held, and a disk shape concentric with the small-diameter portion and having a diameter larger than the small-diameter portion, When peeling the resin tape, even if the circuit board held on the table floats up , a peeling roller having a large diameter portion to be suppressed by contact with the circuit board is positioned on the collection side of the base tape. A process of
Supplying a resin tape in a state of being held on the surface of the base tape on the side of the circuit board substantially parallel to the surface of the circuit board;
Cutting the resin tape held on the base tape into resin tape pieces of a predetermined size;
A step of applying the predetermined pressure from the base tape side, affixing the resin tape piece to the circuit board while being held by the base tape;
A predetermined gap is formed between the large-diameter portion and the circuit board while pulling the base tape away from the surface of the circuit board while pulling the base tape away from the surface of the circuit board. In the state where the large-diameter portion is separated from the table and the circuit board is in contact with the table, the circuit board is moved to the circuit board by moving the resin tape in a direction opposite to the resin tape supply direction. Peeling the base tape from the affixed resin tape piece;
It is the resin tape sticking method characterized by having.

The invention according to claim 2 is the resin tape sticking method according to claim 1, wherein the predetermined gap is 0.05 mm or more and 0.1 mm or less.

Invention of Claim 3 is the resin tape sticking method of Claim 1, Comprising: In the said peeling process, the said large diameter part rolls on the surface of the said circuit board, It is characterized by the above-mentioned. Use the tape application method.

Invention of Claim 4 is the resin tape sticking method of Claim 3, Comprising: The said small diameter part and the said large diameter part rotate independently, respectively, The resin tape sticking method characterized by the above-mentioned is used. .

Invention of Claim 5 is the resin tape sticking method in any one of Claim 1 thru | or 4, Comprising: In the said process to peel, in the area | region along the resin tape piece stuck on the said circuit board, the said circuit A method of applying a resin tape, wherein a substrate is pressed against the table.

  According to the present invention, when the base tape is peeled from the resin tape piece affixed to the surface of the circuit board, excessive lifting of the circuit board can be prevented by the large diameter portion of the peeling roller.

  The present invention relates to a resin tape applying apparatus and an application method that can prevent excessive lifting of a circuit board when a base tape is peeled from a resin tape piece attached to a circuit board. Hereinafter, a resin tape sticking device and a sticking method according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a front view showing an overall configuration of a resin tape attaching apparatus 1 according to an embodiment of the present invention, and FIG. 2 is a plan view showing the vicinity of a circuit board 2 to which the resin tape is attached. As shown in FIGS. 1 and 2, a plurality of circuit boards 2 are aligned and held on an XY table 3 provided at the lower center of the resin tape applicator 1.

  The circuit board 2 is held by the XY table 3 by, for example, suction from a suction port formed on the XY table 3 or an adhesive material on the XY table 3. The circuit board 2 may be a large board before being separated into individual pieces. In this case, the corners of the large board may be mechanically held. The circuit board 2 may have a circuit formed on the back surface (XY table 3 side).

  The XY table 3 is driven in the X and Y directions orthogonal to each other on a horizontal plane, and each circuit board 2 held on the XY table 3 is placed at a predetermined tape application position A which is a fixed position in the resin tape application device 1. Move sequentially.

  The unused tape 4 used for attaching the resin tape is, for example, a resin tape such as an anisotropic conductive resin tape in which metal fine particles are dispersed in a thermosetting resin between the base tape 41 and the cover tape 42. It has a three-layer structure in which 43 is laminated.

  Above the XY table 3 ((+ Z side in FIG. 1)) is for winding a supply reel 5 around which an unused tape 4 is wound, a plurality of guide rollers 6, and a base tape 41 which is a used tape. A tape supply mechanism 10 including a first recovery reel 7, a second recovery reel 8 for winding the cover tape 42 peeled off from the tape 4, a feed chuck 61 and a fixed chuck 62 for feeding the tape 4. Is provided.

  The tape 4 is stretched in the X direction substantially parallel to the surface of the circuit board 2 by the tape supply mechanism 10, and the resin tape 43 is (−X) while being held on the surface of the base tape 41 on the circuit board 2 side. Sequentially supplied in the direction. The tape supply mechanism 10 is constructed on a single frame, and the entire tape supply mechanism 10 and the tape 4 (including the peeled base tape 41) are moved up and down by the elevating mechanism 30. Is lifted and lowered in the direction perpendicular to the surface (Z direction).

  A peeling mechanism 20 is further provided on the frame that is lifted and lowered by the lifting mechanism 30 and is moved up and down in the Z direction together with the tape supply mechanism 10. The peeling mechanism 20 is a peeling roller that comes into contact with the back surface of the surface of the base tape 41 after the resin tape 43 is peeled, on which the resin tape 43 is held (that is, the surface opposite to the circuit board 2). 21. Auxiliary roller 22 that contacts the surface on which the resin tape 43 of the base tape 41 is held on the recovery side of the base tape 41 with respect to the separation roller 21 (that is, the surface on the circuit board 2 side), the separation roller 21 and A slider 23 for rotatably supporting the auxiliary roller 22 around an axis that faces the Y direction (a direction parallel to the surface of the circuit board 2 and perpendicular to the supply direction of the tape 4), and moves in the X direction; A roller moving mechanism 25 that reciprocates the slider 23 in the X direction is used.

  As shown in FIG. 2, the auxiliary roller 22 is a cylindrical roller having a substantially uniform diameter, but the peeling roller 21 has a substantially cylindrical small-diameter portion 212 at a portion in contact with the base tape 41. This is a so-called brazing roller in which the portions on both sides thereof are disk-shaped large-diameter portions 211 having a diameter larger than that of the small-diameter portion 212. Details of the structure of the peeling roller 21 will be described later.

  As shown in FIG. 1, above the predetermined tape application position A (above the tape 4), the pressure head drive mechanism 35 moves up and down in the Z direction independently of the tape supply mechanism 10 and the peeling mechanism 20. A pressure head 11 to be moved is provided. The pressure head 11 and the pressure head drive mechanism 35 constitute a pressure mechanism that presses the resin tape 43 held on the surface of the base tape 41 on the circuit board 2 side from the base tape 41 side to the circuit board 2. The pressure head 11 is fixed in the X direction and the Y direction and is driven only in the Z direction.

  Further, on the upstream side of the tape 4 with respect to the pressure head 11, a cutter 12 is provided on the (+ Y) side of the tape 4, which can be advanced and retracted in the Y direction by the cutter moving mechanism 36. After the cutter 12 moves to the tape 4 from which the cover tape 42 has been peeled off by the cutter moving mechanism 36, the cutter 12 cuts only the resin tape 43 from the circuit board 2 side without cutting the base tape 41. When the resin tape 43 is cut, the cutter 12 holds the upper member 121 in contact with the base tape 41, and the resin tape 43 and the base tape 41 so that the blades are bitten into the pole tape and held by the base tape 41. And a lower member 122 that cuts only 43 into a predetermined dimension.

  Next, the operation of the resin tape applying apparatus, that is, the resin tape applying method will be described with reference to the operation diagrams of FIGS. 3 to 9 and the flowchart of FIG. As shown in FIG. 3, for example, a resin tape piece 44 cut to a predetermined size is affixed to the circuit board 2 at the right end, and then the resin tape piece 44 is affixed to the circuit board 2 at the center. To do.

  First, the XY table 3 is driven to move the central circuit board 2 to the tape application position A (step S1). At this time, as will be described later, the elevation mechanism 30 raises the tape supply mechanism 10 and the peeling mechanism 20 to a predetermined tape cutting position, and the pressure head 11 is retracted to a predetermined position in the (+ Z) direction. Further, the peeling roller 21 and the auxiliary roller 22 are located on the collecting side of the base tape 41.

  Next, the cutter 12 moves forward in the (−Y) direction to the position where the tape 4 is sandwiched while the upper member 121 and the lower member 122 are separated from each other, the upper member 121 is lowered in the (−Z) direction, and the lower member 122 is moved. Is raised in the (+ Z) direction, the tape 4 is sandwiched between the upper member 121 and the lower member 122, and the blade provided on the lower member 122 is bitten into the pole portions of the resin tape 43 and the base tape 41. The resin tape 43 is cut to obtain the resin tape piece 44 (step S2). At this time, since the blade of the lower member 122 does not bite deep enough to completely cut the base tape 41 of the tape 4, the base tape 41 is not cut.

  When the resin tape piece 44 is cut from the resin tape 43 while being held by the base tape 41, the cutter 12 is retracted in the (−Y) direction to the original position, and as shown in FIG. The separation mechanism 20 is moved by an elevating mechanism 30 shown in FIG. 1 so as to face the XY table 3 (or the circuit board 2 held thereon) by a predetermined distance (for example, several mm) ( -Z) direction (step S3). In addition to the lowering operation of the tape supply mechanism 10 and the peeling mechanism 20, the pressure head 11 is lowered in the (−Z) direction by the pressure head drive mechanism 35 (step S4), as shown in FIG. The resin tape piece 44 cut on the circuit board 2 is pressed from the base tape 41 with a predetermined pressure for a predetermined time. As a result, the resin tape piece 44 adheres to the circuit board 2.

  Next, as shown in FIGS. 6 and 7, the pressure head 11 is raised in the (+ Z) direction (step S5), and the roller moving mechanism 25 (see FIG. 1) is driven to rotate the slider 23 freely. The axially supported peeling roller 21 and auxiliary roller 22 move in the (+ X) direction along the circuit board 2 (step S6). Since the peeling roller 21 and the auxiliary roller 22 are in contact with the base tape 41, the peeling roller 21 and the auxiliary roller 22 rotate appropriately as the slider 23 moves due to friction with the base tape 41.

  As shown in FIG. 7, the auxiliary roller 22 is located on the collecting side of the base tape 41 with respect to the peeling roller 21, and further contacts the surface of the base tape 41 that holds the resin tape 43. Therefore, in step S6, the peeling roller 22 21 and the auxiliary roller 22 move in the direction opposite to the direction in which the resin tape 43 is supplied (the (+ X) direction), the base tape 41 is moved closer to the recovery side of the base tape 41 than the peeling roller 21 by the auxiliary roller 22. The base tape 41 is reliably peeled off from the resin tape piece 44 affixed to the circuit board 2. That is, a pulling mechanism for pulling up the base tape 41 in the (+ Z) direction is simply configured by the auxiliary roller 22 and the roller moving mechanism.

  At this time, even if the circuit board 2 is lifted, the circuit board 2 is hardly displaced on the XY table 3 because it is in contact with the large-diameter portion 211 of the peeling roller 21 to prevent excessive lifting. In particular, in the case of a double-sided circuit board having a circuit formed on the back surface or a multilayer circuit board, the force for holding the circuit board 2 on the XY table 3 by suction suction or adhesion is weakened. Even in this case, it is possible to appropriately suppress the floating of the circuit board 2. Thereby, it is possible to stably perform high-speed peeling with a simple configuration, thereby improving productivity and quality.

  As shown in FIG. 8, the movement of the peeling roller 21 and the auxiliary roller 22 in the (+ X) direction is stopped at a position where the auxiliary roller 22 does not contact the resin tape 43 held on the base tape 41. Then, the operation of the roller moving mechanism 25 is reversed, and the peeling roller 21 and the auxiliary roller 22 are moved in the (−X) direction to return to the original positions (step S7).

  Further, as shown in FIG. 9, in parallel with the movement of the peeling roller 21 and the auxiliary roller 22 in the (−X) direction, the tape supply mechanism 10 and the peeling mechanism 20 are raised to a predetermined tape cutting position by the lifting mechanism 30. Then, the resin tape 43 is fed by the tape supply mechanism 10 (step S9). Specifically, the resin tape 43 is supplied by opening the feed chuck 61 with the fixed chuck 62 shown in FIG. 1 closed and moving the feed chuck 61 in the (+ X) direction. By closing and moving in the (−X) direction, the resin tape 43 held on the surface of the base tape 41 on the circuit board 2 side is supplied to the tape application position A.

  Thereafter, as described above, the XY table 3 is driven to return to step S1 where the next circuit board 2 is positioned at the tape application position A. As a result, the state shown in FIG. 3 is restored. By repeating the above steps, the resin tape pieces 44 cut to a predetermined size can be attached to all the circuit boards 2 held on the XY table 3.

  Next, details of the peeling roller 21 will be described. FIG. 11 is a cross-sectional view showing a configuration example of the peeling roller 21. The peeling roller 21 has a substantially cylindrical small-diameter portion 212 in contact with the side surface of the base tape 41, a disk shape concentric with the small-diameter portion 212, and is provided on both sides of the small-diameter portion 212. It is comprised by the diameter part (ridge part) 211, the bearing 213 attached to the axis | shaft 231, etc. FIG. The width W2 of the small diameter portion 212 is set to be slightly larger than the width W1 of the base tape 41. The diameter and position of the large diameter portion 211 are such that a predetermined gap t is generated with respect to the surface of the circuit board 2 when the circuit board 2 is in contact with the XY table 3 while being held on the XY table 3. Is set to move away from the XY table 3.

  Even if the circuit board 2 is lifted by the peeling resistance when the base tape 41 is peeled from the resin tape piece 44 affixed on the circuit board 2, the predetermined gap t is the large diameter portion 211 of the peeling roller 21. It is necessary to make the clearance so that excessive lifting is suppressed by contact with the substrate, and the positional displacement of the circuit board 2 on the XY table 3 hardly occurs, and 0.1 mm or less is preferable. In consideration of manufacturing errors in the thickness of the circuit board 2 and other errors in the apparatus, the predetermined gap t is preferably 0.05 mm or more.

  By providing a predetermined gap t between the large-diameter portion 211 of the peeling roller 21 and the surface of the circuit board 2, a large friction is generated between the large-diameter portion 211 of the peeling roller 21 and the surface of the circuit board 2. Is prevented. For example, when no slip occurs between the base tape 41 and the peeling roller 21, slip occurs when the large-diameter portion 211 and the circuit board 2 come into contact with each other. Since the substrate 2 is not strongly contacted, there is no problem that the large diameter portion 211 damages the circuit substrate 2.

  FIG. 12 is a cross-sectional view illustrating another configuration example of the peeling roller 21. In the configuration example shown in FIG. 12, the large-diameter portion 211 and the small-diameter portion 212 of the peeling roller 21 have the same shape as in FIG. 11, but are separated so as to rotate independently. The diameter and position of the large diameter portion 211 are set so as to roll in contact with the circuit board 2 held on the XY table 3. In this case, the large-diameter portion 211 of the peeling roller 21 directly contacts the surface of the circuit board 2 and reliably suppresses the floating, so that the position shift of the circuit board 2 on the XY table 3 can be reliably prevented, Further, high speed and stable peeling is realized. Further, since the large diameter portion 211 and the small diameter portion 212 rotate independently, no relative slip occurs between the base tape 41 and the circuit board 2 and the peeling roller 21.

  FIG. 13 shows an example in which an arm 50 for pressing the circuit board 2 against the XY table 3 is further provided in the resin tape applying device 1 in the vicinity of the peeling roller 21 shown in FIG. The arm 50 is provided on the (−Y) direction side with respect to the pressure head 11, for example, at the tape application position A in FIG. 1 so as not to hinder the movement of the peeling roller 21. Along with the tape 41, the peeling mechanism 20 and the like, it is moved up and down in the Z direction by the lifting mechanism 30. A pressing member 51 is provided at the tip of the arm 50 to press the region along the resin tape piece 44 affixed to the circuit board 2, and the circuit board 2 is pressed against the XY table 3 by the pressing member 51.

  As described above, in the peeling roller 21 shown in FIG. 11, the circuit board 2 is not directly pressed against the XY table 3, so that the circuit board 2 is very thin or flexible (particularly, the resin to be applied). When the width of the tape is large), when the base tape 41 is peeled from the resin tape piece 44 affixed on the circuit board 2, the circuit board 2 is lifted by the peeling resistance, and the circuit board 2 may be displaced. There is sex. Even in such a case, in the configuration shown in FIG. 13, the entire circuit board 2 is prevented from being lifted by the peeling resistance, and high-speed and stable peeling of the base tape 41 is realized. In addition, in the peeling roller 22 shown in FIG. 12, since the two large diameter portions 211 rotate independently, it is preferable to use the arm 50 in some cases.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made.

  For example, in the above embodiment, the auxiliary roller 22 is used together with the peeling roller 21, but at least the lifting side of the circuit board 2 is suppressed by the peeling roller 21 while the base tape 41 is recovered (the first collection reel 7 than the peeling roller 21 is. Side) is pulled up in the (+ Z) direction, the base tape 41 can be peeled off from the resin tape piece 44 affixed to the circuit board 2 while preventing the circuit board 2 from being lifted excessively on the XY table 3. it can.

  Further, even in the case of the peeling roller 21 shown in FIG. 11, the peeling roller 21 may be urged to the circuit board 2 as long as no problem occurs. In this case, since the surface of the base tape 41 is usually smooth, a slip occurs between the base tape 41 and the small diameter portion 212.

  Further, when the base tape 41 is hardly displaced in the small diameter portion 212, the large diameter portion 211 may be provided only on one side of the small diameter portion 212. In particular, when the arm 50 is provided as shown in FIG. 13, the large-diameter portion 211 may be provided only on the side opposite to the arm 50.

  In the above embodiment, the case where an anisotropic conductive resin tape is used as the resin tape 43 has been described. However, the resin tape is not limited to this and may be an insulating resin tape that does not include metal particles. Good.

As described above, the resin tape affixing device and the affixing method according to the present invention can be used to mount an IC bare chip or other electronic components on a circuit board using a resin tape such as an anisotropic conductive resin tape or an insulating resin tape. It is available when you do.

The front view which shows the whole structure of the resin tape sticking apparatus which concerns on one embodiment of this invention Top view showing the vicinity of the circuit board to which the resin tape is affixed Operational diagram of resin tape applicator Operational diagram of resin tape applicator Operational diagram of resin tape applicator Operational diagram of resin tape applicator Operational diagram of resin tape applicator Operational diagram of resin tape applicator Operational diagram of resin tape applicator Flow chart showing the operation (sticking method) of the resin tape sticking device Sectional drawing which shows one structural example of peeling roller Sectional drawing which shows the other structural example of a peeling roller Partial sectional view showing another example of resin tape attaching device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin tape sticking apparatus 2 Circuit board 3 XY table 4 Tape 5 Supply reel 7 1st collection reel 10 Tape supply mechanism 11 Pressure head 12 Cutter 21 Peeling roller 22 Auxiliary roller 25 Roller moving mechanism 30 Lifting mechanism 41 Base tape 43 Resin tape 44 Resin tape piece 50 Arm 211 Large diameter part 212 Small diameter part S2, S4, S6, S7, S9 Step

Claims (5)

A resin tape affixing method for affixing a resin tape supplied in a state held by a base tape on a circuit board,
A substantially cylindrical small-diameter portion whose side surface is in contact with the surface opposite to the surface on which the resin tape of the base tape is held, and a disk shape concentric with the small-diameter portion and having a diameter larger than the small-diameter portion, When peeling the resin tape, even if the circuit board held on the table floats up , a peeling roller having a large diameter portion to be suppressed by contact with the circuit board is positioned on the collection side of the base tape. A process of
Supplying a resin tape in a state of being held on the surface of the base tape on the side of the circuit board substantially parallel to the surface of the circuit board;
Cutting the resin tape held on the base tape into resin tape pieces of a predetermined size;
A step of applying the predetermined pressure from the base tape side, affixing the resin tape piece to the circuit board while being held by the base tape;
A predetermined gap is formed between the large-diameter portion and the circuit board while pulling the base tape away from the surface of the circuit board while pulling the base tape away from the surface of the circuit board. In the state where the large-diameter portion is separated from the table and the circuit board is in contact with the table, the circuit board is moved to the circuit board by moving the resin tape in a direction opposite to the resin tape supply direction. Peeling the base tape from the affixed resin tape piece;
A method for applying a resin tape, comprising: It is the resin tape sticking method of Claim 1, Comprising:
The resin tape sticking method, wherein the predetermined gap is 0.05 mm or more and 0.1 mm or less. It is the resin tape sticking method of Claim 1, Comprising:
In the peeling step, the large-diameter portion rolls on the surface of the circuit board. It is the resin tape sticking method of Claim 3, Comprising:
The resin tape affixing method, wherein the small diameter portion and the large diameter portion rotate independently of each other. It is the resin tape sticking method in any one of Claim 1 thru | or 4, Comprising:
In the step of the peeling method pasting resin tape the circuit board at regions along the resin tape piece affixed to the circuit board is characterized in that it is pressed against the said table.

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