JP4111846B2 - Plating equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a plating apparatus that performs a series of plating processes on the surface (surface to be plated) of a substrate such as a semiconductor wafer, and more particularly, to a plating apparatus used for forming a film such as a metal or wiring on an LSI substrate. About.
[0002]
[Prior art]
In recent years, a method of forming a metal film or an organic film on a semiconductor wafer or another substrate by using a plating technique has been used in wiring and bump formation of a semiconductor circuit. For example, wiring or bumps (projection-like connection electrodes) in which gold, silver, copper, solder, nickel, or a multilayer of these are laminated at predetermined locations on the surface of a semiconductor wafer on which semiconductor circuits and fine wirings connecting them are formed It is widely practiced to form an electrode and connect it to an electrode of a package substrate or a TAB (Tape Automated Bonding) electrode through this bump. There are various methods such as electroplating, electroless plating, vapor deposition, and printing as methods for forming the wiring and bumps. Many plating methods that can cope with the above have been used.
[0003]
The metal film obtained by electroplating, which is most frequently used at present, is characterized by high purity, high film formation speed, and relatively simple film thickness control method. In the formation of a film on a substrate such as a semiconductor wafer, the uniformity of the film thickness has been violently demanded. In electroplating, a metal film having an excellent film thickness distribution (film thickness uniformity) can be obtained by making the metal ion supply rate distribution and potential distribution of the plating solution uniform. In electroless plating, where technological innovation is expected in the future, it is expected that not only the electroconductive layer necessary for electroplating is unnecessary, but also the process can be simplified and the cost can be reduced.
[0004]
FIG. 7 shows an example of a plating apparatus that performs only a plating process using a so-called face down method. This plating apparatus is disposed above the plating tank 102 that holds the plating solution 100 therein, and holds the substrate W such as a semiconductor wafer in a detachable manner with the surface (surface to be plated) facing downward. And a substrate holder 104. An anode 106 immersed in the plating solution 100 held inside the plating tank 102 is horizontally disposed and fixed to the bottom of the plating tank 102. A plating solution supply nozzle 108 is connected to the bottom of the plating tank 102, and an overflow tank 110 is provided on the outer periphery of the upper end of the plating tank 102.
[0005]
According to this plating apparatus, in a state where the substrate W held by the substrate holder 104 is disposed at a position covering the upper end opening of the plating tank 102, the substrate W is connected to the cathode of the plating power source 114 via the conductive 112, and the conductive 116 is applied. The anode 106 is connected to the anode of the plating power supply 114 respectively, and at the same time, the plating solution 100 is supplied into the plating tank 102 and overflowed into the overflow tank 110, while the jet of the plating solution 100 contacts the surface (lower surface) of the substrate W. Let As a result, the metal ions in the plating solution 100 receive electrons from the surface of the substrate W due to the potential difference between the substrate W and the anode 106, and the metal is deposited on the substrate W to form a metal film.
[0006]
FIG. 8 shows another example of a plating apparatus that performs only a plating process using a so-called dip method. This plating apparatus has a plating tank 122 for holding a plating solution therein, and a substrate holder 124 for exposing the surface and holding the substrate W in a detachable manner. Inside the plating tank 122, an anode 126 immersed in a plating solution held inside the plating tank 122 is held by an anode holder 128 and arranged in a vertical state. The substrate W held by the substrate holder 124 is arranged at a position facing the anode 126, and the size of the substrate W is set inside so as to be positioned between the substrate W and the anode 126. An adjustment plate (regulation plate) 130 made of an insulating material having a circular hole 130a corresponding to the above is disposed.
[0007]
According to this plating apparatus, in a state where the substrate W held by the substrate holder 124 is disposed in the plating tank 122 at a position facing the anode 126, the substrate W is connected to the cathode of the plating power source 134 via the conductive 132 and the conductive 136. By connecting the anode 126 to the anode of the plating power source 134 through the metal, metal is deposited on the substrate W to form a metal film. The potential distribution in the plating tank 122 can be adjusted by the holes 130a provided in the adjustment plate 130, and the film thickness distribution of the metal film formed on the substrate W can be adjusted.
[0008]
The plating apparatus for performing electroplating has been described above. In electroless plating, metal is deposited by oxidation / reduction reactions of metal ions. In the electroless plating apparatus, the above-described FIG. 7 and FIG. The plating power supply in the plating apparatus shown in FIG.
[0009]
[Problems to be solved by the invention]
For example, in manufacturing a semiconductor device, it is necessary to always strictly maintain and manage the cleanliness and temperature around a substrate such as a semiconductor wafer. For this reason, an enormous amount of incidental facilities are provided in order to properly manage various semiconductor manufacturing apparatuses that process substrates. And so that the semiconductor device is produced at an appropriate cost, the semiconductor manufacturing apparatus is strongly required to improve the throughput, improve the cleanliness around the substrate, and reduce the load on the incidental equipment. The same applies to a plating apparatus that includes the plating apparatus that performs the above-described plating process, and that continuously performs all the steps of pretreatment of the substrate, plating treatment, and post-treatment of plating.
[0010]
However, in the conventional plating apparatus in which all the plating processes are performed continuously, the plating process and the process of the substrate to which the plating solution adheres, and the other processes not directly related to the plating solution are mixed. For example, a pretreatment device that performs pretreatment of a substrate and a plating device that performs plating treatment are arranged at positions adjacent to each other, and are configured to deliver a substrate using the same transfer robot. Yes. For this reason, it is generally difficult to improve the cleanliness around the substrate in the plating apparatus due to the plating solution adhering to the transfer robot or the mist containing the plating solution floating, etc. The current situation is that there is a certain limit to the improvement of the process and the reduction of the incidental facilities of the plating apparatus.
[0011]
The present invention has been made in view of the above circumstances, and improves the throughput of the plating apparatus that continuously performs the entire plating process, improves the cleanliness around the substrate, and further reduces the load of incidental equipment of the plating apparatus. It is an object of the present invention to provide a plating apparatus that can be used.
[0012]
[Means for Solving the Problems]
According to the first aspect of the present invention, the interior of the apparatus is divided into a plating space for performing the plating process of the substrate and the substrate to which the plating solution is attached, and a clean space for performing the processing of other substrates. With divider Division And this Between the plating space and the clean space through the partition plate through the partition plate A substrate delivery unit for delivering a substrate is provided, a transfer robot is individually arranged in each of the plating space and the clean space, a pretreatment device for pretreating the substrate is installed in the clean space, and the clean space The transfer robot placed inside ,in front The substrate is transferred and transferred between the substrate transfer section, the pre-processing apparatus and the processing apparatus installed in the clean space. The transfer robot installed in the plating space transfers and transfers the substrate between the substrate transfer unit and the processing apparatus installed in the plating space. It is the plating apparatus characterized by this.
[0013]
With this, the transfer robot disposed in the plating space is used to transfer and transfer the substrate between the processing apparatus and the substrate transfer unit for performing the plating process and the plating solution removal process on the substrate, and the transfer robot disposed in the clean space. Other substrate processing, that is, processing and processing of the substrate not directly related to the plating solution, and transporting and transferring the substrate between the substrate transfer unit, pre-treatment of the substrate, plating treatment and plating In addition to improving the cleanliness around the substrate inside the plating equipment that continuously performs all the post-treatment plating processes, it improves the throughput of the plating equipment, and further reduces the burden on the auxiliary equipment of the plating equipment. Further downsizing as an apparatus can be achieved.
[0014]
According to the second aspect of the present invention, the interior of the apparatus is divided into a plating space for performing the plating treatment of the substrate and the substrate to which the plating solution or the activation treatment solution is attached, and a clean space for treating the other substrates. With divider As well as this Between the plating space and the clean space through the partition plate through the partition plate A substrate delivery unit for delivering a substrate is provided, a transfer robot is individually arranged in each of the plating space and the clean space, a pretreatment device for pretreating the substrate is installed in the clean space, and the clean space The transfer robot placed inside ,in front The transfer robot installed in the plating space performs transfer and transfer of the substrate between the substrate transfer section, the pretreatment device and the processing device installed in the clean space. ,in front A plating apparatus characterized in that a substrate is transferred and delivered between the substrate delivery section and a processing apparatus installed in the plating space.
[0015]
As a result, it is possible to use a plating apparatus having a small footprint as a plating apparatus for performing a plating process, and further reduce the size of the plating apparatus having a large number of plating tanks. The load can be further reduced.
[0016]
According to a third aspect of the present invention, the pretreatment apparatus is configured to supply a pretreatment liquid to the surface of the substrate while rotating the substrate while holding the substrate horizontally. Or it is the plating apparatus of 2 description.
Thereby, the pretreatment liquid can be effectively applied to the entire substrate, the substrate can be efficiently pretreated, and the plating reliability can be improved and the throughput can be improved. Further, for example, residues remaining in the resist pattern on the surface of the substrate can be removed, and this can also be used to form a highly reliable metal film (plating film) free from plating defects.
[0017]
According to a fourth aspect of the present invention, the pretreatment device supplies the pretreatment liquid to the surface of the substrate while rotating the substrate while holding the substrate horizontally, stops the supply of the pretreatment liquid, and rotates the substrate. The plating apparatus according to claim 1, wherein the plating apparatus is configured to perform a liquid draining operation.
Thus, by performing the liquid draining operation by rotating the substrate after the pretreatment, it is possible to prevent the treatment liquid applied to the surface of the substrate from causing dripping in the subsequent treatment.
[0018]
According to a fifth aspect of the present invention, the pretreatment apparatus supplies the pretreatment liquid to the surface of the substrate while rotating the substrate while holding the substrate horizontally, while stopping the supply of the pretreatment liquid and rotating the substrate. 3. The plating apparatus according to claim 1, wherein the plating apparatus is configured to perform a liquid draining operation by spraying a dry gas on an end surface and / or a back surface of the substrate.
In this way, by performing a liquid draining operation by blowing dry gas on the end surface and / or back surface of the substrate while rotating the substrate, the processing liquid applied to the surface of the substrate causes dripping in the subsequent processing. This can be prevented.
[0019]
The invention according to claim 6 is the plating apparatus according to any one of claims 3 to 5, wherein the pretreatment liquid is pure water.
Thus, using pure water as a substrate pretreatment liquid, supplying pure water to the surface of the substrate (surface to be plated) and wetting the surface with pure water improves the wettability of the substrate surface, The reliability of plating can be improved and the throughput can be improved.
[0020]
According to a seventh aspect of the invention, the pretreatment apparatus is configured to supply different treatment liquids to the surface of the substrate continuously or intermittently. It is a plating apparatus as described in.
Thereby, for example, a chemical solution and pure water are supplied to the substrate surface continuously or intermittently, the surface of the substrate is efficiently cleaned with the chemical solution, and the wettability of the substrate surface is improved with pure water, Reliability can be improved and throughput can be improved.
[0021]
The invention according to claim 8 is characterized in that a blowing device for removing a plating solution adhering to the substrate by blowing gas onto the substrate is installed in the plating space. It is a plating apparatus as described in.
The invention described in claim 9 is characterized in that an activation processing device for activating the surface by bringing a chemical solution into contact with the substrate surface before plating is installed in the plating space. The plating apparatus according to any one of the above.
[0022]
In a tenth aspect of the present invention, the transfer robot disposed in the plating space attaches a substrate pretreated by the pretreatment device disposed in the clean space to the substrate holder, and the substrate holder The plating apparatus according to claim 2, wherein the plating apparatus is configured to convey the whole.
The invention according to claim 11 is that the transfer robot arranged in the clean space is a fixed robot that holds the substrate in a horizontal state and delivers the substrate, and the transfer robot is arranged in the plating space. 3. The plating apparatus according to claim 2, wherein the robot is a traveling robot that holds a substrate or a substrate holder on which the substrate is mounted in a vertical state and delivers the substrate or the substrate holder.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG.1 and FIG.2 shows the whole layout drawing of the plating apparatus of embodiment of this invention. This plating device is designed to automatically perform all the plating processes of substrate pre-treatment, plating treatment and post-plating treatment while maintaining the substrate in a horizontal state. The inside of the apparatus frame 10 is subjected to a plating space 14 for performing the plating process of the substrate and the substrate to which the plating solution is adhered, and other processes, that is, a process not directly related to the plating solution, by the partition plate 12. It is divided into a clean space 16. A temporary table 18 is provided as a substrate transfer portion that passes through the partition plate 12 and transfers the substrate between the plating space 14 and the clean space 16. The clean space 16 is connected with a load / unload port 20 on which a substrate cassette containing substrates is placed and mounted, and the apparatus frame 10 is provided with an operation panel 21.
[0024]
Inside the clean space 16 are an aligner 22 that aligns the position of the orientation flat or notch of the substrate in a predetermined direction, two cleaning / drying devices 24 for cleaning the substrate after plating and rotating it at a high speed to spin dry, Pre-treatment of the substrate, in this example, spraying pure water toward the surface of the substrate (surface to be plated) to clean the substrate surface with pure water and also wet with pure water to improve hydrophilicity The pre-processing device 26 for performing is arranged at the four corners. Further, these processing devices, that is, the aligner 22, the cleaning / drying device 24, and the pre-processing device 26 are located at substantially the center of the processing devices 22, 24, 26, the temporary table 18 and the load / unload device. A first transfer robot 28 that transfers and transfers the substrate to and from the substrate cassette mounted on the load port 20 is disposed.
[0025]
In this example, a plating tank 30 for holding a plating solution is provided inside the plating space 14, and the surface of the substrate is brought into contact with the overflowed plating solution held in the plating tank 30 to perform the plating process (FIG. 7), the plating apparatus 32 that performs a rinsing (rough cleaning) process for removing the plating solution adhering to the substrate by spraying pure water on the substrate while rotating the substrate after plating is positioned along the circumferential direction. In total, five units are arranged. Further, a second transfer robot 34 for transferring and delivering the substrate is disposed between the plating apparatus 32 and the temporary mounting table 18 at a substantially central position surrounded by the plating apparatuses 32. .
[0026]
Here, the aligner 22, the cleaning / drying device 24, and the pre-processing device 26 disposed in the clean space 16 are configured to hold and process the substrate in a horizontal posture with the surface facing upward, and the first transfer. The robot 28 is configured to carry and deliver the substrate while holding the substrate in a horizontal posture with the surface facing upward.
[0027]
FIG. 2 shows an outline of the preprocessing device 26. As shown in FIG. 2, the pretreatment device 26 includes a substrate holding unit 40 that holds the substrate W detachably with the surface facing upward, and a surface of the substrate W held by the substrate holding unit 40. An ejection head 42 for spraying a treatment liquid such as pure water is provided, and the ejection head 42 is disposed above the substrate holding unit 40.
[0028]
The substrate holding unit 40 includes a disk-shaped substrate stage 44 and a plurality of substrate chucks 46 provided at predetermined positions in the circumferential direction of the peripheral surface of the upper surface of the substrate stage 44. The substrate W is detachably held with the peripheral edge of the substrate W sealed, and is connected to the upper end of a main shaft 48 that extends in the vertical direction and is rotatable via a motor or the like. On the other hand, the ejection head 42 is provided with a plurality of ejection nozzles 50 located on the rear surface thereof, and the processing liquid is ejected downward from the ejection nozzles 50 and supplied.
[0029]
Furthermore, a side wall 52 that is substantially cylindrical and rises to surround the periphery of the substrate holding unit 40 and descends to open the periphery of the substrate holding unit 40 is moved up and down via a slider 54 that moves up and down by a cylinder or the like. Arranged freely.
[0030]
As a result, the substrate W, which is transported in a horizontal posture with the surface facing upward, is received from the first transport robot 28 while the sidewall 52 is lowered, and is held by the substrate holding unit 40. Raise. In this state, while rotating the substrate holding unit 40 integrally with the substrate W, pure water is supplied to the surface (upper surface) of the substrate W from the plurality of spray nozzles 50 in this example, thereby supplying the substrate. The surface of W is washed with pure water, and at the same time, the surface of the substrate W is wetted with pure water to pretreat the substrate to improve the hydrophilicity of the surface. After completion of this pretreatment, the supply of pure water is stopped, the substrate holder 40 is rotated together with the substrate W, and the substrate is drained.
[0031]
2, a gas supply line 56 that penetrates the inside of the main shaft 48 and opens on the upper surface of the substrate stage 44 is provided. After the pretreatment, the supply of pure water is stopped, and the substrate holding unit While rotating the substrate 40 integrally with the substrate W, N gas is supplied from the gas supply line 56 to the back side of the substrate W. ₂ The substrate W may be drained by supplying an inert gas such as a gas or dry air.
Then, after performing the liquid draining operation of the substrate for a predetermined time, the rotation of the substrate holding unit 40 is stopped, the sidewall 52 is lowered, and the first transport robot 28 receives the substrate W after the liquid draining. hand over.
[0032]
Thus, by supplying a pretreatment liquid such as pure water to the surface of the substrate while horizontally holding and rotating the substrate, the pretreatment liquid can be effectively applied to the entire substrate, The processing can be efficiently performed to improve the reliability of plating and improve the throughput. In addition, for example, residues remaining in the resist pattern on the surface of the substrate can be removed with pure water (treatment liquid), thereby forming a highly reliable metal film (plating film) free from plating defects. Can be useful.
[0033]
In addition, by rotating the substrate after the pretreatment to perform a liquid draining operation, or by performing a liquid draining operation by blowing dry gas, the processing liquid applied to the surface of the substrate in the subsequent processing is liquid. It can be prevented from causing anyone.
Furthermore, by using pure water as the pretreatment liquid, supplying pure water to the surface of the substrate (surface to be plated) and wetting the surface with pure water improves the wettability of the substrate surface and improves the reliability of plating. And the throughput can be improved.
[0034]
A series of bump plating processes by the plating apparatus configured as described above will be described with reference to FIG. First, as shown in FIG. 3A, a seed layer 500 as a power feeding layer is formed on the surface, and a resist 502 having a height H of 20 to 120 μm, for example, is applied to the entire surface of the seed layer 500. Thereafter, a substrate W provided with an opening 502a having a diameter D of about 20 to 200 μm, for example, at a predetermined position of the resist 502 is accommodated in a substrate cassette with its surface (surface to be plated) facing up. The cassette is mounted on the load / unload port 20.
[0035]
One substrate W is taken out from the substrate cassette mounted on the load / unload port 20 by the first transfer robot 28 and placed on the aligner 22 so that the positions of the orientation flat and the notch are aligned in a predetermined direction. The substrate W whose direction is adjusted by the aligner 22 is transferred to the pretreatment apparatus 26 by the first transfer robot 28. Then, as described above, the pretreatment apparatus 26 performs a pretreatment using pure water (pretreatment with water) as described above, and the substrate W after the pretreatment is temporarily placed on the temporary table 18 by the first transfer robot 28. Is transported to and placed on.
[0036]
The substrate W placed on the temporary table 18 is taken out by the second transport robot 34 and transported to any plating apparatus 32. In this plating apparatus 32, the surface of the substrate W is plated, and then pure water is sprayed on the substrate while rotating the substrate W to rinse (roughly clean) the substrate W. The second transfer robot 34 receives the rinsed substrate W from the plating apparatus 32, transfers the substrate W to the temporary table 18, and places it thereon.
[0037]
The first transfer robot 28 takes out the substrate W after the plating process placed on the temporary table 18 from the temporary table 18 and transfers it to one of the cleaning / drying devices 24. Then, the substrate held horizontally with the cleaning / drying device 24 is cleaned with pure water or the like, rotated at a high speed and spin-dried, and then loaded with the first transfer robot 28. Returning to the substrate cassette mounted on the unload port 20, the series of plating processes is completed. As a result, as shown in FIG. 3B, a substrate W on which a plating film 504 is grown in the opening 502a provided in the resist 502 is obtained.
[0038]
Then, the substrate W spin-dried as described above is immersed in a solvent such as acetone having a temperature of 50 to 60 ° C., for example, and the resist 502 on the substrate W is peeled off as shown in FIG. Then, as shown in FIG. 3D, the unnecessary seed layer 500 exposed to the outside after plating is removed. Next, by reflowing the plating film 504 formed on the substrate W, bumps 506 that are rounded by surface tension are formed as shown in FIG. Further, the substrate W is annealed at a temperature of 100 ° C. or more, for example, to remove the residual stress in the bumps 506.
[0039]
According to this example, the second transfer robot 34 disposed in the plating space 14 transfers and transfers the substrate between the plating apparatus 32 that performs the plating process of the substrate and the removal process of the plating solution and the temporary placement table 18, and cleans the substrate. A processing device for processing other substrates, that is, a substrate not directly related to the plating solution, by the transfer robot 28 disposed in the space 16, that is, an aligner 22, a cleaning / drying device 24, and a pretreatment device 26. The substrate is transported and delivered between the substrate and the temporary table 18 to improve the cleanliness around the substrate in the plating apparatus that continuously performs all the plating steps of substrate pretreatment, plating treatment and post-plating treatment. In addition, the throughput of the plating apparatus can be improved, and further, the load on the incidental equipment of the plating apparatus can be reduced, and the size of the plating apparatus can be further reduced.
[0040]
In other words, in a conventional general plating apparatus of this type, a pretreatment apparatus for pretreating a substrate is disposed adjacent to (immediately before) the plating apparatus, and the pretreatment is performed by this pretreatment apparatus. It was configured to receive the processed substrate from the pretreatment device by the transfer robot and transfer it to the plating device, and to receive the substrate subjected to plating by this plating device from the plating device by the same transfer robot and transfer it to the next process . For this reason, it is generally difficult to improve the cleanliness around the substrate after completion of the pretreatment because the plating solution adheres to the transfer robot or there is mist containing the plating solution. There was a certain limit to improving the quality of the equipment and reducing the incidental facilities of the plating equipment. However, according to this example, in particular, the pretreatment device 26 is arranged separately in the clean space 16 separate from the plating device 32, and the transfer robot 28 used for loading and unloading the substrate to and from the plating device 32 and the pretreatment are provided. Such an adverse effect can be eliminated by separating the transfer robot 34 used for loading and unloading the substrate from and into the apparatus 26.
[0041]
In the above example, an example in which one type of injection nozzle is provided as a pretreatment device and pure water is injected from the injection nozzle is shown. For example, it is possible to use a spray nozzle that is supplied with pure water and a chemical solution continuously or intermittently from the respective spray nozzles toward the surface of the substrate. Thereby, the surface of the substrate can be efficiently cleaned with a chemical solution, and the wettability of the surface of the substrate can be improved to improve the reliability and improve the throughput. The same applies to the following examples.
[0042]
FIG. 4 shows an overall layout of a plating apparatus according to another embodiment of the present invention. This example differs from the example shown in FIG. 1 in that one of the two cleaning / drying devices 24 is replaced with a pretreatment device 26 having the same configuration as that shown in FIG. The preprocessing can be performed in parallel. Other configurations are the same as the example shown in FIG.
[0043]
5 and 6 show a plating apparatus according to still another embodiment of the present invention. In this example, the interior of the apparatus frame 10 to which the exterior panel is attached is divided into a plating space 14 for performing the plating process of the substrate and the substrate to which the plating solution is adhered, and other processes, that is, It is divided into a clean space 16 that performs processing not directly related to the plating solution, and is different from the example shown in FIGS. 1 and 2 as follows.
[0044]
That is, two substrate holders 60 (see FIG. 6) are arranged in parallel in the partition portion partitioned by the partition plate 12 that partitions the plating space 14 and the clean space 16, and between the substrate holders 60. A substrate detachment table 62 is provided as a substrate delivery unit for detaching the substrate. In the plating space 14, in order from the partition plate 12 side, a stocker 64 for storing and temporarily placing the substrate holder 60, for example, an oxide film having a large electric resistance on the surface of the seed layer formed on the surface of the substrate is sulfuric acid or An activation treatment device 66 for etching and removing with a chemical solution such as hydrochloric acid, a first water washing device 68a for washing the surface of the substrate with pure water, a plating device 70 for performing a plating treatment, a second water washing device 68b, and draining the substrate after the plating treatment Blow devices 72 for performing the above are sequentially arranged. Then, two second transfer robots 74 a and 74 b are disposed along the rails 76 so as to be located on the sides of these devices. The one second transport robot 74a transports the substrate holder 60 between the substrate detachment table 62 and the stocker 64, and the other second transport robot 74b includes the stocker 64, the activation processing device 66, and the first water washing. The substrate holder 60 is transported among the apparatus 68a, the plating apparatus 70, the second water washing apparatus 68b, and the blow apparatus 72.
[0045]
As shown in FIG. 6, the second transfer robots 74 a and 74 b include a body 78 extending in the vertical direction and an arm 80 that can move up and down along the body 78 and that can rotate about an axis. The arm 80 is provided with two substrate holder holding portions 82 for holding the substrate holder 60 detachably in parallel. Here, the substrate holder 60 is configured to detachably hold the substrate W with the surface exposed and the peripheral edge sealed.
[0046]
The stocker 64, the activation processing device 66, the rinsing devices 68a and 68b, and the plating device 70 hang the substrate holder 60 in the vertical direction by hooking the outward projecting portions 60a provided at both ends of the substrate holder 60. It comes to support in the state. The activation processing device 66 is provided with two activation processing tanks 83 for holding a chemical solution therein. As shown in FIG. 6, the substrate holder 60 loaded with the substrate W is held in a vertical state. 2 The arm 80 of the transfer robot 74b is lowered, and if necessary, the substrate holder 60 is hooked on the upper end portion of the activation treatment tank 83 and supported by being suspended. It is comprised so that an activation process may be performed by immersing in the internal chemical solution.
[0047]
Similarly, each of the water washing devices 68a and 68b includes two washing baths 84a and 84b each holding pure water therein, and the plating device 70 includes a plurality of plating baths 86 each holding a plating solution therein. In the same manner as described above, the substrate holder 60 and the substrate W are immersed in pure water in these washing tanks 84a and 84b or in a plating solution in the plating tank 86, so that the washing process and the plating process are performed. Has been. The blower 72 lowers the arm 80 of the second transfer robot 74b that holds the substrate holder 60 mounted with the substrate W in a vertical state, and blows air or an inert gas onto the substrate W mounted on the substrate holder 60. Thus, the substrate is blown.
[0048]
According to this plating apparatus, first, the substrate holder 60 stored in the vertical position in the stocker 64 is taken out by the first transfer robot 74a, and is rotated horizontally by 90 ° so that two of the substrate holders 60 are arranged in parallel on the substrate attachment / detachment table 62. Placed on. In the same manner as in the examples shown in FIGS. 1 and 2, the substrate subjected to the pretreatment (pretreatment with washing) is attached to the substrate holder 60 mounted on the substrate detachment table 62 with the peripheral edge sealed. To do. Then, the two substrate holders 60 loaded with the substrate W are simultaneously held by the second transport robot 74a, lifted, transported to the stocker 64, and rotated 90 ° to bring the substrate holder 60 into a vertical state. Thereafter, it is lowered, and the two substrate holders 60 are suspended and held (temporarily placed) on the stocker 64. This is repeated sequentially, and the substrates are sequentially mounted on the substrate holder 60 accommodated in the stocker 64, and are sequentially suspended and held (temporarily placed) at predetermined positions of the stocker 64.
[0049]
On the other hand, in the second transfer robot 74b, the two substrate holders 60 mounted with the substrates and temporarily placed on the stocker 64 are simultaneously gripped and raised, and then transferred to the activation processing device 66 to be activated. The substrate is immersed in a chemical solution such as sulfuric acid or hydrochloric acid in 83 to etch the oxide film having a large electric resistance on the surface of the seed layer, thereby exposing a clean metal surface. Further, the substrate holder 60 on which the substrate is mounted is transported to the first water washing device 68a in the same manner as described above, and the surface of the substrate is washed with pure water placed in the water washing tank 84a.
[0050]
The substrate holder 60 on which the substrate that has been washed is mounted is transferred to the plating apparatus 70 in the same manner as described above, and is suspended and supported in the plating tank 86 in a state where it is immersed in the plating solution in the plating tank 86. The surface of W is plated. Then, after a predetermined time has elapsed, the substrate holder 60 on which the substrate is mounted is held again by the second transfer robot 74b and pulled up from the plating tank 86 to finish the plating process.
[0051]
Then, in the same manner as described above, the substrate holder 60 is transported to the second water washing device 68b and immersed in pure water placed in the water washing tank 84b to clean the surface of the substrate with pure water. Thereafter, the substrate holder 60 on which the substrate is mounted is conveyed to the blower device 72 in the same manner as described above. Here, an inert gas or air is blown toward the substrate to adhere to the substrate holder 60. Remove water drops. Thereafter, the substrate holder 60 on which the substrate is mounted is returned to a predetermined position of the stocker 64 and held in the same manner as described above.
The second transfer robot 74b sequentially repeats the above operations, and returns the substrate holder 60, on which the plated substrate is mounted, to the predetermined position of the stocker 64 in a suspended manner.
[0052]
On the other hand, in the second transfer robot 74a, the two substrate holders 60 to which the substrate after the plating process is mounted and returned to the stocker 64 are gripped at the same time, and placed on the substrate detachment table 62 in the same manner as described above. .
Then, the first transfer robot 28 arranged in the clean space 16 takes out the substrate from the substrate holder 60 placed on the substrate detachment table 62, and this is the same as the example shown in FIGS. Then, it is conveyed to the cleaning / drying device 24. Subsequent processing is the same as the example shown in FIGS.
[0053]
In the plating apparatus of this example, the plating apparatus 70 having a small footprint is used as the plating apparatus 70 for performing the plating process, thereby further reducing the size of the plating apparatus having a large number of plating tanks. At the same time, it is possible to further reduce the load on facilities attached to the factory.
In this example as well, as in the example shown in FIG. 4 described above, one of the two cleaning / drying devices 24 installed in FIG. 5 may be replaced with a pretreatment device. is there.
[0054]
【The invention's effect】
As described above, according to the present invention, the transfer and transfer of the substrate between the processing apparatuses that perform the plating process of the substrate and the removal process of the plating solution are arranged in the clean space by the transfer robot arranged in the plating space. With the transfer robot, the transfer and transfer of the substrate between the processing devices that process the other substrates are performed independently, so that the entire plating process of substrate pretreatment, plating treatment and post-plating treatment can be continued. In addition to improving the cleanliness around the substrate inside the plating apparatus to be performed, improving the throughput as the plating apparatus, and further reducing the burden on the incidental equipment of the plating apparatus, it is possible to further downsize the plating apparatus it can.
[Brief description of the drawings]
FIG. 1 is an overall layout view of a plating apparatus according to an embodiment of the present invention.
FIG. 2 is a view showing an outline of a pretreatment apparatus used in the plating apparatus of FIG.
FIG. 3 is a diagram showing an example of forming bumps (protruding connection electrodes) on a substrate in the order of steps.
FIG. 4 is an overall layout view of a plating apparatus according to another embodiment of the present invention.
FIG. 5 is an overall layout view of a plating apparatus according to still another embodiment of the present invention.
6 is a diagram showing a second transfer robot used in the plating apparatus of FIG. 5 and a state in which the substrate is held by the robot. FIG.
FIG. 7 is a schematic view of a plating apparatus that performs only a conventional plating process.
FIG. 8 is a schematic view of another plating apparatus that performs only conventional plating processing.
[Explanation of symbols]
10 Device frame
12 Partition plate
14 Plating space
16 Clean space
18 Temporary table (board transfer part)
20 Load / Unload port
22 Aligner
24 Cleaning and drying equipment
26 Pretreatment device
28, 34, 74a, 74b Transport robot
30,86 plating tank
32,70 Plating equipment
40 Substrate holder
42 Injection head
44 Substrate stage
46 Substrate chuck
50 injection nozzle
52 sidewall
56 Gas supply line
60 Substrate holder
62 Substrate detachment stand (substrate delivery section)
64 Stocker
66 Activation processing equipment
68a, 68b Flushing device
72 Blow device
80 arms
82 Substrate holder holder
83 Activation treatment tank
84a, 84b Flush tank

Claims (11)

Internal device divides the plating space for processing the substrate on which the plating treatment and the plating solution of the substrate is attached, by a partition plate into a clean space for processing the substrate otherwise, through the partition plate to the partition plate Providing a substrate delivery section for delivering the substrate between the plating space and the clean space ,
Each of the transfer robots is individually arranged in the plating space and the clean space,
A pretreatment device for pretreatment of the substrate is installed in the clean space,
The cleaned arranged transfer robot in space, have rows delivery and transport of the substrate between the front Stories substrate transfer unit, the pretreatment apparatus and the installed processor in the clean space,
The plating apparatus, wherein the transfer robot installed in the plating space transfers and transfers the substrate between the substrate transfer unit and the processing apparatus installed in the plating space . Internal equipment, and plating section for processing the substrate plating treatment and the plating solution or activation solution of the substrate is attached, as well as divided by the partition plate to a clean space for processing substrates other than it, to the partition plate Providing a substrate delivery section that passes through the partition plate and delivers the substrate between the plating space and the clean space ;
Each of the transfer robots is individually arranged in the plating space and the clean space,
A pretreatment device for pretreatment of the substrate is installed in the clean space,
The clean space arranged transfer robot in the prior SL substrate delivery unit performs the delivery and transport of the substrate between the pretreatment apparatus and the clean space the installed processor within,
Wherein the installed transport robot in the plating space is pre Symbol substrate transfer unit and the plating apparatus characterized by performing transfer and transport of the substrate between the installed processing device to the plating space.   The plating apparatus according to claim 1, wherein the pretreatment apparatus is configured to supply a pretreatment liquid to the surface of the substrate while rotating the substrate while holding the substrate horizontally.   The pretreatment apparatus is configured to supply a pretreatment liquid to the surface of the substrate while rotating the substrate while holding the substrate horizontally, and stop the supply of the pretreatment liquid and rotate the substrate to perform a liquid draining operation. The plating apparatus according to claim 1, wherein the plating apparatus is provided.   The pretreatment apparatus supplies the pretreatment liquid to the surface of the substrate while rotating the substrate while holding the substrate horizontally, stops supplying the pretreatment liquid, and rotates the substrate to dry the end surface and / or the back surface of the substrate. The plating apparatus according to claim 1, wherein the apparatus is configured to perform a liquid draining operation by blowing a gas.   The plating apparatus according to claim 3, wherein the pretreatment liquid is pure water.   The plating apparatus according to claim 3, wherein the pretreatment apparatus is configured to supply different treatment liquids to the surface of the substrate continuously or intermittently.   The plating apparatus according to claim 1, wherein a blowing device that blows gas onto the substrate to remove a plating solution attached to the substrate is installed in the plating space.   The plating apparatus according to claim 1, wherein an activation processing apparatus that activates the surface by bringing a chemical solution into contact with the substrate surface before plating is installed in the plating space.   The transport robot disposed in the plating space is configured to transport a substrate that has been pretreated by the pretreatment device disposed in the clean space to the substrate holder and transport the substrate holder together. The plating apparatus according to claim 2.   The transfer robot arranged in the clean space is a fixed robot that holds the substrate in a horizontal state and delivers the substrate, and the transfer robot arranged in the plating space is equipped with a substrate or a substrate. 3. The plating apparatus according to claim 2, wherein the plating apparatus is a traveling robot that holds the substrate holder in a vertical state and delivers the substrate or the substrate holder.

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