JP4107245B2 - Micro relay - Google Patents

Description

  The present invention relates to a microrelay formed by a semiconductor microfabrication technique.

Patent Document 1 discloses a microrelay formed using a semiconductor microfabrication technique. This micro relay includes a body (ceramic substrate) including an electromagnet device and an armature block (Si substrate) bonded to the body via a spacer. This armature block has a shape integrally including an armature substrate (movable piece) that includes a magnetic body and that constitutes the armature, and a frame that surrounds the entire circumference of the armature substrate and supports the armature substrate in a swingable manner. . The center of the armature substrate in the longitudinal direction on both sides in the width direction is connected to the frame by a pair of elastic pieces (pivot supports), and performs a seesaw operation with the elastic pieces as axes.
Japanese Patent Laid-Open No. 5-114347

  By the way, in the above conventional micro relay, there is a problem that if the supporting force of the elastic piece is weak, the armature substrate is attracted to the electromagnet device, and conversely, if the supporting force of the elastic piece is strong, the armature substrate does not perform a seesaw operation.

  In view of this point, the present applicant has separately proposed a micro relay capable of stably operating the armature board and freely setting the spring constant (Japanese Patent Application No. 2003-284187). This microrelay has an armature board, an armature block integrally formed with a frame-like frame that is concavo-convexly fitted to the center side of both sides thereof and elastically holds both sides of the center side, and the armature block. It is configured to include a body formed in a shape to be placed on the surface, an electromagnet device housed in the housing portion of the body, a cover, and a fulcrum portion (protrusion portion) serving as a fulcrum for armature seesaw movement. Yes.

  In this configuration, the center side of both side portions of the armature substrate is concavo-convexly engaged with the frame, and the both sides of the center side are elastically held by the frame, thereby enabling stable seesaw movement of the armature substrate. Further, since the armature substrate is not attracted to the body by the fulcrum portion, the spring constant of the portion (elastic piece) elastically held by the frame can be freely set (set small).

  However, the micro relay has a problem that the armature substrate is affected by vibration or impact. That is, the movement of the armature substrate in each direction along the frame inner surface of the frame is restricted by the frame that is unevenly fitted to the center side of both sides of the armature substrate, but the armature substrate in the normal direction to the inner surface of the frame Since the movement of the armature is not regulated, there is a problem that the armature substrate moves in the normal direction.

  The present invention has been made in view of the above circumstances, and provides a micro relay capable of stably operating an armature substrate and freely setting a spring constant and improving vibration resistance and shock resistance performance. For the purpose.

The invention according to claim 1 for solving the above-mentioned problem is a microrelay formed by a semiconductor microfabrication technique, which surrounds the armature substrate and the entire periphery of the armature substrate and the central side of both sides of the armature substrate. A rectangular frame-like frame that fits and elastically holds both sides of the central side is integrally formed with a silicon substrate, and is formed on at least one side of the other side of the armature substrate. An armature block having a movable contact, a magnetic body fixed to the armature substrate and constituting an armature, and a shape in which the armature block is placed on one surface. Formed on at least one side of the armature substrate on the one surface of at least one of the two ends sandwiching the storage portion. A body having a pair of fixed contacts arranged opposite to each other and spaced apart from each other, and a pair of fixed contacts housed in a housing portion of the body and disposed at at least one end of the body. An electromagnet device that contacts and separates a movable contact formed on at least one side of the substrate; a cover formed in a box shape that covers the back surface of the surface of the armature block placed on one surface of the body; The armature is provided at a position corresponding to the center side of one side of the armature substrate between the armature and the body, and when the movable contact is brought into contact with and separated from the fixed contact by the electromagnet device. A fulcrum portion serving as a fulcrum for seesaw movement, an inner bottom surface of the cover, and the armature support at least one of the armature And a convex stopper provided at a location corresponding to the shaft to reduce a minimum separation distance of the armature with respect to the inner bottom surface of the cover, and the body is a pair of fixed members disposed at at least one end of the body A pair of fixed contact through holes that are electrically connected to the contacts, a ground pattern formed on the periphery of the one surface of the body, and a ground through hole that is electrically connected to the ground pattern A pair of fixed contact bumps and a ground bump provided on the back side of the one surface of the body and electrically connected to the pair of fixed contact through holes and the ground through hole, respectively. A metal thin film covering at least the armature block side is fixed to the cover; A space in which the movable contact and the fixed contact are accommodated via a metal thin film formed from one surface of the frame to the other surface on the inner surface of at least the side where the movable contact is formed, on both sides of the frame. In the outwardly projecting portion of the ground pattern of the body that protrudes more outward, the body is electrically connected to the ground pattern, and the movable contact, the fixed contact , the fixed contact, and the fixed contact through A wiring path that is electrically connected to the hole is shielded by the metal thin film of the cover.

In this configuration, the center side of both side portions of the armature substrate is concavo-convexly engaged with the frame, and the both sides of the center side are elastically held by the frame, thereby enabling stable seesaw movement of the armature substrate. Further, since the armature substrate is not attracted to the body by the fulcrum portion, the spring constant of the portion elastically held by the frame can be freely set. In addition, the movement of the armature substrate in each direction along the inner surface of the frame is restricted by a frame that is unevenly fitted to the center side of one side of the armature substrate, and in the normal direction to the inner surface of the frame. The movement of the armature substrate is restricted by the fulcrum portion and the convex portion stopper, so that the vibration resistance and the shock resistance performance can be improved. In addition, since the movable contact, the fixed contact and the wiring path can be shielded by the metal thin film of the cover, the high frequency characteristics of the signal line can be improved, and a micro relay having excellent EMC characteristics can be provided.

According to a second aspect of the present invention, in the microrelay according to the first aspect , the armature block has, as the movable contact, both movable contacts formed on both sides of the other armature substrate, and the body As the pair of fixed contacts, a pair of fixed contacts that are arranged opposite to one of the two movable contacts and spaced apart from each other on one surface of one end portion of the both ends sandwiching the storage portion, and the other The one surface of the end portion has a pair of fixed contacts arranged opposite to the other of the movable contacts and spaced apart from each other, and the pair of fixed contact throughs corresponding to each of the pair of fixed contacts It has a hole, the ground pattern, the ground through hole, the pair of fixed contact bumps, and the ground bump. With this configuration, it is possible to provide a micro relay having two circuit contacts that alternately open and close, for example, a normally open contact and a normally closed contact.

According to a third aspect of the invention, in the microrelay according to the first or second aspect, a metal thin film is fixed to all or a part of the cover, and the metal thin film is marked with a laser. With this configuration, even if the surface is a few millimeters in size, marking with high visibility is possible.

  According to the present invention, the armature substrate can operate stably, the spring constant can be set freely, and the vibration resistance and shock resistance performance can be improved.

  FIG. 1 is a cross-sectional view (a) and a partially enlarged view (b) of a microrelay according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of the microrelay, and FIG. FIG.

  The micro relay of the present embodiment is formed by, for example, a semiconductor micromachining technique, and includes a body 1, an electromagnet device 2, an armature block 3, and a cover 4 as shown in FIGS.

  The body 1 is a rectangular plate made of glass, and as shown in FIG. 4, through holes 10A, 10B, 10C, and 10D penetrating the upper and lower surfaces of the body 1 are formed in the vicinity of the four corners. Through holes 10E and 10F are formed at the central edge of both ends in the longitudinal direction. In order to electrically connect the electric circuit (not shown) of the printed circuit board on which the micro relay is mounted, the fixed contacts 14A, 14B, 15A, 15B and the ground patterns 14C, 15C to the inner peripheral surfaces of the through holes 10A to 10F. Electrical paths 11A to 11F are formed. Each of the electric paths 11A to 11F is made of chromium, titanium, platinum, cobalt, nickel, gold, copper, an alloy of gold and cobalt, or an alloy thereof, and is formed by plating, vapor deposition, sputtering, or the like. Lands 12 that are electrically connected to the electrical paths 11A to 11F are formed on the peripheral edges of the openings at both ends of the through holes 10A to 10F. As shown in FIG. 3, bumps 13 made of a conductive material such as gold, silver, copper, and solder are placed on the lands 12 on the lower surface side of the body 1 so as to block the lower surface openings of the through holes 10A to 10F. In addition, it is tightly bonded by heat or the like.

  On the upper surface of the body 1, as shown in FIG. 4, two pairs of fixed contacts 14A, 14B, 15A, 15B and ground patterns 14C, 15C are formed. Each of the fixed contacts 14A, 14B, 15A, 15B and the ground patterns 14C, 15C has at least the surface thereof formed of chromium, titanium, platinum, cobalt, nickel, gold, copper, an alloy of gold and cobalt, or an alloy thereof. Has been. The fixed contacts 14A and 14B are arranged side by side so as to be sandwiched between the two through holes 10A and 10B. One fixed contact 14A is electrically connected to the land 12 of the through hole 10A, and the other fixed contact 14B is electrically connected to the land 12 of the through hole 10B. The through hole 10E is provided on the outer side between the pair of fixed contacts 14A and 14B, and ground patterns 14C and 14C electrically connected to the land 12 of the through hole 10E extend to the through holes 10A and 10B side. ing. Similarly, the fixed contacts 15A and 15B are arranged in parallel so as to be sandwiched between the two through holes 10C and 10D. One fixed contact 15A is electrically connected to the land 12 of the through hole 10C, and the other fixed contact 15B. Is electrically connected to the land 12 of the through hole 10D. The through hole 10F is provided outside the pair of fixed contacts 15A and 15B, and ground patterns 15C and 15C electrically connected to the land 12 of the through hole 10F are extended to the through holes 10C and 10D side. ing.

  In the center of the body 1, there are provided cross-shaped through holes 16 penetrating the upper and lower surfaces of the body 1, and the thin film 17 is closely bonded to the body 1 so as to close the through hole 16 on the upper surface side of the body 1 ( Figure 2). Thereby, the accommodation recessed part 18 (accommodation part) which accommodates the electromagnet apparatus 2 in the lower surface side of the body 1 is formed (FIG. 3). The thin films 17A to 17F are tightly joined to the body 1 so as to close the through holes 10A to 10F (FIG. 2). The thin films 17, 17A to 17F are formed of silicon or glass, and are formed to a thickness of about 5 to 50 μm, preferably about 20 μm, by performing processing such as etching or polishing. The through-hole 16 is formed in a tapered shape having a sectional area that gradually decreases from the lower surface to the upper surface of the body 1, thereby making it easier to accommodate the electromagnet device 2.

  As shown in FIG. 2, the electromagnet device 2 includes a yoke 20, a permanent magnet 21, coils 22 </ b> A and 22 </ b> B, and a substrate 23. The yoke 20 is formed in a U shape in which rectangular plate-like leg pieces 20B and 20C are raised from both ends of the rectangular plate-like central piece 20A by bending or forging an iron plate such as electromagnetic soft iron. Yes. The permanent magnet 21 has a rectangular parallelepiped shape and is magnetized so that the back-to-back magnetic pole surfaces 21A and 21B (see FIG. 5) have different polarities. The permanent magnet 21 is attached to the yoke 20 such that one magnetic pole surface 21B is in contact with the center of the central piece 20A of the yoke 20 and the other magnetic pole surface 21A is at the same height as the tips of the leg pieces 20B and 20C. ing. The coil 22A is directly wound around the central piece 20A between the leg piece 20B and the permanent magnet 21, and its end face is in contact with the leg piece 20B and the permanent magnet 21, so that the movement in the left-right direction is restricted. Similarly, the coil 22B is wound directly around the central piece 20A between the leg piece 20C and the permanent magnet 21, and its end face is in contact with the leg piece 20C and the permanent magnet 21, so that movement in the left-right direction is restricted. . The substrate 23 has a rectangular shape and is joined to the lower surface of the central piece 20A of the yoke 20 so as to be orthogonal to the central piece 20A. The substrate 23 has a conductive portion 23A on the lower surface (see FIG. 3), and the tip of the coil 22 is electrically connected to the conductive portion 23A. The conductive portion 23A is provided with a bump 24 that electrically connects an electric circuit (not shown) of a printed board on which the micro relay is mounted and the coil 22.

  The electromagnet device 2 is housed in the housing recess 18 with the tips of the leg pieces 20B and 20C facing upward. At this time, as shown in FIGS. 5 and 6, a positioning portion 17 </ b> A consisting of a concave portion or a convex portion is formed on the lower surface of the thin film 17, and the electromagnet apparatus 2 includes the tips of the leg pieces 20 </ b> B and 20 </ b> C and the permanent magnet 21. By positioning the magnetic pole surface 21A with the positioning portion 17A, the positioning surface 17A is accurately positioned and accommodated. The lower surface of the thin film 17 may be a flat surface, and the lower surface of the thin film 17 may be stored in close contact with the tips of the leg pieces 20B and 20C of the electromagnet device 2 and the magnetic pole surface 21A of the permanent magnet 21 (see FIG. 7). Further, the yoke 20 is not limited to a U shape, and may be an H shape as shown in FIG.

  The armature block 3 is formed by etching a silicon substrate having a thickness of about 50 to 300 μm, preferably about 200 μm. As shown in FIGS. 2, 8, and 9, the armature substrate 30 and the entire armature substrate 30 are formed. A frame 31 that surrounds the periphery and supports the armature substrate 30 in a swingable manner is integrally provided. A rectangular plate-like magnetic body 32 is bonded to the lower surface of the armature substrate 30 to constitute the armature 300.

  The armature substrate 30 includes a rectangular magnetic body holding portion 30A to which a magnetic body 32 is bonded on the lower surface, and movable contact portions 30B to which movable contacts 33A and 33B formed on the lower surface, for example, in the same manner as the fixed contacts, are fixed. 30B. These movable contacts are formed in the same manner as the fixed contacts, for example. The movable contact portion 30B is supported on the magnetic body holding portion 30A by hinge pieces 34 that can be elastically deformed on both sides in the longitudinal direction of the magnetic body holding portion 30A.

  Both sides in the width direction of the magnetic body holding portion 30A are supported by the frame 31 by elastic pieces 35 that can be elastically deformed. The elastic pieces 35 are provided at four positions symmetrically about the axis X (fulcrum axis) of the seesaw operation of the armature substrate 30. Each elastic piece 35 has one end integrally formed and coupled to the magnetic body holding portion 30A and the other end integrally formed and coupled to the frame 31, and is identical to the frame 31 between the one end and the other end. A plurality of meandering portions 35A meandering in a U shape on the plane are formed. By providing the meandering portion 35A, the elastic piece 35 can be formed long, and the spring constant of the spring force generated when the elastic piece 35 is twisted when the armature substrate 30 performs a seesaw operation can be appropriately reduced. The stress applied to the elastic piece 35 can also be dispersed. The elastic piece 35 is formed with a thickness smaller than the thickness of the frame 31 and with a width smaller than the thickness.

  Further, the magnetic body holding portion 30A has extended pieces 36 formed at the center portions on both sides in the width direction. A protruding portion 36A is provided at a portion of the extending piece 36 that faces the frame 31, and an extending piece 37 having a recessed portion 37A is provided on the inner peripheral surface of the frame 31 that faces the protruding portion 36A. The convex portion 36A and the concave portion 37A constitute a movement restricting portion 301 that restricts the movement of the armature substrate 30 in the horizontal direction by fitting the concave and convex portions on the same plane as the frame 31. Further, as shown in FIG. 8, a protrusion 36 </ b> B (fulcrum) serving as a fulcrum for the seesaw operation of the armature substrate 30 is formed on the lower surface of the extended piece 36. The convex portions 36A and the concave portions 37A may be reversed, and the concave / convex fitting is not limited to each pair, and a plurality of pairs may be employed.

  Further, second extending pieces 38 are formed at the four corners of the magnetic body holding portion 30A. On the lower surface of the second extending piece 38, a second protrusion 38A serving as a stopper for the seesaw operation of the armature substrate 30 is formed. The second protrusion 38A is formed to have a predetermined distance from the upper surface of the body 1 facing when the armature substrate 30 is leveled.

  The frame 31 has a rectangular shape with a rectangular opening on the lower side. As shown in FIGS. 8 and 9, the metal frame 31 extends from the inner surface to the upper and lower surfaces of both side portions 311 and 312 in the short direction. Thin films 311A and 312A are formed. The metal thin films 311A and 312A are formed on the insulating film after the armature block 3 other than the movable contacts 33A and 33B is covered with the insulating film, for example. The movable contacts 33A and 33B may be formed in the same manner as the fixed contacts simultaneously with the metal thin films 311A and 312A.

  The magnetic body 32 is formed by machining a magnetic material such as electromagnetic soft iron, electromagnetic stainless steel, or permalloy, and is joined to the magnetic body holding portion 30A by a method such as adhesion, welding, hot welding, or brazing. By forming the magnetic body 32 by machining, the thickness can be increased and the attractive force can be improved.

  The thickness of the armature substrate 30 is smaller than the thickness of the frame 31, and the lower surface of the armature 300 with respect to the lower surface of the frame 31 (that is, the lower surface of the magnetic body 32 and the lower surfaces of the movable contacts 33A and 33B). The armature substrate 30 is held on the upper side of the frame 31 so as to be recessed. Thus, as will be described later, when the frame 31 is joined to the body 1, a space for accommodating the swing of the armature 300 is formed between the lower surface of the armature 300 and the body 1.

  The cover 4 is formed in a rectangular plate shape using heat-resistant glass such as Pyrex (R), and a concave portion 40 for accommodating the swing of the armature 300 is provided on the lower surface as shown in FIG.

  And the convex part stopper 41 is provided in the location corresponding to the fulcrum axis | shaft of the seesaw movement in at least one among the inner bottom face 40A of the cover 4 and the armature 300. In the present embodiment, a convex stopper 41 is provided at the center of the inner bottom surface 40A of the cover 4, and the minimum separation distance MD of the armature (armature substrate 30) with respect to the inner bottom surface 40A of the cover 4 is several μm as shown in FIG. It is reduced to tens of μm.

  A metal thin film 4A is fixed to the entire surface of the cover 4, and the metal thin film 4A is electrically connected to the ground patterns 14C and 15C of the body via the metal thin films 311A and 312A of the armature block 3. The upper surface of the cover 4 is marked with a laser.

  The body 1, the armature block 3, and the cover 4 configured as described above are such that the frame 31 of the armature block 3 is anodic bonded to the peripheral edge 19 of the body 1 and the peripheral edge 42 of the cover 4 over the entire periphery. Are joined directly. As shown in FIG. 1, a sealed space S surrounded by the frame 31 is formed between the body 1 and the cover 4, and the armature 300, the movable contacts 33A and 33B, and the fixed contacts 14A and 14B are formed in the sealed space S. , 15A, 15B are accommodated. The movable contacts 33A, 33B and the fixed contacts 14A, 14B, 15A, 15B constitute a contact mechanism 302 that contacts and separates when the armature 300 swings. The protrusion 36 </ b> B of the armature block 3 is in contact with the thin film 17 at the apex thereof.

  Next, the operation of this micro relay will be described. When the coils 22A and 22B are energized from one direction, the magnetic body 32 is attracted to the one leg piece 20B, and the armature 300 performs a seesaw operation with the apex of the protrusion 36B as a fulcrum. The seesaw operation of the armature 300 stops when the second protrusion 38 </ b> A serving as a stopper provided on the lower surface of the second extending piece 38 contacts the upper surface of the body 1. Providing the second protrusion 38A prevents the magnetic body 32 and the thin film 17 from directly colliding with each other and preventing the magnetic body 32 and / or the thin film 17 from being damaged. At this time, the movable contact 33A provided on the lower surface of the movable contact portion 30B comes into contact with the pair of opposed fixed contacts 14A and 14B, and closes between the fixed contacts 14A and 14B. The movable contact 33 </ b> A obtains an appropriate contact pressure due to the elasticity of the hinge piece 34. By adjusting the distance between the second protrusion 38A and the body 1, the amount of pressing of the movable contacts 33A and 33B can be adjusted. Even when the energization of the coils 22A and 22B is stopped, the armature 300 maintains the same state by the magnetic flux generated from the permanent magnet 21 and passing through the closed magnetic path of the magnetic body 32 → the leg piece 20B → the permanent magnet 21.

  Next, when the energizing directions of the coils 22A and 22B are reversed, the magnetic body 32 is attracted to the other leg piece 20C, and the torsional restoring force of the elastic piece 35 is also applied, so that the armature 300 uses the apex of the protrusion 36B as a fulcrum. Execute the seesaw operation in the opposite direction. At this time, the movable contact 33B provided on the lower surface of the movable contact portion 30B comes into contact with the pair of opposed fixed contacts 15A and 15B, and closes between the fixed contacts 15A and 15B. The movable contact 33 </ b> B obtains an appropriate contact pressure due to the elasticity of the hinge piece 34. Even when the energization of the coils 22A and 22B is stopped, the armature 300 maintains the same state by the magnetic flux generated from the permanent magnet 21 and passing through the closed magnetic path of the magnetic body 32 → the leg piece 20C → the permanent magnet 21. That is, the micro relay of the present embodiment is configured as a latching type relay including a pair of normally open contacts and normally closed contacts.

  As described above, the armature substrate 30 of this microrelay is supported by the frame 31 by the elastic piece 35 and the movement restricting portion 301 is restricted from moving in the horizontal direction, with the apex of the protrusion 36B as a fulcrum. Since the seesaw operation is performed, a stable seesaw operation can be performed. Further, since the armature substrate 30 is not attracted to the body 1 because of the projection 36B, the spring constant of the elastic piece 35 can be freely set (set small). In order to mount the micro relay on a printed board (not shown), the bump 13 and the bump 24 on the lower surface of the body 1 may be flip-chip bonded.

  In addition, the movement of the armature substrate 30 in each direction along the inner surface of the frame 41 is regulated by the frame 31 that is unevenly fitted to the central side of one side of the armature substrate 30, and the method for the inner surface of the frame 41 is regulated. The movement of the armature substrate 30 in the linear direction is restricted by the protrusion 36B (fulcrum portion) and the convex stopper 41, whereby vibration resistance and impact resistance can be improved.

  Further, the metal thin film 4A is fixed to the cover 4, and the metal thin film 4A is electrically connected to the ground patterns 14C and 15C of the body 1 at the outward projecting portions 141C and 151C. 33B, the fixed contacts 14A, 14B, 15A, 15B and the wiring path can be shielded by the metal thin film 4A of the cover 4, so that the high frequency characteristics of the signal line can be improved and a micro relay having excellent EMC characteristics is provided. can do. Further, even if the micro relay is small and the surface size is several millimeters, marking with high visibility is possible.

  In the present embodiment, the metal thin film 4A is fixed to the entire surface of the cover 4. However, the present invention is not limited to this, and at least on the inner bottom surface 40A side (for example, the entire surface in the line L) shown in FIG. If the metal thin film 4A covering the armature block 3 side is fixed, a micro relay having excellent EMC characteristics can be provided.

  The through holes 10A to 10F are preferably formed from the upper and lower surfaces of the body 1 by blasting, etching, drilling, or ultrasonic processing. Generally, if a through hole is formed by blasting or etching, a tapered shape is obtained. Therefore, if through holes are formed from both the upper and lower surfaces of the body 1, in the case of blasting or etching, the through holes can be formed without increasing the opening on the surface of the body 1 as shown in FIG. In the case of drilling or ultrasonic machining, a straight hole can be formed as shown in FIG. 11B, and further downsizing can be achieved compared to the tapered shape.

  In the present embodiment, the body and the cover are made of glass, but may be made of silicon.

  In the present embodiment, the polar electromagnet device 2 using the permanent magnet 21 is shown, but a nonpolar electromagnet device that does not use a permanent magnet may be used.

  In the present embodiment, the protrusion 36B is configured to be provided on the lower surface of the armature substrate 30 (the lower surface of the extended piece 36), but as illustrated in FIG. The armature substrate 30 may perform a seesaw operation with the apex of the protrusion 36B provided on the upper surface of the thin film 17 as a fulcrum.

  In the present embodiment, the second protrusion 38A as a stopper is provided on the lower surface of the second extending piece 38, but is provided on the upper surface of the thin film 17 as shown in FIG. A configuration that can be used is also acceptable. Further, instead of providing the second protrusion 38 </ b> A, a metal thin film may be provided on the upper surface of the thin film 17 to protect the portion of the thin film 17 in contact with the armature 300.

  Further, as shown in FIG. 14, a constricted portion 25 having a width larger than the diameter of the winding is provided around the printed circuit board 23, and the ends of the coils 22A and 22B are wound around the constricted portion 25 to treat the end of the coil. You may make it easy to do.

It is sectional drawing (a) of the micro relay of one Embodiment by this invention, and its partially expanded view (b). It is a disassembled perspective view of the micro relay. It is the perspective view which looked at the micro relay from the lower side. It is a disassembled perspective view of the body of the micro relay. It is a schematic diagram which shows the positioning part of the micro relay. It is a schematic diagram which shows another positioning part of the micro relay. It is a figure which shows the modification of the yoke of the micro relay. It is the disassembled perspective view which looked at the armature block of the micro relay from the lower side. It is the bottom view (a) and top view (b) of the armature block. It is the perspective view which looked at the cover of the micro relay from the lower side. It is sectional drawing of the through hole of the body of the micro relay. It is a figure which shows the modification of the projection part of the micro relay. It is a figure which shows the modification of the 2nd projection part of the micro relay. It is a figure which shows the modification of the electromagnet apparatus of the micro relay.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Body 2 Electromagnet apparatus 3 Armature block 4 Cover 10A-10F Through-hole 11A-11F Electrical path 12 Land 13 Bump 14A, 14B Fixed contact 14C Ground pattern 15A, 15B Fixed contact 15C Ground pattern 17 Thin film 20 Yoke 21 Permanent magnet 22A, 22B Coil 30 Armature substrate 31 Frame 32 Magnetic bodies 33A, 33B Movable contact 34 Hinge piece 35 Elastic piece 36B Protrusion 300 Armature 302 Contact mechanism 4 Cover 41 Protrusion stopper

Claims (3)

A micro relay formed by semiconductor micromachining technology,
A silicon substrate in a shape that integrally includes an armature substrate and a rectangular frame frame that surrounds the entire circumference of the armature substrate and fits with the central side of one side of the armature and elastically holds both sides of the central side. An armature block that is formed and has a movable contact formed on at least one side of the other two sides of the armature substrate, and a magnetic body that is fixed to the armature substrate and constitutes the armature;
The armature block is formed in a shape to be placed on one surface, and has a storage portion at the center, and at least one end of at least one of both end portions sandwiching the storage portion has at least one of the armature substrates. A body having a pair of fixed contacts arranged opposite to each other and movable contacts formed on one side;
An electromagnet device that is accommodated in and separated from at least one side portion of the armature substrate with respect to a pair of fixed contacts that are accommodated in the accommodating portion of the body and disposed at at least one end of the body. When,
A cover formed in a box shape covering the back surface of the surface of the armature block placed on one surface of the body;
The armature is provided at a position corresponding to the center side of one side of the armature substrate between the armature and the body, and when the movable contact is brought into contact with and separated from the fixed contact by the electromagnet device. A fulcrum part which becomes a fulcrum of seesaw movement,
A convex stopper provided at a position corresponding to a fulcrum shaft of the seesaw movement in at least one of the inner bottom surface of the cover and the armature, and a convex stopper for reducing the minimum separation distance of the armature with respect to the inner bottom surface of the cover;
The body is formed in a pair of fixed contact through holes electrically connected to a pair of fixed contacts disposed at at least one end of the body, and in a peripheral portion of the one surface of the body. A ground pattern electrically connected to the ground pattern, the pair of fixed contact through holes and the ground through hole provided on the back side of the one surface of the body. Each has a pair of fixed contact bumps and ground bumps that are electrically connected,
A metal thin film covering at least the armature block side is fixed to the cover, and the metal thin film extends from one surface of the frame to the inner surface of at least the side portion of the frame where the movable contact is formed. The body ground pattern is electrically connected to the body ground pattern in an outward projecting portion of the body ground pattern, which projects outward from the space in which the movable contact and the fixed contact are accommodated through a metal thin film formed over the surface. And the movable contact, the fixed contact, and the fixed contact and the through hole for the fixed contact
A microrelay characterized in that a wiring path that electrically connects the two is shielded by the metal thin film of the cover. The armature block has, as the movable contact, both movable contacts formed respectively on the other both sides of the armature substrate,
The body has a pair of fixed contacts that are arranged opposite to one of the two movable contacts on the one surface of one end of the both ends sandwiching the storage portion as the pair of fixed contacts and spaced apart from each other. A pair of fixed contacts arranged opposite to the other of the movable contacts and spaced apart from each other on the one surface of the other end, and the pair of fixed contacts corresponding to each of the pair of fixed contacts The micro relay according to claim 1, comprising a contact through hole, the ground pattern, the ground through hole, the pair of fixed contact bumps, and the ground bump.   The microrelay according to claim 1 or 2, wherein a metal thin film is fixed to all or a part of the cover, and the metal thin film is marked with a laser.

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