JP4079302B2 - Method for assembling magnetic head device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for assembling a magnetic head device.
[0002]
[Prior art]
In a floating magnetic disk drive, a head with a magnetic head attached to a gimbal as a structure to support the magnetic head. The Gimbal Assembly (HGA) is known. The magnetic head device according to the present invention belongs to this HGA.
[0003]
In this type of magnetic head device, for many years, a twisted pair wire is attached to the head support, and the twisted pair wire is connected to the take-out electrode (bump) of the magnetic head attached to the head support by means such as laser welding. However, due to the downsizing of the magnetic head and the reduction of the flying height of the magnetic head, a highly accurate weight balance has become necessary, so that the wiring integrated magnetic head device has become mainstream. Yes.
[0004]
Recently, an FPC adhesion type magnetic head device in which wiring is separately manufactured as a flexible wiring board (hereinafter referred to as FPC) and the FPC is bonded to a head support (suspension) is being put into practical use. The present invention relates to this FPC adhesion type magnetic head device. In the case of assembling an FPC adhesive type magnetic head device, conventionally, an adhesive is applied on a head support, and an FPC is pasted and temporarily fixed thereon, and then the adhesive is fully cured. Thereafter, an adhesive was applied to the head mounting portion of the head support, a magnetic head was placed on the adhesive, and was temporarily cured after temporary fixing. That is, after the main curing of the adhesive for fixing the FPC to the head support, a step of main curing the adhesive for fixing the magnetic head on the head support is taken.
[0005]
For this reason, there existed a problem that an adhesion | attachment process became a complicated process of 2 processes and workability | operativity was bad. Moreover, in each temporary hardening process, problems, such as a bonding | positioning position shift | offset | difference, arise and there also existed a difficulty that reliability would be impaired easily.
[0006]
Furthermore, as a big problem, in order to secure the adhesion reliability of the FPC to the head support, it is necessary to apply an adhesive to the head mounting portion provided in the head support and bond the FPC. Due to the curing, there is a problem that the magnetic head is inclined and bonded to the head mounting portion of the head support. The head mounting portion provided in the head support is a part constituting a gimbal having two degrees of freedom around two orthogonal axes, and is directly related to the attitude angle (roll angle and pitch angle) of the magnetic head. Play a role. When the magnetic head is attached to the head mounting portion at an inclination, the posture angle of the magnetic head is adversely affected. Depending on the degree of inclination, it may be difficult to adjust the attitude angle within a standard value. In a magnetic head device of the HGA type, assuming that the static posture angle is not within a predetermined angle, treating the defective product as an inferior product is an expensive magnetic head manufactured through a complicated process, and an expensive gimbal and load beam. This means that it is not allowed to dispose of the HGA and further to eliminate the assembly cost of the HGA.
[0007]
[Problems to be solved by the invention]
An object of the present invention is to provide a method of assembling a magnetic head device that simplifies the assembling process and is effective in reducing assembling costs.
[0008]
Another object of the present invention is to provide a method of assembling a magnetic head device that can reduce the influence on the attitude angle of the magnetic head.
[0009]
[Means for Solving the Problems]
In order to solve the above-described problems, a method for assembling a magnetic head device according to the present invention applies a first adhesive to a head mounting portion of a head support. A flexible wiring board is placed on the applied first adhesive, and a magnetic head is placed on the flexible wiring board and pressed. Thereafter, the method includes a step of curing the first adhesive.
[0010]
As described above, in the magnetic head device assembly method according to the present invention, the first adhesive is applied to the head mounting portion of the head support, and the FPC and the magnetic head are pressed against the applied first adhesive. Since the first adhesive layer has plasticity or fluidity, the magnetic head is pressed against the first adhesive layer together with the FPC, and the first adhesive is deformed to a constant thin thickness. Can be made. For this reason, there is no room for the magnetic head to be adversely affected by the curing of the first adhesive.
[0011]
Thereafter, since the first adhesive is temporarily cured or permanently cured, the assembly process can be simplified and the assembly cost can be reduced.
[0012]
Other objects, configurations and effects of the present invention will be described in detail with reference to the accompanying drawings which are embodiments.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a perspective view showing an assembled state of a magnetic head device to which the assembling method according to the present invention is applied, and FIG. 2 is an enlarged partial sectional view of a head mounting portion of the magnetic head device shown in FIG. In the illustrated magnetic head device, an FPC 3 is bonded onto a head support 1, and a magnetic head 2 is bonded onto the head support 1 on the side where the FPC is bonded.
[0014]
The head support 1 includes a load beam 11 and a flexible body 12. The load beam 11 has a protrusion 111 (see FIG. 2) in the vicinity of the free end of the longitudinal axis passing through the center. The illustrated load beam 11 has bent portions 118 on both sides in the width direction, and the bent portions 118 increase rigidity. Further, the load beam 11 has a positioning hole 112 at the end opposite to the protrusion 111 (see FIG. 2). The load beam 11 can take various structures and shapes, and is not limited to the illustrated embodiment. For example, the load beam 11 may be provided with a hole for improving the followability of the magnetic head 2 with respect to a recording medium (not shown) or a hole for increasing the overall elasticity.
[0015]
The flexible body 12 is composed of a thin spring plate material, and one surface is attached to the surface of the load beam 11 on the side having the protrusion 111, and receives a pressing load from the protrusion 111. The flexible body 12 is bonded to the side of the load beam 11 having the projection 111 by means of caulking or the like. Instead of caulking, means such as spot welding may be used.
[0016]
Furthermore, the flexible body 12 has a tongue-like portion 120 serving as a head attachment portion. One end of the tongue-like portion 120 is coupled to the horizontal frame portion 121 of the flexible body 12. Both ends of the horizontal frame portion 121 of the flexible body 12 are connected to the outer frame portions 123 and 124. A groove 122 is formed between the outer frame portions 123 and 124 and the tongue-shaped portion 120. The FPC 3 and the magnetic head 2 are attached to one surface of the tongue-like portion 120 by a first adhesive 51. The other surface of the tongue-shaped portion 120 is in contact with the tip of the protrusion 111, so that the upper tongue portion 120 serving as a head mounting portion has two degrees of freedom around two orthogonal axes, that is, pitch and roll. Has two degrees of freedom.
[0017]
The magnetic head 2 is attached to one surface of the tongue 120. The surface of the magnetic head 2 opposite to the mounting side is an air bearing surface.
[0018]
The FPC 3 is known as, for example, a tab tape or the like, and has a necessary conductor wiring 32 embedded in an extremely thin insulating film 31. The FPC 3 is bonded to the magnetic head mounting surface side of the head support 1 with a first adhesive 51. The conductor wiring 32 is exposed to the outside at both ends in the longitudinal direction of the insulating film 31, constitutes an external connection terminal 33 on one end side, and serves as an extraction electrode of a magnetic transducer provided in the magnetic head 2 on the other end side. They are connected by means such as solder balls and bonding.
[0019]
The illustrated FPC 3 includes a frame portion 35 that overlaps the tongue-shaped portion 120 and a notch 34 that exposes a part of the tongue-shaped portion 120. The magnetic head 2 is disposed on the frame portion 35 and the cutout portion 34 and is bonded to the tongue-shaped portion 120 of the flexible body 12 by the first adhesive 51. The outer edge of the frame portion 35 of the FPC 3 is located inside the outer edge of the tongue-shaped portion 120, and the side surface of the magnetic head 2 is located outside the outer edge of the frame portion 35. The magnetic head 2 is bonded to the tongue 120 by a first adhesive 51 that protrudes outside the frame portion 35 of the FPC 3.
[0020]
Next, an assembly method of the magnetic head device shown in FIGS. 1 and 2 will be described with reference to FIGS. In the figure, the same reference numerals are given to the same components as those shown in FIGS.
[0021]
First, as shown in FIGS. 3 and 4, the first adhesive 51 is applied onto one surface of the tongue-like portion 120 of the head support 1 by using an application device 71 called a dispenser. The first adhesive 51 is an organic adhesive, and any type such as a thermosetting type or an ultraviolet curable type may be used. For example, the first adhesive 51 is scattered at 3 to 4 points.
[0022]
Next, as shown in FIGS. 5 and 6, the FPC 3 is placed on the first adhesive 51 applied on one surface of the tongue-like portion 120. The relationship between the lateral width W2 of the frame portion 35 of the FPC 3 and the lateral width W1 of the tongue-shaped portion 120 only needs to be such that the first adhesive 51 protrudes outside the frame portion 35 of the FPC 3, and the magnitude relationship is as follows. It doesn't matter. In the illustrated embodiment, the lateral width W2 of the frame portion 35 of the FPC 3 is narrower than the lateral width W1 of the tongue-shaped portion 120 (see FIG. 6). The first adhesive 51 is applied so as to protrude into the gaps G1 and G2 caused by the difference between the lateral widths W1 and W2.
[0023]
The head support 1 and the FPC 3 have a very elaborate pattern and shape. Therefore, when the FPC 3 is placed on the head support 1, it is necessary to align the FPC 3 with the head support 1 with high accuracy. As the means, alignment by image processing is effective. Moreover, according to the alignment by image processing, the work efficiency can be improved. In the image processing, holes 13 and 36 provided in advance in the head support 1 and the FPC 3 can be used.
[0024]
The head support 1 can be obtained by cutting a frame-shaped assembly in which a plurality of head support elements are arranged in an array in a frame in advance. Similarly to this, the FPC 3 can be obtained by cutting a frame-shaped assembly in which a plurality of FPC elements are arranged in an array in a frame.
[0025]
Next, as shown in FIGS. 7 and 8, the magnetic head 2 is placed on the tongue 120 of the head support 1 while the first adhesive 51 has plasticity and fluidity.
[0026]
Thereafter, a pressing force F1 is applied to the surface of the magnetic head 2 as shown in FIG. At this stage, since the first adhesive 51 has plasticity and fluidity, the first adhesive 51 is between the FPC 3 and the tongue 120 and between the magnetic head 2 and the tongue 120. 51 can be deformed to a constant thin thickness. For this reason, it is possible to avoid the adverse effects caused by the thickness variation of the first adhesive 51 and reduce the influence on the attitude angle of the magnetic head.
[0027]
Conventionally, after the adhesive for bonding the FPC 3 is temporarily cured, the adhesive for bonding the magnetic head 2 is applied and the magnetic head 2 is bonded. Therefore, the adhesive for bonding the FPC 3 bonds the magnetic head 2. At that time, it was already cured. For this reason, the magnetic head 2 suffers from the adverse effect of the cured adhesive and causes problems such as tilting.
[0028]
In the present invention, with the first adhesive 51 in a soft state having plasticity and fluidity, the magnetic head 2 is pressed together with the FPC 3 against the first adhesive 51, and the first adhesive 51 is made to have a certain thin thickness. To deform. For this reason, it is possible to avoid the adverse effects caused by the hardening of the first adhesive 51 and reduce the influence on the attitude angle of the magnetic head 2.
[0029]
In the embodiment, the lateral width W2 of the frame portion 35 of the FPC 3 is narrower than the lateral width W1 of the tongue-shaped portion 120, and the lateral width W3 of the magnetic head 2 is larger than the lateral width W2 of the frame portion 35 provided in the FPC 3. The first adhesive 51 protruding from the tongue 120 adheres to the lower surface and the side surface of the magnetic head 2. As a result, the magnetic head 2 is securely bonded to the tongue 120.
[0030]
Immediately after placing the FPC 3 on the head support 1, it is possible to apply a process in which a pressing force is applied to the FPC 3 and then the magnetic head 2 is placed on the FPC 3 and the pressing force is applied again.
[0031]
Thereafter, a temporary curing process is performed, and further a main curing process is performed. The curing process can be selected from ultraviolet irradiation, heating, or laser irradiation depending on the material of the first adhesive 51.
[0032]
The embodiment shown in FIGS. 3 to 9 further includes a step of applying the second adhesive 52 to the load beam 11 of the head support 1 at a position spaced from the tongue 120. . The second adhesive 52 is used to adhere the FPC 3 and can be applied by the application device 71 that applies the first adhesive 51. When the second adhesive 52 is different from the first adhesive 51, it is preferable that the second adhesive 52 is applied by a coating device different from the coating device 71 that applies the first adhesive 51. .
[0033]
Further, the FPC 3 is pressed against the second adhesive 52, the second adhesive 52 is temporarily cured, and then the first adhesive 51 is applied, and the FPC 3 and the magnetic head 2 are pressed against the first adhesive 51. Thereafter, the first adhesive 51 and the second adhesive 52 can be fully cured simultaneously. In this case, at the stage of positioning the FPC 3 on the tongue 120, the FPC 3 is already positioned on the head support 1 and is fixed to the head support 1 by temporary curing of the second adhesive 52. Positioning of the FPC 3 with respect to the tongue 120 is facilitated.
[0034]
As another process, the FPC 3 and the magnetic head 2 are pressed against the first adhesive 51 applied to the tongue 120, the first adhesive 51 is temporarily cured, and then the second adhesive 52 is applied. , The FPC 3 may be pressed, and then the first adhesive 51 and the second adhesive 52 may be fully cured.
[0035]
10 to 12 are views showing another example of the assembling method according to the present invention. First, as shown in FIG. 10, the first adhesive 51 and the conductive adhesive 53 are applied to the tongue-like portion 120 that becomes the head mounting portion of the head support 1. Of course, the second adhesive 52 may be applied together with the first adhesive 51 and the conductive adhesive 53.
[0036]
The conductive adhesive 53 is applied to the inside of the cutout portion 34 surrounded by the frame portion 35 of the tongue-like portion 120 by an application device 72 such as a dispenser. The conductive adhesive 53 is used for preventing electrostatic breakdown of the magnetic head 2, and for example, an Ag paste containing an organic vehicle is preferably used.
[0037]
Next, as shown in FIGS. 11 and 12, the FPC 3 and the magnetic head 2 are pressed against the first adhesive 51 and the conductive adhesive 53. At this stage, the first adhesive 51 and the conductive adhesive 53 are in a soft state and have plasticity or fluidity. Therefore, the magnetic head 2 and the FPC 3 are pressed to deform the first adhesive 51 to a certain thin thickness between the FPC 3 and the tongue 120, and between the magnetic head 2 and the tongue 120. The conductive adhesive 53 can be deformed to a certain thin thickness. For this reason, the adverse effect of the thickness of the first adhesive 51 and the conductive adhesive 53 can be avoided, and the influence on the attitude angle of the magnetic head can be reduced.
[0038]
In the case of the embodiment, since the conductive adhesive 53 spreads only inside the cutout portion 34 of the FPC 3 and does not come out of the cutout portion 34, the conductive adhesive 53 adheres to the take-out electrode of the magnetic head 2, for example. There is no adverse effect such as.
[0039]
The conductive adhesive 53 may be either an ultraviolet curable type or a thermosetting type. In the curing process of the conductive adhesive 53, any one of ultraviolet irradiation, heating and laser irradiation can be selected according to the material.
[0040]
It is obvious that the assembly process according to the present invention described above can simplify the bonding assembly process and reduce the assembly cost.
[0041]
【The invention's effect】
As described above, according to the present invention, the following effects can be obtained.
(A) It is possible to provide a method of assembling a magnetic head device that simplifies the assembling process and is effective in reducing the assembling cost.
(B) A method of assembling a magnetic head device that can reduce the influence on the attitude angle of the magnetic head can be provided.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an assembled state of a magnetic head device to which an assembling method according to the present invention is applied.
2 is an enlarged front partial sectional view taken along line 2-2 of FIG.
3 is a perspective view for explaining an assembly method of the magnetic head device shown in FIGS. 1 and 2. FIG.
4 is an enlarged front partial sectional view taken along line 4-4 of FIG.
5 is a perspective view showing a step after the step shown in FIGS. 3 and 4. FIG.
6 is an enlarged partial front sectional view of an assembled state obtained by the process shown in FIG. 5;
7 is a perspective view showing a step after the step shown in FIGS. 5 and 6. FIG.
8 is an enlarged front partial sectional view of the assembled state obtained by the process shown in FIG. 7;
FIG. 9 is an enlarged front partial sectional view showing a pressing operation applied to the assembled state shown in FIG. 8;
FIG. 10 is a view showing another embodiment of the assembling method according to the present invention.
11 is a perspective view showing an assembled state obtained through the process shown in FIG. 10;
12 is an enlarged side partial cross-sectional view of the magnetic head device shown in FIG.
[Explanation of symbols]
1 Head support 2 Magnetic head 3 FPC
51 First Adhesive 52 Second Adhesive

Claims (8)

A method of assembling a magnetic head device,
Applying a first adhesive to the head mounting portion of the head support;
A flexible wiring board is placed on the applied first adhesive, and an outer edge of the flexible wiring board is positioned on an inner side of an outer edge of the head mounting portion, and the flexible wiring board Place the first adhesive so that it protrudes from the outer edge ,
Further , by placing and pressing the magnetic head on the flexible wiring board in such a manner that the side surface of the magnetic head is positioned between the outer edge of the flexible wiring board and the outer edge of the head mounting portion , While the first adhesive is deformed to a thinner thickness between the lower surface of the magnetic head and the head mounting portion, the first adhesive is wrapped from the lower surface of the magnetic head to the side surface of the magnetic head,
Then, the first adhesive is cured,
Assembling method of magnetic head device.   2. A method for assembling a magnetic head device according to claim 1, further comprising a second for bonding the flexible wiring board to the head support at a position spaced from the head mounting portion. A method of assembling a magnetic head device, including the step of applying an adhesive.   3. A method of assembling a magnetic head device according to claim 2, wherein the first and second adhesives are applied by the same application means.   3. A method of assembling a magnetic head device according to claim 2, wherein the first and second adhesives are applied by different application means.   5. The method of assembling a magnetic head device according to claim 2, wherein after the second adhesive is cured and the flexible wiring board is bonded, the first adhesive is applied. A method of assembling a magnetic head device including a coating step.   6. The method of assembling a magnetic head device according to claim 1, wherein the curing process includes any one of ultraviolet irradiation, heating, and laser irradiation. A method of assembling a magnetic head device according to any one of claims 1 to 6,
The flexible wiring board has a frame portion that overlaps the head attachment portion, and a cutout portion that exposes a part of the head attachment portion.
Before pressing and contacting the flexible wiring board and the magnetic head to the first adhesive, a conductive adhesive is applied to the notch,
A method of assembling a magnetic head device, comprising the step of disposing the magnetic head on the frame part and the notch part.   8. The method of assembling a magnetic head device according to claim 1, further comprising a step of aligning the flexible wiring board on the head support by image processing. Assembly method.

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