JP4075138B2 - Non-contact IC card inspection device and inspection method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact type information medium, more specifically, a non-contact IC card used in the field of office automation (Office Automation, so-called OA), factory automation (Factory Automat-ion, so-called FA), or security. The present invention relates to a technique for preventing a product having a defective IC module from being mixed in a manufactured non-contact IC card and preventing troubles caused by defective inlets.
[0002]
[Prior art]
In recent years, with the advent of contactless IC cards with built-in semiconductor memory, etc., the storage capacity has increased dramatically compared to conventional magnetic cards, and it has become unnecessary to insert the card into the slot of the read / write device. Improved.
A non-contact IC card is a DC power source that provides a field of vibration energy such as a high-frequency electromagnetic field, ultrasonic waves, or light in a space, absorbs and rectifies the energy, and drives an electronic circuit built in the card. Use the frequency of the AC component of the field as it is, or multiply or divide it into an identification signal, and transmit this identification signal to the information processing circuit of the semiconductor element via a non-contact transmission element such as an antenna or coil or capacitor To do.
In addition, the antenna or coil as used in this specification was used in the following meaning, respectively. The former is an element that communicates by radio waves, and the shape and material can be arbitrarily designed according to standards and applications. The latter is an element that performs communication using a magnetic field, and is a conductor or conductor pattern wound in a so-called coil shape.
[0003]
In particular, many of the non-contact IC cards for the purpose of authentication and simple counting data processing are hard logic radio authentication (Radio Frequency IDentification, which does not include a battery and a CPU (Central Processing Unit). With the advent of this non-contact IC card, the safety against forgery and tampering is increased compared to a magnetic card, and the card holder is attached to the gate device when passing through the gate. All you have to do is bring the card closer to the reader / writer's communication function or touch the card's reader / writer's communication function, reducing the complexity of data communication by removing the card from the case and inserting it into the slot of the reader / writer. It was done.
[0004]
In addition, non-contact IC cards are internationally standardized by ISO (International Organization for Standar-disation). Generally, an IC card is a card body based on plastic or the like, and an IC module such as a semiconductor memory or the like. An antenna or coil that is a contact transmission element is incorporated. Then, an electromagnetic field or an alternating magnetic field radiated from the communication function unit of the read / write device is detected by an antenna or a coil inside the card and coupled to each other to exchange data with the read / write device.
[0005]
In general, the non-contact IC card described above is manufactured as follows.
A metal foil antenna or coil for non-contact transmission is formed on the card base sheet by etching, and a pattern portion for connecting to the IC module is provided at the end of the antenna or coil. And the connection part with the antenna or coil of IC module is connected with this pattern part using soldering, a conductive adhesive, etc., and becomes an inlet for non-contact IC cards. In some cases, an IC chip is directly connected to a connection portion with an antenna or a coil to form an inlet.
Thereafter, the card base sheet on which the IC module is mounted and the inlet is formed is sandwiched between the front and back sheets and laminated to produce the card body.
In order to increase the adhesive strength of the front and back sheets, a method of laminating while applying an adhesive to the front and back sheets is also conceivable. In addition, there is a method of manufacturing the card body by sealing the inlet card-formed card base sheet by injection (injection molding).
In addition to the antenna or coil made of metal foil, the noncontact transmission antenna or coil may be formed by a conductive wire with an insulating film.
Further, in order to manufacture a plurality of non-contact IC cards in the same process and increase the manufacturing efficiency, an antenna or a coil or insulation by etching metal foil on a card base sheet having a size capable of arranging and arranging a plurality of inlets. An antenna or a coil formed by a coated conductive wire is aligned, an IC module is mounted on each antenna or coil terminal, and a card base sheet constituting a plurality of inlets is formed. A method of manufacturing a card body that is cut and processed to have a predetermined size after being sandwiched between and laminated is also introduced in Japanese Laid-Open Patent Publication No. 62-127290.
[0006]
The non-contact IC card manufactured in this way uses a non-contact IC card read / write device to check the operation and function after completion, for example, communication as disclosed in Japanese Patent Laid-Open No. 9-102021. A final inspection of the non-contact IC card manufacturing process is performed by an inspection apparatus using the apparatus, and malfunctioning and malfunctioning cards are detected.
[0007]
[Problems to be solved by the invention]
However, in such an inspection apparatus, since the inspection is performed after the card is completed in the non-contact IC card manufacturing process, when there is a connection failure in the connection portion between the IC module and the antenna or the coil, or the defective IC module is mixed. Even if there is a card, the card is manufactured as usual, and it becomes clear that the card is defective only after the card is completed. Therefore, a member constituting the non-contact IC card, for example, a card base sheet forming an antenna or a coil, front and back sheets sandwiching the card base sheet, and the like are wasted, which affects the manufacturing cost.
Also, the sorting work after the card is completed increases, and there is a risk of mixing defective products due to sorting mistakes. Therefore, it is not so preferable in quality control.
Therefore, before making a card, that is, it is necessary to check the operation and function in the form of a card base sheet in which a plurality of inlets each having an integrated IC module and antenna or coil are arranged.
[0008]
The present invention has been made to solve the above-described problems. In the card manufacturing process, there is a connection failure between the connection portion between the IC module and the antenna or the coil, or there is a mixture of defective IC modules. Even when the card is in use, the card base sheet in which multiple inlets before the carding process are arranged and arranged can be checked for operation and function, preventing the production of defective cards and reducing the consumption of unnecessary card members. An object of the present invention is to provide an inspection apparatus and an inspection method that can suppress an increase in manufacturing cost, further reduce the risk of mixing a defective product after completion of a card, improve quality, and satisfy these requirements.
[0009]
[Means for Solving the Problems]
The means provided by the present invention to solve the above-mentioned problem is that, as shown in claim 1, an IC module including a semiconductor IC chip and an antenna or a coil as a non-contact transmission element are integrated. A non-contact IC card inlet comprising a plurality of non-contact IC card inlets arranged on the base sheet, and a non-contact reading / writing communication operation for each non-contact IC card inlet. A detection head portion having a small antenna or a small coil having a communication area that is not affected by an inlet other than the one that is in communication operation, and a non-contact IC provided on the base sheet A detection head part moving device for moving the detection head part at any non-contact IC card inlet to be inspected from among the card inlets A test communication means is communicatively connected to the detection head unit, reads and writes through the test communication means, the inspection determines whether the IC module and the like from the result is defective or a normal product A non-contact IC card inspection device comprising: a read / write determination processing means.
According to the present invention, in the manufacturing process of a non-contact IC card, a plurality of inlets before the card forming process are aligned even if a connection failure of the connection portion between the IC module and the antenna or the coil occurs or a defective IC module is mixed. Since the operation / function confirmation is performed in the placed card base sheet state, it is possible to prevent defective card manufacture and suppress wasteful card member consumption.
[0010]
In addition, according to the present invention, since the operation and function can be surely confirmed for each inlet section one by one, the reliability of the inspection is improved.
[0011]
[0012]
Then, as shown in claim 2 , the apparatus of claim 1 is a basic configuration, and in particular, the semiconductor IC chip has a function capable of supporting both a non-contact IC card and a contact IC card. It is a semiconductor IC chip.
Even if the semiconductor IC chip has a function capable of supporting both a non-contact IC card and a contact IC card, the present invention can be suitably used.
[0013]
According to a third aspect of the present invention, there are provided a plurality of non-contact IC card inlets on a substrate sheet, wherein an IC module including a semiconductor IC chip and an antenna or coil as a non-contact transmission element are integrated. The degree to which the card base sheet that is arranged individually is not subject to interference by other inlets other than the inlet during communication operation before entering the card forming process of covering the front and back surfaces of the card base sheet with the sheet. IC module that performs a communication operation for each non-contact IC card inlet in the state of a card base sheet by sequentially moving a detection head having a small antenna or a small coil having a communication area between the inlets. It is an inspection method for a non-contact IC card, wherein the inspection is performed by confirming the operation.
According to the present invention, in the manufacturing process of a non-contact IC card, a plurality of inlets before the card forming process are aligned even if a connection failure of the connection portion between the IC module and the antenna or the coil occurs or a defective IC module is mixed. Since the operation / function confirmation is performed in the placed card base sheet state, it is possible to prevent defective card manufacture and suppress wasteful card member consumption.
[0014]
[0015]
[0016]
Then, as shown in claim 4 , the inspection method of claim 3 is a basic configuration, and in particular, the semiconductor IC chip has a function capable of supporting both a non-contact IC card and a contact IC card. It is a semiconductor IC chip.
Even if the semiconductor IC chip has a function capable of supporting both a non-contact IC card and a contact IC card, the present invention can be suitably used.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below. FIG. 4 shows a card base sheet 4 in which a plurality of inlets 3 formed by integrating the non-contact IC module 1 and the non-contact transmission element 2 are arranged in order to increase the manufacturing efficiency of the non-contact IC card. 5 is a view showing an outline of a non-contact IC card that is sandwiched between the back sheet 6 and laminated.
The non-contact transmission element 2 is formed by etching a metal foil antenna or coil for non-contact transmission on the card base sheet 4 and a pattern for connecting to the IC module 1 at the end of the antenna or coil. Parts are provided. And the connection part with the antenna or coil of IC module is connected with this pattern part using soldering, a conductive adhesive, etc., and becomes an inlet for non-contact IC cards.
In some cases, an IC chip is directly connected to a connection portion with an antenna or a coil to form an inlet 3.
[0018]
In addition to the antenna or coil made of metal foil, the non-contact transmission element 2 can be considered to form an antenna or coil by a conducting wire with an insulating film. Further, in order to increase the adhesive strength between the front and back sheets 5 and 6, there is a method of laminating while applying an adhesive to the front and back sheets 5 and 6.
Then, after laminating, cutting is performed by die cutting or the like so that a predetermined card size is obtained, and a non-contact IC card is finally obtained.
Not only the laminating method but also a method of producing a card body by sealing the card base sheet 4 constituting the inlet 3 by an injection molding method and performing a cutting process such as die cutting.
[0019]
Thereafter, in order to confirm the operation / function of the completed non-contact IC card 9, the non-contact IC card is used by using the controller 13 such as the read / write device 8, the communication function unit 10 for the read / write device, and a personal computer as shown in FIG. It was a common method to inspect 9 sheets one by one.
[0020]
In the present invention, as shown in the schematic configuration diagram of the non-contact IC card inspection apparatus in FIG. 1, in the stage before the laminating process, the connection failure between the IC module and the antenna or coil, the disconnection or short circuit of the antenna or coil, the IC module It is characterized by inspections and inspection means aimed at finding defects and the like.
In FIG. 1, 1 is an IC module, 2 is a non-contact communication means, 3 is an inlet in which an IC module and an antenna or a coil are integrated, 4 is a card base sheet in which a plurality of inlets are arranged, 7 is another A detection head unit equipped with a small antenna or small coil having a communication area that is not subject to interference by the inlet, 8 is a read / write device, and 13 is a controller such as a personal computer.
[0021]
Since the inspection communication means used in the detection head unit 7 uses a relatively small antenna or coil as compared with the conventional communication function unit 10 for the read / write device, the communication area can be narrowed. For this reason, when it is arranged near the center of the communication target inlet, it communicates only with the target inlet, and interference with other adjacent inlets does not occur.
If the conventional communication function unit 10 for the read / write device is used, the communication area is relatively wide, so that the adjacent inlets react in addition to the communication target inlet, causing interference and making communication impossible. .
In addition, even in a read / write device that can communicate with several non-contact IC cards in the same communication area, communication processing is performed for each sheet in the order of arrival, so even in this case, the target inlet and the peripheral inlet are sequentially processed. Therefore, the position of the target inlet cannot be specified.
[0022]
Therefore, in order to avoid this phenomenon, it is necessary to widen the interval between the inlets without affecting each other. However, this is an increase in the size of the card base sheet 4, resulting in poor productivity and an increase in cost.
In the present invention, since the detection head unit 7 is equipped with a small antenna or a small coil having a communication area that is not subject to the interference of the adjacent inlet, the inlet interval on the card base sheet can be made relatively narrow. Is very economical.
[0023]
Then, communication processing is performed with the communication target inlet, operation / function inspection is performed, and if the result is obtained, the detection head unit moves to the center of the adjacent inlet and starts communication processing again. Inspection is performed. In this way, the inspection head unit 7 sequentially moves between the inlets, and the operation / function confirmation is performed in the card base sheet form before entering the card forming process for covering the front and back sheets. , Antenna or coil failure, connection failure between the module and antenna or coil, etc. can be found.
[0024]
【Example】
FIG. 2 is a schematic configuration diagram showing an embodiment of a non-contact IC card inspection apparatus according to the present invention. In FIG. 2, 1 is an IC module, 2 is a non-contact transmission element, 3 is an inlet in which an IC module and an antenna or a coil are integrated, 4 is a card base sheet in which a plurality of inlets are arranged, 7 is another A detection head unit equipped with a small antenna or a small coil having a communication area that is not subject to interference by the inlet, 8 is a read / write device, 11 is holding the detection head unit 7, and the detection head unit 7 is attached to the card base sheet 4. Detection head transport device that can move to any position on the surface, 12 is a transport device control unit that controls the position of the detection head transport device, 13 is a personal computer or the like for controlling the read / write device 8 and the transport device control unit 12 Consists of a controller.
In FIG. 2, the detection head 7 is configured to move on the upper side of the card base sheet 4, but may be arranged to move on the lower side.
[0025]
A detection head unit 7 equipped with a small antenna or a small coil having a communication area that does not receive interference from an inlet adjacent to a communication target inlet is attached to a detection head transport device 11 and controlled by a controller 13 according to instructions from the controller 13. Via the part 12, it can move to the inlet center part arbitrarily on the card base sheet 4.
First, the detection head unit 7 moves on the communication target inlet according to an instruction from the controller 13, and then an instruction for confirming the operation / function of the inlet is sent from the controller 13 to the read / write device 8. The read / write device 8 sends a read signal or a write signal to the detection head unit 7 in accordance with the command. The signal is electromagnetically or magnetically coupled to the antenna or coil of the communication target inlet via the detection head unit 7, and information in the communication target inlet is communicated to the read / write device 8 or write information of the read / write device 8 is communicated. Communication processing is performed to the target inlet.
[0026]
If this communication process is performed in a predetermined manner, it is determined that the inlet is normal, and if the communication process is not possible or the communication process scheduled at this place is not performed, the abnormal inlet and the read / write device 8 determine. Then, these pieces of information and information inside the inlet are sent to the controller 13, and on the controller 13 side, the inspection result information is shown on the display unit based on this information, and the controller 13 operates to control an external device (not shown). .
In this way, when the operation and function of an arbitrary communication target inlet is confirmed and inspected, the controller 13 sends an instruction to move to the next inlet to the transport device control unit 12, and the detection head unit 7 The same communication process is performed again, and the operation / function of the inlet is confirmed and inspected. In this way, it is possible to confirm the operation and function in the card base sheet state in which a plurality of inlets before the carding process are arranged and arranged by sequentially moving and inspecting the detection head unit 7 between the inlets by mechanical control. Become.
Further, in the inspection apparatus according to the present invention, any card base sheet having a size within a range in which the detection head unit 7 can be moved does not depend on the arrangement configuration of the inlets. Even card base sheets with an array configuration can be handled without drastically changing the apparatus.
[0027]
Next, a schematic configuration of a reference example will be described with reference to FIG. In FIG. 3, 1 is an IC module, 2 is a non-contact transmission element, 3 is an inlet in which an IC module and an antenna or a coil are integrated, 4 is a card base sheet in which a plurality of inlets are arranged, 7 is A detection head unit equipped with a small antenna or a small coil having a communication area that is not subject to interference by other inlets, 8 is a read / write device, and 14 is a detection head switching device that electrically selects and switches a plurality of detection head units 7. , 13 includes a controller such as a personal computer for controlling the read / write device 8 and the detection head switching device 14.
The plurality of detection head portions 7 are respectively installed at positions corresponding to the central portion of each inlet. In FIG. 3, the plurality of detection head portions 7 are arranged on the upper side of the card base sheet 4, but may be arranged on the lower side.
[0028]
One of the plurality of detection head units 7 is connected to the read / write device 8 by the detection head switching device 14 according to an instruction from the controller 13, and communication is performed between the inlet 3 corresponding to the detection head unit 7 and the read / write device 8. Is done.
First, the detection head switching unit 14 is selected by the instruction of the controller 13 to select the detection head unit 7 located in the communication target inlet and connected to the read / write device 8. Next, an instruction for confirming the operation / function of the inlet is sent from the controller 13 to the read / write device 8. The read / write device 8 sends a read signal or a write signal to the detection head unit 7 that is selectively connected in accordance with the command. The signal is electromagnetically or magnetically coupled to the antenna or coil of the communication target inlet via the detection head unit 7, and information in the communication target inlet is communicated to the read / write device 8 or write information of the read / write device 8 is communicated. Communication processing is performed to the target inlet.
[0029]
Similar to the embodiment in FIG. 2, if this communication process is performed in a predetermined manner, it is determined that the inlet is normal, and if the communication is impossible or the originally scheduled communication process is not performed, the abnormal inlet and the read / write device 8 to decide. Then, these pieces of information and information inside the inlet are sent to the controller 13, and on the controller 13 side, the inspection result information is shown on the display unit based on this information, and the controller 13 operates to control an external device (not shown). .
[0030]
When the operation and function of an arbitrary communication target inlet is confirmed and inspected in this way, the controller 13 sends an instruction to change the connection to the next inlet to the detection head switching device 14, and the corresponding detection head. The unit 7 is connected to the read / write device 8. Then, the same communication process is performed again, and the operation / function of the inlet is confirmed and inspected. In this way, the plurality of detection heads 7 are selectively switched between the inlets sequentially by the function of the detection head switching device 14, and are inspected, whereby a card base in which a plurality of inlets before the carding process are arranged in an array is arranged. It is possible to check the operation and function in the material sheet state. And since each inlet is electrically switched reliably one by one to check the operation / function, the reliability and speed of inspection are improved.
[0031]
Further, in the inspection apparatus according to the reference example , as long as the detection head portions 7 are prepared for the number of inlets on the card base sheet, the positions corresponding to the central portions of the respective inlets without depending on the arrangement arrangement of the inlets. By changing the installation of the detection head unit 7 and simply changing the switching control program, it is possible to cope with any card array sheet having any inlet arrangement without drastically changing the apparatus.
2 and 3 may be combined as a reference example, and a small area, for example, only one row may be used as an electrical switching means, and a movement between rows may be a mechanical moving means.
[0032]
【The invention's effect】
As described above, according to the present invention described in detail, IC module failure, antenna or coil failure, connection failure between the IC module and antenna or coil, etc. can be found before making a card, thus preventing defective card production, Useless card member consumption can be suppressed. In addition, it is not necessary to sort out defective cards after the cards are completed, and the risk of mixing defective products due to operational mistakes is reduced, thereby preventing troubles.
[0033]
In addition, for communication with each inlet, by adopting a detection head unit equipped with a small antenna or a small coil having a communication area that is not subject to interference by the inlet adjacent to the communication target inlet, for a conventional read / write device There is no fear of communication failure or interference as in the case of using the communication function unit. Moreover, in this invention, in order to avoid the trouble at the time of using the communication function part for the conventional reader / writer, it is not necessary to enlarge a card base material sheet, and it is also very economical. And by moving this detection head part mechanically between the inlet center part and inspecting it, each inlet is surely checked for operation and function one by one. The reliability of inspection is improved.
[0034]
[0035]
In other words, according to the present invention, even when there is a connection failure between the connection part of the IC module and the antenna or coil in the card manufacturing process, or even when there is a mixture of defective IC modules, a plurality of inlets before the card forming process are arranged and arranged It is possible to check the operation / function in the card base sheet state that has been made, prevent the production of defective cards, reduce the consumption of useless card members, and suppress the production cost increase, The risk of mixing defective products after completion of the card was reduced, the quality could be improved, and an inspection apparatus and inspection method that could satisfy these requirements could be provided.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a non-contact IC card inspection apparatus according to the present invention.
FIG. 2 is a schematic configuration diagram showing an embodiment of a non-contact IC card inspection apparatus according to the present invention.
FIG. 3 is a schematic configuration diagram illustrating an example of a non-contact IC card inspection apparatus according to a reference example .
FIG. 4 is a diagram showing a schematic configuration of a non-contact IC card.
FIG. 5 is a diagram showing a schematic configuration of a conventional non-contact IC card inspection apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... IC module 2 ... Non-contact transmission element 3 ... Inlet 4 ... Card base sheet 5 ... Top sheet 6 ... Back sheet 7 ... Detection head unit 8... Read / write device 9... Non-contact IC card 10... Read / write device communication function unit 11. 14: Detection head switching device

Claims (4)

A card base sheet in which an IC module having a semiconductor IC chip and an antenna or coil as a non-contact transmission element are integrated, and a plurality of inlets for a non-contact IC card are arranged on the base sheet. On the other hand, each of the non-contact IC card inlets is a test communication means for performing a non-contact read / write communication operation, and has a communication area that does not receive interference from other inlets other than the communication operation. The detection head is moved to a detection head section equipped with a small antenna or a small coil and any non-contact IC card inlet to be inspected among non-contact IC card inlets provided on the base sheet. a test communication means and a detection head section moving device for, is communicatively connected to the detection head portion, through the communication means for testing Reads and writes, the results from the inspection apparatus for non-contact IC card, characterized by comprising a test writing determination processing means for determining whether said IC module and the like is defective or normal products. 2. The non-contact IC card inspection device according to claim 1 , wherein the semiconductor IC chip is a semiconductor IC chip having a function capable of supporting both a non-contact IC card and a contact IC card. . A card base sheet in which an IC module having a semiconductor IC chip and an antenna or coil as a non-contact transmission element are integrated, and a plurality of inlets for a non-contact IC card are arranged on the base sheet. On the other hand, before entering the card forming process of covering the front and back surfaces of the card base sheet with the sheet, a small antenna or small coil having a communication area that is not subject to interference by other inlets other than the inlet during communication operation The communication head for each non-contact IC card inlet in the state of the card base sheet, and the operation check of the IC module and the like are inspected. An inspection method for a non-contact IC card. 4. The inspection method for a non-contact IC card according to claim 3 , wherein the semiconductor IC chip is a semiconductor IC chip having a function compatible with both a non-contact IC card and a contact IC card. .

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