[go: up one dir, main page]

JP4073041B2 - ミクロ範囲の接着用熱硬化性一成分ｌｖａ（低粘度接着型）接着剤系 - Google Patents

ミクロ範囲の接着用熱硬化性一成分ｌｖａ（低粘度接着型）接着剤系 Download PDF

Info

Publication number
JP4073041B2
JP4073041B2 JP50645298A JP50645298A JP4073041B2 JP 4073041 B2 JP4073041 B2 JP 4073041B2 JP 50645298 A JP50645298 A JP 50645298A JP 50645298 A JP50645298 A JP 50645298A JP 4073041 B2 JP4073041 B2 JP 4073041B2
Authority
JP
Japan
Prior art keywords
adhesive
adhesive system
component
bonding
thermosetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP50645298A
Other languages
English (en)
Other versions
JP2000514859A (ja
Inventor
ヘーン、クラウス
バイヤー、ハイナー
ホンスベルク―リードル、マルチン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JP2000514859A publication Critical patent/JP2000514859A/ja
Application granted granted Critical
Publication of JP4073041B2 publication Critical patent/JP4073041B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Description

本発明はμｍ及びサブμｍ範囲の寸法公差で接着を形成するのに適している熱硬化性一成分接着剤系に関する。
ミクロ接着に対して一般に樹脂及び硬化成分から成る接着剤系が公知である。これらの二成分接着剤系ではμｍ範囲の接着に必要とされる僅少量に問題がある。特に塗布直前の個々の成分の精確な配量、混合及び均質化に際して問題がある。またそれら接着剤系は一般に粘度が高過ぎ、従ってミクロ配量用の接着剤、いわゆるＬＶＡ（低粘度接着型）接着剤を塗布できるような稀溶液性には比較的高温（約７０℃）で初めてなることは欠点である。更に公知の二成分系は薄層又は小滴で不均質性であるため不活性ガス又は窒素雰囲気でも不完全にしか硬化しないという欠点を有する。これら全ての要因により産業上の製造に要求される再現可能な品質で、μｍ及びサブμｍ範囲（＝１μｍ以下）の結合強度及び寸法公差に関して工業的に使用できる接合を実現することは従来不可能であった。
従ってエレクトロニクス及びオプトエレクトロニクス分野の低コスト・システムの合理的で自動化されかつ安全で経済的に有利な接合技術を可能にする接着剤系が必要となる。特にμｍ範囲及びサブμｍ範囲の接着に極めて薄い層又は小滴の形で確実に配量し、硬化することができる接着剤系が必要となる。その際上記の寸法は硬化後も維持されなければならない。
従って本発明の課題は僅少量でも不均質性を示さず、μｍ範囲の配量に適した接着剤系を提供することにある。更に本発明の課題は薄層の形で完全に硬化する接着剤系を提供することにある。それにより接着剤による接合の信頼度及び強度が高められ、接着剤による接合後の不所望のガスの発生を低減できるようにする。更に本発明による接着剤系は公知の系に比べて低粘度でかつ良好な展延特性を示すものでなければならない。最後に本発明の接着剤系の耐久性はμｍ及びそれ以下の範囲の寸法公差で個々の部材を継ぎ合わすことを可能にすべきである。
この課題は本発明による接着剤系により解決される。本発明の対象は以下の組成
Figure 0004073041
を含む熱硬化性の一成分系接着剤系である。
更にこのような接着剤系をμｍ及びサブμｍ範囲の寸法公差での接着に使用することが本発明の対象である。他の有利な実施態様は明細書の記載並びに実施例及び従属請求項から明らかとする。
本発明において使用する“エポキシ注型用樹脂”は、注型により適当な形に仕上げることのできるような低粘度の熱硬化性樹脂系及び反応樹脂を意味し、それらは熱的に、即ち適切な付加物（開始剤、促進剤、他の成分）の存在下に熱上昇により硬化可能である。このエポキシ注型用樹脂は本発明の配合物中に６０〜９８重量％の量で、有利には７５〜９５重量％、主として８０〜９５重量％及び特に有利には８５〜９３重量％の範囲で含まれている。
“エポキシ樹脂”としては、チバ・ガイギー（Ｃｉｂａ Ｇｅｉｇｙ）社製の樹脂ＣＹ１７７（３，４−エポキシシクロヘキシルメチル−アジピン酸塩）を使用する。
“アルコール又は糖類”としては本発明では１〜１５個のヒドロキシル基を有するアルコール又は糖類が使用される。有利には１〜５個のヒドロキシル基を有するアルコールが使用される。その際アルコール又は糖類の基本骨格は任意に変えることができ、脂肪族、環状又は二環状であっても、単結合のみ又は多重結合から成っていても、また芳香族系であってもよい。とりわけヘキスト（Ｈｏｅｃｈｓｔ）社のＴＣＤアルコールＤＭ、即ち３（４），８（９）−ビス（ヒドロキシメチル）トリシクロ［５．２．１．０2.6］デカンを使用すると有利である。この有利には多価のアルコールは接着剤配合物中に２〜３０重量％の分量で含まれている。有利にはこのアルコールは２．５〜２０重量％の分量、特に有利には４．５〜１２重量％の分量で含まれている。
熱開始剤としては従来の全ての陽イオンメカニズムで硬化する例えばオニウム塩のような開始剤を使用することができる。この場合アルドリッヒ（Ａｌｄｒｉｃｈ）社のＳ−ベンジルチオラニウムヘキサフルオロアンチモネートが優先的に使用された。
接着促進剤としてはヒュルス（Ｈｕｅｌｓ）社のＡ１８７、即ち３−グリシジルオキシプロピルトリメトキシシランが使用される。
展延補助剤としてはモンサント（Ｍｏｎｓａｎｔｏ）社のモダフロウ（Ｍｏｄａｆｌｏｗ、商品名）を、また流れ調整剤又はチキソトロピー剤としては例えば市販されているデグッサ（Ｄｅｇｕｓｓａ）社のアエロシル（Ａｅｒｏｓｉｌ、商品名）タイプを使用することができる。
既に記載した成分の他に本発明による接着剤系には更にそれ自体公知の添加物及び付加物を含むこともできる。それによりこの接着剤系は特に色又は透明度のような、また難燃性又は耐熱性などの付加特性を有することもできる。従ってこの意味での添加物は例えば色素、顔料、流れ調整剤、一般に安定剤、耐炎剤又は鉱物性又は他の充填剤であってもよい。その際添加物により一定の特性、例えば色素を介しての選択的吸収度又は透明度を達成することは常にほぼ可能である。
この接着剤系の製造は比較可能系と同じようにして行われる。エポキシ樹脂、多価アルコール、熱開始剤、接着促進剤及び場合によっては展延補助剤のような配合成分は場合によっては高めた温度下でもまた再除去可能の溶剤でも一様に相互に混合される。従ってこの接着剤系の製造には従来技術で行われている通常の方法に基づくことができる。
以下に本発明を実施例に基づき詳述する。表１は代表的な接着剤系の配合成分を示すものである。
Figure 0004073041
表２には例として上記の配合物の選択された材料特性がまとめられている。
Figure 0004073041
表３は配合物の貯蔵可能性の試験データを示している。観察期間は２ヶ月とし、その際冷蔵庫で貯蔵（５−８℃）した際例えば熱開始剤が晶質するようないかなる非融和もしくは分解を生じなかった。
Figure 0004073041
本発明による接着剤系でμｍ及びサブμｍ範囲のエレクトロニクス及びオプトエレクトロニクス・コンポーネントの自動化された確実なミクロ接着が可能となる。本発明による一成分エポキシ注型用樹脂は直ちに硬化せず、従って個々の部材の継合わせは最終的に固着されるまで可能である。エポキシ樹脂成分並びに全ての接着剤系はミクロ接着の際に使用されるのに十分な低粘度である。最終的にアルコール又は糖類、特に多価アルコールで接着剤系の滴下特性、湿潤特性及び流れ特性並びに接着剤接合の機械的特性を調整することができる。
この接着剤系は問題なくミクロ量で配量することができ、滴下、湿潤及び展延挙動に関して更に展延補助剤の添加により最適化することができる。熱負荷により、即ち局部的加熱又は接着すべき部分の加熱によりこの接着剤系は迅速に均質な接着結合物に網状化する。
冒頭に記載したミクロ接着技術に関する公知の二成分系の接着配合物の欠点はこうして克服される。特に配量可能性及び配量精度が改善され、また不完全な混合及び混合誤差は回避され、粘度は低下する。
本発明は少なくとも注型用樹脂、特にエポキシ注型用樹脂及び多価アルコールから成る一成分接着剤系に関する。この低粘度の接着剤系はミクロ配量可能であり、貯蔵安定、完全硬化性であり、寸法公差がμｍ及びサブμｍ範囲の用途に適している。

Claims (3)

  1. 以下の成分
    Figure 0004073041
    を含む熱硬化性一成分系接着剤系。
  2. 以下の成分
    Figure 0004073041
    を含む熱硬化性一成分系接着剤系。
  3. 寸法公差がμｍ及びサブμｍ範囲の接着を行うために使用される請求項１又は２記載の接着剤系。
JP50645298A 1996-07-18 1997-07-17 ミクロ範囲の接着用熱硬化性一成分ｌｖａ（低粘度接着型）接着剤系 Expired - Fee Related JP4073041B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19629082A DE19629082A1 (de) 1996-07-18 1996-07-18 Thermisch härtbares einkomponentiges Low viskosity Adhesive-Klebstoffsystem für Verklebungen im Mikrobereich
DE19629082.1 1996-07-18
PCT/DE1997/001505 WO1998003606A1 (de) 1996-07-18 1997-07-17 Thermish härtbares einkomponentiges lva(=low viskosity adhesive)-klebstoffsystem für verklebungen im mikrobereich

Publications (2)

Publication Number Publication Date
JP2000514859A JP2000514859A (ja) 2000-11-07
JP4073041B2 true JP4073041B2 (ja) 2008-04-09

Family

ID=7800230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50645298A Expired - Fee Related JP4073041B2 (ja) 1996-07-18 1997-07-17 ミクロ範囲の接着用熱硬化性一成分ｌｖａ（低粘度接着型）接着剤系

Country Status (8)

Country Link
US (1) US6207732B1 (ja)
EP (1) EP0912649B1 (ja)
JP (1) JP4073041B2 (ja)
CN (1) CN1121468C (ja)
DE (2) DE19629082A1 (ja)
NO (1) NO990222L (ja)
TW (1) TW509716B (ja)
WO (1) WO1998003606A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19804595A1 (de) * 1998-02-05 1999-08-12 Siemens Ag Thermisch härtbare Ein-Komponenten-Underfill-Masse
US20030138434A1 (en) * 2001-08-13 2003-07-24 Campbell Robert L. Agents for enhancing the immune response
DE102005040126A1 (de) * 2005-08-25 2007-03-01 Altana Electrical Insulation Gmbh Überzugsmasse
DE102005056393A1 (de) * 2005-11-24 2007-05-31 Grünenthal GmbH Multicyclische Verbindungen in druckempfindlichen Klebstoffen
TWI666280B (zh) * 2012-08-03 2019-07-21 南韓商Ｌｇ化學股份有限公司 黏合膜與使用彼之有機電子裝置的包封產物
CN102898785B (zh) * 2012-09-05 2014-10-22 烟台德邦科技有限公司 一种用于智能卡的包封胶及其制备方法
US20160251762A1 (en) * 2013-08-29 2016-09-01 Cmi Uvk Gmbh Method of treating a pickling solution for a pickling process

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55118429A (en) * 1979-03-05 1980-09-11 Mitsubishi Petrochem Co Ltd Preparation of tricyclodecanedimethylol
US4480059A (en) * 1982-08-26 1984-10-30 General Electric Company Epoxy adhesives for poly(butylene terephthalate)
AU595593B2 (en) * 1986-05-07 1990-04-05 Minnesota Mining And Manufacturing Company Epoxy resin composition
JP2719616B2 (ja) * 1989-11-30 1998-02-25 日本電信電話株式会社 光硬化型精密接着剤
DE59208790D1 (de) * 1991-06-19 1997-09-18 Ciba Geigy Ag Neue Harzsysteme mit niedrigeren Formtemperaturen
US5494943A (en) * 1993-06-16 1996-02-27 Minnesota Mining And Manufacturing Company Stabilized cationically-curable compositions

Also Published As

Publication number Publication date
WO1998003606A1 (de) 1998-01-29
CN1230974A (zh) 1999-10-06
DE19629082A1 (de) 1998-01-22
EP0912649B1 (de) 2003-12-17
NO990222D0 (no) 1999-01-18
NO990222L (no) 1999-03-15
EP0912649A1 (de) 1999-05-06
DE59711142D1 (de) 2004-01-29
TW509716B (en) 2002-11-11
JP2000514859A (ja) 2000-11-07
US6207732B1 (en) 2001-03-27
CN1121468C (zh) 2003-09-17

Similar Documents

Publication Publication Date Title
Shields Adhesives handbook
JP4073041B2 (ja) ミクロ範囲の接着用熱硬化性一成分ｌｖａ（低粘度接着型）接着剤系
GB2166447A (en) Adhesive compositions
EP3512915B1 (de) Lichtfixierbare vergussmasse und verfahren zum selektiven verguss von substraten/bauteilen unter verwendung der massen
KR20180075549A (ko) 급속 경화형이고 요변성이 높은 에폭시 접착제 조성물
BRPI1104634A2 (pt) composiÇço de resina epàxi de cura com calor, elemento de reforÇo, processo para ligaÇço de substratos estÁveis ao calor, uso da referida composiÇço e espuma estrutural
CN102884099A (zh) 可固化组合物
CN102408861A (zh) 一种双组分环氧结构胶及其制备方法
US6200408B1 (en) Method for cementing a component to a surface
EP0705316B1 (en) Epoxy adhesive composition
JP2025024241A (ja) エポキシ樹脂組成物の製造方法、そのエポキシ樹脂組成物を用いた液体吐出ヘッド、及びその液体吐出ヘッドの製造方法
EP0137716B1 (en) Optical adhesive composition
JP2013091774A (ja) エポキシ樹脂組成物
HU207115B (en) Melt adhesive and process for sticking objects
US20190300760A1 (en) Structure adhesive composition which changes color when heat-cured
JP2719616B2 (ja) 光硬化型精密接着剤
DE19538468B4 (de) Verfahren zur flächigen Verklebung von Werkstücken, geklebter Verbund und Verwendung davon
JP7596118B2 (ja) エポキシ樹脂組成物の製造方法、そのエポキシ樹脂組成物を用いた液体吐出ヘッド、及びその液体吐出ヘッドの製造方法
JPH0381384A (ja) 一液性油面接着剤
JP2017082144A (ja) 熱硬化性多層接着シート、および接着方法
JP2020122086A (ja) エポキシ樹脂組成物
JP3905493B2 (ja) 部材接合構造体の製造方法
JP3389667B2 (ja) 液状エポキシ樹脂組成物及びその製法
JPS5853925A (ja) 芳香族ポリアミド繊維プリプレグ
JP2000154359A (ja) 注入剤

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040716

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070807

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070730

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071106

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20071225

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080122

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110201

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees