JP4060973B2 - LCD controller IC - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an LCD controller IC in which the pitch between pad terminals is a narrow pitch.
[0002]
[Prior art]
FIG. 1 shows a conventional pad terminal. Since the pitch between the pad terminals 9 was as wide as about 100 μm, it was possible to test all the pad terminals when testing the IC chip.
[0003]
[Problems to be solved by the invention]
The total number of pad terminals has increased remarkably with the increase in the size of liquid crystal screens and the improvement in mounting technology. As a result, the size of the IC chip is determined by the pad terminals arranged on the IC chip, and the factor that determines the cost of the IC chip is the interval between the pad terminals. Narrow pitch probe cards are required to measure all the pad terminals of an IC chip with a narrow pitch and a small pitch between pad terminals with a tester, but the needle spacing should be about 80 um. This is a limit and cannot be used for pitches of 50um or less, which will be performed in the future. Further, if the probe is applied by thinning out the pad terminals having a narrow pitch, the adjacent pad terminals may be contacted, which may cause a short circuit between the terminals. Further, since the area of the opening of the pad terminal becomes smaller as the pitch becomes narrower, the margin for the alignment accuracy of the probe is also reduced.
[0004]
[Means for Solving the Problems]
A test pad terminal having a large area with a pad terminal pitch that can be sufficiently accommodated by a probe card is provided in a scribe region that is a portion that is separated between IC chips and is actually used. I connected them at a rate of 1 and thinned them out.
[0005]
As a result, although all pad terminals cannot be measured in the wafer state, screening of IC chips can be performed with high probability in the wafer state.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Example 1
FIG. 2 shows a plan view of the present invention. Narrow pitch pad terminals 3 of 50 μm are provided on the four sides of the IC chip 5. The scribe region 2 is provided with a test terminal 4 having a large area at a pitch of 100 μm, and is connected to the two of the narrow pitch pad terminals 3 by a metal wiring 6. The metal wiring 6 is also connected to the narrow pitch pad terminal of the adjacent IC chip and shares the terminal. At this time, the test pad terminal must have an area that can be accurately touched by the probe needle in the test process. In this way, the probe card may be manufactured in accordance with the test pad terminal 4 having a large pad terminal pitch and a large area during measurement by the tester. After the measurement of the test terminal 4, the test terminal 4 is cut along the center line where the IC chip is cut. By this cutting, adjacent IC chips sharing the test terminal 4 are electrically separated. Since the measurement according to the present invention is a thinning-out measurement, it is preferable to confirm whether all the terminals operate normally in actual use. In this embodiment, one test pad is connected to two of the narrow-pitch pads, but the pass / fail probability of the IC chip can be calculated and estimated based on the thinning rate.
[0007]
(Example 2)
FIG. 3 shows another embodiment of the present invention. The LCD controller IC comprises a segment for driving the liquid crystal panel, a common output terminal 10, and a control terminal 7. While the control terminal has a different shape for each terminal, the segment and common output terminals that occupy the majority of the terminals (about 80%) have a repetitive pattern like a memory cell. Narrowing the terminals is very effective. On the other hand, since there are only about 20 control terminals, test terminals may be provided on the segment of only one side of the four sides of the IC chip and the common output terminal as shown in FIG. In this case, adjacent IC chips are electrically separated.
[0008]
【The invention's effect】
Although a method of selecting an IC by a test after mounting without performing IC selection by wafer measurement is also conceivable, the cost of mounting an IC that should originally be defective becomes very high. However, according to the present invention, the thinning test can be performed by the tester of the LCD controller IC without increasing the chip area. Therefore, since the IC can be selected with a probability proportional to the thinning in the tester, it is possible to remarkably reduce the mounting cost which is originally a defective IC.
[Brief description of the drawings]
FIG. 1 is a plan view of a conventional IC.
FIG. 2 is a plan view of the present invention.
FIG. 3 is a plan view of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Center line where IC chip is cut 2 Scribe area 3 Narrow pitch pad terminal 4 Test pad terminal 5 IC chip 6 Metal wiring 7 Control terminal 8 Segment and common output terminal 9 Pad terminal 10 Segment and common output terminal

Claims (3)

An LCD controller IC comprising a plurality of narrow pitch pad terminals arranged in an IC chip and a test pad terminal arranged only in a scribe line, wherein the narrow pitch pad terminals are thinned out to form a plurality. LCD controller IC, characterized in that consists of a terminal coupled to the test pad pin adjacent a terminal that is not bound to the test pad terminal of a metal wire in one out of every.   2. The LCD controller IC according to claim 1, wherein one narrow pitch pad terminal is coupled to one test pad terminal.   One test pad terminal is connected to one narrow pitch pad terminal on the IC chip and one narrow pitch pad terminal on the adjacent IC chip. The LCD controller IC according to claim 1.

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