JP4060694B2 - Foamable resol-type phenolic resin composition and phenolic resin foam using the same - Google Patents
Foamable resol-type phenolic resin composition and phenolic resin foam using the same Download PDFInfo
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- JP4060694B2 JP4060694B2 JP2002346735A JP2002346735A JP4060694B2 JP 4060694 B2 JP4060694 B2 JP 4060694B2 JP 2002346735 A JP2002346735 A JP 2002346735A JP 2002346735 A JP2002346735 A JP 2002346735A JP 4060694 B2 JP4060694 B2 JP 4060694B2
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- 239000006260 foam Substances 0.000 title claims description 68
- 239000005011 phenolic resin Substances 0.000 title claims description 57
- 239000000203 mixture Substances 0.000 title claims description 45
- 239000011134 resol-type phenolic resin Substances 0.000 title claims description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims description 11
- 229920001568 phenolic resin Polymers 0.000 title claims description 11
- -1 ether compound Chemical class 0.000 claims description 78
- 239000003795 chemical substances by application Substances 0.000 claims description 24
- 239000004088 foaming agent Substances 0.000 claims description 22
- 239000007788 liquid Substances 0.000 claims description 22
- 230000002378 acidificating effect Effects 0.000 claims description 19
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 19
- 229920003987 resole Polymers 0.000 claims description 18
- 239000003381 stabilizer Substances 0.000 claims description 16
- 239000003607 modifier Substances 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 9
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 claims description 9
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 7
- WZLFPVPRZGTCKP-UHFFFAOYSA-N 1,1,1,3,3-pentafluorobutane Chemical compound CC(F)(F)CC(F)(F)F WZLFPVPRZGTCKP-UHFFFAOYSA-N 0.000 claims description 6
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 claims description 6
- WKJICCKTDQDONB-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxycarbonyl)cyclohexane-1-carboxylic acid Chemical compound OC(=O)C1CCCCC1C(=O)OCC1OC1 WKJICCKTDQDONB-UHFFFAOYSA-N 0.000 claims description 4
- MSSNHSVIGIHOJA-UHFFFAOYSA-N pentafluoropropane Chemical compound FC(F)CC(F)(F)F MSSNHSVIGIHOJA-UHFFFAOYSA-N 0.000 claims description 4
- 239000011342 resin composition Substances 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 claims description 3
- 229930195733 hydrocarbon Natural products 0.000 claims description 3
- 150000002430 hydrocarbons Chemical class 0.000 claims description 3
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 32
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 29
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 12
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 12
- 238000002156 mixing Methods 0.000 description 11
- 238000005187 foaming Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 210000004027 cell Anatomy 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000009257 reactivity Effects 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000004604 Blowing Agent Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 2
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 229910000323 aluminium silicate Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- VSXGXPNADZQTGQ-UHFFFAOYSA-N oxirane;phenol Chemical compound C1CO1.OC1=CC=CC=C1 VSXGXPNADZQTGQ-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- JIRHAGAOHOYLNO-UHFFFAOYSA-N (3-cyclopentyloxy-4-methoxyphenyl)methanol Chemical compound COC1=CC=C(CO)C=C1OC1CCCC1 JIRHAGAOHOYLNO-UHFFFAOYSA-N 0.000 description 1
- OKIYQFLILPKULA-UHFFFAOYSA-N 1,1,1,2,2,3,3,4,4-nonafluoro-4-methoxybutane Chemical compound COC(F)(F)C(F)(F)C(F)(F)C(F)(F)F OKIYQFLILPKULA-UHFFFAOYSA-N 0.000 description 1
- BOSAWIQFTJIYIS-UHFFFAOYSA-N 1,1,1-trichloro-2,2,2-trifluoroethane Chemical compound FC(F)(F)C(Cl)(Cl)Cl BOSAWIQFTJIYIS-UHFFFAOYSA-N 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- DDMOUSALMHHKOS-UHFFFAOYSA-N 1,2-dichloro-1,1,2,2-tetrafluoroethane Chemical compound FC(F)(Cl)C(F)(F)Cl DDMOUSALMHHKOS-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- 150000005207 1,3-dihydroxybenzenes Chemical class 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- QNYBOILAKBSWFG-UHFFFAOYSA-N 2-(phenylmethoxymethyl)oxirane Chemical compound C1OC1COCC1=CC=CC=C1 QNYBOILAKBSWFG-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- HJEORQYOUWYAMR-UHFFFAOYSA-N 2-[(2-butylphenoxy)methyl]oxirane Chemical compound CCCCC1=CC=CC=C1OCC1OC1 HJEORQYOUWYAMR-UHFFFAOYSA-N 0.000 description 1
- HIGURUTWFKYJCH-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxymethyl)cyclohexyl]methoxymethyl]oxirane Chemical compound C1OC1COCC1(COCC2OC2)CCCCC1 HIGURUTWFKYJCH-UHFFFAOYSA-N 0.000 description 1
- CAXSADPQQPXXTP-UHFFFAOYSA-N 2-[[2,3-bis(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=1OCC2OC2)=CC=CC=1OCC1CO1 CAXSADPQQPXXTP-UHFFFAOYSA-N 0.000 description 1
- HCTJRUPAQGKROL-UHFFFAOYSA-N 2-[[2,3-bis(oxiran-2-ylmethoxymethyl)phenyl]methoxymethyl]oxirane Chemical compound C(C1CO1)OCC=1C(=C(C=CC1)COCC1CO1)COCC1CO1 HCTJRUPAQGKROL-UHFFFAOYSA-N 0.000 description 1
- VNAFHIAHQJIRPB-UHFFFAOYSA-N 2-[[2-(oxiran-2-ylmethoxymethyl)phenyl]methoxymethyl]oxirane Chemical compound C1OC1COCC1=CC=CC=C1COCC1CO1 VNAFHIAHQJIRPB-UHFFFAOYSA-N 0.000 description 1
- WJORGWQDTVMZDR-UHFFFAOYSA-N 2-methyloxirane;phenol Chemical compound CC1CO1.OC1=CC=CC=C1 WJORGWQDTVMZDR-UHFFFAOYSA-N 0.000 description 1
- HFGHRUCCKVYFKL-UHFFFAOYSA-N 4-ethoxy-2-piperazin-1-yl-7-pyridin-4-yl-5h-pyrimido[5,4-b]indole Chemical compound C1=C2NC=3C(OCC)=NC(N4CCNCC4)=NC=3C2=CC=C1C1=CC=NC=C1 HFGHRUCCKVYFKL-UHFFFAOYSA-N 0.000 description 1
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 description 1
- 229930188104 Alkylresorcinol Natural products 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- CYFVJBZMBOYEKR-UHFFFAOYSA-N C1C(C(CC(C1COCC2CO2)COCC3CO3)COCC4CO4)COCC5CO5 Chemical compound C1C(C(CC(C1COCC2CO2)COCC3CO3)COCC4CO4)COCC5CO5 CYFVJBZMBOYEKR-UHFFFAOYSA-N 0.000 description 1
- PIGMSVIGVRRLND-UHFFFAOYSA-N C1CCC(C(C1)COCC2CO2)(COCC3CO3)COCC4CO4 Chemical compound C1CCC(C(C1)COCC2CO2)(COCC3CO3)COCC4CO4 PIGMSVIGVRRLND-UHFFFAOYSA-N 0.000 description 1
- MZEZASKGQSOOET-UHFFFAOYSA-N C1CCC(C(C1)OCC2CO2)(OCC3CO3)OCC4CO4 Chemical compound C1CCC(C(C1)OCC2CO2)(OCC3CO3)OCC4CO4 MZEZASKGQSOOET-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229940126062 Compound A Drugs 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012615 aggregate Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229940087091 dichlorotetrafluoroethane Drugs 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009775 high-speed stirring Methods 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- AYOOGWWGECJQPI-NSHDSACASA-N n-[(1s)-1-(5-fluoropyrimidin-2-yl)ethyl]-3-(3-propan-2-yloxy-1h-pyrazol-5-yl)imidazo[4,5-b]pyridin-5-amine Chemical compound N1C(OC(C)C)=CC(N2C3=NC(N[C@@H](C)C=4N=CC(F)=CN=4)=CC=C3N=C2)=N1 AYOOGWWGECJQPI-NSHDSACASA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- XULSCZPZVQIMFM-IPZQJPLYSA-N odevixibat Chemical compound C12=CC(SC)=C(OCC(=O)N[C@@H](C(=O)N[C@@H](CC)C(O)=O)C=3C=CC(O)=CC=3)C=C2S(=O)(=O)NC(CCCC)(CCCC)CN1C1=CC=CC=C1 XULSCZPZVQIMFM-IPZQJPLYSA-N 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 239000002984 plastic foam Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920006327 polystyrene foam Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229940029284 trichlorofluoromethane Drugs 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、発泡性レゾール型フェノール樹脂組成物及びそれを用いたフェノール樹脂発泡体に関する。さらに詳しくは、本発明は経時的に安定した低吸水性及び金属板との良好な接着性などを有するフェノール樹脂発泡体を与え、かつ発泡硬化反応性に優れる発泡性レゾール型フェノール樹脂組成物、及び該組成物を発泡硬化させてなる上記の優れた性質を有するフェノール樹脂発泡体に関するものである。
【0002】
【従来の技術】
フェノール樹脂発泡体は、軽量であり、かつ熱可塑性樹脂発泡体に比べて難燃性、耐熱性、低発煙性、耐溶剤性、機械的強度などに優れているため、耐火軽量断熱材、防火軽量断熱材などとして、クリーンルーム用パネル、間仕切りパネルなどの内装材用途に、あるいは金属サイディング、金属パネル等の外壁材、天井材、屋根下地材、床下断熱材、防火扉などに広く用いられている。
このフェノール樹脂発泡体は、一般にレゾール型フェノール樹脂に、整泡剤、発泡剤、及び酸性硬化剤を混合し、常温〜120℃程度で発泡硬化させて製造されている。
しかしながら、上記フェノール樹脂発泡体は、酸性硬化剤として強酸を用いることで、発泡後フェノール樹脂発泡体中に遊離酸として残存することから、この遊離酸が水と介在することで鉄板やアルミニウム板などの金属を腐蝕させたり、釘等の金属製留め具の腐蝕を起こすことで防錆性に懸念があった。また、残留した酸は水との親和性が強く、結果として発泡体吸水量が他のプラスチック発泡体(ポリスチレン発泡体、ウレタン発泡体、ポリエチレン発泡体等)に比べて多くなり、機械的強度の低下を起こしたり、鉄板と発泡体の界面強度が弱くなって剥がれたりするなどの欠点があった。また、発泡体系外へ流出する酸の影響で金属表面に汚れ(腐食が関係)が生じるなどの欠点があった。
【0003】
他方、フェノール樹脂発泡体の製造方法として、例えば脂肪族多価アルコールのジ又はトリグリシジルエーテル化合物(グリシジル基及び側鎖を除く主鎖の炭素数は6以下)の単独又は該化合物の混合物を、フェノール樹脂に配合して加熱反応処理してなるグリシジルエーテル化合物配合型フェノール樹脂を用いる方法が開示されている(例えば、特許文献1参照)。この方法においては、グリシジルエーテル化合物として、ネオペンチルグリコールや1,6−ヘキサンジオールのジグリシジルエーテル、プチルグリシジルエーテル等(グリシジル基及び側鎖を除く主鎖の炭素数は6以下)が用いられている。しかしながら、該グリシジルエーテル化合物は、フェノール樹脂との相溶性の点では良好であるものの、ほとんどが液状であるため、経時により液分離し易いこと、未反応のグリシジルエーテルがフェノール樹脂発泡体から溶出し易くなり製品の品質が不安定となり易いこと、グリシジルエーテルが発泡硬化反応に悪影響を与えやすいことなどの問題がある。
【0004】
また、レゾール型フェノール樹脂として炭素数2〜6であるアルキレングリコール又はアルキレンエーテルグリコールのジ及びトリグリシジルエーテル化合物の少なくとも一種で変性されたものを用い、かつ硬化促進剤としてレゾルシノール類を含む酸性触媒を用いることで、耐腐食性、耐吸湿性の改良されたフェノール樹脂発泡体が開示されている(例えば、特許文献2参照)。このフェノール樹脂発泡体においては、前記特許文献1と同様に、グリシジルエーテル化合物としてネオぺンチルグリコールや1,6−ヘキサンジオールのジグリシジルエーテル、ブチルグリシジルエーテル等(グリシジル基及び側鎖を除く主鎖の炭素数は6以下)を用いているが、フェノール樹脂との相溶性の点では良好であるものの、ほとんどが液状であるため、前記と同様な問題がある。また、酸性触媒中にレゾルシノール類を配合して用いた場合、レゾルシノールの高い反応活性から生じる発熱により発泡硬化反応のタイミングを調整することが難しく、安定したフェノール樹脂発泡体を供給することは困難であると考えられる。
したがって、経時的に安定した低吸水性、金属板との良好な接着性及び良好な発泡硬化反応性などを有する品質上安定なフェノール樹脂発泡体の開発が要求されていた。
【0005】
【特許文献1】
特開昭59−122522号公報
【0006】
【特許文献2】
特開昭59−124940号公報
【0007】
【発明が解決しようとする課題】
本発明は、このような状況下で、経時的に安定した低吸水性及び金属板との良好な接着性などを有するフェノール樹脂発泡体を与え、かつ発泡硬化反応性に優れる発泡性レゾール型フェノール樹脂組成物、及びそれを用いたフェノール樹脂発泡体を提供することを目的とするものである。
【0008】
【課題を解決するための手段】
本発明者らは、前記目的を達成するために鋭意研究を重ねた結果、レゾール型フェノール樹脂と共に、酸性硬化剤、発泡剤及び整泡剤を含むと共に、さら改質剤として、特定の分子量とエポキシ当量を有するモノ及び/又はポリグリシジルエーテル化合物、好ましくは分子内に芳香環やシクロアルカン環を有するグリシジルエーテル化合物を所定の割合で含む組成物により、その目的を達成し得ることを見出した。本発明は、かかる知見に基づいて完成したものである。
【0009】
すなわち、本発明は、
(1)(A)レゾール型フェノール樹脂、(B)酸性硬化剤、(C)発泡剤、(D)整泡剤、(E)改質剤及び(F)液安定化剤を含み、かつ前記(E)成分の改質剤として、重量平均分子量が200〜3000であり、エポキシ当量が150〜2500の範囲にあるモノ及び/又はポリグリシジルエーテル化合物を、前記(A)成分100重量部に対し、0.2〜20重量部の範囲で含有し、前記(F)成分の液安定化剤としてグリシジルエステル化合物を含有することを特徴とする発泡性レゾール型フェノール樹脂組成物。
(2)(E)成分のグリシジルエーテル化合物が、エポキシ基及び側鎖を除く主鎖の炭素数が8以上であり、かつ主鎖に芳香環及び/又はシクロアルカン環を有するものである上記(1)の発泡性レゾール型フェノール樹脂組成物、
(3)(F)成分のグリシジルエステル化合物が、ネオデカン酸グリシジルエステル及び/又はヘキサヒドロフタル酸グリシジルエステルである上記(1)又は(2)の発泡性レゾール型フェノール樹脂組成物、
(4)(E)成分のグリシジルエーテル化合物100重量部に対して、(F)成分のグリシジルエステル化合物を25〜400重量部の範囲で含有する請求項1ないし3のいずれかに記載の発泡性レゾール型フェノール樹脂組成物。
(5)(C)成分の発泡剤が、HFC−365mfc、HFC−245fa及びHFE−7100の中から選ばれる少なくとも一種の含フッ素系発泡剤である上記(1)〜(4)の発泡性レゾール型フェノール樹脂組成物、
(6)(C)成分の発泡剤が、n−ペンタン、イソペンタン、シクロペンタン及び2−メチルペンタンの中から選ばれる少なくとも一種の炭化水素系発泡剤である上記(1)〜(4)の発泡性レゾール型フェノール樹脂組成物、及び
(7)上記(1)〜(6)の発泡性レゾール型フェノール樹脂組成物を発泡硬化させてなるフェノール樹脂発泡体、
を提供するものである。
【0010】
【発明の実施の形態】
本発明の発泡性レゾール型フェノール樹脂組成物(以下、発泡性組成物又は単に組成物ということがある。)は、(A)レゾール型フェノール樹脂、(B)酸性硬化剤、(C)発泡剤、(D)整泡剤、(E)改質剤及び(F)液安定化剤を含む組成物である。
本発明の組成物において、前記(A)成分として用いられるレゾール型フェノール樹脂は特に制限はなく、従来レゾール型フェノール樹脂の製造に使用されている公知の方法、例えばフェノール類とアルデヒド類を、アルデヒド類過剰でアルカリ性触媒の存在下に反応させ、脱水濃縮させることにより製造することができる。フェノール類としては、フェノール、各種クレゾール、各種キシレノール等が挙げられるが、これらの中でも反応性、硬化性の面からフェノール、m−クレゾールが好ましい。これらのフェノール類は単独で用いても、混合して用いてもよく、さらにはo−クレゾール、p−クレゾール、ピスフェノール等と併用してもよい。アルデヒド類としては、ホルムアルデヒド、パラホルムアルデヒド、ポリオキシメチレン、トリオキサン等が使用できる。これらアルデヒド類は単独で用いても、混合して用いてもよい。アルカリ性触媒としては、水酸化ナトリウム、水酸化カリウム、水酸化バリウム、水酸化カルシウム、水酸化マグネシウム等が挙げられる。
【0011】
本発明の組成物において、(B)成分として用いられる酸性硬化剤としては、例えばリン酸、亜リン酸、次亜リン酸、ピロリン酸、トリポリリン酸、ポリリン酸、塩酸、硫酸等の無機酸、フェノールスルホン酸、トルエンスルホン酸、キシレンスルホン酸、ベンゼンスルホン酸等のアリールスルホン酸やメタンスルホン酸等のアルキルスルホン酸等の有機酸が用いられるが、これらに限定されるものではない。また、これらの酸性硬化剤は単独でまたは二種類以上を併用することも可能である。酸性硬化剤の使用量は特に限定されるものではないが、前記(A)成分のレゾール型フェノール樹脂100重量部に対して、通常1〜50重量部、好ましくは5〜30重量部の範囲である。
【0012】
本発明の組成物において、(C)成分として用いられる発泡剤としては、含フッ素系発泡剤であるHFC−365mfc(1,1,1,3,3−ペンタフルオロブタン、日本ソルベイ社製)、HFC−245fa(1,1,1,3,3−ペンタフルオロプロパン、セントラル硝子社製)及びHFE−7100(ノナフルオロブチルメチルエーテル、3M社製)などを、単独もしくは二種以上併用して使用することができる。併用比率は特に限定されるものではない。また、炭化水素系発泡剤であるn−ペンタン、イソペンタン、シクロペンタン、2−メチルペンタンなどを単独もしくは二種以上併用して使用することができる。併用比率は特に限定されるものではない。これらの発泡剤の使用量は、(A)成分のレゾール型フェノール樹脂100重量部に対し、通常1〜20重量部、好ましくは1.5〜15重量部の範囲である。発泡剤の使用量が1重量部未満だと、気化が急激となり発泡硬化のバランスがとれず均質なセル構造が得られにくい。また、20重量部を超えると、セル内の発泡圧力と整泡力のバランスがとれず、セルの壁が破れてしまい、均質なセル構造が得られにくい。これらの発泡剤以外にも公知の発泡剤である−20〜100℃程度の揮発性有機液体、例えばフッ素化炭化水素、塩素化炭化水素、脂肪族炭化水素の一種又は二種以上の混合物を使用することができるが、地球環境破壊を促進する発泡剤である、トリクロロモノフルオロメタン(F−11)、トリクロロトリフルオロエタン(F−113),ジクロロテトラフルオロエタン(F−114)等、さらに四塩化炭素、トリクロロエタン等は実用上好ましくはない。
また、これらの発泡剤と二酸化炭素を発生する炭酸塩、窒素ガスを発生するニトロソ化合物、アゾ化合物、ヒドラジン誘導体等とを併用することもできる。
【0013】
本発明の組成物において、(D)成分として用いられる整泡剤としては、例えばシリコーン系エチレンオキシド−プロピレンオキシド共重合体、又はソルビタン、アルキルフェノール、ヒマシ油等のポリオキシアルキレン付加物等の界面活性剤が挙げられる。これらは単独で用いても、混合して用いてもよい。その使用量は、(A)成分のレゾール型フェノール樹脂100重量部に対し、通常0.5〜10重量部の範囲であることが好ましい。この整泡剤の使用量が0.5重量部未満だと、気泡を安定して形成できず均質な気泡構造が得られにくい(セルサイズのばらつき、ボイドを生じる)。また、10重量部を超えると、整泡力過剰となり気泡壁が厚過ぎて剛直となり割れが生じる原因となる。
【0014】
本発明の組成物においては、(E)成分の改質剤として、モノグリシジルエーテル化合物やポリグリシジルエーテル化合物が用いられる。ポリグリシジルエーテル化合物は、分子内にグリシジル基を2個以上有するものであればよく、特に制限されず、例えばジグリシジルエーテル、トリグリシジルエーテル、テトラグリシジルエーテルなどを挙げることができる。これらのグリシジルエーテル化合物は一種を用いてもよく、二種以上を併用してもよい。
本発明においては、このグリシジルエーテル化合物として、重量平均分子量が200〜3000であり、かつエポキシ当量が150〜2500の範囲にあるものを用いる。
【0015】
このようなグリシジルエーテル化合物を用いることにより、フェノール樹脂発泡体からの溶出を防止し、該化合物を比較的多く配合でき、金属板との接着効果、発泡体の低吸水性化効果が発揮され、また発泡性組成物は、良好な発泡硬化反応性を示す。さらに、発泡性組成物の粘度上昇を緩和調整することができ、金属パネルなどでの充填性がよくなる。
このグリシジルエーテル化合物の添加量は、(A)成分のレゾール型フェノール樹脂100重量部に対して、0.2〜20重量部、好ましくは0.5〜15重量部の範囲である。レゾール型フェノール樹脂100重量部に対してグリシジルエーテル化合物の添加量が0.2重量部未満だと、発泡硬化時間を短縮させるだけの反応熱が得られなかったり、金属板とのなじみや接着性向上が得られなかったり、低吸水性化が図れないことがある。また、グリシジルエーテル化合物の添加量が20重量部を超えると発泡時に破泡現象が起こり、外観不良を生じる原因となる。
【0016】
本発明においては、このグリシジルエーテル化合物は、エポキシ基及び側鎖を除く主鎖の炭素数が8以上であり、かつ主鎖に芳香環及び/又はシクロアルカン環を有するものが、性能の点から好ましい。この芳香環やシクロアルカン環は、主鎖にそれぞれ一つ又は複数導入されていてもよく、あるいは芳香環及びシクロアルカン環が共に導入されていてもよい。ここで、芳香環としては、ベンゼン環やナフタレン環などを挙げることができるが、これらの中でベンゼン環が好ましく、またシクロアルカン環としては、シクロペンタン環、シクロヘキサン環、シクロオクタン環などが挙げられるが、これらの中でシクロヘキサン環が好ましい。
このようなグリシジルエーテル化合物としては、モノグリシジルエーテル化合物として、例えばブチルフェニルグリシジルエーテル、フェノールのエチレンオキシド付加体のグリシジルエーテル、フェノールのプロピレンオキシド付加体のグリシジルエーテル、フェノールのエチレンオキシド付加体の水素添加物のグリシジルエーテル、フェノールのプロピレンオキシド付加体の水素添加物のグリシジルエーテルなどが挙げられ、ジグリシジルエーテル化合物として、例えばビスフェノールA型ジグリシジルエーテル、フェニレンジグリシジルエーテル、トリレンジグリシジルエーテル、シクロヘキシレンジグリシジルエーテル、ビス(グリシドキシメチル)シクロヘキサン、ビス(グリシドキシメチル)ベンゼンなどが挙げられ、トリグリシジルエーテル化合物として、例えばトリス(グリシドキシ)ベンゼン、トリス(グリシドキシ)シクロヘキサン、トリス(グリシドキシメチル)ベンゼン、トリス(グリシドキシメチル)シクロヘキサンなどが挙げられ、テトラグリシジルエーテル化合物としては、例えば1,2,4,5−テトラキス(グリシドキシメチル)ベンゼン、1,2,4,5−テトラキス(グリシドキシメチル)シクロヘキサンなどが挙げられる。さらには、ポリグリシジルエーテル化合物として、フェノールノボラック型樹脂のグリシジルエーテルなどが挙げられる。これらのグリシジルエーテル化合物は、一種を単独で用いてもよく、二種以上を組み合わせて用いてもよい。
【0017】
本発明の組成物においては、(F)成分の液安定化剤としてグリシジルエステル化合物が用いられる。このグリシジルエステル化合物は、前記のグリシジルエーテル化合物と併用することにより、該グリシジルエーテル化合物のレゾール型フェノール樹脂、酸性硬化剤に対する相溶性を補助する働きがあると考えられ、特に酸性硬化剤中にテトラグリシジルエーテル、トリグリシジルエーテル、ジグリシジルエーテルなどのポリグリシジルエーテル化合物を配合した液はポリマー化による粘度上昇を伴う場合があるが、グリシジルエステル化合物を併用することで粘度を調整することができる。
このグリシジルエステル化合物は、有機酸のグリシジルエステル化合物であればよく、特に制限はないが、ネオデカン酸グリシジルエステルやヘキサヒドロフタル酸グリシジルエステルが好適である。該グリシジルエステル化合物は、一種を単独で用いてもよく、二種以上を組み合わせて用いてもよい。また、その添加量は特に制限はないが、通常(E)成分のグリシジルエーテル化合物100重量部に対し、25〜400重量部の範囲で選ばれる。
【0018】
本発明の発泡性レゾール型フェノール樹脂組成物には、本発明の目的が損なわれない範囲で、各種添加剤を配合することができる。例えば、難燃剤として無機フィラーを添加することが可能である。具体的には、水酸化アルミニウム、アルミノシリケート微細中空粒子、タルク、クレー、水酸化カルシウム、ホウ酸等が使用できる。ホウ酸、アルミノシリケート微細中空粒子は、酸性硬化剤中に添加してもかまわない。また、レゾルシノール、アルキルレゾルシノールなどの硬化促進剤、シラスバルーン、ガラスバルーン、多硬質骨材、金属粉、木粉等の無機系及び有機系充填剤、ガラス繊維、炭素繊維、アラミド繊維等の繊維強化材等を配合してもよい。
【0019】
本発明の発泡性レゾール型フェノール樹脂組成物において、グリシジルエーテル化合物及びグリシジルエステル化合物の配合方法については特に制限はないが、工業的に該組成物を調製する場合、(1)グリシジルエーテル化合物単独液またはグリシジルエステル化合物を併用して予め混合液としておき、レゾール型フェノール樹脂の製造段階時に配合する方法、(2)発泡混合装置手前で、フェノール樹脂とグリシジルエーテル化合物単独またはグリシジルエステル化合物を併用して同一ライン内にてプレミックスを行い、発泡混合装置に導く方法、(3)酸性硬化剤製造時にグリシジルエーテル化合物単独またはグリシジルエステル化合物を併用して硬化剤中に配合して硬化剤組成物とする方法、(4)発泡混合装置手前で酸性硬化剤とグリシジルエーテル化合物単独またはグリシジルエステル化合物と併用して同一ライン内にてプレミックスを行い、発泡混合装置に導く方法、(5)レゾール型フェノール樹脂と酸性硬化剤とグリシジルエーテル化合物単独またはグリシジルエステル化合物を併用して別々のラインから発泡混合装置に導く方法等が可能である。
【0020】
本発明の発泡性レゾール型樹脂組成物は、このような配合方法により、レゾール型フェノール樹脂、グリシジルエーテル化合物及び場合により用いられるグリシジルエステル化合物、あるいは酸性硬化剤を配合し、さらに発泡剤、整泡剤、必要に応じて用いられる各種添加剤を配合することにより、調製することができる。
この発泡性レゾール型フェノール樹脂組成物を、枠又はモールドへ流し込み、通常常温〜120℃の範囲の温度で発泡硬化させることにより、本発明のフェノール樹脂発泡体が得られる。
このようにして得られたフェノール樹脂発泡体は、金属板との良好な接着性を有し、かつ経時的に安定した低吸水性を示す。金属板との良好な接着性を示す理由は、発泡性組成物が金属板とのなじみが良くなり、エポキシ樹脂に起因する効果がでるものと思われる。また、該発泡体が低吸水性化する理由は発泡体中に残留する酸をグリシジルエーテル化合物やグリシジルエステル化合物が保護することで、水との親和性を下げる効果がでること、また均一で強固な独立気泡をつくるためと考えられる。
【0021】
さらに、生産性を考えた場合、発泡硬化反応特性が要求されるが、グリシジルエーテル化合物及び場合により用いられるグリシジルエステル化合物と酸性硬化剤が接触した際、反応による急激な発熱が生じることを利用して、発泡配合液の内部発熱を増大させることにより、発泡硬化時間を短縮し、生産性の向上を図ることができる。
【0022】
【実施例】
次に、本発明を実施例により、さらに詳細に説明するが、本発明は、これらの例によってなんら限定されるものではない。
【0023】
実施例1
四つ口フラスコにフェノール2000g、37重量%ホルマリン2930g(ホルムアルデヒド/フェノールのモル比1.7)及び触媒として20重量%水酸化ナトリウム水溶液60gを仕込み、80℃で2時間反応させた後、15重量%p−トルエンスルホン酸水溶液でpH7.0に中和し、減圧脱水処理して、樹脂中の水分を10重量%以下とした。得られたレゾール型フェノール樹脂は、固形分80重量%、粘度4000mPa・s(25℃)、比重1.250(25℃)、重量平均分子量300であった。このレゾール型フェノール樹脂100重量部に対し、整泡剤としてL−5420(シリコーン系界面活性剤 日本ユニカー社製)3重量部、改質剤として重量平均分子量350のビスフェノールA型ジグリシジルエーテル(ジャパンエポキシ社製、エポキシ当量190)3.5重量部、液安定化剤としてネオデカン酸グリシジルエステル1.5重量部、発泡剤としてHFC−365mfc(日本ソルベイ社製)6重量部を添加し、高速攪拌混合したのち、液温を30℃に調整した。
【0024】
その後、酸性硬化剤として70重量%p−トルエンスルホン酸25重量部を30℃に調整して添加し、ホモディスパーにて10秒間高速攪拌混合した後、上下面材を鉄板として65℃に加熱した400×400×25mmの金型容器に速やかに流し込んだ。流し込んだ液の液面が上昇し始める時間をクリームタイム(CT)、発泡液内部に棒をさし抵抗が急激に強くなる時間をゲルタイム(GT)、液面の上昇が終了した時間をライズタイム(RT)、発泡体表面層のベトツキがなくなる時間をタックフリータイム(TFT)として発泡硬化挙動を確認した。配合原液の攪拌開始から3分後に発泡物を取り出し、重量を測り、鉄板の重量を差引いて発泡体密度とした。鉄板と発泡体との接着強度の測定は試験片を50×50×25mmに切り出し、鉄板面に引っ張り試験用ジグを取り付け、クロスヘッドスピード1mm/minで引っ張り試験を計6個で行い、最大値、最小値を除き4個の平均値から接着強度を算出した。発泡体吸水量の測定は試験片を100×100×20mm(鉄板部分は切除)に切り出し、1ヶ月間浸漬後の吸水量を測定した。以上の結果を第1表に示す。
【0025】
実施例2
実施例1において、ネオデカン酸グリシジルエステル1.5重量部に代えて、ヘキサヒドロフタル酸グリシジルエステル1.5重量部を添加したこと以外は、実施例1と同様に実施した。結果を第1表に示す。
【0026】
実施例3
実施例1において、改質剤として重量平均分子量1600のビスフェノールA型ジグリシジルエーテル(ジャパンエポキシ社製、エポキシ当量1000)2.5重量部及び発泡剤としてHFC−365mfc(日本ソルベイ社製)5.4重量部とHFE−7100(日本ソルベイ社製)0.6重量部との混合物を用い、かつネオデカン酸グリシジルエステルの添加量を2.5重量部に変えた以外は、実施例1と同様に実施した。結果を第1表に示す。
【0027】
実施例4
改質剤として重量平均分子量350のビスフェノールA型ジグリシジルエーテル(ジャパンエポキシ社製、エポキシ当量190)3.5重量部、酸性硬化剤として70重量%p−トルエンスルホン酸30重量部及び液安定化剤としてネオデカン酸グリシジルエステル1.5重量部を混合して、酸性硬化剤配合物35重量部を作製したのち、30℃に調整した。
一方、実施例1と同じレゾール型フェノール樹脂100重量部に対し、整泡剤としてL−5420(前出)3重量部及び発泡剤としてHFC365mfc(前出)6重量部を添加し、高速攪拌混合したのち、液温を30℃に調整した。次に、このものと上記酸性硬化剤配合物35重量部とを、ホモディスパーにて10秒間高速攪拌混合したのち、実施例1と同様に実施した。結果を第1表に示す。
【0028】
実施例5
実施例4において、70重量%p−トルエンスルホン酸の量を25重量部に変え、かつレゾール型フェノール樹脂、ジグリシジルエーテル及び70重量%p−トルエンスルホン酸を、別々に添加した以外は、実施例4と同様に実施した。結果を第1表に示す。
【0029】
実施例6
実施例1において、発泡剤としてn−ペンタン6重量部を用いた以外は、実施例1と同様に実施した。結果を第1表に示す。
【0030】
実施例7
実施例1において、ビスフェノールA型ジグリシジルエーテルの量を15重量部及びネオデカン酸グリシジルエステルの量を7.5重量部に変えた以外は、実施例1と同様に実施した。結果を第1表に示す。
【0031】
比較例1
実施例1において、ビスフェノールA型ジグリシジルエーテル及びネオデカン酸ジグリシジルエステルを添加しなかったこと以外は、実施例1と同様に実施した。結果を第1表に示す。
【0032】
比較例2
実施例1において、改質剤として重量平均分子量3700のビスフェノールA型ジグリシジルエーテル(ジャパンエポキシ社製、エポキシ当量2800)3.5重量部を用い、かつネオデカン酸グリシジルエステルの添加量を3.5重量部に変えた以外は、実施例1と同様に実施した。結果を第1表に示す。
【0033】
比較例3
実施例4において、改質剤として重量平均分子量3700のビスフェノールA型ジグリシジルエーテル(ジャパンエポキシ社製、エポキシ当量2800)3.5重量部を用い、かつネオデカン酸グリシジルエステルの量を3.5重量部及び70重量%p−トルエンスルホン酸の量を25重量部に変えた以外は、実施例6と同様に実施した。結果を第1表に示す。
【0034】
比較例4
実施例1において、ビスフェノールA型ジグリシジルエーテルの量を0.1重量部に変え、かつネオデカン酸グリシジルエステルを用いなかったこと以外は、実施例1と同様に実施した。結果を第1表に示す。
【0035】
比較例5
実施例1において、ビスフェノールA型ジグリシジルエーテルの量を25重量部に変え、かつネオデカン酸グリシジルエステルを用いなかったこと以外は、実施例1と同様に実施した。結果を第1表に示す。
【0036】
【表1】
【0037】
【表2】
【0038】
【表3】
【0039】
[注]1)レゾール型フェノール樹脂中にビスフェノールA型ジグリシジルエーテル及びネオデカン酸グリシジルエステルを配合したが、ビスフェノールA型ジグリシジルエーテルの溶解が不十分で、樹脂液の安定性が悪く、発泡評価できなかった。
【0040】
【表4】
【0041】
[注]
2)酸性硬化剤中にビスフェノールA型ジグリシジルエーテル及びネオデカン酸グリシジルエステルを配合したが、ビスフェノールA型ジグリシジルエーテルの溶解が不十分で、硬化剤液の安定性が悪く、発泡評価できなかった。
3)発泡時に破泡現象が生じ、発泡体の外観不良により、測定せず。
【0042】
【発明の効果】
本発明によれば、経時的に安定した低吸水性及び金属板との良好な接着性などを有するフェノール樹脂発泡体を与え、かつ発泡硬化反応性に優れる発泡性レゾール型フェノール樹脂組成物を提供することができる。
また、前記発泡性レゾール型フェノール樹脂組成物を発泡硬化させることにより、前記の優れた特性を有するフェノール樹脂発泡体を得ることができる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a foamable resol-type phenol resin composition and a phenol resin foam using the same. More specifically, the present invention provides a phenolic resin foam having a low water absorption that is stable over time, good adhesion to a metal plate, and the like, and is excellent in foam curing reactivity, And a phenol resin foam having the above-mentioned excellent properties obtained by foam-curing the composition.
[0002]
[Prior art]
Phenol resin foam is lightweight and has superior flame resistance, heat resistance, low smoke generation, solvent resistance, mechanical strength, etc., compared to thermoplastic resin foam. Widely used for interior materials such as clean room panels and partition panels as lightweight insulation materials, or for external wall materials such as metal siding and metal panels, ceiling materials, roof base materials, underfloor insulation materials, fire doors, etc. .
This phenol resin foam is generally produced by mixing a resol type phenol resin with a foam stabilizer, a foaming agent, and an acidic curing agent, and foaming and curing at about room temperature to 120 ° C.
However, since the phenol resin foam uses a strong acid as an acidic curing agent, and remains as a free acid in the phenol resin foam after foaming, the free acid intervenes with water so that an iron plate, an aluminum plate, etc. There was concern about rust prevention by corroding the metal of the metal or causing corrosion of metal fasteners such as nails. In addition, the residual acid has a strong affinity with water, and as a result, the foam water absorption is higher than that of other plastic foams (polystyrene foam, urethane foam, polyethylene foam, etc.), resulting in high mechanical strength. There were drawbacks such as lowering and peeling due to weak interfacial strength between the iron plate and the foam. In addition, there are disadvantages such as contamination (correlated with corrosion) on the metal surface due to the acid flowing out of the foam system.
[0003]
On the other hand, as a method for producing a phenol resin foam, for example, an aliphatic polyhydric alcohol di- or triglycidyl ether compound (the main chain excluding glycidyl groups and side chains has 6 or less carbon atoms) alone or a mixture of the compounds, There has been disclosed a method using a glycidyl ether compound-blended phenolic resin that is blended with a phenolic resin and subjected to a heat reaction treatment (see, for example, Patent Document 1). In this method, as the glycidyl ether compound, neopentyl glycol, 1,6-hexanediol diglycidyl ether, butyl glycidyl ether, or the like (the number of carbons in the main chain excluding the glycidyl group and side chain is 6 or less) is used. Yes. However, although the glycidyl ether compound is good in terms of compatibility with the phenol resin, most of the glycidyl ether compound is liquid, so that it is easy to separate with time, and unreacted glycidyl ether is eluted from the phenol resin foam. There is a problem that the product quality tends to be unstable and the product is unstable, and that glycidyl ether tends to adversely affect the foam curing reaction.
[0004]
In addition, an acid catalyst containing resorcinol as a curing accelerator is used as a resole type phenol resin, which is modified with at least one of di- and triglycidyl ether compounds of alkylene glycol or alkylene ether glycol having 2 to 6 carbon atoms. A phenolic resin foam having improved corrosion resistance and moisture absorption resistance has been disclosed (see, for example, Patent Document 2). In this phenol resin foam, as in Patent Document 1, neopentyl glycol, 1,6-hexanediol diglycidyl ether, butyl glycidyl ether, etc. (mainly excluding glycidyl groups and side chains) are used as glycidyl ether compounds. The number of carbon atoms in the chain is 6 or less), but although it is good in terms of compatibility with the phenolic resin, most of them are liquid and have the same problems as described above. Also, when resorcinols are blended in an acidic catalyst, it is difficult to adjust the timing of the foam curing reaction due to heat generated from the high reaction activity of resorcinol, and it is difficult to supply a stable phenol resin foam. It is believed that there is.
Therefore, it has been required to develop a phenol resin foam that is stable in quality, having low water absorption that is stable over time, good adhesion to a metal plate, good foam curing reactivity, and the like.
[0005]
[Patent Document 1]
JP 59-122522 A
[0006]
[Patent Document 2]
JP 59-124940 A
[0007]
[Problems to be solved by the invention]
Under such circumstances, the present invention provides a foamed resol-type phenol which gives a phenolic resin foam having low water absorption that is stable over time and good adhesion to a metal plate, and is excellent in foam curing reactivity. It aims at providing the resin composition and the phenol resin foam using the same.
[0008]
[Means for Solving the Problems]
As a result of intensive studies to achieve the above object, the inventors of the present invention include an acid curing agent, a foaming agent, and a foam stabilizer together with a resol type phenol resin, and also has a specific molecular weight as a modifier. It has been found that the object can be achieved by a composition comprising a mono and / or polyglycidyl ether compound having an epoxy equivalent, preferably a glycidyl ether compound having an aromatic ring or a cycloalkane ring in the molecule in a predetermined ratio. The present invention has been completed based on such findings.
[0009]
That is, the present invention
(1) (A) resol type phenol resin, (B) acidic curing agent, (C) foaming agent, (D) foam stabilizer, (E) modifierAnd (F) liquid stabilizerAnd a mono- and / or polyglycidyl ether compound having a weight average molecular weight of 200 to 3000 and an epoxy equivalent in the range of 150 to 2500 as a modifier of the component (E). It contains in the range of 0.2-20 weight part with respect to 100 weight part,Contains a glycidyl ester compound as a liquid stabilizer for the component (F).A foamable resol-type phenolic resin composition characterized by that.
(2) The glycidyl ether compound of component (E) has 8 or more carbon atoms in the main chain excluding epoxy groups and side chains, and has an aromatic ring and / or a cycloalkane ring in the main chain.(1) aboveFoamable resol-type phenolic resin composition,
(3) The glycidyl ester compound of component (F) is neodecanoic acid glycidyl ester and / or hexahydrophthalic acid glycidyl ester.(1) or (2) aboveFoamable resol-type phenolic resin composition,
(4)The foamable resol-type phenol according to any one of claims 1 to 3, comprising glycidyl ester compound (F) in an amount of 25 to 400 parts by weight with respect to 100 parts by weight of glycidyl ether compound (E). Resin composition.
(5) The foamable resole of (1) to (4), wherein the foaming agent of component (C) is at least one fluorine-containing foaming agent selected from HFC-365mfc, HFC-245fa, and HFE-7100 Type phenolic resin composition,
(6) The foaming of the above (1) to (4), wherein the foaming agent of component (C) is at least one hydrocarbon-based foaming agent selected from n-pentane, isopentane, cyclopentane and 2-methylpentane. Resol type phenolic resin composition, and
(7) A phenol resin foam obtained by foam-curing the foamable resol-type phenol resin composition of (1) to (6) above,
Is to provide.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
The foamable resol-type phenol resin composition of the present invention (hereinafter sometimes referred to as a foamable composition or simply a composition) includes (A) a resol-type phenol resin, (B) an acidic curing agent, and (C) a foaming agent. , (D) a foam stabilizer, (E) a modifier, and (F) a liquid stabilizer.
In the composition of the present invention, the resol type phenol resin used as the component (A) is not particularly limited, and known methods conventionally used for the production of resol type phenol resins, such as phenols and aldehydes, It can be produced by reacting in the presence of an alkaline catalyst in an excessive amount and dehydrating and concentrating. Examples of phenols include phenol, various cresols, various xylenols, and among these, phenol and m-cresol are preferable from the viewpoint of reactivity and curability. These phenols may be used alone or in combination, and may be used in combination with o-cresol, p-cresol, bisphenol and the like. As aldehydes, formaldehyde, paraformaldehyde, polyoxymethylene, trioxane and the like can be used. These aldehydes may be used alone or in combination. Examples of the alkaline catalyst include sodium hydroxide, potassium hydroxide, barium hydroxide, calcium hydroxide, magnesium hydroxide and the like.
[0011]
In the composition of the present invention, examples of the acidic curing agent used as the component (B) include inorganic acids such as phosphoric acid, phosphorous acid, hypophosphorous acid, pyrophosphoric acid, tripolyphosphoric acid, polyphosphoric acid, hydrochloric acid and sulfuric acid, Organic acids such as aryl sulfonic acids such as phenol sulfonic acid, toluene sulfonic acid, xylene sulfonic acid and benzene sulfonic acid, and alkyl sulfonic acids such as methane sulfonic acid are used, but not limited thereto. These acidic curing agents can be used alone or in combination of two or more. Although the usage-amount of an acidic hardening | curing agent is not specifically limited, It is 1-50 weight part normally with respect to 100 weight part of resol type phenol resin of the said (A) component, Preferably it is the range of 5-30 weight part. is there.
[0012]
In the composition of the present invention, as the foaming agent used as the component (C), HFC-365mfc (1,1,1,3,3-pentafluorobutane, manufactured by Solvay Japan), which is a fluorine-containing foaming agent, HFC-245fa (1,1,1,3,3-pentafluoropropane, manufactured by Central Glass Co., Ltd.) and HFE-7100 (nonafluorobutyl methyl ether, manufactured by 3M Co.) are used alone or in combination of two or more. can do. The combination ratio is not particularly limited. Moreover, n-pentane, isopentane, cyclopentane, 2-methylpentane, etc. which are hydrocarbon-type foaming agents can be used individually or in combination of 2 or more types. The combination ratio is not particularly limited. The amount of these foaming agents used is usually in the range of 1 to 20 parts by weight, preferably 1.5 to 15 parts by weight with respect to 100 parts by weight of the resol type phenolic resin as component (A). When the amount of the foaming agent used is less than 1 part by weight, vaporization is rapid, and the foam curing is not balanced, making it difficult to obtain a uniform cell structure. On the other hand, if it exceeds 20 parts by weight, the foaming pressure in the cell and the foam regulating force cannot be balanced, the cell wall is broken, and it is difficult to obtain a homogeneous cell structure. In addition to these blowing agents, volatile organic liquids of about -20 to 100 ° C., which are known blowing agents, such as fluorinated hydrocarbons, chlorinated hydrocarbons, aliphatic hydrocarbons, or a mixture of two or more of them are used. These are blowing agents that promote the destruction of the global environment, such as trichloromonofluoromethane (F-11), trichlorotrifluoroethane (F-113), dichlorotetrafluoroethane (F-114), and the like. Carbon chloride, trichloroethane and the like are not preferred in practice.
Further, these blowing agents and carbonates that generate carbon dioxide, nitroso compounds that generate nitrogen gas, azo compounds, hydrazine derivatives, and the like can be used in combination.
[0013]
Examples of the foam stabilizer used as the component (D) in the composition of the present invention include a surfactant such as a silicone-based ethylene oxide-propylene oxide copolymer, or a polyoxyalkylene adduct such as sorbitan, alkylphenol, castor oil, and the like. Is mentioned. These may be used alone or in combination. The amount used is preferably in the range of usually 0.5 to 10 parts by weight per 100 parts by weight of component (A) resol type phenol resin. If the amount of the foam stabilizer used is less than 0.5 parts by weight, bubbles cannot be stably formed, and a homogeneous cell structure is difficult to obtain (cell size variation and voids are generated). On the other hand, when the amount exceeds 10 parts by weight, the foam regulating force becomes excessive, the bubble wall becomes too thick and becomes stiff and causes cracking.
[0014]
In the composition of the present invention, a monoglycidyl ether compound or a polyglycidyl ether compound is used as a modifier for the component (E). The polyglycidyl ether compound is not particularly limited as long as it has two or more glycidyl groups in the molecule, and examples thereof include diglycidyl ether, triglycidyl ether, and tetraglycidyl ether. These glycidyl ether compounds may be used singly or in combination of two or more.
In the present invention, a glycidyl ether compound having a weight average molecular weight of 200 to 3000 and an epoxy equivalent in the range of 150 to 2500 is used.
[0015]
By using such a glycidyl ether compound, it is possible to prevent elution from the phenol resin foam, and to compound a relatively large amount of the compound, and to exert an adhesive effect with a metal plate, a low water absorption effect of the foam, The foamable composition also exhibits good foam curing reactivity. Furthermore, an increase in the viscosity of the foamable composition can be moderated, and the filling property with a metal panel or the like is improved.
The addition amount of this glycidyl ether compound is 0.2-20 weight part with respect to 100 weight part of resol type phenol resin of (A) component, Preferably it is the range of 0.5-15 weight part. If the amount of glycidyl ether compound added is less than 0.2 parts by weight based on 100 parts by weight of the resol type phenol resin, reaction heat sufficient to shorten the foam curing time cannot be obtained, or the familiarity and adhesion to the metal plate. Improvement may not be obtained or water absorption may not be reduced. Moreover, when the addition amount of a glycidyl ether compound exceeds 20 weight part, a bubble breaking phenomenon will occur at the time of foaming, and it will cause the appearance defect.
[0016]
In the present invention, this glycidyl ether compound has an aromatic group and / or a cycloalkane ring in the main chain having 8 or more carbon atoms in the main chain excluding the epoxy group and the side chain, from the viewpoint of performance. preferable. One or more aromatic rings or cycloalkane rings may be introduced into the main chain, or both the aromatic ring and cycloalkane ring may be introduced. Here, examples of the aromatic ring include a benzene ring and a naphthalene ring. Among these, a benzene ring is preferable, and examples of the cycloalkane ring include a cyclopentane ring, a cyclohexane ring, and a cyclooctane ring. Of these, the cyclohexane ring is preferred.
Examples of such glycidyl ether compounds include monoglycidyl ether compounds such as butylphenyl glycidyl ether, phenol ethylene oxide adduct glycidyl ether, phenol propylene oxide adduct glycidyl ether, and phenol ethylene oxide adduct hydrogenated products. Examples include diglycidyl ether, glycidyl ether of hydrogenated product of propylene oxide adduct of phenol, and diglycidyl ether compounds such as bisphenol A type diglycidyl ether, phenylene diglycidyl ether, tolylene glycidyl ether, and cyclohexylene diglycidyl ether. Bis (glycidoxymethyl) cyclohexane, bis (glycidoxymethyl) benzene, etc. Examples of the silyl ether compound include tris (glycidoxy) benzene, tris (glycidoxy) cyclohexane, tris (glycidoxymethyl) benzene, and tris (glycidoxymethyl) cyclohexane. Examples of the tetraglycidyl ether compound include 1, Examples include 2,4,5-tetrakis (glycidoxymethyl) benzene and 1,2,4,5-tetrakis (glycidoxymethyl) cyclohexane. Furthermore, examples of the polyglycidyl ether compound include glycidyl ethers of phenol novolac resins. These glycidyl ether compounds may be used individually by 1 type, and may be used in combination of 2 or more type.
[0017]
In the composition of the present invention, a glycidyl ester compound is used as a liquid stabilizer for the component (F). This glycidyl ester compound is considered to have a function of assisting compatibility of the glycidyl ether compound with a resol type phenol resin and an acidic curing agent when used in combination with the glycidyl ether compound. A liquid containing a polyglycidyl ether compound such as glycidyl ether, triglycidyl ether, or diglycidyl ether may be accompanied by an increase in viscosity due to polymerization, but the viscosity can be adjusted by using a glycidyl ester compound in combination.
The glycidyl ester compound is not particularly limited as long as it is a glycidyl ester compound of an organic acid, but neodecanoic acid glycidyl ester and hexahydrophthalic acid glycidyl ester are preferable. This glycidyl ester compound may be used individually by 1 type, and may be used in combination of 2 or more type. The addition amount is not particularly limited, but is usually selected in the range of 25 to 400 parts by weight with respect to 100 parts by weight of the glycidyl ether compound of component (E).
[0018]
Various additives can be blended in the foamable resol-type phenol resin composition of the present invention within the range where the object of the present invention is not impaired. For example, it is possible to add an inorganic filler as a flame retardant. Specifically, aluminum hydroxide, aluminosilicate fine hollow particles, talc, clay, calcium hydroxide, boric acid and the like can be used. Boric acid and aluminosilicate fine hollow particles may be added to the acidic curing agent. Also, hardening accelerators such as resorcinol and alkylresorcinol, Shirasu balloon, glass balloon, multi-hard aggregate, inorganic and organic fillers such as metal powder and wood powder, fiber reinforcement such as glass fiber, carbon fiber and aramid fiber You may mix | blend materials etc.
[0019]
In the foamable resol-type phenolic resin composition of the present invention, there is no particular limitation on the blending method of the glycidyl ether compound and the glycidyl ester compound, but when preparing the composition industrially, (1) glycidyl ether compound single solution Alternatively, a glycidyl ester compound is used in combination as a liquid mixture in advance and blended at the production stage of the resol type phenol resin. (2) In front of the foam mixing device, the phenol resin and the glycidyl ether compound alone or the glycidyl ester compound A method of premixing in the same line and leading to a foam mixing device. (3) A glycidyl ether compound alone or a glycidyl ester compound is used in combination with a curing agent during the production of an acidic curing agent to form a curing agent composition. Method, (4) with an acidic curing agent in front of the foam mixing device A method of premixing in the same line by using a lysidyl ether compound alone or in combination with a glycidyl ester compound, and leading to a foam mixing device. And the like, and a method of leading from a separate line to a foam mixing device.
[0020]
The foamable resol-type resin composition of the present invention is blended with such a blending method, a resole-type phenol resin, a glycidyl ether compound and an optionally used glycidyl ester compound, or an acidic curing agent. It can be prepared by blending various additives used as required.
The phenolic resin foam of the present invention is obtained by pouring the foamable resol type phenolic resin composition into a frame or a mold and foaming and curing it at a temperature in the range of ordinary temperature to 120 ° C.
The phenol resin foam thus obtained has good adhesion to a metal plate and exhibits a stable low water absorption over time. The reason for exhibiting good adhesiveness with the metal plate is that the foamable composition has better compatibility with the metal plate, and the effect due to the epoxy resin appears. The reason why the foam has low water absorption is that the acid remaining in the foam is protected by a glycidyl ether compound or a glycidyl ester compound, thereby reducing the affinity with water, and uniform and strong. It is thought to make a closed cell.
[0021]
Furthermore, when considering productivity, foam curing reaction characteristics are required. However, when the glycidyl ether compound and the glycidyl ester compound used in some cases and the acidic curing agent are in contact with each other, a rapid heat generation due to the reaction occurs. Thus, by increasing the internal heat generation of the foam compounding liquid, it is possible to shorten the foam curing time and improve the productivity.
[0022]
【Example】
EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited at all by these examples.
[0023]
Example 1
A four-necked flask was charged with 2000 g of phenol, 2930 g of 37% by weight formalin (formaldehyde / phenol molar ratio 1.7) and 60 g of a 20% by weight aqueous sodium hydroxide solution as a catalyst. The aqueous solution was neutralized to pH 7.0 with a% p-toluenesulfonic acid aqueous solution and dehydrated under reduced pressure to make the water content in the resin 10% by weight or less. The obtained resol type phenol resin had a solid content of 80% by weight, a viscosity of 4000 mPa · s (25 ° C.), a specific gravity of 1.250 (25 ° C.), and a weight average molecular weight of 300. For 100 parts by weight of this resol type phenol resin, 3 parts by weight of L-5420 (silicone surfactant manufactured by Nippon Unicar) as a foam stabilizer and bisphenol A type diglycidyl ether having a weight average molecular weight of 350 as a modifier (Japan) Epoxy Co., Epoxy Equivalent 190) 3.5 parts by weight, Neodecanoic acid glycidyl ester 1.5 parts by weight as a liquid stabilizer, HFC-365mfc (manufactured by Nippon Solvay) 6 parts by weight as a foaming agent, and high speed stirring After mixing, the liquid temperature was adjusted to 30 ° C.
[0024]
Thereafter, 25 parts by weight of 70 wt% p-toluenesulfonic acid as an acidic curing agent was added at 30 ° C., and the mixture was stirred and mixed at high speed for 10 seconds with a homodisper, and then heated to 65 ° C. using the upper and lower surface materials as iron plates. The mixture was immediately poured into a 400 × 400 × 25 mm mold container. The time when the liquid level of the poured liquid starts to rise is cream time (CT), the time when the stick is put inside the foaming liquid and the resistance sharply increases is gel time (GT), and the time when the liquid level finishes rising is the rise time (RT), the foam hardening behavior was confirmed with the tack free time (TFT) as the time when the foam surface layer did not become sticky. After 3 minutes from the start of stirring of the blended stock solution, the foam was taken out, weighed, and the weight of the iron plate was subtracted to obtain the foam density. For the measurement of the adhesive strength between the steel plate and the foam, the test piece was cut out to 50 × 50 × 25 mm, a jig for tensile test was attached to the surface of the iron plate, and the tensile test was performed with a total of 6 at a crosshead speed of 1 mm / min. The adhesive strength was calculated from the average value of the four samples excluding the minimum value. The foam water absorption was measured by cutting a test piece into 100 × 100 × 20 mm (the iron plate portion was cut out) and measuring the water absorption after immersion for 1 month. The above results are shown in Table 1.
[0025]
Example2
In Example 1, 1.5 parts by weight of neodecanoic acid glycidyl esterInstead toThis was carried out in the same manner as in Example 1 except that 1.5 parts by weight of hexahydrophthalic acid glycidyl ester was added. The results are shown in Table 1.
[0026]
Example3
In Example 1, 2.5 parts by weight of bisphenol A type diglycidyl ether (manufactured by Japan Epoxy Co., Ltd., epoxy equivalent 1000) having a weight average molecular weight of 1600 as a modifier, and HFC-365mfc (manufactured by Solvay Japan Co., Ltd.) as a foaming agent Example 1 except that a mixture of 4 parts by weight and 0.6 part by weight of HFE-7100 (manufactured by Nippon Solvay) was used and the amount of neodecanoic acid glycidyl ester was changed to 2.5 parts by weight. Carried out. The results are shown in Table 1.
[0027]
Example 4
3.5 parts by weight of bisphenol A type diglycidyl ether (manufactured by Japan Epoxy Co., Ltd., epoxy equivalent 190) having a weight average molecular weight of 350 as a modifier, 30 parts by weight of 70% by weight p-toluenesulfonic acid as an acid curing agent, and liquid stabilization After mixing 1.5 parts by weight of neodecanoic acid glycidyl ester as an agent to produce 35 parts by weight of an acidic curing agent blend, the temperature was adjusted to 30 ° C..
On the other hand, with respect to 100 parts by weight of the same resol type phenolic resin as in Example 1, 3 parts by weight of L-5420 (above) and 6 parts by weight of HFC365mfc (above) as a foam stabilizer are added and mixed at high speed. After that, the liquid temperature was adjusted to 30 ° C. Next, this was mixed with 35 parts by weight of the acidic curing agent blend at high speed with a homodisper for 10 seconds, and then the same as in Example 1. The results are shown in Table 1.
[0028]
Example5
Example4In Example 1, except that the amount of 70% by weight p-toluenesulfonic acid was changed to 25 parts by weight and resole-type phenol resin, diglycidyl ether and 70% by weight p-toluenesulfonic acid were added separately.4It carried out like. The results are shown in Table 1.
[0029]
Example6
In Example 1, it implemented like Example 1 except having used 6 weight part of n-pentane as a foaming agent. The results are shown in Table 1.
[0030]
Example7
In Example 1, it carried out like Example 1 except having changed the quantity of bisphenol A type diglycidyl ether into 15 weight part, and changing the quantity of neodecanoic acid glycidyl ester into 7.5 weight part. The results are shown in Table 1.
[0031]
Comparative Example 1
In Example 1, it implemented like Example 1 except not having added bisphenol A type diglycidyl ether and neodecanoic acid diglycidyl ester. The results are shown in Table 1.
[0032]
Comparative Example 2
In Example 1, 3.5 parts by weight of bisphenol A type diglycidyl ether having a weight average molecular weight of 3700 (manufactured by Japan Epoxy Co., Ltd., epoxy equivalent 2800) was used as a modifier, and the amount of neodecanoic acid glycidyl ester added was 3.5. It implemented like Example 1 except having changed into the weight part. The results are shown in Table 1.
[0033]
Comparative Example 3
Example4In this, 3.5 parts by weight of bisphenol A type diglycidyl ether (manufactured by Japan Epoxy Co., Ltd., epoxy equivalent 2800) having a weight average molecular weight of 3700 was used as a modifier, and the amount of neodecanoic acid glycidyl ester was 3.5 parts by weight and 70 parts by weight. The same operation as in Example 6 was carried out except that the amount of weight% p-toluenesulfonic acid was changed to 25 parts by weight. The results are shown in Table 1.
[0034]
Comparative Example 4
In Example 1, it carried out like Example 1 except having changed the quantity of bisphenol A type diglycidyl ether into 0.1 weight part, and not using neodecanoic acid glycidyl ester. The results are shown in Table 1.
[0035]
Comparative Example 5
In Example 1, it carried out like Example 1 except having changed the quantity of bisphenol A type diglycidyl ether into 25 weight part, and not using neodecanoic acid glycidyl ester. The results are shown in Table 1.
[0036]
[Table 1]
[0037]
[Table 2]
[0038]
[Table 3]
[0039]
[Notes] 1) Although bisphenol A type diglycidyl ether and neodecanoic acid glycidyl ester were blended in the resol type phenol resin, the bisphenol A type diglycidyl ether was not sufficiently dissolved, the stability of the resin liquid was poor, and foam evaluation could not.
[0040]
[Table 4]
[0041]
[note]
2) Although bisphenol A type diglycidyl ether and neodecanoic acid glycidyl ester were blended in the acidic curing agent, the dissolution of bisphenol A type diglycidyl ether was insufficient, the stability of the curing agent liquid was poor, and foaming evaluation was not possible. .
3) Bubble measurement occurred during foaming and was not measured due to poor appearance of the foam.
[0042]
【The invention's effect】
According to the present invention, a foamable resol-type phenolic resin composition that gives a phenolic resin foam having low water absorption that is stable over time, good adhesion to a metal plate, and the like, and is excellent in foam curing reactivity is provided. can do.
Moreover, by foaming and curing the foamable resol-type phenol resin composition, a phenol resin foam having the above-described excellent characteristics can be obtained.
Claims (7)
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