JP4060445B2

JP4060445B2 - Array antenna feeder

Info

Publication number: JP4060445B2
Application number: JP17134498A
Authority: JP
Inventors: 弘晶中畔; 博有賀; 武志佐倉; 徳充根岸; 勝田中; 仁士水溜
Original assignee: Mitsubishi Electric Corp
Current assignee: Mitsubishi Electric Corp
Priority date: 1998-06-18
Filing date: 1998-06-18
Publication date: 2008-03-12
Anticipated expiration: 2018-06-18
Also published as: JP2000013138A

Description

【０００１】
【発明の属する技術分野】
この発明は、例えばマイクロ波無線伝送による移動体通信用としてアンテナの指向性を位相制御により任意の方向に指向するフェーズドアレーアンテナにおいて、アンテナを所望の励振振幅位相の信号で給電するために増幅器あるいは移相器を搭載した送受信用モジュールを多数配列したアレーアンテナ給電装置に関するものである。
【０００２】
【従来の技術】
図１１は従来のアレーアンテナ給電装置を示したもので、１は増幅器および移相器等の能動素子を有するマイクロ波集積回路、２はマイクロ波集積回路を搭載し保護するための気密パフケージ、３はマイクロ波集積回路に所望のマイクロ波信号を給電するための給電基板、４はマイクロ波集積回路に電源および制御信号を供給するための制御回路、５はマイクロ波信号の入出力端子、６は制御端子、７はシャーシである。
【０００３】
上記の記述の通り、従来のアレーアンテナ給電装置では複数の入力端子５から入力されたマイクロ波信号を増幅器および移相器等のマイクロ波集積回路２と給電回路３から構成され、個々の接続端子間をワイヤーボンディング等でマイクロ波信号の接続を図ったモジュールにより所望の振幅、位相に変換した後出力端子５から出力される。振幅、位相の制御には増幅器および移相器への制御回路４からの電源および制御信号により各系統が独立に制御可能となる。このモジュールは全体がシャーシ７によって保持されるが、閉じられた領域においてはマイクロ波信号は互いに結合により干渉する。干渉を避けるため電気的に導通のある材料を壁に設けた構成によって、マイクロ波を遮断する必要がある。また、同一系統間でも系統内でのマイクロ波の結合を避けるため、気密パッケージ１または給電基板２を搭載するシャーシ７の幅をマイクロ波の導波管モードが伝搬しない寸法まで狭くする必要がある。従って、気密パッケージ１と制御回路４との間についても金属壁が必要となる。また、金属で構成されたシャーシ７はマイクロ波集積回路２の排熱用のヒートシンクとしても機能している。
【０００４】
【発明が解決しようとする課題】
以上のように従来のアレーアンテナ給電装置は個々の気密パッケージおよび給電回路間の結合による干渉を防ぐため、系統毎に壁を設けた複雑なシャーシが必要となり、高密度な実装ができないという課題があった。
【０００５】
また、マイクロ波集積回路あるいは給電回路の実装されるシャーシの幅をマイクロ波の導波管モードが伝搬しない寸法まで狭くする必要があるため、制御回路とマイクロ波集積回路との間にも壁を設ける必要があり、高密度な実装ができないという課題があった。
【０００６】
この発明は上記の課題を解決するためになされたもので、モジュール各系統毎の分離および制御回路とマイクロ波集積回路との分離のために壁を有する複雑なシャーシを不要とし、アレーアンテナ給電装置を構成する複数のモジュールを高密度で実装することを目的としている。
【０００７】
【課題を解決するための手段】
第１の発明によるアレーアンテナ給電装置は、複数の金属地導体層と金属地導体層間に設けた給電回路と制御回路とを含む複数の金属回路層と、上記金属回路層と金属地導体層間に形成した誘電体層と、最上層と最下層に形成した金属地導体層内に設けられ気密パッケージに覆われる範囲内に設けられた接続端子と、最上層と最下層を同電位とするために上記多層基板の側面全周を覆う金属層または最外周全周に設けた複数個のシールド用スルーホールと、上記金属回路層間を接続する金属柱または層間接続用スルーホールと、上記金属回路層内に設けられ高周波遮断スルーホールにより上記金属地導体層と同電位となる高周波遮断線路とによって一体形成された多層基板上に、増幅器および移相器等の能動素子を有するマイクロ波集積回路と、多層基板への取付面内に電源及び信号の接続端子とを備えた複数個の気密パッケージを搭載し、一個の多層基板上に複数個のモジュールを構成する。
【０００８】
また、第２の発明によるアレーアンテナ給電装置は、金属地導体層と金属地導体層間に設けた給電回路と制御回路とを含む複数の金属回路層と、上記金属回路層と金属地導体層間に形成した誘電体層と、最上層と最下層に形成した金属地導体層内に設けられ気密パッケージに覆われる範囲内に設けられた接続端子と、上記金属回路層に入出力端子を形成する複数の彫り込みと、最上層と最下層を同電位とするために上記多層基板の側面全周を覆う金属層または最外周全周に設けた複数個のシールド用スルーホールと、上記金属回路層間を接続する金属柱または層間接続用スルーホールと、上記金属回路層内に設けられ高周波遮断スルーホールにより上記金属地導体層と同電位となる高周波遮断線路とによって一体形成された多層基板上に、増幅器および移相器等の能動素子を有するマイクロ波集積回路と、多層基板への取付面内に電源及び信号の接続端子とを備えた複数個の気密パッケージを搭載し、一個の多層基板上に複数個のモジュールを構成する。
【０００９】
また、第３の発明によるアレーアンテナ給電装置は、金属地導体層と金属地導体層間に設けた給電回路と制御回路とを含む複数の金属回路層と、上記金属回路層と金属地導体層間に形成した誘電体層と、最上層と最下層に形成した金属地導体層内に設けられ気密パッケージに覆われる範囲内に設けられた接続端子と、最上層と最下層を同電位とするために上記多層基板の側面全周を覆う金属層または最外周全周に設けた複数個のシールド用スルーホールと、上記金属回路層間を接続する金属柱または層間接続用スルーホールと、上記金属回路層内に設けられ高周波遮断スルーホールにより上記金属地導体層と同電位となる高周波遮断線路とによって一体形成された多層基板上に、増幅器および移相器等の能動素子を有するマイクロ波集積回路と、多層基板への取付面内に電源及び信号の接続端子と、取付面内に第２の給電制御回路とを備えた複数個の気密パッケージを搭載し、一個の多層基板上に複数個のモジュールを構成する。
【００１０】
また、第４の発明によるアレーアンテナ給電装置は、金属地導体層と金属地導体層間に設けた給電回路と制御回路とを含む複数の金属回路層と、上記金属回路層と金属地導体層間に形成した誘電体層と、最上層と最下層に形成した金属地導体層内に設けられ気密パッケージに覆われる範囲内に設けられた接続端子と、気密パッケージの取付面内に気密パッケージに設けられた第２の給電制御回路が接触する領域に設けた複数の彫り込みと、最上層と最下層を同電位とするために上記多層基板の側面全周を覆う金属層または最外周全周に設けた複数個のシールド用スルーホールと、上記金属回路層間を接続する金属柱または層間接続用スルーホールと、上記金属回路層内に設けられ高周波遮断スルーホールにより上記金属地導体層と同電位となる高周波遮断線路とによって一体形成された多層基板上に、増幅器および移相器等の能動素子を有するマイクロ波集積回路と、多層基板への取付面内に電源及び信号の接続端子と、取付面内に能動素子あるいは受動素子を搭載した第２の給電制御回路とを備えた複数個の気密パッケージを搭載し、一個の多層基板上に複数個のモジュールを構成する。
【００１１】
また、第５の発明によるアレーアンテナ給電装置は、金属地導体層と金属地導体層間に設けた給電回路と制御回路とを含む複数の金属回路層と、上記金属回路層と金属地導体層間に形成した誘電体層と、最上層と最下層に形成した金属地導体層内に設けられ気密パッケージに覆われる範囲内に設けられた接続端子と、気密パッケージに覆われる領域に設けた第２の給電制御回路と、最上層と最下層を同電位とするために上記多層基板の側面全周を覆う金属層または最外周全周に設けた複数個のシールド用スルーホールと、上記金属回路層間を接続する金属柱または層間接続用スルーホールと、上記金属回路層内に設けられ高周波遮断スルーホールにより上記金属地導体層と同電位となる高周波遮断線路とによって一体形成された多層基板上に、増幅器および移相器等の能動素子を有するマイクロ波集積回路と、多層基板への取付面内に電源及び信号の接続端子とを備えた複数個の気密パッケージを搭載し、一個の多層基板上に複数個のモジュールを構成する。
【００１２】
また、第６の発明によるアレーアンテナ給電装置は、金属地導体層と金属地導体層間に設けた給電回路と制御回路とを含む複数の金属回路層と、上記金属回路層と金属地導体層間に形成した誘電体層と、最上層と最下層に形成した金属地導体層内に設けられ気密パッケージに覆われる範囲内に設けられた接続端子と、気密パッケージに覆われる領域に設けた能動素子あるいは受動素子を搭載した第２の給電制御回路と、最上層と最下層を同電位とするために上記多層基板の側面全周を覆う金属層または最外周全周に設けた複数個のシールド用スルーホールと、上記金属回路層間を接続する金属柱または層間接続用スルーホールと、上記金属回路層内に設けられ高周波遮断スルーホ−ルにより上記金属地導体層と同電位となる高周波遮断線路とによって一体形成された多層基板上に、増幅器および移相器等の能動素子を有するマイクロ波集積回路と、多層基板への取付面内に電源及び信号の接続端子と、上記第２の給電制御回路が接触する領域に設けた１個または複数の彫り込みとを備えた複数個の気密パッケージを搭載し、一個の多層基板上に複数個のモジュールを構成する。
【００１３】
また、第７の発明によるアレーアンテナ給電装置は、金属地導体層と金属地導体層間に設けた給電回路と制御回路とを含む複数の金属回路層と、上記金属回路層と金属地導体層間に形成した誘電体層と、最上層と最下層に形成した金属地導体層内に設けられ気密パッケージに覆われる範囲内に設けられた接続端子と、気密パッケージと接続する領域内に設けた最上層と最下層間を貫通する１個または複数個の貫通金属柱と、最上層と最下層を同電位とするために上記多層基板の側面全周を覆う金属層または最外周全周に設けた複数個のシールド用スルーホールと、上記金属回路層間を接続する金属柱または層間接続用スルーホールと、上記金属回路層内に設けられ高周波遮断スルーホールにより上記金属地導体層と同電位となる高周波遮断線路とによって一体形成された多層基板上に、増幅器および移相器等の能動素子を有するマイクロ波集積回路と、多層基板への取付面内に電源及び信号の接続端子とを備えた複数個の気密パッケージを搭載し、一個の多層基板上に複数個のモジュールを構成する。
【００１４】
【発明の実施の形態】
実施の形態１．
図１はこの発明の実施の形態１を示すアレーアンテナ給電装置の斜視図であり、図２はこの発明の実施の形態１を示す上面図であり、図３はこの発明の実施の形態１の図１に示すＡ−Ａ’面での断面図である。図において８は多層の金属層と誘電体層により一体成形された多層基板、９は多層基板８の最上層と最下層を同電位とするために上記多層基板の側面全周を覆う側面金属層、１０は気密パッケージ２の多層基板８への取付面内と最上層と最下層に形成した金属地導体層内に設けられ気密パッケージ２に覆われる範囲内とに設けられた電源及び信号の接続端子、１１は多層基板８の金属層に設けられたマイクロ波信号の給電線路、１２は多層基板８の金属層に設けられた電源と制御信号を供給する制御線路、１３は給電線路１１および制御線路１２を構成する金属層間に設けた地導体層、１４は給電線路１１および制御線路１２の異なる金属層間を接続する層間接続用スルーホール、１５は給電線路１１および制御線路１２を構成する金属層と地導体層１３との間に設けた誘電体層、１６は地導体層１３間を接続する高周波遮断スルーホール、１７は高周波遮断バイアホール１６に貫通されるように給電線路１１を構成する金属層内に設けた高周波遮断線路を示す。上記一体形成した多層基板８上に増幅器および移相器等の能動素子を有するマイクロ波集積回路を実装した複数個の気密パッケージを搭載することにより、複数個のモジュールを搭載したアレーアンテナ給電装置を構成する。
【００１５】
次に実施の形態１のアレーアンテナ給電装置の動作について説明する。アレーアンテナ給電装置を構成する複数のモジュールの入出力端子５より入力されたマイクロ波信号は、層間接続線路１４を介して多層基板８内にトリプレート線路等で形成された給電線路１１に励振される。マイクロ波信号は、層間接続用スルーホール１４および接続端子１０を介して多層基板８の表面に実装された増幅器および移相器等のマイクロ波集積回路２を搭載した気密パッケージ２と給電線路１１とを伝搬する。モジュール各系統において、マイクロ波信号は複数のマイクロ波集積回路２と接続端子１０を伝搬することにより所望の振幅、位相に変換された後、入出力端子５より出力される。ここで、マイクロ波集積回路２内に設けられた増幅器への電源供給および移相器の位相制御信号は制御端子６から入力され、層間接続用スルーホール１４と多層基板８内に形成された制御線路１２と接続端子１０を介して接続される。多層基板８内を伝搬するマイクロ波信号は最上層および最下層に設けた地導体層１３と両方の層間を同電位で接続する側面金属層９により外部から遮断され、干渉を避けるためのシャーシが不要となる。また、モジュール各系統を構成する給電線路１１は隣接して設けた高周波遮断線路１７を高周波遮断スルーホール１６で地導体層１３と導電位とすることにより側面電気壁を構成し、モジュール間の干渉を抑えることが可能となる。
【００１６】
ここでは多層基板８の片面のみに気密パッケージを搭載した例について説明したが、両面に搭載することも可能である。
【００１７】
また、ここでは多層基板８の最上層および最下層を側面金属層９により同電位で接続する例について説明したが、多層基板８の最外周全集に複数個のシールド用スルーホールを形成することにより同様の効果を得ることも可能である。
【００１８】
実施の形態２．
次に実施の形態２のアレーアンテナ給電装置の動作について説明する。図４はこの発明の実施の形態２を示すアレーアンテナ給電装置の斜視図である。多層基板８により構成されるモジュールの外部とのマイクロ波信号の入出力端子５を接続線路１２が形成される金属層内に設け、多層基板８の最上層の地導体層１３から入出力端子５が形成される金属層までを彫り込むことにより形成し、層間接続用スルーホール１４が不要となり、マイクロ波信号の損失を改善することができる。
【００１９】
実施の形態３．
次に実施の形態３のアレーアンテナ給電装置の動作について説明する。多層基板８へ取り付けられる気密パッケージ２は取付面内に電源及び信号の接続端子と、取付面内に第２の給電制御回路を形成することにより実施の形態１のアレーアンテナ給電装置と比べて実装密度を高めることが可能となる。また、取り付け面内に第２の給電制御回路を形成することによりマイクロ波信号は外部から遮断され、干渉を避けるためのシャーシが不要となる。
【００２０】
実施の形態４．
次に実施の形態４のアレーアンテナ給電装置の動作について説明する。図５はこの発明の実施の形態４を示すアレーアンテナ給電装置の斜視図であり、図６はこの発明の実施の形態４を示す上面図であり、図７はこの発明の実施の形態４の図６に示すＢ−Ｂ’面での断面図である。図において１８は多層基板８内の気密パッケージに設けられた給電制御回路−２が接触する領域に設けた複数の彫り込み、１９は気密パッケージ内の多層基板への取付面内に設けた、能動素子あるいは受動素子を搭載した第２の給電制御回路を示す。多層基板８へ取り付けられる気密パッケージ２は取付面内に電源及び信号の接続端子と、多層基板８に設けた彫り込み１８により能動素子あるいは受動素子を搭載した第２の給電制御回路１９を形成することにより同一領域に複数の給電または制御回路の実装が可能になり、実施の形態３のアレーアンテナ給電装置と比べて実装密度を高めることが可能となる。
【００２１】
実施の形態５．
次に実施の形態５のアレーアンテナ給電装置の動作について説明する。図８はこの発明の実施の形態５を示すアレーアンテナ給電装置の斜視図である。多層基板８の最上層及び最下層面内の気密パッケージ２に覆われる領域に第２の給電制御回路１９を形成することにより実施の形態１のアレーアンテナ給電装置と比べて実装密度を高めることが可能となる。また、取り付け面内に第２の給電制御回路１９を形成することによりマイクロ波信号は外部から遮断され、干渉を避けるためのシャーシが不要となる。
【００２２】
実施の形態６．
次に実施の形態６のアレーアンテナ給電装置の動作について説明する。図９はこの発明の実施の形態６の図６に示すＣ−Ｃ’面でのアレーアンテナ給電装置の断面図である。
多層基板８の最上層及び最下層面内に、気密パッケージ２に設けた彫り込み１８を設けて能動素子あるいは受動素子を搭載した第２の給電制御回路１９を形成することにより同一領域に複数の給電または制御回路の実装が可能になり、実施の形態５のアレーアンテナ給電装置と比べて実装密度を高めることが可能となる。
【００２３】
実施の形態７．
次に実施の形態７のアレーアンテナ給電装置の動作について説明する。図１０はこの発明の実施の形態７の図１に示すＡ−Ａ’面でのアレーアンテナ給電装置の断面図である。図において２０は多層基板８内の気密パッケージ２の取付面内に設けた貫通金属柱を示す。気密パッケージ２に発熱が問題となる能動素子を搭載した場合においては、多層基板８を介して排熱する必要性がある。多層基板８内の気密パッケージ２の取付面内に設けた貫通金属柱２０は上記能動素子で発生した熱を効率良く多層基板外に排熱する通路となり、発熱する能動素子の搭載が可能となる。
【００２４】
【発明の効果】
第１の発明によれば、複数系統の高周波信号を制御するモジュールを同一の基板内に一体形成し、金属シャーシによる干渉除去が不要となることにより、高密度実装が可能となる。
【００２５】
また、第２の発明によれば、多層基板内に形成した給電回路を損失を低減してモジュール外に取り出すことが可能となる。
【００２６】
また、第３の発明によれば、同一層数の多層基板において同一領域により多くの給電回路または制御回路の形成が可能となり、より高密度実装化が可能となる。
【００２７】
また、第４の発明によれば、同一層数の多層基板において同一領域により多くの能動素子または受動素子を搭載する給電制御回路の形成が可能となり、より高密度実装化が可能となる。
【００２８】
また、第５の発明によれば、同一層数の多層基板において同一領域により多くの給電回路または制御回路の形成が可能となり、より高密度実装化が可能となる。
【００２９】
また、第６の発明によれば、同一層数の多層基板において同一領域により多くの能動素子または受動素子を搭載する給電制御回路の形成が可能となり、より高密度実装化が可能となる。
【００３０】
また、第７の発明によれば、気密パッケージに発熱が問題となる能動素子を搭載したマイクロ波集積回路の搭載が可能となる。
【図面の簡単な説明】
【図１】この発明によるアレーアンテナ給電装置の実施の形態１を示す斜視図である。
【図２】この発明によるアレーアンテナ給電装置の実施の形態１および実施形態７を示す上面図である。
【図３】この発明によるアレーアンテナ給電装置の実施の形態１の図１に示すＡ−Ａ’面での断面図である。
【図４】この発明によるアレーアンテナ給電装置の実施の形態２を示す斜視図である。
【図５】この発明によるアレーアンテナ給電装置の実施の形態４を示す斜視図である。
【図６】この発明によるアレーアンテナ給電装置の実施の形態４および実施形態６を示す上面図である。
【図７】この発明によるアレーアンテナ給電装置の実施の形態４の図６に示すＢ−Ｂ’面での断面図である。
【図８】この発明によるアレーアンテナ給電装置の実施の形態５および実施形態６を示す斜視図である。
【図９】この発明によるアレーアンテナ給電装置の実施の形態６の図６に示すＣ−Ｃ’面を示す断面図である。
【図１０】この発明によるアレーアンテナ給電装置の実施の形態７の図１に示すＡ−Ａ’面での断面図である。
【図１１】従来のアレーアンテナ給電装置を示す上面図である。
【符号の説明】
１集積回路、２気密パッケージ、３給電基板、４制御回路、５入出力端子、６制御端子、７シャーシ、８多層基板、９側面金属層、１０接続端子、１１給電線路、１２制御線路、１３地導体層、１４層間接続用スルーホール、１５誘電体層、１６高周波遮断スルーホール、１７高周波遮断線路、１８彫り込み部、１９制御給電回路−２、２０貫通金属柱。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a phased array antenna that directs the directivity of an antenna in an arbitrary direction by phase control, for example, for mobile communication by microwave radio transmission, in order to feed the antenna with a signal having a desired excitation amplitude and phase. The present invention relates to an array antenna feeding device in which a large number of transmission / reception modules equipped with phase shifters are arranged.
[0002]
[Prior art]
FIG. 11 shows a conventional array antenna feeding apparatus, in which 1 is a microwave integrated circuit having active elements such as an amplifier and a phase shifter, 2 is an airtight package for mounting and protecting the microwave integrated circuit, 3 Is a power supply substrate for supplying a desired microwave signal to the microwave integrated circuit, 4 is a control circuit for supplying power and control signals to the microwave integrated circuit, 5 is an input / output terminal for the microwave signal, and 6 is A control terminal 7 is a chassis.
[0003]
As described above, in the conventional array antenna power supply apparatus, the microwave signals input from the plurality of input terminals 5 are configured by the microwave integrated circuit 2 and the power supply circuit 3 such as amplifiers and phase shifters, and are connected to the individual connection terminals. The signal is output from the output terminal 5 after being converted into a desired amplitude and phase by a module in which a microwave signal is connected by wire bonding or the like. For controlling the amplitude and phase, each system can be controlled independently by the power supply and control signal from the control circuit 4 to the amplifier and the phase shifter. This module is entirely held by the chassis 7, but in the closed area the microwave signals interfere with each other by coupling. In order to avoid interference, it is necessary to cut off the microwave by a structure in which an electrically conductive material is provided on the wall. Further, in order to avoid coupling of microwaves in the same system, the width of the chassis 7 on which the hermetic package 1 or the power supply substrate 2 is mounted needs to be narrowed to such a dimension that the microwave waveguide mode does not propagate. . Therefore, a metal wall is required between the hermetic package 1 and the control circuit 4. The chassis 7 made of metal also functions as a heat sink for exhaust heat of the microwave integrated circuit 2.
[0004]
[Problems to be solved by the invention]
As described above, the conventional array antenna power supply apparatus requires a complicated chassis with walls for each system in order to prevent interference due to coupling between individual airtight packages and power supply circuits, and there is a problem that high-density mounting cannot be performed. there were.
[0005]
In addition, since it is necessary to reduce the width of the chassis on which the microwave integrated circuit or the power feeding circuit is mounted so that the microwave waveguide mode does not propagate, there is a wall between the control circuit and the microwave integrated circuit. There is a problem that it is necessary to provide high-density mounting.
[0006]
The present invention has been made to solve the above-described problems, and eliminates the need for a complicated chassis having walls for separating each module system and separating the control circuit and the microwave integrated circuit. The purpose of this is to mount a plurality of modules constituting a high density.
[0007]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided an array antenna power feeding device including a plurality of metal circuit layers including a plurality of metal ground conductor layers, a power supply circuit provided between the metal ground conductor layers and a control circuit, and the metal circuit layer and the metal ground conductor layer. In order to make the uppermost layer and the lowermost layer have the same potential, the formed dielectric layer, the connection terminal provided within the metal ground conductor layer formed on the uppermost layer and the lowermost layer and covered by the hermetic package A metal layer covering the entire circumference of the multilayer substrate or a plurality of shielding through holes provided on the outermost circumference, a metal column or interlayer connection through hole connecting the metal circuit layers, and the metal circuit layer A microwave integrated circuit having active elements such as an amplifier and a phase shifter on a multilayer substrate integrally formed by a high-frequency cutoff line provided at a high-frequency cutoff through-hole and having the same potential as that of the metal ground conductor layer , Equipped with a plurality of air-tight package with a contact of the power and signal in the mounting surface of the multilayer substrate to form a plurality of modules in one of the multi-layer substrate.
[0008]
According to a second aspect of the present invention, there is provided an array antenna power feeding device including a plurality of metal circuit layers including a metal ground conductor layer and a power supply circuit provided between the metal ground conductor layers and a control circuit, and the metal circuit layer and the metal ground conductor layer. A plurality of dielectric layers formed, a connection terminal provided in a metal ground conductor layer formed in the uppermost layer and the lowermost layer and covered within an airtight package, and a plurality of input / output terminals formed in the metal circuit layer The metal circuit layer is connected to a metal layer that covers the entire side surface of the multilayer substrate or a plurality of shielding through holes provided on the outermost periphery so that the uppermost layer and the lowermost layer have the same potential. On a multilayer substrate integrally formed by a metal pillar or through hole for interlayer connection and a high frequency cutoff line provided in the metal circuit layer and having the same potential as the metal ground conductor layer by a high frequency cutoff through hole. A plurality of hermetic packages having a microwave integrated circuit having active elements such as a phase shifter and a phase shifter, and power and signal connection terminals in a mounting surface to the multilayer substrate are mounted on one multilayer substrate. Configure multiple modules.
[0009]
According to a third aspect of the present invention, there is provided an array antenna power feeding device including a plurality of metal circuit layers including a metal ground conductor layer and a power supply circuit provided between the metal ground conductor layers and a control circuit, and the metal circuit layer and the metal ground conductor layer. In order to make the uppermost layer and the lowermost layer have the same potential, the formed dielectric layer, the connection terminal provided within the metal ground conductor layer formed on the uppermost layer and the lowermost layer and covered by the hermetic package A metal layer covering the entire circumference of the multilayer substrate or a plurality of shielding through holes provided on the outermost circumference, a metal column or interlayer connection through hole connecting the metal circuit layers, and the metal circuit layer A microwave integrated circuit having active elements such as an amplifier and a phase shifter on a multilayer substrate integrally formed by a high-frequency cutoff line provided at a high-frequency cutoff through-hole and having the same potential as that of the metal ground conductor layer A plurality of airtight packages having power and signal connection terminals in the mounting surface to the multilayer substrate and a second power supply control circuit in the mounting surface are mounted, and a plurality of modules are mounted on one multilayer substrate. Configure.
[0010]
According to a fourth aspect of the present invention, there is provided an array antenna feeding apparatus comprising: a plurality of metal circuit layers including a metal ground conductor layer and a power supply circuit provided between the metal ground conductor layers and a control circuit; and the metal circuit layer and the metal ground conductor layer. Provided in the hermetic package within the dielectric layer formed, the connection terminals provided in the metal ground conductor layer formed in the uppermost layer and the lowermost layer and covered by the hermetic package, and the mounting surface of the hermetic package In addition, a plurality of engravings provided in a region where the second power supply control circuit is in contact and a metal layer covering the entire circumference of the side surface of the multilayer substrate or the outermost circumference to make the uppermost layer and the lowermost layer have the same potential. A plurality of shield through-holes, metal pillars or interlayer connection through-holes connecting the metal circuit layers, and high-frequency cutoff through-holes provided in the metal circuit layers have the same potential as the metal ground conductor layer. A microwave integrated circuit having active elements such as amplifiers and phase shifters on a multilayer substrate integrally formed with a high-frequency cutoff line, a connection terminal for a power source and a signal in a mounting surface to the multilayer substrate, and a mounting surface A plurality of hermetic packages including a second power supply control circuit having active elements or passive elements mounted thereon are mounted, and a plurality of modules are formed on one multilayer substrate.
[0011]
According to a fifth aspect of the present invention, there is provided an array antenna power feeding device including a plurality of metal circuit layers including a metal ground conductor layer and a power feed circuit provided between the metal ground conductor layers and a control circuit, and the metal circuit layer and the metal ground conductor layer. The formed dielectric layer, the connection terminal provided in the metal ground conductor layer formed in the uppermost layer and the lowermost layer and covered by the hermetic package, and the second provided in the region covered by the hermetic package A power supply control circuit, a metal layer covering the entire side surface of the multilayer substrate or the plurality of shielding through holes provided on the outermost periphery to make the uppermost layer and the lowermost layer have the same potential, and the metal circuit layer On a multi-layer substrate integrally formed by a metal pillar or interlayer connection through hole to be connected and a high frequency cutoff line provided in the metal circuit layer and having the same potential as the metal ground conductor layer by a high frequency cutoff through hole A microwave integrated circuit having active elements such as an amplifier and a phase shifter, and a plurality of hermetic packages having power supply and signal connection terminals in the mounting surface to the multilayer substrate are mounted on one multilayer substrate. Configure multiple modules.
[0012]
According to a sixth aspect of the present invention, there is provided an array antenna power feeding device comprising: a plurality of metal circuit layers including a metal ground conductor layer and a power feed circuit provided between the metal ground conductor layers and a control circuit; and the metal circuit layer and the metal ground conductor layer. A dielectric layer formed, a connection terminal provided in a metal ground conductor layer formed in the uppermost layer and the lowermost layer and covered by the hermetic package, and an active element provided in a region covered by the hermetic package or A second power supply control circuit having passive elements mounted thereon, and a plurality of shield through holes provided on the metal layer covering the entire side surface of the multilayer substrate or on the entire outer periphery so that the uppermost layer and the lowermost layer have the same potential Holes, metal pillars or interlayer connection through-holes connecting the metal circuit layers, and a high-frequency cutoff line provided in the metal circuit layer and having the same potential as the metal ground conductor layer by a high-frequency cutoff through hole Therefore, a microwave integrated circuit having active elements such as an amplifier and a phase shifter on the integrally formed multilayer substrate, a connection terminal for a power source and a signal in a mounting surface to the multilayer substrate, and the second power supply control circuit A plurality of hermetic packages having one or a plurality of engravings provided in a region in contact with each other are mounted, and a plurality of modules are formed on one multilayer substrate.
[0013]
According to a seventh aspect of the present invention, there is provided an array antenna feeding apparatus comprising: a plurality of metal circuit layers including a metal ground conductor layer, a power feed circuit provided between the metal ground conductor layers and a control circuit; and the metal circuit layer and the metal ground conductor layer. The formed dielectric layer, the connection terminals provided in the range covered with the hermetic package provided in the metal ground conductor layers formed in the uppermost layer and the lowermost layer, and the uppermost layer provided in the region connected to the hermetic package And one or a plurality of penetrating metal pillars penetrating the lowermost layer, and a metal layer covering the entire side surface of the multilayer substrate or a plurality of outermost outermost circumferences in order to make the uppermost layer and the lowermost layer have the same potential. High-frequency cutoff that has the same potential as that of the metal ground conductor layer by a through-hole for shielding, a metal pillar or through-hole for connecting the metal circuit layers, and a high-frequency cutoff through hole provided in the metal circuit layer line And a plurality of airtight devices including a microwave integrated circuit having active elements such as an amplifier and a phase shifter on a multilayer substrate integrally formed, and a power supply and signal connection terminal in a mounting surface to the multilayer substrate. A package is mounted, and a plurality of modules are formed on one multilayer substrate.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
FIG. 1 is a perspective view of an array antenna power feeding apparatus showing Embodiment 1 of the present invention, FIG. 2 is a top view showing Embodiment 1 of the present invention, and FIG. 3 is Embodiment 1 of the present invention. It is sectional drawing in the AA 'surface shown in FIG. In the figure, 8 is a multilayer substrate integrally formed of a multilayer metal layer and a dielectric layer, and 9 is a side metal layer that covers the entire side surface of the multilayer substrate so that the uppermost layer and the lowermost layer of the multilayer substrate 8 have the same potential. Reference numeral 10 denotes a connection between a power supply and a signal provided in the surface of the hermetic package 2 attached to the multilayer substrate 8 and in the metal ground conductor layer formed in the uppermost layer and the lowermost layer and covered by the hermetic package 2. Terminal 11, a microwave signal feed line provided on the metal layer of the multilayer substrate 8, 12 a control line for supplying power and control signals provided on the metal layer of the multilayer substrate 8, and 13 a feed line 11 and a control line The ground conductor layer provided between the metal layers constituting the line 12, 14 is an interlayer connection through hole for connecting different metal layers of the feed line 11 and the control line 12, and 15 is the metal layer constituting the feed line 11 and the control line 12. When A dielectric layer provided between the conductor layers 13, 16 is a high-frequency cutoff through-hole that connects the ground conductor layers 13, and 17 is a metal layer that constitutes the feed line 11 so as to penetrate the high-frequency cutoff via hole 16. The high frequency cutoff line provided in is shown. By mounting a plurality of hermetic packages in which microwave integrated circuits having active elements such as amplifiers and phase shifters are mounted on the integrally formed multi-layer substrate 8, an array antenna power feeding device having a plurality of modules mounted thereon is provided. Constitute.
[0015]
Next, the operation of the array antenna power supply apparatus according to the first embodiment will be described. Microwave signals input from the input / output terminals 5 of a plurality of modules constituting the array antenna power supply apparatus are excited by a power supply line 11 formed of a triplate line or the like in the multilayer substrate 8 via the interlayer connection line 14. The The microwave signal is transmitted through the interlayer connection through hole 14 and the connection terminal 10, the hermetic package 2 on which the microwave integrated circuit 2 such as an amplifier and a phase shifter mounted on the surface of the multilayer substrate 8 is mounted, the feed line 11, and the like. To propagate. In each module system, the microwave signal is converted to a desired amplitude and phase by propagating through the plurality of microwave integrated circuits 2 and the connection terminal 10, and then output from the input / output terminal 5. Here, the power supply to the amplifier provided in the microwave integrated circuit 2 and the phase control signal of the phase shifter are input from the control terminal 6, and the control formed in the interlayer connection through hole 14 and the multilayer substrate 8. It is connected to the line 12 via the connection terminal 10. The microwave signal propagating in the multilayer substrate 8 is blocked from the outside by the side metal layer 9 that connects the ground conductor layer 13 provided at the uppermost layer and the lowermost layer at the same potential, and a chassis for avoiding interference is provided. It becomes unnecessary. Further, the feeder line 11 constituting each system of the module forms a side electric wall by making the high-frequency cutoff line 17 provided adjacent to the ground conductor layer 13 through the high-frequency cutoff through hole 16 to have a conductive potential, thereby interfering between the modules. Can be suppressed.
[0016]
Here, the example in which the hermetic package is mounted on only one side of the multilayer substrate 8 has been described, but it is also possible to mount it on both sides.
[0017]
Although the example in which the uppermost layer and the lowermost layer of the multilayer substrate 8 are connected at the same potential by the side metal layer 9 has been described here, by forming a plurality of shield through holes in the entire outermost periphery of the multilayer substrate 8 A similar effect can be obtained.
[0018]
Embodiment 2. FIG.
Next, the operation of the array antenna power supply apparatus according to the second embodiment will be described. FIG. 4 is a perspective view of an array antenna power feeding apparatus showing Embodiment 2 of the present invention. An input / output terminal 5 for a microwave signal to the outside of the module constituted by the multilayer substrate 8 is provided in a metal layer on which the connection line 12 is formed, and the input / output terminal 5 extends from the uppermost ground conductor layer 13 of the multilayer substrate 8. The metal layer formed by engraving is formed by engraving, and the interlayer connection through hole 14 becomes unnecessary, and the loss of the microwave signal can be improved.
[0019]
Embodiment 3 FIG.
Next, the operation of the array antenna power supply apparatus according to the third embodiment will be described. The hermetic package 2 attached to the multilayer substrate 8 is mounted as compared with the array antenna power supply apparatus of the first embodiment by forming connection terminals for power and signals in the attachment surface and a second power supply control circuit in the attachment surface. The density can be increased. Further, by forming the second power supply control circuit in the mounting surface, the microwave signal is cut off from the outside, and a chassis for avoiding interference becomes unnecessary.
[0020]
Embodiment 4 FIG.
Next, the operation of the array antenna power supply apparatus according to the fourth embodiment will be described. 5 is a perspective view of an array antenna feeding apparatus showing Embodiment 4 of the present invention, FIG. 6 is a top view showing Embodiment 4 of the present invention, and FIG. 7 is a diagram of Embodiment 4 of the present invention. It is sectional drawing in the BB 'surface shown in FIG. In the figure, reference numeral 18 denotes a plurality of engravings provided in a region where the power supply control circuit-2 provided in the hermetic package in the multilayer board 8 contacts, and 19 denotes an active element provided in a mounting surface to the multilayer board in the hermetic package. Or the 2nd electric power feeding control circuit carrying a passive element is shown. The hermetic package 2 attached to the multilayer substrate 8 forms a second power supply control circuit 19 on which an active element or a passive element is mounted by connecting terminals for power and signals and an engraving 18 provided on the multilayer substrate 8 on the attachment surface. As a result, a plurality of power feeds or control circuits can be mounted in the same region, and the mounting density can be increased as compared with the array antenna power feed device of the third embodiment.
[0021]
Embodiment 5. FIG.
Next, the operation of the array antenna feeding apparatus according to the fifth embodiment will be described. FIG. 8 is a perspective view of an array antenna power supply apparatus showing Embodiment 5 of the present invention. By forming the second power supply control circuit 19 in the region covered with the hermetic package 2 in the uppermost layer and the lowermost layer surface of the multilayer substrate 8, the mounting density can be increased as compared with the array antenna power supply device of the first embodiment. It becomes possible. Further, by forming the second power supply control circuit 19 in the mounting surface, the microwave signal is cut off from the outside, and a chassis for avoiding interference becomes unnecessary.
[0022]
Embodiment 6 FIG.
Next, the operation of the array antenna feeding apparatus according to the sixth embodiment will be described. FIG. 9 is a cross-sectional view of the array antenna power feeding device on the CC ′ plane shown in FIG. 6 of Embodiment 6 of the present invention.
In the uppermost layer and the lowermost layer surface of the multilayer substrate 8, the engraving 18 provided in the hermetic package 2 is provided to form a second power supply control circuit 19 on which an active element or a passive element is mounted. Alternatively, the control circuit can be mounted, and the mounting density can be increased as compared with the array antenna feeding apparatus of the fifth embodiment.
[0023]
Embodiment 7 FIG.
Next, the operation of the array antenna feeding apparatus according to the seventh embodiment will be described. FIG. 10 is a cross-sectional view of the array antenna power feeding device on the AA ′ plane shown in FIG. 1 according to the seventh embodiment of the present invention. In the figure, reference numeral 20 denotes a through metal column provided in the mounting surface of the hermetic package 2 in the multilayer substrate 8. In the case where an active element in which heat generation is a problem is mounted on the hermetic package 2, it is necessary to exhaust heat through the multilayer substrate 8. The through metal pillar 20 provided in the mounting surface of the hermetic package 2 in the multilayer substrate 8 becomes a passage for efficiently exhausting the heat generated in the active element to the outside of the multilayer substrate, and it is possible to mount the active element that generates heat. .
[0024]
【The invention's effect】
According to the first invention, the modules for controlling the high-frequency signals of a plurality of systems are integrally formed in the same substrate, and the interference removal by the metal chassis is not required, so that high-density mounting is possible.
[0025]
Further, according to the second invention, it is possible to take out the power feeding circuit formed in the multilayer substrate outside the module with reduced loss.
[0026]
In addition, according to the third invention, it is possible to form a larger number of power supply circuits or control circuits in the same region in a multilayer substrate having the same number of layers, thereby enabling higher-density mounting.
[0027]
Further, according to the fourth invention, it is possible to form a power supply control circuit in which more active elements or passive elements are mounted in the same region on the same number of layers of the multilayer substrate, and higher density mounting is possible.
[0028]
Further, according to the fifth invention, it is possible to form a larger number of power supply circuits or control circuits in the same region in a multilayer substrate having the same number of layers, and higher density mounting is possible.
[0029]
Further, according to the sixth invention, it is possible to form a power supply control circuit in which more active elements or passive elements are mounted in the same region in the same number of multilayer substrates, and higher density mounting is possible.
[0030]
Further, according to the seventh invention, it is possible to mount a microwave integrated circuit in which an active element in which heat generation is a problem is mounted in an airtight package.
[Brief description of the drawings]
FIG. 1 is a perspective view showing Embodiment 1 of an array antenna power feeding apparatus according to the present invention.
FIG. 2 is a top view showing a first embodiment and a seventh embodiment of an array antenna feeding apparatus according to the present invention.
FIG. 3 is a cross-sectional view taken along the plane AA ′ shown in FIG. 1 of Embodiment 1 of the array antenna power feeding device according to the present invention;
FIG. 4 is a perspective view showing Embodiment 2 of an array antenna power feeding apparatus according to the present invention.
FIG. 5 is a perspective view showing Embodiment 4 of an array antenna power feeding apparatus according to the present invention.
FIG. 6 is a top view showing a fourth embodiment and a sixth embodiment of an array antenna feeding apparatus according to the present invention.
FIG. 7 is a cross-sectional view taken along the plane BB ′ shown in FIG. 6 of Embodiment 4 of the array antenna power feeding device according to the present invention.
FIG. 8 is a perspective view showing Embodiment 5 and Embodiment 6 of an array antenna power feeding apparatus according to the present invention.
FIG. 9 is a sectional view showing a CC ′ plane shown in FIG. 6 of Embodiment 6 of an array antenna feeding apparatus according to the present invention;
10 is a cross-sectional view taken along the plane AA ′ shown in FIG. 1 of Embodiment 7 of an array antenna feeding apparatus according to the present invention.
FIG. 11 is a top view showing a conventional array antenna feeder.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Integrated circuit, 2 Airtight package, 3 Power supply board, 4 Control circuit, 5 Input / output terminal, 6 Control terminal, 7 Chassis, 8 Multilayer board, 9 Side metal layer, 10 Connection terminal, 11 Feed line, 12 Control line, 13 Ground conductor layer, 14 interlayer connection through hole, 15 dielectric layer, 16 high frequency cutoff through hole, 17 high frequency cutoff line, 18 engraved portion, 19 control feed circuit-2, 20 through metal pillar.

Claims

A microwave integrated circuit mounted in an airtight package and having active elements;
A multilayer board on which the microwave integrated circuit is mounted ;
A power supply circuit configured to supply a microwave signal to the microwave integrated circuit configured on the multilayer substrate;
In an array antenna power supply apparatus equipped with a plurality of modules configured of a control circuit for supplying a power supply and a control signal to the microwave integrated circuit configured on the multilayer substrate,
The above airtight package
An airtight package having power and signal connection terminals in the mounting surface to the multilayer board;
The multilayer substrate is
A plurality of metal ground conductor layers;
A plurality of metal circuit layers including a feeding circuit and a control circuit provided between the metal ground conductor layers;
A dielectric layer formed between the metal circuit layer and the metal ground conductor layer;
Provided in the metal ground conductor layer formed in the uppermost layer and the lowermost layer, provided in a range covered by the airtight package mounted on the surface of the metal ground conductor layer, and connected to the connection terminal of the airtight package A connection terminal of the multilayer substrate;
A metal layer covering the entire circumference of the multilayer substrate in order to connect the metal ground conductor layers provided in the uppermost layer and the lowermost layer at the same potential, or a plurality of shielding through holes provided in the outermost circumference,
Metal pillars connecting the metal circuit layers and the connection terminals of the multilayer substrate or interlayer connection through holes;
A high-frequency cutoff line provided in the metal circuit layer has the same potential as the metal ground conductor layer by a high-frequency cutoff through hole, and is integrally formed with a high-frequency cutoff line that is disposed in the same layer adjacent to the feeder circuit and constitutes a side electric wall. Multilayer board,
An array antenna feeding apparatus comprising: a plurality of modules each having a plurality of the hermetic packages connected to the multilayer substrate; and the side electric wall configured to suppress signal interference between the modules.

A microwave integrated circuit mounted in an airtight package and having active elements;
A multilayer board on which the microwave integrated circuit is mounted ;
A power supply circuit configured to supply a microwave signal to the microwave integrated circuit configured on the multilayer substrate;
In an array antenna power supply apparatus equipped with a plurality of modules configured of a control circuit for supplying a power supply and a control signal to the microwave integrated circuit configured on the multilayer substrate,
The above airtight package
An airtight package having power and signal connection terminals in the mounting surface to the multilayer board;
The multilayer substrate is
A plurality of metal ground conductor layers;
A plurality of metal circuit layers including a feeding circuit and a control circuit provided between the metal ground conductor layers;
A dielectric layer formed between the metal circuit layer and the metal ground conductor layer;
Provided in the metal ground conductor layer formed in the uppermost layer and the lowermost layer, provided in a range covered by the airtight package mounted on the surface of the metal ground conductor layer, and connected to the connection terminal of the airtight package A connection terminal of the multilayer substrate;
A plurality of engravings to form input / output terminals in the metal circuit layer;
A metal layer covering the entire circumference of the multilayer substrate in order to connect the metal ground conductor layers provided in the uppermost layer and the lowermost layer at the same potential, or a shield through-hole provided in the outermost circumference.
Metal pillars connecting the metal circuit layers and the connection terminals of the multilayer substrate or interlayer connection through holes;
A high-frequency cutoff line provided in the metal circuit layer has the same potential as the metal ground conductor layer by a high-frequency cutoff through hole, and is integrally formed with a high-frequency cutoff line that is disposed in the same layer adjacent to the feeder circuit and constitutes a side electric wall. Multilayer board,
An array antenna power supply apparatus comprising: a plurality of modules each having a plurality of the airtight packages connected to the multilayer substrate; and the side electric wall configured to suppress signal interference between the modules.

A microwave integrated circuit mounted in an airtight package and having active elements;
A multilayer board on which the microwave integrated circuit is mounted ;
A power supply circuit configured to supply a microwave signal to the microwave integrated circuit configured on the multilayer substrate;
In an array antenna power supply apparatus equipped with a plurality of modules configured of a control circuit for supplying a power supply and a control signal to the microwave integrated circuit configured on the multilayer substrate,
The multilayer substrate is
A plurality of metal ground conductor layers;
A plurality of metal circuit layers including a feeding circuit and a control circuit provided between the metal ground conductor layers;
A dielectric layer formed between the metal circuit layer and the metal ground conductor layer;
Provided in the metal ground conductor layer formed in the uppermost layer and the lowermost layer, provided in a range covered by the airtight package mounted on the surface of the metal ground conductor layer, and connected to the connection terminal of the airtight package A connection terminal of the multilayer substrate;
A metal layer covering the entire circumference of the multilayer substrate in order to connect the metal ground conductor layers provided in the uppermost layer and the lowermost layer at the same potential, or a shield through-hole provided in the outermost circumference.
Metal pillars connecting the metal circuit layers and the connection terminals of the multilayer substrate or interlayer connection through holes;
A high-frequency cutoff line provided in the metal circuit layer has the same potential as the metal ground conductor layer by a high-frequency cutoff through hole, and is integrally formed with a high-frequency cutoff line that is disposed in the same layer adjacent to the feeder circuit and constitutes a side electric wall. Multilayer board,
The above airtight package
In the mounting surface to the multilayer board, a connection terminal for power and signal,
It is a hermetic package with a power supply control circuit in the mounting surface,
An array antenna feeding apparatus comprising: a plurality of modules each having a plurality of the hermetic packages connected to the multilayer substrate; and the side electric wall configured to suppress signal interference between the modules.

A microwave integrated circuit mounted in an airtight package and having active elements;
A multilayer board on which the microwave integrated circuit is mounted ;
A power supply circuit configured to supply a microwave signal to the microwave integrated circuit configured on the multilayer substrate;
In an array antenna power supply apparatus equipped with a plurality of modules configured of a control circuit for supplying a power supply and a control signal to the microwave integrated circuit configured on the multilayer substrate,
The above airtight package
In the mounting surface to the multilayer board, a connection terminal for power and signal,
It is a hermetic package with a feed control circuit with active or passive elements mounted on the mounting surface,
The multilayer substrate is
A plurality of metal ground conductor layers;
A plurality of metal circuit layers including a feeding circuit and a control circuit provided between the metal ground conductor layers;
A dielectric layer formed between the metal circuit layer and the metal ground conductor layer;
Provided in the metal ground conductor layer formed in the uppermost layer and the lowermost layer, provided in a range covered by the airtight package mounted on the surface of the metal ground conductor layer, and connected to the connection terminal of the airtight package A connection terminal of the multilayer substrate;
A plurality of engravings provided in a region in contact with the power supply control circuit provided in the airtight package in the mounting surface of the airtight package;
A metal layer covering the entire circumference of the multilayer substrate in order to connect the metal ground conductor layers provided in the uppermost layer and the lowermost layer at the same potential, or a shield through-hole provided in the outermost circumference.
Metal pillars connecting the metal circuit layers and the connection terminals of the multilayer substrate or interlayer connection through holes;
A high-frequency cutoff line provided in the metal circuit layer has the same potential as the metal ground conductor layer by a high-frequency cutoff through hole, and is integrally formed with a high-frequency cutoff line that is disposed in the same layer adjacent to the feeder circuit and constitutes a side electric wall. Multilayer board,
An array antenna feeding apparatus comprising: a plurality of modules each having a plurality of the hermetic packages connected to the multilayer substrate; and the side electric wall configured to suppress signal interference between the modules.

A microwave integrated circuit mounted in an airtight package and having active elements;
A multilayer board on which the microwave integrated circuit is mounted ;
A power supply circuit configured to supply a microwave signal to the microwave integrated circuit configured on the multilayer substrate;
In an array antenna power supply apparatus equipped with a plurality of modules configured of a control circuit for supplying a power supply and a control signal to the microwave integrated circuit configured on the multilayer substrate,
The above airtight package
An airtight package including a power supply and a signal connection terminal in a mounting surface to the multilayer substrate;
The multilayer substrate is
A plurality of metal ground conductor layers;
A plurality of metal circuit layers including a feeding circuit and a control circuit provided between the metal ground conductor layers;
A dielectric layer formed between the metal circuit layer and the metal ground conductor layer;
Provided in the metal ground conductor layer formed in the uppermost layer and the lowermost layer, provided in a range covered by the airtight package mounted on the surface of the metal ground conductor layer, and connected to the connection terminal of the airtight package A connection terminal of the multilayer substrate;
A power supply control circuit provided in a region covered by the hermetic package;
A metal layer covering the entire circumference of the multilayer substrate in order to connect the metal ground conductor layers provided in the uppermost layer and the lowermost layer at the same potential, or a shield through-hole provided in the outermost circumference.
Metal pillars connecting the metal circuit layers and the connection terminals of the multilayer substrate or interlayer connection through holes;
A high-frequency cutoff line provided in the metal circuit layer has the same potential as the metal ground conductor layer by a high-frequency cutoff through hole, and is integrally formed with a high-frequency cutoff line that is disposed in the same layer adjacent to the feeder circuit and constitutes a side electric wall. Multilayer board,
An array antenna feeding apparatus comprising: a plurality of modules each having a plurality of the hermetic packages connected to the multilayer substrate; and the side electric wall configured to suppress signal interference between the modules.

A microwave integrated circuit mounted in an airtight package and having active elements;
A multilayer board on which the microwave integrated circuit is mounted ;
A power supply circuit configured to supply a microwave signal to the microwave integrated circuit configured on the multilayer substrate;
In an array antenna power supply apparatus equipped with a plurality of modules configured of a control circuit for supplying a power supply and a control signal to the microwave integrated circuit configured on the multilayer substrate,
The multilayer substrate is
A plurality of metal ground conductor layers;
A plurality of metal circuit layers including a feeding circuit and a control circuit provided between the metal ground conductor layers;
A dielectric layer formed between the metal circuit layer and the metal ground conductor layer;
Provided in the metal ground conductor layer formed in the uppermost layer and the lowermost layer, provided in a range covered by the airtight package mounted on the surface of the metal ground conductor layer, and connected to the connection terminal of the airtight package A connection terminal of the multilayer substrate;
A power supply control circuit including an active element or a passive element provided in a region covered by the hermetic package;
A metal layer covering the entire circumference of the multilayer substrate in order to connect the metal ground conductor layers provided in the uppermost layer and the lowermost layer at the same potential, or a shield through-hole provided in the outermost circumference.
Metal pillars connecting the metal circuit layers and the connection terminals of the multilayer substrate or interlayer connection through holes;
A high-frequency cutoff line provided in the metal circuit layer has the same potential as the metal ground conductor layer by a high-frequency cutoff through hole, and is integrally formed with a high-frequency cutoff line that is disposed in the same layer adjacent to the feeder circuit and constitutes a side electric wall. Multilayer board,
The above airtight package
In the mounting surface to the multilayer board, a connection terminal for power and signal,
An airtight package having one or more engravings provided in a region where the power supply control circuit contacts;
An array antenna feeding apparatus comprising: a plurality of modules each having a plurality of the hermetic packages connected to the multilayer substrate; and the side electric wall configured to suppress signal interference between the modules.

A microwave integrated circuit mounted in an airtight package and having active elements;
A multilayer board on which the microwave integrated circuit is mounted ;
A power supply circuit configured to supply a microwave signal to the microwave integrated circuit configured on the multilayer substrate;
In an array antenna power supply apparatus equipped with a plurality of modules configured of a control circuit for supplying a power supply and a control signal to the microwave integrated circuit configured on the multilayer substrate,
The above airtight package
An airtight package having power and signal connection terminals in the mounting surface to the multilayer board;
The multilayer substrate includes a plurality of metal ground conductor layers,
A plurality of metal circuit layers including a feeding circuit and a control circuit provided between the metal ground conductor layers;
A dielectric layer formed between the metal circuit layer and the metal ground conductor layer;
Provided in the metal ground conductor layer formed on the uppermost layer and the lowermost layer, provided in a range covered by the airtight package mounted on the surface of the metal ground conductor layer, and connected to the connection terminal of the airtight package A connection terminal of the multilayer substrate;
To connect one or more through metal pillars penetrating between the uppermost layer and the lowermost layer provided in the region connected to the hermetic package and the metal ground conductor layer provided at the uppermost layer and the lowermost layer at the same potential. A metal layer covering the entire circumference of the side surface of the multilayer substrate or a shield through-hole provided on the outermost circumference,
Metal pillars connecting the metal circuit layers and the connection terminals of the multilayer substrate or interlayer connection through holes;
A high-frequency cutoff line provided in the metal circuit layer has the same potential as the metal ground conductor layer by a high-frequency cutoff through hole, and is integrally formed with a high-frequency cutoff line that is disposed in the same layer adjacent to the feeder circuit and constitutes a side electric wall. Multilayer board,
An array antenna feeding apparatus comprising: a plurality of modules each having a plurality of the hermetic packages connected to the multilayer substrate; and the side electric wall configured to suppress signal interference between the modules.