JP3980896B2 - Processing method and apparatus for plate material - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a processing method and apparatus for a plate material, and in particular, after chamfering processing of an end surface of a liquid crystal substrate, a ceramic substrate, a glass plate, etc., continuously R chamfering processing, outer peripheral end surface processing (external dimension adjustment), corner portion of the plate material The present invention relates to a technique effective for post-processing such as processing.
[0002]
[Prior art]
For example, a liquid crystal substrate is scribed and broken to a predetermined size and used as various liquid crystal panels.
At this time, if the end surface of the liquid crystal substrate is left in an edge shape, there is a high risk of occurrence of chipping or cracking starting from the edge portion. Therefore, the edge portion of the peripheral edge of the liquid crystal substrate is chamfered. It is common to process.
Also, the chamfering method is easy to chip glass, and burrs and chipping are likely to occur. First, as shown in FIG. Is widely adopted.
Further, for the purpose of adjusting the outer dimensions of the liquid crystal substrate as shown in FIG. 7, outer peripheral end face processing (outer shape shaping) is performed, or corner processing for grinding the corner portion of the rectangular substrate as shown in FIG. ing.
[0003]
Here, in the chamfering process, the R chamfering process, the outer peripheral end surface process, the corner process, etc., since the rotation direction and rotation speed of the grindstone and the moving speed of the plate and the grindstone are different from each other, first, a process dedicated to C chamfering. A plate material such as a liquid crystal substrate is mounted and fixed on the device, and C chamfering is performed, and then it is transported and placed on a dedicated processing device such as R chamfering, outer peripheral edge processing, corner processing, etc. (hereinafter referred to as edge processing of the plate material) ).
[0004]
However, in the conventional method as described above, not only two C-chamfering processing devices and plate material end processing devices are required, but also a plate material conveying device that is a workpiece is required between the two processing devices. Will be.
As a result, there is a problem that the processing accuracy and the processing amount vary due to variations in setting (installation accuracy) when the plate material is set in the processing device.
Moreover, the technical problem that the full length of a processing apparatus becomes long, the semi-finished product thrown in in the meantime, and a production tact also become long was inherent.
[0005]
[Problems to be solved by the invention]
In view of the technical problems inherent in the above-described conventional technology, the present invention can continuously perform edge processing of a plate material such as C chamfering and R chamfering processing of a plate material with a single processing apparatus, and is compact. An object is to provide a plate material processing apparatus having high productivity and excellent processing quality stability, and a processing method using the same.
[0006]
[Means for Solving the Problems]
The processing apparatus for a plate material according to the invention of claim 1 is a multi-grinding wheel that rotates from the surface to the end surface direction with respect to the ridge corner portions of the front and back surfaces of the side portion along the moving direction of the plate material. A pair of upper and lower multi-grinding stones rotating in the direction from the back surface to the end face, and a plurality of grinding stone single plates constituting the upper multi-grinding stone and a plurality of grinding stone single plates constituting the lower multi-grinding stone engage with each other and the grindstone cutting edge Are arranged so as to be in slidable contact with the ridge corners of the two front and back surfaces of the plate material and chamfered, and the rotating shaft of the multi-grinding stone is slightly inclined in the direction in which the chamfering amount increases as the plate material moves. After the C chamfering process, the grindstone blade edge grinds the edge of the plate material with the grindstone rotating at the machining contact point in the direction opposite to the plate material movement direction and the rotation axis being perpendicular to the plate material movement direction. Yes and arranged to, and Distance between the grinding wheel for grinding an end portion of the pair of upper and lower multi-grinding stone and plate members chamfering is equal to or smaller than Ryohen length of the plate to be chamfered.
[0007]
The processing method of the plate material according to the invention of claim 2 is a multi-grinding stone that rotates from the surface to the end surface direction with respect to the ridge corner portions of the front and back surfaces of the side portion along the moving direction of the plate material. A multi-grinding wheel that rotates in the direction from the back to the end face is interdigitated with a plurality of grinding stone single plates that make up the upper multi-grinding stone and a plurality of grinding stone single plates that make up the lower multi-grinding stone. The chamfering amount is slightly inclined in the direction in which the chamfer moves, and the pair of multi-grinding wheel edges are slidably contacted with the ridge corners of the two front and back surfaces of the plate material to perform C chamfering, and the C chamfering is performed. After processing, the distance between the pair of upper and lower multi-grinding stones is narrower than the edge length of the plate material to be chamfered, and the rotating shaft rotates in the direction opposite to the plate material moving direction at the processing contact point. Is a right angle abrasive Characterized by grinding the end portion of the plate material used.
[0008]
In order to make the present invention more effective, the distance between the grindstone cutting edge of the C chamfering processing means and the grindstone cutting edge of the edge processing means of the plate material arranged side by side is the ridge length of the plate material to be chamfered. It is good to set so that it may become narrower than this.
[0009]
Here, “so that the grindstone blade edge is in sliding contact with the ridge corners of the front and back two surfaces of the plate material” may move the plate material as the workpiece, or may move the chamfering means while fixing the plate material, Or it means that they may be moved together.
In consideration of the centering accuracy of the workpiece and downsizing of the driving device, it is preferable to move the plate material as the workpiece.
Moreover, grinding the edge part of a board | plate material is not only when carrying out R chamfering by making the grindstone which consists of a recessed part R shape to the C chamfering corner part of the end surface part after chamfering the edge surface of a board | plate material from the up-down direction, respectively. In the case of grinding so as to be in contact with the end face profile (end face part not chamfered) of the plate material after chamfering, or when processing the outer peripheral edge as shown in FIG. 7, the plate material as shown in FIG. This includes a grinding method by rotating the grindstone blade tip in the direction opposite to the moving direction of the plate material at the machining contact point, including the case of machining the corner portion of the steel plate, and its rotation control means.
[0010]
When the distance between the cutting edge of the grinding wheel for C chamfering and the cutting edge of the grinding wheel edge processing for the plate material such as R chamfering is set to be narrower than the length of the edge of the plate material, A chamfering process or the like is started.
In this case, the moving speed of the plate material is initially set to be relatively slow so that the workpiece can easily bite the cutting edge of the grindstone for R chamfering or the like, and after the start of R chamfering or the like, the moving speed is increased. It is preferable to set to.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
The principal part schematic diagram of the board | plate material processing apparatus 1 which concerns on FIG. 1 at this invention is shown.
The plate material processing apparatus 1 is provided with a mounting and fixing device 3 for setting a plate material such as a liquid crystal substrate 7 as a material to be ground on the table 2 and moves on the table Y axis.
Also, the upper side C chamfering grindstone 4 and the lower side C chamfering grindstone 5 are adjusted in position in the vertical Z-axis direction and the biting direction X-axis direction so as to contact the ridge corners of the two front and back surfaces of the liquid crystal substrate. It is attached as possible.
An R chamfering grindstone 6 is provided in parallel to the rear of the pair of chamfering grindstones 4 and 5 along the movement line of the edge to be chamfered of the liquid crystal substrate.
The R chamfering grindstone 6 can also be adjusted in position in the Z-axis direction and the X-axis direction.
The C chamfering grindstones 4 and 5 and the R chamfering grindstone 6 are rotatably supported by various driving means via a belt or the like, but are shown in FIG. Are omitted from these descriptions.
FIG. 1 shows an example in which a C chamfering grindstone and an R chamfering grindstone are juxtaposed along one edge of the liquid crystal substrate, but as shown in FIG. 2, along the other ridge edge of the liquid crystal substrate. Even if the chamfering grindstone and the R chamfering grindstone are respectively provided in a gate-like shape, it is possible to chamfer both sides of the liquid crystal substrate at one time.
[0012]
Next, the structure of a grindstone for chamfering will be described.
FIG. 3 schematically shows a contact surface between the liquid crystal substrate 7 and the grindstone.
The upper grindstone 4 rotates W1 from the surface 7a of the liquid crystal substrate 7 toward the end surface 7c.
On the other hand, the lower grindstone 5 rotates W2 from the back surface 7b of the liquid crystal substrate toward the end surface 7c.
FIG. 4 shows a state in which the C-chamfering grindstone 4 is viewed from above. For example, the grindstone 4 is a multi grindstone in which three grindstone single plates 41, 42, and 43 are stacked.
In addition, the number of grindstone single plates is arbitrarily set according to the thickness and chamfering amount of the work material.
The liquid crystal substrate 7 is moved from the bottom to the top.
On the other hand, the three multi-grinding stones are arranged so as to be in sliding contact with the ridge corners of the liquid crystal substrate at a slight angle with respect to the rotation axis.
The grinding allowance 81 is ground by the first grindstone 41, the portion of the grinding allowance 82 is ground by the second grindstone 42, the portion of the grinding allowance 83 is ground by the third grindstone 43, and a predetermined C chamfering is performed. Can be obtained.
The inclination angle of the multi-grinding wheel is selected according to the grindstone spacing and the C chamfering amount, but in the case of 0.1 to 0.2 mm C chamfering, the displacement between the whetstones at both ends is about 0.1 mm.
The lower grindstone 5 is also a multi grindstone made of three single grindstones, and is arranged so that the grindstone bites with the upper grindstone 4 so as to sandwich the liquid crystal substrate from above and below. By grinding in this manner, the run-out of the liquid crystal substrate with respect to the grindstone is prevented.
[0013]
The C chamfered liquid crystal substrate is then ground with an R chamfering grindstone 6.
The enlarged schematic diagram is shown in FIG.
The R chamfering grindstone 6 rotates in the direction opposite to the moving direction of the liquid crystal substrate, and has a concave R-shaped cutting edge 6a so as to grind the end surface portion of the liquid crystal substrate into a predetermined R shape.
Further, as shown in FIG. 1, since the interval L1 between the C chamfering grindstone and the R chamfering grindstone is set to be narrower (shorter) than the length L2 of the liquid crystal substrate, the liquid crystal substrate 7 is C chamfered while being chamfered. Processing also proceeds.
In this case, the moving speed of the liquid crystal substrate is set slower until the R chamfering starts.
In addition, although only one R groove is shown in the grindstone 6 shown in FIG. 4, for example, 6 to 9 grooves and a plurality of groove shapes are provided and selected according to the thickness of the plate material or the R chamfer shape. Good to use.
Through these steps, the ridge corners of the liquid crystal substrate are subjected to C chamfering (C1, C2) and R chamfering processing (R1, R2) as shown in FIG.
Further, instead of the R chamfering grindstone 6, an outer shape shaping grindstone 61 may be used as shown in FIG. 7, or the corner portion may be ground with a corner processing grindstone as shown in FIG.
[0014]
【The invention's effect】
According to the present invention, a chamfering grindstone and an edge processing grindstone such as an R chamfer are juxtaposed, and it is possible to continuously perform C chamfering of a plate material and edge processing of the plate material with one processing device. Compared to the conventional need for two chamfering and chamfering and edge processing machines, the processing equipment is more compact, the conveyor between the above processes is not required, and material installation variation due to conveyance The stability of machining accuracy can be expected.
This also dramatically shortens the overall length of the processing line and shortens the line tact.
Furthermore, the amount of semi-finished products in the process can be reduced.
If the distance between the chamfering grindstone and the R chamfering grindstone or the contour shaping grindstone is set narrower than the length of the plate material as the work material, the C chamfering and the R chamfering or contour shaping processing are synchronized simultaneously and simultaneously. The processing apparatus can be made more compact.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a main part of a chamfering apparatus 1 according to the present invention.
FIG. 2 shows an example in which chamfering means are provided on both sides of a plate material.
FIG. 3 shows a state in which the plate material is chamfered in the vertical direction.
FIG. 4 shows a configuration of a chamfering grindstone.
FIG. 5 shows a state in which the chamfering is performed.
FIG. 6 shows a chamfered state of a liquid crystal substrate or the like.
FIG. 7 shows a state of external shape processing.
FIG. 8 shows an example of corner processing of a plate material.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Plate processing apparatus 2 Table 3 Work place fixing device 4 C chamfering grindstone (upper side)
5 Chamfering wheel (lower side)
6 R chamfering grindstone 6a R chamfering grindstone recess R-shaped portion 61 Plate material end face grinding grindstone 7 Plate material (liquid crystal substrate)
7a Plate material front surface 7b Plate material back surface 7c Plate material end surface 81, 82, 83 Grinding allowance

Claims (2)

A pair of upper and lower multi grindstones that rotate from the front surface to the end surface direction and a multi grindstone that rotates from the back surface to the end surface direction with respect to the ridge corners of the two front and back surfaces along the moving direction of the plate material. ,
A plurality of grindstone single plates constituting the upper multi-grinding stone and a plurality of grindstone single plates constituting the lower multi-grinding stone are engaged with each other, and the grindstone cutting edge is in sliding contact with the ridge corners on the front and back surfaces of the plate, C It is arranged to be chamfered,
The rotating shaft of the multi-grinding wheel is slightly inclined in the direction in which the C chamfering amount increases as the plate moves.
After the C-chamfering process, a grindstone that rotates in the direction opposite to the moving direction of the plate material at the machining contact point and the rotating shaft is arranged in a direction perpendicular to the moving direction of the plate material so that the grindstone blade edge grinds the end portion of the plate material. An apparatus for processing a plate material, characterized in that a distance between a pair of upper and lower multi-grinding stones to be chamfered and a grindstone for grinding an end portion of the plate material is narrower than a ridge side length of the plate material to be chamfered . A multi-grinding wheel that rotates from the front surface to the end surface direction and a multi-grinding stone that rotates from the back surface to the end surface direction with respect to the ridge corners of the two front and back surfaces along the moving direction of the plate material , A plurality of grinding wheel single plates constituting the multi-grinding wheel and a plurality of grinding stone single plates constituting the multi-grinding wheel below are engaged with each other, and the rotation axis of the multi-grinding wheel is slightly increased in the direction in which the chamfering amount increases as the plate material moves. Be inclined,
The pair of multi-grinding wheel cutting edges are slidably contacted with the ridge corners of the two front and back surfaces of the plate material to perform C-chamfering, and after the C-chamfering processing, the plate material whose interval between the pair of upper and lower multi-grinding wheels is chamfered. The edge of the plate is ground using a grindstone that is narrower than the edge length of the plate and rotates in the direction opposite to the direction of movement of the plate at the processing contact point and the rotation axis is arranged in a direction perpendicular to the direction of movement of the plate. The processing method of the board material characterized.

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