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JP3975236B2 - Strip material holder processing equipment - Google Patents

Strip material holder processing equipment Download PDF

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JP3975236B2
JP3975236B2 JP2003379069A JP2003379069A JP3975236B2 JP 3975236 B2 JP3975236 B2 JP 3975236B2 JP 2003379069 A JP2003379069 A JP 2003379069A JP 2003379069 A JP2003379069 A JP 2003379069A JP 3975236 B2 JP3975236 B2 JP 3975236B2
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material holder
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band material
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JP2005138160A (en
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忠二 柳本
裕一 橋新
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Laserck Corp
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Description

本発明は、帯材保持台の加工装置に関し、詳しくは、帯材(刃材、罫材、ミシン目形成材など)を帯材保持台に植え込んで形成される抜型において、該帯材保持台に帯材植え込み用のスリットをレーザ光により精度良く形成するものに関する。   The present invention relates to a processing apparatus for a band material holding table, and more particularly, in a die-cut formed by implanting a band material (blade material, ruled material, perforation forming material, etc.) into the band material holding table. The present invention relates to a method for forming a slit for implanting a strip with high accuracy by a laser beam.

従来、紙器やダンボール箱や樹脂フィルム箱などを製作するには、これら紙器等の展開形状の型を有する抜型を用いて打抜加工することにより行っており、その抜型は帯材保持台に型形状となるスリットを予めレーザ加工して設け、そのスリットに屈曲された刃材や罫材などの帯材を植え込むことにより形成されている。   Conventionally, paper containers, cardboard boxes, resin film boxes, and the like are manufactured by punching using a die having an unfolded shape such as a paper container, and the punching is performed on a belt holding table. A slit having a shape is formed by laser processing in advance, and is formed by implanting a band material such as a blade material or a ruled material bent into the slit.

上記紙器等の製品の品質を向上させるためには抜型の寸法精度が非常に重要であり、換言すれば、帯材を植え込む帯材保持台のスリットの寸法が精度良く加工されているか否かがポイントとなる。
スリットの加工は、図8に示すように、合板からなる帯材保持台1にレーザ光Lの焦点FをZ方向の上方にずらした状態で照射し、レーザ光Lに対して帯材保持台1を予め設定した経路に従って水平方向のX−Y方向に移動させることで、一定の幅を持ったスリット1aを所定形状に形成している。
In order to improve the quality of products such as the above paper containers, the dimensional accuracy of the cutting die is very important. In other words, whether or not the dimensions of the slits of the band material holding base for implanting the band material are processed with high accuracy. It becomes a point.
As shown in FIG. 8, the slit processing is performed by irradiating the strip material holder 1 made of plywood with the focal point F of the laser beam L shifted upward in the Z direction. By moving 1 in the XY direction in the horizontal direction according to a preset route, a slit 1a having a certain width is formed in a predetermined shape.

つまり、レーザ光Lの焦点Fを帯材保持台1より若干上方にずらしていることで、スリット1aに帯材を植え込めるだけの幅を持たせることができる訳であるが、一定の角度を有するレーザ光Lを帯材保持台1の厚み分だけ貫通させるため、帯材保持台1の表面と裏面とではレーザ光Lから受けるエネルギーは相違することとなる。
帯材保持台1の表面側においては、焦点F距離を調節することでスリット1aの幅d1を所定の値に守ることができるが、裏面側では帯材保持台1をX−Y方向に移動させなければ、集光された角度で逆に拡がりを持つことになり、裏面側のスリット幅がd2’のように大きくなってしまう。そこで、スリット1aの裏面側の幅が大きくなる前に帯材保持台1をX−Y方向に移動させることで、スリット1aの裏面側の幅d2を狭くすることができ表面側の幅d1と同一となるように調節している。
That is, by shifting the focal point F of the laser beam L slightly upward from the strip material holder 1, the slit 1a can be wide enough to implant the strip material. Since the laser beam L that is included is penetrated by the thickness of the strip material holder 1, the energy received from the laser beam L is different between the front surface and the back surface of the strip material holder 1.
On the front surface side of the strip material holder 1, the width d1 of the slit 1a can be kept at a predetermined value by adjusting the focal point F distance, but on the back surface side, the strip material holder 1 is moved in the XY direction. If it is not made, it will have an expansion at the converging angle, and the slit width on the back side will become large like d2 ′. Therefore, the width d2 on the back surface side of the slit 1a can be reduced by moving the band material holder 1 in the XY direction before the width on the back surface side of the slit 1a becomes large. It is adjusted to be the same.

しかし、合板からなる帯材保持台1は個々に含水率が相違し、その含水率に応じてレーザ光から帯材保持台1に伝達される熱エネルギーが異なり、即ち、含水率の大きい箇所では刃物保持台1自体に伝達する熱エネルギーが小さい一方、含水率の小さい箇所では刃物保持台1自体に伝達される熱エネルギーが大きくなるため、帯材保持台1をレーザ光Lに対して設定通りの加工速度でX−Y方向に移動させたとしても、スリット1aの裏面側の幅d2にバラツキが生じてしまう現象が発生していた。
帯材保持台1の加工されたスリット1aの幅d1、d2が植え込まれる帯材の厚さに少しでも合わないと、帯材の挟持力が低下して打抜加工中に短い帯材が脱落したり、帯材保持台1に対して帯材が垂直とならない等の問題が発生する。
However, the strip material holder 1 made of plywood has a different moisture content, and the thermal energy transmitted from the laser beam to the strip material holder 1 differs depending on the moisture content, that is, at a location where the moisture content is large. While the thermal energy transmitted to the blade holder 1 itself is small, the thermal energy transmitted to the blade holder 1 itself is large at a location where the moisture content is small. Even when moved in the XY direction at the processing speed, a phenomenon occurs in which the width d2 on the back surface side of the slit 1a varies.
If the widths d1 and d2 of the processed slits 1a of the band material holder 1 do not match the thickness of the band material to be planted, the band holding force is reduced and a short band material is formed during the punching process. Problems such as dropping off or the strip not being perpendicular to the strip holder 1 occur.

そこで、特許第2528587号公報では図9に示すレーザ加工装置1が提供されている。詳しくは、レーザ加工装置1は、レーザ発生装置2と、レーザ発生装置2を制御する制御装置3と、制御装置3に接続され加工対象物である帯材保持台7の重量を計測する重量計測器5と、帯材保持台7を直接支持するため重量計測器5の上面に立設された針状部材6と、重量計測器5を支持すると共に水平方向のX−Y方向に移動可能なテーブル4とを備えている。   Therefore, Japanese Patent No. 2528587 discloses a laser processing apparatus 1 shown in FIG. Specifically, the laser processing apparatus 1 includes a laser generation apparatus 2, a control apparatus 3 that controls the laser generation apparatus 2, and a weight measurement that measures the weight of the band material holder 7 that is connected to the control apparatus 3 and that is a workpiece. A needle-like member 6 erected on the upper surface of the weight measuring instrument 5 to directly support the container 5 and the band material holding table 7, and supports the weight measuring instrument 5 and is movable in the horizontal XY directions. Table 4 is provided.

図9に示すレーザ加工装置1によれば、重量計測器5で計測された帯材保持台7の重量からその含水率が算出されて、この含水率に応じて加工速度等の制御データを補正し、現状の含水率に合った制御データを自動設定してレーザ加工を行うので、帯材保持台7の個々の含水率を反映させた精度良いスリット加工を可能としている。   According to the laser processing apparatus 1 shown in FIG. 9, the moisture content is calculated from the weight of the strip material holder 7 measured by the weight measuring device 5, and the control data such as the machining speed is corrected according to the moisture content. In addition, since the laser processing is performed by automatically setting the control data suitable for the current moisture content, it is possible to perform accurate slitting reflecting the individual moisture content of the band material holder 7.

しかしながら、上記公報に開示されたレーザ加工装置1では、帯材保持台7全体の重量を計測して含水率を算出しているため、帯材保持台7全体の平均含水率しか算出することができない。帯材保持台7に含有された水分が板全体にわたって均一に分布している場合はそれでも問題はないが、水分の分布が不均一な場合にはスリット幅にバラツキが発生してしまう恐れがある。
特許第2528587号公報
However, in the laser processing apparatus 1 disclosed in the above publication, since the moisture content is calculated by measuring the weight of the entire band material holder 7, only the average moisture content of the entire band material holder 7 can be calculated. Can not. If the moisture contained in the strip material holder 7 is evenly distributed over the entire plate, there is no problem, but if the moisture distribution is not uniform, the slit width may vary. .
Japanese Patent No. 2528587

本発明は、上記問題に鑑みてなされたもので、帯材保持台のレーザ照射位置の局所的な含水率を反映させた正確なスリット加工を可能とすることを課題としている。   This invention is made | formed in view of the said problem, and makes it a subject to enable the exact slit process which reflected the local moisture content of the laser irradiation position of a strip | belt material holding stand.

上記課題を解決するため、本発明は、含水性材質の帯材保持台にレーザ光を照射して帯材植え込み用のスリットを形成する加工装置において、
上記レーザ光を上記帯材保持台に向けて照射するレーザ加工機構と、
上記レーザ光と上記帯材保持台とを相対変位させる移動手段と、
上記帯材保持台の含水率に応じた上記レーザ光の照射開始時に発生する水蒸気爆発音を取得する集音手段と、
上記移動手段および上記集音手段に接続されると共に、上記帯材保持台と上記レーザ光との相対移動速度を含む加工条件について上記水蒸気爆発音の値に応じた最適加工条件を保存しているデータベースを有するコンピュータとを備え、
上記コンピュータは上記集音手段で集音された上記水蒸気爆発音の値に基づいて上記帯材保持台と上記レーザ光との相対移動速度を含む加工条件を上記データベースより取得される最適加工条件に演算補正する演算制御手段を設けていることを特徴とする帯材保持台の加工装置を提供している。
In order to solve the above problems, the present invention provides a processing apparatus for forming a slit for implanting a strip material by irradiating a laser beam onto a strip material holder of a water-containing material.
A laser processing mechanism for irradiating the laser beam toward the band material holder;
A moving means for relatively displacing the laser beam and the belt material holder;
Sound collecting means for acquiring a water vapor explosion sound generated at the start of irradiation of the laser light according to the moisture content of the strip material holder ,
It is connected to the moving means and the sound collecting means, and the optimum processing conditions corresponding to the value of the steam explosion sound are stored for the processing conditions including the relative moving speed between the band material holder and the laser beam. A computer having a database,
The computer sets the processing conditions including the relative movement speed between the band material holder and the laser beam as the optimum processing conditions acquired from the database based on the value of the steam explosion sound collected by the sound collecting means. An apparatus for processing a strip support is provided, characterized in that a calculation control means for calculation correction is provided.

本発明者は、鋭意研究の結果、帯材保持台に含まれる水分(細胞水)量の大小に応じてレーザ光を照射した際の加工音が異なることを見い出した。即ち、レーザ光が帯材保持台に含有された水分に照射されることでミクロな細胞内の水蒸気爆発が発生し、その水蒸気爆発音を含む加工音の値を調べることにより、帯材保持台の局所的な含水率を考慮することが可能となる。
したがって、上記構成とすれば、上記集音手段で取得されたレーザ加工時の加工音をコンピュータに取り込み、予め用意されたデータベースと照合して当該加工音に応じた最適加工条件を取得してレーザ光の移動速度等を最適値に自動演算補正することにより、局所的な含水率に応じた加工条件の設定が可能となり、含水率が不均一な帯材保持台のスリット加工も正確な寸法精度を確保して行うことができる。
なお、上記含水性材質の帯材保持台は、木質製の単板または積層板、発泡樹脂板、異種材料の集積材などで形成される。また、上記加工音は、加工作業に伴って付随する音も含むものである。
As a result of diligent research, the present inventor has found that the processing sound when laser light is irradiated differs depending on the amount of water (cell water) contained in the band material holder. That is, by irradiating the moisture contained in the band material holder with laser light, a microscopic steam explosion occurs in the cell, and by examining the value of the processing sound including the steam explosion sound, It becomes possible to take into account the local moisture content.
Therefore, with the above-described configuration, the processing sound at the time of laser processing acquired by the sound collecting means is taken into a computer, and an optimum processing condition according to the processing sound is acquired by collating with a database prepared in advance to obtain a laser. By automatically calculating and correcting the light movement speed etc. to the optimum value, it is possible to set the processing conditions according to the local moisture content, and the slit processing of the strip holder with non-uniform moisture content is also accurate dimensional accuracy Can be performed.
The water-containing material band holder is formed of a single plate or laminate made of wood, a foamed resin plate, an accumulation material of different materials, and the like. Further, the processing sound includes sound accompanying the processing work.

上記データベースと照合する加工音は、上記帯材保持台の含水率に応じて上記レーザ光の照射開始時に発生する水蒸気爆発音を含む加工音としていることが好ましい。   It is preferable that the processing sound collated with the database is a processing sound including a steam explosion sound generated at the start of irradiation of the laser light in accordance with the moisture content of the band material holder.

レーザ光を照射した直後の加工スタート時は、レーザ光の全径を用いて帯材保持台を切断することになるが、その後、レーザー光と帯材保持台とを相対的に移動させて連続してスリット加工を進めると、レーザ光は全径でなく径方向の一部分のみが帯材保持台のバージン部分(未切断部分)を切断し、その他の光線は既にスリットが形成された切断跡を通過するだけとなる。上記集音手段で取得される加工音にこのバージン部分の面積を考慮して最適加工条件を割り出すことは可能ではあるが、加工速度が相違すればレーザ光が当たるバージン部分の面積も異なってくるのでデータベースの参照項目として加工速度を追加考慮する必要が生じる。
しかし、上記構成とすれば、レーザ光を帯材保持台に照射開始した加工スタート時の加工音を参照することとしているので、加工面積がレーザ光の全径となり条件が一定するので、加工精度を向上させることができると共にデータベースを簡素化することができる。
なお、同様の原理により、レーザ光のスポット照射による加工音をデータベースとの照合用に用いてもよい。
At the start of processing immediately after the laser beam irradiation, the band material holder is cut using the entire diameter of the laser beam, but then the laser beam and the band material holder are moved relative to each other continuously. Then, when the slit processing is advanced, the laser beam cuts the virgin portion (uncut portion) of the band material holder, not the entire diameter, but only a part in the radial direction, and the other light beam shows the cut trace where the slit has already been formed. It will only pass. Although it is possible to determine the optimum machining condition in consideration of the area of the virgin portion for the processing sound acquired by the sound collecting means, the area of the virgin portion to which the laser beam hits will be different if the processing speed is different. Therefore, it is necessary to additionally consider the processing speed as a reference item of the database.
However, with the above configuration, since the processing sound at the start of processing when laser beam irradiation is started on the band material holder is referred to, the processing area becomes the entire diameter of the laser light and the conditions are constant. Can be improved and the database can be simplified.
In addition, based on the same principle, the processing sound by laser beam spot irradiation may be used for collation with a database.

軟質材打ち抜き用の抜型を構成する上記帯材保持台は上記スリットに金属製の上記帯材が植え込まれるものであって、
上記帯材保持台と上記レーザ光との相対移動速度は、一つの加工区間である上記スリット全長にわたって一定または可変としていると好適である。なお、上記軟質材としては、紙材、樹脂フィルム材、繊維材などが挙げられる。
The band material holding base constituting the punch for soft material punching is one in which the band material made of metal is implanted in the slit,
It is preferable that the relative movement speed between the strip material holder and the laser beam is constant or variable over the entire length of the slit, which is one processing section. Examples of the soft material include paper materials, resin film materials, and fiber materials.

本発明は、含水性材質の帯材保持台にレーザ光を照射して帯材植え込み用のスリットを形成する加工装置において、
上記レーザ光を上記帯材保持台に向けて照射するレーザ加工機構と、
上記レーザ光と上記帯材保持台とを相対変位させる移動手段と、
上記帯材保持台ヘ向けた音波の反響音あるいは物理的衝撃手段による衝撃時の反響音を取得する反響検知手段と、
上記移動手段および上記反響検知手段に接続されると共に、上記帯材保持台と上記レーザ光との相対移動速度を含む加工条件について上記反響音の値に応じた最適条件を保存しているデータベースを有するコンピュータとを備え、
上記コンピュータは上記反響検知手段で取得された反響音の値に基づいて上記帯材保持台と上記レーザ光との相対移動速度を含む加工条件を上記データベースより取得される最適加工条件に演算補正する演算制御手段を設けていることを特徴とする帯材保持台の加工装置を提供している。
The present invention is a processing apparatus for forming a slit for implanting a strip material by irradiating a strip material holder of a water-containing material with a laser beam,
A laser processing mechanism for irradiating the laser beam toward the band material holder;
A moving means for relatively displacing the laser beam and the belt material holder;
Reverberation detecting means for acquiring a reverberant sound of a sound wave directed to the band material holder or a reverberant sound at the time of impact by a physical impact means;
A database that is connected to the moving means and the echo detection means, and that stores optimum conditions according to the value of the echo sound for processing conditions including a relative moving speed between the band material holder and the laser beam. And a computer having
The computer calculates and corrects the processing conditions including the relative movement speed between the band material holder and the laser beam to the optimum processing conditions acquired from the database based on the value of the reverberation sound acquired by the reverberation detecting means. There is provided a processing apparatus for a band material holding table, characterized in that an arithmetic control means is provided.

上記構成とすると、上記反響検知手段で取得された反響音データを上記データベースと照合することで、レーザ光に対する帯材保持台の加工速度等の加工条件を最適値に設定することができ、帯材保持台の含水率に応じた加工条件により正確な寸法精度でスリット加工することができる。   With the above configuration, the reverberation sound data acquired by the reverberation detecting means is collated with the database, so that the processing conditions such as the processing speed of the band material holder with respect to the laser light can be set to an optimum value. Slit processing can be performed with accurate dimensional accuracy by processing conditions corresponding to the moisture content of the material holding table.

以上の説明より明らかなように、本発明によれば、レーザ加工時の加工音を上記集音手段からコンピュータに取り込み、データベースを参照して当該加工音に応じた最適加工条件を取得して帯材保持台とレーザ光との相対移動速度等を最適値に自動演算補正することにより、帯材保持台の局所的な含水率を反映させた加工が可能となり、含水率が不均一であっても正確にスリット加工を行うことができる。   As is clear from the above description, according to the present invention, the processing sound at the time of laser processing is taken into the computer from the sound collecting means, the optimum processing condition according to the processing sound is obtained by referring to the database, and By automatically calculating and correcting the relative movement speed between the material holder and the laser beam to the optimum value, processing that reflects the local moisture content of the band material holder becomes possible, and the moisture content is uneven. Can be accurately slit.

本発明の実施形態を図面を参照して説明する。
図1は第1実施形態の帯材保持台の加工装置10の構成図を示している。
加工装置10は、加工対象物である木製の平板状からなる帯材保持台19に向けてレーザ光Lを照射するレーザ加工機構11と、レーザ加工機構11のレンズ15を垂直方向(Z方向に)移動させるZテーブル24と、帯材保持台19を水平方向(X−Y方向)に移動させるXYテーブル(移動手段)20と、XYテーブル20の上面に立設されて帯材保持台19を直接支持する針状支持材20と、XYテーブル21をACサーボ22を介して駆動制御するNCコントローラ23と、帯材保持台19の近傍に配置固定されたマイクである集音手段30と、集音手段30およびNCコントローラ23に接続されると共にデータベース27を有するコンピュータ25とを備えている。
Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a block diagram of a processing apparatus 10 for a belt holding table according to the first embodiment.
The processing apparatus 10 includes a laser processing mechanism 11 that irradiates a laser beam L toward a strip holding base 19 made of a wooden flat plate that is a processing target, and a lens 15 of the laser processing mechanism 11 in a vertical direction (in the Z direction). ) The Z table 24 to be moved, the XY table (moving means) 20 for moving the band material holding table 19 in the horizontal direction (XY direction), and the band material holding table 19 erected on the upper surface of the XY table 20 Needle-like support material 20 that directly supports, NC controller 23 that drives and controls XY table 21 via AC servo 22, sound collecting means 30 that is a microphone arranged and fixed in the vicinity of band material holding table 19, A computer 25 connected to the sound means 30 and the NC controller 23 and having a database 27 is provided.

レーザ加工機構11は、CO2レーザを発生するレーザ発振器12と、レーザ発振器12からのレーザ光Lを通過させるレーザ通路部13と、レーザ光Lを水平方向から垂直方向に屈曲させるベンドミラー14と、レーザ光Lを集光する集光レンズ15と、レーザ発振器12を制御する制御部16および操作用の制御パネル17を有する制御装置18とを備え、レーザ通路部13の下端開口13aからレーザ光Lを所定の角度で集光照射している。 The laser processing mechanism 11 includes a laser oscillator 12 that generates a CO 2 laser, a laser passage portion 13 that allows the laser beam L from the laser oscillator 12 to pass, and a bend mirror 14 that bends the laser beam L from the horizontal direction to the vertical direction. A condensing lens 15 for condensing the laser light L, a control unit 16 for controlling the laser oscillator 12 and a control device 18 having an operation control panel 17, and the laser light from the lower end opening 13 a of the laser passage unit 13. L is condensed and irradiated at a predetermined angle.

コンピュータ25は、各種演算や一時記憶等を行う演算制御手段26と、集音手段30と接続するインターフェースである入力手段28と、NCコントローラ23と接続するインターフェースである出力手段29と、加工音と最適加工条件との関係を保存しているデータベース27とを備えている。   The computer 25 includes calculation control means 26 for performing various calculations and temporary storage, input means 28 that is an interface connected to the sound collection means 30, output means 29 that is an interface connected to the NC controller 23, machining sound, And a database 27 that stores the relationship with the optimum machining conditions.

データベース27は、レーザ光Lに対する帯材保持台19の水平方向(X−Y方向)への移動速度や焦点距離やパワー密度などの加工条件に関して、加工音の各値に対応した最適条件の実験データを保存している。なお、データベース27に用いられる加工音の値は、レーザ光Lを帯材保持台19に照射開始した直後である加工スタート時の加工音を適用している。   The database 27 is an experiment of optimum conditions corresponding to each value of the machining sound with respect to the machining conditions such as the moving speed in the horizontal direction (XY direction) of the strip material holder 19 with respect to the laser light L, the focal length, and the power density. Saving data. The processing sound value used in the database 27 is the processing sound at the start of processing, which is immediately after the irradiation of the laser beam L to the band material holder 19 is started.

集音手段30は、レーザ光Lが帯材保持台19に照射された加工箇所から20〜50mm程度の一定距離が維持されるように、レーザ加工機構11のハウジングに図示しないアームを介して固定されている。また、集音手段30が取得する加工音は、帯材保持台19に含有される細胞水がレーザ光Lにより急蒸発する水蒸気爆発音の他に、ノイズ音をも含むため、不要音域をマスキングして水蒸気爆発音のみを対象として使用すると好適である。なお、集音手段30とコンピュータ25との間に信号増幅器を介設してもよい。   The sound collecting means 30 is fixed to the housing of the laser processing mechanism 11 via an arm (not shown) so that a constant distance of about 20 to 50 mm is maintained from the processing position where the laser beam L is applied to the band material holder 19. Has been. Further, the processing sound acquired by the sound collecting means 30 includes noise sound in addition to the steam explosion sound in which the cellular water contained in the band material holder 19 is rapidly evaporated by the laser light L, so that the unnecessary sound range is masked. Thus, it is preferable to use only steam explosion sound as a target. A signal amplifier may be provided between the sound collecting means 30 and the computer 25.

次に、上記構成の加工装置10を用いた帯材保持台19のスリット加工について説明する。
図2に示すように、レーザ光Lの焦点Fを帯材保持台19の若干上方に位置させることで所定の角度で拡がるレーザ光Lを帯材保持台19に照射してスリット19aを形成する。
レーザ光Lが帯材保持台19を切断する際には、帯材保持台19に含有された細胞水Wにレーザ光Lが当たることにより水蒸気爆発音を伴うミクロな細胞内における水蒸気爆発が発生するため、その水蒸気爆発音を含む加工音を集音手段30で取得して電気信号としてコンピュータ25に送信する。
Next, the slit processing of the strip material holder 19 using the processing apparatus 10 having the above-described configuration will be described.
As shown in FIG. 2, the focus F of the laser light L is positioned slightly above the strip material holder 19 to irradiate the strip material holder 19 with the laser beam L spreading at a predetermined angle to form a slit 19 a. .
When the laser beam L cuts the strip material holder 19, the laser beam L strikes the cellular water W contained in the strip material holder 19, thereby causing a steam explosion in a micro cell accompanied by a steam explosion sound. Therefore, the processing sound including the steam explosion sound is acquired by the sound collecting means 30 and transmitted to the computer 25 as an electric signal.

ここで、レーザー光Lに対してXYテーブル21を移動させて帯材保持台19を連続してスリット加工している途中においては、図3(A)に示すように、レーザ光Lは全径でなく径方向の一部分のみが帯材保持台19の未切断部分であるバージン部分Vを切断し、その他の光線は既にスリット19aが形成された切断跡を通過するだけとなり、加工面積は加工速度に依存することとなる。そこで、本実施形態では、帯材保持台19に照射開始した直後の加工スタート部分Sの加工音のみをデータベース27との比較対象とすることで、レーザ光Lの全径が切断に使用されて加工面積が一定の加工条件下において加工音を考察することができる。また、全径切断となる加工スタート部分Sは加工音が最も大きくなるので集音しやすいというメリットもある。   Here, in the middle of continuously slitting the band material holder 19 by moving the XY table 21 with respect to the laser light L, the laser light L has a full diameter as shown in FIG. Instead, only a part in the radial direction cuts the virgin portion V, which is an uncut portion of the band material holding base 19, and the other rays only pass through the cutting trace where the slit 19a has already been formed, and the processing area is the processing speed. Will depend on. Therefore, in the present embodiment, the entire diameter of the laser light L is used for cutting by using only the processing sound of the processing start portion S immediately after the start of irradiation of the band material holder 19 as a comparison target with the database 27. The processing sound can be considered under processing conditions with a constant processing area. In addition, the machining start portion S that is cut at all diameters has the advantage that the machining noise is the largest and therefore it is easy to collect sound.

なお、帯材保持台19にスリット加工を行う場合、通常、図3(B)に示すように、帯材31の切欠(図示せず)を嵌め込むブリッジBを間欠的に複数設けて、被切断部が抜け落ちないようにしており、1つの帯材保持台19のレーザ加工作業において加工スタート部分Sは複数発生する。
また、加工音と加工速度等との関係が保存されたデータベースにおいても、レーザ光の照射直後のスタート時の加工音を対象として取得された実験データを基に構築されていることは言うまでもない。
When slit processing is performed on the strip material holder 19, usually, as shown in FIG. 3 (B), a plurality of bridges B into which notches (not shown) of the strip material 31 are intermittently provided are provided. The cutting portion is prevented from falling off, and a plurality of processing start portions S are generated in the laser processing operation of one band material holder 19.
Further, it goes without saying that the database storing the relationship between the processing sound and the processing speed is constructed based on experimental data acquired for the processing sound at the start immediately after the laser light irradiation.

そして、ブリッジBごとに取得された加工音の値に対応する最適な加工速度(XYテーブル21の送り速度)をデータベース27から取得し、NCコントローラ23内のプログラムの加工速度を上記最適値に自動演算補正しながら加工を行う。なお、必要に応じて、コンピュータ25と制御装置18とを接続し、焦点距離やパワー密度も同様に自動補正するも自由である。   Then, the optimum machining speed (feed speed of the XY table 21) corresponding to the machining sound value obtained for each bridge B is obtained from the database 27, and the machining speed of the program in the NC controller 23 is automatically set to the optimum value. Machining while correcting the calculation. If necessary, the computer 25 and the control device 18 can be connected to automatically correct the focal length and power density in the same manner.

上記構成とすると、帯材保持台19の含水率が局所的に異なり不均一である場合でも、加工箇所の含水率に応じた加工速度に修正されるので、帯材保持台19のスリット19aの表面側の幅d1と裏面側の幅d2が同一となるように正確な寸法で加工することができる。
そして、最終的には帯材保持台19の形成されたスリット19aに帯材31(刃材または罫材)を植え込むと共に、背面側に薄肉鉄板32、紙シート33および裏板34を設けて打ち抜きプレス(図示せず)に装着することで高精度な抜型が構成される。つまり、スリット19aが正確な寸法で形成されていることにより、帯材31に対して適切な挟持力を発揮し、打ち抜き加工中に帯材31が脱落することが防止できると共に、帯材31を帯材保持台19に対して正しく垂直に植え付けることができる。
With the above configuration, even when the moisture content of the strip material holding table 19 is locally different and non-uniform, the processing speed is corrected according to the moisture content of the machining location. Processing can be performed with accurate dimensions so that the width d1 on the front surface side and the width d2 on the back surface side are the same.
Finally, the strip 31 (blade or ruled material) is implanted in the slit 19a in which the strip holder 19 is formed, and a thin iron plate 32, a paper sheet 33 and a back plate 34 are provided on the back side and punched out. A high-accuracy die is formed by mounting on a press (not shown). That is, since the slit 19a is formed with an accurate dimension, an appropriate clamping force can be exerted on the band material 31, and the band material 31 can be prevented from falling off during the punching process. It can be planted correctly and vertically with respect to the strip material holder 19.

また、上記実施形態の変形例として、加工スタート部分Sから次のブリッジBに到達するまでの連続的な加工においても、連続的に集音手段30より加工音を取得し、コンピュータ25の演算制御手段26で連続的にXYテーブル21の移動速度の最適値への自動演算補正を行い、リアルタイムでNCコントローラ23にフィードバックすると好適である。
上記構成とすると、ブリッジB間の一つの加工区間での連続加工時においても含水率の変化に応じてフレキシブルに加工速度を変化させて調整を行うことができる。
Further, as a modification of the above embodiment, even in continuous machining from the machining start portion S to the next bridge B, machining sound is continuously acquired from the sound collecting means 30, and the computer 25 performs arithmetic control. It is preferable to continuously perform automatic calculation correction to the optimum value of the moving speed of the XY table 21 by means 26 and feed back to the NC controller 23 in real time.
With the above configuration, even during continuous processing in one processing section between the bridges B, adjustment can be performed by changing the processing speed flexibly according to the change in moisture content.

図5および図6は第2実施形態を示す。
第1実施形態との相違点は、反響検知手段43を設けて帯材保持台19の含水率を求めている点である。
5 and 6 show a second embodiment.
The difference from the first embodiment is that the echo detection means 43 is provided to determine the moisture content of the band material holder 19.

反響検知手段43は、図5および図6に示すように、音波46を生成する発音手段45と、帯材保持台19で反射した反響音47を取得する集音手段(高性能マイク)44とを備えており、コンピュータ48の入出力手段42に接続されている。
また、コンピュータ48は、反響音47の値と帯材保持台19の含水率との関係に関する実験データを保存したデータベース41を備えている。
なお、他の構成は第1実施形態と同様であるため同一符号を付して説明を省略する。
As shown in FIGS. 5 and 6, the echo detection unit 43 includes a sound generation unit 45 that generates a sound wave 46, a sound collection unit (high-performance microphone) 44 that acquires an echo sound 47 reflected by the band material holder 19, and And is connected to the input / output means 42 of the computer 48.
In addition, the computer 48 includes a database 41 that stores experimental data relating to the relationship between the value of the reverberation sound 47 and the moisture content of the band material holder 19.
Since other configurations are the same as those of the first embodiment, the same reference numerals are given and description thereof is omitted.

上記した加工装置40の動作手順は、まず試運転時に、XYテーブル21を動かして、帯材保持台19に形成される予定のスリットの経路に沿って予め反響検知手段43で反響音47の取得を行い、その反響音データに基づきデータベース41と照合することで、次工程でレーザ光Lが照射される帯材保持台19の各箇所の局所的な含水率を算出しておく。そして、上記算出された含水率に基づいた最適な加工速度の条件をNCコントローラ23に送信する。   The operation procedure of the processing apparatus 40 is as follows. First, during the trial operation, the XY table 21 is moved, and the echo detection means 43 acquires the echo sound 47 in advance along the path of the slit to be formed on the band material holder 19. This is performed and collated with the database 41 based on the reverberation sound data, thereby calculating the local moisture content of each part of the band material holder 19 irradiated with the laser light L in the next process. Then, the optimum processing speed condition based on the calculated moisture content is transmitted to the NC controller 23.

上記構成とすると、帯材保持台19の含水率が局所的に異なり不均一である場合でも、各加工箇所における含水率に応じた加工速度でXYテーブル21が送られて、帯材保持台19のスリットを正確な寸法精度で加工することができる。
なお、反響検知手段43による反響音47の取得は、レーザ加工と同時に加工箇所近傍で行うことで、試運転を不要としてもよい。また、帯材保持台19の含水率がほぼ均一であると考えられる場合には、帯材保持台19の一部について反響音を取得することで平均含水率を求めるようにしても構わない。
With the above configuration, even when the moisture content of the strip material holder 19 is locally different and non-uniform, the XY table 21 is sent at a processing speed corresponding to the moisture content at each processing location, and the strip material holder 19 Can be machined with accurate dimensional accuracy.
Note that the acquisition of the reverberation sound 47 by the reverberation detection means 43 may be performed near the processing location simultaneously with the laser processing, thereby eliminating the need for a trial run. Further, when it is considered that the moisture content of the strip material holder 19 is substantially uniform, the average moisture content may be obtained by obtaining an echo sound for a part of the strip material holder 19.

図7は第3実施形態を示す。
第2実施形態との相違点は、発音手段45で帯材保持台19に音波を照射して反響音を取得する代わりに、物理的衝撃手段50で帯材保持台19の表面を打撃した際の反響音を取得して最適条件に加工速度等の加工条件を演算補正するようにしている。
物理的衝撃手段50は、シリンダ部51と、下端にハンマー部52aを有するピストン部52とを備え、信号線53を介してコンピュータ48に接続されている。つまり、ピストン52を所要のタイミングで昇降させて、刃物保持台19の表面にハンマー部52aを軽く衝突させ、その反響音を集音手段44で集音している。ハンマー部52aの材質は、刃物保持台19の材質と同じものを用いれば、互いの材料の固有振動数が一致して共鳴により反響音を取得し易くなる利点があると共に、片側の材料(刃物保持台19またはハンマー部52a)の衝突負けによる変形も防止できる。
なお、この場合のデータベースは物理的衝撃手段による反響音の値と帯材保持台19の含水率との関係に関する実験データを保存していることとする。また、他の構成は第2実施形態と同様であるため説明を省略する。
FIG. 7 shows a third embodiment.
The difference from the second embodiment is that when the sounding means 45 strikes the surface of the band material holder 19 with the physical impact means 50 instead of irradiating the band material holder 19 with the sound wave to acquire the echo sound. Thus, the processing conditions such as the processing speed are calculated and corrected to the optimum conditions.
The physical impact means 50 includes a cylinder part 51 and a piston part 52 having a hammer part 52 a at the lower end, and is connected to a computer 48 via a signal line 53. That is, the piston 52 is moved up and down at a required timing, the hammer portion 52 a is lightly collided with the surface of the blade holder 19, and the reflected sound is collected by the sound collecting means 44. If the material of the hammer portion 52a is the same as the material of the blade holding base 19, there is an advantage that the natural frequencies of the materials coincide with each other and it is easy to obtain reverberation sound by resonance. Deformation due to collision loss of the holding base 19 or the hammer portion 52a) can also be prevented.
In this case, it is assumed that the database stores experimental data relating to the relationship between the value of the reverberant sound caused by the physical impact means and the moisture content of the band material holder 19. Other configurations are the same as those of the second embodiment, and thus description thereof is omitted.

本発明の第1実施形態の加工装置を示す構成図である。It is a lineblock diagram showing the processing device of a 1st embodiment of the present invention. スリットの加工を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the process of a slit. (A)はレーザ光の照射を示す斜視図、(B)はスリットのブリッジを示す図面である。(A) is a perspective view which shows irradiation of a laser beam, (B) is drawing which shows the bridge | bridging of a slit. 帯材保持台への帯材の植え込みを示す断面図である。It is sectional drawing which shows implantation of the strip | belt material to a strip | belt-material holding stand. 第2実施形態の加工装置を示す構成図である。It is a block diagram which shows the processing apparatus of 2nd Embodiment. 含水率の計測原理を示す要部拡大図である。It is a principal part enlarged view which shows the measurement principle of a moisture content. 第3実施形態の含水率の計測原理を示す要部拡大図である。It is a principal part enlarged view which shows the measurement principle of the moisture content of 3rd Embodiment. 帯材保持台へのスリットの形成を説明する図面である。It is drawing explaining formation of the slit to a strip | belt material holding stand. 従来例を示す図面である。It is drawing which shows a prior art example.

符号の説明Explanation of symbols

10、40 加工装置
11 レーザ加工機構
12 レーザ発振器
13 レーザ通路部
13a 開口
14 ベンドミラー
15 集光レンズ
18 制御装置
19 帯材保持台
19a スリット
20 針状支持材
21 XYテーブル(移動手段)
22 ACサーボ
23 NCコントローラ
24 Zテーブル
25 コンピュータ
26 演算制御手段
27、41 データベース
28 入力手段
29 出力手段
30 集音手段
31 帯材
32 薄肉鉄板
33 紙シート
34 裏板
43 反響検知手段
44 集音手段
45 発音手段
46 音波
47 反響音
50 物理的衝撃手段
L レーザ光
W 細胞水
DESCRIPTION OF SYMBOLS 10, 40 Processing apparatus 11 Laser processing mechanism 12 Laser oscillator 13 Laser passage part 13a Aperture 14 Bend mirror 15 Condensing lens 18 Control apparatus 19 Band material holder 19a Slit 20 Needle-shaped support material 21 XY table (moving means)
22 AC servo 23 NC controller 24 Z table 25 Computer 26 Arithmetic control means 27, 41 Database 28 Input means 29 Output means 30 Sound collecting means 31 Strip material 32 Thin iron plate 33 Paper sheet 34 Back plate 43 Echo detection means 44 Sound collecting means 45 Sound generation means 46 Sound wave 47 Reverberation sound 50 Physical impact means L Laser light W Cell water

Claims (3)

含水性材質の帯材保持台にレーザ光を照射して帯材植え込み用のスリットを形成する加工装置において、
上記レーザ光を上記帯材保持台に向けて照射するレーザ加工機構と、
上記レーザ光と上記帯材保持台とを相対変位させる移動手段と、
上記帯材保持台の含水率に応じた上記レーザ光の照射開始時に発生する水蒸気爆発音を取得する集音手段と、
上記移動手段および上記集音手段に接続されると共に、上記帯材保持台と上記レーザ光との相対移動速度を含む加工条件について上記水蒸気爆発音の値に応じた最適加工条件を保存しているデータベースを有するコンピュータとを備え、
上記コンピュータは上記集音手段で集音された上記水蒸気爆発音の値に基づいて上記帯材保持台と上記レーザ光との相対移動速度を含む加工条件を上記データベースより取得される最適加工条件に演算補正する演算制御手段を設けていることを特徴とする帯材保持台の加工装置。
In a processing apparatus for forming a slit for implanting a band material by irradiating a laser beam to a band material holding table of a hydrous material,
A laser processing mechanism for irradiating the laser beam toward the band material holder;
A moving means for relatively displacing the laser beam and the belt material holder;
Sound collecting means for acquiring a water vapor explosion sound generated at the start of irradiation of the laser light according to the moisture content of the strip material holder ,
It is connected to the moving means and the sound collecting means, and the optimum processing conditions corresponding to the value of the steam explosion sound are stored for the processing conditions including the relative moving speed between the band material holder and the laser beam. A computer having a database,
The computer sets the processing conditions including the relative movement speed between the band material holder and the laser beam as the optimum processing conditions acquired from the database based on the value of the steam explosion sound collected by the sound collecting means. An apparatus for processing a strip material holder, comprising arithmetic control means for arithmetic correction.
軟質材打ち抜き用の抜型を構成する上記帯材保持台は上記スリットに金属製の上記帯材が植え込まれるものであって、
上記帯材保持台と上記レーザ光との相対移動速度は、一つの加工区間である上記スリット全長にわたって一定または可変としている請求項1に記載の帯材保持台の加工装置。
The band holding base constituting the die for soft material punching is one in which the band made of metal is implanted in the slit,
The apparatus for processing a strip material holder according to claim 1, wherein a relative movement speed between the strip material holder and the laser beam is constant or variable over the entire length of the slit which is one processing section .
含水性材質の帯材保持台にレーザ光を照射して帯材植え込み用のスリットを形成する加工装置において、
上記レーザ光を上記帯材保持台に向けて照射するレーザ加工機構と、
上記レーザ光と上記帯材保持台とを相対変位させる移動手段と、
上記帯材保持台ヘ向けた音波の反響音あるいは物理的衝撃手段による衝撃時の反響音を取得する反響検知手段と、
上記移動手段および上記反響検知手段に接続されると共に、上記帯材保持台と上記レーザ光との相対移動速度を含む加工条件について上記反響音の値に応じた最適条件を保存しているデータベースを有するコンピュータとを備え、
上記コンピュータは上記反響検知手段で取得された反響音の値に基づいて上記帯材保持台と上記レーザ光との相対移動速度を含む加工条件を上記データベースより取得される最適加工条件に演算補正する演算制御手段を設けていることを特徴とする帯材保持台の加工装置。
In a processing apparatus for forming a slit for implanting a band material by irradiating a laser beam to a band material holding table of a hydrous material,
A laser processing mechanism for irradiating the laser beam toward the band material holder;
A moving means for relatively displacing the laser beam and the belt material holder;
Reverberation detecting means for acquiring a reverberant sound of a sound wave directed to the band material holder or a reverberant sound at the time of impact by a physical impact means;
A database that is connected to the moving means and the echo detection means, and that stores optimum conditions according to the value of the echo sound for processing conditions including the relative movement speed of the band material holder and the laser beam. And a computer having
The computer calculates and corrects the processing conditions including the relative movement speed between the band material holder and the laser beam to the optimum processing conditions acquired from the database based on the value of the reverberation sound acquired by the reverberation detecting means. An apparatus for processing a strip holding table, comprising an arithmetic control means .
JP2003379069A 2003-11-07 2003-11-07 Strip material holder processing equipment Expired - Fee Related JP3975236B2 (en)

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