JP3938590B2 - Communication device - Google Patents

Description

  The present invention relates to a sheet-like communication device that can easily charge a power supply of a communication element.

Conventionally, as a surface such as a sheet shape (cloth shape, paper shape, foil shape, plate shape, mesh shape (typically having a mesh finer than the electromagnetic wave length of a signal) in which a plurality of communication elements are embedded. The present inventors have proposed a technique relating to a communication device having a wide range of thickness and a small thickness. For example, in the following literature, a communication in which a plurality of communication elements embedded in a sheet-like member (hereinafter referred to as “sheet-like body”) transmits a signal by relaying the signal without forming individual wirings. A device has been proposed.
Japanese Patent Laid-Open No. 2004-007448

  Here, in the technique disclosed in [Patent Document 1], each communication element is arranged at the apex of a lattice-like, triangular, or honeycomb-like figure on the surface of the sheet-like body. Each communication element communicates only with other communication elements arranged in the vicinity by utilizing the fact that the potential change generated by the communication element is strong in the vicinity and is attenuated and propagated in the distance.

  By sequentially transmitting the signals between the communication elements by this local communication, the signals are transmitted to the target communication element. The plurality of communication elements are divided into hierarchies by the management function, and route data is set in each hierarchy, so that signals can be efficiently transmitted to the final target communication element.

  In a communication device in which communication elements are embedded in the surface of such a sheet-like body almost regularly and communication elements form a network to transmit information, how to configure the sheet-like body, Various new technical proposals are strongly demanded to meet various demands and uses as to how the elements are arranged.

  In particular, there is a strong demand for a technique for appropriately charging a communication element.

  SUMMARY OF THE INVENTION The present invention meets such a demand and an object of the present invention is to provide a sheet-like communication device that can easily charge a power supply of a communication element.

  In order to achieve the above object, the following invention is disclosed in accordance with the principle of the present invention.

  The communication device according to the first aspect of the present invention is capacitively coupled to the first sheet conductor portion, the second sheet conductor portion disposed substantially parallel to the first sheet conductor portion, and the first sheet conductor portion. A communication element portion having a first electrode and a second electrode capacitively coupled to the second sheet conductor portion is provided.

  Any one of the coupling between the first sheet conductor and the first electrode and the coupling between the second sheet conductor and the second electrode adopts coupling by conductor contact instead of capacitive coupling. It is also good to do.

  Here, the communication element unit rectifies and charges the voltage change between the first electrode and the second electrode, which changes based on the voltage change between the first sheet conductor part and the second sheet conductor part. Operates as a power source.

  In addition, the communication element unit changes the voltage between the first sheet conductor unit and the second sheet conductor unit by changing the voltage between the first electrode and the second electrode, and / or the first electrode. An electromagnetic wave is propagated between the sheet conductor portion and the second sheet conductor portion to communicate with another communication device coupled to the first sheet conductor portion and the second sheet conductor portion.

  Here, the “communication element” may be a small circuit unit for transferring a signal, or a sensor or a light emitting element to which a signal transmission / reception circuit is added. In the case of a sensor, it is possible to adopt a form in which data is returned in response to a command from a communication device having a function as a host, or data is spontaneously emitted according to a measured amount. The “communication device” includes a communication device connected directly to the first and second sheet conductors or via a connector and a cable, and between the first and second sheet conductors by the above configuration. The “other communication elements” arranged also fall under this category.

  In the communication apparatus of the present invention, the communication element unit can be configured to be disposed between the first sheet conductor unit and the second sheet conductor unit.

  In the communication device of the present invention, a first sheet-like insulator is disposed between the first sheet conductor and the communication device, and between the second sheet conductor and the communication device. The second sheet-like insulator is disposed, and between the first sheet-like insulator, the second sheet-like insulator, and the communication device, a sheet-like material is filled between them. A resistor can be arranged.

  In the communication device of the present invention, a sheet resistance is connected to a surface of one of the first sheet conductor portion and the second sheet conductor portion that faces the other, and the sheet resistance is It can be configured to be insulated from the other.

  Moreover, in the communication apparatus of this invention, it can comprise so that the sheet-like resistance insulated from these may be arrange | positioned between a 1st sheet conductor part and a 2nd sheet conductor part.

  Further, in the communication device of the present invention, in the surface of the first sheet conductor portion that faces the second sheet conductor portion, the region in which the electromagnetic wave in the frequency band used by the communication element portion reflects higher than a predetermined ratio. The sheet-like resistor can be configured to be connected.

  Further, in the communication device of the present invention, in the surface of the first sheet conductor portion facing the second sheet conductor portion, the region where the number of communication element portions arranged per unit area is higher than a predetermined threshold value The sheet-like resistor can be configured to be connected.

  In addition, the communication device of the present invention can be configured to use a material having a large dielectric loss instead of the sheet resistance.

  In the communication device of the present invention, the space between the first sheet conductor portion and the second sheet conductor portion can be filled with a material having a large dielectric loss.

  ADVANTAGE OF THE INVENTION According to this invention, the sheet-like communication apparatus which can charge the power supply of a communication element easily can be provided.

  Embodiments of the present invention will be described below. The embodiments described below are for explanation, and do not limit the scope of the present invention. Therefore, those skilled in the art can employ embodiments in which each of these elements or all of the elements are replaced with equivalent ones, and these embodiments are also included in the scope of the present invention.

  1 and 2 are explanatory diagrams illustrating a communication device according to the first embodiment of the present invention. FIG. 1 is a perspective external view of the communication device, and FIG. 2 is a cross-sectional view of the communication device. Hereinafter, a description will be given with reference to FIG.

  In the communication apparatus 100 according to the present embodiment, two first conductor layers 101 that are sheet-like (foil-like and film-like) conductors and a second conductor layer 102 are arranged in parallel and opposed to each other. The first conductor layer 101 is provided with a plurality of holes 103.

  Hereinafter, a good conductor at the signal frequency is adopted as the “conductor”. Therefore, even if an insulator is used for direct current, a material such as a good conductor can be used for signal frequency.

  Further, a protrusion 104 is arranged on the second conductor layer 102 so as to penetrate each of the holes 103.

  Communication element 105 is coupled to the first conductor layer in the vicinity of hole 103. Further, it is coupled to the second conductor layer 102 through the protrusion 104.

  The communication elements 105 communicate with each other by propagating electromagnetic waves between the first conductor layer 101 and the second conductor layer 102.

  When the thickness of the communication device 100 is sufficiently smaller than the electromagnetic wave length, the electric field vector of the propagating electromagnetic wave is perpendicular to the first conductor layer 101 and the second conductor layer 102.

  Each communication element 105 is directly coupled or capacitively coupled to the first conductor layer 101 and the second conductor layer 102.

  Here, when the communication element 105 supplies a current passing through a certain first conductor layer 101, the communication element 105, and the second conductor layer 102, the first conductor layer 101 and the second conductor layer 105 are not connected. Electromagnetic waves are propagated in the sheet-shaped spreading direction (direction orthogonal to the current flowing through the protrusions 104). Therefore, the other communication elements 105 can be affected by this electromagnetic wave, and thus, signals can be detected.

  The distribution of the electromagnetic field due to the electromagnetic wave can be considered to be axially symmetric (cylindrical symmetry) with respect to the axis passing through the protrusion 104 and perpendicular to the sheet-like spreading direction of the first conductor layer 101 and the second conductor layer 102.

  In addition, when the size of the maximum side of the communication device 100 is sufficiently smaller than the wavelength of the electromagnetic wave, these phenomena can be regarded as quasi-stationary electric field changes. Therefore, when the voltage between the first conductor layer 101 and the second conductor layer 102 in the vicinity of the communication element 105 is changed by operating the communication element 105, the voltage changes uniformly in the spreading direction, This change in voltage can also be detected by other communication elements 105.

  In the communication device 100 shown in FIG. 1, the space between the first conductor layer 101 and the second conductor layer 102 is filled with an insulator called “air”.

  On the other hand, in the communication device 100 shown in FIG. 2, this point is clarified and various insulators including air are used. That is, an insulating layer 106 filled with an insulator is provided between the first conductor layer 101 and the second conductor layer 102. The insulating layer 106 insulates them. Hereinafter, a configuration including the first conductor layer 101, the second conductor layer 102, and the insulating layer 106 is referred to as a “communication layer”.

  This is not necessary when the communication element 105 is supplied with power from other sources or has a built-in power supply, but a constant voltage is applied between the first conductor layer 101 and the second conductor layer 102. As a result, the power of the operation of the communication element 105 can be supplied.

According to the numerical calculation and experiment on the behavior of the cylindrical electromagnetic field, the conductivity (reciprocal of resistivity) σ of the first conductor layer 101 and the second conductor layer 102, the dielectric constant ε between them, the first conductor layer 101 And the distance d between the facing surfaces of the second conductor layer 102 and the angular frequency ω of the signal, the parameters representing the attenuation of the electromagnetic field are as follows:
η = d ((2σ) / (εω)) ^1/2
Can think. This represents a distance at which the amplitude of the signal becomes 1 / e times when signal scattering due to the presence of the hole 103 and the communication element 105 is not considered. Therefore, it is necessary to set the configuration in consideration of this parameter depending on the application field of the communication apparatus 100.

  FIG. 2 is a cross-sectional view illustrating an example of a state in which the first conductor layer 101 and the second conductor layer 102 of the communication device 100 are coupled to the communication element 105.

  As shown in the figure, the communication element 105 has two electrodes 201 and 202. The electrode 201 is directly connected to the peripheral portion of the hole 103 of the first conductor layer 101. The electrode 202 is directly connected to the protrusion 104 of the second conductor layer 102. A voltage is applied between the first conductor layer 101 and the second conductor layer 102, and the communication element 105 operates upon receiving power supply by this voltage. Note that an insulator provided with an opening may be disposed above the first conductor layer 101 (a surface not facing the second conductor layer 102) so that the communication element 105 is fitted therein.

  FIG. 3 is a cross-sectional view similar to the above but showing an example in which the shape of the protrusion 104 is changed.

  In the example shown in this figure, an opening is provided so as to curve from the lower surface of the second conductor layer 102 toward the upper side of the first conductor layer 101, and a portion corresponding to the hole 103 of the first conductor layer 101. The periphery of is also curved upward. A curved portion of the second conductor layer 102 corresponds to the protrusion 104. An insulating layer 106 is disposed between the two. For example, all of these have a shape in which a hole is made by applying a force to a metal plate with a cone, and when viewed as a whole, these are in close contact with each other.

  The electrode 201 has a cap shape that covers this curve, and is directly connected to the first conductor layer 101. The electrode 202 is directly connected to the inside of the protrusion of the second conductor layer 102.

  The contact point between the electrode 201 and the electrode 202 is such that the first conductor layer 101 and the second conductor layer 102 are sandwiched between the inside and the outside of the curve by a spring, thereby ensuring the connection.

  FIG. 4 is a cross-sectional view illustrating another example in which the first conductor layer 101 and the second conductor layer 102 of the communication device 100 are coupled to the communication element 105.

  As shown in the figure, an insulator 301 is disposed above the first conductor layer 101 (a surface not facing the second conductor layer 102). Therefore, the electrode 201 of the communication element 105 forms a kind of capacitor with the first conductor layer 101, and the electrode 202 forms a kind of capacitor with the first conductor layer 102. At this time, the electrode 201 and the electrode 202 are not necessarily in close contact with the insulator 301, and may have some clearance.

  Generally, when charge is generated on the surface of the electrode 201 (202) in a state where the electrode 201 (202) and the conductor layer 101 (102) are close to each other, a charge having an opposite sign is induced in the conductor layer 101 (102). . Such coupling is called “capacitive coupling”.

  Even if the electrodes 201 and 202 of the communication element 105 and the first conductor layer 101 and the second conductor layer 102 are not directly connected, if such capacitive coupling is established, the first conductor layer 101 and the second conductor layer 101 By changing the voltage between the two conductor layers 102, a voltage change occurs between the electrode 201 and the electrode 202 in response to the change. Therefore, if the voltage change is rectified and charged, an operating power source for the communication element 105 can be secured.

Here, when the area of the electrode 201 (202) is S, the distance between the electrode 201 (202) and the first conductor layer 101 (second conductor layer 102) is d, and the dielectric constant of the insulating layer 106 between them is ε. The capacitance C formed between the electrode and the conductor layer is
C = εS / d

  Given in.

When S = 5 mm × 5 mm, d = 1 mm, and ε = 5 × 10 ⁻¹¹ F / m, C = 1.25 pF. At f = 2.4 GHz, the impedance (reactance) of the capacitor C is 53Ω. In a high-frequency AC signal, low impedance coupling is possible by capacitive coupling in this way, and signal power can be transmitted with high efficiency.

  Advantages of adopting capacitive coupling include the following.

  First, it is not necessary to ensure conductivity for the connection between the first conductor layer 101, the second conductor layer 102, and the communication element 105, and the manufacturing is simple.

  Next, even if there is a situation where the insulator 301 is peeled between the first conductor layer 101 and the second conductor layer 102, since the electrical connection is not presupposed from the beginning, the coupling can be maintained.

  Furthermore, since a hard conductive adhesive is not locally used, the joint is not easily broken.

  The first conductor layer 101 and the second conductor layer 102 can make a structure that can be laterally displaced from each other, and the communication device 100 can be flexibly bent as a sheet.

  In addition, when conductive fibers or meshes are used as the first conductor layer 101 and the second conductor layer 102, not only the nearest conductive fibers that face each other but also the outer side (the back as viewed from the communication device 105). And other conductive fibers, etc.) can be capacitively coupled, and the coupling is averaged and stabilized.

  FIG. 5 is a cross-sectional view illustrating another example in which the first conductor layer 101 and the second conductor layer 102 of the communication device 100 are coupled to the communication element 105. In this example, instead of providing the protrusion 104 on the second conductor layer 102, the shape of the communication element 105 plays a role of “protrusion”.

  As shown in FIG. 4A, in this example, the insulator 301 is disposed so as to cover the second conductor layer 102 facing the hole 103 and above the first conductor layer 101. On the other hand, the communication element 105 is shaped to fit into the hole 103 covered with the insulator 301.

  The hole 103 has a circular shape, the electrode 201 has a ring shape, and the electrode 202 has a circular shape. When fitted, these centers coincide. This figure (b) shows the state of the lower surface of the communication element 105 and the electrodes 201 and 202.

  It is to be noted that by providing a connector having the same shape as the communication element 105 described so far and having the electrodes 201 and 202, the communication element 105 connected to the external device and the communication device 100 (the same connector or the like) It is possible to communicate with other external devices using the.

  FIG. 6 is an explanatory diagram showing a schematic configuration of the communication element 105 that receives power supply. However, the same configuration can be adopted even when power is not supplied. Hereinafter, a description will be given with reference to FIG.

  As shown in this figure, the communication element 105 includes a positive terminal 501, a negative terminal 502, a diode 504, a capacitor 505, a transmission circuit 506, a reception circuit 507, and a control circuit 508.

  The capacitor 505 is charged via the diode 504. The diode 504 enters a state in which a current flows when the power supply potential VDD in the communication element 105 falls below the inter-terminal voltage OUT, and is quickly charged. As long as OUT <VDD, the diode 504 is in a high-impedance state, so that transmission of signals by the transmission circuit 506 is not hindered. Operating power is supplied from the capacitor 505 to the transmission circuit 506, the reception circuit 507, and the control circuit 508.

  Although a half-wave rectifier circuit is used here, a full-wave rectifier circuit may be used. Although not shown, a standard voltage regulator circuit may be employed to stabilize the supply voltage to the circuit.

When the protrusion 104 has a cylindrical shape and the radius thereof is sufficiently smaller than the wavelength of the electromagnetic wave of the signal used for communication, the radiation impedance Z when the communication layer is viewed from the communication element 105 is inductive. ,
Z = α + jβ (α> 0, β> 0)
It has a shape like

  The radiation impedance Z is finite. For example, when 2.5 GHz band communication is performed, the layer interval is about 1 mm, and the protrusion radius is about several mm, α is about 1Ω to 10Ω. On the other hand, the resistance of the communication layer can be regarded as zero in terms of direct current. In terms of direct current, power can be supplied with sufficiently low impedance. In this way, by using the first conductor layer 101 and the second conductor layer 102, signal transmission and power supply can be performed.

  The positive terminal 501 is connected to one of the electrode 201 and the electrode 202, and the negative terminal 502 is connected to the other of the electrode 201 and the electrode 202. When capacitive coupling is established as described above, if the voltage between the first conductor layer 101 and the second conductor layer 102 is changed, the voltage between the electrode 201 and the electrode 202 also changes.

  Therefore, when an appropriate voltage change (alternating current / voltage) is applied between the first conductor layer 101 and the second conductor layer 102, rectification charging is performed on the capacitor 505 by the diode 504.

  If the charging signal is 2.4 GHz microwave, the impedance of capacitive coupling of C = 1.25 pF is 53Ω. In addition, it becomes 5.3 kΩ at a charge signal frequency of 24 MHz. When the connected communication element consumes 100 μA on average, the voltage across the capacitance is only 5.3 mV and 0.53 V, respectively, and it can be seen that the low power consumption communication element can be easily driven by capacitive coupling. Further, a larger amount of current can be supplied by inserting a matching circuit that cancels this reactance into the receiving circuit.

  As the control circuit 508, various information processing devices such as a more general logic circuit and a small computer can be adopted. The control circuit 508 controls the reception circuit 507 and the transmission circuit 506, communicates with the adjacent communication element 105, and forms a network. For such a communication control method, the technique disclosed in the above [Patent Document 1] can be applied, and the technique described later can be adopted.

  FIG. 7 is a circuit diagram showing a schematic configuration of the transmission circuit of the communication element in the present embodiment. Hereinafter, a description will be given with reference to FIG.

  As shown in the figure, the transmission circuit 506 includes a pMOS transistor 601, a diode 602, and an nMOS transistor 603.

Control by the control circuit 508 is performed by changing the gate voltages of the pMOS transistor 601 and the nMOS transistor 603.
(1) When the control circuit 508 does not emit a signal, the gate of the nMOS transistor 603 is set to the ground (VSS) potential in the chip, and the gate of the pMOS transistor 601 is set to the VDD potential. In this case, in both cases, the impedance between the source and the drain is sufficiently high, and OUT is substantially equal to the VDD potential.
(2) When the control circuit 508 applies H (High) potential to the gates of both the nMOS transistor 603 and the pMOS transistor 601, OUT becomes L (Low) potential.
(3) When the control circuit 508 applies L potential to the gates of both the nMOS transistor 603 and the pMOS transistor 601, OUT becomes H potential.

  By changing the potential in this way, an electromagnetic wave is generated between the first conductor layer 101 and the second conductor layer 102 to transmit a signal.

  A diode 602 sandwiched between the nMOS transistor 603 and the pMOS transistor 601 is inserted to adjust the amplitude of the output voltage. If the two are short-circuited here without providing the diode 602, the H level of OUT becomes the power supply potential and the L level becomes the ground potential in the chip. However, if the diode 602 is inserted, the forward voltage drop Therefore, the L level potential is increased and power consumption can be saved.

  Note that the resistance component α of the radiation impedance Z converges to a constant value when the radius of the protrusion 104 becomes smaller than a certain value.

  On the other hand, the reactance component β of the radiation impedance Z diverges and increases as the radius of the protrusion 104 decreases.

  For this reason, when the protrusion 104 is small, the voltage change energy may not be effectively converted into the wave energy of the electromagnetic wave if it is driven as it is.

  At this time, a capacitor having an impedance for canceling β at the output is connected in series between the positive terminal 501 and the transmission circuit 506 or between the negative terminal 502 and the transmission circuit 506.

  Then, the load of the communication layer viewed from the transmission circuit 506 can be a pure resistance. In this case, the maximum energy can be transmitted with the minimum voltage amplitude, and the energy consumed by the load is directly converted into wave energy of electromagnetic waves.

  The optimum capacitance Copt of the capacitor connected in series between the transmission circuit 506 and either the positive terminal 501 or the negative terminal 502 is determined by numerical calculation or experiment. In some cases, depending on the circuit configuration and shape, the communication layer can be made a pure resistance as described above by connecting an inductance. Also in this case, the value may be obtained by numerical calculation or experiment.

In the communication layer, current and electromagnetic field exist only on the surface on the opposite side of the conductor, and the depth is the skin depth (the depth at which the current amplitude becomes 1 / e times)
ζ = c ((2ε) / (σω)) ^1/2
Given in. Where c is the speed of light.

  Therefore, if only the vicinity of the surface of the communication layer is replaced with a material having a low conductivity, and a material having a sufficiently high conductivity is used on the back surface, the signal is attenuated and the DC power supply has a sufficiently low communication layer resistance. Can be done through.

  FIG. 8 is a circuit diagram showing a schematic configuration of the receiving circuit of the communication element in the present embodiment. Hereinafter, a description will be given with reference to FIG.

  As shown in the figure, the receiving circuit 507 includes a resistor (r1) 701, a resistor (r2) 702, and a comparator 703. The reception circuit 507 sets a threshold value indicating whether the change in the received potential is H or L depending on the voltage division ratio between the resistors 701 and 702.

  FIG. 9 is a circuit diagram showing another schematic configuration of the receiving circuit of the communication element in the present embodiment. Hereinafter, a description will be given with reference to FIG.

  This receiving circuit shows an embodiment of a receiving circuit based on ASK (Amplitude Shift Keying), which is one of standard signal transmission methods. In this method, one bit is transmitted depending on the presence or absence of a burst signal that generates a carrier wave having a frequency f for a predetermined time T. The receiving circuit applies a band-pass filter whose center frequency is f to the signal at the IN terminal, amplifies it, and then rectifies it. The rectified signal is passed through a low pass filter having a cutoff frequency greater than 1 / T and less than f. The output is compared with a threshold value, and finally the presence / absence of a burst signal is converted to H level and L level and transmitted to the control circuit.

  If the carrier frequency f of the signal and the signal frequency F for charging the communication element are set to different values, signal transmission / reception will not be affected by charging.

  In addition, the resistance component of the impedance between the input terminal and VSS determined by the input impedance of the comparator 703 should be approximately the same as the resistance component α of the radiation impedance Z from the viewpoint of maximizing the energy absorbed by the receiving circuit 507. Is desirable. Similarly to the case of the transmission circuit 506, a capacitor that cancels the reactance component β of the communication layer is connected in series between the positive terminal 501 and the reception circuit 507. As a result, the power flowing into the receiving circuit 507 is maximized.

  The optimum capacity of the capacitor at this time is Copt if the input circuit routing of the transmission circuit 506 and the reception circuit 507 is the same, but it is actually obtained by numerical calculation or experiment.

  When the communication element 105 and the first conductor layer 101 and the second conductor layer 102 are capacitively coupled, the above-described “series-connected capacitors” are inevitably formed.

  Therefore, in such a case, the communication layer may be made a pure resistance as described above by connecting the inductances in series instead of further connecting the capacitors in series. Also in this case, the value may be obtained by numerical calculation or experiment.

  Thus, according to the present embodiment, it is possible to provide a sheet-like communication device 100 in which a plurality of communication elements 105 communicate with each other.

  In general, in communication using electromagnetic waves, it is often necessary to eliminate the influence of reflection. The same applies to the present embodiment. Therefore, in the following, measures for eliminating the influence of reflection will be described.

  As described above, according to the parameter η representing the attenuation of the electromagnetic field, when the conductivity σ of the first conductor layer 101 or the second conductor layer 102 is decreased (the resistivity is increased), the reach of the electromagnetic wave is shortened. . Therefore, in a place where reflection is likely to occur, multiple reflections can be suppressed by providing a resistance layer in order to reduce the electrical conductivity σ of the first conductor layer 101 and the second conductor layer 102. .

  FIG. 10 shows an embodiment in which a resistance layer is provided with respect to the embodiment in FIG. In this figure (a), the resistance layer 801 is connected to the first conductor layer 101, and the insulating layer 106 is provided between the resistance layer 801 and the second conductor layer 102. In FIG. 6B, conversely, the resistance layer 801 is connected to the second conductor layer 102, and the insulating layer 106 is provided between the resistance layer 801 and the first conductor layer 101. Similarly, in other forms, the resistance layer 801 is provided to adjust the reach distance of the electromagnetic wave.

  Note that the resistance layer 801 may be embedded in the insulating layer 106 and insulated from both the first conductor layer 101 and the second conductor layer 102.

  FIG. 11 is an explanatory diagram for explaining a portion where it is better to provide the resistance layer 801 with respect to the communication device 100 having a special shape.

  The sheet-like communication device 100 shown in the figure has a shape that connects two large islands with a bridge. In this figure, the portion indicated by the mesh is a portion where the resistance layer 801 is to be disposed, and the conductivity σ remains high in other portions.

  First, reflection is likely to occur at the edge of the shape or the bent portion of the region. Therefore, a resistance layer is disposed in such a place.

  Moreover, in the example of this figure, the density of arrangement | positioning of the hole 103 (it describes with the circle | round | yen in the figure) is also different. Therefore, in order to avoid collision of unnecessary signals even in places where the communication elements 105 can be disposed at high density, the resistance layer 801 is disposed to shorten the reach of electromagnetic waves.

  As a method for selecting such a region where the resistance layer 801 is to be provided, the following may be considered. That is, this is a method in which a simulation experiment or numerical analysis in the absence of the resistance layer 801 is performed, the degree of reflection in each region is examined, and a region whose degree is higher than a predetermined threshold is selected. In addition, the number of holes 103 per unit area may be examined, and a region where this is higher than a predetermined threshold value may be selected.

  In this manner, by providing the resistance layer 801, it is possible to prevent the influence of reflection and signal collision.

  The basic configuration is the same as that of the above embodiment, and the protrusion 104 and the communication element 105 can be integrally configured. FIG. 12 shows a cross-sectional view of a communication apparatus according to such an embodiment.

  As shown in this figure, in the communication device 100, the first conductor layer 101 and the second conductor layer 102 are arranged such that the floor and ceiling are the floor and the communication element 105 is the pillar. An insulating layer 106 and a resistance layer 801 depending on the part are prepared. In this example, the resistance layer 801 is disposed so as to be in contact with the second conductor layer 102, but the location where the resistance layer 801 is disposed can be changed in the same manner as in the above embodiment. In the case of this example, the communication element 105 is supplied with power from the first conductor layer 101 and the second conductor layer 102.

  Even in such an aspect, a sheet-like communication device in which a plurality of communication element units communicate with each other can be realized.

  In addition, a five-layer structure such as the first conductor layer 101, the insulating layer 106, the resistance layer 801, the insulating layer 106, and the second conductor layer 102 may be employed. Even when such a configuration is adopted, an effect of reducing σ can be obtained, while a short circuit between the first conductor layer 101 and the second conductor layer 102 can be prevented.

  Further, a structure in which the resistance layer is disposed on both surfaces of the conductor layers 101 and 102, that is, a five-layer structure such as the first conductor layer 101, the resistance layer 801, the insulating layer 106, the resistance layer 801, and the second conductor layer 102. Even if is adopted, the same effect can be obtained.

  FIG. 13 is a cross-sectional view showing the shape of the vicinity of the hole in another embodiment when the communication element and the first conductor layer and the second conductor layer are connected in contact with each other.

  In the example shown in FIG. 5A, a pin-like shape is adopted as the electrode 202, and a recess is provided so that the pin portion of the electrode 202 can be inserted from the tip of the protrusion 104 into the inside.

  In the example shown in FIG. 7B, the protrusion 104 is not extended from the second conductor layer 102, but a protrusion shape is provided from the communication element 105 to the second conductor layer 101, and the electrode 202 is provided at the tip thereof. The connection is made. The first conductor layer 101 and the insulating layer 106 are provided with holes that fit into the protruding shape of the communication element 105.

  In the example shown in this figure (c), the electrode 202 itself is used as the protruding shape in this figure (b).

  As described above, such various shapes can be adopted for the communication element 105 including the connector to the external device and the configuration fitted thereto.

  So far, the embodiment in which the communication element 105 is outside the communication apparatus 100 has been mainly described. Hereinafter, a mode in which the communication element 105 is sandwiched between the first conductor layer 101 and the second conductor layer 102 will be described.

  FIG. 14 is an explanatory diagram showing a state in which the communication element 105 is sandwiched between the first conductor layer 101 and the second conductor layer 102. Hereinafter, a description will be given with reference to FIG.

  In the example shown in FIG. 5A, the communication element 105 is completely embedded between the first conductor layer 101 and the second conductor layer 102 and is integrated with the communication device 100. As the communication element 105 in such a case, a sensor that detects temperature, pressure, humidity, light, electromagnetic waves, or the like, or a device that performs information processing such as an RF-ID tag can be considered.

  The first conductor layer 101 and the electrode 201 of the communication element 105 are oppositely capacitively coupled, and the second conductor layer 102 and the electrode 202 of the communication element 105 are oppositely capacitively coupled.

  Charging of the communication element 105 by capacitive coupling, and the communication element 105 changes in voltage between the first conductor layer 101 and the second conductor layer 102 or propagates between the first conductor layer 101 and the second conductor layer 102. The mode of performing communication using the electromagnetic wave is as described above.

  For example, when the size (the length of the maximum side) of the communication device 100 is sufficiently smaller than the electromagnetic wave length (for example, 1/10 or less), it is between the first conductor layer 101 and the second conductor layer 102. Can be considered as a quasi-stationary voltage change without considering the situation where electromagnetic waves propagate, and the influence of electromagnetic waves can be considered only with a lumped constant without considering it.

  For example, in the communication element 105, when a signal having a frequency of about 10 MHz is used for communication, the wavelength is about 30 m. At this time, this corresponds to a case where the sheet size of the communication apparatus 100 is about 1 m to several m.

  In such a case, any frequency can be used as the frequency of the AC voltage applied to the first conductor layer 101 and the second conductor layer 102 for charging.

  The frequency F of the charging signal and the frequency f of the information signal are respectively a high frequency (a frequency at which the electromagnetic wave length is smaller than the size of the sheet-like communication device 100) and a low frequency (an electromagnetic wave length of the communication device 100 having the electromagnetic wave length). Either of the frequencies (which becomes larger than the magnitude) may be selected.

  When both the charge signal F and the frequency f of the information signal are low (when the electromagnetic wave length is larger than the size of the communication sheet), the transmission of the information signal is hindered by connecting an AC power supply for charging to the conductor layer. It is necessary to prevent it.

  FIG. 15 is an explanatory diagram showing a drive circuit of the communication layer C composed of the first conductor layer 101 and the second conductor layer 102 and other additional circuits.

  In this figure, L1 and C1 are set so that the resonance frequency 1 / (2π√ (L1 C1)) is equal to f. As a result, at the information signal frequency f, the communication layer C is connected to the power supply with high impedance.

  Then, C2 (or inductance L2 instead of C2 in some cases) is adjusted so that the impedance at both ends of the power supply becomes small at the charging frequency F (F <f), and the communication layer for the communication element 105 is moved to. Set so that the charging voltage and current can be secured.

  When L is connected so that the resonance frequency 1 / (2π√ (LC)) of the capacitance C and L of the communication layer is equal to the information signal carrier frequency f, the drive impedance (first frequency) of the communication layer viewed from the communication element 105 (Impedance between an arbitrary location of the conductor layer 101 and the location of the second conductor layer 102 in the vicinity thereof) becomes large at the frequency f, so that a signal with a large voltage amplitude can be generated with a small current with the first conductor layer 101. It can be generated between the second conductor layers 102.

  When the size of the communication device 100 is not sufficiently small compared to the electromagnetic wave length, for example, when the frequency of the electromagnetic wave used by the communication element 105 is equal to or higher than the GHz band, as described above, the electromagnetic wave It is necessary to consider the communication status assuming the propagation of

  Even in this case, it is desirable that the distance between the first conductor layer 101 and the second conductor layer 102 be smaller than the electromagnetic wave length. This is because if the distance between the two becomes large, the number of modes of the generated electromagnetic wave increases, which may be disadvantageous for signal reception. Typically, the distance between them is smaller than half of the electromagnetic wave length. In addition, by using a thin sheet shape, it can be easily mounted on the surface and inside of various objects.

  In the example shown in FIGS. 14B, 14C, and 14D, the resistance layer 801 is provided in consideration of such propagation of electromagnetic waves to prevent reflection.

  In FIG. 14B, the resistance layer 801 is connected to the first conductor layer 101, and the resistance layer 801 and the communication element 105 and the second conductor layer 102 are insulated.

  In FIG. 14C, the resistance layer 801 is disposed between the first conductor layer 101 and the communication element 105 in an insulated manner.

  In FIG. 14D, the communication element 105 is insulated and embedded in the resistance layer 801. The insulating layer 106 on the first conductor layer 101 side and the insulating layer 106 on the second conductor layer 102 side are constant. Thus, it is possible to use a sheet having a thickness of 5 mm, thereby improving the integrity as a sheet and facilitating manufacture.

  In this figure, the electrode 201 and the electrode 202 are provided so as to overlap each other in the thickness direction of the communication device 100 on both sides of the communication element 105, but these positions may not overlap each other. Good and can be freely determined.

In addition, in the above embodiment, as a member (such as the resistance layer 801) used as an electromagnetic wave absorber, a “material having a large dielectric loss” may be employed instead of so-called “resistance”. Both the resistor and dielectric have a complex permittivity of ε (ω) = ε _r (ω)-jε _i (ω)
Can be expressed as

In an ideal dielectric, the imaginary part ε _i (ω) = 0, and the real part ε _r (ω) is a constant.

In an ideal resistance, if the conductivity is σ, the imaginary part ε _i (ω) = σ / ω.

  The electromagnetic wave attenuation parameter η can also be expressed by such a complex dielectric constant, and a material that is an insulator at DC but has a large dielectric loss at a communication frequency can be used as an electromagnetic wave absorber.

  Accordingly, a sheet-like material having a large dielectric loss is insulated between the insulating layer 106 on the first conductor layer 101 side and the insulating layer 106 on the second conductor layer 102 side, as in the resistance layer 801 of the above embodiment. Electromagnetic wave absorption of a material having a large dielectric loss instead of the insulating layer 106 between the insulating layer 106 on the first conductor layer 101 side and the insulating layer 106 on the second conductor layer 102 side It is also possible to limit the communication distance by filling the body.

  If a material having a large dielectric loss at the information signal frequency f and a small dielectric loss at the charging signal frequency F is selected, reflection of the information signal can be prevented while feeding without loss.

  In the above embodiment, the electrode 201 is capacitively coupled to the first conductor layer 101, and the electrode 202 is capacitively coupled to the second conductor layer 102. Any one of these capacitive couplings is a conductor coupling. It is also possible. For example, when the electrode 202 and the second conductor layer 102 are conductor-coupled, the communication element 105 is directly installed on the second conductor layer 102. In this case, the resistance layer 801 is appropriately disposed between the second conductor layer 102 and the first conductor layer 101 as in the above-described embodiment.

  With this configuration, when the sheet-like communication device 100 is bent, it is possible to prevent displacement of the first conductor layer 101 and the second conductor layer 102 as much as possible, and to make the communication device 100 more robust. Can be configured. However, when an excessive force is applied, the first conductor layer 101 can be laterally displaced with respect to the electrode 201, and the electrode 201 and the electrode 202 are respectively moved to the first conductor layer 101 and the second conductor layer. It is harder to break than when the conductor is bonded to 102.

  In the above embodiment, the electrode 201 is capacitively coupled to the first conductor layer 101 and the electrode 202 is capacitively coupled to the second conductor layer 102. However, the electrode 201 and the electrode are arranged at different locations on one side of the communication element 105. 202 may be arranged so that they are capacitively coupled to the first conductor layer 101 (or the second conductor layer 102).

  In the case where the communication device 100 is configured to have a size for performing communication by propagation of electromagnetic waves between the first conductor layer 101 and the second conductor layer 102, the electromagnetic waves can be changed if the locations of the electrodes 201 and 202 are different. A potential difference can occur between the two due to the propagation of. Accordingly, even when the electrode 201 and the electrode 202 are capacitively coupled to a common conductor layer, communication and rectification charging are possible.

  As described above, according to the present invention, it is possible to provide a sheet-like communication device that can easily charge the power supply of the communication element.

1 is a perspective view illustrating a schematic configuration of a communication device according to a first embodiment of the present invention. It is sectional drawing which shows schematic structure of the communication apparatus which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows schematic structure of the communication apparatus which concerns on other embodiment of this invention. It is sectional drawing which shows schematic structure of the communication apparatus which concerns on other embodiment of this invention. It is sectional drawing which shows schematic structure of the communication apparatus which concerns on other embodiment of this invention. It is explanatory drawing which shows schematic structure of a communication element which receives power supply. It is a circuit diagram which shows schematic structure of the transmission circuit of a communication element. It is a circuit diagram which shows schematic structure of the receiving circuit of a communication element. It is a circuit diagram which shows schematic structure of the other aspect of the receiving circuit of a communication element. It is sectional drawing which shows schematic structure of the communication apparatus which concerns on other embodiment of this invention. It is explanatory drawing explaining the site | part which should provide a resistance layer with respect to the communication apparatus of a special shape. It is sectional drawing which shows schematic structure of the communication apparatus which concerns on other embodiment of this invention. It is sectional drawing which shows the shape of the hole vicinity of another Example when a communication element, a 1st conductor layer, and a 2nd conductor layer are connected in contact. It is sectional drawing which shows schematic structure of the communication apparatus of the aspect by which a communication element is pinched | interposed between a 1st conductor layer and a 2nd conductor layer. It is explanatory drawing which shows the drive circuit of a communication layer which consists of a 1st conductor layer, and a 2nd conductor layer, and another additional circuit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Communication apparatus 101 1st conductor layer 102 2nd conductor layer 103 Hole 104 Protrusion 105 Communication element 106 Insulation layer 201 Electrode 202 Electrode 301 Insulator 501 Positive terminal 502 Negative terminal 504 Diode 505 Capacitor 506 Transmission circuit 507 Reception circuit 508 Control circuit 601 pMOS transistor 602 diode 603 nMOS transistor 701 resistor 702 resistor 703 comparator 801 resistor layer

Claims (12)

A first sheet conductor portion,
A second sheet conductor portion which is substantially parallel to the said first sheet conductor portion,
A communication device portion having a second electrode coupled capacitively first electrode and the second sheet conductor portion capacitively coupled to said first sheet conductor portion,
Regardless of whether communication is performed by the communication element unit, the voltage of a predetermined charging frequency is applied to the first sheet conductor unit and the second sheet while charging the communication element unit. A power supply unit that is continuously applied between the conductor unit ,
With
Wherein the communication device unit, the voltage between the first electrode and the second electrode changes based on the change of the voltage between said first sheet conductor portion and the second sheet conductor portion Rectify and charge the change and act as a power source,
The communication element unit is configured to transmit the signal to another communication device coupled to the first sheet conductor unit and the second sheet conductor unit based on the signal to be transmitted. Applying a voltage of a predetermined communication frequency between the first electrode and the second electrode to change the voltage between the first sheet conductor portion and the second sheet conductor portion, and / or or, wherein the first sheet conductor portion by propagating electromagnetic waves between the second sheet conductor portion, a communication apparatus characterized by communicating with the other communication device. A first sheet conductor portion,
A second sheet conductor portion which is substantially parallel to the said first sheet conductor portion,
A communication device portion having a second electrode for the conductor coupling the first electrode and the second sheet conductor portion capacitively coupled to said first sheet conductor portion,
Regardless of whether communication is performed by the communication element unit, the voltage of a predetermined charging frequency is applied to the first sheet conductor unit and the second sheet while charging the communication element unit. A power supply unit that is continuously applied between the conductor unit ,
With
Wherein the communication device unit, the voltage between the first electrode and the second electrode changes based on the change of the voltage between said first sheet conductor portion and the second sheet conductor portion Rectify and charge the change and act as a power source,
The communication element unit is configured to transmit the signal to another communication device coupled to the first sheet conductor unit and the second sheet conductor unit based on the signal to be transmitted. Applying a voltage of a predetermined communication frequency between the first electrode and the second electrode to change the voltage between the first sheet conductor portion and the second sheet conductor portion, and / or or, wherein the first sheet conductor portion by propagating electromagnetic waves between the second sheet conductor portion, a communication apparatus characterized by communicating with the other communication device. The communication device according to claim 1 or 2,
The communication element unit is disposed between the first sheet conductor unit and the second sheet conductor unit. The communication device according to claim 3,
Between the first sheet conductor portion and the communication device, a first sheet-like insulator is disposed,
Between the second sheet conductor portion and the communication device, a second sheet-like insulator is disposed,
Between the first sheet-like insulator, the second sheet-like insulator, and the communication device, a sheet-like resistor filling between these is arranged. Communication device. The communication device according to any one of claims 1 to 3,
A sheet-like resistor is connected to a surface of the first sheet conductor portion and the second sheet conductor portion, one of which faces the other, and the sheet-like resistor is insulated from the other. A communication device. The communication device according to any one of claims 1 to 3,
A sheet-like resistor insulated from the first sheet conductor and the second sheet conductor is disposed between the first sheet conductor and the second sheet conductor. The communication device according to any one of claims 1 to 3,
A sheet-like resistor is connected to a region of the surface of the first sheet conductor portion facing the second sheet conductor portion where electromagnetic waves in the frequency band used by the communication element portion are reflected higher than a predetermined ratio. A communication device characterized by being provided. The communication device according to any one of claims 1 to 3,
Of the surface of the first sheet conductor portion facing the second sheet conductor portion, a sheet resistance is connected to a region where the number of the communication element portions arranged per unit area is higher than a predetermined threshold value. A communication device characterized by being provided. The communication device according to any one of claims 3 to 8,
In place of the sheet-like resistor, a sheet-like body having a large dielectric loss is disposed. The communication device according to any one of claims 1 to 3,
A communication device, wherein a material having a large dielectric loss is filled between the first sheet conductor portion and the second sheet conductor portion. The communication device according to any one of claims 1 to 10,
The communication frequency is different from the charging frequency.
The communication element unit separates a component of the communication frequency from a change in voltage between the first electrode and the second electrode, and performs the other communication based on the separated component. A communication apparatus for obtaining a signal received from a device. The communication device according to claim 11,
The communication device, wherein the communication frequency is higher than the charging frequency .

Images