JP3894141B2 - Coating device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a coating apparatus that spins and rotates a substrate in the process of forming a coating film on a substrate to be processed, and more particularly to a coating apparatus having a function of removing a coating solution adhering to an inner surface of a processing container by cleaning.
[0002]
[Prior art]
In a lithography process for manufacturing a liquid crystal display (LCD) or a semiconductor device, a so-called spin coating method is often used to apply a resist solution to a substrate to be processed (glass substrate, semiconductor wafer, etc.). However, in the spin coating method, when the substrate is rotated by spin, the resist solution scattered to the outside of the substrate by centrifugal force hits the inner surface of the processing container, and a part of it adheres as it is, which may become a particle generation source. Therefore, there is a need for a cleaning technique that can effectively and effectively clean the inner surface of the processing container.
[0003]
Conventionally, as a cleaning technique of this type, a cleaning jig instead of a substrate is placed on a spin chuck, and a cleaning liquid is discharged or scattered from the cleaning jig toward a processing container (for example, Patent Document 1). In addition, a cleaning nozzle for spraying the cleaning liquid toward the processing container can be moved up and down under the spin chuck, and when applying the resist solution to the substrate on the spin chuck, the cleaning nozzle is located under (outside) the processing container. In order to clean the processing container, the cleaning nozzle is moved or raised into the processing container (for example, Patent Document 2).
[0004]
[Patent Document 1]
JP-A-5-82435
[Patent Document 2]
JP-A-8-255789
[0005]
[Problems to be solved by the invention]
However, those using a cleaning jig as described above are not only troublesome in loading / unloading and storing the jig, but also the cleaning liquid is supplied to the cleaning jig from the upper surface opening of the processing container by a cleaning liquid supply nozzle or the like. Since it takes the form of supply or replenishment, it is unsuitable for cleaning a processing container with a lid that closes the upper surface opening. In addition, when using a lifting type cleaning nozzle as described above, the mechanism around the spin chuck becomes larger and complicated, making assembly and maintenance difficult, and piping moving up and down due to the lifting and lowering movement of the cleaning nozzle. There are also problems such as cutting.
[0006]
The present invention has been made in view of the problems of the related art, and an object of the present invention is to provide a coating apparatus having a cleaning function capable of easily and effectively cleaning the inner surface of a processing container.
[0007]
Another object of the present invention is to provide a coating apparatus having a cleaning mechanism with good maintainability and high reliability.
[0008]
Another object of the present invention is to provide a coating apparatus equipped with a cleaning mechanism suitable for cleaning a lid-type sealed processing container.
[0009]
[Means for Solving the Problems]
  In order to achieve the above object, a coating apparatus according to the present invention is held by a holding unit for horizontally placing and holding a substrate to be processed, a processing container for housing the holding unit, and the holding unit. Coating liquid supply means for supplying a desired coating liquid to the substrate;A vacuum chuck provided on the holding means for holding the substrate by vacuum suction;Provided in a rotation support shaft for supporting the holding means so as to be capable of spin rotation, a first rotation means for spinning the holding means through the rotation support shaft, a cleaning liquid supply source, the rotation support shaft, and the holding means. And a cleaning means for supplying the cleaning liquid from the cleaning liquid supply source to the inner surface of the processing container through the cleaning liquid supply path.The cleaning liquid supply path is connectable to the cleaning liquid supply source provided in an axial direction through the rotation support shaft, and the first fluid path is provided in the holding means. A vacuum fluid source for generating a vacuum suction force, and a rotary support for the vacuum chuck, the second fluid passage connectable to the second fluid passage, and a cleaning liquid discharge port provided at the end of the second fluid passage A third fluid passage connectable to the vacuum source provided through the shaft in the axial direction; a fourth fluid passage connectable to the third fluid passage provided in the holding means; A vacuum pad provided in the holding means in communication with the fourth fluid passage for vacuum suction in a state where the substrate is placed, and provided in the axial direction through the rotation support shaft. Switching the common flow path to the first fluid passage and the front Selectively used in the third fluid passage.
[0010]
  In the coating apparatus of the present invention, the cleaning liquid supply path is provided in the rotation support shaft and the holding means, and when cleaning the processing container, the cleaning liquid from the cleaning liquid supply source is supplied to the inner surface of the cup through the cleaning liquid supply path.. More specifically, the cleaning liquid supply source is connected to a first fluid passage that can be connected to a cleaning liquid supply source that is provided to penetrate the rotation support shaft in the axial direction, and a first fluid passage that is provided to the holding means. A possible second fluid passage and a cleaning liquid outlet provided at the end of the second fluid passage. In addition, a vacuum chuck provided on the holding means for holding the substrate by vacuum suction is connected to a vacuum source for generating a vacuum suction force and a vacuum source provided in the axial direction through the rotary support shaft. A third possible fluid passage, a fourth fluid passage connectable to a third fluid passage provided in the holding means, and a fourth fluid passage communicating with the fourth fluid passage for vacuum suction in a state where the substrate is placed And a vacuum pad provided on the holding means. And the common flow path provided through the rotation support shaft in the axial direction is switched and selectively used for the first fluid passage and the third fluid passage. That is, when the substrate is held on the holding means by the vacuum chuck, the common flow path is used as the third fluid passage, and when the processing container is cleaned by the cleaning means, the common flow path is used as the first fluid passage. use.
[0014]
  in this case,Preferably, the cleaning means has a first port connected to the common flow path of the rotation support shaft, a second port connected to the cleaning liquid supply source, and a third port connected to the vacuum source. The first switch connects the first port to the second port when the processing container is cleaned by the above-mentioned method, and connects the first port to the third port when the substrate is held on the holding means by the vacuum chuck. You may have a valve. In the spin chuck, a fourth port connected to the common flow path of the rotation support shaft, a fifth port connected to the second fluid passage, and a sixth port connected to the fourth fluid passage. When the processing container is cleaned by the cleaning means, the fourth port is connected to the fifth port, and when the substrate is held on the holding means by the vacuum chuck, the fourth port is set to the sixth port. The structure which provides the 2nd switching valve connected to this port is also preferable.
[0015]
According to a preferred aspect of the present invention, the second switching valve includes a first opening that forms a fourth port on one end face of the rotation support shaft facing the common flow path, and a fourth port. A cylindrical valve chamber having a second opening that forms a fifth port on the side wall near one end face and a third opening that forms a sixth port on the side wall near the other end face; A first position in which the sixth port is closed and the fifth port is communicated with the fourth port; and the fifth port is closed and the sixth port is closed. And a valve body movable between a second position communicating with the fourth port.
[0016]
Preferably, a spring member for biasing the valve body to the second position is provided, and the position of the valve body is set to the first position in accordance with the spring force of the spring member and the fluid pressure on the first port side. It is good also as a structure switched between 2nd positions. With this configuration, the second switching valve can automatically perform a switching operation according to the fluid pressure on the fluid passage (common flow path) side of the rotation support shaft. In this case, in order to ensure stable and reliable valve operation, it is preferable that the cleaning liquid sent from the cleaning liquid supply source to the surface facing the first port of the valve body through the common flow path of the rotation support shaft. It is good also as a structure which provides the recessed part for receiving a pressure in the direction which resists the spring force of a spring member. More preferably, the valve body has at least one through hole facing the first port at a position avoiding the recess, and when the valve body is held at the second position, the valve body is inserted through the through hole of the valve body. The sixth port may be configured to communicate with the fourth port.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
[0018]
FIG. 1 shows a coating and developing processing system as a configuration example to which the substrate processing apparatus of the present invention can be applied. This coating / development processing system is installed in a clean room and uses, for example, an LCD substrate as a substrate to be processed, and performs cleaning, resist coating, pre-baking, development, and post-baking in the photolithography process in the LCD manufacturing process. is there. The exposure process is performed by an external exposure apparatus (not shown) installed adjacent to this system.
[0019]
This coating and developing system is roughly divided into a cassette station (C / S) 10, a process station (P / S) 12, and an interface unit (I / F) 14.
[0020]
A cassette station (C / S) 10 installed at one end of the system includes a cassette stage 16 on which a predetermined number, for example, four cassettes C for storing a plurality of substrates G can be placed, and a side on the cassette stage 16. And a transport path 17 provided in parallel with the arrangement direction of the cassette C, and a transport mechanism 20 that is movable on the transport path 17 and that allows the substrate C to be taken in and out of the cassette C on the stage 16. The transport mechanism 20 has a means for holding the substrate G, for example, a transport arm, can be operated with four axes of X, Y, Z, and θ, and is transported on the process station (P / S) 12 side described later. And the substrate G can be transferred.
[0021]
The process station (P / S) 12 includes, in order from the cassette station (C / S) 10 side, a cleaning process unit 22, a coating process unit 24, and a development process unit 26, a substrate relay unit 23, a chemical solution supply unit 25, and It is provided in a horizontal row via (spaced) the space 27.
[0022]
The cleaning process unit 22 includes two scrubber cleaning units (SCR) 28, an upper and lower ultraviolet irradiation / cooling unit (UV / COL) 30, a heating unit (HP) 32, and a cooling unit (COL) 34. Contains.
[0023]
The coating process unit 24 includes a resist coating unit (CT) 40, a vacuum drying unit (VD) 42, an edge remover unit (ER) 44, an upper and lower two-stage adhesion / cooling unit (AD / COL) 46, An upper and lower two-stage heating / cooling unit (HP / COL) 48 and a heating unit (HP) 50 are included.
[0024]
The development process unit 26 includes three development units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 53, and a heating unit (HP) 55.
[0025]
Conveying paths 36, 51, 58 are provided in the longitudinal direction at the center of each of the process units 22, 24, 26, and the main conveying devices 38, 54, 60 move along the respective conveying paths, and each process unit 22 The unit is accessed to carry in / out or carry the substrate G. In this system, in each process part 22, 24, 26, a spinner system unit (SCR, CT, DEV, etc.) is disposed on one side of the transport paths 36, 51, 58, and a heat treatment system is disposed on the other side. Units (HP, COL, etc.) are arranged.
[0026]
The interface unit (I / F) 14 installed at the other end of the system is provided with an extension (substrate transfer unit) 56 and a buffer stage 57 on the side adjacent to the process station 12, and is transported to the side adjacent to the exposure apparatus. A mechanism 59 is provided. The transport mechanism 59 is movable on the transport path 19 extending in the Y direction, and is used for loading / unloading the substrate G to / from the buffer stage 57, an extension (substrate transfer unit) 56, and an adjacent exposure device. The substrate G is transferred.
[0027]
FIG. 2 shows a processing procedure in this coating and developing processing system. First, in the cassette station (C / S) 10, the transport mechanism 20 takes out one substrate G from a predetermined cassette C on the stage 12 and transports it to the cleaning process unit 22 of the process station (P / S) 12. It is passed to the device 38 (step S1).
[0028]
In the cleaning process section 22, the substrate G is first sequentially carried into an ultraviolet irradiation / cooling unit (UV / COL) 30, subjected to dry cleaning by ultraviolet irradiation in the first ultraviolet irradiation unit (UV), and then subjected to the next cooling unit ( In COL), the temperature is cooled to a predetermined temperature (step S2). This UV cleaning mainly removes organic substances on the substrate surface.
[0029]
Next, the substrate G is subjected to a scrubbing cleaning process by one of the scrubber cleaning units (SCR) 28 to remove particulate dirt from the substrate surface (step S3). After the scrubbing cleaning, the substrate G is subjected to dehydration treatment by heating in the heating unit (HP) 32 (step S4), and then cooled to a constant substrate temperature by the cooling unit (COL) 34 (step S5). Thus, the pretreatment in the cleaning process unit 22 is completed, and the substrate G is transferred to the coating process unit 24 by the main transfer device 38 via the substrate transfer unit 23.
[0030]
In the coating process unit 24, the substrate G is first sequentially carried into an adhesion / cooling unit (AD / COL) 46, and undergoes a hydrophobic treatment (HMDS) in the first adhesion unit (AD) (step S6). The cooling unit (COL) cools to a constant substrate temperature (step S7).
[0031]
Thereafter, the substrate G is coated with a resist solution by a resist coating unit (CT) 40, and then subjected to a drying process by a reduced pressure drying unit (VD) 42, and then an edge remover unit (ER) 44 of the periphery of the substrate Excess (unnecessary) resist is removed (step S8).
[0032]
Next, the substrate G is sequentially carried into the heating / cooling unit (HP / COL) 48, and the first heating unit (HP) performs baking after coating (pre-baking) (step S9), and then the cooling unit ( COL) to cool to a constant substrate temperature (step S10). In addition, the heating unit (HP) 50 can also be used for baking after this application | coating.
[0033]
After the coating process, the substrate G is transported to the interface unit (I / F) 14 by the main transport device 54 of the coating process unit 24 and the main transport device 60 of the development process unit 26, and is passed from there to the exposure apparatus. (Step S11). In the exposure apparatus, a predetermined circuit pattern is exposed on the resist on the substrate G. After the pattern exposure, the substrate G is returned from the exposure apparatus to the interface unit (I / F) 14. The transport mechanism 59 of the interface unit (I / F) 14 passes the substrate G received from the exposure apparatus to the development process unit 26 of the process station (P / S) 12 via the extension 56 (step S11).
[0034]
In the development process unit 26, the substrate G is subjected to development processing in any one of the development units (DEV) 52 (step S12), and then sequentially carried into one of the heating / cooling units (HP / COL) 53, Post baking is performed in the first heating unit (HP) (step S13), and then the substrate is cooled to a constant substrate temperature in the cooling unit (COL) (step S14). A heating unit (HP) 55 can also be used for this post-baking.
[0035]
The substrate G that has undergone a series of processing in the development process section 26 is returned to the cassette station (C / S) 10 by the transfer devices 60, 54, and 38 in the process station (P / S) 24, where the transfer mechanism 20 Is stored in one of the cassettes C (step S1).
[0036]
In this coating and developing system, the present invention can be applied to, for example, the resist coating unit (CT) 40 of the coating process unit 24. Hereinafter, an embodiment in which the present invention is applied to a resist coating unit (CT) 40 will be described with reference to FIGS.
[0037]
3 to 7 show the overall configuration of the resist coating unit (CT) 40 in the embodiment.
[0038]
The resist coating unit (CT) 40 includes a rotary cup 60 as a substantially hermetically sealable processing container, and a spin rotatable and vertically movable for placing and holding the substrate G in the rotary cup 60 horizontally. A spin chuck 62 and a drive unit 66 provided under the rotary cup 60 for rotating and rotating the spin chuck 62 through a vertical rotation support shaft 64 are provided.
[0039]
The rotary cup 60 has a cup body 68 having an upper surface opened and a lid 70 for closing the upper surface opening of the cup body 68. The side wall of the cup body 68 extends in an annular shape so as to surround the outer periphery of the spin chuck 62, and has an inner diameter that gradually decreases in a tapered shape upward.
[0040]
An opening for passing the support shaft 64 is formed at the center of the bottom of the cup body 68, and a cylindrical joint member or connecting cylinder 72 extending in the vertical direction from the drive unit 64 at the periphery of the opening. The upper ends of the are joined. The cup body 68 or the rotating cup 60 is configured to spin-rotate together with the spin chuck 62 by the drive of the drive unit 66 through the connecting cylinder 72. Inside the bottom of the cup body 68, the spin chuck 62 is lowered to the lowest position (in the state shown in the figure) and is in pressure contact with the lower surface of the spin chuck 62 so that the processing space in the rotating cup 60 is disposed below the container. A ring-shaped seal member, for example, an O-ring 74 for hermetically sealing from the atmosphere is disposed, and a frame-shaped cleaning liquid guide member 76 having a plane size slightly larger than the spin chuck 62 is disposed. The cleaning liquid guide member 76 forms a part of the cleaning mechanism in this embodiment, and its detailed configuration and operation will be described later. A large number of exhaust and drain openings or drain ports 78 are formed at the outer peripheral end of the bottom of the cup body 68 at appropriate intervals in the circumferential direction.
[0041]
On the outside of the cup body 68 of the rotating cup 60, a fixed drain cup 80 having an open top surface is disposed. At the bottom of the drain cup 80, one or more drainage ports 80a are provided near the outer peripheral end, and one or more exhaust ports 80b are provided inside the drainage port 80a. The drain port 80a is connected to a drain processing unit (not shown) via a drain pipe, and the exhaust port 80b is connected to an exhaust system (not shown) such as an exhaust duct via an exhaust pipe.
[0042]
The spin chuck 62 is made of a rigid body such as stainless steel (SUS), and a vacuum pad 82 is provided on the upper surface on which the substrate G is placed. The vacuum pad 82 is made of, for example, an aluminum plate and has a planar shape (for example, a rectangular shape) corresponding to the substrate G. As shown in FIG. 4, concentric and radial vacuum suction grooves 83 are provided on the upper surface. A plurality of through holes or vacuum suction holes 84 connected to the suction grooves 83 are provided discretely.
[0043]
The rotation support shaft 64 is formed with a fluid passage 64a penetrating in the axial direction as indicated by a dotted line in FIGS. Further, a vacuum passage 85 (FIGS. 8 and 9) for connecting the upper end of the fluid passage 64a of the rotation support shaft 64 and the vacuum pad 82 (particularly, the vacuum suction hole 84) is formed in the spin chuck 62. Yes. On the other hand, a vacuum source 86 such as a vacuum pump can be connected to the lower end of the fluid passage 64 a of the rotation support shaft 64 via a switching valve 90. By connecting the vacuum source 86 to the fluid passage 64 a of the rotation support shaft 64, the vacuum pad 82 is activated or activated, and the substrate G is fixed and held on the spin chuck 62 with a vacuum adsorption force.
[0044]
Furthermore, the resist coating unit (CT) 40 of this embodiment has a cleaning mechanism for cleaning the rotary cup 60. This cleaning mechanism uses the fluid passage 64 a of the rotation support shaft 64 as a part of the cleaning liquid supply path in order to supply the cleaning liquid to the inner surface of the rotary cup 60. More specifically, a cleaning liquid supply source 88 that sends out a cleaning liquid (for example, thinner) at a predetermined pressure can be connected to the lower end of the fluid passage 64 a of the rotation support shaft 64 via the switching valve 90. On the other hand, as shown in FIG. 7, a plurality of cleaning liquid passages 92 that can be connected to the upper end of the fluid passage 64a of the rotation support shaft 64 are provided in the spin chuck 62 in a radial manner. A cleaning liquid discharge port 94 is formed by opening outward in the radial direction on the back side of the pad 82. When the cleaning mechanism is activated, the cleaning liquid from the cleaning liquid supply source 88 passes through the fluid passage 64 a of the rotation support shaft 64 and the cleaning liquid passage 92 in the spin chuck 62 and is directed from the cleaning liquid discharge port 94 toward the inner surface of the rotary cup 60. Are discharged and supplied.
[0045]
The cleaning liquid guide member 76 arranged in a frame shape on the bottom surface of the rotating cup 60 reflects or cleans the cleaning liquid discharged from the cleaning liquid discharge port 94 of the spin chuck 62 upward (particularly toward the inner surface of the lid 70). It is for guidance. The inner surface of each side of the cleaning liquid guide member 76 that faces the spin chuck 62 is formed as an inclined reflection surface or guide surface 76a that faces obliquely upward. As shown in FIG. 6, the cleaning liquid discharged almost horizontally toward the radially outer side from the cleaning liquid discharge port 94 of the spin chuck 62 hits the inclined guide surface 76 a of the cleaning liquid guide member 76 and is directed to the upper lid 70 side. It is like that. As shown in FIG. 7, the distance from the cleaning liquid guide member 76 to the cup peripheral portion is relatively large at the long side portion and relatively small at the short side portion. Therefore, it is preferable that the inclined guide surface 76a of the cleaning liquid guide member 76 is formed with a relatively gentle slope at the long side portion and a relatively steep slope at the short side portion.
[0046]
The switching valve 90 is composed of, for example, an air-operated directional control valve, and is connected to a port 90 a connected to the lower end of the fluid passage 64 a of the rotation support shaft 64 via a pipe 92 and a vacuum source 86 via a pipe 94. It has a port 90b connected and a port 90c connected to the cleaning liquid supply source 88 via a pipe 96, and operates the vacuum pad 82 under the control of a control unit (not shown). When the substrate G is held on the spin chuck 62, the port 90a is connected to the port 90b, and when the cleaning mechanism is operated to clean the rotary cup 60, the port 90a is connected to the port 90c. Each of the vacuum source 86 and the cleaning liquid supply source 88 includes an on / off control open / close valve (not shown).
[0047]
As shown in FIG. 3, in this resist coating unit (CT) 40, a resist nozzle 100 for supplying a resist solution to the substrate G in the rotating cup 60 is attached to a swivel horizontal arm 102, and an arm driving unit By 104, it is swung in the horizontal direction between the resist solution discharge position set above the processing container 60 and the standby position set outside the rotary cup 60. A resist solution supply source 108 is connected to the resist nozzle 100 via a resist solution supply pipe 106, and an opening / closing valve 110 is provided in the middle of the resist solution supply pipe 106.
[0048]
The lid 70 of the rotating cup 60 is handled by the robot arm 112, and when the substrate G is loaded into / unloaded from the rotating cup 60 or when the resist solution is supplied to the substrate G, as shown in FIG. When the film thickness of the resist solution on the substrate G is made uniform by high-speed spin rotation or when the rotating cup 60 is cleaned, it is made to fit the upper surface of the cup body 68 as shown in FIG. The upper surface opening is closed. Although not shown, the lid 70 and the upper surface of the cup body 68 are configured to engage with each other, and the lid 70 rotates integrally with the cup body 68.
[0049]
Here, the overall operation of the resist coating unit (CT) 40 will be described with reference to FIGS. When loading the substrate G to be processed, the lid 70 is lifted upward by the robot arm 112 as shown in FIG. 3, and the upper surface of the rotary cup 60 is opened (opened). The substrate G transferred by the main transfer device 54 (FIG. 1) is placed on the upper surface of the spin chuck 62 from the upper surface opening of the rotary cup 60. At this time, the spin chuck 62 receives the substrate G at the uppermost height position for transferring the substrate and then moves down to the height position where the resist is dropped. The substrate G is fixed and held on the spin chuck 62 by vacuum suction by a vacuum pad 82. In order to activate the vacuum pad 82, the switching valve 90 switches the port 90a on the rotation support shaft 64 side to the port 90b on the vacuum source 86 side.
[0050]
After the substrate G is loaded into the rotating cup 60 as described above, the arm driving unit 104 turns the horizontal arm 102 to move the resist nozzle 100 to the resist solution discharge position above the rotating cup 60. Next, the on-off valve 1102 is opened, and the resist solution from the resist solution supply source 100 is sent to the resist nozzle 100 through the resist supply pipe 110, and the resist solution is transferred from the resist nozzle 100 to the upper surface of the substrate G on the spin chuck 62 ( To be treated). Usually, the resist solution is dropped onto the center of the upper surface of the substrate G while the spin chuck 62 and the cup body 68 are rotated by a rotational drive of the drive unit 66 at a relatively low rotational speed (for example, 100 to 500 rpm). If necessary, a solvent such as thinner may be applied onto the substrate G using a dedicated nozzle (not shown) prior to dropping the resist solution.
[0051]
When the resist solution is dropped or applied with a predetermined rough distribution on the substrate G as described above, the on-off valve 110 is closed and the supply of the resist solution is stopped, and the arm driving unit 104 causes the resist nozzle 100 to rotate the resist cup 100. Retract out of 60. Then, the drive unit 66 temporarily stops the spin rotation of the spin chuck 62 and the cup body 68, and the robot arm 112 covers the lid 70 on the upper surface of the cup body 68 so that the rotary cup 60 is substantially sealed. In order to seal the rotary cup 60, the height position of the spin chuck 62 may be adjusted to the lowest position in contact with the O-ring 74 as shown in FIG.
[0052]
In this manner, after the resist solution is supplied to the substrate G on the spin chuck 62 and the rotary cup 60 is almost sealed, the spin chuck 62 and the cup are rotated by the drive unit 66 as shown in FIG. The main body 68 is spun at a high rotational speed (for example, 1000 rpm or more). By the high-speed spin rotation in this closed space, the resist solution is spread on the substrate G by centrifugal force, and the film thickness of the resist solution is made uniform. At this time, the resist solution spun off and scattered out of the substrate G is received by the inner surface of the rotating cup 60, particularly the side wall of the cup body 68 and the inner surface of the lid body 70, and is applied to the outer peripheral edge of the bottom of the cup body 68. It is guided to the drain cup 80 through the formed drain port 78 and sent to the drainage processing unit from the drain port 80a at the bottom of the drain cup 80.
[0053]
In addition, in order to prevent air from flowing out from the drain port 78 during the spin rotation and causing the inside of the rotating cup 60 to have an excessive negative pressure, an appropriate air supply port (see FIG. (Not shown) may be provided. The air that has passed from the drain port 78 of the rotary cup 60 to the drain cup 80 is sent to the exhaust system from the bottom exhaust port 80b.
[0054]
When the leveling of the resist film by high-speed spin rotation as described above is completed over a required time (for example, several minutes), the resist coating process is completed. Immediately after this, the robot arm 112 opens the lid 70 to open the upper surface of the rotary cup 60, the drive unit 66 raises the spin chuck 62 to the height position for substrate transfer, and the vacuum source 86 stops the vacuuming. Thus, the vacuum pad 82 is deactivated. Then, the main transfer device 54 (FIG. 1) accesses to take out the substrate G from the spin chuck 62 and carry it out.
[0055]
In the resist coating unit (CT) 40, for example, when the resist coating process as described above is performed a predetermined number of times, the cleaning mechanism of the present embodiment is operated to adhere to the inner surface of the rotary cup 60. Cleaning may be performed to remove the resist.
[0056]
As shown in FIG. 6, when cleaning the rotating cup 60, the spin chuck 62 and the rotating cup are rotated by the driving unit 66 while the lid 70 is put on the empty cup body 68 without the substrate G. 60 is spin-rotated at an appropriate rotation speed (for example, 1000 rpm or more). In the switching valve 90, the port 90 a on the rotation support shaft 64 side is switched to the port 90 c on the cleaning liquid supply source 88 side, and the cleaning liquid from the cleaning liquid supply source 88 is transferred to the spin chuck 62 via the fluid passage 64 a of the rotation support shaft 64. The cleaning liquid is sent to the fluid passage 92 and discharged from the cleaning liquid discharge port 94 on the back surface side of the spin chuck 62.
[0057]
The cleaning liquid discharged almost horizontally toward the outer side in the radial direction from the cleaning liquid discharge port 94 of the spin chuck 62 strikes the inclined guide surface 76a of the cleaning liquid guide member 76 and diffuses upward, mainly in the vicinity of the outer peripheral edge of the lid 70 and the cup. The resist hits the inner side surface of the upper portion of the side wall of the main body 68 and spreads from there to adhere to the inner side surface of the cup. The used cleaning solution in which the resist is dissolved is discharged from the drain port 78 of the cup body 68 to the drain cup 80 side by centrifugal force and gravity. When the cleaning of the rotary cup 60 is completed, the cleaning liquid supply source 88 stops sending out the cleaning liquid, and the drive unit 66 stops the rotational drive of the spin chuck 62 and the rotary cup 60.
[0058]
In the configuration in which the air supply port (not shown) is provided in the upper part of the cup body 68 or the lid 70 as described above, a spiral air flow is generated in the rotating cup 60 during the cup cleaning, and the cleaning liquid discharge port 94 is generated. It is possible to spread and supply the cleaning liquid discharged more on the inner surface of the cup in a wider range by putting it on the air flow.
[0059]
In the resist coating unit (CT) 40 of this embodiment, cleaning liquid supply paths (64a, 92, 94) are provided in the rotation support shaft 64 and the spin chuck 62, and when cleaning the cup 60, the cleaning liquid from the cleaning liquid supply source 88 is used. Since it is supplied to the inner surface of the cup via the cleaning liquid supply path (64a, 92), there is no need to use a portable cleaning jig that is troublesome to handle, and for large-scale cleaning that goes in and out of the processing container No nozzle unit is required, and simple, efficient, maintainable and reliable cleaning functions can be realized. Further, the structure (76) in which the cleaning liquid is directed from the vicinity of the bottom of the cup body 68 toward the lid body 70 side allows the resist attached to the cup body 68 and the inner surface of the lid body 70 in the lid-type sealed rotary cup 60 to be removed. Thorough cleaning and removal is also possible.
[0060]
Further, in this resist coating unit (CT) 40, a vacuum pad 82 for holding the substrate G by vacuum suction is provided on the spin chuck 62, and vacuum passages (64a, 85) provided on the rotation drive shaft 64 and the spin chuck 62 are provided. Thus, a vacuum force is supplied to the vacuum pad 82, and in this vacuum mechanism, a part of the vacuum supply path (64a, 85) is also used as the fluid path 64a of the rotation support shaft 64. As a result, the cleaning mechanism and the vacuum mechanism can be provided together with the minimum necessary members and occupied space.
[0061]
In this embodiment, in order to share (use switching) the fluid passage 64a of the rotation support shaft 64 for the cleaning fluid supply passage and the vacuum supply passage, the cleaning fluid is connected to the lower end opening of the fluid passage 64a via the switching valve 90 as described above. One of the supply source 88 and the vacuum source 86 is selectively connected. Further, either one of the cleaning liquid passage 92 and the vacuum passage 85 is selectively connected to the upper end opening of the fluid passage 64a via a switching valve 114 (FIGS. 8 and 9) incorporated in the spin chuck 62 described later. ing.
[0062]
8 and 9, the configuration and operation of the switching valve 114 built in the spin chuck 62 in this embodiment will be described. FIG. 8 shows the state of the switching valve 114 when the vacuum mechanism is operated to hold the substrate G on the spin chuck 62. FIG. 9 shows the state of the switching valve 114 when the cleaning mechanism is operating.
[0063]
As shown in FIGS. 8 and 9, the back surface (lower surface) of the spin chuck 62 is formed with a thick central portion, and the upper end portion of the rotation support shaft 64 is inserted into a counterbore 62a formed in the thick central portion. And is fastened and fixed by a power lock 116. An opening 118 (port A) that is coaxially connected to the fluid passage 64a of the rotation support shaft 64 is formed on the ceiling surface of the counterbore 62a facing the upper end surface of the rotation support shaft 64, and further, this opening 118 ( A cylindrical through-hole having a relatively large diameter that extends vertically upward to the upper surface of the spin chuck 62 continuously with the port A) is formed as the valve chamber 120. A cylindrical valve body 122 made of, for example, stainless steel (SUS) is accommodated in the valve chamber 120 so as to be slidable in the axial direction.
[0064]
At the lower end of the valve chamber 120, an opening 124 (port B) communicating with the cleaning liquid passage 92 is formed on the side wall adjacent to the opening 118 (port A) on the fluid passage 64 a side. The upper end of the valve chamber 120 is closed by a vacuum pad 82, and an opening 126 (port C) communicating with the vacuum passage 85 is formed at the upper end of the valve chamber 120.
[0065]
A concave portion 128 having substantially the same diameter as the fluid passage 64a and the opening 118 (port A) is formed at the center of the lower surface of the valve body 122 so as to face the fluid passage 64a of the rotation support shaft 64. A concave portion 130 is also formed at the center of the upper surface of the valve body 122, and a compression coil spring 132 is inserted in the concave portion 130 in the vertical direction so as to be pushed under the vacuum pad 82. The valve body 122 is formed with one or a plurality (eight in the illustrated example) of axial through holes 134 at positions avoiding the recesses 128 and 130, that is, at the outer periphery.
[0066]
The valve body 122 is formed in a size slightly shorter than the valve chamber 120 in the axial direction. The first position (the position shown in FIG. 9) where the lower surface of the valve body 122 is in close contact with the vacuum pad 82 as an upper valve seat. ) And the second position (position shown in FIG. 8) where the lower peripheral edge of the valve body 122 is in close contact with the lower end seat of the valve chamber 120 as a lower valve seat.
[0067]
More specifically, when the state of FIG. 8, that is, when the vacuum mechanism is operated, the lower peripheral edge of the valve body 122 is pressed against the bent lower end surface (lower valve seat) of the valve chamber 120 by the spring force of the compression coil spring 132. Accordingly, the opening 124 (port B) on the cleaning liquid passage 92 side is closed by the outer peripheral surface of the lower end portion of the valve body 122, while the opening 126 (port C) on the vacuum passage 85 side is the through hole of the valve body 122. The rotation support shaft 64 communicates with the opening (port A) on the fluid passage 64 a side via the 134. Thus, the vacuum suction force from the vacuum source 86 is applied to the vacuum suction hole 84 or suction groove 83 (see FIG. 8) of the vacuum pad 82 via the fluid passage 64a of the rotation support shaft 64, the switching valve 114 in the spin chuck 62, and the vacuum passage 85. 4) is transmitted or supplied. The vacuum passage 85 is provided between the upper surface of the spin chuck 62 and the lower surface of the vacuum pad 82.
[0068]
9, that is, when the cleaning mechanism operates, the pressure of the opening (port A) on the fluid passage 64 a side of the rotation support shaft 64, that is, the pressure of the cleaning liquid sent from the cleaning liquid supply source 88 is the spring of the compression coil spring 132. The upper end surface of the valve body 122 is pressed against the vacuum pad 82 (upper valve seat). Thereby, the opening 126 (port C) on the vacuum passage 85 side is closed by the outer peripheral surface of the upper end portion of the valve body 122, while the opening 124 (port B) on the cleaning liquid passage 92 side is fluid of the rotation support shaft 64. It communicates with the opening (port A) on the passage 64a side. Thus, the vacuum suction force from the cleaning liquid supply source 88 is supplied to the inner surface of the rotary cup 60 via the fluid passage 64 a of the rotation support shaft 64, the switching valve 114 in the spin chuck 62, the cleaning liquid passage 92 and the cleaning liquid discharge port 94. Is done.
[0069]
Immediately after the start of the operation of the cleaning mechanism, the cleaning liquid rising in the fluid passage 64a of the rotation support shaft 64 first hits the concave portion 128 on the lower surface of the valve body 122, and causes the valve body 122 to flow through the valve body 122 with a vertically regulated flow pressure. The compression coil spring 132 is pushed up to the first position. When the valve body 122 moves to the first position, the upper end surface of the valve body 122 is closed by the upper valve seat, so that the cleaning liquid does not pass through the through hole 134.
[0070]
As described above, in this embodiment, the switching valve 114 connected to the fluid passage 64a of the rotation support shaft 64 is provided in the spin chuck 62 so that the spin chuck 62 and the rotation support shaft 64 can be used both as a cleaning mechanism and a vacuum mechanism. Built-in. The switching valve 114 is configured to be able to automatically switch according to the fluid pressure on the fluid passage 64a side, and no special external operating force is required.
[0071]
FIG. 10 shows a configuration example of the drive unit 66 in the resist coating unit (CT) 40 of this embodiment. The drive unit 66 includes a rotation drive unit for rotationally driving the spin chuck 62 and the cup body 66, and a lift drive unit for moving the spin chuck 62 up and down.
[0072]
A fixed cylindrical collar member 120 is provided around the rotation support shaft 64, and a bearing 142 that supports the rotation support shaft 64 so as to be rotatable and slidable in the axial direction is provided on the inner peripheral side of the collar member 140. In addition, a bearing 144 that rotatably supports the connecting cylinder 72 is provided on the outer peripheral side of the collar member 120. The rotation support shaft 64 and the connecting cylinder 72 are coupled to driven pulleys 146 and 148 that are coaxial and have the same diameter. These driven pulleys 146 and 148 are connected to drive pulleys 154 and 156 having substantially the same diameter and the same diameter via endless belts 150 and 152, respectively. Both drive pulleys 154 and 156 are coupled to rotary drive shafts 162 and 164 of drive motors 158 and 160, respectively. When the drive motors 158 and 160 rotate at the same rotation speed in the same rotation direction, the rotation support shaft 64 and the connecting cylinder 72 are connected via the drive pulleys 154 and 156, the endless belts 150 and 152, and the driven pulleys 146 and 148. Spins in the same rotational direction at the same rotational speed.
[0073]
The rotation support shaft 64 and the support frame 166 that supports the drive motor 158 are connected to the piston rod 170 of the elevating cylinder 168 and are moved up and down together by the elevating drive of the elevating cylinder 168. A lower end opening of the rotation support shaft 64 is connected to a joint 174 of the pipe 92 in an airtight manner by a vacuum seal 172 so as to be rotatable.
[0074]
The embodiment described above can be variously modified based on the technical idea of the present invention. For example, in the above-described embodiment, the processing container is configured as the rotating cup 60 that rotates together with the spin chuck 62, but may be configured as a fixed cup. The configuration of the processing container itself can be variously modified, and the present invention can be applied to a normally open processing container without a lid. In the above embodiment, the automatic switching type switching valve 114 is provided in the spin chuck 62. However, it can be replaced with a switching valve of a type that operates with an external operating force such as an electromagnetic valve. In the above embodiment, the vacuum type vacuum pad 82 is used to hold the substrate G on the spin chuck 62, but it can be replaced with a mechanical type holding means. Various positions or portions where the cleaning liquid discharge port 94 is provided in the spin chuck 62 can be selected. Any method for dropping or coating the resist solution on the substrate can be used.
[0075]
The above-described embodiment relates to a resist coating apparatus in a coating / development processing system for LCD manufacturing. However, the present invention is applicable to any application that supplies a coating liquid onto a substrate to be processed. As the coating solution in the present invention, in addition to the resist solution, liquids such as an interlayer insulating material, a dielectric material, and a wiring material can be used. The substrate to be processed in the present invention is not limited to an LCD substrate, and other flat panel display substrates, semiconductor wafers, CD substrates, glass substrates, photomasks, printed substrates, and the like are also possible.
[0076]
【The invention's effect】
As described above, according to the coating apparatus of the present invention, the inner surface of the processing container can be easily and effectively cleaned, and the maintainability and reliability can be improved. Moreover, it can respond | correspond suitably also to the washing | cleaning of a closed type processing container with a lid | cover.
[Brief description of the drawings]
FIG. 1 is a plan view showing a configuration of a coating and developing treatment system to which a coating apparatus of the present invention can be applied.
FIG. 2 is a flowchart showing a processing procedure in the coating and developing treatment system of the embodiment.
FIG. 3 is a schematic cross-sectional view showing an entire configuration (state when resist is dropped) of the resist coating unit of the embodiment.
FIG. 4 is a plan view showing a configuration of a vacuum pad in the resist coating unit of the embodiment.
FIG. 5 is a schematic cross-sectional view showing an overall configuration of the resist coating unit of the embodiment (a state during high-speed spin rotation for uniform film thickness).
FIG. 6 is a schematic cross-sectional view showing an overall configuration (state at the time of rotating cup cleaning) of the resist coating unit of the embodiment.
FIG. 7 is a plan view showing a configuration of a cleaning liquid passage in a spin chuck and a configuration of a cleaning liquid guide member in the resist coating unit of the embodiment.
FIG. 8 is a partial cross-sectional view showing the configuration (state when the cleaning mechanism is activated) of the switching valve in the spin chuck in the resist coating unit of the embodiment.
FIG. 9 is a partial cross-sectional view showing the configuration of the switching valve in the spin chuck (state when the vacuum mechanism is activated) in the resist coating unit of the embodiment.
FIG. 10 is a diagram illustrating a configuration of a drive unit in the resist coating unit of the embodiment.
[Explanation of symbols]
40 resist coating unit (CT)
60 rotating cups
62 Spin chuck
64 Rotating support shaft
64a Fluid passage
66 Drive unit
68 cup body
70 lid
72 Connecting cylinder
76 Cleaning liquid guide member
78 Drain port
80 drain cup
82 Vacuum Pad
85 Vacuum passage
86 Vacuum source
88 Cleaning fluid supply source
90 selector valve
92 Cleaning fluid passage
94 Cleaning liquid outlet
100 resist nozzle
108 Resist liquid supply source
112 Robot arm
114 selector valve
118 Opening (Port A)
120 Valve chamber
122 Valve body
124 opening (port B)
126 Opening (Port C)
128 recess
132 Compression coil spring

Claims (7)

Holding means for horizontally placing and holding the substrate to be processed;
A processing container containing the holding means;
A coating liquid supply means for supplying a desired coating liquid to the substrate held by the holding means;
A vacuum chuck provided on the holding means for holding the substrate by vacuum suction;
A rotation support shaft for supporting the holding means in a spin-rotatable manner;
First rotating means for spinning the holding means through the rotation support shaft;
A cleaning means having a cleaning liquid supply source, a cleaning liquid supply path provided in the rotation support shaft and the holding means, and supplying the cleaning liquid from the cleaning liquid supply source to the inner surface of the processing container via the cleaning liquid supply path It has a door,
The cleaning liquid supply path is connected to a first fluid passage that is connectable to the cleaning liquid supply source provided in an axial direction through the rotation support shaft, and is connected to the first fluid passage provided in the holding means. A possible second fluid passage, and a cleaning liquid outlet provided at the end of the second fluid passage,
The vacuum chuck is provided in the holding means, a vacuum source for generating a vacuum suction force, a third fluid passage that is connectable to the vacuum source provided in an axial direction through the rotation support shaft, and A fourth fluid passage connectable to the third fluid passage, and a vacuum provided in the holding means in communication with the fourth fluid passage for vacuum suction in a state where the substrate is placed And a pad
A coating apparatus that selectively uses the first fluid passage and the third fluid passage by switching a common passage provided through the rotation support shaft in the axial direction .   A first port connected to a common flow path of the rotation support shaft; a second port connected to the cleaning liquid supply source; and a third port connected to the vacuum source; When cleaning the processing container by means, the first port is connected to the second port, and when holding the substrate on the holding means by the vacuum chuck, the first port is connected to the third port. The coating apparatus according to claim 1, further comprising a first switching valve connected to the other port.   In the spin chuck, a fourth port connected to a common flow path of the rotation support shaft, a fifth port connected to the second fluid passage, and a fourth fluid passage connected to the fourth fluid passage And when cleaning the processing container by the cleaning means, the fourth port is connected to the fifth port, and the substrate is held on the holding means by the vacuum chuck. The coating apparatus according to claim 1 or 2, wherein a second switching valve is provided to connect the fourth port to the sixth port. The second switching valve is
A first opening for forming the fourth port on one end face of the rotation support shaft facing the common flow path; and the fifth port on a side wall near the one end face close to the fourth port. A cylindrical valve chamber having a second opening to be formed and a third opening to form the sixth port on the side wall near the other end surface;
A first position that is axially slidably accommodated in the valve chamber, closes the sixth port and communicates the fifth port with the fourth port, and closes the fifth port. The coating device according to claim 3, further comprising a valve body movable between a second position where the sixth port communicates with the fourth port.   A spring member for urging the valve body to the second position, and the position of the valve body is set according to a spring force of the spring member and a fluid pressure on the first port side; The coating apparatus according to claim 4, wherein the coating apparatus switches between the position and the second position.   In a direction against the spring force of the spring member, the pressure of the cleaning liquid sent from the cleaning liquid supply source to the surface of the valve body facing the first port through the common flow path of the rotation support shaft. The coating apparatus according to claim 5, wherein a recess for receiving is provided.   The valve body has at least one through hole facing the first port at a position avoiding the recess, and when the valve body is held at the second position, the through hole of the valve body The coating apparatus according to claim 6, wherein the sixth port communicates with the fourth port through the first port.

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