JP3886001B2 - Suction pad and positioning method for thin ring parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a suction pad and positioning method for a thin ring component suitable mainly for handling a thin ring component having a thickness of 0.1 mm or less.
[0002]
[Prior art]
Conventionally, when handling ring parts, it is common to cut out ring parts one by one with a parts feeder and hold the ring parts with a mechanical chuck or suction pad. However, in the case of a thin ring component having a thickness of 0.1 mm or less, the amplitude of the parts feeder is equal to or greater than the thickness of the ring component, so that the feed is not stable. In addition, when a high-frequency parts feeder is used, feeding is relatively stable, but it is very difficult to prevent two sheets from being stacked, and it is difficult to cut out thin ring components one by one accurately. There is also a method in which ring parts are placed apart, the position of the ring parts is detected by image processing, and the parts are picked up and handled one by one.
[0003]
FIG. 8 is a structural diagram of a conventional suction pad. FIG. 9 is a sectional view of a suction hole of a conventional suction pad.
[0004]
[Problems to be solved by the invention]
However, in the case of a normal suction pad with one hole in the center of the tip, if the ring parts overlap, the suction air flows from the hole in the center of the ring part when the upper part is picked up. Parts are also attracted. In order to avoid this problem, when manufacturing suction pads with suction holes that are less than the ring width of the ring component, if the ring width is very narrow, such as 0.3 mm or less, it is very difficult to drill the suction holes. is there. Further, when attracting and positioning a thin ring component, if an attempt is made to center the outer periphery of the ring component with a chuck or the like, the component is thin and easily deformed, making accurate positioning difficult.
[0005]
SUMMARY OF THE INVENTION An object of the present invention is to provide a suction pad and positioning method for a thin ring component that can be surely sucked one by one even when thinly placed thin ring components are overlapped and can be accurately positioned without deforming the thin ring components. provide.
[0006]
[Means for Solving the Problems]
The problem is that a first suction pad formed by inserting a pin in contact with the inner surface of the cylindrical member into a cylindrical member having an axially extending groove on the inner surface, and a pin tip of the first suction pad is cylindrical. The thin suction ring part is vacuum-sucked by the first suction pad using the second suction pad that protrudes from the tip of the member and is tapered, and is moved to a temporary positioning pin that is biased by the spring by the spring . pressing said first suction pad, the pressing thin ring component pushing the provisional positioning pin into the seat, opening the adsorption of thin ring component was transferred to a thin ring component in the provisional positioning pin, a second suction pad pushing the tip of the pin to the provisional positioning pin, it adsorbed after sandwiching the thin ring part by the base and a second suction pad, for holding the thin ring part to the second suction pad It is solved by the method of positioning the mold ring component.
[0007]
That is, the present invention provides a 0. Suction pad of less than 1mm thin ring component thickness, made of a conductive hard material, a cylindrical member having a groove extending in the axial direction on the inner surface of the cylindrical member insert the lupine that Sessu an inner surface, an adsorption pad of the thin ring component ing to form a suction hole in said groove and the pin.
[0008]
Further, the present invention is a zero. Suction pad of less than 1mm thin ring component thickness, made of a conductive hard material, a cylindrical member having a groove extending in the axial direction on the inner surface of the cylindrical member insert the pin in contact with the inner surface, the result forming the suction holes in the groove and the pin, the tip of the pin protrudes from the tip of the cylindrical member and the suction pads of the tapered der Ru flat-ring component, It is.
[0009]
Further, the present invention is a zero. Suction pad of less than 1mm thin ring component thickness, made of a conductive hard material, a cylindrical member having a groove extending in the axial direction on the inner surface of the cylindrical member insert the pin in contact with the inner surface, a first suction pad thin ring component obtained by forming the suction holes in said groove and said pin, a suction pad having a thickness of 0. 1 mm or less thin ring component, A pin made of a conductive hard material and having a groove extending in the axial direction on the inner surface is inserted with a pin in contact with the inner surface of the cylindrical member, and an adsorption hole is formed by the groove and the pin. using a second suction pad tip of having said cylindrical member protrudes from the tip of the pin and a tapered, the thin ring component by vacuum suction in the first adsorption pad is provided on the base It is biased by a spring that can be moved Pressing said first suction pad to the positioning pins, the push in the provisional positioning pin pressed against the thin ring component on the pedestal, provisional positioning the thin ring component to release the adsorption of the thin ring component in the provisional positioning pin and, wherein the second pin of the suction pads push on the provisional positioning pin, thin ring components adsorbed after sandwiching the thin ring component by the suction pad and the pedestal, for holding said thin ring component on the suction pad This is a positioning method.
[0010]
【Example】
Hereinafter, suction pads and positioning methods for thin ring components according to embodiments of the present invention will be described with reference to the drawings.
[0011]
FIG. 2 is a structural diagram of a suction pad according to an embodiment of the present invention. The suction pad of FIG. 2 processes the groove 2 in the axial direction of the inner surface of the cylindrical member 1 by wire electric discharge machining (the electric discharge machining jig 6 of FIG. 3) , and the pin 3 having the same outer diameter as the inner diameter of the cylindrical member 1. The suction hole 4 having a diameter of about 0.2 mm is formed by insertion. When the ring component is sucked by this suction pad, the suction hole is completely blocked by the ring component , so the suction air does not leak, and even if the ring components overlap, only one piece on the upper side can be easily Can be adsorbed.
[0012]
FIG. 1 is a cross-sectional view of a suction hole of a suction pad according to an embodiment of the present invention. In Figure 1, it tapered over the pin 3 Ru Tei protrudes than the cylindrical member 1. Thus, when adsorbing the thin ring portion products, fitting the inside diameter of the tapered over the thin ring portion products of the pin 3, positioning is performed.
[0013]
The 4-7, illustrating a method of positioning a thin ring component. After adsorbing the thin ring component by the suction pad of the present invention, as shown in FIGS. 4 to 7, performs sorting of the ring parts. As shown in FIG. 4, and the hollow portion 12 is open to the pedestal 11, the provisional positioning pin is inserted into the hollow portion 12, behind the provisional positioning pin has a compression spring, with a provisional positioning pin into the seat 11 It is fast. When the leading edge of the provisional positioning pin is pressed, the compression bar ne contracts, provisional positioning pin is pushed.
[0014]
Here, the positioning pin is pushed into the suction hole that sucks the ring component, the thin film ring component 10 is sandwiched between the tip of the hole and the base , the suction of the thin film ring component 10 is released , and when the suction hole is separated, the thin film ring component 10 is removed. The compression spring penetrates and the thin film ring component 10 is held.
[0015]
Next, as shown in FIG. 5, push the pin 3 of the tip of the adsorption pad, sandwiching the thin ring component 10 by adsorption pad and the base 11. At this time, the ring component is accurately positioned by the taper at the tip of the suction pad. Here, as shown in FIGS. 6 and 7, by sucking the thin film ring component 10, the thin film ring component 10 can be sucked while being positioned by the suction pad.
[0016]
【The invention's effect】
As described above, according to the suction pad and the positioning method of the present invention, it is possible to pick up only one thin ring component placed separately without sucking it and accurately position it without deforming it. It becomes.
[Brief description of the drawings]
FIG. 1 is a structural diagram of a suction pad according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of a suction hole of a suction pad according to an embodiment of the present invention.
FIG. 3 is an explanatory view of applying electric discharge machining to the inside of a cylindrical member with the suction pad of the present invention.
FIG. 4 is an explanatory diagram immediately before the workpiece is sucked by the suction pad according to the embodiment of the present invention.
FIG. 5 is an explanatory diagram when a workpiece is sucked and temporarily positioned by a suction pad according to an embodiment of the present invention.
FIG. 6 is an explanatory diagram when the workpiece is positioned by the suction pad according to the embodiment of the present invention.
FIG. 7 is an explanatory view after positioning a work by a suction pad according to an embodiment of the present invention.
FIG. 8 is a structural diagram of a conventional suction pad.
FIG. 9 is a cross-sectional view of a suction hole of a conventional suction pad.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Cylindrical member 2 Groove 3 Pin 4 Suction hole 6 Electric discharge machining jig 10, 23 Thin film ring component 11 Base 12 Hollow part 13 Taper 21 Cylindrical member 22 Groove

Claims (3)

A suction pad having a thickness of 0. 1 mm or less thin ring part made of a conductive hard material, a cylindrical member having a groove extending in the axial direction on the inner surface, Sessu an inner surface of said cylindrical member lupine insert the suction pad of the thin ring component, wherein Rukoto such to form a suction hole in said groove and the pin. Thickness 0. A suction pad of less than 1mm thin ring part made of a conductive hard material, a cylindrical member having a groove extending in the axial direction on the inner surface, inserting the pin in contact with the inner surface of the cylindrical member and, it forms a suction hole in said groove and said pin, suction pad of the thin-type ring component you wherein a distal end of the previous Kipi emissions protrudes from the tip of the cylindrical member, and a tapered . Thickness 0. A suction pad of less than 1mm thin ring part made of a conductive hard material, a cylindrical member having a groove extending in the axial direction on the inner surface, inserting the pin in contact with the inner surface of the cylindrical member and a first suction pad thin ring component obtained by forming the suction holes in said groove and said pin, a suction pad having a thickness of 0. 1 mm or less thin ring component, a conductive hard material A pin in contact with the inner surface of the cylindrical member is inserted into a cylindrical member having a groove extending in the axial direction on the inner surface, and an adsorption hole is formed by the groove and the pin, and the tip of the pin has the cylindrical shape using a second suction pad having protruding from the tip of the member, and a tapered pin, the thin ring component in the first adsorption pad by vacuum suction, is urged by a spring provided on the pedestal the provisional positioning pin can be moved Serial first pressing the suction pads, pressing said thin ring component pushing the provisional positioning pin into the seat, opening the adsorption of the thin ring component temporarily positioning the thin ring component in the provisional positioning pins, the push pins of the second suction pad to the provisional positioning pin, the pedestal and the adsorbed after sandwiching the thin ring component by the suction pad, the method of positioning a thin ring component for holding said thin ring component on the suction pad .

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