JP3870591B2 - SUBSTRATE FOR ORGANIC ELECTROLUMINESCENT DISPLAY ELEMENT AND METHOD FOR PRODUCING ORGANIC ELECTROLUMINESCENT DISPLAY ELEMENT - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention generally relates to television and advanced information processing terminal displays. And In particular, the present invention relates to the field of organic electroluminescence display devices that can be applied to other display devices such as liquid crystal display devices, and in particular, such organic electroluminescence display elements. Substrate and organic electroluminescence display element It relates to a manufacturing method.
[0002]
[Prior art]
A simple matrix drive electroluminescence (EL) display element is expected to be a next-generation flat panel display because it is thin, lightweight, low-cost, self-luminous, and has an advantage of high luminance. In the case of a simple matrix drive EL display element, an anode made of a striped transparent conductive film is provided on a translucent substrate.
[0003]
The organic EL display element is a current drive type. In the case of a simple matrix, the aspect ratio (length / width ratio) of the anode line increases and the electrical resistance of the anode line increases as the area becomes higher in definition and area. As a result, if a current necessary for obtaining sufficient luminance is supplied to the anode line, the voltage drop due to the resistance of the anode line increases, and there is a problem that the drive voltage increases correspondingly, which decreases the electrical resistance of the anode. Need arises. Liquid crystal display devices and AC-type inorganic EL display elements are voltage-driven, but it is necessary to reduce the resistance of electrode lines including a transparent conductive film in order to make in-plane display characteristics uniform.
[0004]
Various techniques have been disclosed for reducing the resistance of the anode line. For example, JP-A-10-106751 and JP-A-9-230318 are examples thereof. According to Japanese Patent Laid-Open No. 10-106751, low resistance of the anode line is realized by providing a highly conductive metal line in contact with both side surfaces of the transparent electrode line. However, according to the method disclosed in Japanese Patent Laid-Open No. 10-106751, the height of the highly conductive metal line is limited to the height of the transparent electrode line, so that the resistance of the anode line can be reduced to some extent. However, it is difficult to achieve this even when the resistance is further lowered.
[0005]
Japanese Laid-Open Patent Publication No. 9-230318 discloses a technique of flattening between metal wirings with an ultraviolet curable resin. However, since this method requires patterning of the transparent electrode, the process becomes complicated. In that case, a particular problem is that when the transparent electrode material is patterned with the etching solution, the metal wiring is hardly eroded by the etching solution. Furthermore, in order to prevent corrosion of the metal wiring, the side end to be aligned with the metal wiring of the transparent electrode line has to be extended on the adjacent ultraviolet curable resin. In such a structure, colors are mixed when colorizing, so it is impossible to obtain a pure color display.
[0006]
[Problems to be solved by the invention]
The present invention has been made to solve these problems, and in an organic EL display element having a high definition and a large screen, an organic EL capable of obtaining sufficient luminance by lowering the electrical resistance of the anode line. It is an object of the present invention to provide a display element substrate, an organic EL display element, and a manufacturing method thereof.
[0007]
Another object of the present invention is to provide an organic EL display element substrate, an organic EL display element, and a method for manufacturing the same, which can omit the patterning of ITO (when the first electrode is an anode).
[0008]
[Means for Solving the Problems]
In order to solve the above problems, the present invention provides: Forming a plurality of electrically insulating layers each having an inversely tapered shape on a supporting substrate; forming a conductive material layer on substantially the entire surface of the supporting substrate having the electrically insulating layer; and Removing the portion on the surface of the supporting substrate so that the portion remaining on the surface of the supporting substrate is in contact with one side edge of each electrical insulating layer and separated from the other side edge; Forming a plurality of conductive bus lines each connected to the electrical insulating layer only at one side end thereof; forming a first electrode layer on a support substrate having the electrical insulating layer and the conductive bus line; Thereby forming a plurality of first electrode lines extending from above each electrical insulation layer onto a conductive bus line connected to the electrical insulation layer and separated from each other on the other side end side of each electrical insulation layer. Organic electroluminescence characterized by Method of manufacturing a substrate for scan display element I will provide a.
[0010]
In a preferred aspect of the present invention, one of both sides of each electrical insulating layer is in contact with the conductive bus line, and the other has a gap between the adjacent conductive bus line, in which case the gap The width is preferably 1 to 500 μm . Normally, this gap is an electrically insulating material. The filling Do .
[0011]
In the embodiment of the present invention, each electrical insulating layer is made of a negative resist in which a UV absorbing substance or a color material is dispersed.
[0012]
In the present invention, the first electrode line may be an anode, and the electrical insulating layer may constitute a color filter layer.
[0013]
In the present invention, the conductive bus lines are Ni, Cu, Cr, Ti, Fe, Co, Au, Ag, Al, Pt, Rh , Pd, Pb and Sn, and a metal material selected from the group consisting of alloys containing at least one of these metal elements.
[0014]
Furthermore, the height of the conductive bus line is preferably 0.1 to 100 μm, and the width is preferably 1 to 500 μm.
[0015]
By providing a light-absorbing layer on the surface of the conductive bus line that contacts the substrate, the conductive bus line can have a black stripe function.
[0016]
The present invention In A plurality of partition walls intersecting the first electrode line Formation The partition preferably has an eave at the top and a skirt at the bottom.
[0017]
The present invention In A light emitting medium, a second electrode line, and a sealing layer on a substrate for an electroluminescence display device Can be formed .
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the drawings. Throughout the drawings, the same or similar parts / members are denoted by the same reference numerals. In the following example, the case where the first electrode is an anode and the second electrode is a cathode will be described in detail.
[0020]
First, an organic EL display element substrate and a display element according to an embodiment of the present invention will be described based on a manufacturing method thereof with reference to FIGS.
[0021]
According to the present invention, first, as shown in FIG. 1A, a negative photoresist layer 12 in which a UV-absorbing substance or a color material is dispersed on a translucent and electrically insulating support substrate 11 is formed on the entire surface. Apply and form and dry.
[0022]
In the present invention, as the translucent insulating support substrate 11, a quartz substrate, a glass substrate, a plastic substrate, or the like can be used.
[0023]
Next, as shown in FIG. 1B, ultraviolet (UV) exposure and development are performed using a photomask (not shown) having an elongated rectangular window with an appropriate pitch, and a striped electrical insulating layer is formed. 13 is formed. In this case, a UV-absorbing substance or a coloring material is dispersed in the negative photoresist, so that at the time of exposure, a portion of a certain depth from the surface of the photoresist layer 12 is exposed, but the UV-absorbing substance or Since the UV light is absorbed by the coloring material, it cannot reach the deep part, and the lower part remains unexposed. When development is performed in this state, the exposed portion remains undissolved in the surface region of the photoresist layer 12, but the unexposed portion is removed, and if conditions are selected, a reverse taper shape as shown in FIG. The electrical insulating layer 13 can be formed.
[0024]
As a color material contained in the negative photoresist layer 12, a monochromatic pigment is desirable. In addition, as the UV-absorbing substance, organic substances such as benzophenone, phenyl salicylic acid, cyanoacrylate, benzotriazole, and oxalic anilide, as well as inorganic substances such as glass powder and cerium oxide powder can be used.
[0025]
Next, as shown in FIG. 1C, a conductive material layer 14 is formed over the entire surface of the substrate 11 on which the electrical insulating layer 13 is formed. The conductive material may be a metal material selected from Ni, Cu, Cr, Fe, Co, Au, Ag, Pt, Rh, Pd, Pb, Sn, or an alloy containing one or more of these metal elements. preferable. The conductive material 14 can be formed by a sputtering method or the like.
[0026]
As shown in FIG. 1C, the conductive material layer 14 is continuously formed on the surface of the support substrate 11 between the electrical insulating layers 13 and the top surface of the electrical insulating layer 13. When the electrical insulating layer 13 has a reverse taper shape, the conductive material layer 14 substantially forms a stripe portion 14 a between the adjacent electrical insulating layers 13, and between the side surfaces of the electrical insulating layer 13. A gap 15 is formed. The stripe portion 14a of the conductive material layer 14 is continuous with a portion 14b on the electrical insulating layer via a thin step portion 14c formed therebetween.
[0027]
Next, in order to form a mask for etching the conductive material layer 14, a photoresist layer 16 is formed on the conductive material layer 14 as shown in FIG.
[0028]
Thereafter, the photoresist layer 16 is processed to form a predetermined etching mask, and then the conductive material layer 14 is etched to form a conductive bus line. At this time, this conductive bus line is formed. 18 is performed so as to be in contact with the electrical insulating layer 13 only on one side (see FIG. 2B).
[0029]
Thus, it is one of the preferable aspects of the present invention that the conductive bus line 18 contacts the electrical insulating layer only on one side thereof. In order to realize this, as shown in FIG. 2A, when the photoresist layer 16 is processed to form a resist pattern 17, a conductive material layer is formed in a region between adjacent electrical insulating layers 13. 14 so that the resist pattern 17 on one side covers the step 14c of the conductive material layer 14 at one end and the side end of the portion 14b on the electrical insulating layer 13, and the step 14c is exposed at the other end. To do. When the conductive material layer 14 is etched in this state, the etching proceeds through the exposed stepped portion 14c, but does not proceed at the stepped portion 14c covered with the resist pattern, so that the remaining stepped portion as shown in FIG. In the portion corresponding to the portion 14c, it is possible to form the conductive bus line 18 that contacts the electrical insulating layer 13 only on one side (the side end portion 13B of the electrical insulating layer 13 in FIG. 2B).
[0030]
Each conductive bus line 18 preferably has as low a resistance as possible across the line. The resistance value is desirably 1000 ohms or less, and more desirably 100 ohms or less. However, the width of each bus line 18 is desirably 1/2 or less of the maximum width of the pixel, and more desirably 1/4 or less, in order to ensure the transmittance of EL light. In addition, since the resistance of each bus line 18 cannot be sufficiently reduced with a line width of 1/20 or less of the width of the first electrode line, each bus line 18 has a width wider than 1/20 of the maximum width of the pixel. Is desirable. In addition, it is desirable that the height of each bus line 18 is normally 0.1 μm or more, and each bus line 18 is substantially flush with the top surface of the electrical insulating layer 13. It is desirable to form as follows. In order to limit the emission direction of the EL light and prevent the viewing angle from being narrowed, each bus line 18 is desirably formed at a height of 50 μm or less.
[0031]
For example, when a bus line 18 having a length of 7 cm is formed using a metal mainly composed of copper having a resistivity of 2E-6 Ωcm with respect to a width of 100 μm of the first electrode line, the width of the bus line 18 is set to 1 pixel width. If the thickness is 25 μm corresponding to / 4 and the height is 5 μm, the resistance value between both ends of the bus line 18 is about 10 ohms. Therefore, for example, the resistance is one-hundredth of that of the first electrode line made of only indium-tin composite oxide (ITO), and energy loss due to a voltage drop caused by the first electrode line can be prevented.
[0032]
It is also preferable to provide a light-absorbing metal oxide layer (not shown) on the surface of each conductive bus line 18 in contact with the support substrate 11. Thus, the contrast of the EL display element can be improved by providing each conductive bus line 18 with a function as a black stripe and preventing reflection of external light.
[0033]
After forming the bus line 18 as described above, as shown in FIG. 2C, the transparent conductive film 20 constituting the first electrode line is preferably formed by sputtering. At this time, as can be seen from FIG. 2B, the electrical insulating layer 13 has a reverse taper shape and has an eaves on the top, so that one side end portion 13B side is in contact with the conductive bus line. However, since the other side end portion 13A side is not in contact with the conductive bus line (the gap 19 is formed between the bus line 18), the side end when forming the transparent conductive film. It is cut on the part 13A side. For this purpose, the transparent electrode film 20 is naturally patterned at the same time it is formed. This eliminates the need to separately pattern the transparent conductive film (omission of a separately performed patterning step). Accordingly, naturally, the conductive bus line 18 is not corroded by the etching solution when the transparent conductive film is etched.
[0034]
As the transparent conductive film 20 in the present invention, ITO, indium zinc oxide composite oxide, zinc aluminum oxide, or the like can be used.
[0035]
After the transparent conductive film 20 is formed, the gap between the electrical insulating layer 13 and the adjacent conductive bus line is filled with an electrical insulating material 21 made of resin or the like to form an organic EL display element substrate (FIG. 2). (See (d)).
[0036]
As can be seen from the above description, in the organic EL display element substrate of the present invention, the plurality of first electrode lines 20 are arranged apart from each other, and the conductive bus line 18 is substantially the same as the first electrode line 20. Are formed so as to extend in parallel. The first electrode line 20 is arranged at a distance from the support substrate 11 (due to the presence of the electrical insulating layer 13), and one side end portion (only) of the surface of one conductive bus line 18 adjacent thereto. Extends over. In this way, each first electrode line extends on a relatively wide surface of the conductive bus line 18 formed on the substrate, thereby further reducing the resistance of the first electrode line 20. The driving voltage of the organic EL display element can be reduced. In addition, according to the present invention, the first electrode line is patterned at the same time as its formation, so that patterning with an etchant is unnecessary.
[0037]
Next, as shown in FIG. 3, after forming the light emitting medium layer 31 and the second electrode lines 32 spaced apart from each other in a direction intersecting (preferably orthogonally) with the first electrode line, a sealing layer is formed. 33 can be formed by an ion plating method or the like to complete the organic EL display element.
[0038]
However, in the organic EL display element substrate of the present invention, the organic light emitting medium and the second electrode line are formed in the direction intersecting (preferably orthogonal) with the first electrode line, and at the same time, the patterning is performed. It is preferable to provide a plurality of partition walls. These partition walls are formed on the organic EL display element substrate shown in FIG. 2D so as to extend away from each other in a direction intersecting with (preferably orthogonal to) the first electrode lines 20. Each partition may be reverse tapered or T-shaped.
[0039]
In a preferred embodiment of the present invention, each of the partition walls has eaves at the upper part and skirts at the lower part as disclosed in Japanese Patent Application No. 10-117236 (cross-section “work” -shaped partition wall). Since each partition has a base in addition to the eaves, the organic light emitting medium is formed up to the bottom of the partition without generating a gap with the partition, and the second electrode line formed thereon also emits organic light. Since it is formed on the medium up to the bottom of the partition, problems of short circuit and dielectric breakdown are avoided. Furthermore, as disclosed in Japanese Patent Application No. 10-247212, the T-shaped partition wall preferably has a plurality of connecting bands that connect adjacent partition walls to each other at the skirt portion. This connection band can effectively prevent a short circuit with the second electrode line at the side edge of the first electrode line.
[0040]
FIG. 4 shows a substrate for an organic EL display element of the present invention having the above-mentioned shaped letter partition 32 on the substrate shown in FIG. 4A shows a cross-sectional view in the same direction as FIGS. 1 and 2, and FIG. 4B shows a cross-sectional view in a direction orthogonal to FIG. 4A. Each partition wall 41 has an eaves 41 a at the top and a bottom 41 b at the bottom, and is shown as extending in a direction orthogonal to the first electrode line 20.
[0041]
Here, the principle of forming the letter-shaped partition wall 41 as shown in FIG. 4 will be described with reference to FIG. First, as shown in FIG. 5A, a negative resist layer 52 in which a UV absorbing material or a color material is mixed is formed on almost the entire surface of a substrate 51 (the organic EL display element substrate shown in FIG. 2D). Then, exposure is performed with UV light (indicated by an arrow in the figure) using a photomask 53 having a rectangular window 53a at an appropriate pitch. Then, the photosensitive portion 52a is formed by exposing light up to a certain depth from the surface of the resist layer 52, but UV light is absorbed by the UV-absorbing substance or coloring material and cannot reach the deep portion. Remains unexposed. If development is performed in this state, the photosensitive portion 52a remains undissolved in the surface layer, but the unexposed portion is removed (FIG. 5B). Since all of the lower side of the surface layer is an unexposed portion, the development further proceeds from the side, and a forward-tapered skirt is formed (FIG. 5C). Further, if the conditions are selected, it is possible to form a letter-shaped partition 54 (corresponding to the partition 41 best shown in FIG. 4B) having a longer skirt than the eaves (FIG. 5D).
[0042]
Thus, when the partition is formed, the photoresist itself applied on the substrate naturally fills the gap 19 between the electrical insulating layer 13 and the adjacent conductive bus line. Therefore, it is not necessary to fill the gap 19 in advance (see FIG. 2D). In this case, the width of the gap 19 is desirably 1 to 500 μm.
[0043]
The formation principle of the electrically insulating layer 13 having a reverse taper shape is basically the same as the formation principle of the above-mentioned kanji-shaped partition wall 41. In the case of the electric insulating layer 13, the development condition is selected and the bottom is formed shorter than the eaves.
[0044]
Now, in order to fabricate an organic EL display element using the organic EL display element substrate with barrier ribs shown in FIG. 4, referring to FIG. 6, the organic EL display element substrate with barrier ribs shown in FIG. As stated, the luminescent medium 31 is preferably formed by vacuum deposition, then the second electrode line 32 is preferably formed by vacuum deposition, and then the sealing layer 33 is preferably formed by ion plating. Form. The light emitting medium 31 and the second electrode material 32 are patterned by the partition walls 41 at the same time as the formation thereof, and are deposited separately from each other, so that it is not necessary to perform etching separately.
[0045]
As the luminescent medium 31 in the present invention, a 9,10-diarylanthracene derivative, salicyl hydrochloride, pyrene, coronene, perylene, rubrene, tetraphenylbutadiene, 9,10-bis (phenylethynyl) anthracene, 8-quinolinolato lithium, Alq (?), Tris (5,7-dichloro, 8-quinolinolato) aluminum complex, tris (5-chloro-8-quinolinolato) aluminum complex, bis (8-quinolinolato) zinc complex, tris (5-fluoro-8- Quinolinolato) aluminum complex, tris (4-methyl-5-trifluoromethyl-8-quinolinolato) aluminum complex, tris (4-methyl-5-cyano-8-quinolinolato) aluminum complex, bis (2-methyl-5-trifluoro) Romethyl-8-quinori Lat), 4- (4-cyanophenylphenolate) aluminum complex, bis (2-methyl-5-cyano-8-quinolinolato), 4- (4-cyanophenylphenolate) aluminum complex, tris (8-quinolinolato) Scandium complexes, bis [8- (para-tosyl) aminoquinoline] zinc complexes and cadmium complexes, 1,2,3,4-tetraphenylcyclopentadiene, pentaphenylcyclopentadiene, poly-2,5-diheptyloxy-para Examples include -phenylene vinylene, fluorescent substances mentioned in JP-A-4-31488, US Pat. Nos. 5,146,571 and 4,769,292, N, N′-diaryl substituted pyrrolopyrrole compounds, and the like.
[0046]
As the second electrode line (cathode line) 32 including the metal layer in the present invention, MgAg, AlLi, CuLi or the like can be used.
[0047]
The sealing layer 33 can be formed with germanium oxide to a thickness of 1 μm, for example.
[0048]
In the present invention, the electrical insulating layer 13 can also be constituted by color filter layers (R, G, B) as shown in FIG. 7A is a cross-sectional view corresponding to FIG. 3, and FIG. 7B is a view corresponding to FIG. Here, FIG. 7A shows the final organic EL display element structure, but the organic EL display element substrate corresponding to the organic EL display element substrate shown in FIG. It is to be interpreted as indicating. Similarly, FIG. 7B shows the final organic EL display element structure with a partition, but the organic EL display element substrate corresponding to the organic EL display element substrate shown in FIG. Thus, the organic EL display element substrate with partition walls corresponding to the organic EL display element substrate with partition walls shown in FIG.
[0049]
【Example】
Example 1
In this example, an organic EL display element substrate was produced by the method described with reference to FIGS.
[0050]
That is, first, a negative photoresist in which a UV absorbing material or a color material was dispersed was applied and dried on a glass support substrate 11 to form a photoresist layer 12 (FIG. 1A).
[0051]
Next, using a striped photomask with a pitch of 300 μm and a width of 20 μm, the resist layer 12 was subjected to UV exposure and development to form an electrically insulating layer 13 having an inversely tapered shape (FIG. 1B). ).
[0052]
Next, a copper layer 14 having substantially the same thickness as the electrical insulating layer 13 was formed on the glass substrate 11 on which the electrical insulating layer 13 was formed by a sputtering method (FIG. 1C).
[0053]
A photoresist layer 16 was formed on the copper layer 4 (FIG. 1D).
[0054]
The photoresist layer 16 was subjected to UV exposure and development to form a desired resist pattern 17 (FIG. 2A).
[0055]
Next, after etching the copper layer 14, the resist pattern 17 was removed to form a desired copper bus line 18 (FIG. 2B).
[0056]
Next, an ITO pattern 20 having a thickness of 0.1 μm was formed by a sputtering method. Since the electrical insulating layer 13 has an inversely tapered shape, the ITO layer 20 was cut at one side end 13A of the electrical insulating layer at the same time as it was formed, and was naturally patterned (FIG. 2C). ).
[0057]
Thereafter, the gap 9 between the electrical insulating layer 13 and the copper bus line 18 was filled with the negative resist 21 to complete an organic EL display element substrate (FIG. 2D).
[0058]
Example 2
On the organic EL display element substrate (FIG. 2 (d)) produced in Example 1, the engine-shaped partition wall 41 was described with reference to FIG. 5 so as to be orthogonal to the ITO line 20 and the copper bus line 18. The organic EL display element substrate with barrier ribs was completed by the method (FIG. 4).
[0059]
Example 3
The electrical insulating layers 13 of the organic EL display element substrate and the partition-equipped organic EL display element substrate prepared in Example 1 and Example 2 are each composed of a color filter layer (R, G, B), and have a color filter. An organic EL display element substrate, a color filter, and an organic EL display element substrate with partition walls (see FIG. 7) were completed.
[0060]
Example 4
The organic light emitting layer 31 and the second electrode line 32 are sequentially vacuum-deposited on the organic EL display element substrate produced in Example 1 and the organic EL display element substrate with partition produced in Example 2, and sealed. The organic EL display element of this invention was produced by sealing with a stop layer 14 (FIGS. 3 and 6).
[0061]
Example 5
The organic light emitting layer 31 and the second electrode line 32 were sequentially vacuum-deposited and sealed on the organic EL display element substrate with a color filter and the color filter and the organic EL display element substrate with a partition wall prepared in Example 3, respectively. The organic EL display element of the present invention was formed by sealing with a layer 33 (FIG. 7).
[0062]
In the organic EL display device manufactured in the above embodiment, the resistance of the first electrode line can be further reduced than before.
[0063]
【The invention's effect】
As described above, according to the present invention, the conductive bus line is provided under the transparent conductive film line in contact with the transparent conductive film in the region between the transparent conductive film line as the first electrode line and the support substrate. As a result, the drive voltage of the organic EL display element can be lowered. According to the present invention, since the thickness of the conductive bus line thus provided is not limited by the thickness of the transparent conductive film, the resistance of the first electrode line can be further reduced. Further, since the conductive bus line can function as a black stripe, the contrast of the EL display element can be improved. Further, by forming the electrically insulating layer or the color filter layer in an inversely tapered shape, the transparent conductive film can be patterned at the same time as being formed, so that the patterning step of the transparent conductive film can be omitted.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view for explaining a production process of an organic EL display element substrate of the present invention.
FIG. 2 is a schematic cross-sectional view for explaining a manufacturing process of the organic EL display element substrate of the present invention, continued from FIG. 1;
FIG. 3 is a schematic cross-sectional view of an organic EL display element of the present invention.
FIG. 4 is a schematic cross-sectional view of a substrate for organic EL display elements with a partition wall according to the present invention.
FIG. 5 is a schematic cross-sectional view for explaining the principle of forming a process-shaped partition wall.
FIG. 6 is a schematic cross-sectional view of an organic EL display element using the organic EL display element substrate with a partition according to the present invention.
FIG. 7 is a schematic cross-sectional view showing an organic EL display element with a color filter of the present invention.
[Explanation of symbols]
11 ... Supporting substrate
12 ... Negative resist layer in which UV absorbing substance or coloring material is dispersed
13 ... Electrical insulation layer
13A: side of the electric insulation layer that does not contact the conductive bus line
13B: side of the electrically insulating layer that contacts the conductive bus line
14 ... Conductive material layer for bus line
14c ... Step part
15 ... Gap
16 ... Photoresist
17 ... resist pattern
18 ... Conductive bus line
19 ... Gap
20 ... 1st electrode line (transparent conductive film line)
21. Electrical insulating material
31. Organic light emitting medium
32 ... Second electrode line
33 ... Sealing layer
41 ... Processed partition
41a ... eaves
41b ...
51 ... Board
52. Negative photoresist
52a ... Sensitive area
53 ... Photomask
53a ... Window

Claims (11)

Forming a plurality of electrically insulating layers each having an inversely tapered shape on a supporting substrate; forming a conductive material layer on substantially the entire surface of the supporting substrate having the electrically insulating layer; and Removing the portion on the surface of the supporting substrate so that the portion remaining on the surface of the supporting substrate is in contact with one side edge of each electrical insulating layer and separated from the other side edge; Forming a plurality of conductive bus lines each connected to the electrical insulating layer only at one side end thereof; forming a first electrode layer on a support substrate having the electrical insulating layer and the conductive bus line; Thereby forming a plurality of first electrode lines extending from above each electrical insulation layer onto a conductive bus line connected to the electrical insulation layer and separated from each other on the other side end side of each electrical insulation layer. Organic electroluminescence characterized by Method of manufacturing a substrate for scan display element. 2. The organic electroluminescence according to claim 1, wherein one of both sides of each electrical insulating layer is in contact with the conductive bus line, and the other has a gap between the conductive bus line and the adjacent conductive bus line. A manufacturing method of a substrate for display elements. The method for producing a substrate for an organic electroluminescence display element according to claim 2, wherein a width of the gap between each electrical insulating layer and the conductive bus line adjacent thereto is 1 to 500 µm. 4. The method for manufacturing a substrate for an organic electroluminescence display element according to claim 2, wherein an electric insulating material is filled in the gap between each electric insulating layer and the conductive bus line adjacent thereto. 5. The method for manufacturing a substrate for an organic electroluminescence display element according to claim 1, wherein each electrical insulating layer is made of a negative resist in which a UV absorbing substance or a color material is dispersed. . 6. The method for manufacturing a substrate for an organic electroluminescence display element according to claim 1, wherein the first electrode line is an anode, and the electrically insulating layer constitutes a color filter layer. In the group where the conductive bus line is made of Ni, Cu, Cr, Ti, Fe, Co, Au, Ag, Al, Pt, Rh, Pd, Pb and Sn and an alloy containing at least one of these metal elements The method for producing a substrate for an organic electroluminescence display element according to claim 1, wherein the substrate is made of a metal material selected from the group consisting of : The method for manufacturing a substrate for an organic electroluminescence display element according to claim 1, wherein the conductive bus line has a height of 0.1 to 100 μm and a width of 1 to 500 μm. The method for producing a substrate for an organic electroluminescence display element according to claim 1, wherein a light absorbing layer is provided on a surface of the conductive bus line in contact with the substrate. Forming a plurality of partition walls intersecting the first electrode lines on the organic electroluminescence display element substrate obtained by the manufacturing method according to claim 1, A method for manufacturing a substrate for an organic electroluminescence display element with a partition wall, characterized by having an upper portion and a lower portion. The substrate for organic electroluminescent display elements with a partition obtained by the board | substrate for organic electroluminescent display elements obtained by the manufacturing method of any one of Claim 1 thru | or 9, or the manufacturing method of Claim 10 method of manufacturing an organic electroluminescence display element, which comprises forming a light-emitting medium and the second electrode lines and the sealing layer thereon.

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