JP3857202B2 - Plating method for crystalline polyester resin molded article and plated crystalline polyester resin molded article - Google Patents
Plating method for crystalline polyester resin molded article and plated crystalline polyester resin molded article Download PDFInfo
- Publication number
- JP3857202B2 JP3857202B2 JP2002259462A JP2002259462A JP3857202B2 JP 3857202 B2 JP3857202 B2 JP 3857202B2 JP 2002259462 A JP2002259462 A JP 2002259462A JP 2002259462 A JP2002259462 A JP 2002259462A JP 3857202 B2 JP3857202 B2 JP 3857202B2
- Authority
- JP
- Japan
- Prior art keywords
- polyester resin
- crystalline polyester
- resin molded
- molded article
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、結晶性ポリエステル樹脂成形品のめっき方法及びその方法によって得られるめっき品に関するものである。
【0002】
【従来の技術】
成形加工性に優れ、電気的、機械的特性に優れた樹脂を使用し回路部品、その他の電気的、電子的製品或いは部品を製造するには、樹脂表面と金属面との接着の技術が必要であり、その一つの方法としてめっき法が従来から提案されている。
絶縁樹脂層の表面を粗化処理した後、短波長紫外線を照射してめっき処理する方法が、特許文献1に開示されている。この方法において、絶縁樹脂層を粗面化処理するための具体的手段としては、過マンガン酸カリウムや重クロム酸カリウム等の酸化剤、N−メチル−2−ピロリドンやN,N−ジメチルホルムアミド等の有機溶剤、水酸化ナトリウムや水酸化カリウム等のアルカリ水溶液が使用され、これら化学薬品による処理で、絶縁樹脂層の表層部に存在する微粒子状のゴム成分及び/又は炭酸カルシウムなどのフィラーが粗化剤に溶出又は分解し、硬化樹脂絶縁層の表面に凹凸状の粗化面が形成できることが記載されている(例えば、特許文献1参照)。一方、熱可塑性樹脂、とりわけ結晶性熱可塑性樹脂は耐薬品性に優れることがよく知られており、上記のような化学薬品でアンカー効果によるめっき皮膜の密着性に有効な粗化表面を形成することは一般的に困難である。但し、上記の従来技術の記載にある様に、特定の化学薬品に対して溶解性を示す炭酸カルシウムなどの特定無機フィラー、或いはブタジエン系ポリマーなどの特定樹脂を多量に結晶性熱可塑性樹脂に添加することにより、成形品上に凹凸状の粗化面を形成することは可能であるが、結晶性熱可塑性樹脂が有する優れた機械的特性や耐薬品性が著しく損なわれるという問題が生じることから、実使用可能な用途範囲は極めて限定される。従って、一般的結晶性熱可塑性樹脂において、化学薬品による粗化処理と短波長紫外線照射処理を併用してめっき処理を行なっても、実使用に耐えるめっき皮膜の密着性は実質上得られなかった。
【0003】
結晶性熱可塑性樹脂材料に対して、サンドブラスト等の物理的な方法により特定粗さになるよう粗化処理し、パラジウム塩を含む特定の水溶性高分子樹脂組成物を使用してめっきする方法が、例えば特許文献2に開示されている。この方法によれば、熱可塑性ポリエステル樹脂を含めた結晶性熱可塑性樹脂に対して、良好な密着性を有するめっき皮膜を形成することができるが、めっき触媒としてのパラジウム塩を含有する特殊な水溶性樹脂組成物を塗装する必要があり、工業湿式めっき工程で一般的に使用される錫−パラジウムコロイド系触媒と比較して、触媒物質の塗着効率に由来する製造コストの上昇が非常に大きいという問題があった。
【0004】
【特許文献1】
特開2001−85840号公報
【特許文献2】
特開2000‐154266号公報
【0005】
【発明が解決しようとする課題】
本発明の目的は、めっき皮膜密着性に優れた結晶性ポリエステル樹脂成形品のめっき方法及びその方法によるめっき品を提供することにある。
【0006】
【課題を解決するための手段】
本発明者らは、前記課題の解決を目指して鋭意検討した結果、結晶性ポリエステル樹脂成形品において、物理的な粗化処理法の一つであるブラスト処理と特定波長の紫外線照射処理を併用することにより、めっき皮膜密着性に関して著しい改善効果があることを見出して本発明に至った。
すなわち本発明は、結晶性ポリエステル樹脂成形品をブラスト処理により表面粗さ(Ra)が0.5μm以上にする粗化処理工程と、粗化処理した成形品表面に300nm以下の波長の紫外線を照射する工程と、これらの工程を経た成形品をめっき処理する工程とからなることを特徴とする結晶性ポリエステル樹脂成形品のめっき方法を提供する。また、本発明は紫外線照射強度が100mJ/cm2以上である前記発明の結晶性ポリエステル樹脂成形品のめっき方法を提供する。また、本発明は、前記発明の方法により得られためっきされた結晶性ポリエステル樹脂成形品を提供する。更に本発明は、めっきが電磁波シールド用であるか電気回路用である前記めっきされた結晶性ポリエステル樹脂成形品を提供する。
【0007】
【発明の実施の形態】
以下、本発明について詳細に説明する。
本発明で用いる結晶性ポリエステル樹脂とは、例えば、ポリブチレンテレフタレート樹脂、ポリエチレンテレフタレート樹脂、ポリプロピレンテレフタレート樹脂、ポリブチレンナフタレート樹脂、ポリシクロヘキサンジメチレンテレフタレート樹脂、液晶性ポリエステル樹脂の単独、又はこれらの混合物を云う。これらの樹脂を主成分として公知の無機充填剤、安定剤、着色剤、エラストマー等を含んでいてもよい。成形品とは、特に制限されず、例えば、射出成形品、押出し成形品、ブロー成形品、フイルム成形品等が挙げられる。これらの樹脂は耐薬品性があり、めっきの前工程としての樹脂の粗化に際し、樹脂表面の酸化などの化学的方法による粗化が困難である。
【0008】
粗化処理とは、結晶性ポリエステル樹脂成形品の表面を粗面化する処理を云う。本発明においては、ブラスト処理のような機械的手段により粗化処理を行なう。ブラスト処理としては、サンドブラスト法(エアーブラスト法)、液体ホーニング法、タンブリング法、ショットブラスト法などの方法がよく知られているが、アルミナ等の無機質微粉を水中に分散させたものを圧縮空気の力で被処理物に吹付けるウェットブラスト処理或いは液体ホーニング処理と呼ばれる方法が特に好適に用いられる。この処理により、結晶性ポリエステル樹脂成形品の表面粗さは、(Ra)が0.5μm以上、好ましくは1μm以上、10μm以下とする。Raが小さすぎると、後述の紫外線照射処理をしてもめっき皮膜の結晶性ポリエステル樹脂成形品への十分な密着強度が得られない。また過度に粗くしても外観上の問題を生じたり、電気的特性の問題を生じたりするため、好ましくない。
【0009】
前記の粗化処理を行なった結晶性ポリエステル樹脂成形品は、次に、300nm以下、好ましくは150〜280nmの波長の紫外線照射処理を受ける。紫外線照射処理は、粗化された樹脂成形品表面にめっき触媒となる金属が付着し易く、結果的にはめっき皮膜の密着性を大きくする効果を有する。300nm以下の紫外線は、例えば、市販の低圧水銀ランプを使用することにより得られる。300nm以下の紫外線は、一般的に容器などの殺菌処理やプラスチックの塗装・印刷の前処理として利用される。殺菌処理については、当該波長域の紫外線が殺菌効果を有するためであり、塗装・印刷時の前処理は、紫外線の表面改質効果による塗料・インクのぬれ性改善や官能基創出による塗料・インクとの反応効果による密着性改善を目的としている。当該発明者らの研究によれば、ブラスト処理によりプラスチック表面は十分に親水性となる。また、塗料・インクで見られるようなある種の化学反応は期待されないため、ブラスト処理と紫外線照射処理によるめっき皮膜密着性の大幅向上の要因は、未だ明らかではないが、別のメカニズムが働いているものと考えられる。要因の一つとして、めっき触媒との電気化学的吸着効果が考えられる。尚、300nm以下の紫外線の照射条件は、紫外線照射強度が100mJ/cm2以上、更には300mJ/cm2以上、3000mJ/cm2以下であることが好ましい。
【0010】
紫外線照射処理を行なった成形品は、めっき処理を受ける。紫外線照射処理した成形品を水洗、錫−パラジウムコロイド触媒溶液に浸漬し、塩酸による活性化処理をした後、例えば、無電解銅めっき、電気銅めっきを行なう一般的な前処理方法が採用できる。即ち、パラジウム塩、錯生成剤及び水溶性ポリマーを主成分とする特殊な水溶性高分子樹脂組成物を成形品表面に塗布し、加熱、紫外線或いはレーザーなどの高エネルギー線の照射によりパラジウムイオンを還元し、金属パラジウムとして成形品表面に沈着させる等の特殊な水溶性高分子樹脂組成物を用いた、特殊な前処理を行なった後に化学銅めっき、化学ニッケルめっきを行うと云う工程は必要ない。めっき膜の厚さは、用途により異なるが0.1〜100μm、更には0.5〜50μmが好ましい。電磁波シールド用には、膜厚0.5〜10μm、電気回路用には、1〜50μmが好ましい。また、密着力はピール強さ評価法で0.5kgf/10mm以上であることが好ましい。電気回路用の場合には、化学銅めっきが好ましい。また、電気回路用には、フォトレジスト法、(フォトエッチング法)等の公知の方法によりめっきした面の不要部分を選択的に溶解除去し、必要とする電気回路層を形成する。
【0011】
このようにして得られる結晶性ポリエステル樹脂成形品めっき品はめっき皮膜の樹脂成形品に対する密着強度が高く、電磁波シールド部品や電気回路基板などに好適に用いられる。具体的には、電気・電子用コネクター、光通信用光リンク、電子制御ユニット(ECU)、放電灯昇電圧装置、携帯電話、携帯用通信端末装置の部品などに使用される。
【0012】
【実施例】
以下、実施例により本発明を具体的に説明するが、本発明はこれらに限定されるものではない。尚、プラスチック成形品とめっき皮膜との密着性を評価した方法は以下の通りである。
ピール強さ評価法
プラスチック成形品のめっき表面にカッターナイフを使用して10mm間隔で2本のカット傷を入れる。次いで、10mm幅にカット傷を入れためっき皮膜の片端を15〜25mm程度プラスチック成形品表面から剥ぎ起こす。次に、剥ぎ起こした部分を引張り試験機に取り付け、プラスチック成形品のめっき表面に対して90°の方向にクロスヘッドスピード50mm/分の速度で引張り、ピール強さ(kgf/10mm)を測定した。
表面粗さ(Ra)
JIS B0601に準拠して算術平均粗さを測定した。
【0013】
(実施例1)
ガラス繊維(GF)15重量%を含有するポリブチレンテレフタレート(PBT)樹脂(ポリプラスチックス(株)製、ジュラネックス(登録商標)3105)を使用し、射出成形機を用いて縦10cm×横10cm×厚み3mmの平板状のプラスチック成形品を作製した。次に、この成形品の片面を、市販の液体ホーニング装置(不二精機製造所製、型式LH5)を使用して下記条件によりブラスト処理した。
研削剤:中心粒子径44〜74μmの溶融質アルミナ研削剤(液体:水、分散濃度17体積%)
吹付け圧力:0.4MPa
被処理物との距離:約20cm
処理時間:20秒
次いで、上記処理したものを水洗、室温乾燥した後、市販の表面粗度測定装置(ミツトヨ社製、SV−C624)により粗化処理面の表面粗さを測定した。表面粗さ(Ra)は1.5μmであった。次にこのサンプルを市販の低圧水銀ランプ照射装置(SEN LIGHTS CORPORATION製、型式PL8−200、主波長185nm及び254nm)を使用して、ランプからの距離5cm(紫外線照射強度が10mW/cm2)の所にサンプルを置いて60秒間(600mJ/cm2)、紫外線ランプ照射を行った。次に、このサンプルを水洗、錫−パラジウムコロイド触媒溶液(シプレイ・ファーイースト社製/キャタポジット44)に浸漬、塩酸による活性化処理を行なった後、無電解銅めっき液(シプレイ・ファーイースト社製/オムニシールド1598)に45℃×30分間浸漬して無電解めっきを行った。得られた無電解銅めっき皮膜の厚さは約1.5μm程度であった。更に、電気銅めっきを約30μm程度行って評価用のサンプルを得、上記の方法によりめっき皮膜のピール強さを測定した。その結果、1.2kgf/10mmの値を得た。
【0014】
(実施例2)
ガラス繊維(GF)30重量%を含有する液晶性ポリエステル(LCP)(ポリプラスチックス(株)製、ベクトラ(登録商標)E1301)樹脂を使用した他は、実施例1と同様にして評価サンプルを得て、同様の評価を行なった。結果を表1に示す。
【0015】
(比較例1及び3)
紫外線ランプ照射による処理を行なわなかった他は、それぞれ実施例1及び2と同様にして評価サンプルを得て、同様の評価を行なった。
(比較例2及び4)
液体ホーニングによるブラスト処理を行なわなかった他は、それぞれ実施例1及び2と同様にして評価サンプルを得て、同様の評価を行なった。
(比較例5及び6)
非強化のポリアセタール(POM)樹脂(ポリプラスチックス(株)製、ジュラコン(登録商標)M90S)及びガラス繊維40重量%を含有するポリフェニレンサルファイド(PPS)樹脂(ポリプラスチックス(株)製、フォートロン(登録商標)1140A6)をそれぞれ用いた他は、実施例1と同様にして評価サンプルを得て、同様の評価を行なった。
(比較例7及び8)
粗化処理の方法として、ブラスト処理に代わり、化学薬品による浸漬エッチング処理を下記条件で実施した他は、それぞれ実施例1及び2と同様にして評価サンプルを得て、同様の評価を行なった。
化学薬品:40%水酸化カルシウム水溶液
温度:70℃
時間:30分
【0016】
(比較例9及び10)
低圧水銀ランプによる紫外線照射処理の代わりに、市販のコロナ放電処理装置(tantec社製、型式HVO5−2)を使用し、下記条件により処理した他は、それぞれ実施例1及び2と同様にして評価サンプルを得て、同様の評価を行なった。比較例の結果を表1に示す。
処理速度:20mm/sec
距離:約10mm
回数:3回パス
【0017】
【表1】
【0018】
【発明の効果】
本発明に係るプラスチック成形品のめっき方法によれば、結晶性ポリエステル樹脂成形品に対して密着強度が高いめっき皮膜が得られ、電磁波シールド部品や電気回路基板などに好適に用いることができる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for plating a crystalline polyester resin molded article and a plated article obtained by the method.
[0002]
[Prior art]
In order to manufacture circuit parts and other electrical and electronic products or parts using resins with excellent molding processability and excellent electrical and mechanical properties, it is necessary to have a technique for bonding resin surfaces to metal surfaces. As one of the methods, a plating method has been conventionally proposed.
Patent Document 1 discloses a method in which a surface of an insulating resin layer is roughened and then subjected to plating treatment by irradiating with short wavelength ultraviolet rays. In this method, specific means for roughening the insulating resin layer include oxidizing agents such as potassium permanganate and potassium dichromate, N-methyl-2-pyrrolidone, N, N-dimethylformamide and the like. Organic solvents, alkaline aqueous solutions such as sodium hydroxide and potassium hydroxide are used, and the treatment with these chemicals roughens fine rubber components and / or fillers such as calcium carbonate present in the surface layer of the insulating resin layer. It is described that an uneven roughened surface can be formed on the surface of the cured resin insulating layer by elution or decomposition into the agent (for example, see Patent Document 1). On the other hand, it is well known that thermoplastic resins, especially crystalline thermoplastic resins, are excellent in chemical resistance, and the above chemicals form a roughened surface effective for the adhesion of the plating film by the anchor effect. That is generally difficult. However, as described in the above prior art, a large amount of a specific inorganic filler such as calcium carbonate or a specific resin such as a butadiene polymer that is soluble in a specific chemical is added to the crystalline thermoplastic resin. It is possible to form an uneven rough surface on the molded product, but the problem arises that the excellent mechanical properties and chemical resistance of the crystalline thermoplastic resin are significantly impaired. The practical application range is extremely limited. Therefore, in general crystalline thermoplastic resins, even if the plating treatment was performed by using a combination of a chemical roughening treatment and a short-wavelength ultraviolet irradiation treatment, the adhesion of the plating film that could withstand actual use was practically not obtained. .
[0003]
There is a method in which a crystalline thermoplastic resin material is roughened by a physical method such as sand blasting to have a specific roughness and plated using a specific water-soluble polymer resin composition containing a palladium salt. For example, it is disclosed in Patent Document 2. According to this method, it is possible to form a plating film having good adhesion to a crystalline thermoplastic resin including a thermoplastic polyester resin, but a special water solution containing a palladium salt as a plating catalyst. In comparison with tin-palladium colloidal catalysts generally used in industrial wet plating processes, there is a very large increase in production cost due to the coating efficiency of the catalyst material. There was a problem.
[0004]
[Patent Document 1]
JP 2001-85840 A [Patent Document 2]
JP 2000-154266 A
[Problems to be solved by the invention]
The objective of this invention is providing the plating method of the crystalline polyester resin molded product excellent in plating film adhesiveness, and the plating product by the method.
[0006]
[Means for Solving the Problems]
As a result of intensive studies aimed at solving the above problems, the inventors of the present invention combined use of blasting, which is one of physical roughening treatment methods, and ultraviolet irradiation treatment of a specific wavelength in a crystalline polyester resin molded article. As a result, it has been found that there is a marked improvement effect on the adhesion of the plating film, and the present invention has been achieved.
That is, the present invention includes a roughening treatment step in which a surface roughness (Ra) is 0.5 μm or more by blasting a crystalline polyester resin molded product, and the surface of the roughened molded product is irradiated with ultraviolet rays having a wavelength of 300 nm or less. There is provided a method for plating a crystalline polyester resin molded product comprising the steps of: and a step of plating a molded product that has undergone these steps. Moreover, this invention provides the plating method of the crystalline polyester resin molded product of the said invention whose ultraviolet irradiation intensity is 100 mJ / cm < 2 > or more. Moreover, this invention provides the plated crystalline polyester resin molded article obtained by the method of the said invention. Furthermore, the present invention provides the plated crystalline polyester resin molded product, wherein the plating is for electromagnetic wave shielding or for electric circuits.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail.
The crystalline polyester resin used in the present invention is, for example, polybutylene terephthalate resin, polyethylene terephthalate resin, polypropylene terephthalate resin, polybutylene naphthalate resin, polycyclohexanedimethylene terephthalate resin, liquid crystalline polyester resin alone, or a mixture thereof. Say. These resins may be used as a main component and may contain known inorganic fillers, stabilizers, colorants, elastomers, and the like. The molded product is not particularly limited, and examples thereof include injection molded products, extrusion molded products, blow molded products, and film molded products. These resins have chemical resistance and are difficult to roughen by chemical methods such as oxidation of the resin surface when the resin is roughened as a pre-plating process.
[0008]
The roughening treatment refers to a treatment for roughening the surface of the crystalline polyester resin molded product. In the present invention, roughening is performed by mechanical means such as blasting. As a blasting process, a sand blasting method (air blasting method), a liquid honing method, a tumbling method, a shot blasting method, and the like are well known. A method in which inorganic fine powder such as alumina is dispersed in water is used. A method called wet blasting or liquid honing that sprays the workpiece with force is particularly preferably used. By this treatment, the surface roughness of the crystalline polyester resin molded product is such that (Ra) is 0.5 μm or more, preferably 1 μm or more and 10 μm or less. If Ra is too small, sufficient adhesion strength to the crystalline polyester resin molded product of the plating film cannot be obtained even if the ultraviolet irradiation treatment described later is performed. Moreover, since it will produce the problem on an external appearance and the problem of an electrical property even if it roughens too much, it is unpreferable.
[0009]
The crystalline polyester resin molded article subjected to the roughening treatment is then subjected to an ultraviolet irradiation treatment with a wavelength of 300 nm or less, preferably 150 to 280 nm. The ultraviolet irradiation treatment has an effect of increasing the adhesion of the plating film as a result of the metal serving as the plating catalyst being easily attached to the roughened resin molded product surface. Ultraviolet rays of 300 nm or less can be obtained by using, for example, a commercially available low-pressure mercury lamp. Ultraviolet rays of 300 nm or less are generally used as a pretreatment for sterilization treatment of containers and the like and plastic coating / printing. The sterilization treatment is because ultraviolet rays in the wavelength range have a sterilization effect, and the pretreatment at the time of painting and printing is performed by improving the wettability of paints and inks by the surface modification effect of ultraviolet rays and by creating functional groups. The purpose is to improve adhesion by the reaction effect. According to the study by the inventors, the plastic surface becomes sufficiently hydrophilic by blasting. In addition, since certain chemical reactions such as those seen in paints and inks are not expected, the cause of the significant improvement in plating film adhesion by blasting and ultraviolet irradiation treatment is not yet clear, but another mechanism works. It is thought that there is. One of the factors may be an electrochemical adsorption effect with the plating catalyst. The irradiation conditions of UV light below 300nm, the ultraviolet irradiation intensity 100 mJ / cm 2 or more, further 300 mJ / cm 2 or more, is preferably 3000 mJ / cm 2 or less.
[0010]
The molded product that has been subjected to the ultraviolet irradiation treatment is subjected to a plating treatment. A general pretreatment method in which, for example, electroless copper plating or electrolytic copper plating is performed after the molded product subjected to ultraviolet irradiation treatment is washed with water, immersed in a tin-palladium colloidal catalyst solution, and activated with hydrochloric acid can be employed. That is, a special water-soluble polymer resin composition mainly composed of a palladium salt, a complexing agent and a water-soluble polymer is applied to the surface of a molded article, and palladium ions are irradiated by heating, irradiation of high energy rays such as ultraviolet rays or lasers. There is no need to perform chemical copper plating or chemical nickel plating after special pretreatment using a special water-soluble polymer resin composition such as reduction and deposition on the surface of the molded article as metallic palladium. . The thickness of the plating film varies depending on the use, but is preferably 0.1 to 100 μm, and more preferably 0.5 to 50 μm. A film thickness of 0.5 to 10 μm is preferable for electromagnetic shielding, and 1 to 50 μm is preferable for electric circuits. Moreover, it is preferable that adhesive force is 0.5 kgf / 10mm or more by the peel strength evaluation method. In the case of an electric circuit, chemical copper plating is preferable. For electric circuits, unnecessary portions of the plated surface are selectively dissolved and removed by a known method such as a photoresist method or a (photo etching method) to form a necessary electric circuit layer.
[0011]
The crystallized polyester resin molded product plated product thus obtained has a high adhesion strength of the plating film to the resin molded product, and is suitably used for electromagnetic shielding components, electric circuit boards, and the like. Specifically, it is used for parts of electrical / electronic connectors, optical links for optical communication, electronic control units (ECUs), discharge lamp voltage raising devices, mobile phones, portable communication terminal devices, and the like.
[0012]
【Example】
EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto. The method for evaluating the adhesion between the plastic molded product and the plating film is as follows.
Peel Strength Evaluation Method Two cut flaws are made at 10 mm intervals on the plating surface of a plastic molded product using a cutter knife. Next, one end of the plating film having a cut flaw of 10 mm width is peeled off from the surface of the plastic molded product by about 15 to 25 mm. Next, the peeled portion was attached to a tensile tester, pulled at a crosshead speed of 50 mm / min in the direction of 90 ° with respect to the plating surface of the plastic molded product, and the peel strength (kgf / 10 mm) was measured. .
Surface roughness (Ra)
Arithmetic mean roughness was measured according to JIS B0601.
[0013]
Example 1
Polybutylene terephthalate (PBT) resin containing 15% by weight of glass fiber (GF) (manufactured by Polyplastics Co., Ltd., DURANEX (registered trademark) 3105) is used, and 10 cm long by 10 cm wide using an injection molding machine. X A flat plastic molded product having a thickness of 3 mm was produced. Next, one side of this molded product was blasted under the following conditions using a commercially available liquid honing apparatus (manufactured by Fuji Seiki Seisakusho, model LH5).
Abrasive: Melt alumina abrasive with a central particle size of 44 to 74 μm (liquid: water, dispersion concentration 17% by volume)
Spray pressure: 0.4 MPa
Distance to workpiece: about 20cm
Treatment time: 20 seconds Subsequently, the above treated material was washed with water and dried at room temperature, and then the surface roughness of the roughened surface was measured with a commercially available surface roughness measuring device (SV-C624, manufactured by Mitutoyo Corporation). The surface roughness (Ra) was 1.5 μm. Next, using a commercially available low-pressure mercury lamp irradiation device (manufactured by SEN LIGHTTS CORPORATION, model PL8-200, main wavelengths 185 nm and 254 nm), this sample was measured at a distance of 5 cm from the lamp (ultraviolet irradiation intensity was 10 mW / cm 2 ). A sample was placed on the spot and irradiated with an ultraviolet lamp for 60 seconds (600 mJ / cm 2 ). Next, this sample was washed with water, immersed in a tin-palladium colloidal catalyst solution (manufactured by Shipley Far East Co., Ltd./Cataposit 44), subjected to activation treatment with hydrochloric acid, and then electroless copper plating solution (Shipley Far East Co., Ltd.). Manufactured / Omni Shield 1598) at 45 ° C. for 30 minutes for electroless plating. The thickness of the obtained electroless copper plating film was about 1.5 μm. Furthermore, electrolytic copper plating was performed for about 30 μm to obtain a sample for evaluation, and the peel strength of the plating film was measured by the above method. As a result, a value of 1.2 kgf / 10 mm was obtained.
[0014]
(Example 2)
An evaluation sample was prepared in the same manner as in Example 1 except that liquid crystalline polyester (LCP) (polyplastics Co., Ltd., Vectra (registered trademark) E1301) resin containing 30% by weight of glass fiber (GF) was used. The same evaluation was performed. The results are shown in Table 1.
[0015]
(Comparative Examples 1 and 3)
An evaluation sample was obtained in the same manner as in Examples 1 and 2 except that the treatment by ultraviolet lamp irradiation was not performed, and the same evaluation was performed.
(Comparative Examples 2 and 4)
An evaluation sample was obtained in the same manner as in Examples 1 and 2 except that blasting by liquid honing was not performed, and the same evaluation was performed.
(Comparative Examples 5 and 6)
Non-reinforced polyacetal (POM) resin (manufactured by Polyplastics Co., Ltd., Duracon (registered trademark) M90S) and polyphenylene sulfide (PPS) resin containing 40% by weight of glass fiber (manufactured by Polyplastics Co., Ltd., Fortron) An evaluation sample was obtained in the same manner as in Example 1 except that (registered trademark) 1140A6) was used, and the same evaluation was performed.
(Comparative Examples 7 and 8)
As an example of the roughening treatment, evaluation samples were obtained in the same manner as in Examples 1 and 2 except that immersion etching treatment with chemicals was performed under the following conditions instead of blast treatment, and the same evaluation was performed.
Chemical: 40% calcium hydroxide aqueous solution Temperature: 70 ° C
Time: 30 minutes [0016]
(Comparative Examples 9 and 10)
Evaluation was carried out in the same manner as in Examples 1 and 2 except that a commercially available corona discharge treatment apparatus (manufactured by tantec, model HVO5-2) was used instead of ultraviolet irradiation treatment with a low-pressure mercury lamp, and treatment was performed under the following conditions. Samples were obtained and evaluated similarly. The results of the comparative example are shown in Table 1.
Processing speed: 20mm / sec
Distance: about 10mm
Number of times: 3 passes [0017]
[Table 1]
[0018]
【The invention's effect】
According to the method for plating a plastic molded product according to the present invention, a plating film having high adhesion strength to a crystalline polyester resin molded product can be obtained, and can be suitably used for an electromagnetic shielding component, an electric circuit board, and the like.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002259462A JP3857202B2 (en) | 2002-09-04 | 2002-09-04 | Plating method for crystalline polyester resin molded article and plated crystalline polyester resin molded article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002259462A JP3857202B2 (en) | 2002-09-04 | 2002-09-04 | Plating method for crystalline polyester resin molded article and plated crystalline polyester resin molded article |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004099918A JP2004099918A (en) | 2004-04-02 |
JP3857202B2 true JP3857202B2 (en) | 2006-12-13 |
Family
ID=32260458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002259462A Expired - Fee Related JP3857202B2 (en) | 2002-09-04 | 2002-09-04 | Plating method for crystalline polyester resin molded article and plated crystalline polyester resin molded article |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3857202B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101431613B1 (en) * | 2013-07-25 | 2014-08-22 | (주)에스앤에스켐 | Manufacturing method of EMI shielding layer |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005320569A (en) * | 2004-05-07 | 2005-11-17 | Murata Mfg Co Ltd | Plating apparatus |
US7354354B2 (en) * | 2004-12-17 | 2008-04-08 | Integran Technologies Inc. | Article comprising a fine-grained metallic material and a polymeric material |
JP4851264B2 (en) * | 2005-08-30 | 2012-01-11 | 古河電気工業株式会社 | POLYMER FILM, PROCESS FOR PRODUCING THE SAME, AND LAMINATE FOR WIRING BOARD |
JP2014123619A (en) * | 2012-12-20 | 2014-07-03 | Hitachi Chemical Co Ltd | Electronic component manufacturing method and electronic component |
JP7194372B2 (en) * | 2017-06-09 | 2022-12-22 | 株式会社 高秋化学 | METHOD FOR FORMING COATING OF RESIN MOLDED PRODUCT |
-
2002
- 2002-09-04 JP JP2002259462A patent/JP3857202B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101431613B1 (en) * | 2013-07-25 | 2014-08-22 | (주)에스앤에스켐 | Manufacturing method of EMI shielding layer |
Also Published As
Publication number | Publication date |
---|---|
JP2004099918A (en) | 2004-04-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2009142B1 (en) | Composition for etching treatment of resin molded article | |
JP6004046B2 (en) | Manufacturing method of aluminum resin joined body | |
TWI445068B (en) | A manufacture method of forming a circuit unit | |
JP6749482B2 (en) | Method for forming conductive traces on a polymeric article surface | |
US8202576B2 (en) | Method of forming metal film | |
EP3315302B1 (en) | Laminated body, molded article, electroconductive pattern, electronic circuit, and electromagnetic shield | |
JP4528634B2 (en) | Method for forming metal film | |
JP4738308B2 (en) | Method for producing cycloolefin polymer material with metal film and cycloolefin polymer material with metal film obtained by using the method | |
CN1481448A (en) | Plating method of metal film on surface of polymer | |
JP4135459B2 (en) | Method for pretreatment of electroless plating material and method for manufacturing plating coated member | |
KR100883726B1 (en) | Plating method of non-conductor products | |
KR20060031692A (en) | Resin substrate having a resin-metal composite layer and a method of manufacturing the same | |
JP3857202B2 (en) | Plating method for crystalline polyester resin molded article and plated crystalline polyester resin molded article | |
JP5149805B2 (en) | Electroless copper plating method | |
JP3999696B2 (en) | Electroless plating method and plated parts | |
JP3343522B2 (en) | Manufacturing method of plastic molded products | |
TWI404475B (en) | Selective deposition of metal on plastic substrates | |
JP4930804B2 (en) | Method for producing electroless plating material | |
JP2013095958A (en) | Manufacturing method of laminate having metal layer | |
CN1743502A (en) | The method of plating resin material | |
KR101557204B1 (en) | Plating Method on Engineering Plastic | |
US8563093B2 (en) | Method for production of electroless plating material | |
JP4940512B2 (en) | Method for forming electroless plating film of resin | |
KR20090046385A (en) | Electroless Plating Method and Electroless Plating Material Using the Same | |
KR20230121047A (en) | Etching liquid for silver and manufacturing method of printed wiring board using the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20050819 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050823 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060317 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060328 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20060912 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20060913 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090922 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100922 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100922 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110922 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120922 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130922 Year of fee payment: 7 |
|
LAPS | Cancellation because of no payment of annual fees |