JP3839929B2 - Resin composition with improved hue and film comprising the composition - Google Patents
Resin composition with improved hue and film comprising the composition Download PDFInfo
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- JP3839929B2 JP3839929B2 JP25930797A JP25930797A JP3839929B2 JP 3839929 B2 JP3839929 B2 JP 3839929B2 JP 25930797 A JP25930797 A JP 25930797A JP 25930797 A JP25930797 A JP 25930797A JP 3839929 B2 JP3839929 B2 JP 3839929B2
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- Prior art keywords
- film
- polyethylene resin
- resin composition
- ethylene
- temperature
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- 239000011342 resin composition Substances 0.000 title claims description 13
- 239000000203 mixture Substances 0.000 title description 5
- 229910000323 aluminium silicate Inorganic materials 0.000 claims description 14
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 14
- 229920013716 polyethylene resin Polymers 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 10
- 238000000113 differential scanning calorimetry Methods 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 4
- 238000001938 differential scanning calorimetry curve Methods 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 229920005678 polyethylene based resin Polymers 0.000 claims description 3
- 238000013213 extrapolation Methods 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 description 34
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 33
- -1 polypropylene Polymers 0.000 description 32
- 239000004711 α-olefin Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 18
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 17
- 238000007789 sealing Methods 0.000 description 15
- 229920001577 copolymer Polymers 0.000 description 12
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 12
- 238000000465 moulding Methods 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 9
- 150000001768 cations Chemical class 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 150000002500 ions Chemical class 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 5
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 5
- 239000002981 blocking agent Substances 0.000 description 5
- 229920000092 linear low density polyethylene Polymers 0.000 description 5
- 239000004707 linear low-density polyethylene Substances 0.000 description 5
- 239000012968 metallocene catalyst Substances 0.000 description 5
- 239000000725 suspension Substances 0.000 description 5
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 150000008040 ionic compounds Chemical class 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 2
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004581 coalescence Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229920001038 ethylene copolymer Polymers 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 238000001542 size-exclusion chromatography Methods 0.000 description 2
- 239000012748 slip agent Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- DBQOUEWUAIHCNY-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenyl)alumane Chemical compound Fc1c(F)c(F)c([AlH2])c(F)c1F DBQOUEWUAIHCNY-UHFFFAOYSA-N 0.000 description 1
- ZOICEQJZAWJHSI-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenyl)boron Chemical compound [B]C1=C(F)C(F)=C(F)C(F)=C1F ZOICEQJZAWJHSI-UHFFFAOYSA-N 0.000 description 1
- BKBUTURKEFUGJM-UHFFFAOYSA-N (3,4,5-trifluorophenyl)boron Chemical compound [B]C1=CC(F)=C(F)C(F)=C1 BKBUTURKEFUGJM-UHFFFAOYSA-N 0.000 description 1
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 1
- 125000004361 3,4,5-trifluorophenyl group Chemical group [H]C1=C(F)C(F)=C(F)C([H])=C1* 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- QOVUQHJLIWOBNB-UHFFFAOYSA-N C1=CC=CC=C1[P](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 Chemical compound C1=CC=CC=C1[P](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 QOVUQHJLIWOBNB-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- WTMNYOPMWNBMAA-UHFFFAOYSA-N Fc1c(F)c(F)c(c(F)c1F)[P](c1c(F)c(F)c(F)c(F)c1F)(c1c(F)c(F)c(F)c(F)c1F)c1c(F)c(F)c(F)c(F)c1F Chemical compound Fc1c(F)c(F)c(c(F)c1F)[P](c1c(F)c(F)c(F)c(F)c1F)(c1c(F)c(F)c(F)c(F)c1F)c1c(F)c(F)c(F)c(F)c1F WTMNYOPMWNBMAA-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- AFJXJDKUWZPRQX-UHFFFAOYSA-N [3,5-bis(trifluoromethyl)phenyl]boron Chemical compound [B]C1=CC(C(F)(F)F)=CC(C(F)(F)F)=C1 AFJXJDKUWZPRQX-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- OJOSABWCUVCSTQ-UHFFFAOYSA-N cyclohepta-2,4,6-trienylium Chemical compound C1=CC=C[CH+]=C[CH]1 OJOSABWCUVCSTQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- XBPCUCUWBYBCDP-UHFFFAOYSA-O dicyclohexylazanium Chemical compound C1CCCCC1[NH2+]C1CCCCC1 XBPCUCUWBYBCDP-UHFFFAOYSA-O 0.000 description 1
- ROSDSFDQCJNGOL-UHFFFAOYSA-O dimethylaminium Chemical compound C[NH2+]C ROSDSFDQCJNGOL-UHFFFAOYSA-O 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-O dipropylazanium Chemical compound CCC[NH2+]CCC WEHWNAOGRSTTBQ-UHFFFAOYSA-O 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- BQPIGGFYSBELGY-UHFFFAOYSA-N mercury(2+) Chemical compound [Hg+2] BQPIGGFYSBELGY-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- WVIICGIFSIBFOG-UHFFFAOYSA-N pyrylium Chemical compound C1=CC=[O+]C=C1 WVIICGIFSIBFOG-UHFFFAOYSA-N 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000007613 slurry method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- LMPPLQCHTQMREC-UHFFFAOYSA-N tetrakis(2,3,4,5,6-pentafluorophenyl)antimony Chemical compound FC1=C(F)C(F)=C(F)C(F)=C1[Sb](C=1C(=C(F)C(F)=C(F)C=1F)F)(C=1C(=C(F)C(F)=C(F)C=1F)F)C1=C(F)C(F)=C(F)C(F)=C1F LMPPLQCHTQMREC-UHFFFAOYSA-N 0.000 description 1
- SDZDVEBYGHBDLZ-UHFFFAOYSA-N tetrakis(2,3,4,5,6-pentafluorophenyl)arsenic Chemical compound FC1=C(F)C(F)=C(F)C(F)=C1[As](C=1C(=C(F)C(F)=C(F)C=1F)F)(C=1C(=C(F)C(F)=C(F)C=1F)F)C1=C(F)C(F)=C(F)C(F)=C1F SDZDVEBYGHBDLZ-UHFFFAOYSA-N 0.000 description 1
- CTNFMWSFOVTSNU-UHFFFAOYSA-N tetraphenylantimony Chemical compound C1=CC=CC=C1[Sb](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 CTNFMWSFOVTSNU-UHFFFAOYSA-N 0.000 description 1
- SPBCHLOKCIXNAN-UHFFFAOYSA-N tetraphenylarsenic Chemical compound C1=CC=CC=C1[As](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 SPBCHLOKCIXNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-O tributylazanium Chemical compound CCCC[NH+](CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-O 0.000 description 1
- ZMANZCXQSJIPKH-UHFFFAOYSA-O triethylammonium ion Chemical compound CC[NH+](CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-O 0.000 description 1
- DWCSXQCXXITVKE-UHFFFAOYSA-N triethyloxidanium Chemical compound CC[O+](CC)CC DWCSXQCXXITVKE-UHFFFAOYSA-N 0.000 description 1
- YWWDBCBWQNCYNR-UHFFFAOYSA-O trimethylphosphanium Chemical compound C[PH+](C)C YWWDBCBWQNCYNR-UHFFFAOYSA-O 0.000 description 1
- OGBBLSOPKGNKHZ-UHFFFAOYSA-N triphenyloxidanium Chemical compound C1=CC=CC=C1[O+](C=1C=CC=CC=1)C1=CC=CC=C1 OGBBLSOPKGNKHZ-UHFFFAOYSA-N 0.000 description 1
- RIOQSEWOXXDEQQ-UHFFFAOYSA-O triphenylphosphanium Chemical compound C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-O 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- GIIXTFIYICRGMZ-UHFFFAOYSA-N tris(2,3-dimethylphenyl)phosphane Chemical compound CC1=CC=CC(P(C=2C(=C(C)C=CC=2)C)C=2C(=C(C)C=CC=2)C)=C1C GIIXTFIYICRGMZ-UHFFFAOYSA-N 0.000 description 1
- COIOYMYWGDAQPM-UHFFFAOYSA-N tris(2-methylphenyl)phosphane Chemical compound CC1=CC=CC=C1P(C=1C(=CC=CC=1)C)C1=CC=CC=C1C COIOYMYWGDAQPM-UHFFFAOYSA-N 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 238000009816 wet lamination Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、成膜後の色相の変化がなく、低温シール性、シール強度、ホットタック性、衝撃強度、透明性に優れ、フィルム同士のブロッキング性、滑り性の良好なフィルム用樹脂組成物および該組成物から得られるフィルムに関する。
【0002】
【従来の技術】
現在、ポリエチレン系樹脂は、その低温シール性、ヒートシール強度、透明性、柔軟性、耐衝撃強度から、単体、もしくはポリアミド樹脂、ポリエステル樹脂、ポリプロピレン樹脂、エチレン・ビニルアルコール共重合体樹脂等の他樹脂との共押し出し、もしくは延伸されたポリアミドフィルム、ポリエステルフィルム、ポリプロピレンフィルム等の基材フィルムと積層することにより、食品、医薬品、工業用品等の包装に広く用いられている。一般的に使用されるポリエチレン系樹脂としては、高圧法低密度ポリエチレン、高密度ポリエチレン、直鎖状低密度ポリエチレン(以下、LLDPEという)やエチレン・酢酸ビニル共重合体(以下、EVAという)やエチレン・アクリル酸共重合体等のエチレン・α−オレフィン共重合体が挙げられるが、低温シール性やシール強度の要求される分野には、LLDPEやEVA等のエチレン・α−オレフィン共重合体が主に用いられる。近年の高速自動包装機の開発や、安定的なシール性の要求から、ポリエチレン系樹脂に更なる低温シール性を賦与する必要性がでてきた。更なる低温シール性を賦与するためには、エチレン・α−オレフィン共重合体中のαオレフィン含量を高め樹脂の結晶性を低下させればよいが、結晶性が低下すると、弾性率の低いベタベタしたフィルムとなり、フィルム同士のブロッキング性及び滑り性が悪化し実用化が困難となる。この欠点を改良するためには、無機フィラー等のアンチブロッキング剤を多量に添加する必要があるが、アンチブロッキング剤と酸化防止剤等の他の添加剤との相互作用により赤変、黄変等の変色が起こりやすくなる。
【0003】
【発明が解決しようとする課題】
本発明は、成膜後の色相の変化がなく、低温シール性、シール強度、ホットタック性、衝撃強度、透明性に優れ、フィルム同士のブロッキング性及び滑り性の良好なフィルム用樹脂組成物及びフィルムを提供することにある。
【0004】
【課題を解決するための手段】
本発明者らは、上記課題を解決することにつき鋭意検討した結果、フィルムの変色及びブロッキング防止に有効な特定の性状を有するアンチブロッキング剤と特定の曲げ弾性率を有するエチレン・α−オレフィン共重合体を組み合わせることにより発明の目的を達成することを見出し、本発明を完成するに至った。すなわち、本発明は、JIS K−7106に準拠して測定した曲げ弾性率が2500kg/cm2以下のポリエチレン系樹脂100重量部に対し、下記(1)〜(3)の性状を有する非晶性アルミノシリケート0.3〜5重量部を含有することを特徴とするポリエチレン系樹脂組成物及びそれからなるフィルムである。
(1)平均粒子径0.1〜10μm
(2)5%固形分の水溶性分散液としたときのpHが5.0以上7.0未満
(3)屈折率1.48〜1.52
【0005】
【発明の実施の態様】
以下に本発明を詳細に説明する。
1.ポリエチレン系樹脂(成分A)
本発明に用いられるポリエチレン系樹脂は、エチレン単独重合体もしくはエチレン・α−オレフィン共重合体である。エチレン・α−オレフィン共重合体としては、エチレンと炭素数4〜18のα−オレフィンとの共重合体が好ましい。α−オレフィンとしては、ブテン−1、ペンテン−1、ヘキセン−1、4−メチル−1−ペンテン、オクテン−1、デセン−1、酢酸ビニル、(メタ)アクリル酸、(メタ)アクリル酸メチルや(メタ)アクリル酸エチル等の(メタ)アクリル酸エステル等が用いられるが、ブテン−1、ヘキセン−1、4−メチル−1−ペンテン、オクテン−1、酢酸ビニル、(メタ)アクリル酸、(メタ)アクリル酸メチル、(メタ)アクリル酸エチルが好ましい。また、これらのα−オレフィンは、二種以上併用して重合に供しても良いし、二種以上のエチレン・α−オレフィン共重合体をブレンドしても構わない。
【0006】
本発明のエチレン・α−オレフィン共重合体のうち、エチレン・ブテン−1共重合体、エチレン・ヘキセン−1共重合体、エチレン・オクテン−1共重合体等であるLLDPEの製造方法としては、高圧ラジカル重合法、高圧イオン重合法、気相法、溶液法、スラリー法等が挙げられるが、高圧イオン重合法が好ましい。触媒としては、チーグラー触媒、メタロセン触媒等の遷移金属錯体触媒が用いられるが、メタロセン触媒を用いるのが好ましい。
【0007】
本発明におけるエチレン・α−オレフィン共重合体の具体的な製造方法としては、特開昭58−19309号、同59−95292号、同60−35005号、同60−35006号、同60−35007号、同60−35008号、同60−35009号、同61−130314号、特開平3−163088号の各公報、ヨーロッパ特許出願公開第420,436号明細書、米国特許第5,055,438号明細書、および国際公開公報W091/04257号明細書等に記載されている方法、すなわちメタロセン触媒、メタロセン/アルモキサン触媒、または、例えば国際公開公報W092/07123号明細書等に開示されている様なメタロセン化合物と以下に述べるメタロセン触媒と反応して安定なイオンとなる化合物からなる触媒を使用して、主成分のエチレンと従成分の炭素数4〜18のα−オレフィンとを共重合させる方法等を挙げることができる。
【0008】
上述のメタロセン触媒と反応して安定なイオンとなる化合物とは、カチオンとアニオンのイオン対から形成されるイオン性化合物或いは親電子性化合物であり、メタロセン化合物と反応して安定なイオンとなって重合活性種を形成するものである。
このうち、イオン性化合物は下記式(I)で表される。
[Q]m+[Y]m-(mは1以上の整数) (I)
式中のQはイオン性化合物のカチオン成分であり、カルボニウムカチオン、トロピリウムカチオン、アンモニウムカチオン、オキソニウムカチオン、スルホニウムカチオン、ホスホニウムカチオン等が挙げられ、更には、それ自身が還元され易い金属の陽イオンや有機金属の陽イオン等も挙げることができる。
【0009】
これらのカチオンは、特表平1−501950号公報等に開示されているようなプロトンを与えることができるカチオンだけでなく、プロトンを与えないカチオンでも良い。これらのカチオンの具体例としては、トリフェニルカルボニウム、ジフェニルカルボニウム、シクロヘプタトリエニウム、インデニウム、トリエチルアンモニウム、トリプロピルアンモニウム、トリブチルアンモニウム、N,N−ジメチルアンモニウム、ジプロピルアンモニウム、ジシクロヘキシルアンモニウム、トリフェニルホスホニウム、トリメチルホスホニウム、トリ(ジメチルフェニル)ホスホニウム、トリ(メチルフェニル)ホスホニウム、トリフェニルスルホニウム、トリフェニルオキソニウム、トリエチルオキソニウム、ピリリウム、また、銀イオン、金イオン、白金イオン、パラジウムイオン、水銀イオン、フェロセニウムイオン等が挙げられる。
【0010】
また、Yはイオン性化合物のアニオン成分であり、メタロセン化合物と反応して安定なアニオンとなる成分であって、有機ホウ素化合物アニオン、有機アルミニウム化合物アニオン、有機ガリウム化合物アニオン、有機リン化合物アニオン、有機ヒ素化合物アニオン、有機アンチモン化合物アニオン等が挙げられ、具体的にはテトラフェニルホウ素、テトラキス(3,4,5−トリフルオロフェニル)ホウ素、テトラキス(3,5−ジ(トリフルオロメチル)フェニル)ホウ素、テトラキス(3,5−(t−ブチル)フェニル)ホウ素、テトラキス(ペンタフルオロフェニル)ホウ素、テトラフェニルアルミニウム、テトラキス(3,4,5−トリフルオロフェニル)アルミニウム、テトラキス(3,5−ジ(トリフルオロメチル)フェニル)アルミニウム、テトラキス(3,5−ジ(t−ブチル)フェニル)アルミニウム、テトラキス(ペンタフルオロフェニル)アルミニウム、テトラフェニルガリウム、テトラキス(3,4,5−トリフルオロフェニル)ガリウム、テトラキス(3,5−ジ(トリフルオロメチル)フェニル)ガリウム、テトラキス(3,5−ジ(t−ブチル)フェニル)ガリウム、テトラキス(ペンタフルオロフェニル)ガリウム、テトラフェニルリン、テトラキス(ペンタフルオロフェニル)リン、テトラフェニルヒ素、テトラキス(ペンタフルオロフェニル)ヒ素、テトラフェニルアンチモン、テトラキス(ペンタフルオロフェニル)アンチモン、デカボレート、ウンデカボレート、カルバドデカボレート、デカクロロデカボレート等が挙げられる。
【0011】
また、親電子性化合物としては、ルイス酸化合物として知られているもののうち、メタロセン化合物と反応して安定なイオンとなって重合活性種を形成するものであり、種々のハロゲン化金属化合物や固体酸として知られている金属酸化物等が挙げられる。具体的にはハロゲン化マグネシウムやルイス酸性無機化合物が例示される。
【0012】
エチレン・α−オレフィン共重合体のうち、EVA、エチレン・(メタ)アクリル酸共重合体、エチレン・(メタ)アクリル酸エステル共重合体等のエチレンとカルボニル基を有するα−オレフィンとの共重合体の製造方法としては、高圧ラジカル重合等が挙げられる。
【0013】
本発明で用いるエチレン・α−オレフィン共重合体の曲げ弾性率は、2500kg/cm2以下、好ましくは1000kg/cm2以下である。曲げ弾性率が2500kg/cm2を超えると、低温ヒートシール性が悪化するため好ましくない。
【0014】
本発明のエチレン・α−オレフィン共重合体の重量平均分子量Mwと数平均分子量Mnの比Mw/Mn(Q値)は、1.5〜3.0、好ましくは1.5〜2.5であることが望ましい。
【0015】
また、エチレン・α−オレフィン共重合体の示差走査熱量測定法(DSC)によって得られる融解ピークの補外融解終了温度(Tem)と密度(D)との関係が、Tem≦286D−137、好ましくはTem≦429D−271、より好ましくはTem≦571D−404の関係式を満たすことが望ましい。Temが上記範囲からはずれた場合、フィルムの透明性やシール性を阻害するので好ましくない。
【0016】
更に、本発明で用いるエチレン・α−オレフィン共重合体のJIS−K7210による190℃、荷重2.16kgの条件で測定したメルトフローレート(以下、MFRという)は、フィルムに成形できれば特に制約を受けないが、成膜安定性を勘案すると0.1〜50g/10min、好ましくは0.3〜20g/10minであることが望ましい。
【0017】
2.非晶性アルミノシリケート(成分B)
本発明に使用される非晶性アルミノシリケートは、以下の性状を満たす必要がある。
▲1▼平均粒子径
本発明に使用される非晶性アルミノシリケートの平均粒子径は、0.1〜10μmである。平均粒子径が0.1μm以下では、アンチブロッキング性が十分でなく、10μmを超えるとフィルムの透明性が悪くなるので好ましくない。
【0018】
(2)pH
本発明に使用される非晶性アルミノシリケートの5%固形分の水溶性分散液としたときのpHは、5.0以上7.0未満、好ましくは5.3以上7.0未満、より好ましくは5.5以上7.0未満である。pHがこの範囲からはずれると、フィルムの変色が起こりやすくなり好ましくない。
【0019】
▲3▼屈折率
本発明に使用される非晶性アルミノシリケートの屈折率は、1.48〜1.52である。屈折率がこの範囲からはずれるとフィルムの透明性が悪くなるので好ましくない。
【0020】
本発明の樹脂組成物には、一般に樹脂組成物用として用いられている補助添加成分、例えば、酸化防止剤(中でも、フェノール系およびリン系酸化防止剤が好ましい)、光安定剤、他の無機系、有機系アンチブロッキング剤の併用、スリップ剤、熱安定剤、紫外線吸収剤、中和剤、防曇剤、着色剤、顔料、核剤等を配合することができ、また、防曇剤については、公知のフィルム表面塗布型の防曇剤を塗布することができる。
【0021】
また、フィルムを成形する際の成形性をより良好なものとするために、他のエチレン重合体、例えば高圧法低密度ポリエチレン、直鎖状低密度ポリエチレン、高密度ポリエチレン等を必要に応じ添加することができる。この場合、添加量は、ベースのエチレン−α−オレフィン共重合体の強靭性を実用上損わない範囲として、5〜15重量%が好ましい。
【0022】
本発明の樹脂組成物は、特定のエチレン・α−オレフィン共重合体および特定の非晶性アルミノシリケートをドライブレンド、または溶融混練することにより得られる。
ドライブレンドは、タンブラーミキサー、ヘンシェルミキサーなどの各種ブレンダーが使用される。
溶融混練には、単軸押出機、二軸押出機、バンバリーミキサー、ブラベンダープラストグラフ、熱ロール等の各種ミキサーや混練押出機が用いられる。
【0023】
フィルムの製造方法は、空冷インフレーション成形、空冷2段冷却インフレーション成形、Tダイフィルム成形、水冷インフレーション成形等で好適なフィルムを得ることができる。本発明のフィルムは、単層、もしくは他のフィルム成形可能な任意の基材との複合フィルムにしてもよい。
【0024】
使用される基材としては、紙、セロファン、織物、アルミニウム箔や、ナイロン6、ナイロン66、ナイロン11、ナイロン12等のポリアミド樹脂、ポリエチレンテレフタレート、ポリブチレンテレフタレート等のポリエステル樹脂、ポリエチレン、ポリプロピレン、ポリ−1−ブテン、エチレン・酢酸ビニル共重合体、エチレン・(メタ)アクリル酸(エステル)共重合体、アイオノマー等のポリオレフィン系樹脂、ポリ塩化ビニル、ポリスチレン、ポリビニルアルコール、エチレン・ビニルアルコール共重合体等が挙げられる。
【0025】
本発明のシーラントフィルムと基材との複合フィルムは、ドライラミネーション、ウェットラミネーション、サンドラミネーション、ホットメルトラミネーション等のラミネート法、共押出法、押出ラミネート法など公知の技術、及びこれらの技術の組合せにより製造される。
【0026】
共押出の方法としては、積層数に応じた押出機と通常のフィードブロックタイプ、マルチマニホールドタイプ、マルチスロットタイプの接合・合流部を有する空冷インフレーションフィルム成形、Tダイフィルム成形、水冷インフレーションフィルム成形等で好適なフィルムを得ることができる。
さらに、フィルムに、コロナ放電処理、フレーム処理、延伸処理、液剤塗布処理等の各種処理をおこなってもかまわない。
【0027】
【実施例】
以下に実施例および比較例を記載し、本発明を更に具体的に説明する。実施例および比較例における物性の測定とフィルム物性評価は、以下に示す方法によって実施した。
【0028】
1.物性の測定法
(a)MFR:JIS−K7210(190℃、2.16kg荷重)に準拠した。
【0029】
(b)密度:JIS−K7112に準拠した。
【0030】
(c)示差走査熱量測定法(DSC)による補外融解終了温度(Tem):
熱プレスによって成形した100μmのフィルムから約5mgの試料を秤量し、それをセイコー電子工業(株)製RDC 220 DSC装置にセットし、170℃に昇温してその温度で5分間保持した後、降温速度10℃/分で−10℃まで冷却した。1分間保持した後、昇温速度10℃/分で170℃まで昇温して測定を行った。すなわち、−10℃から170℃に昇温してDSC曲線を得た。JIS−K7121に準拠し、DSC曲線の高温側のベースラインを低温側に延長した線と、融解ピークの高温側の曲線に勾配が最大になる点で引いた接線の交点の温度を補外融解終了温度(Tem)とした。
【0031】
(d)Q値:サイズ排除クロマトグラフィー(Size Exclusion Chromatography:SEC)を用いて、以下に示す測定条件下で測定し、重量平均分子量Mw/数平均分子量MnよりQ値を求めた。単分散ポリスチレンでユニバーサルな検量線を作成し、直鎖のポリスチレンの分子量として計算した。
機種;Waters Model 150C GPC
溶媒;o−ジクロロベンゼン
流速;1ml/分
温度;140℃
測定濃度;2mg/ml
注入量;200μl
カラム;昭和電工(株)製AD80M/S 3本
【0032】
(e)曲げ弾性率;JIS K−7106に準拠して測定した。
【0033】
2.フィルム物性評価方法
(a)HAZE;JIS K7105に準拠した。
【0034】
(b)300g荷重低温ヒートシール温度(低温ヒートシール性):本発明のフィルムをコロナ未処理面が重なるように2枚重ね、東洋精機製熱盤式ヒートシーラーにて、80℃から5℃間隔でシール圧力:2kg/cm2、シール時間;0.5秒でヒートシールし、引張試験機にてヒートシール強度を測定した。ヒートシール強度が300g/15mmに達したときの温度を300g荷重ヒートシール温度とし低温ヒートシール性の目安とした。
【0035】
(c)フィルムの色相;実施例に従って成形したフィルムを40℃、湿度80%の恒温恒湿槽に入れて1ヶ月放置した後のフィルム巻き断面の色相の変化を目視で確認した。
判定基準 ○;色相の変化がない、×;黄変、赤変などフィルムが変色する。
【0036】
3.フィルムの成形法
ポリエチレン系樹脂に非晶性アルミノシリケートを所定量添加して、以下の条件でTダイ成形法にてフィルムを成形し評価に供した。更に、装置に取り付けられたコロナ放電処理機により、フィルム表面の表面張力が44〜45dyne/cmとなるようにコロナ処理を施した。
【0037】
実施例1
(1)成分Aの調製
触媒の調製は、特開昭61−130314号公報に記載された方法で実施した。すなわち、エチレンビス(4,5,6,7−テトラヒドロインデニル)ジルコニウムジクロライド2.0ミリモルに、東洋ストウファー社製メチルアンモキサンを上記錯体に対し1000モル倍加え、トルエンで10リットルに希釈して、触媒溶液を調製し、以下の方法で重合を行った。
内容積1.5リットルの撹拌式オートクレーブ型連続反応器に、エチレンと1−ヘキセンとの混合物を1−ヘキセンの組成が80重量%となるように供給し、反応器内の圧力を1300kg/cm2に保ち、145℃の温度で反応を行った。
反応終了後、MFRが3.5g/10分、密度が0.904g/cm3、示差走査熱量測定法(DSC)による融解ピークの補外融解終了温度(Tem)が103℃であるエチレン・1−ヘキセン共重合体を得た。得られた共重合体に、酸化防止剤としてイルガノックス1076(チバガイギー社製)およびP−EPQ(サンド社製)、スリップ剤としてエルカ酸アミド(日本化成社製)を適量配合し、共重合体組成物を調製した。
【0038】
(2)樹脂組成物の調製
上記で得られた成分Aに、成分Bとして水沢化学(株)製の非晶性アルミノシリケートa(平均粒子径2.95μm、5%サスペンジョンのpH6.0、屈折率1.50)を用い、成分A100重量部に対し成分Bを1.2重量部の割合で配合し、上記の条件でTダイ成形を行いフィルムを成形し評価した。評価の結果は表1に示す通りである。
【0039】
実施例2
成分Aとして、日本ポリケム(株)製LV360(MFR;3.5g/10分、酢酸ビニル含有量11重量%)のエチレン・酢酸ビニル共重合体を用い、成分Bを0.8重量部としたこと以外は実施例1と同様にフィルムを作成し評価した。評価の結果は表1に示す通りである。
【0040】
比較例1
成分Bとして、水沢化学(株)製の非晶性アルミノシリケートb(平均粒子径2.82μm、5%サスペンジョンのpH7.8、屈折率1.47)を用いた以外は実施例1と同様にフィルムを作成し評価した。評価の結果は表1に示す通りである。
【0041】
比較例2
成分Bとして、水沢化学(株)製の非晶性アルミノシリケートJC−30(平均粒子径3.06μm、5%サスペンジョンのpH11.1、屈折率1.50)を用いた以外は実施例1と同様にフィルムを作成し評価した。評価の結果は表1に示す通りである。
【0042】
比較例3
成分Bとして、水沢化学(株)製の非晶性アルミノシリケートJC−30(平均粒子径3.06μm、5%サスペンジョンのpH11.1、屈折率1.50)を用いた以外は実施例2と同様にフィルムを作成し評価した。評価の結果は表1に示す通りである。
【0043】
比較例4
成分Aとして、日本ポリケム(株)製SF240のエチレン・ヘキセン−1共重合体(MFR:2.0g/10分、密度:0.920g/cm3、示差走査熱量測定法(DSC)による融解ピークの補外融解終了温度(Tem):129℃)を用い、成分Bとして、水沢化学(株)製の非晶性アルミノシリケートa(平均粒子径2.95μm、5%サスペンジョンのpH6.0、屈折率1.50)を用い、成分A100重量部に対し成分Bを0.3重量部の割合で配合し、上記の条件でTダイ成形を行いフィルムを成形し評価した。評価結果は表1に示す通りである。
【0044】
【表1】
【0045】
【発明の効果】
本発明の樹脂組成物は、ブロッキング防止に有効な特定の性状を有するアンチブロッキング剤と特定の曲げ弾性率を有するエチレン・α−オレフィン共重合体を組み合わせたポリエチレン系樹脂組成物であり、成膜後の色相の変化がなく、低温シール性、シール強度、ホットタック性、衝撃強度、透明性に優れ、フィルム同士のブロッキング性及び滑り性の良好なフィルムが得られる。[0001]
BACKGROUND OF THE INVENTION
The present invention does not change the hue after film formation, is excellent in low-temperature sealing properties, sealing strength, hot tack properties, impact strength, transparency, blocking properties between films, good sliding properties and The present invention relates to a film obtained from the composition.
[0002]
[Prior art]
Currently, polyethylene resins are used alone or in combination with polyamide resins, polyester resins, polypropylene resins, ethylene / vinyl alcohol copolymer resins, etc. due to their low-temperature sealing properties, heat sealing strength, transparency, flexibility, and impact strength. By being coextruded with a resin or laminated with a stretched base film such as a polyamide film, a polyester film, or a polypropylene film, it is widely used for packaging foods, pharmaceuticals, industrial products and the like. Commonly used polyethylene resins include high pressure method low density polyethylene, high density polyethylene, linear low density polyethylene (hereinafter referred to as LLDPE), ethylene / vinyl acetate copolymer (hereinafter referred to as EVA) and ethylene. -Ethylene / α-olefin copolymers such as acrylic acid copolymers are listed, but ethylene / α-olefin copolymers such as LLDPE and EVA are mainly used in fields where low-temperature sealability and seal strength are required. Used for. Due to the development of high-speed automatic packaging machines in recent years and the demand for stable sealing properties, it has become necessary to impart further low-temperature sealing properties to polyethylene resins. In order to impart further low-temperature sealing properties, the α-olefin content in the ethylene / α-olefin copolymer may be increased to lower the crystallinity of the resin. It becomes the film which became a film, and the blocking property and slipperiness | liquidity of films deteriorate, and practical use becomes difficult. In order to improve this defect, it is necessary to add a large amount of an anti-blocking agent such as an inorganic filler, but due to the interaction between the anti-blocking agent and other additives such as an antioxidant, redness, yellowing, etc. Discoloration tends to occur.
[0003]
[Problems to be solved by the invention]
The present invention does not change the hue after film formation, is excellent in low-temperature sealing properties, sealing strength, hot tack properties, impact strength, transparency, film-to-film blocking properties and good sliding properties and To provide a film.
[0004]
[Means for Solving the Problems]
As a result of diligent investigations to solve the above problems, the present inventors have found that an anti-blocking agent having specific properties effective for discoloration and blocking prevention of the film and an ethylene / α-olefin copolymer having a specific bending elastic modulus. The inventors have found that the object of the invention can be achieved by combining the coalescence, and have completed the present invention. That is, the present invention provides an amorphous property having the following properties (1) to (3) with respect to 100 parts by weight of a polyethylene resin having a flexural modulus measured according to JIS K-7106 of 2500 kg / cm 2 or less. A polyethylene resin composition containing 0.3 to 5 parts by weight of aluminosilicate and a film comprising the same.
(1) Average particle diameter of 0.1 to 10 μm
(2) pH of 5.0 or more and less than 7.0 when a 5% solid content water-soluble dispersion is used (3) Refractive index 1.48 to 1.52
[0005]
BEST MODE FOR CARRYING OUT THE INVENTION
The present invention is described in detail below.
1. Polyethylene resin (component A)
The polyethylene resin used in the present invention is an ethylene homopolymer or an ethylene / α-olefin copolymer. The ethylene / α-olefin copolymer is preferably a copolymer of ethylene and an α-olefin having 4 to 18 carbon atoms. Examples of the α-olefin include butene-1, pentene-1, hexene-1, 4-methyl-1-pentene, octene-1, decene-1, vinyl acetate, (meth) acrylic acid, methyl (meth) acrylate, (Meth) acrylic acid esters such as ethyl (meth) acrylate are used, butene-1, hexene-1, 4-methyl-1-pentene, octene-1, vinyl acetate, (meth) acrylic acid, ( Preferred are methyl (meth) acrylate and ethyl (meth) acrylate. These α-olefins may be used in combination of two or more kinds, or may be blended with two or more kinds of ethylene / α-olefin copolymers.
[0006]
Among the ethylene / α-olefin copolymers of the present invention, as a method for producing LLDPE which is an ethylene / butene-1 copolymer, an ethylene / hexene-1 copolymer, an ethylene / octene-1 copolymer, etc., High pressure radical polymerization method, high pressure ion polymerization method, gas phase method, solution method, slurry method and the like can be mentioned, and high pressure ion polymerization method is preferable. As the catalyst, a transition metal complex catalyst such as a Ziegler catalyst or a metallocene catalyst is used, but a metallocene catalyst is preferably used.
[0007]
Specific methods for producing the ethylene / α-olefin copolymer in the present invention are disclosed in JP-A-58-19309, 59-95292, 60-35005, 60-35006, 60-35007. No. 60-35008, No. 60-35209, No. 61-130314, Japanese Unexamined Patent Publication No. 3-163088, European Patent Application Publication No. 420,436, US Pat. No. 5,055,438. And the methods described in International Publication No. W091 / 04257, etc., that is, metallocene catalyst, metallocene / alumoxane catalyst, or the like, for example, International Publication No. W092 / 07123 Made of a compound that reacts with a metallocene compound and a metallocene catalyst described below to form stable ions Use may be a method of copolymerizing the α- olefin of the main component of ethylene and minor component of the carbon atoms from 4 to 18 and the like.
[0008]
The compound that reacts with the metallocene catalyst and becomes a stable ion is an ionic compound or electrophilic compound formed from an ion pair of a cation and an anion, and reacts with the metallocene compound to become a stable ion. It forms a polymerization active species.
Among these, an ionic compound is represented by the following formula (I).
[Q] m + [Y] m- (m is an integer of 1 or more) (I)
Q in the formula is a cation component of an ionic compound, and examples thereof include a carbonium cation, a tropylium cation, an ammonium cation, an oxonium cation, a sulfonium cation, and a phosphonium cation. Cations and organic metal cations can also be mentioned.
[0009]
These cations are not only cations that can give protons as disclosed in JP-A-1-501950, but also cations that do not give protons. Specific examples of these cations include triphenylcarbonium, diphenylcarbonium, cycloheptatrienium, indenium, triethylammonium, tripropylammonium, tributylammonium, N, N-dimethylammonium, dipropylammonium, dicyclohexylammonium, tri Phenylphosphonium, trimethylphosphonium, tri (dimethylphenyl) phosphonium, tri (methylphenyl) phosphonium, triphenylsulfonium, triphenyloxonium, triethyloxonium, pyrylium, silver ion, gold ion, platinum ion, palladium ion, mercury Ion, ferrocenium ion, etc. are mentioned.
[0010]
Y is an anion component of an ionic compound, which is a component that reacts with a metallocene compound to become a stable anion, and is an organic boron compound anion, an organic aluminum compound anion, an organic gallium compound anion, an organic phosphorus compound anion, an organic Examples include arsenic compound anions, organic antimony compound anions, etc., specifically tetraphenyl boron, tetrakis (3,4,5-trifluorophenyl) boron, tetrakis (3,5-di (trifluoromethyl) phenyl) boron , Tetrakis (3,5- (t-butyl) phenyl) boron, tetrakis (pentafluorophenyl) boron, tetraphenylaluminum, tetrakis (3,4,5-trifluorophenyl) aluminum, tetrakis (3,5-di ( Trifluoromethyl) phenyl Aluminum, tetrakis (3,5-di (t-butyl) phenyl) aluminum, tetrakis (pentafluorophenyl) aluminum, tetraphenylgallium, tetrakis (3,4,5-trifluorophenyl) gallium, tetrakis (3,5- Di (trifluoromethyl) phenyl) gallium, tetrakis (3,5-di (t-butyl) phenyl) gallium, tetrakis (pentafluorophenyl) gallium, tetraphenylphosphorus, tetrakis (pentafluorophenyl) phosphorus, tetraphenylarsenic, Examples include tetrakis (pentafluorophenyl) arsenic, tetraphenylantimony, tetrakis (pentafluorophenyl) antimony, decaborate, undecaborate, carbadodecaborate, decachlorodecaborate and the like.
[0011]
Among the electrophilic compounds, among those known as Lewis acid compounds, they react with metallocene compounds to form stable ions to form polymerization active species, and various metal halide compounds and solids Examples thereof include metal oxides known as acids. Specific examples include magnesium halides and Lewis acidic inorganic compounds.
[0012]
Among ethylene / α-olefin copolymers, copolymer of EVA, ethylene / (meth) acrylic acid copolymer, ethylene / (meth) acrylic acid ester copolymer, etc. and α-olefin having a carbonyl group Examples of the method for producing the coalescence include high-pressure radical polymerization.
[0013]
The flexural modulus of the ethylene / α-olefin copolymer used in the present invention is 2500 kg / cm 2 or less, preferably 1000 kg / cm 2 or less. When the flexural modulus exceeds 2500 kg / cm 2 , the low temperature heat sealability is deteriorated, which is not preferable.
[0014]
The ratio Mw / Mn (Q value) of the weight average molecular weight Mw and the number average molecular weight Mn of the ethylene / α-olefin copolymer of the present invention is 1.5 to 3.0, preferably 1.5 to 2.5. It is desirable to be.
[0015]
Further, the relationship between the extrapolated melting end temperature (Tem) and the density (D) of the melting peak obtained by differential scanning calorimetry (DSC) of the ethylene / α-olefin copolymer is preferably Tm ≦ 286D-137, Preferably satisfies the relational expression of Tem ≦ 429D-271, more preferably Tem ≦ 571D-404. When Tem deviates from the above range, the transparency and sealing properties of the film are impaired, which is not preferable.
[0016]
Further, the melt flow rate (hereinafter referred to as MFR) of the ethylene / α-olefin copolymer used in the present invention measured at 190 ° C. and a load of 2.16 kg according to JIS-K7210 is particularly limited if it can be formed into a film. However, considering film formation stability, it is desirably 0.1 to 50 g / 10 min, preferably 0.3 to 20 g / 10 min.
[0017]
2. Amorphous aluminosilicate (component B)
The amorphous aluminosilicate used in the present invention must satisfy the following properties.
(1) Average particle diameter The average particle diameter of the amorphous aluminosilicate used in the present invention is 0.1 to 10 μm. When the average particle size is 0.1 μm or less, the anti-blocking property is not sufficient, and when it exceeds 10 μm, the transparency of the film is deteriorated.
[0018]
(2) pH
The pH of the amorphous aluminosilicate used in the present invention as a 5% solids aqueous dispersion is 5.0 or more and less than 7.0 , preferably 5.3 or more and less than 7.0 , more preferably. Is 5.5 or more and less than 7.0. If the pH deviates from this range, film discoloration tends to occur, which is not preferable.
[0019]
(3) Refractive index The refractive index of the amorphous aluminosilicate used in the present invention is 1.48 to 1.52. If the refractive index is out of this range, the transparency of the film deteriorates, which is not preferable.
[0020]
In the resin composition of the present invention, auxiliary additives generally used for resin compositions, such as antioxidants (among them, phenol-based and phosphorus-based antioxidants are preferred), light stabilizers, other inorganics System, combined use of organic anti-blocking agent, slip agent, heat stabilizer, UV absorber, neutralizer, antifogging agent, colorant, pigment, nucleating agent, etc. Can be applied with a known film surface coating type antifogging agent.
[0021]
In addition, other ethylene polymers such as high-pressure low-density polyethylene, linear low-density polyethylene, high-density polyethylene, etc. are added as necessary in order to improve the moldability when forming the film. be able to. In this case, the addition amount is preferably 5 to 15% by weight as long as the toughness of the base ethylene-α-olefin copolymer is not practically impaired.
[0022]
The resin composition of the present invention can be obtained by dry blending or melt-kneading a specific ethylene / α-olefin copolymer and a specific amorphous aluminosilicate.
Various blenders such as a tumbler mixer and a Henschel mixer are used for dry blending.
For melt kneading, various mixers and kneading extruders such as a single screw extruder, a twin screw extruder, a Banbury mixer, a Brabender plastograph, and a hot roll are used.
[0023]
As a film production method, a suitable film can be obtained by air-cooled inflation molding, air-cooled two-stage cooling inflation molding, T-die film molding, water-cooled inflation molding, or the like. The film of the present invention may be a single layer or a composite film with any other substrate that can be formed into a film.
[0024]
Base materials used include paper, cellophane, fabric, aluminum foil, polyamide resins such as nylon 6, nylon 66, nylon 11 and nylon 12, polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyethylene, polypropylene, poly -1-butene, ethylene / vinyl acetate copolymer, ethylene / (meth) acrylic acid (ester) copolymer, polyolefin resin such as ionomer, polyvinyl chloride, polystyrene, polyvinyl alcohol, ethylene / vinyl alcohol copolymer Etc.
[0025]
The composite film of the sealant film and the substrate of the present invention is obtained by a known technique such as a lamination method such as dry lamination, wet lamination, sand lamination, hot melt lamination, co-extrusion method, extrusion lamination method, and a combination of these techniques. Manufactured.
[0026]
Co-extrusion methods include extruders according to the number of layers and normal feed block type, multi-manifold type, multi-slot type air-cooled inflation film molding, T-die film molding, water-cooled inflation film molding, etc. A suitable film can be obtained.
Furthermore, the film may be subjected to various treatments such as corona discharge treatment, frame treatment, stretching treatment, and liquid coating treatment.
[0027]
【Example】
Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples. Measurement of physical properties and evaluation of film physical properties in Examples and Comparative Examples were performed by the following methods.
[0028]
1. Measurement method of physical properties (a) MFR: compliant with JIS-K7210 (190 ° C., 2.16 kg load).
[0029]
(B) Density: Conforms to JIS-K7112.
[0030]
(C) Extrapolated melting end temperature (Tem) by differential scanning calorimetry (DSC):
A sample of about 5 mg was weighed from a 100 μm film formed by hot pressing, set in an RDC 220 DSC device manufactured by Seiko Denshi Kogyo Co., Ltd., heated to 170 ° C. and held at that temperature for 5 minutes, It cooled to -10 degreeC with the temperature-fall rate of 10 degree-C / min. After holding for 1 minute, the temperature was raised to 170 ° C. at a temperature raising rate of 10 ° C./min, and the measurement was performed. That is, the DSC curve was obtained by raising the temperature from −10 ° C. to 170 ° C. In accordance with JIS-K7121, extrapolate the temperature at the intersection of the line where the base line on the high temperature side of the DSC curve is extended to the low temperature side and the tangent line drawn at the point where the gradient is maximum on the high temperature side curve of the melting peak. The end temperature (Tem) was used.
[0031]
(D) Q value: Measured under the following measurement conditions using size exclusion chromatography (SEC), and the Q value was determined from the weight average molecular weight Mw / number average molecular weight Mn. A universal calibration curve was created with monodisperse polystyrene and calculated as the molecular weight of linear polystyrene.
Model: Waters Model 150C GPC
Solvent; o-dichlorobenzene flow rate; 1 ml / min temperature; 140 ° C
Measurement concentration: 2 mg / ml
Injection volume: 200 μl
Column: 3 AD80M / S manufactured by Showa Denko KK
(E) Flexural modulus: measured in accordance with JIS K-7106.
[0033]
2. Film physical property evaluation method (a) HAZE; conformed to JIS K7105.
[0034]
(B) 300 g load low temperature heat seal temperature (low temperature heat seal property): Two sheets of the film of the present invention are stacked so that the untreated corona surface overlaps, and is heated at 80 ° C. to 5 ° C. with a Toyo Seiki hot plate heat sealer. The sealing pressure was 2 kg / cm 2 , the sealing time was 0.5 seconds, and the heat sealing strength was measured with a tensile tester. The temperature at which the heat seal strength reached 300 g / 15 mm was taken as the standard for low temperature heat sealability with a 300 g load heat seal temperature.
[0035]
(C) Hue of film: The film formed according to the example was placed in a constant temperature and humidity chamber of 40 ° C. and 80% humidity and left for one month, and the change in hue of the film winding cross section was visually confirmed.
Judgment criteria ○: No change in hue, ×: Film discoloration such as yellowing, redning, etc.
[0036]
3. Film Forming Method A predetermined amount of amorphous aluminosilicate was added to a polyethylene-based resin, and a film was formed by the T-die molding method under the following conditions for evaluation. Furthermore, corona treatment was performed by a corona discharge treatment machine attached to the apparatus so that the surface tension of the film surface was 44 to 45 dyne / cm.
[0037]
Example 1
(1) Preparation of component A The catalyst was prepared by the method described in JP-A-61-130314. That is, to 2.0 mmol of ethylenebis (4,5,6,7-tetrahydroindenyl) zirconium dichloride, 1000 mol times of methylammoxane manufactured by Toyo Stofer Co. is added to the above complex, and diluted to 10 liters with toluene. Then, a catalyst solution was prepared and polymerized by the following method.
A mixture of ethylene and 1-hexene was supplied to a stirred autoclave type continuous reactor having an internal volume of 1.5 liter so that the composition of 1-hexene was 80% by weight, and the pressure in the reactor was 1300 kg / cm. The reaction was carried out at a temperature of 145 ° C.
After completion of the reaction, ethylene · 1 having an MFR of 3.5 g / 10 min, a density of 0.904 g / cm 3 , and a melting peak extrapolated melting temperature (Tem) by differential scanning calorimetry (DSC) of 103 ° C. -A hexene copolymer was obtained. Irganox 1076 (manufactured by Ciba Geigy) and P-EPQ (manufactured by Sanda) as antioxidants and an appropriate amount of erucic acid amide (manufactured by Nippon Kasei Co., Ltd.) as a slip agent are blended in the obtained copolymer. A composition was prepared.
[0038]
(2) Preparation of Resin Composition Component A obtained above was mixed with Component A as amorphous B amorphous aluminosilicate a (average particle size 2.95 μm, 5% suspension pH 6.0, refraction The component B was blended at a ratio of 1.2 parts by weight with respect to 100 parts by weight of the component A, T-die molding was performed under the above conditions, and a film was molded and evaluated. The results of evaluation are as shown in Table 1.
[0039]
Example 2
As component A, an ethylene / vinyl acetate copolymer of LV360 (MFR; 3.5 g / 10 minutes, vinyl acetate content 11% by weight) manufactured by Nippon Polychem Co., Ltd. was used, and component B was adjusted to 0.8 part by weight. Except for this, a film was prepared and evaluated in the same manner as in Example 1. The results of evaluation are as shown in Table 1.
[0040]
Comparative Example 1
As component B, amorphous aluminosilicate b (average particle size 2.82 μm, pH 7.8 of 5% suspension, refractive index 1.47) manufactured by Mizusawa Chemical Co., Ltd. was used. Films were created and evaluated. The results of evaluation are as shown in Table 1.
[0041]
Comparative Example 2
As Component B, Example 1 was used except that amorphous aluminosilicate JC-30 (average particle size: 3.06 μm, 5% suspension pH: 11.1, refractive index: 1.50) manufactured by Mizusawa Chemical Co., Ltd. was used. Similarly, a film was prepared and evaluated. The results of evaluation are as shown in Table 1.
[0042]
Comparative Example 3
As Component B, Example 2 was used except that amorphous aluminosilicate JC-30 (average particle diameter 3.06 μm, pH 11.1 of 5% suspension, refractive index 1.50) manufactured by Mizusawa Chemical Co., Ltd. was used. Similarly, a film was prepared and evaluated. The results of evaluation are as shown in Table 1.
[0043]
Comparative Example 4
As component A, SF240 ethylene hexene-1 copolymer (MFR: 2.0 g / 10 min, density: 0.920 g / cm 3 , manufactured by Nippon Polychem Co., Ltd., melting peak by differential scanning calorimetry (DSC) As the component B, amorphous aluminosilicate a (average particle size: 2.95 μm, 5% suspension pH: 6.0, refraction) The component B was blended at a ratio of 0.3 part by weight with respect to 100 parts by weight of the component A, T-die molding was performed under the above conditions, and a film was molded and evaluated. The evaluation results are as shown in Table 1.
[0044]
[Table 1]
[0045]
【The invention's effect】
The resin composition of the present invention is a polyethylene-based resin composition in which an anti-blocking agent having specific properties effective for blocking prevention and an ethylene / α-olefin copolymer having a specific bending elastic modulus are combined. There is no subsequent change in hue, and a film having excellent low-temperature sealing properties, sealing strength, hot tack properties, impact strength, transparency, and good blocking properties and slipperiness between films can be obtained.
Claims (5)
(1)平均粒子径0.1〜10μm
(2)5%固形分の水溶性分散液としたときのpHが5.0以上7.0未満
(3)屈折率1.48〜1.52Amorphous aluminosilicate 0.3 to 5 having the following properties (1) to (3) with respect to 100 parts by weight of a polyethylene-based resin having a flexural modulus of 2500 kg / cm 2 or less measured in accordance with JIS K-7106. A polyethylene resin composition comprising parts by weight.
(1) Average particle diameter of 0.1 to 10 μm
(2) pH of 5.0 or more and less than 7.0 when a 5% solid content water-soluble dispersion is used (3) Refractive index 1.48 to 1.52
・重量平均分子量Mwと数平均分子量Mnの比、Mw/Mnが1.5〜3.0The polyethylene resin composition according to claim 1 or 2, wherein the polyethylene resin satisfies the following properties.
-Ratio of weight average molecular weight Mw and number average molecular weight Mn, Mw / Mn is 1.5 to 3.0
(イ)示差走査熱量測定法(DSC)によって得られる融解ピークの補外融解終了温度(Tem)と密度(D)との関係が、以下の関係式を満たす。
Tem≦286D−137
(但し、補外融解終了温度(Tem)とは、JIS K−7121に準拠し、厚さ100μmの試料フィルムに対して−10℃から170℃に昇温して得られるDSC曲線の高温側のベースラインを低温側に延長した線と、融解ピークの高温側の曲線に勾配が最大になる点で引いた接線との交点の温度を意味する。)The polyethylene resin composition according to any one of claims 1 to 3 , wherein the polyethylene resin satisfies the following properties (a).
(A) The relationship between the extrapolated melting end temperature (Tem) and the density (D) of the melting peak obtained by the differential scanning calorimetry (DSC) satisfies the following relational expression.
Tem ≦ 286D-137
(However, the extrapolation melting end temperature (Tem) is based on JIS K-7121, and is measured on the high temperature side of the DSC curve obtained by raising the temperature of a sample film of 100 μm from −10 ° C. to 170 ° C. (It means the temperature at the intersection of the line extending the base line to the low temperature side and the tangent line drawn at the point where the slope is maximum on the high temperature side curve of the melting peak.)
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