JP3838740B2 - Resin molding equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resin molding apparatus, and more particularly to a resin molding apparatus using a release film.
[0002]
[Prior art]
A resin molding apparatus using a release film is an apparatus that performs resin molding by covering a resin molding portion such as a cavity inner surface of a mold with a synthetic resin film having a mold and a resin peelability. FIG. 3 is a cross-sectional view showing a state where the molded product 14 is clamped by the upper mold 12a and the lower mold 12b through the release film 10 and resin molding is performed. The figure shows a state before filling the cavity 16 with resin in the left half of the center line A, and a state in which the cavity 18 is filled with resin 18 in the right half.
[0003]
FIG. 4 shows the arrangement of the molded product 14 and the arrangement of the release film 10 on the lower mold 12b. The release film 10 is disposed so as to cover the cavity recess 16a that is a resin molding portion, and the resin 18 is prevented from adhering to the inner wall surface of the cavity 16 when the resin 18 is pumped from the pot 20 toward the cavity 16. can do.
[0004]
In order to place the release film 10 at a predetermined position on the clamping surface of the mold, an air suction hole 22 that opens on the clamping surface around the cavity recess 16a is provided, and air is sucked from the air suction hole 22 to release the release film. 10 is held so as not to be displaced on the clamping surface. Reference numeral 24 denotes a cavity suction hole that opens in a slit shape at the peripheral edge of the bottom surface of the cavity recess 16a. The cavity suction hole 24 holds the release film 10 on the clamp surface and then sucks air in the cavity 16 to suck and support the release film 10 along the inner wall surface of the cavity 16.
[0005]
[Problems to be solved by the invention]
By the way, the molded product 14 such as a lead frame is positioned and set on the release film 10 disposed on the lower mold 12b after the release film 10 is sucked and supported on the clamping surface of the mold. Positioning of the molded product 14 is performed by inserting guide pins 28 into guide holes 26 provided on the side edge of the molded product 14 as shown in FIG.
[0006]
However, as described above, since the release film 10 is made of a flexible material so as to be easily adsorbed and supported along the inner surface of the cavity recess 16a by air suction, the molded product 14 is interposed via the release film 10. Is clamped, the release film 10 is compressed to about 20% of the original film thickness.
When the release film 10 is greatly compressed in this way, the excess of the release film 10 is moved, and although the guide film 28 is supported by the guide pin 28, the molded product 14 is displaced from a predetermined position. .
[0007]
If the molded product 14 is displaced from a predetermined position, a normal resin mold cannot be formed, which causes a defect.
The present invention is a resin molding apparatus that uses such a release film, and eliminates the fact that the molded product is displaced due to compression of the release film during clamping, making it impossible to form a regular resin mold. It is an object of the present invention to provide a resin molding apparatus that can be used.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the present invention comprises the following arrangement.
That is, the resin molding part of the mold is covered with a release film that can be easily peeled off from the mold and the mold resin, and the molded product is formed by the guide hole provided in the molded product and the guide pin provided in the lower mold. In a resin molding apparatus that aligns and clamps the molded product with the upper mold and the lower mold and fills the cavity with resin and molds the resin, the clamp surfaces of the upper mold and the lower mold are covered with the release film. And within the range in which the molded product is disposed, a pressing pin that clamps the molded product in the thickness direction is disposed on each of the upper mold and the lower mold with the end surfaces facing each other , and the upper mold As for the presser pin to be arranged on the presser pin, the tip of the presser pin is urged so as to protrude from the clamp surface by the thickness of the release film or more, and the presser pin to be placed on the lower mold For, provided by protruding an end face from the clamping surface of the lower mold, the via the release film at the time of mold clamping before the molded article is clamped, it is provided on the upper and lower molds on the surface of the object to be molded article The end surface of the pressing pin thus brought into contact is pressed between the end surfaces of the pressing pin, and then the release film is compressed to clamp the molded product .
Further, the end surfaces of the pressing pins provided on the upper mold and the lower mold are formed as flat surfaces, and the end surfaces of the pressing pins mounted on the upper mold have a smaller diameter than the end surfaces of the pressing pins mounted on the lower mold. It is characterized by being formed .
Further, a pressing pin provided in the upper mold is mounted in a pin mounting hole provided in the upper mold , and a spring is interposed between the inner end face of the adjustment screw mounted by screwing into the pin mounting hole. There, characterized in that it is supported urges mounted.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described.
FIG. 1 is a cross-sectional view showing characteristic components in a resin molding apparatus according to the present invention. In the resin mold apparatus of the present embodiment, when the molded product 14 is clamped via the release film 10, the molded product 14 is clamped by a mold to prevent the molded product 14 from being displaced. It is characterized in that the product 14 is sandwiched and supported by the pressing pin 30a provided on the upper die 12a and the holding pin 30b provided on the lower die 12b in the thickness direction.
[0010]
The pressing pin 30a disposed on the upper mold 12a is provided with a spring 32 disposed on the back, and is urged and mounted in a direction in which the tip of the pin protrudes from the clamp surface. The presser pin 30a is formed with a slightly thicker diameter from the narrower tip, a thicker base, and a step in the middle, and the inner shape of the pin mounting hole 34 into which the presser pin 30a is inserted. Also, a step corresponding to these steps is formed to prevent the pressing pin 30a from coming off from the pin mounting hole 34.
[0011]
Since the pressing pin 30a is set so as to press the molded product 14 before the molded product 14 is clamped via the release film 10, the amount of protrusion from the clamping surface at the tip of the pressing pin 30a is determined by the release film 10. It is better to set it larger than the thickness before compression. As a result, the end surface of the pressing pin 30a can be brought into contact with the product 14 before the release film 10 air-adsorbed on the upper mold 12a contacts the surface of the product 14.
[0012]
The upper inner surface of the pin mounting hole 34 is a female screw, and the adjustment screw 36 is screwed together, and the spring 32 is elastically mounted between the adjustment screw 36 and the end surface of the pressing pin 30a. The adjusting screw 36 moves forward and backward in the pin mounting hole 34 to adjust the urging force of the spring 32, and appropriately adjusts the pressing force of the product 14 by the pressing pins 30a and 30b.
[0013]
The holding pin 30b provided on the lower die 12b is arranged with its end face slightly protruding from the clamping surface of the lower die 12b at a position facing the holding pin 30a of the upper die 12a. The protruding amount of the pressing pin 30b may be set as appropriate, but the positioning is performed by pressing the molded product 14 while the molded product 14 is placed on the release film 10, so that the dimension is approximately the same as the thickness of the release film 10. It is good to do. Of course, a configuration may be adopted in which a protrusion is formed on the clamp surface of the lower mold 12b without separately providing the pressing pin 30b. Alternatively, the pressing pin 30b may be a screw, and the pressing pin 30b may be attached to the screw hole to adjust the protruding amount of the pressing pin 30b.
[0014]
In the embodiment, the diameter of the end surface where the pressing pin 30a of the upper mold 12a abuts on the molded product 14 is smaller than the diameter of the end surface where the pressing pin of the lower mold 12b contacts the molded product 14 (about 1 mm). However, this is because the pressing force of the pressing pin 30a is concentrated on the molded product 14. The diameter dimension of the pressing pin 30b of the lower mold 12b may be made larger than the diameter dimension of the pressing pin 30a so that the pressing pin 30a of the upper mold 12a and the pressing pin 30b of the lower mold 12b can be securely clamped.
[0015]
As shown in FIG. 1, the holding pins 30 a and 30 b are arranged in a portion where the molded product 14 is not covered with the release film 10 when the molded product 14 is set in a mold. When the molded article 14 is a lead frame, the side edge portion is exposed, and a guide hole 26 is disposed on the side edge portion so that the guide pin 28 is inserted. The pressing pins 30a and 30b are also arranged on the side edge of the lead frame.
[0016]
FIG. 2 shows the arrangement positions of the guide pins 28 and the pressing pins 30b in the lower mold 12b. This mold is a mold for resin molding in which two lead frames are arranged with the pot 20 in between. Both the pressing pin 30 b and the guide pin 28 are disposed on the outer edge portion of the molded product 14. The guide pin 28 is arranged at three places on one outer edge, and the pressing pin 30b is arranged at two places.
[0017]
Hereinafter, an operation of preventing the misalignment of the molded product 14 by the pressing pins 30a and 30b in the resin mold of the above embodiment will be described.
First, the release film 10 is supplied to the clamp surfaces of the upper mold 12a and the lower mold 12b in the mold open state, and the release film 10 is air adsorbed on each clamp surface, and then the lead frame is placed on the release film 10 of the lower mold 12b. The molded product 14 such as is supplied and set. In the lead frame, guide pins 28 are slid into the guide holes 26 and positioned at predetermined positions.
[0018]
Next, the molded product 14 is clamped. As described above, since the tip of the pressing pin 30a provided on the upper mold 12a protrudes from the clamp surface by the urging force of the spring 34, the upper mold 12a and the lower mold 12b. First, the end surface of the pressing pin 30a comes into contact with the upper surface of the molded product 14, and the molded product 14 is sandwiched between the end surface of the pressing pin 30a and the end surface of the pressing pin 30b. The The distance between the upper mold 12a and the lower mold 12b is further narrowed by the mold clamping operation. At this time, the holding pin 30a is relatively relatively clamped in the thickness direction by always urging the spring 32 with the urging force of the spring 32. It is pushed into the pin mounting hole 34.
[0019]
When clamping the molded product 14, the release film 10 that is air adsorbed on the upper mold 12 a comes into contact with the upper surface of the molded product 14, and the release film 10 is compressed and clamped gradually by the clamping force. Since the molded product 14 is supported by pressing the side edges of the pressing pins 30a and 30b, the positional shift that occurs when the release film 10 is compressed is prevented and the molded product 14 is clamped at a proper position. Can be supported. The prevention of the positional deviation of the molded product 14 is based on the pressing force that holds the molded product 14 by the pressing pins 30a and 30b. This pressing force may be set to an appropriate pressing force that prevents the molded product 14 from being displaced by adjusting the biasing force of the spring 32 with the adjusting screw 36.
[0020]
Thus, even when the release film 10 is greatly compressed when the product 14 is clamped via the release film 10, it is possible to prevent the product 14 from being displaced, and a reliable resin mold can be realized. Thus, it becomes possible to produce a high-quality resin mold product without variation.
[0021]
In the above embodiment, the pressing pin 30a is movably supported on the upper mold 12a. However, the pressing pin 30b installed on the lower mold 12b may be movable and the pressing pin 30a installed on the upper mold 12a may be fixed. In addition, the pressing pins 30a and 30b of the upper mold 12a and the lower mold 12b may be movable. Moreover, in the said embodiment, although the pressing pin 30a was urged | supported and supported by the spring 32, the means to urge | bias with air pressure etc. other than a spring may be used.
[0022]
Further, it is possible to provide driving means such as an air cylinder as urging means when the pressing pins 30a and 30b are movable pins. When the driving means such as an air cylinder is positively provided, the operation of clamping the molded article 14 with the pressing pin in conjunction with the clamping operation is controlled, and after the molded article 14 is completely clamped, the driving means It is also possible to perform control such as releasing the urging force caused by.
[0023]
【The invention's effect】
According to the resin mold apparatus according to the present invention, as described above, when clamping the molded product through the release film, the molded product is prevented from being displaced from the position where the molded product is positioned and set. It is possible to produce a highly accurate resin mold, and it is possible to obtain a resin resin product having a good quality without variation.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a configuration of a pressing pin in a resin molding apparatus according to the present invention.
FIG. 2 is a plan view showing an arrangement position of a pressing pin in a lower mold.
FIG. 3 is a cross-sectional view of a resin molding apparatus using a release film.
FIG. 4 is an explanatory view showing an arrangement of release films in a lower mold.
[Explanation of symbols]
10 Release film 12a Upper mold 12b Lower mold 14 Molded product 16 Cavity 16a Cavity recess 18 Resin 26 Guide hole 28 Guide pin 30a, 30b Holding pin 32 Spring 34 Pin mounting hole 36 Adjustment screw

Claims (3)

The resin molding part of the mold is covered with a release film that can be easily peeled off from the mold and the mold resin, and the molded product is aligned by the guide hole provided in the molded product and the guide pin provided in the lower mold. In the resin mold apparatus that clamps the molded product with the upper mold and the lower mold, fills the resin in the cavity, and resin molds,
The upper die and the lower die are clamped to clamp the molded product in the thickness direction within the range in which the molded product is arranged without being covered by the release film on the clamp surfaces of the upper die and the lower die. Are arranged with their end faces facing each other ,
For the pressing pin to be placed on the upper mold, the tip of the pressing pin is urged so as to protrude from the clamp surface more than the thickness of the release film,
For the pressing pin to be arranged in the lower mold, the end face is provided to protrude from the clamp surface of the lower mold,
Before the molded product is clamped via the release film during mold clamping, the end surfaces of the pressing pins provided on the upper mold and the lower mold are brought into contact with the surface of the molded product so that the molded product is A resin molding apparatus, wherein the pressing pin is clamped between end faces, and then the release film is compressed to clamp the product to be molded . The end surfaces of the pressing pins provided on the upper mold and the lower mold are formed as flat surfaces, and the end surfaces of the pressing pins mounted on the upper mold are formed to have a smaller diameter than the end surfaces of the pressing pins mounted on the lower mold. resin molding apparatus according to claim 1, characterized in that it is. The holding pin provided on the upper mold is mounted in the pin mounting hole provided in the upper mold , and a spring is mounted between the inner end face of the adjusting screw mounted by screwing into the pin mounting hole. The resin mold apparatus according to claim 1 , wherein the resin mold apparatus is biased and supported.

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