JP3824744B2 - Cable for high voltage electronics - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cable for high voltage electronic equipment useful as a cable for a CT scanner device or an X-ray device.
[0002]
[Prior art]
In recent years, as a cable used for a DC high voltage circuit of a high voltage electronic device such as a CT scanner device or an X-ray device, a fluororesin insulation coating having a thickness of about 0.3 to 0.4 mm on a conductor 1 as shown in FIG. 2 of the low-voltage insulated wire core 3 formed by extrusion coating 2 and 2 wires of the bare conductor 4 are twisted, and a semiconductive tape is wound around the twisted wire core portion 5 so that the inner semiconductive layer 6 is wound. Furthermore, a high voltage insulator 7 made of an insulating rubber such as EP rubber having a thickness of about 5 to 6 mm, and an external semiconductive layer 8 formed by winding a nylon semiconductive tape are formed thereon. A shield layer 9 and a sheath 10 are sequentially formed so that the finished outer diameter of the entire cable is about 20 mm. The diameter is smaller than that of a conventional cable of this type, and the capacitance is reduced. It is attracting attention because it can.
[0003]
[Problems to be solved by the invention]
However, in such a cable, there is a problem in that corona is easily generated at the time of pressure increase because the high-voltage insulator 7 and the external semiconductive layer 8 are poorly adhered, and the captured image is disturbed.
[0004]
In general, in order to reduce the corona of the cable, it is conceivable to form the outer semiconductive layer by extruding a semiconductive material to improve the adhesion to the high voltage insulator 7. When the conductive material is formed by extrusion, there is a problem that the outer semiconductive layer is thick and the outer diameter of the cable is increased.
[0005]
The present invention has been made in response to such a conventional situation, and an object thereof is to provide a cable for high-voltage electronic equipment with improved corona resistance without increasing the outer diameter of the cable. .
[0006]
[Means for Solving the Problems]
The cable for high voltage electronic equipment according to the first invention of the present application is a cable for high voltage electronic equipment in which an inner semiconductive layer, a high voltage insulator, an external semiconductive layer, a shielding layer, and a sheath are provided in this order on the outer periphery of the core. The outer semiconductive layer is formed by winding a semiconductive topping tape formed by rubberizing semiconductive butyl rubber on a semiconductive tape base material, with the rubberized layer side facing the high voltage insulator side, and heat treatment. It is characterized by being adhered to the high-voltage insulator .
[0007]
The cable for a high voltage electronic device according to the second invention of the present application is a high voltage electronic device in which an inner semiconductive layer, a high voltage insulator, an external semiconductive layer, a shielding layer, and a sheath are sequentially provided on the outer periphery of the wire core. In the cable for use, the external semiconductive layer is composed of a semiconductive coating layer and a semiconductive tape wound around the coating layer.
[0008]
In the cable for high voltage electronic equipment according to the first invention of the present application, the outer semiconductive layer is made of a tape, so that the outer diameter of the cable is not increased, and the tape is heat-treated. As a result, the adhesion to the high-voltage insulator is also improved, so that the corona resistance is improved and the generation of corona is suppressed.
[0009]
Also, in the cable for high voltage electronic equipment according to the second invention of the present application, the external semiconductive layer is composed of a semiconductive paint coating layer and a semiconductive tape attached on the coating layer. Therefore, the diameter of the cable does not increase as in the case where the outer semiconductive layer is formed by extrusion coating, and the semiconductive tape and the high voltage insulator are adhered by applying the semiconductive paint. Therefore, the corona resistance is improved and the generation of corona is suppressed.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0011]
FIG. 1 is a cross-sectional view showing an example of a cable for high-voltage electronic equipment according to the present invention.
[0012]
In FIG. 1, reference numeral 11 denotes a wire core portion. The wire core portion 11 includes two strips of a low-pressure insulating wire core 14 in which a fluororesin 13 is coated on a conductor 12 and an outer diameter of the low-voltage insulating wire core 14. Two strips of bare conductor 15 having the same diameter or smaller diameter are twisted together. In addition, although illustration is abbreviate | omitted, the wire core part 11 may also be set as the structure which twisted together the 1 or 2 line | wire of the semiconductive wire core which provided the semiconductive wire core which provided two lines of the low voltage | pressure insulated wire core on the conductor. Good.
[0013]
An inner semiconductive layer 16 having a thickness of about 0.4 mm is provided on the outer periphery of the wire core 11 by winding a polyethylene terephthalate semiconductive tape, and further, EP rubber (ethylene propylene rubber) is provided thereon. The high-pressure insulator 17 is provided by extruding insulating rubber / plastic. The internal semiconductive layer 16 may be formed by extruding semiconductive rubber / plastic such as semiconductive EP rubber.
[0014]
An external semiconductive layer 18 made of a semiconductive topping tape is formed on the high voltage insulator 17 by the following method.
[0015]
That is, for example, a semiconductive topping tape obtained by rubberizing a semiconductive butyl rubber to a thickness of about 0.15 mm on a tape base material made of nylon having a thickness of about 0.1 mm, and the rubberized layer side being a high voltage insulator. The outer semiconducting layer 18 is formed by wrapping toward the 17 side and performing a heat treatment, for example, holding in a vacuum atmosphere at a temperature of 60 ° C. for one day or more.
[0016]
On the external semiconductive layer 18, a shielding layer 19 made of a soft copper wire braid and a plastic sheath 20 made of a soft vinyl chloride resin are further provided in this order.
[0017]
In the cable for high voltage electronic equipment configured as described above, the semiconductive topping tape wound around the high voltage insulator 17 is in close contact with the high voltage insulator 17 by heat treatment. Although the outer diameter of the cable is slightly larger than the conventional cable for high-voltage electronic equipment in which the outer semiconductive layer is made of nylon-based semiconductive tape, the extent is when the outer semiconductive layer is formed by extrusion coating On the other hand, the corona resistance is greatly improved, and corona resistance comparable to that obtained by forming the outer semiconductive layer by extrusion coating can be obtained.
[0018]
In the present invention, the external semiconductive layer may be constituted by a combination of a conventional semiconductive tape and a semiconductive paint.
[0019]
That is, as shown in FIG. 2, a semiconductive paint 21 such as conductive graphite ink for a soft substrate is applied on the high voltage insulator 17 to a thickness of about 0.1 mm, and a nylon semi-conductive coating is applied on the applied layer. It may be formed by winding a conventional semiconductive tape 22 such as a conductive tape. By applying the semiconductive paint 21, the adhesion of the semiconductive tape 22 to the high voltage insulator 17 is improved, and the generation of corona can be prevented. In addition, the cable outer diameter is only increased by the thickness of the coating applied, and the increase in the cable diameter can be suppressed. In FIG. 2, the same reference numerals are given to portions common to FIG. 1.
[0020]
Thus, since the cable for high voltage electronic equipment of the present invention can improve the corona resistance without impairing the diameter reduction of the cable, the high voltage electronic equipment such as a CT scanner device or an X-ray device can be used. It is very useful as a DC high voltage cable.
[0021]
【The invention's effect】
As described above, according to the cable for high voltage electronic equipment of the present invention, the outer semiconductive layer is substantially composed of a tape, so that the outer diameter of the cable does not increase so much, Since the adhesion between the high voltage insulator and the external semiconductive layer is excellent, the corona resistance is good and the generation of corona is greatly reduced.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of a cable for high-voltage electronic equipment according to the present invention.
FIG. 2 is a cross-sectional view showing another example of a cable for high-voltage electronic equipment according to the present invention.
FIG. 3 is a cross-sectional view showing an example of a conventional cable for high-voltage electronic equipment.
[Explanation of symbols]
11 ......... Wire core 16 ......... Internal semiconductive layer 17 ......... High voltage insulator 18 ......... External semiconductive layer 19 ......... Shielding layer 20 ......... Plastic sheath 21 ......... Semiconductive paint 22 ... Semiconductive tape

Claims (2)

In the cable for high-voltage electronic equipment in which the inner semiconductive layer, the high voltage insulator, the outer semiconductive layer, the shielding layer, and the sheath are provided in this order on the outer periphery of the wire core,
The external semiconductive layer is formed by wrapping a semiconductive topping tape formed by rubberizing semiconductive butyl rubber on a semiconductive tape base material, with the rubberized layer side facing the high-voltage insulator side, and by heat treatment. A cable for high voltage electronic equipment, characterized in that it is in close contact with a high voltage insulator . In the cable for high-voltage electronic equipment in which the inner semiconductive layer, the high voltage insulator, the outer semiconductive layer, the shielding layer, and the sheath are provided in this order on the outer periphery of the wire core,
The external semiconductive layer is composed of a semiconductive paint coating layer and a semiconductive tape wound around the coating layer.

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