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JP3819664B2 - Optical coupling element - Google Patents

Optical coupling element Download PDF

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Publication number
JP3819664B2
JP3819664B2 JP2000063953A JP2000063953A JP3819664B2 JP 3819664 B2 JP3819664 B2 JP 3819664B2 JP 2000063953 A JP2000063953 A JP 2000063953A JP 2000063953 A JP2000063953 A JP 2000063953A JP 3819664 B2 JP3819664 B2 JP 3819664B2
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Prior art keywords
wire
light receiving
light
side lead
optical coupling
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JP2001250978A (en
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尚記 佐田
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Sharp Corp
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Sharp Corp
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、受光素子と発光素子とからなる光結合素子に関するものである。
【０００２】
【従来の技術】
従来の光結合素子は、図８に示すように、発光素子１０１と、この発光素子１０１がダイボンドおよびワイヤボンドされた２本の発光側リード端子１０２ａ，１０２ｂと、受光素子１０３と、この受光素子１０３がダイボンドおよびワイヤボンドされた２本の受光側リード端子１０４ａ，１０４ｂと、発光素子１０１の全体を被覆する透光性のシリコーン樹脂部材１０５と、これら発光素子１０１、受光素子１０３および各リード端子部１０２ａ，１０２ｂ，１０４ａ，１０４ｂの全体をモールドする透光性樹脂部材１０６と、この透光性樹脂部材１０６の表面を覆う遮光性樹脂部材１０７とから構成されている。
【０００３】
また、製造過程においては、発光側リード端子１０２ａ，１０２ｂは、端子接続部材で接続された状態となっており、一般に発光側リードフレームと呼ばれる。同様に、受光側リード端子１０４ａ，１０４ｂも、端子接続部材で接続された状態となっており、一般に受光側リードフレームと呼ばれる。
【０００４】
次に、このような構造の光結合素子の製造方法について、図９を参照しつつ説明する。
【０００５】
まずはじめに、発光素子１０１を発光側リードフレーム上の所定の位置（すなわち、一方の発光側リード端子１０２ａの一端部）にダイボンドし（ステップＳ１０１−ａ）、受光素子１０３を受光側リードフレーム上の所定の位置（すなわち、一方の受光側リード端子１０４ａの一端部）にダイボンドする（ステップＳ１０１−ｂ）。さらに、発光素子１０１と発光側リードフレーム上の所定の位置（すなわち、他方の発光側リード端子１０２ｂの一端部）とを金線等のワイヤ１０８を用いてワイヤボンドし（ステップＳ１０２−ａ）、受光素子１０３と受光側リードフレーム上の所定の位置（すなわち、他方の受光側リード端子１０４ｂの一端部）とを金線等のワイヤ１１８を用いてワイヤボンドする（ステップＳ１０２−ｂ）。
【０００６】
次いで、発光素子１０１の表面全体にシリコーン樹脂にてプリコートを施して、発光素子１０１の露出した部分をシリコーン樹脂部材１０５で覆う（ステップＳ１０３）。
【０００７】
その後、発光側リードフレームまたは受光側リードフレームを、例えばスポット溶接すること、またはローディングフレームにセットすること等により、発光素子１０１と受光素子１０３とを光学的に対向配置させた状態で固定し（ステップＳ１０４）、この後、透光性樹脂にて１次モールドを行って、透光性樹脂部材１０６を形成する（ステップＳ１０５）。
【０００８】
次に、バリ取りを施した後、遮光性樹脂にて２次モールドを行って、遮光性樹脂部材１０７を形成する（ステップＳ１０６）。
【０００９】
最後に、外装めっき（ステップＳ１０７）やフォーミング（ステップＳ１０８）等を行って光結合素子の組立が完了する。
【００１０】
その後、完成した光結合素子に対して性能テスト（ステップＳ１０９）と外観検査（ステップＳ１１０）とを行い、合格したものを梱包し（ステップＳ１１１）、出荷する（ステップＳ１１２）。
【００１１】
【発明が解決しようとする課題】
しかしながら、前述の光結合素子においては、透光性樹脂部材１０６の材料としてエポキシ系の樹脂が用いられている。そのため、受光素子１０３側のワイヤ１１８も、受光素子１０３とともにこのエポキシ系の樹脂によって覆われている。従って、光結合素子に過電流や過電圧が加わった場合、まず、受光素子１０３が接合破壊やアルミニウム（Ａｌ）パターンの焼損、酸化膜の破壊等が原因でショート状態になり、次に、ワイヤ１１８の溶断が発生する。このとき、エポキシ系の樹脂に含まれる炭素によってワイヤ１１８の周辺部が炭化してしまう場合があり、この炭化した部分を介して、受光素子１０３と他方の受光側リード端子１０４ｂとが導通状態となり、受光素子１０３が破壊されてしまうといった問題があった。また、受光素子１０３が破壊された状態のままでは周辺回路にまで悪影響が及び、光結合素子を用いて構成された製品自体の誤動作や破壊にまでつながる恐れがあるといった問題もあった。そのため、過電流等が加わって受光素子が破壊されたときには、直ちにオープン状態となり、電流が流れないようになることが望ましい。
【００１２】
また、エポキシ系の樹脂のモールドにはトランスファモールドが採用されるので、樹脂の粘度が高いため、ワイヤの変形が発生して、受光素子にワイヤが接触し、特性不良が発生するといった問題があった。
【００１３】
本発明はこのような問題を解決すべく創案されたもので、製品の誤動作や破壊、および特性不良の発生を防止することができる光結合素子を提供することにある。
【００１４】
【課題を解決するための手段】
本発明の光結合素子は、発光側リード端子にワイヤボンドされて搭載された発光素子と、受光側リードフレームにワイヤボンドされて搭載された受光素子とを光学的に対向配置した状態で、これら発光素子および受光素子を含むリード端子部全体がエポキシ系の透光性樹脂部材によってモールドされ、その透光性樹脂部材の表面が遮光性の樹脂部材にて被覆され、前記受光素子との電気的接続に用いられるワイヤの表面がさらにシリコーン系の透光性樹脂部材によって被覆されることで、前記ワイヤが前記エポキシ系の透光性樹脂部材から隔離された構造となっていることを特徴とする。
【００１５】
このような特徴を有する本発明によれば、光結合素子に過電流や過電圧が加わりワイヤが溶断した場合においても、導通状態になることを防止できる。さらに、透光性樹脂部材を形成する際に発生していたワイヤの変形を防止できる。
【００１６】
また、前記シリコーン系の樹脂が透光性を有していてもよく、この場合には、受光素子の受光感度が損なわれることを防止できる。
【００１７】
また、シリコーン系の樹脂は炭素を含んでいないので、光結合素子に過電流や過電圧が加わりワイヤが溶断した場合においても、ワイヤ周辺部の炭化により導通状態になることを防止できる。
【００１８】
また、ワイヤボンド用受光側リード端子の近傍に導電性部材が配置され、前記ワイヤが、受光素子と導電性部材とをワイヤボンドする第１ワイヤと、導電性部材とワイヤボンド用受光側リード端子とをワイヤボンドする第２ワイヤとで構成されており、第２ワイヤは第１ワイヤよりも径が細いワイヤによって形成されていてもよく、この場合には、第１ワイヤの電気容量より第２ワイヤの電気容量を小さくすることができる。
【００１９】
また、ワイヤボンド用受光側リード端子の近傍に導電性部材が配置され、前記ワイヤが、受光素子と導電性部材とをワイヤボンドする第１ワイヤと、導電性部材とワイヤボンド用受光側リード端子とをワイヤボンドする第２ワイヤとで構成されており、第２ワイヤの本数が第１ワイヤの本数よりも少なくなるように設けられていてもよく、この場合には、第１ワイヤの電気容量より第２ワイヤの電気容量を小さくすることができる。
【００２０】
また、前記他の受光側リード端子は、１つの受光側リード端子、他の受光側リード端子、および１つの受光側リード端子と他の受光側リード端子とを接続する端子接続部材からなる受光側リードフレームから端子接続部材を除去することによって得られる部材であり、この端子接続部材には導電性部材がさらに接続されていてもよく、この場合には、製造過程における光結合素子の構成部材の数を増やすことなく導電性部材を追加することができる。
【００２１】
また、前記受光素子の受光部が、透光性を有する前記シリコーン系の樹脂によって覆われていてもよく、この場合には、受光素子の受光感度を向上させることができる。
【００２２】
【発明の実施の形態】
次に、本発明の光結合素子の実施の形態について図面を参照しつつ説明する。
【００２３】
図１は、本発明の光結合素子の実施の形態１を示す断面図である。
【００２４】
本実施の形態１において、この光結合素子は、一方の発光側リード端子２ａにダイボンドされ、他方の発光側リード端子２ｂに金線等のワイヤ８でワイヤボンドされて搭載された発光素子１と、一方の受光側リードフレーム４ａにダイボンドされ、他方の受光側リードフレーム（請求項に記載のワイヤボンド用受光側リード端子）４ｂに金線等のワイヤ１８でワイヤボンドされて搭載された受光素子３とが光学的に対向配置され、この配置状態で、これら発光素子１および受光素子３を含む各リード端子２ａ，２ｂ，４ａ，４ｂの先端部全体が、透光性の樹脂部材６によってモールドされ、その透光性樹脂部材６の表面が遮光性の樹脂部材７にて被覆されている。そして、受光素子３と他方の受光側リードフレーム４ｂとをワイヤボンドするワイヤ１８は、その表面が難燃性の樹脂部材１５によって被覆された構造となっている。
【００２５】
また、製造過程においては、発光側リード端子２ａ，２ｂは端子接続部材でつながれた状態となっており、一般に発光側リードフレームと呼ばれる。同様に、受光側リード端子４ａ，４ｂも端子接続部材でつながれた状態となっており、一般に受光側リードフレームと呼ばれる。
【００２６】
また、難燃性の樹脂部材１５の材料としては、透光性を有する樹脂であるシリコーン樹脂が使用される。このシリコーン樹脂は炭素を含んでいないので、従来の光結合素子において発生していた受光素子用のワイヤ周辺部の炭化を防止できる。これにより、受光素子３の破壊が発生しても、受光素子３はオープン状態になるので、周辺回路の破壊や誤動作を防止できる。
【００２７】
また、受光素子３用のワイヤ１８の表面が難燃性の樹脂部材１５で覆われているので、従来の光結合素子において透光性樹脂部材を形成する際に発生していたワイヤの変形を防止できる。これにより、受光素子３にワイヤ１８が接触して特性不良が発生することを防止でき、歩留まりが向上する。
【００２８】
次に、図１に示す光結合素子の製造方法について図面を参照しつつ説明する。
【００２９】
図２は、図１に示す光結合素子の製造方法の一例を示すフローチャートである。
【００３０】
まずはじめに、発光素子１を発光側リードフレーム上の所定の位置（すなわち、一方の発光側リード端子２ａの一端部）にダイボンドし（ステップＳ１−ａ）、受光素子３を受光側リードフレーム上の所定の位置（すなわち、一方の受光側リード端子４ａの一端部）にダイボンドする（ステップＳ１−ｂ）。さらに、発光素子１と発光側リードフレーム上の所定の位置（すなわち、他方の発光側リード端子２ｂの一端部）とを金線等のワイヤ８を用いてワイヤボンドし（ステップＳ２−ａ）、受光素子３と受光側リードフレーム上の所定の位置（すなわち、他方の受光側リード端子４ｂの一端部）とを金線等のワイヤ１８を用いてワイヤボンドする（ステップＳ２−ｂ）。
【００３１】
次いで、発光素子１の露出した部分にシリコーン樹脂にてプリコートを施して、発光素子１の露出した部分をシリコーン樹脂部材５で覆う（ステップＳ３−ａ）とともに、受光素子用のワイヤ１８にプリコートを施して、受光素子用のワイヤ１８の表面を難燃性の樹脂部材１５で覆う（ステップＳ３−ｂ）。
【００３２】
その後、発光側リードフレーム２ａ，２ｂおよび受光側リードフレーム４ａ，４ｂを、例えばスポット溶接すること、またはローディングフレームにセットすること等により、発光素子１と受光素子３とを光学的に対向配置させた状態で固定して（ステップＳ４）、透光性樹脂にて１次モールドを行い透光性樹脂部材６を形成する（ステップＳ５）。
【００３３】
さらに、バリ取りを施した後、遮光性樹脂にて２次モールドを行い、遮光性樹脂部材７を形成する（ステップＳ６）。
【００３４】
最後に、錫めっきまたは半田めっき等の外装めっき（ステップＳ７）やフォーミング（ステップＳ８）等を行って光結合素子の組立が完了する。
【００３５】
その後、完成した光結合素子に対して性能テスト（ステップＳ９）と外観検査（ステップＳ１０）とを行い、合格したものを梱包し（ステップＳ１１）、出荷する（ステップＳ１２）。
【００３６】
次に、本発明の光結合素子の実施の形態２について図面を参照しつつ説明する。
【００３７】
図３は、本発明の光結合素子の実施の形態２を示す断面図である。
【００３８】
本実施の形態２の光結合素子と実施の形態１に示した光結合素子との間で異なっているところは、受光素子３が受光側リード端子４ｂの近傍に配置された導電性部材４ｃに第１ワイヤ１８ａを用いてワイヤボンドされており、かつ、この導電性部材４ｃが他方のリード端子４ｂに第２ワイヤ１８ｂを用いてワイヤボンドされている点である。さらに、第２ワイヤ１８ｂとしては、第１ワイヤ１８ａよりも径が細いワイヤが用いられる。
【００３９】
このような構成を採用することにより、第２ワイヤ１８ｂの電気容量を第１ワイヤ１８ａの電気容量よりも小さくすることができる。これにより、光結合素子に過電流等が加わった場合には、受光素子３側の第２ワイヤ１８ｂより先に第１ワイヤ１８ａの方が溶断するので、受光素子３の破壊を防止することができる。
【００４０】
また、難燃性の樹脂部材１５は、第１ワイヤ１８ａおよび第２ワイヤ１８ｂの両方を覆うように形成される。
【００４１】
また、発光側リードフレームとしては、従来の光結合素子や実施の形態１に示した光結合素子を製造する際に使用される発光側リードフレームが使用される。この発光側リードフレームの一例としては、図４に示すような、２本の発光側リード端子２ａ，２ｂと、これらの発光側リード端子２ａ，２ｂを接続するための端子接続部材１２とから構成されたものがある。
【００４２】
一方、受光側リードフレームの一例としては、図５に示すような、２本の受光側リード端子４ａ，４ｂと、導電性部材４ｃと、これらの受光側リード端子４ａ，４ｂおよび導電性部材４ｃを接続するための端子接続部材１４とから構成されたものがある。このように、端子接続部材１４に導電性部材４ｃがさらに接続されている場合には、製造過程における光結合素子の構成部材の数を増やすことなく導電性部材を追加することができる。
【００４３】
なお、第２ワイヤ１８ｂの電気容量を第１ワイヤ１８ａの電気容量よりも小さくする手段はワイヤの径を異ならせることに限定されるものではない。例えば、第２ワイヤ１８ｂの本数を第１ワイヤ１８ａの本数よりも少なくしてもよい。図６に示す光結合素子においては、第１ワイヤ１８ａが１本のワイヤで構成されており、第２ワイヤ１８ｂが２本のワイヤで構成されている。
【００４４】
次に、本発明の光結合素子の実施の形態３について図面を参照しつつ説明する。
【００４５】
図７は、本発明の光結合素子の実施の形態３を示す断面図である。
【００４６】
本実施の形態３の光結合素子と実施の形態１に示した光結合素子との間で異なっているところは、難燃性の樹脂部材１５が、受光素子３用のワイヤ１８の表面を覆うとともに受光素子３の受光部（図６においては受光素子の上面）Ｓも覆っている点である。本実施の形態３において、難燃性の樹脂部材１５は透光性を有する樹脂を用いて形成されている。
【００４７】
このような構成を採用することにより、受光素子３の受光感度を向上させることができる。
【００４８】
なお、本発明は、上述の各実施の形態に限定されるものではなく、本発明の範囲内で上述の実施の形態に多くの修正および変更を加え得ることは言うまでもない。
【００４９】
例えば、難燃性の部材で覆うワイヤについては受光素子側のワイヤについてのみ記載したが、発光素子側のワイヤについても応用可能である。また、光結合素子としてフォトカプラまたはフォトトライアックカプラについてのみ記載したが、本発明はその他の樹脂封止される半導体にも応用できることは言うまでもない。
【００５０】
また、上述の各実施の形態では、発光素子および受光素子のいずれについても、２つの電極の一方がダイボンドされ、他方の電極がワイヤボンドされているが、両方の電極がワイヤボンドされるなど、少なくとも１つの電極がワイヤボンドされているものであれば、本発明の適用が可能である。
【００５１】
【発明の効果】
本発明によれば、受光素子を他の受光側リード端子にワイヤボンドする際に用いられるワイヤ表面が難燃性を有する樹脂で形成された難燃性の樹脂部材によって覆われているので、光結合素子を用いて構成された製品の誤動作や破壊を防止することができる。さらに、透光性樹脂部材を形成する際に発生していたワイヤの変形を防止できるので、受光素子にワイヤが接触して特性不良が発生することを防止でき、歩留まりが向上する。
【００５２】
また、シリコーン系の樹脂が透光性を有している場合には、受光素子の受光感度が損なわれることを防止できる。また、光結合素子を用いて構成された製品の誤動作や破壊を防止することができる。
【００５３】
また、シリコーン系の樹脂は炭素を含んでいないので、光結合素子に過電流や過電圧が加わりワイヤが溶断した場合においても、ワイヤ周辺部の炭化により導通状態になることを防止できる。
【００５４】
また、ワイヤボンド用受光側リード端子の近傍に導電性部材が配置され、ワイヤが、受光素子と導電性部材とをワイヤボンドする第１ワイヤと、導電性部材とワイヤボンド用受光側リード端子とをワイヤボンドする第２ワイヤとで構成されており、第２ワイヤは第１ワイヤよりも径が細いワイヤによって形成されている場合には、光結合素子に過電流等が加わったときに、受光素子側の第２ワイヤより先に第１ワイヤの方が溶断するので、受光素子の破壊を防止することができる。
【００５５】
また、ワイヤボンド用受光側リード端子の近傍に導電性部材が配置され、ワイヤが、受光素子と導電性部材とをワイヤボンドする第１ワイヤと、導電性部材とワイヤボンド用受光側リード端子とをワイヤボンドする第２ワイヤとで構成されており、第２ワイヤの本数が第１ワイヤの本数よりも少なくなるように設けられている場合には、光結合素子に過電流等が加わったときに、受光素子側の第２ワイヤより先に第１ワイヤの方が溶断するので、受光素子の破壊を防止することができる。
【００５６】
また、受光素子の受光部が、透光性を有する樹脂で形成された難燃性の樹脂部材によって覆われている場合には、受光素子の受光感度を向上させることができる。
【図面の簡単な説明】
【図１】本発明の光結合素子の実施の形態１を示す断面図である。
【図２】図１に示す光結合素子の製造方法の一例を示すフローチャートである。
【図３】本発明の光結合素子の実施の形態２を示す断面図である。
【図４】図１に示す光結合素子の製造過程において用いられる発光側リードフレームの一例を示す斜視図である。
【図５】図１に示す光結合素子の製造過程において用いられる受光側リードフレームの一例を示す斜視図である。
【図６】実施の形態２の光結合素子のさらに他の実施の形態を示す断面図である。
【図７】本発明の光結合素子の実施の形態３を示す断面図である。
【図８】従来の光結合素子の一例を示す断面図である。
【図９】図８に示す光結合素子の製造方法の一例を示すフローチャートである。
【符号の説明】
１ 発光素子
２ａ，２ｂ 発光側リード端子
３ 受光素子
４ａ，４ｂ 受光側リード端子
４ｃ 導電性部材
５ シリコーン樹脂部材
６ 透光性樹脂部材
７ 遮光性樹脂部材
８ ワイヤ
１２，１４ 端子接続部材
１５ 難燃性の樹脂部材
１８ ワイヤ
１８ａ 第１ワイヤ
１８ｂ 第２ワイヤ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical coupling element including a light receiving element and a light emitting element.
[0002]
[Prior art]
As shown in FIG. 8, the conventional optical coupling element includes a light emitting element 101, two light emitting side lead terminals 102a and 102b in which the light emitting element 101 is die-bonded and wire bonded, a light receiving element 103, and the light receiving element. Two light-receiving side lead terminals 104a and 104b 103 are die-bonded and wire-bonded, a translucent silicone resin member 105 covering the entire light-emitting element 101, the light-emitting element 101, the light-receiving element 103, and each lead terminal The light transmitting resin member 106 that molds the entire portions 102 a, 102 b, 104 a, and 104 b and the light shielding resin member 107 that covers the surface of the light transmitting resin member 106 are configured.
[0003]
In the manufacturing process, the light emitting side lead terminals 102a and 102b are in a state of being connected by a terminal connecting member, and are generally called light emitting side lead frames. Similarly, the light receiving side lead terminals 104a and 104b are also connected by a terminal connecting member, and are generally called a light receiving side lead frame.
[0004]
Next, a manufacturing method of the optical coupling element having such a structure will be described with reference to FIG.
[0005]
First, the light emitting element 101 is die-bonded to a predetermined position on the light emitting side lead frame (that is, one end of one light emitting side lead terminal 102a) (step S101-a), and the light receiving element 103 is placed on the light receiving side lead frame. Die-bond to a predetermined position (that is, one end of one light-receiving side lead terminal 104a) (step S101-b). Further, the light emitting element 101 and a predetermined position on the light emitting side lead frame (that is, one end portion of the other light emitting side lead terminal 102b) are wire-bonded using a wire 108 such as a gold wire (step S102-a), The light receiving element 103 and a predetermined position on the light receiving side lead frame (that is, one end portion of the other light receiving side lead terminal 104b) are wire-bonded using a wire 118 such as a gold wire (step S102-b).
[0006]
Next, the entire surface of the light emitting element 101 is precoated with silicone resin, and the exposed portion of the light emitting element 101 is covered with the silicone resin member 105 (step S103).
[0007]
Thereafter, the light-emitting element 101 and the light-receiving element 103 are fixed in a state where the light-emitting element 101 and the light-receiving element 103 are optically opposed to each other, for example, by spot welding or setting on a loading frame. Thereafter, primary molding is performed with a translucent resin to form the translucent resin member 106 (step S105).
[0008]
Next, after deburring, secondary molding is performed with a light-shielding resin to form the light-shielding resin member 107 (step S106).
[0009]
Finally, exterior plating (step S107) and forming (step S108) are performed to complete the assembly of the optical coupling element.
[0010]
Thereafter, a performance test (step S109) and an appearance inspection (step S110) are performed on the completed optical coupling element, and those that pass are packed (step S111) and shipped (step S112).
[0011]
[Problems to be solved by the invention]
However, in the above-described optical coupling element, an epoxy resin is used as the material of the translucent resin member 106. Therefore, the wire 118 on the light receiving element 103 side is also covered with this epoxy resin together with the light receiving element 103. Therefore, when an overcurrent or an overvoltage is applied to the optical coupling element, first, the light receiving element 103 is short-circuited due to junction breakage, aluminum (Al) pattern burnout, oxide film destruction, and the like. Fusing occurs. At this time, the peripheral portion of the wire 118 may be carbonized by carbon contained in the epoxy resin, and the light receiving element 103 and the other light receiving side lead terminal 104b become conductive through the carbonized portion. There is a problem that the light receiving element 103 is destroyed. Further, if the light receiving element 103 is in a broken state, there is a problem that the peripheral circuit is adversely affected, and there is a possibility that the product itself configured using the optical coupling element may malfunction or be destroyed. Therefore, when an overcurrent or the like is applied and the light receiving element is destroyed, it is desirable to immediately enter an open state so that no current flows.
[0012]
In addition, since a transfer mold is used for the epoxy resin mold, the viscosity of the resin is high, so that there is a problem that the wire is deformed, the wire comes into contact with the light receiving element, and the characteristic defect occurs. It was.
[0013]
The present invention was devised to solve such a problem, and it is an object of the present invention to provide an optical coupling element capable of preventing malfunction and destruction of a product and occurrence of defective characteristics.
[0014]
[Means for Solving the Problems]
The optical coupling element of the present invention is a state in which a light emitting element mounted by wire bonding to a light emitting side lead terminal and a light receiving element mounted by wire bonding to a light receiving side lead frame are optically arranged opposite to each other. total lead terminal portion including a light emitting element and a light receiving element are molded with translucent resins member epoxy, the surface of the translucent resin member is coated with the light-shielding resin member, the electrical and the light receiving element in Rukoto covered by translucent resin member is a silicone-based surface of the wire used for the connection, and wherein the wire is in the isolated structure of a light-transmitting resin member of the epoxy To do.
[0015]
According to the present invention having such a feature, even when an overcurrent or an overvoltage is applied to the optical coupling element and the wire is melted, it can be prevented from being in a conductive state. Further, it is possible to prevent the wire from being deformed when the translucent resin member is formed.
[0016]
Further, the silicone-based resin may have translucency, and in this case, it is possible to prevent the light receiving sensitivity of the light receiving element from being impaired.
[0017]
Further, shea recone based resins because it does not contain carbon, when joined by overcurrent or overvoltage in the optical coupling element wire is blown can also prevent Rukoto such a conducting state by carbonization of the wire perimeter.
[0018]
Also, a conductive member is disposed in the vicinity of the light receiving side lead terminal for wire bonding, and the wire includes a first wire for wire bonding the light receiving element and the conductive member, and a conductive member and the light receiving side lead terminal for wire bonding. And the second wire may be formed of a wire having a diameter smaller than that of the first wire. In this case, the second wire may have a second capacitance greater than that of the first wire. The electric capacity of the wire can be reduced.
[0019]
Also, a conductive member is disposed in the vicinity of the light receiving side lead terminal for wire bonding, and the wire includes a first wire for wire bonding the light receiving element and the conductive member, and a conductive member and the light receiving side lead terminal for wire bonding. And the second wire to be wire-bonded, and the number of the second wires may be smaller than the number of the first wires. In this case, the electric capacity of the first wire Further, the electric capacity of the second wire can be reduced.
[0020]
The other light receiving side lead terminal is a light receiving side comprising one light receiving side lead terminal, another light receiving side lead terminal, and a terminal connecting member for connecting one light receiving side lead terminal to another light receiving side lead terminal. This is a member obtained by removing the terminal connection member from the lead frame, and a conductive member may be further connected to the terminal connection member. In this case, the component member of the optical coupling element in the manufacturing process Conductive members can be added without increasing the number.
[0021]
The light receiving portion of the light receiving element may be covered by the silicone resin having translucency, in this case, it is possible to improve the light receiving sensitivity of the light receiving element.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the optical coupling element of the present invention will be described with reference to the drawings.
[0023]
FIG. 1 is a sectional view showing Embodiment 1 of the optical coupling element of the present invention.
[0024]
In the first embodiment, the optical coupling element is die-bonded to one of the light emitting side lead pin 2 a, mounted are wire-bonded by wires 8 of gold or the like on the other of the light emitting side lead pin 2 b a light-emitting element 1 is die-bonded to one of the light receiving side lead frame 4 a, are wire-bonded by the other light receiving side lead frame of gold or the like 4b (wire receiving-side lead terminal for bonded of claim) wire 18 The mounted light receiving element 3 is optically opposed to each other, and in this arrangement state, the entire tip portions of the lead terminals 2a, 2b, 4a, 4b including the light emitting element 1 and the light receiving element 3 are translucent. The resin member 6 is molded, and the surface of the translucent resin member 6 is covered with a light-shielding resin member 7. The wire 18 for wire bonding the light receiving element 3 and the other light receiving side lead frame 4b has a structure in which the surface thereof is covered with a flame retardant resin member 15.
[0025]
In the manufacturing process, the light emitting side lead terminals 2a and 2b are connected by a terminal connecting member and are generally called a light emitting side lead frame. Similarly, the light receiving side lead terminals 4a and 4b are also connected by a terminal connecting member, and are generally called a light receiving side lead frame.
[0026]
Moreover, as a material of the flame-retardant resin member 15, a silicone resin that is a light-transmitting resin is used. Since this silicone resin does not contain carbon, it is possible to prevent carbonization of the peripheral portion of the light receiving element wire that has occurred in the conventional optical coupling element. As a result, even if the light receiving element 3 is broken, the light receiving element 3 is in an open state, so that the peripheral circuit can be prevented from being broken or malfunctioned.
[0027]
Moreover, since the surface of the wire 18 for the light receiving element 3 is covered with the flame retardant resin member 15, the deformation of the wire that has occurred when forming the translucent resin member in the conventional optical coupling element is prevented. Can be prevented. Thereby, it can prevent that the wire 18 contacts the light receiving element 3, and a characteristic defect generate | occur | produces, and a yield improves.
[0028]
Next, a method for manufacturing the optical coupling element shown in FIG. 1 will be described with reference to the drawings.
[0029]
FIG. 2 is a flowchart showing an example of a manufacturing method of the optical coupling element shown in FIG.
[0030]
First, the light emitting element 1 is die-bonded to a predetermined position on the light emitting side lead frame (that is, one end of one light emitting side lead terminal 2a) (step S1-a), and the light receiving element 3 is placed on the light receiving side lead frame. A die bond is made at a predetermined position (that is, one end of one light receiving side lead terminal 4a) (step S1-b). Furthermore, the light emitting element 1 and a predetermined position on the light emitting side lead frame (that is, one end portion of the other light emitting side lead terminal 2b) are wire-bonded using a wire 8 such as a gold wire (step S2-a), The light receiving element 3 and a predetermined position on the light receiving side lead frame (that is, one end portion of the other light receiving side lead terminal 4b) are wire-bonded using a wire 18 such as a gold wire (step S2-b).
[0031]
Next, the exposed portion of the light emitting element 1 is precoated with silicone resin, and the exposed portion of the light emitting element 1 is covered with the silicone resin member 5 (step S3-a), and the light receiving element wire 18 is precoated. Then, the surface of the light receiving element wire 18 is covered with a flame-retardant resin member 15 (step S3-b).
[0032]
Thereafter, the light-emitting element 1 and the light-receiving element 3 are optically arranged to face each other by, for example, spot welding or setting the light-receiving-side lead frames 4a and 4b on the loading frame. Then, the light-transmitting resin member 6 is formed by performing primary molding with a light-transmitting resin (step S5).
[0033]
Further, after deburring, secondary molding is performed with a light shielding resin to form the light shielding resin member 7 (step S6).
[0034]
Finally, exterior plating such as tin plating or solder plating (step S7), forming (step S8), or the like is performed to complete the assembly of the optical coupling element.
[0035]
Thereafter, a performance test (step S9) and an appearance inspection (step S10) are performed on the completed optical coupling element, and those that pass are packed (step S11) and shipped (step S12).
[0036]
Next, a second embodiment of the optical coupling element of the present invention will be described with reference to the drawings.
[0037]
FIG. 3 is a sectional view showing Embodiment 2 of the optical coupling element of the present invention.
[0038]
The difference between the optical coupling element of the second embodiment and the optical coupling element shown in the first embodiment is that the light receiving element 3 is disposed on the conductive member 4c disposed in the vicinity of the light receiving side lead terminal 4b. The first wire 18a is wire-bonded, and the conductive member 4c is wire-bonded to the other lead terminal 4b using the second wire 18b. Further, a wire having a diameter smaller than that of the first wire 18a is used as the second wire 18b.
[0039]
By adopting such a configuration, the electric capacity of the second wire 18b can be made smaller than the electric capacity of the first wire 18a. As a result, when an overcurrent or the like is applied to the optical coupling element, the first wire 18a is fused before the second wire 18b on the light receiving element 3 side, so that the destruction of the light receiving element 3 can be prevented. it can.
[0040]
The flame-retardant resin member 15 is formed so as to cover both the first wire 18a and the second wire 18b.
[0041]
Further, as the light emitting side lead frame, a light emitting side lead frame used when manufacturing the conventional optical coupling element or the optical coupling element shown in the first embodiment is used. As an example of the light emitting side lead frame, it is configured by two light emitting side lead terminals 2a and 2b and a terminal connecting member 12 for connecting the light emitting side lead terminals 2a and 2b as shown in FIG. There is something that was done.
[0042]
On the other hand, as an example of the light receiving side lead frame, as shown in FIG. 5, two light receiving side lead terminals 4a and 4b, a conductive member 4c, and these light receiving side lead terminals 4a and 4b and a conductive member 4c. And a terminal connection member 14 for connecting the two. As described above, when the conductive member 4c is further connected to the terminal connection member 14, the conductive member can be added without increasing the number of constituent members of the optical coupling element in the manufacturing process.
[0043]
The means for making the electric capacity of the second wire 18b smaller than the electric capacity of the first wire 18a is not limited to making the diameter of the wire different. For example, the number of second wires 18b may be less than the number of first wires 18a. In the optical coupling element shown in FIG. 6, the first wire 18a is composed of one wire, and the second wire 18b is composed of two wires.
[0044]
Next, a third embodiment of the optical coupling element of the present invention will be described with reference to the drawings.
[0045]
FIG. 7 is a sectional view showing Embodiment 3 of the optical coupling element of the present invention.
[0046]
The difference between the optical coupling element of the third embodiment and the optical coupling element shown in the first embodiment is that the flame-retardant resin member 15 covers the surface of the wire 18 for the light receiving element 3. At the same time, it also covers the light receiving part (the upper surface of the light receiving element in FIG. 6) S of the light receiving element 3. In the third embodiment, the flame retardant resin member 15 is formed using a translucent resin.
[0047]
By adopting such a configuration, the light receiving sensitivity of the light receiving element 3 can be improved.
[0048]
The present invention is not limited to the above-described embodiments, and it goes without saying that many modifications and changes can be made to the above-described embodiments within the scope of the present invention.
[0049]
For example, the wire covered with the flame retardant member is described only for the light receiving element side wire, but it can also be applied to the light emitting element side wire. Although only a photocoupler or phototriac coupler has been described as the optical coupling element, it goes without saying that the present invention can also be applied to other resin-encapsulated semiconductors.
[0050]
In each of the above-described embodiments, for both the light emitting element and the light receiving element, one of the two electrodes is die-bonded and the other electrode is wire-bonded, but both electrodes are wire-bonded, etc. If at least one electrode is wire-bonded, the present invention can be applied.
[0051]
【The invention's effect】
According to the present invention, the wire surface used when wire-bonding the light-receiving element to another light-receiving side lead terminal is covered with the flame-retardant resin member formed of a flame-retardant resin. It is possible to prevent malfunction and destruction of a product configured using the coupling element. Furthermore, since the deformation of the wire that has occurred when forming the translucent resin member can be prevented, it is possible to prevent the wire from coming into contact with the light receiving element and to cause a characteristic defect, and the yield is improved.
[0052]
Further, when the silicone-based resin has translucency, it is possible to prevent the light receiving sensitivity of the light receiving element from being impaired. In addition, it is possible to prevent malfunction and destruction of a product configured using the optical coupling element.
[0053]
Further, a silicone-based resin because does not contain carbon, when joined by overcurrent or overvoltage in the optical coupling element wire is blown can also prevent Rukoto such a conducting state by carbonization of the wire perimeter.
[0054]
Also, a conductive member is disposed in the vicinity of the light receiving side lead terminal for wire bonding, the wire includes a first wire for wire bonding the light receiving element and the conductive member, a conductive member, and a light receiving side lead terminal for wire bonding. In the case where the second wire is formed of a wire having a diameter smaller than that of the first wire, the light reception is performed when an overcurrent or the like is applied to the optical coupling element. Since the first wire is fused before the second wire on the element side, it is possible to prevent destruction of the light receiving element.
[0055]
Also, a conductive member is disposed in the vicinity of the light receiving side lead terminal for wire bonding, the wire includes a first wire for wire bonding the light receiving element and the conductive member, a conductive member, and a light receiving side lead terminal for wire bonding. In the case where the number of second wires is less than the number of first wires, an overcurrent or the like is applied to the optical coupling element. In addition, since the first wire is melted before the second wire on the light receiving element side, the destruction of the light receiving element can be prevented.
[0056]
Moreover, when the light-receiving part of the light-receiving element is covered with a flame-retardant resin member formed of a light-transmitting resin, the light-receiving sensitivity of the light-receiving element can be improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a first embodiment of an optical coupling element of the present invention.
FIG. 2 is a flowchart showing an example of a method for manufacturing the optical coupling element shown in FIG.
FIG. 3 is a cross-sectional view showing a second embodiment of the optical coupling element of the present invention.
4 is a perspective view showing an example of a light emitting side lead frame used in the manufacturing process of the optical coupling element shown in FIG. 1; FIG.
5 is a perspective view showing an example of a light receiving side lead frame used in the manufacturing process of the optical coupling element shown in FIG. 1; FIG.
FIG. 6 is a cross-sectional view showing still another embodiment of the optical coupling element according to the second embodiment.
FIG. 7 is a cross-sectional view showing a third embodiment of the optical coupling element of the present invention.
FIG. 8 is a cross-sectional view showing an example of a conventional optical coupling element.
FIG. 9 is a flowchart showing an example of a manufacturing method of the optical coupling element shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Light emitting element 2a, 2b Light emitting side lead terminal 3 Light receiving element 4a, 4b Light receiving side lead terminal 4c Conductive member 5 Silicone resin member 6 Translucent resin member 7 Light shielding resin member 8 Wire 12, 14 Terminal connection member 15 Flame retardance Resin member 18 wire 18a first wire 18b second wire

Claims (4)

発光側リード端子にワイヤボンドされて搭載された発光素子と、受光側リードフレームにワイヤボンドされて搭載された受光素子とを光学的に対向配置した状態で、これら発光素子および受光素子を含むリード端子部全体がエポキシ系の透光性樹脂部材によってモールドされ、その透光性樹脂部材の表面が遮光性の樹脂部材にて被覆され、前記受光素子との電気的接続に用いられるワイヤの表面がさらにシリコーン系の透光性樹脂部材によって被覆されることで、前記ワイヤが前記エポキシ系の透光性樹脂部材から隔離された構造となっていることを特徴とする光結合素子。A lead including the light emitting element and the light receiving element in a state where the light emitting element mounted by wire bonding to the light emitting side lead terminal and the light receiving element mounted by wire bonding to the light receiving side lead frame are optically opposed to each other. entire terminal portion is molded by translucent resins member epoxy, the surface of the translucent resin member is coated with the light-shielding resin member, the surface of the wire used for electrical connection between said light receiving element in Rukoto There is further covered by a translucent resin member of the silicone-based, the wire is an optical coupling element characterized in that which is the isolated structure of a light-transmitting resin member of said epoxy. ワイヤボンド用受光側リード端子の近傍に導電性部材が配置され、前記ワイヤが、受光素子と導電性部材とをワイヤボンドする第１ワイヤと、導電性部材とワイヤボンド用受光側リード端子とをワイヤボンドする第２ワイヤとで構成されており、第２ワイヤは第１ワイヤよりも径が細いワイヤによって形成されている請求項１記載の光結合素子。  A conductive member is disposed in the vicinity of the light receiving side lead terminal for wire bonding, and the wire includes a first wire for wire bonding the light receiving element and the conductive member, and the conductive member and the light receiving side lead terminal for wire bonding. The optical coupling element according to claim 1, wherein the second wire is formed of a wire having a diameter smaller than that of the first wire. ワイヤボンド用受光側リード端子の近傍に導電性部材が配置され、前記ワイヤが、受光素子と導電性部材とをワイヤボンドする第１ワイヤと、導電性部材とワイヤボンド用受光側リード端子とをワイヤボンドする第２ワイヤとで構成されており、第２ワイヤの本数が第１ワイヤの本数よりも少なくなるように設けられている請求項１記載の光結合素子。  A conductive member is disposed in the vicinity of the light receiving side lead terminal for wire bonding, and the wire includes a first wire for wire bonding the light receiving element and the conductive member, and the conductive member and the light receiving side lead terminal for wire bonding. 2. The optical coupling element according to claim 1, wherein the optical coupling element includes a second wire to be wire-bonded, and is provided so that the number of the second wires is smaller than the number of the first wires. 前記受光素子の受光部が、透光性を有する前記シリコーン系の樹脂によって覆われている請求項１ないし請求項３のいずれかに記載の光結合素子。  4. The optical coupling element according to claim 1, wherein a light receiving portion of the light receiving element is covered with the silicone resin having translucency.
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