JP3814422B2 - Display device and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a display device such as a liquid crystal display device and an EL, and more particularly to a display device in which a driver IC, an FPC, and the like are connected using an anisotropic conductive film and a manufacturing method thereof .
[0002]
[Prior art]
Conventionally, a driver IC or a TAB in which a driver IC is mounted on an FPC is mounted on a non-display area of a substrate constituting a liquid crystal display device via an anisotropic conductive film (hereinafter abbreviated as ACF), and is electrically According to this technology, the electrodes are extended to the non-display area of the substrate, and when the driver IC or TAB is mounted via the ACF, the marker is recognized and mounted.
[0003]
FIG. 6 is an enlarged plan view of a main part of the liquid crystal display device 2 provided with TAB1.
3 is a glass substrate constituting the liquid crystal display device 2, 4 is an input electrode patterned on the glass substrate 3, 5 is a rectangular marker, and 6 is an ACF coated on the input electrode 4 (shaded portion). Further, on the FPC forming the TAB 1, an output electrode 7 and a marker 8 having the same shape as the marker 5 are formed on the back side in the drawing. The marker 8 is formed in the vicinity of the output electrode 7 to improve mounting accuracy.
[0004]
In order to mount the TAB 1 on the liquid crystal display device 2, first, the ACF 6 is transferred onto the glass substrate 3 in a band shape, and the TAB 1 is moved above the mounting position on the glass substrate 3. TAB 1 is mounted at a predetermined position on the glass substrate 3 by superimposing both of them while detecting the marker 8 and the marker 8. After that, ACF6 is solidified by heating and pressurizing from above TAB1.
[0005]
[Problems to be solved by the invention]
However, in the mounting method described above, the marker 5 cannot be accurately recognized as described below, and there is a case where it cannot be mounted.
[0006]
That is, when the ACF 6 is transferred onto the marker 5, a bubble enters the interface between the two and erroneous recognition occurs due to the bubble, and thus the marker 5 cannot be accurately recognized.
[0007]
Therefore, the object of the present invention is to eliminate such misrecognition, increase the mounting accuracy of the driver IC and FPC, thereby increasing the manufacturing yield and lowering the production cost. As a result, a low-cost and highly reliable display device is achieved. It is to provide.
[0008]
[Means for Solving the Problems]
In order to solve the above problems, the invention of claim 1 is directed to a substrate having a display portion, a non-display portion, and a plurality of first electrodes extending from the display portion to the non-display portion, and the non-display portion. A mounting body having a plurality of second electrodes electrically connected to the first electrode located in the display portion via an anisotropic conductive film, wherein the mounting body includes the mounting body, The substrate is provided with a pair of markers arranged at a distance from the second electrode, and the substrate is arranged to face the marker of the mounting body via the anisotropic conductive film, and is spaced from the first electrode. A pair of alignment markers arranged with a gap therebetween, and a recognition marker arranged outside the region of the anisotropic conductive film and spaced from the alignment marker so as to correspond to the alignment marker display instrumentation, characterized in that the, further comprising .
According to a second aspect of the present invention, the recognition marker is arranged at a position substantially translated from the alignment marker in the extending direction of the first electrode.
According to a third aspect of the present invention, the display unit, the non-display unit, the multiple first electrodes extending from the display unit to the non-display unit, and the first electrode are spaced apart from each other. An alignment marker, an anisotropic conductive film disposed so as to cover the first electrode extending to the non-display portion and the alignment marker, and disposed outside the region of the anisotropic conductive film, A transparent substrate having a recognition marker arranged at a distance from the alignment marker so as to correspond to the alignment marker is prepared, and corresponding to the first electrode located in the non-display portion Preparing a mounting body having a plurality of second electrodes to be provided and a marker provided corresponding to the alignment marker, and aligning the recognition marker on the substrate and the marker on the mounting body Process and Aligning the marker of the mount and the alignment marker of the substrate so as to face each other through the anisotropic conductive film by relatively moving the mount and the substrate; And mounting the mounting body on the substrate.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the display device of the present invention is exemplified by a liquid crystal display device.
1 is a plan view of a COG type liquid crystal display device A, FIG. 2 is a sectional view taken along line XX shown in FIG. 1, and FIG. 3 is a plan view of a TAB type liquid crystal display device B. 4 is a plan view of the vicinity of the mounting portion of the FPC (TAB), and FIG. 5 is a plan view of the vicinity of the mounting portion of the driver IC in the liquid crystal display device A. In addition, the same code | symbol is attached | subjected to the same location as the liquid crystal display device 2 shown in FIG.
[0010]
Structure of each liquid crystal display device A, B According to the liquid crystal display device A, a scanning side substrate 11 and a signal side substrate 12 constituted by a glass substrate having ITO transparent electrodes 9, 10 formed on the inner surface, Are arranged opposite to each other, and an alignment film of polyimide resin is provided on each of the transparent electrodes 9 and 10. The scanning side substrate 11 and the signal side substrate 12 are fixed through a sealant 13 made of a thermosetting resin such as epoxy, acrylic, silicone, etc., and further, a spacer 14 made of a resin sphere or the like is used to separate the substrate. It is constant. Liquid crystal 15 is sealed inside. Reference numeral 17 denotes a driver IC, and 18 denotes an FPC for an input cable.
[0011]
Reference numeral 19 denotes a display unit defined by the liquid crystal sealing range, and a large number of transparent electrodes 10 constituting the display unit 19 extend on the non-display unit region 20 of the signal side substrate 12. A large number of terminal electrodes 21 as existing electrode portions are formed, and these terminal electrodes 21 are divided into a plurality of groups and arranged.
[0012]
As for the liquid crystal display device B, as shown in FIG. 3, a driver IC is connected by the TAB method in place of the driver IC 17. 26 is a TAB.
[0013]
Mounting method of FPC A case where the FPC 18 as the mounting body is mounted in the liquid crystal display device A and a case where the TAB 26 is mounted in the liquid crystal display device B will be described with reference to FIG.
[0014]
In the electrode pattern shown in FIG. 4, in addition to the alignment marker 5 in the ACF placement site shown in FIG. 6, a cross-shaped recognition marker 27 is also provided around the ACF placement site, specifically from the ACF. Form inside. The alignment marker 5 and the recognition marker 27 are symmetrically arranged as a pair, and the intervals are the same. Further, the interval between the alignment marker 5 and the recognition marker 27 is set to the same interval a.
[0015]
To mount the TAB 26 on the non-display area 20 of the signal side substrate 12, first transfer the ACF 6 onto the non-display area 20, move the TAB 26 above the ACF 6, and provide it on the back side of the signal side substrate 12. While recognizing the positions of the recognition marker 27 and the marker 8 with a camera, the TAB 26 is placed on the site where the ACF 6 is disposed, and fine adjustment is performed so that the recognition marker 27 and the marker 8 are superimposed. Next, the TAB 26 is moved, and the marker 8 is mounted so as to overlap the alignment marker 5 by shifting the marker 8 from the recognition marker 27 to the alignment marker 5 by a distance a to perform alignment. Thereafter, the ACF 6 is solidified by heating and pressing from above the TAB 26.
[0016]
In the case of mounting as described above, the mounting position is confirmed by the recognition marker 27 around the ACF 6 and the alignment is performed by the alignment marker 5 in the ACF 6. Misrecognition due to the generated bubbles is eliminated, and since the alignment marker 5 is in the ACF 6, high-precision alignment can be performed at the closest part of the output electrode 7 and the terminal electrode 21.
[0017]
Method for mounting driver IC The method for mounting the driver IC 17 in the liquid crystal display device A having the above configuration will be described with reference to FIG. Specifically, a case will be described in which the driver IC terminal electrodes 22 are also formed in a pattern along with the terminal electrodes 21 on the non-display area 20 of the signal side substrate 12, and the electrode terminals of the driver IC 17 are mounted thereon.
[0018]
An area indicated by 23 is a mounting area for the driver IC 17 on the non-display area 20, and two rectangular alignment markers 24 are provided in the IC mounting area 23 as a pair. Two circular recognition markers 25 are provided. On the other hand, on the mounting surface of the driver IC 17, electrode terminals are provided at the same site so that the terminal electrode 21 and the driver IC terminal electrode 22 correspond to the pattern shape, and a marker having the same shape as the rectangular alignment marker 24 is also provided. It is provided at the same site. When the interval between the alignment marker 24 and the recognition marker 25 is expressed by the X coordinate axis and the Y coordinate axis, they are the interval c and the interval b, respectively.
[0019]
The driver IC 17 in which the electrodes and markers are thus formed is mounted on the signal side substrate 12 as follows.
[0020]
First, the ACF is transferred to the IC mounting portion 23 on the signal side substrate 12, the driver IC 17 is moved above the ACF, and the driver is recognized while recognizing the position of the recognition marker 25 with the camera provided on the back side of the signal side substrate 12. The IC 17 is arranged on the IC mounting unit 23. At that time, the midpoint of the pair of recognition markers 25 and the midpoint of the pair of markers on the driver IC 17 are finely adjusted so as to match the inclination between the pair of markers. Next, the alignment marker 24 and the marker on the driver IC 17 are overlapped with each other by being moved at an interval b, and alignment is performed. Thereafter, the ACF is solidified by heating and pressurizing from above the driver IC 17.
[0021]
Thus, even when the mounting is performed as described above, the mounting position is confirmed by the recognition marker 25 around the IC mounting portion 23, and the alignment is performed by the alignment marker 24 in the IC mounting portion 23. Since there is no false recognition due to bubbles generated at the interface, and the alignment marker 24 is in the IC mounting portion 23, it is possible to perform high-precision alignment at the closest part of the electrodes and terminals. did it.
[0022]
In addition, this invention is not limited to the said embodiment, A various change, improvement, etc. do not interfere in the range which does not deviate from the summary of this invention. For example, the display device has been described as a liquid crystal display device. However, the present invention is not limited to this, and the same effect can be obtained when a driver IC, FPC, or the like is connected to another display device such as an EL using an anisotropic conductive film. .
[0023]
【The invention's effect】
As described above, according to the display device and the manufacturing method thereof of the present invention, the driver IC and the FPC are provided via the ACF on the extended electrode part on the non-display part region of the substrate having the display part such as liquid crystal or EL. When mounting, a marker having a different shape is provided in and around the ACF placement area on the non-display area, so that when mounting the driver IC or FPC, the ACF is placed by camera or visual observation. By detecting the marker around the installation site and placing it on the mounting site, and then aligning with the marker around the ACF installation site, misrecognition due to bubbles generated at the interface due to the ACF is eliminated. , Increase the mounting accuracy of driver ICs and FPCs, thereby increasing the manufacturing yield and lowering the production cost, resulting in the provision of a low-cost and highly reliable display device We were.
[Brief description of the drawings]
FIG. 1 is a plan view of a liquid crystal display device of the present invention.
FIG. 2 is a cross-sectional view taken along line XX shown in FIG.
FIG. 3 is a plan view of another liquid crystal display device of the present invention.
FIG. 4 is a plan view of the vicinity of an FPC mounting site in the liquid crystal display device of the present invention.
FIG. 5 is a plan view of the vicinity of a mounting portion of a driver IC in the liquid crystal display device of the present invention.
FIG. 6 is a plan view of the vicinity of a TAB mounting portion in a conventional liquid crystal display device.
[Explanation of symbols]
1,26 TAB
2, A, B Liquid crystal display device 3 Glass substrate 4 Input electrode 5, 24 Alignment marker 25, 27 Recognition marker 6 ACF
7 Output electrode 9, 10 Transparent electrode 11 Scanning side substrate 12 Signal side substrate 17 Driver IC
19 Display portion 20 Non-display portion area 21 Terminal electrode 22 Driver IC terminal electrode 23 IC mounting portion

Claims (3)

A substrate having a display portion, a non-display portion, and a large number of first electrodes extending from the display portion to the non-display portion;
A mounting body having a plurality of second electrodes electrically connected to the first electrode located in the non-display portion via an anisotropic conductive film,
The mounting body includes a pair of markers that are spaced apart from the second electrode,
The substrate is disposed to face the marker of the mounting body with the anisotropic conductive film interposed therebetween, and a pair of alignment markers that are spaced from the first electrode and the anisotropic conductive film. A display device , further comprising: a recognition marker arranged outside the film region and spaced from the alignment marker so as to correspond to the alignment marker . 2. The display device according to claim 1, wherein the recognition marker is disposed at a position that is substantially translated from the alignment marker toward an extending direction of the first electrode. A display unit, a non-display unit, a number of first electrodes extending from the display unit to the non-display unit, an alignment marker arranged at a distance from the first electrode, and the non-display unit An anisotropic conductive film disposed so as to cover the first electrode extended to the alignment marker, and the anisotropic conductive film disposed outside the region of the anisotropic conductive film so as to correspond to the alignment marker A plurality of second electrodes provided corresponding to the first electrodes located in the non-display section, and preparing a transparent substrate having the alignment markers and recognition markers arranged at intervals, Preparing a mounting body having a marker provided corresponding to the alignment marker;
Aligning the recognition marker on the substrate and the marker on the mounting body;
Aligning the marker of the mount and the alignment marker of the substrate so as to face each other through the anisotropic conductive film by relatively moving the mount and the substrate; ,
And a step of mounting the mounting body on the substrate.

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