JP3798716B2 - Semiconductor circuit device and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor circuit device and a manufacturing method thereof.
[0002]
[Prior art]
Inspections such as semiconductor chip operation confirmation include contact-type function confirmation and non-contact-type function confirmation, and are performed as follows. 11 and 12 show a contact type inspection method. FIG. 11 shows the semiconductor chip on the semiconductor wafer before the dicing process. FIG. 12 shows an inspection method using a contact type inspection apparatus. As shown in FIG. 11, a large number of semiconductor chips 1 a, 1 b, 1 c, and 1 d are provided on the semiconductor wafer 3. A scribe line 2 is provided between each of the semiconductor chips 1a, 1b, 1c, and 1d in a dicing process. For further inspection, a connection terminal 6 or a test terminal 7 is provided on each scribe line 2 on each semiconductor chip 1.
[0003]
In the contact type inspection apparatus, as shown in FIG. 12, the pin 4 is brought into direct contact with the connection terminal 6 or the test terminal 7 for inspection. Therefore, it is possible to accurately inspect each semiconductor chip 1. However, handling is difficult, and there is a problem that the semiconductor chip 1 is accidentally damaged during handling. Further, it is difficult to adjust the pressure when the pin 4 is brought into contact with the connection terminal 6 or the test terminal 7.
[0004]
Next, FIGS. 13 and 14 show a non-contact type inspection method. As shown in FIG. 13, the communication coil 5 is provided on the semiconductor chip 1. The communication coil 5 and the connection terminal 6 are connected by a wiring 8. By using this communication coil 5, signals can be input and output externally and wirelessly. Thereby, the semiconductor chip 1 can be inspected in a non-contact manner. Therefore, there is no risk of damaging the semiconductor chip 1.
[0005]
FIG. 14 shows an inspection method using a non-contact type inspection apparatus. First, by using the head 9, an inspection signal is wirelessly transmitted to the semiconductor chip 1a mounted on the semiconductor wafer 3 to be inspected. The function of the semiconductor chip 1a is inspected by receiving an output signal from the semiconductor chip 1a corresponding to the inspection signal. By moving the semiconductor wafer 3 or the head 9, all the semiconductor chips 1 on the semiconductor wafer 3 can be inspected.
[0006]
However, the interval between the semiconductor chips 1a and 1b is very narrow, usually about 110 μm. On the other hand, the communication distance of the semiconductor chip is usually 1.5 mm or more. For this reason, when an inspection signal is transmitted from the head 9 to one semiconductor chip 1a, the inspection signal is also received, for example, by the semiconductor chip 1b adjacent thereto. Therefore, the semiconductor chip 1a and the adjacent semiconductor chip 1b also transmit output signals to the head 9. Therefore, the head 9 cannot receive only the signal of the semiconductor chip 1a to be inspected, which hinders the inspection. That is, there is a problem that the function confirmation for each semiconductor chip cannot be performed with high accuracy.
[0007]
[Problems to be solved by the invention]
As described above, the conventional semiconductor device has a problem that the semiconductor chip is damaged in the inspection process and a problem that the inspection cannot be performed with high accuracy.
[0008]
The present invention has been made to solve such problems, and it is an object of the present invention to provide a semiconductor circuit device that can be inspected with high accuracy without damaging a semiconductor chip and a method of manufacturing the same.
[0009]
[Means for Solving the Problems]
A semiconductor circuit device according to the present invention includes:
In the semiconductor wafer state before being cut into a plurality of semiconductor chips,
On this semiconductor wafer (for example, the semiconductor wafer 3 in the present embodiment), the semiconductor chip (for example, the semiconductor chip 1 in the present embodiment) is used only for semiconductor chip inspection, and is cut into the plurality of semiconductor chips. after the communication coil that stops the functions (e.g., communication coil 5 in this embodiment) which is a semiconductor circuit device having a. With such a configuration, the inspection can be performed with high accuracy without damaging the semiconductor chip in the inspection process.
[0010]
The communication coil described above is desirably provided in a region other than the semiconductor chip. Thereby, an inspection can be performed with high accuracy without damaging the semiconductor chip.
[0011]
The communication coil described above may be provided on a scribe line. As a result, the inspection can be performed with high accuracy without damaging the semiconductor chip.
[0012]
It is desirable that a part of the wiring connecting the communication coil and the semiconductor chip is provided on the scribe line. As a result, the inspection can be performed with high accuracy without damaging the semiconductor chip.
[0013]
It is desirable that the communication distance of the above-described communication coil is a distance that does not affect when inspecting adjacent chips. This makes it possible to perform inspections with high accuracy. [0014]
A semiconductor chip can be obtained by cutting the semiconductor circuit device described above with a scribe line.
[0015]
A method for manufacturing a semiconductor circuit device according to the present invention includes:
Forming a semiconductor chip on a semiconductor wafer and a communication coil used only for inspection of the semiconductor chip;
Inspecting the semiconductor chip via the communication coil;
A method for manufacturing a semiconductor circuit device comprising the steps of dicing the wafer to cut out the semiconductor chip and stopping the function of the communication coil. With this manufacturing method, it is possible to manufacture a semiconductor circuit device that can be accurately inspected without damaging the semiconductor chip.
[0016]
The step of stopping the function of the communication coil may include the step of removing all or part of the communication coil. By doing so, the inspection can be performed with high accuracy without damaging the semiconductor chip.
[0017]
The step of stopping the function of the communication coil may include a step of cutting a part of the wiring connecting the communication coil and the semiconductor chip. By doing so, the inspection can be performed with high accuracy without damaging the semiconductor chip.
[0018]
According to the manufacturing method described above, it is possible to manufacture a semiconductor circuit device that can be accurately inspected without damaging the semiconductor chip.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 of the Invention
[0020]
1 and 2 show a configuration on the semiconductor wafer before the semiconductor chip having the semiconductor circuit device according to the first embodiment is cut. FIG. 1 is a plan view of the semiconductor wafer 3. Many semiconductor chips 1 are arranged on the semiconductor wafer 3. FIG. 2 is an enlarged view of a round frame portion provided with one semiconductor chip on the semiconductor wafer 3 shown in FIG. Here, the reference numerals 1a and 1b with alphabets indicate the respective semiconductor chips 1. Although only two semiconductor chips 1 a and 1 b are shown in FIG. 2, a large number of semiconductor chips 1 are actually arranged on the semiconductor wafer 3. A scribe line 2 is provided between the semiconductor chips 1 (for example, between the semiconductor chips 1a and 1b). The width of this scribe line is usually about 110 μm. And the communication coil 5, the connection terminal 6, and the wiring 8 which are used only for a test | inspection in the process of manufacturing the semiconductor chip 1 were formed. In the present embodiment, the communication coil 5 is provided on a semiconductor chip. Further, since the communication coil 5 is used only for inspection, the function of the semiconductor chip 1 is not affected. Here, the communication coil 5 is a rectangular spiral coil, and is formed on the formation surface side of the connection terminal of the semiconductor chip 1 via an insulating surface protective film. The connection terminal 6 is also provided on the semiconductor chip 1. This connection terminal 6 is connected to a lead terminal such as a lead frame by a metal wire in a lead bonding process after the dicing process. Further, the wiring 8 is provided so that the communication coil 5 and the connection terminal 6 are electrically connected. Here, two wires 8 are connected to the communication coil 5, and one of the wires 8 is connected to the connection terminal 6 via the scribe line 2. That is, a part of the wiring 8 is provided on the scribe line 2.
[0021]
Next, FIG. 3 shows a non-contact inspection method for a semiconductor chip having a semiconductor circuit device according to the present invention. Reference numeral 9 denotes a head of a semiconductor inspection apparatus. The head 9 outputs an inspection signal to the semiconductor chip 1a wirelessly with respect to the communication coil 5 described above. The function of the semiconductor chip 1a is inspected by receiving an output signal from the semiconductor chip 1a. Then, the semiconductor chip 1 on the semiconductor wafer 3 is inspected by moving the head 9 or the semiconductor wafer 3. Thereby, the function test of the semiconductor chip 1 can be performed in a non-contact manner, and there is no possibility of damaging the semiconductor chip 1. Since the communication coil 5 is used only for inspection, the function of the semiconductor chip 1 is not affected. Accordingly, the communication distance can be freely selected. Therefore, by setting the communication distance to a distance that is not affected by the adjacent semiconductor chip, a signal is not erroneously output when the adjacent semiconductor chip is inspected, and the inspection can be performed with high accuracy.
[0022]
In the dicing process after the inspection process, the semiconductor wafer 3 is cut along the scribe line 2 with a diamond cutter, chopped for each semiconductor chip, and packed in a tray. At this time, as indicated by a dotted line in FIG. 4, a part of the wiring 8 provided on the scribe line 2 is also cut, so that the function of the communication coil 5 can be stopped. By cutting the wiring 8 in the dicing process, it is not necessary to add a new process for stopping the function of the communication coil 5 and the productivity is not lowered.
[0023]
In Embodiment 1 of the present invention, only one of the two wires 8 connected to the communication coil 5 is connected to the connection terminal 6 via the scribe line 2. The same effect can be obtained by connecting to the connection terminal 6 via the top.
[0024]
Embodiment 2 of the Invention
5 and 6 show the configuration on the semiconductor wafer before the semiconductor chip having the semiconductor circuit device according to the second embodiment is cut. 1 and 2 are the same as or equivalent to those in FIGS. 1 and 2, and thus the description thereof is omitted.
[0025]
FIG. 5 is a plan view of the semiconductor wafer 3. FIG. 6 is an enlarged view of the boundary portion between the portion of the semiconductor wafer 3 where the semiconductor chip 1 is provided and the portion where the semiconductor chip 1 is not provided at the end of the semiconductor wafer 3, as indicated by the round frame in FIG. 5. The communication coil 5 is provided in a region where the semiconductor chip 1 is not formed at the end of the semiconductor wafer 3. Since part of the wiring 8 is also connected to the communication coil 5, it is in a region where the semiconductor chip 1 is not provided. One end of the wiring 8 is connected to the connection terminal 6, and the other terminal is connected to another connection terminal 6. By using this communication coil 5 as in the first embodiment, wireless non-contact inspection is possible. Further, by setting the communication distance of the communication coil 5 to a short distance that does not interfere with the adjacent semiconductor chip 1, an accurate non-contact inspection can be performed.
[0026]
FIG. 7 shows the semiconductor chip 1 after dicing. Since the communication coil 5 is provided in a region other than the semiconductor chip 1 as shown in FIG. 7, the communication coil 5 is removed when shredding. Therefore, it is not necessary to add a new process for stopping the function of the communication circuit 5, and the productivity is not lowered.
Embodiment 3 of the Invention
FIG. 8 shows the configuration on the semiconductor wafer before the semiconductor chip having the semiconductor circuit device according to the third embodiment is cut. 1 and 2 are the same as or equivalent to those in FIGS. 1 and 2, and thus the description thereof is omitted.
[0028]
FIG. 8 is an enlarged view showing a portion where the semiconductor chip 1 is formed on the semiconductor wafer 3 (a portion corresponding to a portion indicated by a round frame of the semiconductor wafer in FIG. 1). The communication coil 5 is provided on the scribe line 2 between the semiconductor chips 1. Since the wiring 8 is connected to the communication coil 5, a part of the wiring 8 is provided on the scribe line 2. One end of the wiring 8 is connected to the connection terminal 6, and the other terminal is connected to another connection terminal 6. By using this communication coil 5 as in the first and second embodiments, wireless non-contact inspection is possible. Further, since this communication coil 5 is used only for inspection, its communication distance can be freely selected. Therefore, the non-contact inspection with high accuracy is possible by setting the communication distance to a short distance that does not interfere with the adjacent semiconductor chip 1.
[0029]
FIG. 9 shows the semiconductor chip 1 after dicing. Since the communication coil 5 is provided on the scribe line 2, the communication coil 5 is removed when chopping. Therefore, it is not necessary to add a new process for stopping the function of the communication coil 5, and productivity is not lowered.
Other Embodiments [0030]
In addition to the embodiment described above, the same effect can be obtained if at least a part of the communication coil 5 or a part of the wiring 8 is provided in a region other than the semiconductor chip 1. For example, it is possible to adopt a configuration in which the communication coil 5 is provided at the boundary between the semiconductor chip 1 and the scribe line 2, that is, a configuration in which only a part of the communication coil is provided on the scribe line 2. By adopting such a configuration, a part of the communication coil 5 can be removed in the dicing process, so that the same effect can be obtained.
[0031]
Further, as shown in FIG. 10, the communication coil 5 may be formed on the outer periphery of the circuit of the semiconductor chip 1 and the connection terminal 6, and a part or all of the communication coil 5 may be provided on the scribe line 2. If such a configuration is adopted, the outer peripheral portion of the communication coil 5 can be cut in the dicing step, and the same effect can be obtained.
[0032]
As another example, the whole or a part of the connection terminal 6 is provided on the scribe line 2 and the wiring 8 connected to the connection terminal 6 is provided on the scribe line 2. Is also possible. With such a configuration, the connection terminal 6 and a part of the wiring 8 can be cut off in the dicing process, so that the same effect can be obtained.
[0033]
Since the communication coil 5 described above is used only for the inspection of the semiconductor chip 1, the function of the semiconductor chip 1 is not affected. Therefore, the communication distance can be freely selected. By making the communication distance short, it is possible to prevent mutual signal interference. By doing so, it is possible to prevent mutual communication interference between the semiconductor chips 1. Further, since the non-contact inspection can be performed by the communication coil 5, handling of the pins 4 is not necessary, and the function can be confirmed without damaging the semiconductor chip 1.
[0034]
It is desirable that the communication coil 5 described above is formed into a spiral coil via an insulating surface protective film such as a silicon oxide film or a resin film on the side where the connection terminal 6 is formed. Moreover, the conductor which comprises the communication coil 5 can be formed by a metal sputter layer, a metal vapor deposition layer, a metal plating layer, or these combinations. Furthermore, it is desirable to have a multilayer structure having a metal sputter layer or a metal vapor deposition layer and a metal plating layer. The metal sputter layer or metal vapor deposition layer may be formed of a metal selected from Al, Cr, Ni, or Cu or an alloy of two or more metals selected from these metal groups. In addition to a uniform single layer film, a multilayer structure in which different metal layers or alloy layers are stacked in multiple layers can be employed. On the other hand, the metal plating is preferably formed of copper, and can be formed by electroless plating, electroplating, or precision electroforming.
[0035]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the semiconductor circuit device which can test | inspect with high precision, without damaging a semiconductor chip, and its manufacturing method can be provided.
[Brief description of the drawings]
1 is a plan view of a semiconductor wafer having a semiconductor circuit device according to a first embodiment of the present invention;
FIG. 2 is a configuration diagram showing a semiconductor chip having a semiconductor circuit device according to a first embodiment of the present invention;
FIG. 3 is a schematic view when a semiconductor chip according to the present invention is inspected in a non-contact manner.
FIG. 4 is a configuration diagram after a dicing process of a semiconductor chip having the semiconductor circuit device according to the first embodiment of the present invention;
FIG. 5 is a plan view of a semiconductor wafer having a semiconductor circuit device according to a second embodiment of the present invention;
6 is a configuration diagram showing a semiconductor chip having a semiconductor circuit device according to a second embodiment of the present invention; FIG.
FIG. 7 is a configuration diagram after a dicing process of a semiconductor chip having a semiconductor circuit device according to a second embodiment of the present invention;
FIG. 8 is a configuration diagram showing a semiconductor chip having a semiconductor circuit device according to a third embodiment of the present invention;
FIG. 9 is a configuration diagram after a dicing process of a semiconductor chip having a semiconductor circuit device according to a third embodiment of the present invention;
FIG. 10 is a configuration diagram showing a semiconductor chip having a semiconductor circuit device according to another embodiment of the present invention.
FIG. 11 is a configuration diagram showing a semiconductor chip to be inspected by a contact method.
FIG. 12 is a schematic view when a semiconductor chip is inspected by a contact method.
FIG. 13 is a block diagram showing a semiconductor chip having a semiconductor circuit device according to the prior art.
FIG. 14 is a schematic view when a semiconductor chip having a semiconductor circuit device according to the prior art is inspected in a non-contact manner.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Semiconductor chip 2 Scribe line 3 Semiconductor wafer 4 Pin 5 Communication coil 6 Connection terminal 7 Test terminal 8 Wiring 9 Head

Claims (10)

In the semiconductor wafer state before being cut into a plurality of semiconductor chips,
The semiconductor chip on the semiconductor wafer,
Is used only on the semiconductor chip inspection, the semiconductor circuit apparatus having a communication coil to Suspend function after being cut into the plurality of semiconductor chips.   The semiconductor circuit device according to claim 1, wherein the communication coil is provided in a region other than the semiconductor chip.   2. The semiconductor circuit device according to claim 1, wherein all or part of the communication coil is provided on a scrub line. The semiconductor circuit device according to claim 1, wherein a part of the wiring connecting the communication coil and the semiconductor chip is provided on the scrub line.   5. The semiconductor circuit device according to claim 1, wherein a communication distance of the communication coil is a distance that does not affect the adjacent semiconductor chip. Claims 1 to semiconductor chips obtained by carving the fifth semiconductor circuit device according to any one at scrub line. Forming a semiconductor chip on a semiconductor wafer and a communication coil used only for semiconductor chip inspection;
Inspecting the semiconductor chip via the communication coil;
A method of manufacturing a semiconductor circuit device, comprising: dicing the semiconductor wafer to cut out the semiconductor chip and stopping the function of the communication coil . The step of stopping the function of the communication coil includes:
8. The method of manufacturing a semiconductor circuit device according to claim 7, further comprising the step of removing all or part of the communication coil. The step of stopping the function of the communication coil includes:
8. The method of manufacturing a semiconductor circuit device according to claim 7, further comprising a step of cutting a part of a wiring connecting the communication coil and the semiconductor chip.   A semiconductor circuit device manufactured by the manufacturing method according to claim 7.

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