JP3790250B2 - Continuous production method of double-sided conductor polyimide laminate - Google Patents
Continuous production method of double-sided conductor polyimide laminate Download PDFInfo
- Publication number
- JP3790250B2 JP3790250B2 JP2004009531A JP2004009531A JP3790250B2 JP 3790250 B2 JP3790250 B2 JP 3790250B2 JP 2004009531 A JP2004009531 A JP 2004009531A JP 2004009531 A JP2004009531 A JP 2004009531A JP 3790250 B2 JP3790250 B2 JP 3790250B2
- Authority
- JP
- Japan
- Prior art keywords
- sided conductor
- roll
- polyimide
- laminate
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920001721 polyimide Polymers 0.000 title claims description 72
- 239000004020 conductor Substances 0.000 title claims description 60
- 239000004642 Polyimide Substances 0.000 title claims description 47
- 238000000034 method Methods 0.000 title claims description 19
- 238000010924 continuous production Methods 0.000 title claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 50
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 239000011888 foil Substances 0.000 claims description 38
- 239000009719 polyimide resin Substances 0.000 claims description 35
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 230000003746 surface roughness Effects 0.000 claims description 13
- 230000009477 glass transition Effects 0.000 claims description 9
- 238000004804 winding Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 239000012298 atmosphere Substances 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 5
- 238000005524 ceramic coating Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 58
- 239000002243 precursor Substances 0.000 description 18
- 239000011347 resin Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- 229920006259 thermoplastic polyimide Polymers 0.000 description 12
- 230000037303 wrinkles Effects 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 238000001816 cooling Methods 0.000 description 8
- 239000012212 insulator Substances 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 238000003786 synthesis reaction Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
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- 238000000576 coating method Methods 0.000 description 5
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 150000003949 imides Chemical group 0.000 description 4
- 229920005575 poly(amic acid) Polymers 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000013585 weight reducing agent Substances 0.000 description 3
- XFDUHJPVQKIXHO-UHFFFAOYSA-N 3-aminobenzoic acid Chemical compound NC1=CC=CC(C(O)=O)=C1 XFDUHJPVQKIXHO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241000989747 Maba Species 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
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- 229910052759 nickel Inorganic materials 0.000 description 2
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- YDYSEBSNAKCEQU-UHFFFAOYSA-N 2,3-diamino-n-phenylbenzamide Chemical compound NC1=CC=CC(C(=O)NC=2C=CC=CC=2)=C1N YDYSEBSNAKCEQU-UHFFFAOYSA-N 0.000 description 1
- ZNVDOKOOMPHOSP-UHFFFAOYSA-N 4-amino-n-(4-amino-2-methoxyphenyl)benzamide Chemical compound COC1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 ZNVDOKOOMPHOSP-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
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- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
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- 230000002950 deficient Effects 0.000 description 1
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- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
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- 229920001971 elastomer Polymers 0.000 description 1
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- 239000006260 foam Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
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- 125000005843 halogen group Chemical group 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- ZHDTXTDHBRADLM-UHFFFAOYSA-N hydron;2,3,4,5-tetrahydropyridin-6-amine;chloride Chemical compound Cl.NC1=NCCCC1 ZHDTXTDHBRADLM-UHFFFAOYSA-N 0.000 description 1
- 238000006358 imidation reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1432—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface direct heating of the surfaces to be joined
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- B29C65/1458—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface scanning at least one of the parts to be joined once, i.e. contour welding
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
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- B29C66/01—General aspects dealing with the joint area or with the area to be joined
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H05K1/0346—Organic insulating material consisting of one material containing N
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Description
本発明は、電子機器類の小型化、軽量化の要請に対応した配線材料としてのフレキシブルプリント基板等に好適な両面導体ポリイミド積層体の連続製造方法に関し、特に加熱プレスロールを利用したシワの発生のない、しかも品質バラツキもないロール巻き製品として安定生産が可能な両面導体ポリイミド積層体の連続製造方法に関する。 The present invention relates to a continuous production method of a double-sided conductor polyimide laminate suitable for a flexible printed circuit board as a wiring material in response to the demand for downsizing and weight reduction of electronic devices, and particularly wrinkle generation using a hot press roll. The present invention relates to a continuous production method for a double-sided conductor polyimide laminate that can be stably produced as a rolled product with no quality variation.
近年、高機能化する携帯電話やデシタルカメラ、ナビゲーター、その他の各種電子機器類の小型化、軽量化の進展に伴って、これらに使用される電子配線材料としてのフレキシブルプリント基板(配線基板)の小型高密度化、多層化、ファイン化、低誘電化等の要請が高まっている。このフレキシブルプリント配線基板については、以前はポリイミドフイルムと金属箔とを低温硬化可能な接着剤で張り合わせて製造されていたが、接着剤層が配線基板としての特性の低下、特にポリイミドベースフイルムの優れた耐熱性、難燃性等を損ねるという問題がある。さらに接着剤層を有する他の問題として配線の回路加工性が悪くなるという問題もある。 In recent years, with the progress of miniaturization and weight reduction of highly functional mobile phones, digital cameras, navigators, and other various electronic devices, flexible printed circuit boards (wiring boards) as electronic wiring materials used for them have been developed. There is an increasing demand for smaller, higher density, multilayer, finer, and lower dielectric constants. This flexible printed circuit board was previously manufactured by bonding polyimide film and metal foil together with an adhesive that can be cured at low temperature. However, the adhesive layer has reduced characteristics as a wiring board, especially the superiority of polyimide base film. There is a problem that the heat resistance and flame retardancy are impaired. Another problem with the adhesive layer is that the circuit processability of the wiring is deteriorated.
具体的には、スルーホール加工時のドリリングによる樹脂スミアの発生や、導体スルーホール加工時の寸法変化率が大きい等の問題が挙げられる。特に両面スルーホール構造の場合、絶縁体層であるベースフイルムを中心にその両面に接着剤を介して導体の銅箔等を貼り合わせて形成されたものは、片面構造のフレキシブルプリント基板と比較して一般的にその柔軟性が低いという問題がある。一方、ICの高密度化、プリント配線の微細化や高密度化に伴い、発熱が大きくなり、良熱伝導体を貼り合わせることが必要になる場合がある。また、よりコンパクトにするため、ハウジングと配線を一体化する方法もある。さらには、電気容量の異なった配線を必要としたり、より高温に耐える配線材を必要とすることもある。そこで、接着剤を使用しないで硬化前のポリアミック酸溶液を銅箔等の導体に直接塗布し、加熱して硬化させるフレキシブルプリント基板の製造方法が種々提案されている。 Specifically, there are problems such as generation of resin smear due to drilling during through-hole processing and a large dimensional change rate during conductor through-hole processing. In particular, in the case of a double-sided through-hole structure, what is formed by laminating copper foil, etc. of a conductor through an adhesive on both sides of the base film as an insulator layer is compared with a flexible printed board with a single-sided structure. In general, there is a problem that its flexibility is low. On the other hand, heat generation increases with the increase in the density of ICs and the miniaturization and density of printed wiring, and it may be necessary to attach a good heat conductor. There is also a method of integrating the housing and the wiring in order to make it more compact. Furthermore, wiring with different electric capacities may be required, or wiring materials that can withstand higher temperatures may be required. Therefore, various methods for producing a flexible printed board have been proposed in which a polyamic acid solution before curing is directly applied to a conductor such as a copper foil without using an adhesive, and is cured by heating.
例えば、硬化物の線膨張係数が3.0×10-5以下のジアミンとテトラカルボン酸無水物で合成されるポリアミック酸を金属箔に塗布し加熱硬化させるもの(例えば特許文献1参照)や、特定構造単位を有するボリアミドイミド前駆体化合物を含有する樹脂溶液を導体上に塗布してイミド化するもの(例えば特許文献2参照)、ジアミノベンズアニリド又はその誘導体を含むジアミン類と芳香族テトラカルボンサンとの反応で得られる構造単位を有する絶縁材の前駆体溶液を導体上に直接塗布して硬化させるもの(例えば特許文献3参照)等が挙げられる。さらに金属箔との密着性を高めるために導体上に複数のポリイミド前駆体樹脂溶液を用いて、複数回塗布と乾燥を行うことによって複数のポリイミド樹脂層を有するフレキシブルプリント配線用基板を製造する方法(例えば特許文献4参照)も提案されている。 For example, a polyamic acid synthesized with a diamine having a linear expansion coefficient of 3.0 × 10 −5 or less and a tetracarboxylic acid anhydride applied to a metal foil and cured by heating (for example, see Patent Document 1), A resin solution containing a polyamidoimide precursor compound having a specific structural unit is applied onto a conductor to imidize (see, for example, Patent Document 2), a diamine containing diaminobenzanilide or a derivative thereof, and an aromatic tetracarboxylicsan Examples include those in which a precursor solution of an insulating material having a structural unit obtained by the above reaction is directly applied on a conductor and cured (for example, see Patent Document 3). Further, a method for producing a flexible printed wiring board having a plurality of polyimide resin layers by applying and drying a plurality of times using a plurality of polyimide precursor resin solutions on a conductor in order to improve adhesion to a metal foil (For example, see Patent Document 4) has also been proposed.
これらのフレキシブルプリント配線基板は、導電性金属箔の片面側のみに接着剤なしで絶縁体層を加熱硬化にて接着させた片面構造に関するものである。一方、電子機器類の小型化、軽量化に対応して本発明者等は、先に導電性金属箔(M1)の片面に少なくとも三層のポリイミド層を有する片面導体積層体を使用し、そのポリイミド層に導電性金属箔(M2)を加熱加圧下に積層する両面導体ポリイミド積層体の製造方法(例えば特許文献5参照)を提案している。かかる両面導体積層体は特に基板の両面に配線回路を形成することが可能であり、高密度実装のために既に実用化されて近年では種々の分野で多く採用されている。
上記の特許文献5における両面導体ポリイミド積層体の製造方法では、熱プレス装置等を利用したバッチ方式の具体例を開示している。このバッチ方式の熱プレス装置等では熱板と呼ばれる台座の上に、片面導体積層体と導電性金属箔の組合わせを複数層同時に載せ加熱圧着するものである。通常の加熱は、熱板内に配置した電気ヒーターによって行われ、圧力は油圧により台座が押し上げられシートを通じて上部台座に圧力を伝達させて所定圧力を維持する。かかる熱板ではヒーターの温度ばらつきが大きいことから、種々の補正を行っても加熱不足や加熱過剰により部分的に不良箇所が発生する場合がある。
In the above-described method for producing a double-sided conductor polyimide laminate in
また複数層同時に処理する場合、長時間の加熱により積層樹脂層の劣化が促進され、品番毎の最適条件が狭い非常に不安定なプロセスであった。さらに積層基材は常温から加熱加圧して一定温度に達した後冷却するバッチ方式のサイクルを繰返して生産されるために生産効率が低いだけでなく、積層基材の裁断作業が必要であり、この時点で異物を巻き込みやすく、異物が付着した場合、積層したもの全てに異物の形状が転写する外観不良を起こすことが多かった。そこで連続方式による品質の安定した両面導体ポリイミド積層体の製造方法が強く要請されている。 Moreover, when processing several layers simultaneously, deterioration of the lamination resin layer was accelerated | stimulated by long-time heating, and it was a very unstable process with the narrow optimal conditions for every product number. Furthermore, since the laminated base material is produced by repeating a batch-type cycle in which it is heated and pressurized from room temperature to reach a certain temperature and then cooled, not only the production efficiency is low, but the laminated base material needs to be cut, At this time, foreign matters are easily caught, and when foreign matters adhere, there are many appearance defects in which the shape of the foreign matter is transferred to all the stacked layers. Therefore, there is a strong demand for a method for producing a double-sided conductor polyimide laminate with stable quality by a continuous method.
本発明者等は、先に提案した特許文献5における両面導体ポリイミド積層体の製造方法における熱プレス装置等を利用したバッチ方式に代えて、一対の加熱プレスロールによる加熱圧着により両面導体ポリイミド積層体を連続製造する方法について検討を進めた結果、プレスロール間への装入前における基材の搬送条件や予熱手段とプレスロール出口からの搬送条件や冷却手段が適切でないと基材が通過中に熱膨張・冷却収縮起因の格子じわ、集束じわ等の10種類近いシワの発生が見られること、またロール面があまりに平滑度が高い状態では基材とロール面との密着度が強くなって走行中に巻き付きによる複雑なシワ(以下、トラレと称する)や不純物に起因するピット(製品表面に数十ミクロンの打痕)等が多数発生しやすいこと等の種々の解決すべき課題のあることがわかった。
The present inventors, instead of the batch method using the hot press apparatus and the like in the method for producing a double-sided conductor polyimide laminate in
従って、本発明の目的は、ポリイミド系樹脂層の両面に接着剤を介することなく導電性金属層を積層した縦じわ等の外観不良のない品質の安定した両面導体ポリイミド系積層体の連続製造方法を提供することにある。また、本発明の他の目的は、特にユーザーからの要望の強い優れた配線回路加工性を有し、また、配線回路基板として優れた耐熱性や可撓性を有する両面導体ポリイミド積層体をロール巻き状態にて製造する方法を提供することにある。 Therefore, the object of the present invention is to continuously manufacture a double-sided conductor polyimide-based laminate having a stable quality without appearance defects such as vertical wrinkles in which conductive metal layers are laminated without using an adhesive on both sides of the polyimide-based resin layer. It is to provide a method. Another object of the present invention is to roll a double-sided conductor polyimide laminate having excellent heat resistance and flexibility as a printed circuit board, which has excellent wiring circuit workability that is particularly demanded by users. It is providing the method of manufacturing in a winding state.
本発明者らは、上記課題について鋭意検討した結果、加熱プレスロール間に導入直前の片面導体積層体と導電性金属箔(M2)を特定温度に予備加熱すること、プレスロール表面を特定の表面粗さ(Ra)に粗面化処理したものを使用することにより、上記の目的が達成されることを見出し本発明を完成した。 As a result of intensive studies on the above problems, the inventors of the present invention preliminarily heated the single-sided conductor laminate and the conductive metal foil (M 2 ) immediately before introduction between heated press rolls to a specific temperature, and specified the press roll surface. The present invention was completed by finding that the above-mentioned object was achieved by using a surface roughened surface roughness (Ra).
すなわち本発明は、
(1)導電性金属箔(M1)上にベース層、中間メイン層、トップ層の少なくとも三層のポリイミド系樹脂層を有する片面導体積層体と導電性金属箔(M2)とからなるそれぞれの導入基材を連続的に一対の加熱プレスロール間に導入し、上記トップ層に導電性金属箔(M2)を加熱圧着により積層一体化させる両面導体ポリイミド積層体の製造方法において、加熱プレスロール間に導入直前の片面導体積層体と導電性金属箔(M2)をそれぞれ200℃以上〜トップ層のポリイミド系樹脂のガラス転移点以下に予備加熱後に、平均表面粗さ(Ra)が0.01μmよりも大きく、5μm以下に粗面化処理される加熱プレスロール表面に接触させることを特徴とする両面導体ポリイミド積層体の連続製造方法である。
That is, the present invention
(1) a conductive metal foil (M 1) base layer over the intermediate main layer, single-sided conductor laminate and the conductive metal foil having a polyimide resin layer of at least three layers of the top layer (M 2) and consisting, respectively In the method for producing a double-sided conductor polyimide laminate, the conductive substrate is continuously introduced between a pair of heated press rolls, and the conductive metal foil (M 2 ) is laminated and integrated on the top layer by thermocompression bonding. The average surface roughness (Ra) is 0 after preheating the single-sided conductor laminate and the conductive metal foil (M 2 ) immediately before introduction between the rolls to 200 ° C. or more and below the glass transition point of the polyimide resin of the top layer, respectively. It is a continuous production method of a double-sided conductor polyimide laminate, characterized by contacting with the surface of a hot press roll that is roughened to a surface roughness greater than 0.01 μm and 5 μm or less .
(2)上記本発明における一対のプレスロール表面は、不活性ガス雰囲気下にてプレスロール表面温度を340〜390℃、プレスロール間の線圧50Kg/cm〜300Kg/cm(490〜2940N/cm)、通過時間2〜5秒間の条件下で加熱圧着することが望ましい。 (2) The pair of press roll surfaces in the present invention has a press roll surface temperature of 340 to 390 ° C. under an inert gas atmosphere, and a linear pressure between the press rolls of 50 kg / cm to 300 kg / cm (490 to 2940 N / cm). ), It is desirable to heat-press under the conditions of a passage time of 2-5 seconds.
(3)上記本発明における片面導体積層体と導電性金属箔(M2)はロール巻き状態から引き出してそれぞれ中心軸の高さが異なる複数のガイドロールを経由させて窒素雰囲気下の平面性を高めた状態で予備加熱されることが望ましい。 (3) The single-sided conductor laminate and the conductive metal foil (M 2 ) in the present invention have a flatness in a nitrogen atmosphere through a plurality of guide rolls that are drawn from the roll winding state and have different central axis heights. It is desirable to preheat in an elevated state.
(4)上記本発明における予備加熱は基材が加熱プレスロール面に接触する位置に配置された加熱手段内蔵のガイドロールによって行うことが望ましい。 (4) The preheating in the present invention is preferably performed by a guide roll with a built-in heating means disposed at a position where the substrate comes into contact with the heated press roll surface.
(5)上記本発明におけるロール表面にセラミック皮膜が溶射されて表面粗さ(Ra)が形成されていることが望ましい。 (5) It is desirable that a ceramic film is sprayed on the roll surface in the present invention to form a surface roughness (Ra).
かかる本発明によれば、加熱プレスロール間に導入前の片面導体積層体と導電性金属箔(M2)をそれぞれ不活性ガス雰囲気下にて200℃以上〜ガラス転移点以下の温度(好ましくは200〜350℃)で予備加熱後に加熱プレスロール表面に接触させることで、加熱圧着時の急激な温度上昇が緩和される結果、両面導体積層体の表面への縦すじ等の外観不良が防止される。また加熱プレスロールの表面粗さを特定条件に保持することで基材とロール面との密着度が減少することで走行中に巻き付きによる複雑なシワ(以下、トラレと称する)やピット(製品表面に数十ミクロンの打痕)等の発生も防止される。 According to the present invention, the single-sided conductor laminate and the conductive metal foil (M 2 ) before being introduced between the hot press rolls are each at a temperature of 200 ° C. or more to a glass transition point or less (preferably in an inert gas atmosphere). 200 to 350 ° C.), after preheating at the surface of the heated press roll, the rapid temperature rise at the time of thermocompression bonding is alleviated. As a result, appearance defects such as vertical stripes on the surface of the double-sided conductor laminate are prevented. The Also, by maintaining the surface roughness of the heated press roll under specific conditions, the degree of adhesion between the base material and the roll surface is reduced, so that complicated wrinkles (hereinafter referred to as “trails”) and pits (product surface) due to winding during running Furthermore, the occurrence of dents of several tens of microns is also prevented.
以下に本発明を詳細に説明する。先ず本発明において使用される導電性金属箔(M1とM2)としては、厚みが5〜150μmである銅、アルミニウム、鉄、銀、パラジウム、ニッケル、クロム、モリブデン、タングステン、亜鉛及びそれらの合金等を挙げることができ、好ましくは銅である。特に、剛性が低く加熱圧着による圧力制御が困難として使用が敬遠されていた圧延銅箔品も好適に使用できる。なお接着力の向上を目的として、その表面にサイディング、ニッケルメッキ、銅−亜鉛合金メッキ、あるいはアルミニウムアルコラート、アルミニウムキレート、シランカップリング剤等による化学的又は機械的な表面処理を施してもよい。 The present invention is described in detail below. First, as the conductive metal foil (M 1 and M 2 ) used in the present invention, copper, aluminum, iron, silver, palladium, nickel, chromium, molybdenum, tungsten, zinc, and their thicknesses of 5 to 150 μm are used. An alloy etc. can be mentioned, Preferably it is copper. In particular, a rolled copper foil product, which has low rigidity and is difficult to control pressure by thermocompression bonding, can be suitably used. For the purpose of improving the adhesion, the surface may be subjected to chemical or mechanical surface treatment with siding, nickel plating, copper-zinc alloy plating, aluminum alcoholate, aluminum chelate, silane coupling agent or the like.
ここでかかる導電性金属箔(M1)の片面に絶縁体層としてポリイミド系樹脂が接着剤なしに加熱硬化して接着させた片面導体積層体としては、前記特許文献1〜4や5で開示された公知のものを利用することができる。絶縁体層として使用されるポリイミド系樹脂とは、イミド環構造を有する樹脂の総称であり、例えばポリイミド、ポリアミドイミド、ポリエステルイミドなどが挙げられる。そして、ポリイミド系樹脂層としては、前記特許文献1〜4に記載したような低熱膨張性のものや、加熱すると溶融若しくは軟化する熱可塑性ポリイミド等が利用でき特に限定されない。しかし特に好ましい絶縁体層は、特許文献5に記載されたポリイミド前駆体樹脂溶液の加熱硬化で得られた熱可塑性ポリイミド系樹脂からなるベース層と低熱膨張性ポリイミド系樹脂からなる中間メイン層及び熱可塑性ポリイミド系樹脂からなるトップ層の少なくとも三層のポリイミド系樹脂層からなるものが望ましい。
The single-sided conductor laminate in which a polyimide resin is heated and cured without an adhesive as an insulator layer on one side of the conductive metal foil (M 1 ) is disclosed in Patent Documents 1 to 4 and 5 described above. Can be used. The polyimide resin used as the insulator layer is a general term for resins having an imide ring structure, and examples thereof include polyimide, polyamideimide, and polyesterimide. And as a polyimide-type resin layer, the thing of the low thermal expansion as described in the said patent documents 1-4, the thermoplastic polyimide etc. which fuse | melt or soften when heated can be utilized, and it is not specifically limited. However, particularly preferable insulator layers are a base layer made of a thermoplastic polyimide resin obtained by heat curing of a polyimide precursor resin solution described in
ここで中間メイン層を形成する低熱膨張ポリイミド系樹脂としては、その線膨張係数が30×10-6(1/℃)以下が好ましく、フイルムの耐熱性、可撓性において優れた性能を有するものがよい。ここで線膨張係数は、イミド化反応が十分に終了した試料を用い、サーモメカニカルアナライザー(TMA)を用いて250℃に昇温後、10℃/分の速度で冷却し、240〜100℃の範囲における平均の線膨張係数を求めたものである。このような性質を有する低熱膨張ポリイミド系樹脂の具体例としては、前記特許文献5に記載された下記一般式(I)で表される単位構造を有するポリイミド系樹脂が望ましい。
Here, the low thermal expansion polyimide resin forming the intermediate main layer preferably has a linear expansion coefficient of 30 × 10 −6 (1 / ° C.) or less, and has excellent performance in heat resistance and flexibility of the film. Is good. Here, the linear expansion coefficient is a sample having a sufficiently completed imidation reaction, heated to 250 ° C. using a thermomechanical analyzer (TMA), cooled at a rate of 10 ° C./min, and 240 to 100 ° C. The average linear expansion coefficient in the range is obtained. As a specific example of the low thermal expansion polyimide resin having such properties, a polyimide resin having a unit structure represented by the following general formula (I) described in
また、ベース層やトップ層に使用される熱可塑性ポリイミド系樹脂としては、そのガラス転移点温度が350℃以下のものであればいかなる構造のものであってもよいが、好ましくは加熱加圧下で圧着した際にその界面の接着強度が十分であるものがよい。ここでいう熱可塑性ポリイミド系樹脂とは、ガラス転移点以上の通常の状態で必ずしも十分な流動性を示さなくてもよく、加圧によって接着可能なものも含まれる。このような性質を有する熱可塑性ポリイミド系樹脂の具体例としては、前記特許文献5に記載された下記一般式(II)や一般式(III)で表される単位構造を有するものである。
The thermoplastic polyimide resin used for the base layer and the top layer may have any structure as long as its glass transition temperature is 350 ° C. or lower, but preferably under heat and pressure. What has sufficient adhesive strength of the interface when crimping | bonding is good. Here, the thermoplastic polyimide resin does not necessarily have sufficient fluidity in a normal state above the glass transition point, and includes those that can be bonded by pressurization. Specific examples of the thermoplastic polyimide resin having such properties have a unit structure represented by the following general formula (II) or general formula (III) described in
ここで、2価の芳香族基Ar1又Ar2の具体例としては例えば
また片面導体積層体の製造方法としては、前記特許文献5に記載されているようにポリイミド前駆体溶液又はポリイミド溶液に、公知の酸無水物系やアミン系硬化剤等の硬化剤、シランカップリング剤、チタネートカップリング剤、エポキシ化合物等の接着性付与剤、ゴム等の可撓性付与剤等の各種の添加剤や触媒を加えて導電性金属箔(M1)へ塗工し、次いで熱処理により熱硬化して片面導体積層体を得ることができる。なお片面導体積層体は、導電性金属箔(M1)にベース層として熱可塑性ポリイミド系樹脂層を、中間メイン層に低熱膨張性ポリイミド系樹脂層を、さらにトップ層(最表面層)として熱可塑性ポリイミド系樹脂層が積層されていることが好ましい。ここで、中間メイン層に低熱膨張性ポリイミド系樹脂層を含まない場合は、加熱硬化工程で得られる片面導体積層体の反りやカールが大きくなり、以後の工程での作業性が著しく低下する。また、トップ層(最表面層)に熱可塑性ポリイミド系樹脂層を含まないと、加熱圧着ロール工程での導電性金属箔との熱圧着による接着力が十分に発揮されないので好ましくない。
Moreover, as a manufacturing method of a single-sided conductor laminated body, as described in the said
その際、低熱膨張性ポリイミド系樹脂層の厚みt1と熱可塑性ポリイミド系樹脂層の厚みt2の厚さの比(t1/t2)は2〜100の範囲、好ましくは5〜20の範囲がよい。この厚さの比(t1/t2)が2より小さいと、ポリイミド系樹脂層全体の熱膨張係数が金属箔のそれに比べて高くなりすぎ、この第一の工程で得られる片面導体積層体の反りやカールが大きくなり、次の第二の工程での作業性が著しく低下する。また、熱可塑性ポリイミド系樹脂層の厚みt2が小さすぎ、厚さの比(t1/t2)が100を超えるほどに大きくなると、第二の工程の熱圧着による接着力が充分に、発揮されなくなる場合が生じる。 At that time, the ratio (t 1 / t 2 ) between the thickness t 1 of the low thermal expansion polyimide resin layer and the thickness t 2 of the thermoplastic polyimide resin layer is in the range of 2 to 100, preferably 5 to 20. The range is good. If the thickness ratio (t 1 / t 2 ) is smaller than 2, the thermal expansion coefficient of the entire polyimide resin layer becomes too high compared to that of the metal foil, and the single-sided conductor laminate obtained in this first step Warpage and curl increase, and workability in the next second step is remarkably reduced. Further, if the thickness t 2 of the thermoplastic polyimide resin layer is too small and the ratio of thickness (t 1 / t 2 ) increases to exceed 100, the adhesive force by the thermocompression bonding in the second step is sufficient, In some cases, it cannot be used.
導電性金属箔(M1)上へのこれら複数のポリイミド系樹脂の塗工は、その樹脂溶液の形で行うことができるが、好ましくは前記特許文献4や5に記載されているようにその前駆体溶液の形で、複数の前駆体溶液の一括又は逐次の塗工あるいはイミド閉環温度以下での脱溶剤処理の後、前駆体のポリイミドへの加熱変換を一括して行うのが好ましい。完全にポリイミドに変換された層の上にさらに別のポリイミド系前駆体溶液を塗工し、熱処理してイミド閉環させると、各ポリイミド系樹脂層間の接着力が充分に発揮されないことがあり、製品の両面積層体の品質を低下させる原因になる。
The application of the plurality of polyimide resins on the conductive metal foil (M 1 ) can be performed in the form of the resin solution, but preferably as described in
導電性金属箔(M1)上にポリイミド系樹脂溶液あるいはその前駆体溶液(ポリアミック酸溶液)の塗工の方法としては、例えばナイフコーター、ダイコーター、ロールコーター、カーテンコーター等を使用して公知の方法により行うことができ、特に厚塗りを行う場合にはダイコーターやナイフコーターが適している。また、塗工に使用するポリイミド系前駆体溶液のポリマー濃度は、ポリマーの重合度にもよるが、通常5〜30重量%、好ましくは10〜20重量%である。ポリマー濃度が5重量%より低いと一回のコーティングで充分な膜厚が得られず、また、30重量%より高くなると溶液粘度が高くなりすぎて塗工しずらくなる。 As a method for coating a polyimide resin solution or a precursor solution (polyamic acid solution) on the conductive metal foil (M 1 ), for example, a knife coater, a die coater, a roll coater, a curtain coater or the like is used. In particular, when thick coating is performed, a die coater or a knife coater is suitable. The polymer concentration of the polyimide precursor solution used for coating is usually 5 to 30% by weight, preferably 10 to 20% by weight, although it depends on the degree of polymerization of the polymer. When the polymer concentration is lower than 5% by weight, a sufficient film thickness cannot be obtained by one coating, and when the polymer concentration is higher than 30% by weight, the solution viscosity becomes too high and coating becomes difficult.
導電性金属箔に均一な厚みに塗工されたポリアミック酸溶液は、次に熱処理によって溶剤が除去されさらにイミド閉環される。この場合、急激に高温で熱処理すると、樹脂表面にスキン層が生成して溶剤が蒸発しずらくなったり、発泡したりするので低温から徐々に高温まで上昇させながら熱処理していくのが望ましい。この際の最終的な熱処理温度としては、通常300〜400℃が好ましく、400℃以上ではポリイミドの熱分解が徐々に起こり始め、また、300℃以下ではポリイミド皮膜が導電性金属箔上に充分に配向せず、平面性の良い片面導体積層体が得られない。このようにして形成された絶縁体としてのポリイミド系樹脂層の全体の厚みは通常10〜150μmである。 The polyamic acid solution applied to the conductive metal foil with a uniform thickness is then subjected to heat treatment to remove the solvent and further imide ring closure. In this case, if the heat treatment is suddenly performed at a high temperature, a skin layer is formed on the resin surface, and the solvent does not easily evaporate or foams. The final heat treatment temperature at this time is usually preferably 300 to 400 ° C., and at 400 ° C. or higher, the thermal decomposition of the polyimide begins to occur gradually. A single-sided conductor laminate with good flatness cannot be obtained without orientation. The total thickness of the polyimide resin layer as an insulator thus formed is usually 10 to 150 μm.
以下、本発明を実施するための最良の形態を添付した図面に従って詳細に説明する。図1は、本発明の片面導体積層体と導電性金属箔(M2)を一対のプレスロール間に導入し、加熱圧着により積層一体化させる両面導体ポリイミド積層体の製造方法を示す概略フローである。図2は予備加熱用ガイドロールの一例を示す概略の縦断面図である。図3はプレスロールの一例を示す概略の縦断面図である。 Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a schematic flow showing a method for producing a double-sided conductor polyimide laminate in which the single-sided conductor laminate of the present invention and a conductive metal foil (M 2 ) are introduced between a pair of press rolls and laminated and integrated by thermocompression bonding. is there. FIG. 2 is a schematic longitudinal sectional view showing an example of a preheating guide roll. FIG. 3 is a schematic longitudinal sectional view showing an example of a press roll.
図1において、前述した導電性金属箔(M1)の片面にポリイミド系樹脂からなる絶縁体層を加熱硬化して接着させた片面導体積層体1と導電性金属箔(M2)2とは、共にロール巻き状態から連続的に引き出されて中心軸の高さが異なる複数のガイドロール3、3’、4、4’等を経て平面性を高めた状態で予備加熱された後で、一対の加熱プレスロール5、6の表面に接触した状態でプレスロール同士による加圧点を通過させることで、上記片面導体積層体1のトップ層に導電性金属箔(M2)を加熱圧着により積層一体化させた両面導体ポリイミド積層体7を形成した後、適宜冷却用の不活性ガス吹き付け等の冷却手段cによって予備冷却し、以下、複数のガイドロール8、8’を経て外気中でさらに冷却されつつロール巻き製品9とされる。
In FIG. 1, a single-sided conductor laminate 1 and a conductive metal foil (M 2 ) 2 in which an insulating layer made of polyimide resin is heat-cured and bonded to one side of the conductive metal foil (M 1 ) described above are as follows. , After being preheated in a state in which the flatness is improved through a plurality of guide rolls 3, 3 ′, 4, 4 ′, etc., which are continuously drawn from the roll winding state and have different central axis heights, A conductive metal foil (M 2 ) is laminated on the top layer of the single-sided conductor laminate 1 by thermocompression bonding by passing a pressure point between the press rolls in contact with the surfaces of the heated press rolls 5 and 6. After the integrated double-sided
ここで、複数のガイドロール3、3’、4、4’、8、8’等や一対の加熱プレスロール5、6は導電性金属箔の酸化を防ぐために大気圧以上の窒素ガス等の不活性ガス雰囲気下に保持された処理室10内に配置され、且つ基材導入口及び積層体の排出口にはシール機構(ラビリンスシール)11を設けることが望ましい。ここで、ロール巻き状態から連続的に引き出される片面導体積層体1と導電性金属箔(M2)2とは、図示されていないが処理室10内に導入される前に、それぞれ中心軸の高さが異なる複数のガイドロールを経由させて緊張状態で平面性を高めることが望ましい。また、処理室10から引き出された後の両面導体ポリイミド積層体も、図示されていないがロール巻き製品9とされる前に外気中にてそれぞれ中心軸の高さが異なる複数のガイドロールによる緊張状態で経由させて更に表面温度を下げることが望ましい。
Here, the plurality of guide rolls 3, 3 ′, 4, 4 ′, 8, 8 ′, etc. and the pair of heated press rolls 5, 6 are not used to prevent oxidation of the conductive metal foil. It is desirable that a seal mechanism (labyrinth seal) 11 is provided in the
特に、本発明における平面性を高めた状態で予備加熱する手段としては、加熱プレスロール5.6の直前のガイドロール3’(4’)を加熱手段内蔵タイプとするか、又は加熱プレスロール直前に加熱ランプ又は輻射エネルギーを放出するヒーターh1やh2等を設置して予備加熱してもよく、或いは両方の予備加熱手段を併用してもよい。ここで特に好ましい加熱手段内蔵タイプの予備加熱用ガイドロールの一例を図2によって説明する。図2において、ガイドロール3’(4’)は内部が空洞の外周部と空洞の両端から突出される中心軸12とがロール外周部の両端内部に配置されたベアリング等の回転支持部材13を介して一体化され、且つロール外周部は中心軸12の回りを該回転支持部材13で自由回転させる構造である。
In particular, as a means for preheating in the state in which the flatness is improved in the present invention, the
またロール内部における中心軸12には誘電加熱による加熱コイル、赤外線ヒータ、抵抗加熱コイル等から選ばれる輻射熱による加熱制御手段14が適宜分割又は一体化されて固定されており、これら加熱手段へ流す電流値を変えることでロールの内壁面へ照射する輻射熱エネルギーを制御する。また、ロール外表面付近には、加熱制御手段より照射される輻射熱エネルギーで表面温度を均一加熱化するための熱伝導性の良好な有機熱媒体が充填されたジャケット又はヒートパイプと呼ばれる熱伝導素子17が埋め込まれて配置されている。かかるヒートパイプは上記の中心軸12の加熱手段14からの熱伝達でロール外表面全体に瞬時に伝達されるので表面温度精度が高く、軸方向の温度差が殆ど生じない。
Further, a heating control means 14 by radiant heat selected from a heating coil by dielectric heating, an infrared heater, a resistance heating coil, etc. is fixed to the
ここで加熱プレスロール間に導入前の片面導体積層体1と導電性金属箔(M2)2の予備加熱温度としては、200℃以上でトップ層樹脂である熱可塑性ポリイミド系樹脂のガラス転移点以下の温度、好ましくは200〜350℃が望ましい。かかる予備加熱ロール外表面温度はロール表面に埋め込まれた温度センサーにて監視し常時所定温度を保持するように加熱制御手段14へ供給する電流値を制御することが望ましい。予備加熱しない場合、或いは予備加熱温度が200℃以下においては極めて薄い金属箔が加熱プレスロール間を通過時に急激に昇温されて圧着される結果、積層体の表面で多数の縦すじ、横シワや集束じわ等が発生することで外観不良につながるだけでなく、接着性が低くなる点で好ましくない。また、ガラス転移点以上ではポリイミド系樹脂が劣化するので好ましくない。 Here, the preheating temperature of the single-sided conductor laminate 1 and the conductive metal foil (M 2 ) 2 before being introduced between the heating press rolls is 200 ° C. or higher and the glass transition point of the thermoplastic polyimide resin that is the top layer resin. The following temperature is desirable, preferably 200 to 350 ° C. It is desirable to monitor the outer surface temperature of the preheating roll with a temperature sensor embedded in the roll surface, and to control the current value supplied to the heating control means 14 so as to always maintain a predetermined temperature. When preheating is not performed or when the preheating temperature is 200 ° C. or less, a very thin metal foil is rapidly heated and pressed when passing between heated press rolls, resulting in a large number of vertical stripes and wrinkles on the surface of the laminate. The generation of wrinkles and the like is not preferable because it not only leads to poor appearance but also lowers the adhesiveness. Moreover, since the polyimide resin deteriorates above the glass transition point, it is not preferable.
次に一対の加熱プレス5(6)は、図3に示すように、構造的には図2で説明した加熱手段内蔵タイプのガイドロール3’(4’)と同じで、図2で付した符号と同じものは、図2で説明したものと同一の意味であるが、その直径が大きく、且つ加熱手段が14、15、16と3分割されており、図示されていないが攪拌動力機構で強制回転させる構造である点が異なる。プレスロール外表面付近には、熱伝導性の良好な有機熱媒体が充填されているジャケット又はヒートパイプと呼ばれる熱伝導素子17が埋め込まれて表面温度を均一化する手段が設けられている。プレスロール外表面温度は、熱可塑性ポリイミド系樹脂のガラス転移点以上であることが望ましく、より好ましくは360〜390℃の範囲内の設定値に制御する。かかるプレスロール外表面温度はロール表面に埋め込まれた温度センサーにて監視し加熱手段14、15、16へ供給する電流値を制御することが望ましい。
Next, as shown in FIG. 3, the pair of heating presses 5 (6) are structurally the same as the heating means built-in
また、上記一対の加熱プレスロール5、6は窒素雰囲気下において、図示されていないが上下に配置された少なくとも片方のプレスロールを中心軸12の両側で保持して所定の位置まで油圧又はギヤによる加圧手段で移動させて両者のギャップ調整を行わせることで、導入される基材1,2に対して相互にプレスロールから最適な加圧力が伝達される。この場合の加熱プレスロール間の線圧は50〜500Kg/cm(490N/cm〜4900N/cm)、好ましくは100〜300Kg/cm(980N/cm〜2940N/cm)、通過時間2〜5秒間の条件下で加熱圧着することが望ましい。
The pair of heating press rolls 5 and 6 are not shown in the figure, but hold at least one press roll arranged on both sides of the
さらに使用される一対の加熱プレスロールは、プレスロールの平均表面粗さ(Ra)を0.01μmよりも大きく、5μm以下、好ましくは0.1〜3μmの粗面化状態にて使用することが望ましい。プレスロールの表面粗さ(Ra)が0.01μm以下では加熱ロール間から出てくる両面導体ポリイミド積層体のロール密着によるトラレが発生して走行中にシワが発生したり、銅箔粉等の異物付着に起因するピット(製品表面に数十ミクロンの打痕、又は凹み)等の発生が避けられない。また5μm以上ではロール表面の凹凸が積層体表面に転写されるので好ましくない。ロール表面を上記範囲内の粗面とするにはセラミック皮膜を溶射することで調整することができる。なお、表面粗さ(Ra)はダイヤ針による触針式表面粗さ計にて求める。 Further, the pair of heated press rolls used has a press roll average surface roughness (Ra) larger than 0.01 μm and 5 μm or less , preferably 0.1 to 3 μm in a roughened state. desirable. When the surface roughness (Ra) of the press roll is 0.01 μm or less, the tray caused by the roll adhesion of the double-sided conductor polyimide laminate that comes out between the heating rolls will generate wrinkles during running, Occurrence of pits (a dent of several tens of microns or dents on the product surface) due to the adhesion of foreign substances is unavoidable. On the other hand, when the thickness is 5 μm or more, unevenness on the roll surface is transferred to the surface of the laminate, which is not preferable. In order to make the roll surface rough within the above range, it can be adjusted by spraying a ceramic film. The surface roughness (Ra) is obtained with a stylus type surface roughness meter using a diamond needle.
なお、図1において加熱プレスロール5と6にて片面導体積層体1のトップ層に導電性金属箔(M2)を加熱圧着により積層一体化させた両面導体ポリイミド積層体7を形成した後は、冷却用の不活性ガス吹き付け等の冷却手段cによって予備冷却するのが望ましいが、冷却手段cによる冷却温度は、あまりに急激に冷却した場合、積層体7に反りが発生し好ましくないので、前記した予備加熱温度と同等の200℃以上でトップ層樹脂である熱可塑性ポリイミド系樹脂のガラス転移点以下の温度、好ましくは200〜300℃が望ましい。
In addition, after forming the double-sided
本発明で得られる両面導体型ポリイミド積層体は、絶縁体としてのポリイミド系樹脂層の両面に導体としての導電性金属層を有し、外観が良好でシワの発生がないしかも品質バラツキもないロール巻き製品であり、高機能化する携帯電話やデシタルカメラ、ナビゲーター、その他の各種電子機器類の小型化、軽量化の進展に伴って、使用される電子配線材料として好適である。 The double-sided conductor-type polyimide laminate obtained by the present invention has a conductive metal layer as a conductor on both sides of a polyimide resin layer as an insulator, has a good appearance, is free from wrinkles, and has no quality variation It is a rolled product and is suitable as an electronic wiring material to be used with the progress of miniaturization and weight reduction of highly functional mobile phones, digital cameras, navigators, and other various electronic devices.
以下、実施例及び比較例に基づいて,本発明の実施の形態を具体的に説明する。なお、以下の実施例及び比較例において、線膨張係数、片面銅張品のカール及び接着力は以下の方法で測定した。 Hereinafter, based on an Example and a comparative example, embodiment of this invention is described concretely. In the following examples and comparative examples, the linear expansion coefficient, the curl of the single-sided copper-clad product, and the adhesive force were measured by the following methods.
すなわち、線膨張係数はセイコー電子工業株式会社製サーモメカニカルアナライザー(TMA100)を用いて、250℃に昇温後に10℃/分の速度で冷却し、240℃〜100℃の間における平均線膨張係数を算出して求めた。片面銅張品のカールとしては、熱処理してイミド化した後における100mm×100mmの寸法の銅張品の極率半径を測定した。 In other words, the linear expansion coefficient is an average linear expansion coefficient between 240 ° C. and 100 ° C. by using a thermomechanical analyzer (TMA100) manufactured by Seiko Denshi Kogyo Co., Ltd. Was calculated. As the curl of a single-sided copper-clad product, the radius of curvature of a copper-clad product having a size of 100 mm × 100 mm after heat treatment and imidization was measured.
片面銅張品の接着力は,JIS C5016:7.1項に順じ、導体幅3mmのパターンを使用し、銅箔を180°の方向に50mm/分の速度で引き剥がした時の値として求めた。 The adhesive strength of a single-sided copper-clad product is the value when the copper foil is peeled off at a speed of 50 mm / min in a 180 ° direction using a pattern with a conductor width of 3 mm in accordance with JIS C5016: Asked.
また、実施例及び比較例中では以下の略号を使用した。
PMDA:無水ピロメリット酸
BTDA:3,3’,4,4’−ベンゾフェノンテトラカルボン酸無水物
DDE:4,4−ジアミノジフェニルエーテル
MABA:2’−メトキシ−4,4’−ジアミノベンズアニリド
In the examples and comparative examples, the following abbreviations were used.
PMDA: pyromellitic anhydride BTDA: 3,3 ′, 4,4′-benzophenone tetracarboxylic anhydride DDE: 4,4-diaminodiphenyl ether MABA: 2′-methoxy-4,4′-diaminobenzanilide
(合成例1)
ガラス製反応器に窒素を通じながらN,N−ジメチルアセトアミド2,532gを仕込み、続いて攪拌下に0.5モルのDDEと0.5モルのMABAとを仕込み、その後完全に溶解させた。この溶液を10℃に冷却し、反応液が30℃以下の温度に保たれるように1モルのPMDAを少量ずつ添加し、添加終了後引き続いて室温で2時間攪拌を行い、重合反応を完結させた。得られたポリイミド前駆体溶液はポリマー濃度15重量%及びB型粘度計による25℃でのみかけ粘度1000mPa・sであった。
(Synthesis Example 1)
2,532 g of N, N-dimethylacetamide was charged into a glass reactor through nitrogen, then 0.5 mol of DDE and 0.5 mol of MABA were charged with stirring, and then completely dissolved. The solution was cooled to 10 ° C., and 1 mol of PMDA was added little by little so that the reaction solution was kept at a temperature of 30 ° C. or lower. After the addition was completed, the mixture was stirred at room temperature for 2 hours to complete the polymerization reaction. I let you. The obtained polyimide precursor solution had a polymer concentration of 15% by weight and an apparent viscosity of 1000 mPa · s at 25 ° C. using a B-type viscometer.
(合成例2)
ジアミン成分としてDDEの1モルを使用し、酸無水物成分としてBTDAの1モルを使用した以外は、合成例1と同様にしてポリイミド前駆体溶液を調整した。得られたポリイミド前駆体溶液はポリマー濃度15重量%及びB型粘度計による25℃でのみかけ粘度300mPa・sであった。
(Synthesis Example 2)
A polyimide precursor solution was prepared in the same manner as in Synthesis Example 1 except that 1 mol of DDE was used as the diamine component and 1 mol of BTDA was used as the acid anhydride component. The resulting polyimide precursor solution had a polymer concentration of 15% by weight and an apparent viscosity of 300 mPa · s at 25 ° C. using a B-type viscometer.
(積層体の作製)
35μmロール状の電解銅箔(日鉱グールド社製)の粗化面にダイコーターを用いて合成例2で調整したポリイミド前駆体溶液2を12μmの厚みで均一に塗工した後、120℃の熱風乾燥炉で連続的に処理し溶剤を除去した。次にこのポリイミド前駆体層の上からリバース式ロールコーターを用いて合成例1で調整したポリイミド前駆体溶液1を200μmの厚みで均一に塗工し、120℃の熱風乾燥炉で連続的に処理し溶剤を除去した後、さらに合成例2で調整したポリイミド前駆体溶液2を15μmの厚みで均一に塗布し、次いで熱風乾燥炉で30分間かけて120℃から360℃まで昇温させて熱処理しイミド化させ、ポリイミド樹脂層の厚みが25μmで反りやカールのない平面性の良好な片面銅張品aを得た。この片面銅張品aの銅箔層とポリイミド樹脂層との間の180°引き剥がし強さ(JIS C−5016)を測定した結果は0.8kg/cmであり、エッチング後のフイルムの熱膨張係数は23.5×10-6(1/℃)であった。
(Production of laminate)
After the
(実施例1)
製造例で調整した片面絶縁体層の銅張品の横幅500mmのロール巻きシートの樹脂面と同じ横幅寸法の35μmのロール巻きシートである圧延銅箔の粗化面とを、それぞれ窒素雰囲気下のガイドロールを経由して、一対の加熱プレスロール(外径は300mm、幅800mmで、表面付近には均一加熱手段としてナフタリンを封入したジャケット式のヒートパイプが埋め込まれ、内部の中心軸には誘電加熱コイルを内蔵させた構造)間に導入する前で加熱手段内蔵タイプのガイドロール3’(4’)にて予備加熱後に、加熱プレスロール表面温度360〜390℃、プレスロール間の線圧150〜170kg/cm、通過時間2〜5秒間の範囲内で加熱圧着した。このとき、同じ基材材料、同じ加熱プレスロール条件下での予備加熱しない場合と、予備加熱温度を150℃、250℃及び340℃に変更した場合について、得られた両面銅張品の表面状態を目視にて調査した結果を表1に示す。
(Example 1)
The roughened surface of the rolled copper foil, which is a 35 μm roll wound sheet having the same width as the resin surface of the 500 mm wide roll wound sheet of the copper-clad product of the single-sided insulator layer prepared in the production example, respectively, under a nitrogen atmosphere Via a guide roll, a pair of heated press rolls (outer diameter is 300 mm, width is 800 mm, a jacket type heat pipe filled with naphthalene as a uniform heating means is embedded near the surface, and the inner central axis is dielectric. After the preheating with the
(実施例2)
上記の実施例1において、加熱プレスロール表面の設定温度360℃、プレスロール間の線圧150kg/cm、通過時間3秒間に設定し、且つ加熱プレスロール間へ導入される基材の予備加熱が無い場合と、予備加熱温度を250℃及び340℃とした場合のそれぞれについて、加熱プレスロールの表面粗さ(Ra)を0.01以下、0.05、0.20、10.0μmの4段間に変化させた場合に得られた両面銅張品の表面状態を目視にて調査した結果を表2に示す。
(Example 2)
In Example 1 above, the set temperature of the heated press roll surface is set to 360 ° C., the linear pressure between the press rolls is set to 150 kg / cm, the passing time is set to 3 seconds, and the preliminary heating of the base material introduced between the heated press rolls is performed. For each of the case where there is no surface heating and the preheating temperature of 250 ° C. and 340 ° C., the surface roughness (Ra) of the heated press roll is 0.01 or less, 0.05, 0.20, 10.0 μm in four stages. Table 2 shows the results of visual inspection of the surface state of the double-sided copper-clad product obtained when the distance was changed in between.
1 片面導体積層体
2 導電性金属箔
3 ガイドロール
3’予備加熱用ガイドロール
4 ガイドロール
4’予備加熱用ガイドロール
5 加熱プレスロール
6 加熱プレスロール
7 両面導体ポリイミド積層体
8 ガイドロール
9 ロール巻き製品
10 窒素ガス雰囲気の処理室
11 窒素シール機構
12 中心軸
13 ベアリング等による回転支持部材
14 加熱手段
17 ヒートパイプ
DESCRIPTION OF SYMBOLS 1 Single-sided conductor laminated
Claims (5)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2004009531A JP3790250B2 (en) | 2004-01-16 | 2004-01-16 | Continuous production method of double-sided conductor polyimide laminate |
CN2004800404673A CN1906027B (en) | 2004-01-16 | 2004-12-27 | Continuous production method for both-sided conductor polyimide laminate |
KR1020067016383A KR101027203B1 (en) | 2004-01-16 | 2004-12-27 | Continuous production method of double-sided conductor polyimide laminate |
PCT/JP2004/019523 WO2005068183A1 (en) | 2004-01-16 | 2004-12-27 | Continuous production method for both-sided conductor polyimide laminate |
TW094101197A TW200602191A (en) | 2004-01-16 | 2005-01-14 | Continuous production method for both-sided conductor polyimide laminate |
Applications Claiming Priority (1)
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JP2004009531A JP3790250B2 (en) | 2004-01-16 | 2004-01-16 | Continuous production method of double-sided conductor polyimide laminate |
Publications (2)
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JP2005199615A JP2005199615A (en) | 2005-07-28 |
JP3790250B2 true JP3790250B2 (en) | 2006-06-28 |
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JP2004009531A Expired - Lifetime JP3790250B2 (en) | 2004-01-16 | 2004-01-16 | Continuous production method of double-sided conductor polyimide laminate |
Country Status (5)
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JP (1) | JP3790250B2 (en) |
KR (1) | KR101027203B1 (en) |
CN (1) | CN1906027B (en) |
TW (1) | TW200602191A (en) |
WO (1) | WO2005068183A1 (en) |
Cited By (1)
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WO2024062103A1 (en) * | 2022-09-23 | 2024-03-28 | Basf Se | Process for producing a composite component comprising at least one metal layer and one polymer layer |
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JP2008062448A (en) * | 2006-09-05 | 2008-03-21 | Hitachi Chem Co Ltd | Flexible laminate, its manufacturing method and flexible printed-wiring board |
CN101670697B (en) * | 2008-09-12 | 2012-06-27 | 财团法人工业技术研究院 | Double-sided metal foil laminate and its manufacturing method |
DE102013013495A1 (en) * | 2013-08-16 | 2015-02-19 | Thyssenkrupp Steel Europe Ag | Method and device for producing a composite material |
JO3638B1 (en) * | 2015-09-09 | 2020-08-27 | Lilly Co Eli | Compounds useful for inhibiting ror-gamma-t |
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KR20220044501A (en) * | 2019-08-08 | 2022-04-08 | 가부시키가이샤 아리사와 세이사쿠쇼 | Method for manufacturing a laminate |
CN110911646B (en) * | 2019-10-25 | 2022-05-10 | 合肥国轩高科动力能源有限公司 | A kind of composite current collector roll welding die-cutting integrated equipment and roll welding die-cutting method |
KR20220103795A (en) * | 2019-12-04 | 2022-07-22 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | rotating acoustic horn |
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JP3102622B2 (en) * | 1995-02-27 | 2000-10-23 | 宇部興産株式会社 | Metal foil laminated polyimide film |
JP3580128B2 (en) * | 1998-04-17 | 2004-10-20 | 宇部興産株式会社 | Manufacturing method of metal foil laminated film |
JP2001310435A (en) * | 2000-04-27 | 2001-11-06 | Kanegafuchi Chem Ind Co Ltd | Method for preparing heat-resistant flexible base |
JP2001239585A (en) * | 2000-02-28 | 2001-09-04 | Kuraray Co Ltd | A metal-clad laminate and a method for producing the same. |
JP4345187B2 (en) * | 2000-03-28 | 2009-10-14 | 宇部興産株式会社 | Method for producing flexible metal foil laminate |
JP4193461B2 (en) * | 2001-10-11 | 2008-12-10 | 宇部興産株式会社 | Heat-sealable polyimide and laminate using the polyimide |
-
2004
- 2004-01-16 JP JP2004009531A patent/JP3790250B2/en not_active Expired - Lifetime
- 2004-12-27 WO PCT/JP2004/019523 patent/WO2005068183A1/en active Application Filing
- 2004-12-27 CN CN2004800404673A patent/CN1906027B/en not_active Expired - Lifetime
- 2004-12-27 KR KR1020067016383A patent/KR101027203B1/en not_active Expired - Lifetime
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2005
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Cited By (1)
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WO2024062103A1 (en) * | 2022-09-23 | 2024-03-28 | Basf Se | Process for producing a composite component comprising at least one metal layer and one polymer layer |
Also Published As
Publication number | Publication date |
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CN1906027A (en) | 2007-01-31 |
WO2005068183A1 (en) | 2005-07-28 |
KR101027203B1 (en) | 2011-04-06 |
CN1906027B (en) | 2012-11-07 |
TW200602191A (en) | 2006-01-16 |
JP2005199615A (en) | 2005-07-28 |
TWI333895B (en) | 2010-12-01 |
KR20060126561A (en) | 2006-12-07 |
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