JP3784312B2 - Coating film forming apparatus and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively utilize a substrate by approaching a zone to be coated to the periphery of the substrate in the formation of a liquid film while scanning linearly. <P>SOLUTION: The delivery of the substrate to a substrate holding part is performed by using a substrate transporting means having a function to align and delivering the pre-treated substrate to the substrate holding part in a coating unit. After the delivery, the precise position of the substrate is recognized by a position detecting means and the central coordinates of the substrate are obtained. The error in each center of the substrate and the substrate holding part is corrected if it is present and after the precise positioning of the zone of the substrate is recognized in a control part, the coating liquid is supplied to the zone. <P>COPYRIGHT: (C)2003,JPO

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a technique for supplying a coating liquid to various substrates such as a semiconductor wafer, a glass substrate for a liquid crystal display, or a reticle substrate for a photomask, and forming a liquid film of the coating liquid on the surface of the substrate.
[0002]
[Prior art]
In the manufacturing process of semiconductor devices and LCDs, resist processing is performed on a substrate to be processed by a technique called photolithography. In this technique, for example, a resist solution is applied to a semiconductor wafer (hereinafter referred to as a wafer), a liquid film is formed on the surface, the resist film is exposed using a photomask, and then a development process is performed to obtain a desired pattern. Is performed by a series of steps. In performing this process, for example, a coating unit, a developing unit, a heating unit for performing processing before and after the processing of these units, a cooling unit, and a substrate to be processed are transferred between these units. A pattern forming apparatus having a main arm is used.
[0003]
As a resist solution coating unit in the pattern forming apparatus, for example, a substrate holding unit 11 movable along a rail R as shown in FIG. A nozzle 12 is provided above the held wafer W so that the resist solution discharge port faces the wafer W. The nozzle 12 is reciprocated in the X direction along a guide member (not shown) and the wafer W is moved in the Y direction. It is known that the resist solution is supplied to the entire surface of the wafer W in a so-called one-stroke manner. In such a coating apparatus, for example, if the resist solution spills on the outer edge of the wafer W, the resist solution adhering to the part may be scattered as particles, so that device formation is performed on the wafer W. For example, a pair of liquid receiving portions 13 (13a, 13b) as shown in FIGS. 17 and 18 are used.
[0004]
As shown in the drawing, the liquid receiving portions 13 (13a, 13b) are provided at both end portions in the moving region of the nozzle 12 so as to be movable back and forth in the X direction, and according to the width of the coated region 14 of the wafer W during coating processing. It is set as the structure controlled from the control part 15 so that it may move. This advance / retreat control will be described in detail. First, the substrate holder 12 is placed on the substrate holder 11 from the above-described main arm (not shown). The control unit 15 stores a table in which the position of the Y coordinate of the substrate holding unit 11 and the separation distance α of the liquid receiving unit 13 (13a, 13b) are associated with each other. The table is, for example, (Y = −99 mm). , Α = ◯◯ mm), (Y = −98.5 mm, α = ΔΔ mm), (Y = −98.0 mm, α = □□ mm), and so on. Y = −100 mm is the position of the substrate holding portion 11 when the tip of the wafer W is located at a line connecting the center of the liquid receiving portion 13a and the center of the liquid receiving portion 13b, for example. The value of Y decreases by, for example, 0.5 mm as it advances in the direction of the arrow in the middle. In this manner, the separation distance α between the liquid receiving portions 13a and 13b changes symmetrically in the X direction in accordance with the Y coordinate position of the substrate holding portion 11, whereby the resist solution is applied to the device formation region on the wafer W.
[0005]
[Problems to be solved by the invention]
Here, the main arm that delivers the wafer W to the substrate holding unit 11 has, for example, a horseshoe shape surrounding the periphery of the wafer W, and is configured to regulate the periphery of the wafer W. For example, the wafer W has a diameter of 300 mm. If it is of a size, it is configured so that the largest wafer W, for example, a wafer W with a diameter of 300.5 mm, can be held within the range of size variation. Accordingly, there is usually a slight gap between the peripheral edge of the wafer W and the inner peripheral portion of the main arm, and the gap becomes larger as the wafer size varies among the wafers with variations.
[0006]
Since the main arm regulates the peripheral edge of the wafer W in this way, the wafer W is placed almost accurately on a predetermined position on the plate of the heating unit or cooling unit, and in the substrate holding part 11 of the coating unit. Is the same. Therefore, as shown in FIG. 18, since the center line β of the wafer W is located at substantially the center between the liquid receiving portions 13a and 13b, the resist solution can be applied to a position slightly inward from the periphery of the wafer W. .
[0007]
By the way, until now, the region to be coated is a position of about 5 mm from the periphery of the wafer W, so that there is no problem if the center line β of the wafer W and the center between the liquid receiving portions 13a and 13b substantially coincide. However, in order to use the wafer W as efficiently as possible in the future, if the coating area is formed from the periphery of the wafer W to a position of about 2 mm, for example, the length of the mask area 16 becomes extremely short. When the resist solution is to be applied from the periphery of the wafer W to the inside by a predetermined dimension, the separation distance α of the liquid receiving portion 13 is such that the center line β of the wafer W is from an intermediate point between the pair of liquid receiving portions 13a and 13b. In anticipation of the deviation, it is necessary to make a margin slightly larger than the length of the region to be coated according to the position of the wafer W in the Y direction. The opposite liquid receiver 13 is positioned outside the periphery of the wafer W. For this reason, if the resist solution is applied from the periphery of the wafer W to a position of 2 mm, for example, the variation in the holding position caused by the variation in the size of the wafer W when the wafer W is held by the main arm is caused on the periphery of the wafer W. This may cause the resist solution to adhere. The resist solution adhering to the peripheral edge of the wafer W is likely to be a cause of generation of particles and greatly affects the yield. Accordingly, there is a problem that the resist solution cannot be applied close to the periphery of the wafer W.
[0008]
The present invention has been made based on such circumstances, and the object thereof is to form a coating film on the surface of the substrate by applying the coating solution to the substrate in a linear scan. An object of the present invention is to provide a technique that can more effectively use the substrate by bringing the coating region closer to the periphery of the substrate.
[0009]
[Means for Solving the Problems]
The coating film forming apparatus according to the present invention includes: It is a semiconductor wafer In a coating film forming apparatus that forms a liquid film of a coating solution on the surface of a substrate,
A substrate holding part for horizontally holding the substrate;
A first driving unit for moving the substrate holding unit in the X direction and rotating it around a vertical axis;
A supply nozzle provided opposite to the substrate held by the substrate holding unit and reciprocating in the X direction while discharging a coating liquid onto the substrate;
In order to be able to receive the coating liquid from the supply nozzle at both ends of the movement area of the supply nozzle and regulate the coated area in the X direction. Symmetrically A pair of liquid receiving portions provided so as to freely advance and retract;
After the supply nozzle is moved in the X direction and the coating liquid is applied linearly on the substrate, the substrate holding portion is relatively Y with respect to the supply nozzle so that the linear application regions are arranged in the Y direction. A second drive unit for intermittent movement in the direction;
Position detecting means for detecting the peripheral edge of the substrate at each rotation position when rotating the substrate held by the substrate holding section, and detecting the center position of the substrate based on the detection data;
Based on the detection result of this position detection means, The X coordinate position coincides with the X coordinate position of the intermediate point of the separation distance between the pair of liquid receiving portions. And a positioning means for moving the substrate holding part in the X direction via the first driving part.
[0010]
According to such a configuration, prior to starting the supply of the coating liquid to the substrate, the position is adjusted in advance so that the center position of the substrate held by the substrate holding unit is at a predetermined coating start position, for example. Can be done. Therefore, in consideration of the error between the coating area on the substrate and the actual supply range of the coating liquid, the regulation range of the coating area by the liquid receiving portion that has been given a margin can be narrowed. An effective device area can be expanded.
[0011]
A coating film forming apparatus according to another invention includes a plurality of coating film forming apparatuses. It is a semiconductor wafer A cassette station on which a substrate cassette containing substrates is placed;
A coating unit that forms a liquid film of a coating solution on the surface of the substrate;
A plurality of processing units for performing pre-processing or post-processing of the coating processing performed in the coating unit;
Substrate removed from substrate cassette in the cassette station On the other hand, while holding the peripheral edge of the substrate in a regulated state, the center of the substrate is aligned to the extent that it does not affect the processing in the processing unit, Between coating unit and processing unit Carry A substrate transfer means including a transfer arm, and
The coating unit includes a substrate holding unit that holds the substrate horizontally,
A first driving unit for moving the substrate holding unit in the X direction and rotating it around a vertical axis;
A supply nozzle provided opposite to the substrate held by the substrate holding unit and reciprocating in the X direction while discharging a coating liquid onto the substrate;
In order to be able to receive the coating liquid from the supply nozzle at both ends of the movement area of the supply nozzle and regulate the coated area in the X direction. Symmetrically A pair of liquid receiving portions provided so as to freely advance and retract;
After the supply nozzle is moved in the X direction and the coating liquid is applied linearly on the substrate, the substrate holding portion is relatively Y with respect to the supply nozzle so that the linear application regions are arranged in the Y direction. A second drive unit for intermittent movement in the direction;
Position detecting means for detecting the peripheral edge of the substrate at each rotation position when rotating the substrate held by the substrate holding section, and detecting the center position of the substrate based on the detection data;
Based on the detection result of this position detection means, The X coordinate position coincides with the X coordinate position of the intermediate point of the separation distance between the pair of liquid receiving portions. And a positioning means for moving the substrate holding part in the X direction via the first driving part.
[0012]
According to such a configuration, even if a deviation occurs in the center position of the substrate transferred from the substrate transport means to the substrate holding unit in the application unit, the application process can be performed by correcting the deviation of the position. Therefore, the effective device area of the substrate can be expanded without the result of the coating process being affected by the amount of play provided on the transfer arm.
[0013]
The coating film forming method according to the present invention includes: It is a semiconductor wafer In a coating film forming method for forming a liquid film of a coating liquid on the surface of a substrate,
A step of horizontally holding the substrate by a substrate holding portion that is movable in the X direction and rotatable about a vertical axis;
Detecting the peripheral edge of the substrate at each rotational position when rotating the substrate held by the substrate holder, and detecting the center position of the substrate based on the detection data;
An error in the X direction between the detected center position of the substrate and the midpoint of the pair of liquid receiving portions is obtained, and the center position of the substrate and the midpoint of the midpoint are determined. Each X coordinate Moving the substrate holder relatively in the X direction so that
Thereafter, a step of reciprocating a supply nozzle provided facing the substrate held by the substrate holding unit in the X direction while discharging a coating liquid toward the substrate;
The application area from the supply nozzle is received at both ends of the movement area of the supply nozzle to regulate the application area. Therefore, the pair of liquid receiving portions are moved back and forth symmetrically in the X direction. Process,
After the supply nozzle is moved in the X direction and the coating liquid is applied linearly on the substrate, the substrate is relative to the supply nozzle and the liquid receiving portion so that the linear application areas are arranged in the Y direction. And intermittently moving in the Y direction.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment in which the coating and developing apparatus according to the present invention is applied to a coating and developing apparatus that forms a resist film on a substrate and develops the exposed substrate will be described below. 1 and 2 show the overall structure of the present embodiment. In the figure, reference numeral 21 denotes a cassette station, for example, a cassette mounting portion for mounting a cassette C containing 25 wafers W. 22 and a transfer arm 23 for transferring the wafer W between the cassette C placed thereon. A processing unit S <b> 1 surrounded by a casing 24 is connected to the back side of the delivery arm 23. A main transport unit 3 serving as a substrate transport unit is provided in the center of the processing unit S1, and a liquid processing unit is formed by combining the coating unit 4 and the developing unit 25 on the right side so as to surround this, for example. U1 has a processing unit for performing pre-processing or post-processing of coating processing performed by the coating unit on the left side, front side, and back side, a transfer unit having a transfer table for transferring the wafer W, etc. Shelving units U2, U3, U4 configured by stacking a plurality of layers are respectively arranged.
[0015]
In the processing units constituting the shelf units U2, U3, U4, for example, the wafer W coated with the coating solution by the coating unit 4 is dried in a reduced pressure atmosphere, and the solvent contained in the coating solution is volatilized under reduced pressure. A unit, a heating unit for heating (baking) the wafer W, a cooling unit for cooling the wafer W, and the like are included. The delivery unit described above is incorporated in the shelf units U3 and U4. Further, the above-described main transfer means 3 includes a transfer arm (main arm) that can move up and down and move back and forth and rotate around a vertical axis, for example, and constitutes a liquid processing unit U1 and shelf units U2, U3, and U4. It is possible to transfer the wafer W between each unit. An interface part S2 is connected to the back side of the processing part S1. The interface unit S2 transfers the wafer W between the processing unit S1 and an exposure apparatus (not shown) by transfer means 26 configured to be movable up and down, movable left and right, back and forth, and rotatable about the vertical axis. Is. In FIG. 2, the delivery arm 23 and the main transport unit 3 are omitted for the sake of drawing.
[0016]
Here, the configuration of the main transport unit 3 will be described with reference to FIGS. In FIG. 3, reference numeral 31 denotes an arm unit that can be moved up and down. It consists of. A pair of guide members 34 for guiding the arm portion 31 up and down are provided on both sides of the arm portion 31, and the upper and lower ends are connected by connecting members 35 (35 a and 35 b). The lower side of the connecting member 35b is supported by a turntable 36. The turntable 36 allows the main transport means 3 to be integrally rotated about the vertical axis by θ.
[0017]
Each of the transfer arms 32 (32a, 32b, 32c) holds the peripheral edge of the wafer W and is provided so as to be able to advance and retreat independently in the longitudinal direction of the base 33. The drive control of the transfer arm 32 is performed by the drive mechanism 37 described above. Via the control unit 5. Taking the transfer arm 32a as an example, the configuration thereof will be described with reference to FIG. 4 (a). A horseshoe-shaped support frame p1 with the front side cut out is formed on the front end side, and the support frame p1 is formed inside the support frame p1. For example, a plurality of, for example, three support pieces p <b> 2 serving as a regulating member that holds and regulates the periphery of the wafer W are provided. As shown in FIG. 4B, each support piece p2 is formed with an inclined surface p3 that is inclined inwardly downward. By sliding the wafer W along the inclined surface p3 from above, The periphery of W can always be held and regulated in substantially the same posture.
[0018]
Further, the transfer arm 32a has a slight gap between each support piece p2 and the wafer W so that the wafer W can be held up to, for example, 300.5 mm in consideration of the error when the wafer W has a size of, for example, 300 mm ± 0.2 mm. It has a structure with play. Furthermore, the transfer arm 32a is configured such that when the wafer W is transferred, the center p4 of the transfer arm 32a (the center of the wafer W when the wafer W is held) is a planned mounting position of the wafer W at the transfer destination of the wafer W (for example, Positioning work by teaching is performed in advance so as to be accurately directed to the center q) of the substrate holding portion 41 of the coating unit 4 to be described later, and the transfer control of the wafer W is performed based on the positioning information thus obtained. It is like that.
[0019]
Next, the coating unit 4 will be described with reference to FIGS. In the figure, reference numeral 40 denotes a housing, and the internal space thereof is vertically divided by a partition plate 42 having a slit 41 formed in the center, and, for example, a clean air downflow is formed by airflow forming means (not shown). ing. The width in the length direction of the slit 41 is, for example, substantially the same as the maximum width of the application region of the wafer W.
[0020]
First, the lower side space 40a on the lower side of the partition plate 42 will be described. 43 is a substrate holding unit for horizontally holding the wafer W by, for example, vacuum suction on the back side, and the suction unit 44 and the suction unit 44 can be moved up and down. The rotary base 45 is configured to be rotatable around the vertical axis. The lower end of the rotary base 45 is supported by the moving body 46 and can be moved in the X direction along a rail 47 a provided on the upper surface of the moving body 46 via the X direction driving unit 47. Is movable in the Y direction along a rail 48a provided on the bottom surface of the housing 40 via a Y direction drive unit 48 (only a ball screw is shown for convenience of drawing) formed of a ball screw mechanism. That is, the rotary base 45, the X-direction drive unit 47, and the rail 47a correspond to the first drive unit, and the Y-direction drive unit 48 and the rail 48a correspond to the second drive unit. This is performed from the control unit 5. Further, the control unit 5 is configured so that the position (coordinates) and the rotation angle of the substrate holding unit 43 can be grasped from a pulse encoder or the like connected to a motor (not shown) provided in each of the above-described driving parts.
[0021]
In the upper space 40b above the partition plate 42, a pair of liquid receiving portions 72 (which can be moved back and forth in the X direction symmetrically with respect to each other via an advance / retreat drive portion 71 so as to cover a part of the slit 41 described above. 72a, 72b), a supply nozzle 74 guided in the X direction along the guide member 73 above the movement region of the liquid receiving portion 72 (72a, 72b), and the supply nozzle 74 via the guide member 73 in the X direction. And a nozzle driving unit 75 that is driven. Further, the liquid receiving portion 72 (72a, 72b) is formed in, for example, a tray shape so as to receive the resist liquid falling from above and collect it, and further adheres to the surface although illustration is omitted. A cleaning mechanism for washing away the resist solution or a drain line for discharging the received resist solution to the outside of the apparatus is provided.
[0022]
Here, the structure of the suction portion 44 in the substrate holding portion 43 will be described. The upper surface 44a of the suction portion 44 has a circular shape as shown in the plan view of FIG. Thus, four suction means 44b are provided. These suction means 44b have a convex section as shown in FIG. 8, and a suction port 44c for sucking and holding the back side of the wafer W is formed at the tip thereof. Each suction port 44c communicates with a suction pump 44e through a suction path 44d formed in the suction section 44, and an opening / closing valve V1 whose opening / closing control is performed by the control section 5, for example, is interposed in the suction path 44d. It is installed.
[0023]
The lower side space 40a is provided with position detecting means 6 for grasping the position of the center p4 of the wafer W transferred from the main transfer means 3 on the side of the moving area of the substrate holding portion 43. The configuration will be described below with reference to FIGS. The position detection means 6 is configured such that a CCD camera 62 as an image pickup means and an illumination LED 62 are opposed to each other on the inner surface of a U-shaped portion 61 having a U-shaped cross section. As shown in FIG. 5, the wafer W is made to enter the U-shaped portion 61 and light is emitted from the LED 63.
[0024]
The control unit 5 obtains the position of the center p4 of the wafer W in a predetermined direction based on the image processing unit 5a that processes the image data obtained by the CCD camera 62 and the image data processed by the image processing unit 5a. An error in the X and Y directions between the center position calculation unit 5b and the center p4 of the wafer W obtained by the center position calculation unit 5b and the rotation center q of the substrate holding unit 43 is obtained, and the substrate holding unit 43 is obtained according to the error. And an error correction unit 5c that corrects the position. That is, each component for driving the substrate holding portion 43 and each component of the control portion 5 correspond to the alignment means in the claims, and the error of the wafer W to be corrected by these portions. Is when the orientation of the wafer W is the same as when applying the resist. The control unit 5 also includes a storage unit 5d that stores a table (not shown) in which the Y coordinate of the center q of the substrate holding unit 43 and the corresponding intervals from the liquid receiving units 72a to 72b are associated with each other. In the coating process, the movement control of the substrate holding unit 43 and the liquid receiving unit 72 (72a, 72b) is performed with reference to this table.
[0025]
The operation of the present embodiment will be described below with reference to the process chart shown in FIG. First, when the cassette C is carried into the cassette station 21, the wafer W is taken out from the cassette C by the delivery arm 23 (step S1), and delivered to the main transfer means 3 via the delivery unit 100 in the shelf unit U3. . Then, for example, a hydrophobic treatment is performed in each processing unit included in the shelf unit U2 (U3, U4), and then a cooling process is performed (step S2). As for the transfer of the wafer W from the processing unit (cooling unit) that has performed the cooling process to the transfer arm 32a, first, as shown in FIG. The support pin 103 is raised, and the transfer arm 32a enters with the support pin 103 still raised. Then, by lowering the support pins 103, the wafer W is lowered along the inclined surface p3 of the support piece p2 as described above, and is held at a predetermined position in the support piece p2 as shown in FIG. It is held in a horizontal posture (step S3).
[0026]
Then, the wafer W is transferred to the vicinity of the coating unit 4 by the function of the main transfer means 3, and when the transfer arm 32a enters a predetermined position above the substrate holding portion 43 based on the alignment information described above, for example, the wafer enters the cooling plate 101. The same procedure as when W is delivered, that is, the suction unit 44 rises in the support frame p1 to receive the wafer W, and after the transfer arm 32a is retracted from the housing 40, the wafer W is lowered to a predetermined height. Thus, the delivery work is completed (step S4). At this time, the control unit 5 performs opening control of the valve V1 to start suction at each suction port 44c, and thus the wafer W is fixed to the suction unit 44.
[0027]
Next, in order to correct an error in the X direction between the center p4 of the wafer W and the center q of the substrate holding unit 43 (suction unit 44), the center position of the wafer W is first detected (step S5). This process is performed by first moving the substrate holding part 43 and causing the wafer W to enter the U-shaped part 61 of the position detecting means 6, and will be described below with reference to FIG. The image processing unit 5a first recognizes a notch r, which is an index for alignment formed on the outer edge of the wafer W, based on image data transmitted from, for example, the CCD camera 62, and one corner of the notch r. A distance d (d1) from r1 to the center q of the substrate holding part 43 is calculated. Then, as shown in FIG. 12, the substrate holding portion 43 is rotated, and for example, the rotation angle θ (θ1, θ2, θ3) when the line connecting the first coordinate of r1 and the center q of the substrate holding portion 43 is the reference line L. , Θ4...), The distance dn (d1, d2, d3, d4...) From the intersection rn (r1, r2, r3, r4...) Between the reference line L and the outer edge of the wafer W to the center q. .) Is recorded, and the position of the entire contour is determined when the substrate holding portion 43 is rotated once, so that the coordinates of the center W1 of the wafer W are obtained.
[0028]
When the coordinates of the center W1 of the wafer W are thus obtained, the wafer W is rotated in a predetermined direction, for example, a direction in which the notch r as shown in FIG. The correction unit 5c calculates an error in the X direction and the Y direction between the center W1 of the wafer W and the center q of the substrate holding unit 43 in this state. If there is an error in the X direction between the two, the substrate holder 43 is moved in the X direction by the amount corresponding to the error (step S6), and the center W1 of the wafer W and, for example, a slit are moved. The X coordinate with the center of 41 (the intermediate point between the liquid receiving portions 72a and 72b) is made to coincide. If an error in the Y direction has occurred, the error is corrected, and the tip of the application area of the wafer W in the Y direction is located below the movement area of the supply nozzle 74 (application processing standby position). The wafer W is moved to (step S7).
[0029]
Then, as shown in FIG. 13, the resist solution is discharged from the supply nozzle 74 and the supply nozzle 74 is scanned in the X direction, and the wafer W is moved intermittently in the direction B in the figure in accordance with this, In this way, the resist solution is applied from one end side to the other end side of the wafer W in the manner of one-stroke writing (step S8). At this time, both of the liquid receivers 72 (72a, 72b) cover the outer edge of the wafer W with exactly the same width based on the contents of the table in the storage unit 5d, and move while shifting the interval therebetween. On the other hand, as shown in FIG. 14, the supply nozzle 74 moves above the liquid receiving portion 72a and the liquid receiving portion 72b and supplies the resist solution while changing the moving range in the X direction. As described above, the resist solution is applied to all other portions on the surface of the wafer W, leaving an area of, for example, exactly 2 mm from the end. Further, the resist solution supplied from the supply nozzle 74 to a portion other than the application region of the wafer W is received by the solution receiving portion 72 (72a, 72b) and collected through a drain line (not shown).
[0030]
When the coating process is completed, the wafer W is unloaded from the coating unit 4 by the main transfer means 3 in the reverse order of loading, and a predetermined post-process (step S9) is performed. Specifically, for example, after performing post-processing such as cooling, drying under reduced pressure, or heating in each processing unit in the shelf units U2, U3, U4, the wafer W is exposed, for example, outside the figure via the interface unit S2. The wafer W is transferred to the apparatus, where the wafer W is exposed. After the exposure is completed, the wafer W is returned to the processing unit S1 through the reverse path, developed by the developing unit 25 (step S10), and then returned to the cassette C mounted on the cassette mounting unit 22. (Step S11).
[0031]
As described above, according to the present embodiment, in the coating film forming apparatus in which the alignment of the wafer W is performed to such an extent that the main transfer means 3 does not affect the processing before and after the coating process, the coating unit 4 further includes Since accurate alignment is performed, the intermediate point of the liquid receiving part 72 (72a, 72b) and the center line of the wafer W can be accurately matched, and the wafer W receives the liquid receiving on the left and right sides of the peripheral part. Since the portions 72a and 72b are covered in a well-balanced manner, the coverage area of the wafer W by the liquid receiving portions 72 (72a and 72b) can be narrowed compared to the conventional case. Therefore, since the device area which is the application area on the surface of the wafer W can be widened, the wafer W can be used more effectively.
[0032]
In the present embodiment, since the wafer W is held by the substrate holding unit 43 by the four suction means 44b provided in the substrate holding unit 43, stable substrate holding can be performed with a small contact area. Can do. By the way, although the example which uses a semiconductor wafer as a board | substrate was shown in the said embodiment, various board | substrates, such as a glass substrate for liquid crystal displays, or a reticle substrate for photomasks, can be used for a board | substrate, for example, a reticle board | substrate. For a substrate whose upper and lower ends are inclined and cut like this, instead of the substrate holding portion 43, a plurality of freely movable advancing and retracting grips 81 having a cross-sectional shape as shown in FIG. It is also possible to adopt a configuration in which four units are provided and each holds the substrate horizontally from the side. In such a configuration, each of the inclined surfaces 82 (82a, 82b) of the grip portion 81 matches the angle of the upper cut surface 83a and the lower cut surface 83b, and the substrate is held only by this portion. The contact area with each gripping part 82 is small, and there is little risk of particle generation.
[0033]
As for the adjustment of the orientation of the wafer W performed before the start of the coating process, the above embodiment has shown an example in which the notch is positioned on the rear side in the traveling direction of the wafer W. For example, in the image processing unit 5a Adjustments may be made based on the obtained image data of the surface of the wafer W. By doing so, for example, the resist solution can be applied in an optimum direction for the wiring pattern on the surface of the wafer W.
[0034]
【The invention's effect】
As described above, according to the present invention, when a coating liquid is linearly applied to a substrate to form a liquid film of the coating liquid on the surface of the substrate, the region to be coated can be brought close to the periphery of the substrate. The substrate can be used more effectively.
[Brief description of the drawings]
FIG. 1 is a plan view showing the overall structure of a coating film forming apparatus according to an embodiment of the present invention.
FIG. 2 is a perspective view showing an overall structure in the embodiment.
FIG. 3 is a perspective view showing a substrate transfer means used in the embodiment.
4A and 4B are a plan view and a longitudinal sectional view showing an example of a transfer arm provided in the substrate transfer means.
FIG. 5 is a longitudinal sectional view showing a configuration of a coating unit used in the above embodiment.
FIG. 6 is a plan view showing the configuration of the coating unit.
FIG. 7 is a schematic plan view showing an upper surface of a substrate holding part (suction part) provided in the coating unit.
FIG. 8 is a schematic cross-sectional view showing the configuration of the adsorption part and its related parts.
FIG. 9 is an explanatory diagram showing a configuration of position detection means provided in the coating unit and parts related thereto.
FIG. 10 is a process diagram showing an operation of the present embodiment.
FIG. 11 is an operation explanatory view showing how a substrate is delivered from a substrate holding section in the unit to a transfer arm in a unit that performs pretreatment of coating processing.
FIG. 12 is an operation explanatory diagram showing an operation by the position detection unit.
FIG. 13 is a perspective view illustrating a relative movement relationship between a supply nozzle and a wafer W during a coating process.
FIG. 14 is an operation explanatory view showing a state in the vicinity of the outer edge of the wafer W during the coating process.
FIG. 15 is a schematic explanatory diagram showing another embodiment according to the present invention.
FIG. 16 is a perspective view showing a state of a coating process in a conventional technique.
FIG. 17 is a longitudinal sectional view showing a coating apparatus in the prior art.
FIG. 18 is a plan view showing a coating apparatus in the prior art.
[Explanation of symbols]
W Semiconductor wafer
3 Main transport means
31 Arm
32a Transfer arm
43 Substrate holder
44 Adsorption part
44b Adsorption means
45 Rotating substrate
46 Mobile
47 X direction drive
48 Y direction drive
5 Control unit
5a Image processing unit
5b Center position calculator
5c Error correction unit
5d storage unit
6 Position detection means
72 (72a, 72b) Liquid receiving part
74 Supply nozzle

Claims (6)

In a coating film forming apparatus that forms a liquid film of a coating liquid on the surface of a substrate that is a semiconductor wafer ,
A substrate holding part for horizontally holding the substrate;
A first driving unit for moving the substrate holding unit in the X direction and rotating it around a vertical axis;
A supply nozzle provided opposite to the substrate held by the substrate holding unit and reciprocating in the X direction while discharging a coating liquid onto the substrate;
A pair of liquid receiving portions provided so as to be capable of advancing and retreating symmetrically in the X direction so as to receive the coating liquid from the supply nozzle at both ends of the moving region of the supply nozzle and to regulate the coated region;
After the supply nozzle is moved in the X direction and the coating liquid is applied linearly on the substrate, the substrate holding portion is relatively Y with respect to the supply nozzle so that the linear application regions are arranged in the Y direction. A second drive unit for intermittent movement in the direction;
Position detecting means for detecting the peripheral edge of the substrate at each rotation position when rotating the substrate held by the substrate holding section, and detecting the center position of the substrate based on the detection data;
Based on the detection result of the position detector, the X coordinate position of the center of the substrate and the X coordinate position of the intermediate point of the separation distance of the pair of liquid receiving portions are matched via the first drive unit. And a positioning means for moving the substrate holding portion in the X direction. A cassette station on which a substrate cassette containing a plurality of semiconductor wafer substrates is placed;
A coating unit that forms a liquid film of a coating solution on the surface of the substrate;
A plurality of processing units for performing pre-processing or post-processing of the coating processing performed in the coating unit;
The substrate taken out from the substrate cassette in the cassette station is held in a state where the peripheral edge of the substrate is regulated, so that the center of the substrate is aligned to the extent that it does not affect the processing in the processing unit. together, and a substrate transfer means having a transfer arm to transport between the coating unit and a processing unit,
The coating unit includes a substrate holding unit that holds the substrate horizontally,
A first driving unit for moving the substrate holding unit in the X direction and rotating it around a vertical axis;
A supply nozzle provided opposite to the substrate held by the substrate holding unit and reciprocating in the X direction while discharging a coating liquid onto the substrate;
A pair of liquid receiving portions provided so as to be capable of advancing and retreating symmetrically in the X direction so as to receive the coating liquid from the supply nozzle at both ends of the moving region of the supply nozzle and to regulate the coated region;
After the supply nozzle is moved in the X direction and the coating liquid is applied linearly on the substrate, the substrate holding portion is relatively Y with respect to the supply nozzle so that the linear application regions are arranged in the Y direction. A second drive unit for intermittent movement in the direction;
Position detecting means for detecting the peripheral edge of the substrate at each rotation position when rotating the substrate held by the substrate holding section, and detecting the center position of the substrate based on the detection data;
Based on the detection result of the position detector, the X coordinate position of the center of the substrate and the X coordinate position of the intermediate point of the separation distance of the pair of liquid receiving portions are matched via the first drive unit. And a positioning means for moving the substrate holding portion in the X direction. The second drive unit is configured to intermittently move the substrate holding unit in the Y direction,
A storage unit that stores a table in which the position of the substrate holding unit in the Y direction and the separation distance between the pair of liquid receiving units are associated with each other;
Coating film forming apparatus according to claim 1, wherein further comprising a control unit for controlling the position of the substrate holding portion and a liquid receiver reads the table stored in the storage unit. Alignment means, coating film forming apparatus according to any one of claims 1 and controls the position in the Y direction of the substrate holder further via the second driving portion on the basis of the detection result 3 . In a coating film forming method of forming a liquid film of a coating liquid on the surface of a substrate that is a semiconductor wafer ,
A step of horizontally holding the substrate by a substrate holding portion that is movable in the X direction and rotatable about a vertical axis;
Detecting the peripheral edge of the substrate at each rotational position when rotating the substrate held by the substrate holder, and detecting the center position of the substrate based on the detection data;
An error in the X direction between the detected center position of the substrate and the intermediate point of the pair of liquid receiving portions is obtained, and the substrate holding portion is relatively positioned so that the center position of the substrate and each X coordinate of the intermediate point coincide. Moving in the X direction,
Thereafter, a step of reciprocating a supply nozzle provided facing the substrate held by the substrate holding unit in the X direction while discharging a coating liquid toward the substrate;
Reciprocating the pair of liquid receiving portions symmetrically in the X direction in order to receive the coating liquid from the supply nozzle at both ends of the moving region of the supply nozzle and regulate the coated region;
After the supply nozzle is moved in the X direction and the coating liquid is applied linearly on the substrate, the substrate is relative to the supply nozzle and the liquid receiving portion so that the linear application areas are arranged in the Y direction. And a step of intermittently moving in the Y direction. Each process of Claim 5 is performed in an application unit,
Before each step performed in this coating unit, the step of carrying in the pretreatment by carrying it by the transfer arm into the treatment unit for performing the pretreatment,
A step of receiving the pre-processed substrate by the transfer arm and transferring it to the substrate holding unit in the coating unit;
Receiving a substrate coated with a coating liquid in the coating unit with a transfer arm, carrying it into a processing unit for performing post-processing and performing post-processing,
6. The transfer arm according to claim 5, wherein the transfer arm is configured to align the center of the substrate to such an extent that the transfer arm does not affect the processing in the processing unit by holding the substrate with the peripheral edge of the substrate being regulated. Coating film forming method.

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