JP3781541B2 - Manual prober - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a manual prober used when performing a circuit characteristic test of a circuit board in which a circuit is formed on the surface of a thin plate such as an IC wafer or a liquid crystal plate, and particularly when positioning is performed while supporting the thin plate. The present invention relates to a brake mechanism for a manual prober with improved operability of movement and fixation.
[0002]
[Prior art]
Generally, the manual prober 1 is configured as shown in FIGS.
[0003]
2 in the figure is a base surface plate. A Z-up lever 3 is provided on the left side of the front surface (front side) of the base surface plate 2. The Z-up lever 3 is for raising and lowering a base plate 7 slidably supported on a Z-axis base 4 described later.
[0004]
A Z-axis base 4 is provided behind the base surface plate 2 (right side in FIG. 3). The Z-axis base 4 is formed in a vertical wall shape rising from the base surface plate 2. A Z slide plate 5 is fixed to the front surface of the Z-axis base 4. Z slide guides 6 are slidably attached to both sides of the Z slide plate 5. A base plate 7 is fixed to the Z slide guide 6. Thereby, the base plate 7 is supported by the Z-axis base 4 through the Z slide guide 6 and the Z slide plate 5 so as to be movable up and down. This base plate 7 covers the upper part of the base surface plate 2 and supports a probe 13 and the like which will be described later. A purge plate 9 is provided on the lower surface of the base plate 7 via a spacer 8. The purge plate 9 is used to cover an upper side surface of a chuck top 29 (to be described later) and maintain the upper side surface of the chuck top 29 at a constant temperature during high / low temperature measurement. A ring plate 11 is fixed to the upper surface of the base plate 7. The ring plate 11 is made of an iron-based plate material and can attract a magnet. A manipulator 12 is attached on the ring plate 11. A magnet is built in the manipulator 12, and the manipulator 12 is fixed to the ring plate 11 with this magnet. The manipulator 12 supports a probe 13 extending on the surface of the semiconductor wafer 20 on the chuck top 29. The base plate 7 is provided with a notch hole 14, and the probe 13 is inserted from the notch hole 14 to the surface of the semiconductor wafer 20.
[0005]
A microscope scanner 17 is attached to the upper end portion of the Z-axis base 4. One end of a microscope arm 18 is fixed to the microscope scanner 17. A microscope 19 is attached to the other end of the microscope arm 18. The position of the microscope 19 is adjusted by a microscope scanner 17.
[0006]
On the upper surface of the base surface plate 2, a stage portion 21 that supports the semiconductor wafer 20 as a measurement object and moves on the base surface plate 2 and is fixed at the measurement position; A guide mechanism 22 for guiding the movement is provided.
[0007]
The stage unit 21 is positioned above the stage base 25, located above the stage base 25, a Y fine adjustment mechanism 26 that finely adjusts the Y-axis direction, and an upper side of the Y fine adjustment mechanism 26. An X fine adjustment mechanism 27 that finely adjusts the X-axis direction, a θ fine adjustment mechanism 28 that finely adjusts the rotation direction, and a θ fine adjustment mechanism 28 that finely adjusts the rotation direction. The chuck top 29 is configured to support the semiconductor wafer 20 placed thereon.
[0008]
An air bearing mechanism (not shown) is incorporated in the stage base 25. The stage portion 21 can freely move on the base surface plate 2 by this air bearing mechanism. Further, a base grip 31 is fixed to the stage base 25. The base grip 31 is for an operator to hold the hand grip 31 and move the stage unit 21 to an arbitrary position on the base surface plate 2. A drive handle 32 is rotatably attached to the base grip 31. This drive handle 32 is connected to the θ fine adjustment mechanism 28 via a belt 32A, and by rotating the drive handle 32, θ fine adjustment of the chuck top 29 can be performed. Further, the base grip 31 is provided with a grip switch 33. The grip switch 33 is a switch that controls the air bearing mechanism. When the grip switch 33 is pressed, the air bearing state is established. When the grip switch 33 is released, the air bearing state is released, and the stage base 25 is attracted to the base plate 2 by being evacuated. The Y fine adjustment mechanism 26 is provided with a Y-direction adjusting microhead 35 and a vacuum switch 36 for operating a vacuum mechanism (not shown) for attracting and fixing the semiconductor wafer 20 on the chuck top 29. The X fine adjustment mechanism 27 is provided with an X direction adjusting microhead 37. When measuring the semiconductor wafer 20 at high and low temperatures, a hot chuck (not shown) incorporating a temperature adjustment mechanism is mounted as the chuck top 29.
[0009]
The guide mechanism 22 includes a Y-direction guide portion 38, an X-direction guide portion 39, and the air bearing mechanism. The Y-direction guide portion 38 is composed of a Y-axis rail 41 disposed on one side of the base surface plate 2 and a Y-axis guide 42 slidably attached to the Y-axis rail 41. Yes. One end of the X-direction guide portion 39 is fixed to the Y-axis guide 42 of the Y-direction guide portion 38, and the X-axis rail 43 that is supported by the Y-axis guide 42 and moves in the Y-axis direction; A guide roller 44 that is attached to the other end portion to support the other end portion and supports the movement of the X-axis rail 43 together with a Y-axis guide 42 that supports one end, and is slidably attached to the X-axis rail 43. And an X-axis guide 45. The stage base 25 of the stage unit 21 is attached to the X-axis guide 45, and the movement of the stage unit 21 in the Y direction is guided by the Y direction guide unit 38, and the movement in the X direction is guided by the X direction guide unit 39, respectively. It has come to be.
[0010]
A brake mechanism 47 is provided on the Y-axis guide 42 and the X-axis guide 45. The Y-axis guide 42 and the X-axis guide 45 provided with the brake mechanism 47 are configured as shown in FIGS. Both the Y-axis guide 42 and the X-axis guide 45 have the same configuration.
[0011]
The Y-axis guide 42 and the X-axis guide 45 are mainly composed of a guide fixing plate 51 and a guide roller 52. The guide fixing plate 51 includes an upper guide fixing plate 51A and a lower guide fixing plate 51B that sandwich the brake mechanism 47. The guide fixing plate 51 is made of a rectangular plate and is located above the rails 41 and 43. Four guide rollers 52 are attached below the lower guide fixing plate 51B so as to sandwich the rails 41 and 43, respectively. Each guide roller 52 is provided with a V-groove on its outer peripheral edge. Further, both end portions of the rails 41 and 43 are formed in a V shape so as to be fitted into the V grooves of the respective guide rollers 52. Thus, the four guide rollers 52 sandwich the rails 41 and 43 so that only movement in the direction along the rails 41 and 43 is allowed.
[0012]
The brake mechanism 47 includes a slide block 54 that is sandwiched between and slides between the upper guide fixing plate 51A and the lower guide fixing plate 51B, an eccentric shaft 55 that slides the slide block 54, and a slide block. The brake pads 56 are in contact with the rails 41 and 43 by 54 slides.
[0013]
The slide block 54 is sandwiched between the upper and lower guide fixing plates 51 </ b> A and the lower guide fixing plate 51 </ b> B and is sandwiched between the left and right block guides 57, and slides in a direction perpendicular to the rails 41 and 43. It has become. An elliptical through hole 58 into which the eccentric shaft 55 is inserted is provided at the center of the slide block 54. A spring insertion hole 59 is provided at one end (left end in the figure) of the slide block 54. A spring 60 is inserted into the spring insertion hole 59. The spring 60 covers the spring 60 and is supported by a spring cover 61 fixed between the upper guide fixing plate 51A and the lower guide fixing plate 51B to urge the slide block 54.
[0014]
A brake lever 55 </ b> A is attached to the eccentric shaft 55. By rotating the brake lever 55A, the slide block 54 is slid to one side (left side in FIG. 5) against the spring 60.
[0015]
The brake pad 56 is formed facing the rails 41 and 43 while being fixed to the slide block 54. The contact portion of the brake pad 56 with respect to the rails 41 and 43 is formed in a V-groove shape so as to be fitted to the rails 41 and 43.
[0016]
Further, a shield case 63 that covers the entire manual prober 1 is provided as necessary.
[0017]
In the manual prober 1 configured as described above, the semiconductor wafer 20 is inspected as follows.
[0018]
When the shield case 63 is provided, the operator opens the door 63A of the shield case 63.
[0019]
The brake lever 55A of the brake mechanism 47 is turned by hand to pull the brake pad 56 away from the rails 41 and 43 to release the brake. Next, the grip switch 33 of the stage unit 21 is pressed to enter the air bearing state, and the stage unit 21 is moved while being guided by the guide mechanism 22. In this guide mechanism 22, the Y direction is guided by the Y direction guide portion 38 and the X direction is guided by the X direction guide portion 39, and the stage portion 21 moves stably.
[0020]
Thereby, the stage part 21 is moved to the hand, the grip switch 33 is released, and the air bearing state of the stage part 21 is released. Thereby, the stage part 21 is evacuated and fixed on the base surface plate 2. In this state, the semiconductor wafer 20 is placed on the chuck top 29 of the stage unit 21, the vacuum switch 36 is turned on, and the semiconductor wafer 20 is fixed to the chuck top 29 by evacuation.
[0021]
Next, the grip switch 33 is pushed by hand to bring it into an air bearing state, and the stage unit 21 is moved so that the measurement portion of the semiconductor wafer 20 placed on the chuck top 29 of the stage unit 21 is positioned directly below the microscope 19. At this time, the stage unit 21 is supported by the Y-direction guide unit 38 and the X-direction guide unit 39 of the guide mechanism 22 and moves stably. When the positioning of the stage portion 21 is completed, the brake lever 55A of the brake mechanism 47 is turned by hand to press the brake pad 56 against the rails 41 and 43 to fix the Y-axis guide 42 and the X-axis guide 45.
[0022]
Next, the microscope scanner 17 adjusts so that the center of the objective lens of the microscope 19 is positioned at the center of the cutout hole 14 of the base plate 7. Next, the microscope 19 is focused on the measurement surface of the semiconductor wafer 20. At this time, the Y-direction adjusting microhead 35 and the X-direction adjusting microhead 37 are rotated to finely adjust the Y-direction and the X-direction so that the measurement position of the semiconductor wafer 20 falls within the field of view of the microscope 19. Further, the drive handle 32 is rotated to finely adjust the θ of the chuck top 29.
[0023]
At the time of high / low temperature measurement, the temperature of the chuck top 29 is set. In the case of low temperature measurement, nitrogen gas or dry air is filled between the chuck top 29 and the purge plate 9 in order to prevent condensation on the semiconductor wafer 20 and the probe 13 and the like.
[0024]
Next, the probe 13 is attached to the manipulator 12, and the manipulator 12 is mounted on the ring plate 11. Adjustment of the manipulator 12 in the X, Y, and Z directions is performed so that the probe 13 is in contact with the measurement position of the semiconductor wafer 20. Next, the Z-up lever 3 is rotated clockwise to lower the base plate 7 by about 100 μm, and the probe 13 is overdriven.
[0025]
When the shield case 63 is used, the door 63A of the 62 is closed.
[0026]
Next, measurement is performed.
[0027]
[Problems to be solved by the invention]
As the size of the semiconductor wafer 20 has increased in recent years, the size of the apparatus has increased, and the movement stroke of the stage portion 21 in the X and Y directions has increased. For this reason, when the stage part 21 moves to the inner part on the base platen 2, it is difficult for the operator to manually turn the brake lever 55A of the brake mechanism 47. Furthermore, with the increase in size of the apparatus, it is necessary to provide two Y-axis rails 41 of the Y-direction guide portion 38, and accordingly, the brake mechanisms 47 are also provided at two places.
[0028]
As described above, since the number of the brake lever 55A increases as the position of the brake lever 55 increases, there is a problem in that the operability at the time of aligning the stage portion 21 is deteriorated.
[0029]
The present invention has been made in view of such problems, and an object of the present invention is to provide a brake mechanism for a manual prober that can be remotely operated to improve measurement workability.
[0030]
[Means for Solving the Problems]
A manual prober according to a first aspect of the present invention provides a base surface plate and a thin plate that is an object to be measured, and can freely move on the base surface plate and at any position. A stage portion fixed to the base plate, a guide mechanism that is provided on the base plate with the stage portion supported, and that guides the stage portion and stabilizes movement in the X-axis direction and the Y-axis direction, The guide mechanism is provided with an X-axis direction brake mechanism that fixes the movement of the stage portion in the X-axis direction when there is no operation, and the guide mechanism is provided with a fixed movement of the stage portion in the Y-axis direction when there is no operation. A Y-axis direction brake mechanism, an X-axis direction brake operation switch for operating the X-axis direction brake mechanism, and a Y-axis direction brake operation switch for operating the Y-axis direction brake mechanism. Axial break An operation switch, wherein both so that can be operated simultaneously with can be operated individually only one during the movement of the stage, characterized in that integrally provided.
[0031]
With the above configuration, when measuring a thin plate, the thin plate is first placed on the stage portion. Next, the X-axis direction brake mechanism and the Y-axis direction brake mechanism are appropriately operated by selectively operating the X-axis direction and Y-axis direction brake operation switches. Accordingly, the stage unit is appropriately moved in the X-axis direction and the Y-axis direction while being guided by the guide mechanism and being stable. If the operation of the X-axis direction and Y-axis direction brake operation switch is stopped when the stage unit is moved to the predetermined position, the brake is applied to the X-axis direction brake mechanism and the Y-axis direction brake mechanism, and the stage unit is moved to the predetermined position. Fixed.
[0032]
A manual prober according to a second aspect of the present invention is provided with a handle for moving the stage portion on the stage portion, and the X-axis direction and Y-axis direction brake operation switches are provided close to the handle. The X-axis direction and Y-axis direction brake operation switches are configured such that only one of them can be operated individually while holding the handle while the stage unit is moving, and both can be operated simultaneously. .
[0033]
With the above configuration, the stage portion is moved by holding the handle. While holding the handle, the X-axis direction and Y-axis direction brake operation switches are selectively operated while moving the stage portion.
[0034]
A manual prober according to a third aspect of the present invention is characterized in that each of the brake mechanisms is operated by a vacuum or pressure fluid controlled by operation of the brake operation switch.
[0035]
With the above configuration, each brake mechanism is remotely operated by controlling the vacuum or pressure fluid by operating the brake operation switch. Thereby, operability is improved.
[0036]
A manual prober according to a fourth aspect of the invention is characterized in that an air bearing mechanism capable of freely moving the stage portion on a base surface plate is provided in the stage portion.
[0037]
With this configuration, the stage portion can be freely moved by the air bearing mechanism while being guided by the guide mechanism.
[0038]
A manual prober according to a fifth aspect of the invention is characterized in that the air bearing mechanism operates in conjunction with the operation of one or both of the X-axis direction and Y-axis direction brake operation switches.
[0039]
With the above configuration, when the X-axis direction and Y-axis direction brake operation switches are selectively operated, the X-axis direction brake mechanism and the Y-axis direction brake mechanism are appropriately brought into a brake release state, and the X-axis direction and the Y-axis direction It will be possible to move appropriately. In this way, when movement in only the X-axis direction, only in the Y-axis direction, or both in the X-axis direction and the Y-axis direction becomes possible, the stage portion can be moved to an arbitrary position by simultaneously operating the air bearing mechanism. Can be moved to.
[0040]
In the manual prober according to a sixth aspect of the invention, the stage unit has an X fine adjustment mechanism for fine adjustment of the X direction, a Y fine adjustment mechanism for fine adjustment of the Y direction, a θ fine adjustment mechanism for fine adjustment of the rotation direction, and the handle. And a drive handle which is provided integrally and is connected to the θ fine adjustment mechanism to perform fine adjustment.
[0041]
With the above-described configuration, the thin plate on the stage unit can be accurately aligned by finely adjusting the X direction, the Y direction, and the rotation direction.
[0042]
A manual prober according to a seventh aspect of the invention is characterized in that the guide mechanism includes a Y-direction guide portion and an X-direction guide portion, and two Y-axis rails are provided in the Y-direction guide portion.
[0043]
With the above configuration, the stage unit is guided by the two Y-axis rails, so that the stage unit can be stably moved even when the apparatus is enlarged.
[0044]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a manual prober according to the present invention will be described with reference to the accompanying drawings.
[0045]
[First Embodiment]
1 is a front view showing a manual prober according to this embodiment, FIG. 8 is a side view showing the manual prober according to this embodiment, FIG. 9 is a plan view showing the manual prober according to this embodiment, and FIG. 10 is this embodiment. 11 is a front sectional view showing the brake mechanism of the manual prober according to the embodiment, FIG. 11 is a side sectional view showing the brake mechanism of the manual prober according to this embodiment, and FIG. 12 is a rear view showing the brake plate of the brake mechanism of FIG. 13 is a circuit configuration diagram of an electric system and a pneumatic system of the brake mechanism, FIG. 14 is a circuit configuration diagram showing a state where both the first and second grip switches are turned on in the circuit of FIG. 13, and FIG. 15 is a circuit configuration diagram of FIG. FIG. 16 is a circuit diagram showing a state in which the 2 grip switch is turned on. FIG. 16 is a circuit diagram showing a state in which the first grip switch is turned on in the circuit in FIG. It is a block diagram.
[0046]
The manual prober 71 according to the present embodiment is configured as shown in FIGS. Since the entire configuration of the manual prober 71 is substantially the same as that of the conventional manual prober 1, the same parts are denoted by the same reference numerals and the description thereof is omitted.
[0047]
The manual prober 71 of the present embodiment is generally larger than the conventional manual prober 1. This is due to the increase in the size of the semiconductor wafer 20 to be measured. For this reason, in the manual prober 71 of this embodiment, the two Y-axis rails 73 of the Y direction guide part 72 are provided. The Y-axis rail 73 and the X-axis rail 74 are formed in a quadrangular cross section, and guide grooves 75 (see FIGS. 10 and 11) are provided on both side surfaces thereof.
[0048]
Further, the base plate 76 is supported above the Z-axis base 77 in order to increase the distance (stroke) to move on the base surface plate 2. The Z-axis base 77 is formed higher than the conventional Z-axis base 4. Thereby, the stage unit 21 can be moved to the vicinity of the Z-axis base 77 on the base surface plate 2. Along with this, the Z-up lever 78 is provided on the upper portion of the Z-axis base 77.
[0049]
Furthermore, in this embodiment, in order to facilitate the brake operation, the brake control system is automated, and the first grip switch 79 and the second grip switch 80 as the brake operation switches are provided on the base grip 31 as the handle. The operation switches are concentrated. The first grip switch 79 and the second grip switch 80 are provided integrally in close proximity to each other. As a result, the operator can selectively press one of the two grip switches 79 and 80 or both at the same time while holding the base grip 31 by hand. The brake control system is configured as shown in FIGS.
[0050]
Of the brake control system, the brake mechanism 81 is incorporated in the Y-axis guide 82 and the X-axis guide 83. The Y-axis guide 82 and the X-axis guide 83 are configured as shown in FIGS. The Y-axis guide 82 and the X-axis guide 83 are composed of a guide base 85 and a guide piece 86. The guide base 85 is formed in a rectangular shape. Guide pieces 86 are attached to four locations on the lower surface of the guide base 85. The four guide pieces 86 are arranged so as to sandwich the rails 73 and 74. Further, on the contact surface of the guide piece 86 with the rails 73 and 74, a ridge 87 that fits into the guide groove 75 is provided. The Y-axis guide 82 and the X-axis guide 83 are configured so that the rails 73 and 74 can be slid stably by fitting the protrusions 87 into the guide grooves 75.
[0051]
A rectangular storage space 90 that opens downward is provided in the guide base 85. The storage space 90 is a space for incorporating the brake mechanism 81. The brake mechanism 81 is mainly connected to a brake base 91 housed in the housing space 90, a brake plate 92 attached integrally to the lower surface of the brake base 91, and an upper side of the brake base 91 so as to be vacuumed. The vacuum tube joint 93 for attracting the brake plate 92 to the upper surfaces of the rails 73 and 74, the guide shaft 94 fixed to the upper side of the brake base 91 and biasing the brake base 91 upward, and the vacuum tube joint 93 are connected. Thus, a pneumatic system circuit described later for selectively evacuating and an electric circuit for controlling the pneumatic system circuit are included.
[0052]
In the brake base 91 and the brake plate 92, there are provided suction long holes 97 that open on the upper surfaces of the rails 73 and 74, respectively. Two long holes 97 for suction are provided in parallel along the longitudinal direction of the rails 73 and 74. In the brake base 91, a bag hole 98 that communicates the two suction long holes 97 is provided. Reference numeral 99 denotes a blocking plug that closes the bag hole 98. A vacuum tube joint 93 is communicated with the bag hole 98. The brake plate 92 is used to fix the Y-axis guide 82 and the X-axis guide 83 to the rails 73 and 74 by abutting against the upper side surfaces of the rails 73 and 74 and by friction thereof. As a material of the brake plate 92, a synthetic resin such as polytetrafluoroethylene (Teflon) or rubber is used depending on the application.
[0053]
The vacuum tube joint 93 is slidably inserted into the insertion hole 85 </ b> A of the guide base 85, and moves up and down in conjunction with the vertical movement of the brake base 91. A vacuum tube 101 is connected to the vacuum tube joint 93. The vacuum tube 101 is connected to a pneumatic circuit described later.
[0054]
Two guide shafts 94 are provided on the guide base 85. Insertion holes 85B into which the guide shaft 94 is slidably inserted are provided on both sides of the insertion hole 85A in which the vacuum tube joint 93 is inserted in the guide base 85. The guide shaft 94 is slidably inserted into the two insertion holes 85B, and moves up and down in conjunction with the up and down movement of the brake base 91. At the upper end of the guide shaft 94, there is provided a spring receiver 94A that is formed in a flange-like diameter. A compression spring 102 is provided on the guide shaft 94. The compression spring 102 urges the guide shaft 94 upward by pressing the spring receiver 94A by applying a reaction force to the guide base 85. As a result, the brake plate 92 is separated from the rails 73 and 74 to maintain a slight gap. In this state, when a vacuum is drawn through the vacuum tube joint 93, the brake plate 92 is sucked to the rails 73 and 74 through the suction long holes 97.
[0055]
The vacuum tube 101 is connected to a pneumatic circuit. This pneumatic circuit is as shown in FIG. The whole is controlled by three solenoid valves 105, 106 and 107.
[0056]
The first solenoid valve 105 is constituted by a three-way switching valve. The first passage 105A that is always open in the first electromagnetic valve 105 is connected to the air bearing mechanism 108 of the stage portion 21 so that supply of compressed air or evacuation is selectively performed as appropriate. The second passage 105 </ b> B is connected to a compressed air supply source (not shown) such as a compressor, and compressed air is supplied to the first electromagnetic valve 105. The third passage 105 </ b> C is connected to a vacuum supply source (not shown) such as a vacuum pump, and negative pressure is supplied to the first electromagnetic valve 105. The first solenoid valve 105 is connected to the power source 111 and operates to close the third passage 105C from the state in which the first passage 105A and the third passage 105C are in communication with each other. The passage 105B is connected. Thereby, compressed air is supplied to the air bearing mechanism 108 of the stage part 21, and the stage part 21 switches from a locked state to an air bearing state.
[0057]
The second solenoid valve 106 has a first passage 106A that is always open and a second passage 106B that is selectively opened and closed. The first passage 106A is connected to each brake mechanism 81A of the two Y-axis guides 82. The second passage 106B is connected to a vacuum supply source. The second solenoid valve 106 is connected to the power source 111 and operates to shut off the first passage 106A and the second passage 106B and release the brakes of the brake mechanisms 81A that have been locked by evacuation. It is like that. As a result, the stage unit 21 can freely move in the Y-axis direction.
[0058]
The third solenoid valve 107 has a first passage 107A that is always open and a second passage 107B that is selectively opened and closed. The first passage 107A is connected to the brake mechanism 81B of the X-axis guide 83. The second passage 107B is connected to a vacuum supply source. The third solenoid valve 107 is connected to the power source 111 and operates to shut off the first passage 107A and the second passage 107B and release the brake of the brake mechanism 81B that has been locked by evacuation. It has become. As a result, the stage unit 21 can freely move in the X-axis direction.
[0059]
On the other hand, the electric circuit is as follows. The coil 105 </ b> D of the first electromagnetic valve 105 is connected to the power source 111 through two systems of circuits. That is, it is composed of a first system connected to the power supply 111 via the first grip switch 79 and the diode 112, and a second system connected to the power supply 111 via the second grip switch 80 and the diode 113. ing. As a result, the first electromagnetic valve 105 operates regardless of which of the first grip switch 79 and the second grip switch 80 is turned on.
[0060]
The coil 106 </ b> C of the second electromagnetic valve 106 is connected to the power source 111 via the first grip switch 79. Accordingly, the second electromagnetic valve 106 is operated together with the first electromagnetic valve 105 by turning on the first grip switch 79.
[0061]
The coil 107 </ b> C of the third electromagnetic valve 107 is connected to the power source 111 via the second grip switch 80. Accordingly, the third electromagnetic valve 107 is operated together with the first electromagnetic valve 105 by turning on the second grip switch 80.
[0062]
Thus, by operating the grip switches 79 and 80, the solenoid valves 105, 106, and 107 are operated to control the supply of vacuum or compressed air, and the brake mechanism 81 and the air bearing mechanism 108 are remotely operated. It is like that.
[0063]
[Operation]
In the manual prober 71 configured as described above, the semiconductor wafer 20 is inspected as follows. The overall operation is almost the same as that of the conventional manual prober 1 described above.
[0064]
When the shield case 63 is provided, the operator opens the door 63A of the shield case 63.
[0065]
In a state where the operator does not press the first grip switch 79 and the second grip switch 80 of the brake mechanism 81 by hand, all the three solenoid valves 105, 106, 107 are stopped. As a result, as shown in FIG. 13, the three brake mechanisms 81 of the Y-axis guide 82 and the X-axis guide 83 are in the locked state, and the air bearing mechanism 108 is attracted to the base platen 2, and the stage portion 21 is fixed on the base surface plate 2. In this state, the operator presses both the first grip switch 79 and the second grip switch 80 simultaneously with one hand. As a result, the state shown in FIG. 14 is entered. In other words, the first electromagnetic valve 105 is activated to supply compressed air to the air bearing mechanism 108, and the stage base 25 of the stage portion 21 is in an air bearing state. Further, the second electromagnetic valve 106 and the third electromagnetic valve 107 are operated, and all the brakes of the three brake mechanisms 81 are released. The operator appropriately moves the stage unit 21 in the Y-axis direction and the X-axis direction while being guided by the guide mechanism 22 while pressing the two grip switches 79 and 80.
[0066]
When the stage unit 21 is moved to the hand and the two grip switches 79 and 80 are released, the state instantly returns to the state shown in FIG. 13 and all the three brake mechanisms 81 are evacuated and locked. Further, the air bearing mechanism 108 is also evacuated, and the stage base 25 is attracted to the base surface plate 2. Thereby, the stage part 21 is fixed on the base surface plate 2. In this state, the semiconductor wafer 20 is placed on the chuck top 29 of the stage unit 21, and the semiconductor wafer 20 is fixed to the chuck top 29.
[0067]
Next, the two grip switches 79 and 80 are selectively pressed to move the stage unit 21 to an arbitrary position. Specifically, both the two grip switches 79 and 80 are pressed to the state shown in FIG. 14, and the stage portion 21 is guided by the Y-axis guide 82 and the X-axis guide 83, respectively. Move appropriately in the axial direction.
[0068]
Further, only the second grip switch 80 is pressed to operate the first solenoid valve 105 and the third solenoid valve 107. As a result, as shown in FIG. 15, compressed air is supplied to the air bearing mechanism 108 of the stage base 25 of the stage portion 21 to enter the air bearing state, and the evacuation of the brake mechanism 81B of the X-axis guide 83 is stopped. To unlock. The two brake mechanisms 81A of the Y-axis guide 82 are maintained in a locked state. Thus, the stage unit 21 is appropriately moved in the X-axis direction while being guided by the X-axis guide 83.
[0069]
Further, only the first grip switch 79 is pressed to operate the first electromagnetic valve 105 and the second electromagnetic valve 106. As a result, as shown in FIG. 16, compressed air is supplied to the air bearing mechanism 108 of the stage base 25 of the stage portion 21 to enter the air bearing state, and the evacuation of each brake mechanism 81A of the Y-axis guide 82 is stopped. Will be unlocked. The brake mechanism 81B of the X-axis guide 83 is maintained in the locked state. Accordingly, the stage unit 21 is appropriately moved in the Y-axis direction while being guided by the Y-axis guide 82.
[0070]
As a result, the stage unit 21 is moved so that the measurement portion of the semiconductor wafer 20 placed on the chuck top 29 of the stage unit 21 is positioned directly below the microscope 19.
[0071]
When the positioning of the stage portion 21 is completed, the hands are released from the first grip switch 79 and the second grip switch 80. As a result, the state instantly returns to the state of FIG. 13 and all the three brake mechanisms 81 are evacuated and locked. Further, the air bearing mechanism 108 is also evacuated, and the stage base 25 is attracted to the base surface plate 2. Thereby, the stage part 21 is fixed on the base surface plate 2.
[0072]
Next, as in the case of the conventional manual prober 1 described above, fine adjustment is performed and the probe 13 is brought into contact with the measurement position of the semiconductor wafer 20 for measurement.
[0073]
[effect]
As described above, the operation for moving the stage unit 21 can be performed with only two switches (the first grip switch 79 and the second grip switch 80), and the two switches 79 and 80 are used as the base grip 31. Therefore, it is very easy to align the semiconductor wafer 20 by moving the stage portion 21.
[0074]
As a result, even when the manual prober 71 increases in size as the size of the semiconductor wafer 20 increases, the positioning operation of the stage portion 21 can be easily performed, and the measurement workability of the semiconductor wafer 20 is greatly improved. .
[0075]
[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to the accompanying drawings. 17 is a front sectional view showing a brake mechanism of a manual prober according to the second embodiment, FIG. 18 is a circuit configuration diagram of an electric system and a pneumatic system of the brake mechanism of FIG. 17, and FIG. FIG. 20 is a circuit configuration diagram showing a state in which the second grip switch is turned on in the circuit of FIG. 18, and FIG. 21 is a circuit configuration diagram showing the state in which the second grip switch is turned on. It is a circuit block diagram which shows the state turned on.
[0076]
Since the overall configuration of the manual prober according to the present embodiment is substantially the same as the manual prober 71 of the first embodiment, the description thereof is omitted. The feature of the manual prober according to the present embodiment is that the brake mechanism 122 is operated by compressed air.
[0077]
The Y-axis guide 82 and the X-axis guide 83 in which the brake mechanism 122 is incorporated are configured in the same manner as in the first embodiment. The brake base 91, the brake plate 92, and the guide shaft 94 are the same as those in the first embodiment. In this embodiment, an air cylinder 123 is provided instead of the vacuum tube joint 93. The air cylinder 123 is fixed to the guide base 85. The piston rod 124 of the air cylinder 123 is inserted from the insertion hole 85 </ b> A of the guide base 85 and is fixed to the brake base 91. The air cylinder 123 is connected to a pneumatic system circuit via an air tube 125.
[0078]
The pneumatic circuit is as shown in FIG. The overall configuration of the pneumatic system circuit is substantially the same as the pneumatic system circuit of the first embodiment. For this reason, the same code | symbol is attached | subjected to the same member and the description is abbreviate | omitted.
[0079]
In the pneumatic system circuit according to the present embodiment, the second passage 105B of the first electromagnetic valve 105, the second passage 106B of the second electromagnetic valve 106, and the second passage 107B of the third electromagnetic valve 107 are connected to a compressed air supply source, respectively. ing. Only the third passage 105C of the first electromagnetic valve 105 is connected to the vacuum supply source.
[0080]
The electric circuit is the same as that of the first embodiment.
[0081]
[Operation]
In the manual prober configured as described above, the semiconductor wafer 20 is inspected as follows. The overall operation is the same as in the first embodiment.
[0082]
In a state where the operator does not press the first grip switch 79 and the second grip switch 80 of the brake mechanism 122 by hand, all the three solenoid valves 105, 106, 107 are stopped. As a result, as shown in FIG. 18, compressed air is supplied to the three brake mechanisms 122, the piston rod 124 of the air cylinder 123 protrudes, and the brake plate 92 is pressed against the rails 73 and 74 to be locked. ing. The air bearing mechanism 108 is evacuated and adsorbed to the base surface plate 2. Thereby, the stage part 21 is fixed on the base surface plate 2.
[0083]
In this state, the operator presses both the first grip switch 79 and the second grip switch 80 simultaneously with one hand. As a result, the state shown in FIG. 19 is entered. In other words, the first electromagnetic valve 105 is activated to supply compressed air to the air bearing mechanism 108, and the stage base 25 of the stage portion 21 is in an air bearing state. Further, the second electromagnetic valve 106 and the third electromagnetic valve 107 are operated to stop the supply of compressed air, and all the brakes of the three brake mechanisms 122 are released. The operator appropriately moves the stage unit 21 in the Y-axis direction and the X-axis direction while being guided by the guide mechanism 22 while pressing the two grip switches 79 and 80.
[0084]
When the stage unit 21 is moved to the hand and the two grip switches 79 and 80 are released, the state instantly returns to the state shown in FIG. 18 and all the three brake mechanisms 122 are locked by the supply of compressed air. Further, the air bearing mechanism 108 is also evacuated, and the stage base 25 is attracted to the base surface plate 2. Thereby, the stage part 21 is fixed on the base surface plate 2. In this state, the semiconductor wafer 20 is placed on the chuck top 29 of the stage unit 21, and the semiconductor wafer 20 is fixed to the chuck top 29.
[0085]
Next, the two grip switches 79 and 80 are selectively pressed to move the stage unit 21 to an arbitrary position. Specifically, both of the two grip switches 79 and 80 are pressed to the state shown in FIG. 19 described above, and the stage portion 21 is guided by the Y-axis guide 82 and the X-axis guide 83, respectively, Move appropriately in the axial direction.
[0086]
Further, only the second grip switch 80 is pressed to operate the first solenoid valve 105 and the third solenoid valve 107. As a result, as shown in FIG. 20, compressed air is supplied to the air bearing mechanism 108 to enter the air bearing state, and the supply of compressed air to the brake mechanism 122B of the X-axis guide 83 is stopped to enter the unlocked state. Become. The two brake mechanisms 122A of the Y-axis guide 82 are maintained in a locked state. Thus, the stage unit 21 is appropriately moved in the X-axis direction while being guided by the X-axis guide 83.
[0087]
Further, only the first grip switch 79 is pressed to operate the first electromagnetic valve 105 and the second electromagnetic valve 106. As a result, as shown in FIG. 21, compressed air is supplied to the air bearing mechanism 108 to be in an air bearing state, and supply of compressed air to each brake mechanism 122A of the Y-axis guide 82 is stopped and unlocked. become. The brake mechanism 122B of the X-axis guide 83 is maintained in the locked state. Accordingly, the stage unit 21 is appropriately moved in the Y-axis direction while being guided by the Y-axis guide 82.
[0088]
As a result, the stage unit 21 is moved so that the measurement portion of the semiconductor wafer 20 placed on the chuck top 29 of the stage unit 21 is positioned directly below the microscope 19.
[0089]
When the positioning of the stage portion 21 is completed, the hands are released from the first grip switch 79 and the second grip switch 80. Thereby, it returns to the state of FIG. 18 instantly, and all the three brake mechanisms 122 are locked. Further, the air bearing mechanism 108 is also attracted to the base surface plate 2. Thereby, the stage part 21 is fixed on the base surface plate 2.
[0090]
Next, as in the case of the conventional manual prober 1 described above, fine adjustment is performed and the probe 13 is brought into contact with the measurement position of the semiconductor wafer 20 for measurement.
[0091]
[effect]
Also in this case, as in the first embodiment, the alignment of the semiconductor wafer 20 performed by moving the stage portion 21 becomes extremely easy.
[0092]
As a result, even when the manual prober 71 increases in size as the size of the semiconductor wafer 20 increases, the positioning operation of the stage portion 21 can be easily performed, and the measurement workability of the semiconductor wafer 20 is greatly improved. .
[0093]
[Modification]
(1) In the above embodiment, the guide mechanism 22 for guiding the movement of the stage portion 21 is configured by the rails 73 and 74, the guides 82 and 83, and the air bearing mechanism 108 incorporated in the stage portion 21, but the slider Alternatively, the guide mechanism 22 may be configured by only the guide rail that slides on the rail. In this case, two rails are arranged in the Y-axis direction, the rails are laid over the sliders on the rails in the X-axis direction, and the stage portion 21 is fixed to the sliders on the rails.
[0094]
Also in this case, the same operations and effects as described above can be achieved.
[0095]
(2) In the second embodiment, compressed air is used as means for operating the air cylinder 123, but other fluids such as hydraulic pressure may be used.
[0096]
【The invention's effect】
As described above, according to the present invention, the following effects can be obtained.
[0097]
The stage part can be moved with only two switches, and each switch can be operated individually or simultaneously while moving the stage part. This makes it very easy to align the thin plate.
[0098]
As a result, even when the manual prober is enlarged with the increase in the size of the thin plate, the positioning operation of the stage portion can be easily performed, and the measurement workability of the thin plate is greatly improved.
[Brief description of the drawings]
FIG. 1 is a front view showing a manual prober according to a first embodiment of the present invention.
FIG. 2 is a front view showing a conventional manual prober.
FIG. 3 is a side view showing a conventional manual prober.
FIG. 4 is a plan view showing a conventional manual prober.
FIG. 5 is a plan sectional view showing a brake mechanism of a conventional manual prober.
FIG. 6 is a side sectional view showing a brake mechanism of a conventional manual prober.
7 is a side cross-sectional view showing an operating state of the brake mechanism of FIG. 6. FIG.
FIG. 8 is a side view showing the manual prober according to the first embodiment of the present invention.
FIG. 9 is a plan view showing a manual prober according to the first embodiment of the present invention.
FIG. 10 is a front sectional view showing the brake mechanism of the manual prober according to the first embodiment of the present invention.
FIG. 11 is a side sectional view showing the brake mechanism of the manual prober according to the first embodiment of the present invention.
12 is a rear view showing a brake plate of the brake mechanism of FIG. 11. FIG.
13 is a circuit configuration diagram of an electric system and a pneumatic system of the brake mechanism of FIG. 11. FIG.
14 is a circuit configuration diagram showing a state in which both the first and second grip switches are turned on in the circuit of FIG. 13;
15 is a circuit configuration diagram showing a state in which a second grip switch is turned on in the circuit of FIG. 13;
16 is a circuit configuration diagram showing a state in which a first grip switch is turned on in the circuit of FIG.
FIG. 17 is a front sectional view showing a brake mechanism of a manual prober according to a second embodiment of the present invention.
18 is a circuit configuration diagram of an electric system and a pneumatic system of the brake mechanism of FIG. 17;
FIG. 19 is a circuit configuration diagram showing a state in which both the first and second grip switches are turned on in the circuit of FIG. 18;
20 is a circuit configuration diagram showing a state in which a second grip switch is turned on in the circuit of FIG.
21 is a circuit configuration diagram showing a state in which the first grip switch is turned on in the circuit of FIG. 18;
[Explanation of symbols]
2: Base platen, 20: Semiconductor wafer, 21: Stage part, 31: Base grip, 32: Drive handle, 71: Manual prober, 72: Y direction guide part, 73: Y axis rail, 74: X axis Rail, 75: guide groove, 76: base plate, 77: Z-axis base, 78: Z-up lever, 79: first grip switch, 80: second grip switch, 81: brake mechanism, 82: Y-axis guide, 83: X-axis guide, 85: guide base, 86: guide piece, 90: storage space, 92: brake base, 92: brake plate, 93: vacuum tube joint, 94: guide shaft, 97: oblong hole for suction, 98: bag Hole: 101: Vacuum tube, 102: Compression spring, 105: First solenoid valve, 106: Second solenoid valve, 107: Third solenoid valve, 108: Air Bearing mechanism, 111: power supply, 122: brake mechanism, 123: air cylinder, 124: piston rod, 125: air tube.

Claims (7)

A base plate,
A stage part that supports a thin plate as a measurement object and can freely move on the base platen and is fixed to the base platen at an arbitrary position;
A guide mechanism which is provided on the base surface plate in a state where the stage portion is supported, and which guides the stage portion and stabilizes movement in the X-axis direction and the Y-axis direction;
An X-axis direction brake mechanism that is provided in the guide mechanism and fixes the movement of the stage portion in the X-axis direction when there is no operation;
A Y-axis direction brake mechanism that is provided in the guide mechanism and fixes the movement of the stage portion in the Y-axis direction when there is no operation;
An X-axis direction brake operation switch for operating the X-axis direction brake mechanism;
A Y-axis direction brake operation switch for operating the Y-axis direction brake mechanism,
The manual prober characterized in that the X-axis direction and Y-axis direction brake operation switches are integrally provided so that only one of them can be individually operated and both can be operated simultaneously while the stage is moving. . In the manual prober according to claim 1,
In addition to providing a handle for moving the stage unit on the stage unit, the X-axis direction and Y-axis direction brake operation switches are provided close to the handle,
The X-axis direction and Y-axis direction brake operation switches can be operated individually and simultaneously while holding the handle while the stage unit is moving. Prober. In the manual prober according to claim 1 or 2,
Each of the brake mechanisms is operated by a vacuum or pressure fluid controlled by operation of the brake operation switch. The manual prober according to any one of claims 1 to 3,
A manual prober characterized in that an air bearing mechanism capable of freely moving the stage part on a base surface plate is provided in the stage part. In the manual prober according to claim 4,
The manual prober, wherein the air bearing mechanism is operated in conjunction with the operation of one or both of the X-axis direction and Y-axis direction brake operation switches. The manual prober according to any one of claims 1 to 5,
The stage part is
An X fine adjustment mechanism for finely adjusting the X direction;
A Y fine adjustment mechanism for finely adjusting the Y direction;
A θ fine adjustment mechanism for finely adjusting the rotation direction;
A manual prober provided with a drive handle that is provided integrally with the handle and performs fine adjustment by coupling to the θ fine adjustment mechanism. The manual prober according to any one of claims 1 to 6,
A manual prober, wherein the guide mechanism comprises a Y-direction guide portion and an X-direction guide portion, and two Y-axis rails are provided in the Y-direction guide portion.

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