JP3778426B2 - Semiconductor device mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor element mounting device, on which a hermetically closed space is formed inside the mounting device including a work transfer passage, and a solder-applying operation can be carried out, without deteriorating an antioxidant atmosphere by feeding a gas containing nitrogen to the hermetically closed space. SOLUTION: An X table 21 and a Y table 23 are moved horizontally, to apply a wire solder 25 on a work 3 like drawing as the wire solder 25 is fed by a drive motor 26, through the intermediary of an application nozzle 29 on the work 3 on a transfer passage 6 inside a hermetically closed space 4 of a device body 1A. At this point, an opening 30 is bored in the stainless steel device body 1A which serves as the top surface of the hermetically closed space 4, and the opening 30 is blocked with a lid 31, in a state with the application nozzle 29 penetrating.

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor element mounting apparatus for mounting a semiconductor element on a heat sink or a ceramic substrate. More specifically, a work such as a heat sink or a ceramic substrate intermittently fed by the transfer device is supplied to the transfer path at the supply station by the supply device, and solder is applied to the work by the solder application device at the solder application station and mounted. The present invention relates to a semiconductor device mounting apparatus in which a semiconductor element is mounted on a workpiece by a mounting device at a station via solder, and a work having the semiconductor device mounted thereon is taken out by a discharge / takeout device at a discharge station.
[0002]
[Prior art]
In such a semiconductor element mounting apparatus, when a solder material is used at a high temperature for joining the semiconductor element and the substrate or the like, it is necessary to take measures to prevent oxidation of the work (heat sink or ceramic substrate) at a high temperature.
[0003]
Conventionally, for workpieces that are intermittently fed using a carrier or the like, anti-oxidation and reduction measures have been performed by blowing nitrogen or a material in which hydrogen gas is added thereto in the joining material supply section. .
[0004]
[Problems to be solved by the invention]
However, with the method described above, it is possible to create an atmosphere locally, but it is difficult to create a perfect atmosphere despite the possibility of oxidation during transport before and after that.
[0005]
Therefore, the present invention forms a sealed space in the mounting apparatus main body including the workpiece conveyance path, and solder application work without impairing the antioxidant atmosphere formed by supplying a gas containing at least nitrogen to the sealed space. An object of the present invention is to provide a semiconductor device mounting apparatus that can perform the above.
[0006]
[Means for Solving the Problems]
Therefore, according to the first aspect of the present invention, a work such as a heat sink or a ceramic substrate intermittently fed by the transport device is supplied onto the transport path by the supply device at the supply station, and solder is applied onto the work by the solder application device at the solder application station. In the mounting device for a semiconductor element, the semiconductor element is mounted on the workpiece by the mounting device at the mounting station via the solder, and the workpiece on which the semiconductor element is mounted is taken out by the discharge / extraction device at the discharge station. Forming a sealed space in the mounting apparatus body including the transfer path, supplying a gas containing at least nitrogen to the sealed space, forming an opening in the mounting apparatus body in the solder application station , and It said slidably provided around the opening solder coating apparatus Coating nozzle is characterized in that it has closed the opening in the lid in a state of penetrating.
[0007]
The second invention is characterized in that the lower surface of the lid body is a smooth surface .
[0008]
In a third aspect of the invention, a work such as a heat sink or a ceramic substrate intermittently fed by a carrying device is supplied onto a carrying path by a supply station by a supply device, and solder is applied onto the work by a solder applying device at a solder application station. In the mounting device for a semiconductor element, the semiconductor element is mounted on the workpiece by the mounting device at the mounting station via the solder, and the workpiece on which the semiconductor element is mounted is taken out by the discharge / extraction device at the discharge station. Forming a sealed space in the mounting apparatus body including the conveyance path, supplying a gas containing at least nitrogen to the sealed space, and forming an opening in the mounting apparatus body in the solder application station to apply the coating nozzle of the solder coating apparatus There was close the opening in the lid in a state of penetrating, absolute the lid Characterized in that prepared in sexual good materials.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. Reference numeral 1 denotes a semiconductor device mounting apparatus. After a work 3 such as a heat sink or a ceramic substrate supplied from the outside of the mounting apparatus 1 is intermittently fed by a transport apparatus 2, a predetermined operation is performed on the work 3, and then the mounting apparatus 1 1 is taken out.
[0010]
The mounting apparatus 1 has a supply station I, a solder application station II, a mounting station III, and a discharge station IV from the upstream, and a vertical side view of the mounting apparatus 1 in each station of FIG. 2 and between each station of FIG. As shown in the vertical side view of the mounting apparatus 1, a sealed space 4 is formed in the apparatus main body 1 </ b> A.
[0011]
The transfer device 2 provided in the sealed space 4 has a transfer 5 provided along the transfer direction of the workpiece 3 and a transfer 5 for locking and moving each workpiece 3 on the transfer path 6. A plurality of feed claws 7 provided at predetermined intervals, a reciprocating drive source (not shown) that reciprocates the transfer 5 by one pitch of a predetermined length, and the transfer 5 is moved by a one-pitch forward operation by the drive source. After that, a swing drive source (not shown) that swings around the lower end as a fulcrum to release the engagement between the work 3 and the feed claw 7 is provided.
[0012]
In FIG. 3, reference numeral 10 denotes a plurality of supply pipes for supplying nitrogen gas or a mixed gas of nitrogen and hydrogen into the sealed space 4 in order to prevent or reduce the oxidation of the work 3 in the sealed space 4. Each supply pipe 10 is connected to a gas supply source (not shown) via each flow rate regulator.
[0013]
Then, as shown in a vertical side view of the mounting device 1 in the mounting station III of FIG. 2, an opening 11 is formed on the upper surface of the sealed space 4 and a shutter 13 is provided to open and close the opening 11 with a cylinder 12. This configuration is the same in the supply station I, the solder application station II, and the discharge station IV.
In addition, a transparent glass window 14 is provided between the stations, and an operator can look into the apparatus main body 1A, for example, a state in which a wire solder is applied or a semiconductor element such as a bare chip, through the window 14. it can.
[0014]
First, at the supply station I, the workpiece 3 arranged and stored on the tray 15 is taken out while the suction nozzle 5 of the supply device is moved in a plane direction and a vertical direction by a driving source (not shown), and is taken out by the cylinder 12. The shutter 13 is moved and sequentially supplied onto the conveyance path 6 through the opening 11. After this supply, the shutter 13 is moved to close the opening 11. Then, as described above, the workpiece on the conveyance path 6 is intermittently fed one pitch at a time by the conveyance device 2.
[0015]
In the next solder application station II, the shutter 13 is moved by the cylinder 12, and wire solder as a bonding material is applied to the work 3 on the transport path 6 through the opening 11 by a solder application device (not shown). The rear shutter 13 is moved to close the opening 11. In addition, this solder application | coating apparatus is a structure which can be moved by the drive source which is not illustrated in a plane direction and an up-down direction. In addition, a heater block in which a heater (not shown) is embedded is provided, and the workpiece 3 is heated via the forming block 6A of the conveyance path 6 to apply the wire solder while melting.
[0016]
At the next mounting station III, the suction nozzle 16 of the mounting device is moved in the plane direction and the vertical direction by a driving source (not shown), and a semiconductor element such as a bare chip is taken out from the semiconductor supply device, and the shutter 13 is moved by the cylinder 12. Then, it is mounted on the workpiece 3 on the conveying path 6 via the opening 11 via wire solder, and after this mounting, the shutter 13 is moved to close the opening 11.
[0017]
At the final discharge station IV, the shutter 13 is moved by the cylinder 12, and the workpiece 3 on which the semiconductor element is mounted on the transport path 6 is moved through the opening 11 in the plane direction and the vertical direction by a driving source (not shown). The paper is taken out by the suction nozzle 17 of the discharge / take-out device and stored on the tray 18 as a storage device. After the extraction, the shutter 13 is moved to close the opening 11.
[0018]
As described above, the work 3 on the transport path 6 supplied at the supply station I is intermittently fed one pitch at a time sequentially by the transport device 2, while applying wire solder to each work, that is, the work 3, A semiconductor element is mounted on the workpiece 3, or the workpiece 3 is taken out from the conveying path 6 and stored.
[0019]
Moreover, a sealed space 4 is formed in the apparatus main body 1A, and the shutter 13 is moved by the cylinder 12 and opened only when the work supply, wire solder application, semiconductor element mounting, and work removal work as described above are performed. Since 11 is opened, various operations can be performed without impairing the oxidation-preventing atmosphere.
[0020]
Next, another embodiment of the solder coating apparatus will be described with reference to FIG. First, a Y table 23 that is movable in the Y direction by a Y axis motor 22 is provided on an X table 21 that can be moved in the X direction by an X axis motor (not shown) along the base 20. The wire solder driving unit 24 is fixed to 23.
[0021]
The wire solder drive unit 24 feeds wire solder 25 wound around a solder supply roller (not shown) through a coating roller 29 by a drive roller 27 and a driven roller 28 that are rotated by a drive motor 26.
[0022]
The X table 21 and the Y table 23 are moved in the plane direction while feeding the wire solder 25 through the application nozzle 29 by the drive motor 26 onto the work 3 on the conveying path 6 in the sealed space 4 of the apparatus main body 1A. It is moved and the wire solder 25 is applied as drawn.
[0023]
At this time, an opening 30 is formed in the stainless steel device main body 1A forming the upper surface of the sealed space 4, and at least the lower surface in a state where the coating nozzle 29 penetrates the opening 30 is a smooth surface 31. It is set as the structure closed by. Accordingly, the lid 31 can slide on the upper surface of the apparatus main body 1A having a smooth surface at least around the opening 30, and the coating nozzle 29 penetrates the lid 31 so as to move up and down. Therefore, even when the X table 21 and the Y table 23 move in the plane direction to apply the wire solder 25, a circle having an area (size) that can close the opening 30 regardless of where it moves in the opening 30. Since the opening 30 is closed by the plate-shaped lid body 31, the antioxidant atmosphere is not impaired.
[0024]
For confirmation of solder application, since the ground contact between the steel application nozzle 29 and the work 3 is confirmed, the lid body 31 is made of a material having good insulating properties such as glass, so as not to disturb this confirmation. Although it is made of a material such as ceramic, it is convenient for the confirmation if it is made of transparent glass.
[0025]
Reference numeral 33 denotes a heater block in which a heater is embedded, which heats the workpiece 3 via the formation block 34 of the transport path 6 and applies the wire solder 25 while melting.
[0026]
Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.
[0027]
【The invention's effect】
As described above , according to the present invention, an opening is formed in the mounting apparatus main body at the solder application station, and the application nozzle of the solder application apparatus is slidably provided around the opening on the upper surface of the apparatus main body. Since the opening is closed with the lid in a state, an anti-oxidation atmosphere is formed by forming a sealed space in the mounting apparatus main body including the work conveyance path and supplying a gas containing at least nitrogen to the sealed space. It is possible to provide a semiconductor device mounting apparatus in which a soldering operation can be performed by sliding a lid with a coating nozzle penetrating therearound without damaging the periphery of the opening .
In addition, since the lid is made of a material having good insulation, it is possible to confirm the grounding between the application nozzle for confirming the application of solder and the workpiece without being obstructed by the lid.
[Brief description of the drawings]
FIG. 1 is a plan view of a semiconductor device mounting apparatus.
FIG. 2 is a vertical right side view of the mounting apparatus 1 in the mounting station III.
FIG. 3 is a right side view of a longitudinal section between stations.
FIG. 4 is a vertical right side view showing another embodiment of the solder application apparatus.
FIG. 5 is a plan view of a main part of a solder application station.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Semiconductor device mounting apparatus 1A Apparatus main body 2 Conveying apparatus 3 Work piece 4 Sealed space 6 Conveying path 10 Supply pipe 25 Wire solder 29 Coating nozzle 30 Opening 31 Lid

Claims (3)

A work such as a heat sink or a ceramic substrate that is intermittently fed by the transfer device is supplied to the transfer path by the supply device at the supply station, and solder is applied to the work by the solder application device at the solder application station. A semiconductor device mounting apparatus in which a semiconductor element is mounted on the work via solder, and a work on which the semiconductor element is mounted is taken out by a discharge / removal device at a discharge station. Forming a sealed space in the interior, supplying a gas containing at least nitrogen to the sealed space, forming an opening in the mounting device body in the solder application station , and being slidable around the opening on the upper surface of the device body coating nozzle of provided with the solder coating device penetrates Mounting apparatus for a semiconductor device characterized by closing the said opening in the lid of the condition. The lid is mounted device as claimed in claim 1, characterized in that the lower surface is a smooth surface. A work such as a heat sink or a ceramic substrate that is intermittently fed by the transfer device is supplied to the transfer path by the supply device at the supply station, and solder is applied to the work by the solder application device at the solder application station. A semiconductor device mounting apparatus in which a semiconductor element is mounted on the work via solder, and a work on which the semiconductor element is mounted is taken out by a discharge / removal device at a discharge station. A lid body in which a sealed space is formed, a gas containing at least nitrogen is supplied to the sealed space, and an opening is formed in the mounting device body in the solder coating station so that the coating nozzle of the solder coating device penetrates in closing the opening, the lid with a material having good insulating properties Mounting device for a semiconductor device characterized by being manufactured.

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