JP3777912B2 - Color filter polishing method and polishing apparatus used therefor - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface polishing method for a color filter for a liquid crystal display device and a polishing apparatus used therefor.
[0002]
[Prior art]
For color filters for liquid crystal display devices that require high-definition and high-quality display, or color filters for ferroelectric liquid crystal display devices, the surface smoothness of the colored layer of the color filter is that of the liquid crystal display device to be incorporated. Depending on the type, there is a case where the flatness of the surface unevenness of 0.05 to 0.02 μm is required, and sometimes a step of smoothing the surface of the color filter is required as a finishing process. In this case, a buffing method is generally used.
[0003]
As shown in FIG. 3, the buff polishing method has a buff (leather) -lined polishing stage 1 and an object to be polished 6 (color filter) attached inside a corner presser 8 of a lid-like polishing plate 7 facing each other. The two are repeatedly moved relative to each other by rotation and reciprocation. Here, a polishing liquid 9 in which a polishing agent is suspended and dispersed is supplied between the polishing stage 1 and the workpiece 6, and a desired pressure is applied between the polishing stage 1 and the workpiece 6. .
[0004]
The buff 3 on the polishing substrate 2 of the polishing stage 1 is felt-like, but normally, as shown in FIG.
[0005]
However, the resin of the adhesive layer 4 adhering the buff 3 is pressed by the polishing pressure, oozes from the back surface of the buff 3 to the outer peripheral end surface, diffuses from the end surface to the polished surface, and the polished surface of the object 6 to be polished. There was an inconvenience of polluting. The object to be polished 6 thus contaminated, that is, the color filter, remains as a defective product because the resin of the adhesive layer remains even after washing.
[0006]
[Problems to be solved by the invention]
An object of the present invention is to provide a polishing method and a polishing apparatus used therefor, which can eliminate the contamination of the color filter due to the oozing of the adhesive layer between the polishing base and the buff.
[0007]
[Means for Solving the Problems]
The present invention includes a polishing stage in which a buff cloth is attached to the upper surface of a polishing substrate with an adhesive layer , and an outer peripheral end portion of the buff cloth is folded into a side wall from the upper surface of the polishing substrate and fixed to the side wall of the polishing substrate, Resin of the adhesive layer by carrying out the final polishing of the color filter colored layer surface using a buffing device comprising a lid-like polishing plate that holds the polished material and makes the polished surface of the object to be polished opposite the buff cross surface of the polishing stage Is a method for polishing a color filter, and is a polishing apparatus used therefor.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Next, an embodiment of the present invention will be described below together with an example with reference to the drawings.
<Example>
When the surface state of the substrate in which the black matrix and the color filter were still formed by the conventional method was observed, a protruding portion of about 0.5 μm was found scattered. Therefore, the polishing method of the present invention was applied to the substrate in this state (hereinafter referred to as the workpiece 6).
[0009]
As shown in FIG. 3, first, the object to be polished 6 was stuck to the frame of the corner presser 8 on the lower surface of the lid-like polishing plate 7 with water adhesion. On the other hand, an appropriate amount of polishing liquid 9 in which an abrasive (Al ₂ O ₃ , average particle size 0.3 μm) was suspended and dispersed was dropped onto the polishing stage 1. Next, the position of the lid-like polishing plate 7 is lowered, the polishing stage 1 and the polishing surface of the workpiece 6 are brought into close contact with each other, and a predetermined pressure is applied and repeated by a combination of rotational and reciprocating movements of the polishing stage 1. The polishing process was performed by relative movement.
[0010]
However, the buff 3 on the polishing substrate 2 in the polishing apparatus used in the present invention is adhered to the adhesive layer 4 as shown in FIG. After being folded into the side wall, it is fixed with the fastener 5. In addition, as the fastener 5, an appropriate one such as a ring-shaped member extending over the entire circumference of the polishing base 2, a wire, and various other strings and pins can be selected.
[0011]
When the object 6 to be polished, that is, the surface of the color filter substrate, was subjected to the above polishing treatment, it was flattened to 0.2 μm with the total difference in surface roughness. In addition, there was no defect due to the contamination of the adhesive layer that had occurred in the past with the resin.
[0012]
Following this, an overcoat layer is applied to the color filter substrate in the above state with an acrylic resin or a polyimide resin to a thickness of about 1.2 μm by spin coating for further surface smoothing. Forming a color filter. By this treatment, a color filter having a smoothness of 0.05 μm could be obtained.
[0013]
【The invention's effect】
Conventionally, as much as 2% of defects in the polishing process due to contamination of the adhesive layer with the resin occurred, according to the polishing method using the polishing apparatus of the present invention, the resin of the adhesive layer is caused by the polishing pressure. Even when pressed, the buff end face is folded and fixed, so the resin does not ooze out to the outer peripheral end face, and therefore the resin does not diffuse from the end face to the polishing surface and contaminate the surface of the object to be polished. The defect due to the contamination of the adhesive layer with the resin no longer occurred.
[0014]
[Brief description of the drawings]
FIG. 1 is an explanatory view showing a state of a polishing stage in a polishing apparatus used in the present invention.
FIG. 2 is an explanatory view showing a state of a polishing stage in a conventional polishing apparatus.
FIG. 3 is an explanatory diagram showing an outline of a configuration of a polishing apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Polishing stage 2 Polishing base | substrate 3 Buff 4 Adhesive layer 5 Fastener 6 Polishing object 7 Lid-like polishing board 8 Corner presser 9 Polishing liquid

Claims (2)

A buff cloth is adhered to the upper surface of the polishing substrate with an adhesive layer , and the outer peripheral edge of the buff cloth is folded into the side wall from the upper surface of the polishing substrate, and holds the object to be polished and the polishing stage fixed to the side wall of the polishing substrate. Then, the surface of the color filter colored layer is subjected to final polishing using a buffing device comprising a lid-like polishing plate with the polishing surface of the object to be polished facing the buffing surface of the polishing stage, so that the resin of the adhesive layer is applied to the outer peripheral end surface. A method for polishing a color filter, characterized in that it does not come out . A buff cloth is adhered to the upper surface of the polished base with an adhesive layer , and the outer peripheral end of the buff cloth is folded into the side wall from the upper surface of the polishing base and fixed to the side wall of the polishing base, A buffing device comprising a lid-like polishing plate that holds and makes a polishing surface of an object to be polished face a buffing surface of a polishing stage.

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