JP3770837B2 - Stripping solution for cured film of photopolymerizable composition - Google Patents

Description

【００２９】
厚み２３μｍのポリエチレンテレフタレートフイルム上に乾燥後の厚みが４０μｍとなるように該溶液を塗工し、室温で９０秒放置した後、６０℃、９０℃、１１０℃のオーブンでそれぞれ２分間乾燥した。次いで得られた光重合性組成物の層の上に２５μｍのポリエチレンフイルムを重ね合わせてフォトレジストフイルムを得た。
【００３０】
（硬化膜用剥離液の調製）
（ａ）水 ９１．５部
（ｂ１）モノエタノールアミン ６．５部
（ｃ１）テトラメチルアンモニウムハイドロキサイド １．５部
（ｄ１）３−アミノ−１，２，４−トリアゾール ０．５部
（ｅ）プロピレングリコールモノメチルエーテル ０．２部
を混合して硬化膜用剥離液を調製した。
【００３１】
（印刷配線板の製造）
かかるフォトレジストフイルムからポリエチレンフイルムを剥離し、光重合性組成物の層を銅張基板にホットロールラミネータ〔大成ラミネーター（株）製「ＶＡII−７００」〕により１００℃でラミネートした。この時の処理条件は内径が４０ｍｍのエアシリンダーを用い加圧し、エアシリンダーにかけたエア圧力は０．３ＭＰａとし、ラミネート速度は２．０ｍ／ｍｉｎとした。また、ここで用いた銅張基板は厚さ１．６ｍｍでありガラス繊維エポキシ基材の両面に３５μｍの銅箔を張り合わせた巾２００ｍｍ、長さ２５０ｍｍの基板である。
【００３２】
ライン／スペース＝５０μｍ／５０μｍのパターンマスクを用いて２ｋｗ超高圧水銀灯(平行光源)でストーファー２１段ステップタブレットの数値が９となる露光量で露光を行った。露光後１５分経過してからポリエステルフイルムを剥離し、基板に３０℃の炭酸ナトリウム１％水溶液をスプレー圧０．１５ＭＰａで６０秒間噴霧し、未露光部分を溶解除去して硬化膜を得た。
【００３３】
得られた硬化膜に硫酸銅めっき液にて、めっき厚２５μｍとなるように銅めっきを行った後、ホウフッ化はんだめっき液にて５μｍのはんだめっきを施した。処理をした基板に前記硬化膜用剥離液を５０℃、スプレー圧０．２ＭＰａの条件下で９０秒噴霧して硬化膜の剥離操作をその時の剥離液の性能評価するために下記の▲１▼〜▲３▼の評価を実施した。
【００３４】
▲１▼硬化膜残渣
○：残渣が全く認められなかった
△：一部残渣が認められた
×：残渣が多数認められた
【００３５】
▲２▼めっき部の変色
○：変色が認められなかった
△：一部変色が認められた
×：全体に変色が認められた
【００３６】
▲３▼基板の変色
○：変色が認められなかった
△：一部変色が認められた
×：全体に変色が認められた
【００３７】
実施例２〜９、比較例１〜４
表１に示す組成の硬化膜用剥離液を調製し、実施例１と同様に硬化膜用剥離液の性能の評価を行った。表２に結果を示す。尚、比較例４においては表１中の（ａ）〜（ｃ）に加えてトリメチル（２−ヒドロキシエチル）アンモニウムハイドロキサイド０．５５部及びベンゾトリアゾール０．０５部を併用した。

上記の各成分の単位は部である。また各配合物の記号は以下の通りである。
（ａ） 水
（ｂ１）モノエタノールアミン
（ｂ２）Ｎ，Ｎ−ジメチルエタノールアミン
（ｃ１）テトラメチルアンモニウムハイドロキサイド
（ｃ２）トリメチル（２ーヒドロキシエチル）アンモニウムハイドロキサイド
（ｄ１）３−アミノ−１，２，４−トリアゾール
（ｄ２）４−アミノ−１，２，４−トリアゾール
（ｄ３）５−メチルテトラゾール
（ｅ）プロピレングリコールモノメチルエーテル
【００３８】

【００３９】
【発明の効果】
本発明の硬化膜用剥離液は、アルカリ水溶液現像型の光重合性組成物を基板に塗布又はラミネートした後、活性光線により該組成物を硬化させて得られる硬化膜を基板から剥離する際に用いられる剥離液であって、その組成が（ａ）水、（ｂ）水溶性アルカノールアミン、（ｃ）第４級アンモニウムハイドロキサイド、（ｄ）トリアゾール骨格に直接アミノ基又はアルキルアミノ基を有するトリアゾール類あるいは５−メチルテトラゾールを含有してなるので、高露光量で強固に硬化させたレジスト膜を剥離する場合等に剥離条件を厳しくしてもめっき部や基板の変色が抑制され、印刷配線基板の製造に有効に利用される。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a stripping solution for stripping a cured film of a photopolymerizable composition formed on a substrate by light irradiation from the substrate.
[0002]
[Prior art]
In general, a printed wiring board is formed by applying or laminating a photopolymerizable composition comprising an alkaline resin-soluble acrylic resin, an ethylenically unsaturated monomer, and a photopolymerization initiator on a copper-clad substrate, and then pattern masking. The composition is imagewise cured through exposure, and the uncured portion is developed and removed with an alkaline aqueous solution such as sodium carbonate. Usually, further plating is performed, and an aqueous ferric chloride solution is used as necessary. It is manufactured by removing a cured film that has become unnecessary through an etching process and using a remover.
[0003]
As a basic physical property of such a stripping solution, it is required not to cause corrosion of a metal substrate such as a copper-clad substrate. A photoresist stripping solution comprising amine (a), two specific types of ammonium hydroxides (b) and (c) and benzotriazoles (d) has been disclosed.
[0004]
[Problems to be solved by the invention]
However, in recent years, in the field of printed wiring boards using photoresists, higher density and fine patterning have been demanded. In particular, with negative resists, resist patterns can be formed by increasing the amount of exposure energy in order to suppress swelling during development. There exists a tendency to harden | cure hard and it must naturally make the peeling conditions of a cured film severe (for example, peeling process time is long). As a result, the plated part or substrate may be corroded or the substrate or plated part may be discolored even if corrosion does not occur. Liquid is sought.
[0005]
[Means for Solving the Problems]
Accordingly, as a result of intensive studies to solve such problems, the present inventor obtained by applying or laminating a photopolymerizable composition of an alkaline aqueous solution development type to a substrate and then curing the composition with actinic rays. A stripping solution used for stripping a cured film from a substrate, the composition of which is (a) water, (b) a water-soluble alkanolamine, (c) a quaternary ammonium hydroxide, (d) a triazole skeleton The present inventors have found that a stripping solution for a cured film of a photopolymerizable composition containing a triazole having a direct amino group or an alkylamino group or 5-methyltetrazole satisfies the requirements.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
The stripping solution for a cured film of the present invention contains the above (a), (b), (c), (d), and as such (b) water-soluble alkanolamine, specifically, monomethanolamine, Examples include ethanolamine, diethanolamine, triethanolamine, 1,1,2,2-tetramethylmonoethanolamine, N, N-dimethylethanolamine, and the like, and monoethanolamine is preferred in that the aqueous solution is less colored.
[0007]
(C) Specific examples of the quaternary ammonium hydroxide include ammonium hydroxide, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, trimethyl (2 -Hydroxyethyl) ammonium hydroxide and the like are exemplified, and tetramethylammonium hydroxide is preferred from the viewpoint of inexpensiveness.
[0008]
(D) Specific examples of triazoles having an amino group or an alkylamino group directly on the triazole skeleton include 3 -amino-1,2,4-triazole, 4-amino-1,2,4-triazole, 3- Examples thereof include dimethylamino-1,2,4-triazole and 4-dimethylamino-1,2,4-triazole. As the tetrazoles, 5 - and methyl tetra zone le. Among these, 3-amino-1,2,4-triazole is preferable because of its low cost.
[0009]
As a blending amount of the above (a), (b), (c), (d), (a) is preferably 85 to 94 parts by weight, more preferably 86 to 93 parts by weight, and particularly preferably 89 to 93 parts by weight. , (B) is preferably 1 to 10 parts by weight, more preferably 2 to 8 parts by weight, particularly preferably 3 to 7 parts by weight, and (c) is preferably 0.1 to 5 parts by weight, more preferably 0.3. -4 parts by weight, particularly 0.5-3 parts by weight, (d) is preferably 0.05-2 parts by weight, more preferably 0.1-1.5 parts by weight, especially 0.2-1 0.0 part by weight is preferred.
[0010]
In the above, if (a) is less than 85 parts by weight, the cured film remover may act on the plated part or the metal to cause etching failure, and the cost of the cured film remover is increased to 94 parts by weight. If it exceeds 1, the content of the amine compound in the stripping solution for a cured film is decreased, and thus the peelability tends to be lowered.
If (b) is less than 1 part by weight, discoloration of the plated part may occur, and if it exceeds 10 parts by weight, a cured film residue may be generated when a strong cured film is peeled off.
When (c) is less than 0.1 parts by weight, a cured film residue may be generated when a strong cured film is peeled off. When it exceeds 5 parts by weight, the etching defects and the cost of the cured film peeling liquid are high. It may be.
If (d) is less than 0.05 part by weight, the effect of preventing discoloration of the substrate may not be sufficiently exhibited. If it exceeds 2 parts by weight, component (d) may remain on the release substrate even after washing with water. Absent.
[0011]
Furthermore, the cured film stripping solution of the present invention includes (a) water, (b) water-soluble alkanolamine, (c) quaternary ammonium hydroxide to improve the dispersibility of the strips during the stripping process. Side, (d) 0.01 to 0.5 parts by weight of the water-soluble organic solvent with respect to 100 parts by weight of the total amount of triazoles having a direct amino group or alkylamino group or 5-methyltetrazole in the triazole skeleton Further, it is advantageous to contain 0.05 to 0.3 parts by weight. If the blending amount is less than 0.01 parts by weight, the combined effect is hardly exhibited, and if it exceeds 0.5 parts by weight, the peelability tends to decrease, which is not preferable.
[0012]
(E) As water-soluble organic solvents, methyl 2-hydroxyisobutyrate, ethylene glycol monoalkyl ether, diethylene glycol monoalkyl ether, triethylene glycol monoalkyl ether, propylene glycol monoalkyl ether, dipropylene glycol monoalkyl ether, tripropylene Glycol monoalkyl ethers are used alone or in admixture. Examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, and tert-butyl. Among these, propylene glycol monomethyl ether is preferable from the viewpoint of solubility in water.
[0013]
Thus, by blending the above (a) to (d) or (a) to (e), the release liquid for cured film of the present invention can be obtained.
Next, the peeling method of the photopolymerizable composition using the peeling liquid for cured films of this invention is demonstrated.
In order to peel the cured film of the photopolymerizable composition on the substrate using the cured film release liquid of the present invention, the substrate is immersed in the cured film release liquid and air bubbling, stirring blades, ultrasonic vibration, etc. Examples include a dipping method that vibrates the stripping solution for cured film by stirring, a method for flowing the stripping solution for cured film onto the substrate, and a method for spraying the stripping solution for cured film onto the substrate surface. Is.
[0014]
The liquid temperature at the time of peeling is preferably 30 to 80 ° C., more preferably 40 to 60 ° C., and less than 30 ° C. is not preferable because sufficient peeling cannot be performed. On the other hand, when it exceeds 80 ° C., component (b) It is not preferable because evaporation of the water may occur. The peeling time varies depending on the kind of the peeling method described above, but in the case of the spraying method, the peeling pressure is 0.1 to 0.5 MPa.
Stripping time is usually about 30 to 120 seconds, the time of about 2 times the time during which the exposure light portion completely peeled (breakpoint) are employed.
[0015]
The cured film is peeled off using the cured film peeling liquid as described above. A series of manufacturing steps of the printed wiring board using the photoresist film including such steps will be described in detail below.
The photoresist film that can be used is one in which a support film, a photopolymerizable composition and a protective film are sequentially laminated.
The support film has heat resistance and solvent resistance when forming a layer of the photopolymerizable composition, and examples thereof include polyester film, polyimide film, aluminum foil, and the film thickness is usually 3 to 50 μm. Degree.
[0016]
The photopolymerizable composition is not particularly limited as long as it is an alkaline aqueous development type composition, and contains an alkaline water-soluble acrylic resin, an ethylenically unsaturated monomer, a photopolymerization initiator, and other additives as necessary. It contains.
Examples of the alkaline water-soluble acrylic resin include (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-hydroxyethyl ( Homopolymers or copolymers of acrylic monomers such as (meth) acrylate, 2-ethylhexyl (meth) acrylate, methoxyethyl (meth) acrylate, styrene, (meth) acrylamide, (meth) acrylonitrile as required And those obtained by further copolymerizing monomers such as vinyl acetate.
[0017]
Ethylenically unsaturated monomers include ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate 1,6-hexanediol di (meth) acrylate, 2,2-bis [4- (meth) acryloxypropyloxyphenyl] propane, 2,2-bis [4- (meth) acryloxyethoxyphenyl] propane, Trimethylolpropane tri (meth) acrylate, pentaerythritol penta (meth) acrylate, tri (meth) acryloxyethyl phosphate, tris (2-hydroxyethyl) isocyanurate tri (meth) acrylate, pentaerythritol Rupenta (meth) acrylate, ethylene glycol diglycidyl ether di (meth) acrylate, are exemplified such as glycerin triglycidyl ether tri (meth) acrylate, which may be used alone or as a mixture of two or more.
[0018]
The blending ratio (weight ratio) of the ethylenically unsaturated monomer and the acrylic resin is adjusted to 10/90 to 70/30, and more preferably 30/70 to 50/50. If the blending ratio is less than 10/90, curing is insufficient and satisfactory resolution cannot be obtained. On the other hand, if it exceeds 70/30, an edge fusion phenomenon appears when the photoresist film is handled as a roll product. Tend.
[0019]
Examples of the photopolymerization initiator include benzophenone, Michler's ketone, 4,4'-bis (diethylamino) benzophenone, t-butylanthraquinone, 2-ethylanthraquinone, N-aryl-α-amino acids, lophine dimers, thioxanthone , Benzoin alkyl ethers, benzyl ketals and the like, and these may be used alone or in combination. The photopolymerization initiator is usually blended so as to contain 0.01 to 30% by weight in the total solid content of the photopolymerizable composition.
[0020]
Note that various additives such as a photochromic agent, a polymerization aid, a dye, an adhesion-imparting agent, a thermal polymerization inhibitor, and a plasticizer can be appropriately added to the photopolymerizable composition as necessary.
The layer thickness of the photopolymerizable composition is preferably 5 to 300 μm, more preferably 10 to 50 μm.
If the thickness is less than 5 μm, the film thickness becomes non-uniform when coating and drying, and pinholes are likely to occur. On the other hand, if it exceeds 300 μm, the exposure sensitivity is lowered and the development speed is decreased, which is not preferable.
[0021]
When the protective film is used in the form of a roll of photoresist film, the layer of the photopolymerizable composition having adhesiveness is transferred to the support film, or dust or the like adheres to the layer of the photopolymerizable composition. In order to prevent this, it is used by being laminated on the layer of the photopolymerizable composition. Examples of the protective film include a polyester film, a polyethylene film, a polypropylene film, and a tetrafluoroethylene resin film, but are not limited to such examples. The thickness of the protective film is not particularly limited, but is usually 10 to 50 μm.
[0022]
Such a photoresist film is laminated on a substrate, and then exposed and developed.
As a method for laminating a photoresist film, first, after peeling off the protective film, a layer of the photopolymerizable composition is laminated on a substrate using a hot roll laminator. The hot roll laminator used is generally configured such that a pair of upper and lower heating rolls are pressurized by an air cylinder provided one at each end of the upper heating roll, and the heating roll is moved at a predetermined speed. By rotating, a layer of the photopolymerizable composition can be laminated on both sides of the substrate. The pressure of the laminate is adjusted by the air pressure of the air cylinder.
[0023]
As such lamination conditions, a pressure of 0.03 to 5 MPa, preferably 0.1 to 1 MPa, a lamination speed of 0.1 to 10 m / min, preferably 0.5 to 5 m / min, and a roll temperature of 70 to 250 ° C. are appropriate. It is.
Examples of the substrate include a copper-clad substrate, an iron plate, an aluminum plate, a stainless steel plate, and the like, and a copper or aluminum foil laminated on the surface of an inorganic or organic substrate having electrical insulation, When the substrate is used, the effect of preventing discoloration of the substrate of the present invention is remarkably exhibited.
After the lamination is completed by such a method, the pattern mask is brought into close contact with the support film, and exposed with actinic rays through the pattern mask.
[0024]
Examples of such actinic rays include ultraviolet rays, electron beams, and X-rays, and ultra-high pressure mercury lamps, carbon arc lamps, xenon lamps, metal halide lamps, chemical lamps, and the like are used as light sources at that time.
The greatest feature of the present invention is that no discoloration occurs on the substrate or the plated part even if the peeling conditions are strict, so for example, even for a cured film that is hardened by increasing the amount of exposure energy efficiently. Peeling treatment can be performed. The hardened cured film was cured with a large exposure amount so that the numerical value of the stove 21 step tablet (negative film produced so that the light transmission amount decreased stepwise) would be 9 steps or more. A cured film is exemplified. Of course, the stripping solution of the present invention is also useful for a resist film in which the step tablet value, which is the exposure energy that is normally carried out, is cured with an exposure amount of about 7 or 8 steps.
[0025]
An image is formed by developing or developing a layer of the photopolymerizable composition by spraying or immersing a developer in a photoresist film on the exposed substrate. As the developer, an alkaline aqueous solution such as sodium carbonate or potassium carbonate is used.
[0026]
When using a cured film of a photopolymerizable composition that has been developed and is present on a substrate for plating, first perform the necessary pretreatment, and then apply plating such as copper sulfate plating or copper pyrophosphate plating to the recesses of the substrate. Subsequently, tin plating and solder plating are performed to protect the plated portion.
Thereafter, the cured film of the photopolymerizable composition is removed by the above-described method using the cured film peeling liquid of the present invention.
Further, the printed metal board is manufactured by etching away the exposed metal portion of the substrate with a solution of alkaline ammonia or the like.
[0027]
When a cured film of a photopolymerizable composition developed and present on a substrate is used for etching, the substrate is exposed with an etching solution such as ferric chloride, cupric chloride, hydrogen peroxide-sulfuric acid, alkaline ammonia, etc. After removing the upper metal part, the cured film of the photopolymerizable composition is removed using the cured film peeling liquid of the present invention to produce a printed wiring board.
Although the case of a printed wiring board using a negative resist among the photoresists has been described above, the cured film of the present invention is also applied to a positive resist and a stripping solution for a cured film used for manufacturing semiconductor elements such as IC and LSI. The stripping solution can be applied.
[0028]
【Example】
Hereinafter, the present invention will be described in detail with examples. “%” And “parts” are based on weight.
Example 1
(Manufacture of photoresist film)
An alkali-developable photopolymerizable composition solution having the following composition was prepared.

[0029]
The solution was coated on a polyethylene terephthalate film having a thickness of 23 μm so that the thickness after drying was 40 μm, left at room temperature for 90 seconds, and then dried in an oven at 60 ° C., 90 ° C., and 110 ° C. for 2 minutes. Next, a 25 μm polyethylene film was superposed on the resulting photopolymerizable composition layer to obtain a photoresist film.
[0030]
(Preparation of stripping solution for cured film)
(A) Water 91.5 parts (b1) Monoethanolamine 6.5 parts (c1) Tetramethylammonium hydroxide 1.5 parts (d1) 3-amino-1,2,4-triazole 0.5 parts ( e) 0.2 part of propylene glycol monomethyl ether was mixed to prepare a release liquid for a cured film.
[0031]
(Manufacture of printed wiring boards)
The polyethylene film was peeled from the photoresist film, and the layer of the photopolymerizable composition was laminated on a copper-clad substrate at 100 ° C. with a hot roll laminator [“VAII-700” manufactured by Taisei Laminator Co., Ltd.]. The treatment conditions at this time were pressurized using an air cylinder having an inner diameter of 40 mm, the air pressure applied to the air cylinder was 0.3 MPa, and the laminating speed was 2.0 m / min. Moreover, the copper clad board | substrate used here is a board | substrate with a width of 200 mm and a length of 250 mm which laminated | stacked 35 micrometers copper foil on both surfaces of the glass fiber epoxy base material.
[0032]
Using a pattern mask of line / space = 50 μm / 50 μm, exposure was performed with a 2 kW ultra-high pressure mercury lamp (parallel light source) with an exposure amount at which the numerical value of the stove 21 step tablet was 9. After 15 minutes from the exposure, the polyester film was peeled off, and a 1% aqueous solution of sodium carbonate at 30 ° C. was sprayed onto the substrate at a spray pressure of 0.15 MPa for 60 seconds to dissolve and remove the unexposed portion to obtain a cured film.
[0033]
The obtained cured film was subjected to copper plating with a copper sulfate plating solution to a plating thickness of 25 μm, and then subjected to 5 μm solder plating with a borofluoride solder plating solution. In order to evaluate the performance of the stripping solution at the time of the stripping operation of the cured film by spraying the cured substrate stripping liquid on the treated substrate for 90 seconds under the conditions of 50 ° C. and spray pressure 0.2 MPa, the following (1) Evaluation of ~ 3 was carried out.
[0034]
(1) Cured film residue ○: No residue was observed Δ: Partial residue was observed ×: Many residues were observed [0035]
(2) Discoloration of the plating part ○: No discoloration was observed Δ: Partial discoloration was observed ×: Discoloration was observed on the whole [0036]
(3) Discoloration of the substrate ○: No discoloration was observed Δ: Partial discoloration was observed ×: Discoloration was observed on the whole [0037]
Examples 2-9, Comparative Examples 1-4
A cured film release liquid having the composition shown in Table 1 was prepared, and the performance of the cured film release liquid was evaluated in the same manner as in Example 1. Table 2 shows the results. In Comparative Example 4, in addition to (a) to (c) in Table 1, 0.55 part of trimethyl (2-hydroxyethyl) ammonium hydroxide and 0.05 part of benzotriazole were used in combination.

The unit of each component is part. Moreover, the symbol of each compound is as follows.
(A) Water (b1) Monoethanolamine (b2) N, N-dimethylethanolamine (c1) Tetramethylammonium hydroxide (c2) Trimethyl (2-hydroxyethyl) ammonium hydroxide (d1) 3-amino- 1,2,4-triazole (d2) 4-amino-1,2,4-triazole (d3) 5-methyltetrazole (e) propylene glycol monomethyl ether

[0039]
【The invention's effect】
The stripping solution for a cured film of the present invention is used when a cured film obtained by applying or laminating a photopolymerizable composition of an alkaline aqueous solution development type to a substrate and then curing the composition with actinic rays is peeled from the substrate. A stripping solution to be used, the composition of which has (a) water, (b) water-soluble alkanolamine, (c) quaternary ammonium hydroxide, and (d) a triazole skeleton having an amino group or an alkylamino group directly. Since it contains triazoles or 5-methyltetrazole , discoloration of the plating part and the substrate is suppressed even when the stripping conditions are strict when stripping a resist film that has been hardened with a high exposure amount, and printed wiring. It is effectively used for manufacturing a substrate.

Claims (3)

A stripping solution for use in stripping a cured film obtained by applying or laminating a photopolymerizable composition of an alkaline aqueous solution development type onto a substrate and then curing the composition with actinic rays from the substrate. Contains (a) water, (b) water-soluble alkanolamine, (c) quaternary ammonium hydroxide, (d) triazoles having a direct amino group or alkylamino group in the triazole skeleton, or 5-methyltetrazole A stripping solution for a cured film of a photopolymerizable composition characterized by comprising: (A) Water, (b) Water-soluble alkanolamine, (c) Quaternary ammonium hydroxide, (d) Triazoles having an amino group or alkylamino group directly on the triazole skeleton, or 5-methyltetrazole The cured film of a photopolymerizable composition according to claim 1, wherein the amount is 85 to 94 parts by weight, 1 to 10 parts by weight, 0.1 to 5 parts by weight, 0.05 to 2 parts by weight. Stripping solution. Furthermore, (a) water, (b) water-soluble alkanolamine, (c) quaternary ammonium hydroxide, (d) triazoles having an amino group or alkylamino group directly on the triazole skeleton, or the total amount of 5-methyltetrazole The stripping solution for a cured film of a photopolymerizable composition according to claim 2, wherein 0.01 to 0.5 part by weight of (e) a water-soluble organic solvent is blended with respect to 100 parts by weight.